CN105489738A - White light LED device with adjustable color temperature display index, and preparing method and regulating and controlling method of white light LED device - Google Patents
White light LED device with adjustable color temperature display index, and preparing method and regulating and controlling method of white light LED device Download PDFInfo
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- CN105489738A CN105489738A CN201610087840.5A CN201610087840A CN105489738A CN 105489738 A CN105489738 A CN 105489738A CN 201610087840 A CN201610087840 A CN 201610087840A CN 105489738 A CN105489738 A CN 105489738A
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- 238000000034 method Methods 0.000 title claims abstract description 13
- 230000001105 regulatory effect Effects 0.000 title claims abstract description 6
- 230000001276 controlling effect Effects 0.000 title abstract description 9
- 239000012790 adhesive layer Substances 0.000 claims description 104
- 238000002955 isolation Methods 0.000 claims description 73
- 239000003292 glue Substances 0.000 claims description 54
- 239000000843 powder Substances 0.000 claims description 50
- 238000001556 precipitation Methods 0.000 claims description 21
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 18
- 238000002360 preparation method Methods 0.000 claims description 13
- 238000003466 welding Methods 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000000463 material Substances 0.000 description 17
- 244000247747 Coptis groenlandica Species 0.000 description 13
- 235000002991 Coptis groenlandica Nutrition 0.000 description 13
- 238000007598 dipping method Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 239000003086 colorant Substances 0.000 description 4
- 239000006071 cream Substances 0.000 description 4
- 230000005496 eutectics Effects 0.000 description 4
- 241001313855 Bletilla Species 0.000 description 2
- 241001062009 Indigofera Species 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a white light LED device with an adjustable color temperature display index, and a preparing method and a regulating and controlling method of the white light LED device. The white light LED device comprises a body support, a first cup, a second cup, a first blue light LED chip, a second blue light LED chip, a first fluorescent gel layer and a second fluorescent gel layer. The first cup and the second cup are formed in the body support. The first blue light LED chip is fixed in the first cup, and the second blue light LED chip is fixed in the second cup. The first blue light LED chip is sealed in the first cup through the first fluorescent gel layer, and the second blue light LED chip is sealed in the second cup through the second fluorescent gel layer. The first fluorescent gel layer has a low color temperature and high display index ratio, and the second gel layer has a high color temperature and low display index ratio; or the first gel layer has a high color temperature and low display index ratio, and the second fluorescent gel layer has a low color temperature and high display index ratio. The two different fluorescent gel layers are injected into the two cups respectively to control the currents of the two chips respectively, so that controllability of the color temperature display index is achieved, and the structure design that the color temperature cannot be adjusted unless at least two kinds of color chips are available traditionally is broken through.
Description
Technical field
The present invention relates to LED component field, particularly relate to a kind of colour temperature and show finger adjustable white light LED part, its preparation method and regulate and control method.
Background technology
In prior art, realize single LEDs device that colour temperature is controlled, mainly contain following structure:
1. the chip of red, the green and blue three-color of single LEDs device load, by controlling electric current, to reach colour temperature controlled; 2. the chip of the red and blue two kinds of colors of single LEDs device load, and use yellow fluorescent powder sealing, reach colour temperature by the electric current controlling red chip controlled; 3. the red two kinds of color chips of single LEDs device load bletilla, reach colour temperature by control red chip electric current controlled.
Although single LEDs device of above-mentioned three kinds of structures can realize the controlled object of colour temperature, need the LED chip of at least two kinds of different colours, and there is following defect respectively:
1. conventional red, the green and blue three-color chip structure of mutually arranging in pairs or groups, corresponding single LEDs device power consumption is large, involves great expense, deficiency in economic performance.2. conventional red, indigo plant and the yellow three kinds of color chips structure of mutually arranging in pairs or groups, then there is following shortcoming: first, corresponding single LEDs device production operation is relatively loaded down with trivial details, be mainly reflected in red chip to need respectively to use different primers to carry out die bond from blue chip, yellow chip, more bonding wire can reduce the speed of production; Secondly, in corresponding single LEDs device, once the bright dipping of wherein any one color chips in three kinds of color chips goes wrong, whole single LEDs device all can lose efficacy, and causes the waste of other color chips; Again, in the structure that conventional red, indigo plant and yellow three kinds of chips are arranged in pairs or groups mutually, manufacture order LEDs device needs the base plate line of use more complicated, and needs the control power supply of collocation relative complex.3. tradition blue and red two kinds of chips structure of mutually arranging in pairs or groups, yellow fluorescent powder mainly by adopting in sealing operation controls colour temperature, the structure that this structure is relatively red, green and blue three-color chip is arranged in pairs or groups mutually and red, blue and yellow three kinds of color chips are arranged in pairs or groups mutually, energy consumption is low, but it is well-known, red chip utilance is low, and economic benefit does not obtain too large improvement, and the chromaticity coordinates point of regulation and control cannot agree with Planck curve.4. traditional bletilla red two kinds of chips structure of mutually arranging in pairs or groups, because white chip is immature, economic benefit is also poor, and light efficiency is low and aobvious finger is uncontrollable.
Summary of the invention
Need the LED chip of at least two kinds of different colours could realize the problem of colour temperature regulation and control for LEDs device single in prior art, the invention provides a kind of colour temperature and show finger adjustable white light LED part, its preparation method and control method, in the present invention, white light LED part only needs a kind of LED chip of color can realize colour temperature and the aobvious regulation and control referred to.
In order to solve the problems of the technologies described above, a first aspect of the present invention, disclose a kind of colour temperature and show the adjustable white light LED part of finger, it comprises:
Main body rack;
Be formed at first bowl of cup on main body rack and second bowl of cup;
Be fixed on the first blue LED die in first bowl of cup;
Be fixed on the second blue LED die in second bowl of cup;
First fluorescent adhesive layer, in order to be sealed in first bowl of cup by the first blue LED die; And,
Second fluorescent adhesive layer, in order to be sealed in second bowl of cup by the second blue LED die;
Wherein, the first fluorescent adhesive layer is the fluorescent adhesive layer of low colour temperature height aobvious assignment ratio, and the second fluorescent adhesive layer is the fluorescent adhesive layer of the low aobvious assignment ratio of high color temperature; Or the first fluorescent adhesive layer is the fluorescent adhesive layer of the low aobvious assignment ratio of high color temperature, the second fluorescent adhesive layer is the fluorescent adhesive layer of low colour temperature height aobvious assignment ratio.
White light LED part in the present invention, breach tradition and at least need two kinds of combined structural designs that could realize adjustable color of color chips, by the fluorescent adhesive layer difference injecting glue of aobvious for low colour temperature the height fluorescent adhesive layer and the low aobvious assignment ratio of high color temperature that assign ratio in two bowl cups, by freely controlling the electric current of two blue LED die, the aobvious finger of colour temperature can be realized controlled.White light LED part of the present invention only by controlling the size of current of two blue LED die, need can realize the regulation and control that colour temperature shows finger, effectively reducing preparation cost, good in economic efficiency.
According to an embodiment of the present invention, white light LED part also comprises:
First isolation mount, the first isolation mount is longitudinally arranged between first bowl of cup and second bowl of cup, in order to separate the first blue LED die and the second blue LED die.Longitudinally isolation the first blue LED die and the second blue LED die, makes can to have in main body rack and manyly effectively utilizes space, is beneficial to the placement of two blue LED die, and improves the reliability of white light LED part production technology and the uniformity of bright dipping.
According to an embodiment of the present invention, white light LED part also comprises:
In order to separate the second isolation mount and the 3rd isolation mount of white light LED part positive pole pin and negative pole pin;
Second isolation mount is horizontally set in first bowl of cup;
3rd isolation mount is horizontally set in second bowl of cup.
According to an embodiment of the present invention, in white light LED part:
The distance of the second isolation mount and white light LED part positive pole pin equals the distance of itself and white light LED part negative pole pin; The distance of the 3rd isolation mount and white light LED part positive pole pin equals the distance of itself and white light LED part negative pole pin;
Or the distance of the second isolation mount and white light LED part positive pole pin is greater than the distance of itself and white light LED part negative pole pin; The distance of the positive pole pin of the 3rd isolation mount and white light LED part is greater than the distance of the negative pole pin of itself and white light LED part.
According to an embodiment of the present invention, in white light LED part:
The fluorescent adhesive layer of low colour temperature height aobvious assignment ratio comprises following component: rouge and powder, bloom, A glue, B glue and anti-precipitation powder; The weight ratio of rouge and powder, bloom, A glue, B glue and anti-precipitation powder is followed successively by (0.005 ~ 0.02): (0.12 ~ 0.48): 0.2:0.8:(0.005 ~ 0.02);
Or the fluorescent adhesive layer of low colour temperature height aobvious assignment ratio comprises following component: rouge and powder, yellowish green powder, A glue, B glue and anti-precipitation powder; The weight ratio of rouge and powder, yellowish green powder, A glue, B glue and anti-precipitation powder is followed successively by (0.0025 ~ 0.01): (0.15 ~ 0.6): 0.2:0.8:(0.005 ~ 0.02).
According to an embodiment of the present invention, in white light LED part:
The fluorescent adhesive layer of the low aobvious assignment ratio of high color temperature comprises following component: bloom, A glue, B glue and anti-precipitation powder, and the weight ratio of bloom, A glue, B glue and anti-precipitation powder is followed successively by: (0.08 ~ 0.32): 0.2:0.8:(0.005 ~ 0.02).
A second aspect of the present invention discloses a kind of colour temperature and shows the preparation method referring to adjustable white light LED part, and it comprises the steps:
Die sinking: form first bowl of cup and second bowl of cup on main body rack;
Die bond: the first blue LED die is fixed in first bowl of cup, the second blue LED die is fixed in second bowl of cup;
Bonding wire: the both positive and negative polarity welding the first blue LED die and the second blue LED die respectively;
Sealing: by the first fluorescent adhesive layer injecting glue in first bowl of cup, seal the first blue LED die; By the second fluorescent adhesive layer injecting glue in second bowl of cup, seal the second blue LED die;
Wherein, the first fluorescent adhesive layer is the fluorescent adhesive layer of low colour temperature height aobvious assignment ratio, and the second fluorescent adhesive layer is the fluorescent adhesive layer of the low aobvious assignment ratio of high color temperature; Or the first fluorescent adhesive layer is the fluorescent adhesive layer of the low aobvious assignment ratio of high color temperature, the second fluorescent adhesive layer is the fluorescent adhesive layer of low colour temperature height aobvious assignment ratio.
According to an embodiment of the present invention, in die sinking step wherein:
Main body rack is also formed with the first isolation mount:
First isolation mount is longitudinally formed between first bowl of cup and second bowl of cup, in order to separate the first blue LED die and the second blue LED die.
According to an embodiment of the present invention, in die sinking step wherein:
Main body rack is also formed with the second isolation mount and the 3rd isolation mount that separate white light LED part positive pole pin and negative pole pin;
Second isolation mount is laterally formed in first bowl of cup;
3rd isolation mount is laterally formed in second bowl of cup.
A third aspect of the present invention, disclose a kind of white light LED part colour temperature aobvious finger regulate and control method, it comprises the steps:
Current regulation: the electric current regulating first bowl of cup, the power of first bowl of cup becomes the first power adjustments percentage P from the first power initial percentage
1; Regulate the electric current of second bowl of cup, the power of second bowl of cup becomes the second power adjustments percentage P from the second power initial percentage
2;
Brightness control: the brightness of white light LED part is become from original intensity:
P
1maximum brightness+the P of × the first bowl of cup
2the maximum brightness of × the second bowl of cup;
Colour temperature regulates and controls: the colour temperature of white light LED part is become from initial colour temperature:
Aobvious finger regulation and control: the aobvious finger of white light LED part becomes from initially showing finger:
Wherein, in current regulation step, the Current adjustment order of the Current adjustment of first bowl of cup and second bowl of cup in no particular order; After carrying out current regulation, the brightness of white light LED part, colour temperature and aobvious finger, change with current regulation simultaneously.
Accompanying drawing explanation
Fig. 1 is the front view of white light LED part when adopting positive cartridge chip in the embodiment of the present invention one;
Fig. 2 is the front view of white light LED part when adopting flip-chip in the embodiment of the present invention one;
Fig. 3 is the bottom view of white light LED part in the embodiment of the present invention one;
Fig. 4 is the end view of white light LED part in the embodiment of the present invention one.
Description of reference numerals: 10, main body rack; 101, first bowl of cup; 102, second bowl of cup; 201, the first blue LED die, 202, the second blue LED die; 301, the first fluorescent adhesive layer; 302, the second fluorescent adhesive layer; 401, the first isolation mount; 402, the second isolation mount; 403, the 3rd isolation mount; 404, the first positive pole pin; 405, the first negative pole pin; 406, the second positive pole pin; 407, the second negative pole pin; 408, the first gold thread; 409, the second gold thread; 410, the 3rd gold thread; 411, the 4th gold thread; 412, first is heat sink; 413, second is heat sink; 414, the first adhesive-spill-preventing structure; 415, the second adhesive-spill-preventing structure.
Embodiment
Below will with graphic exposure multiple execution mode of the present invention, as clearly stated, the details in many practices will be explained in the following description.But should be appreciated that, the details in these practices is not applied to limit the present invention.That is, in some embodiments of the present invention, the details in these practices is non-essential.In addition, for the purpose of simplicity of illustration, some known usual structures and assembly illustrate it by the mode simply illustrated in the drawings.
About it " first ", " second " etc. used herein, the not special meaning of censuring order or cis-position, is also not used to limit the present invention, and it is only used to distinguish the assembly or operation that describe with constructed term.
The present invention has to show about a kind of colour temperature the design referring to adjustable white light LED part, and the preparation method of white light LED part and white light LED part colour temperature are aobvious refers to regulate and control method, white light LED part of the present invention can carry out the aobvious finger regulation and control of colour temperature on the one hand, on the other hand, also there is the simple structural design not available for prior art, thus reduce device preparation cost.Below, divide three embodiments to introduce colour temperature in the present invention respectively in detail and show the structural design, its preparation method and the regulate and control method that refer to adjustable white light LED part.
Embodiment one
Please refer to Fig. 1-4, the present embodiment provides a kind of colour temperature to show the adjustable white light LED part of finger, and white light LED part comprises: main body rack 10, first bowl of cup 101, second bowl of cup 102, chip loop and adhesive body.
As shown in Fig. 1 and 2, along the longitudinal direction of main body rack 10, by the inner recess of main body rack 10 end face to main body rack 10, form first bowl of cup 101 and second bowl of cup 102.First bowl of cup 101 and second bowl of cup 102 shape and measure-alike.On main body rack 10, be also provided with two groups of conductive pins, two groups of conductive pins and main body rack 10 one-body molded; Two groups of conductive pins on main body rack 10, simultaneously as the conductive pin of white light LED part, are connected with external power source or external circuit.Two groups of conductive pins are respectively first group of conductive pin and second group of conductive pin; First group of conductive pin comprises the first positive pole pin 404 and the first negative pole pin 405; Second group of conductive pin comprises the second positive pole pin 406 and the second negative pole pin 407, and as Fig. 1 and 2, the first positive pole pin 404 is located at the left side of first bowl of cup 101, and the first negative pole pin 405 is located at the right side of first bowl of cup 101; Second positive pole pin 406 is located at the left side of second bowl of cup 102, and the second negative pole pin 407 is located at the right side of second bowl of cup 102.
Chip loop comprises the first chip circuit and the second chip circuit.First chip circuit comprises the first current control circuit of electrical connection and the first blue LED die 201, first current control circuit in order to control the electric current of the first blue LED die 201, and the first blue LED die 201 is fixed in first bowl of cup 101; Second chip circuit comprises the second current control circuit of electrical connection and the second blue LED die 202, second current control circuit in order to control the electric current of the second blue LED die 202, and the second blue LED die 202 is fixed in second bowl of cup 102.Preferably, first blue LED die 201 and the second blue LED die 202 can adopt packed LED chip or flip LED chips respectively, the dominant wavelength of the first blue LED die 201 and the second blue LED die 202 is 440nm-480nm, the wave band of 440nm-480nm includes all wave bands of blue light, according to the difference of wave band, different fluorescent material of can arranging in pairs or groups reaches better light distribution effect.
First current control circuit can adopt the circuit design of prior art, and the first blue LED die 201 adopts positive cartridge chip or flip-chip.As Fig. 1, when the first blue LED die 201 adopts positive cartridge chip, first blue LED die 201 uses white glue die bond, be fixed in first bowl of cup 101, preferably be fixed on position, middle, first bowl of cup 101 bottom surface, first blue LED die 201 adopts the first gold thread 408 and the second gold thread 409 to weld its both positive and negative polarity respectively, and to realize being electrically connected with the first current control circuit, the first current control circuit then connects the first positive pole pin 404 and the first negative pole pin 405 respectively.When the first blue LED die 201 adopts flip-chip, as Fig. 2, first blue LED die 201 uses tin cream or eutectic welding, be fixed in first bowl of cup 101, and can directly realize being electrically connected with the first current control circuit, the first current control circuit then connects the first positive pole pin 404 and the first negative pole pin 405 respectively.
Second current control circuit can adopt the circuit design of prior art, also can be identical with the circuit design of the first current control circuit.Second blue LED die 202 adopts positive cartridge chip or flip-chip.As Fig. 1, when the second blue LED die 202 adopts positive cartridge chip, second blue LED die 202 uses white glue die bond, be fixed in second bowl of cup 102, preferably be fixed on position, middle, second bowl of cup 102 bottom surface, second blue LED die 202 adopts the 3rd gold thread 410 and the 4th gold thread 411 to weld its both positive and negative polarity respectively, and to realize being electrically connected with the second current control circuit, the second current control circuit then connects the second positive pole pin 406 and the second negative pole pin 407 respectively.When the second blue LED die 202 adopts flip-chip, as Fig. 2, second blue LED die 202 uses tin cream or eutectic welding, be fixed in second bowl of cup 102, and can directly realize being electrically connected with the second current control circuit, the second current control circuit then connects the second positive pole pin 406 and the second negative pole pin 407 respectively.
As Fig. 4, adhesive body comprises the first fluorescent adhesive layer 301 and the second fluorescent adhesive layer 302.First fluorescent adhesive layer 301 is in order to be sealed in first bowl of cup 101 by the first blue LED die 201; Second fluorescent adhesive layer 302 is in order to be sealed in the second blue LED die 202 in second bowl of cup 102.Wherein, the first fluorescent adhesive layer 301 is the fluorescent adhesive layer of low colour temperature height aobvious assignment ratio, and the second fluorescent adhesive layer 302 is the fluorescent adhesive layer of the low aobvious assignment ratio of high color temperature; Or the first fluorescent adhesive layer 301 is the fluorescent adhesive layer of the low aobvious assignment ratio of high color temperature, the second fluorescent adhesive layer 302 is the fluorescent adhesive layer of low colour temperature height aobvious assignment ratio.In industry, colour temperature is divided into: cold in vain, just white, warm white, respectively with 6000K, 4500K, 3000K for standard, in the present invention, high color temperature refers to 6000k, and low colour temperature refers to 3000k; Low aobvious finger is generally 80 and following aobvious to refer to, 90 and aobviously refers to and then belong to high above aobviously to refer to.
First fluorescent adhesive layer 301 and the second fluorescent adhesive layer 302 are formed by the external sealant configuration of fluorescent material and encapsulation, be the wave band of 440nm-480nm according to the dominant wavelength that the first blue LED die 201 and the second blue LED die 202 are selected, in order to reach better light distribution effect, fluorescent material collocation is as follows: fluorescent material is that bloom and rouge and powder combine, or be single bloom, then or be the combination of yellowish green powder and rouge and powder.Particularly, when carrying out the configuration of the first fluorescent adhesive layer 301 and the second fluorescent adhesive layer 302, the fluorescent adhesive layer of low colour temperature height aobvious assignment ratio comprises following component: rouge and powder, bloom, A glue, B glue and anti-precipitation powder, wherein, the weight ratio of rouge and powder, bloom, A glue, B glue and anti-precipitation powder is followed successively by (0.005 ~ 0.02): (0.12 ~ 0.48): 0.2:0.8:(0.005 ~ 0.02); Be preferably, the weight ratio of rouge and powder, bloom, A glue, B glue and anti-precipitation powder is followed successively by 0.01:0.24:0.2:0.8:0.01; Or, the fluorescent adhesive layer of low colour temperature height aobvious assignment ratio comprises following component: rouge and powder, yellowish green powder, A glue, B glue and anti-precipitation powder, wherein, the weight ratio of rouge and powder, yellowish green powder, A glue, B glue and anti-precipitation powder is followed successively by (0.0025 ~ 0.01): (0.15 ~ 0.6): 0.2:0.8:(0.005 ~ 0.02), be preferably, the weight ratio of rouge and powder, yellowish green powder, A glue, B glue and anti-precipitation powder is followed successively by 0.005:0.3:0.2:0.8:0.01.The fluorescent adhesive layer of the low aobvious assignment ratio of high color temperature comprises following component: bloom, A glue, B glue and anti-precipitation powder, wherein, the weight ratio of bloom, A glue, B glue and anti-precipitation powder is followed successively by: (0.08 ~ 0.32): 0.2:0.8:(0.005 ~ 0.02); Be preferably, the weight ratio of bloom, A glue, B glue and anti-precipitation powder is followed successively by 0.16:0.2:0.8:0.01.
White light LED part in the present embodiment, by the fluorescent adhesive layer difference injecting glue of aobvious for low colour temperature the height fluorescent adhesive layer and the low aobvious assignment ratio of high color temperature that assign ratio in two bowl cups, by freely controlling the electric current of two blue LED die respectively, the aobvious finger of colour temperature can be realized controlled, effectively reduce the preparation cost of white light LED part in prior art.In addition, relative to the LED component needing use two kinds of above different-colours of difference in prior art, single the white light LED part of the present embodiment saves spatial area more.
Further, the material selection PPA of main body rack 10 or EMC resin material, manyly effectively space is utilized in order to make can to have in main body rack 10, be beneficial to the placement of two blue LED die, and improve the reliability of white light LED part production technology, improve the uniformity of white light LED part bright dipping, white light LED part also comprises the first isolation mount 401, as Fig. 1 and 2, first isolation mount 401 is longitudinally arranged between first bowl of cup 101 and second bowl of cup 102, in order to separate the first blue LED die and the second blue LED die, concrete, for separating the first chip circuit and the second chip circuit.The material of the first isolation mount 401 is consistent with the material of main body rack 10, can be one-body molded with main body rack 10, or the first isolation mount 401 is a part for main body rack 10, is directly formed in die sinking step.
In another preferred version, white light LED part also comprises the second isolation mount 402 and the 3rd isolation mount 403.As Fig. 1 and 2, the second isolation mount 402 is horizontally set in first bowl of cup 101, in order to separate positive pole pin and the negative pole pin of white light LED part, concrete, and the second isolation mount 402 is for separating the first positive pole pin 404 and the first negative pole pin 405; 3rd isolation mount 403 is horizontally set in second bowl of cup 102, in order to separate positive pole pin and the negative pole pin of white light LED part, concrete, and the 3rd isolation mount 403 is for separating the second positive pole pin 406 and the second negative pole pin 407.The material of the second isolation mount 402 and the 3rd isolation mount 403 is consistent with the material of main body rack 10, can be one-body molded with main body rack 10, or the second isolation mount 402 and the 3rd isolation mount 403 are a part for main body rack 10, are directly formed in die sinking step.Specifically, the concrete setting position of the second isolation mount 402 and the 3rd isolation mount 403 comprises following two kinds: (1) second isolation mount 402 and is arranged at first bowl of cup 101 centre position, and the distance of itself and white light LED part positive pole pin equals the distance of itself and white light LED part negative pole pin; 3rd isolation mount 403 is arranged at second bowl of cup 102 centre position, and the distance of itself and white light LED part positive pole pin equals the distance of itself and white light LED part negative pole pin.As Fig. 2, the distance of the second isolation mount 402 to the first positive pole pin 404 is equal with its distance to the first negative pole pin 405; The distance of the 3rd isolation mount 403 to the second positive pole pin 406 is equal with its distance to the second negative pole pin 407.(2) second isolation mounts 402 and the distance of white light LED part positive pole pin are greater than the distance of itself and white light LED part negative pole pin; 3rd isolation mount 403 and the distance of the positive pole pin of white light LED part are greater than the distance of the negative pole pin of itself and white light LED part.As Fig. 1, the distance of the second isolation mount 402 to the first positive pole pin 404 is greater than its distance to the first negative pole pin 405; The distance of the 3rd isolation mount 403 to the second positive pole pin 406 is greater than its distance to the second negative pole pin 407.Adopt the second isolation mount 402 and the 3rd isolation mount 403 to separate the both positive and negative polarity pin of white light LED part, effectively prevent the both positive and negative polarity pin of white light LED part from conducting electricity, and can make rational planning for chip placement locations and space.In addition, it should be noted that, said longitudinal and horizontal in the present invention, explain according to engineering science, as in Fig. 1 and 2 front views, the direction at parallel longer sides place is called longitudinal direction, and the parallel direction compared with minor face place is called transverse direction.
In addition, because the white light LED part in the present embodiment has first bowl of cup 101 and second bowl of cup, 102 two bowl cups, in order to prevent two bowl cups from the interactive circumstances of glue of overflowing occurring, the first adhesive-spill-preventing structure 414 and the second adhesive-spill-preventing structure 415 is set in white light LED part, as shown in Figure 4.In the bottom of first bowl of cup 101 and second bowl of cup 102, be also provided with first heat sink 412 and second heat sink 413 respectively, as shown in Figure 3, first heat sink 412 and second heat sink 413 in order to improve the heat sinking function of white light LED part.First heat sink 412 and second heat sink 413 specifically uses copper silver-plated, is more conducive to the conduction of heat in white light LED part, improves the life-span of the first blue LED die 201 and the second blue LED die 202.
It should be noted that, carry out technology extension according to same principle of the present invention, white light LED part of the present invention can also comprise the 3rd bowl of cup and the 3rd blue LED die, or more bowls of cups and the blue LED die identical with bowl cup number.In the white light LED part structure being greater than two bowl cups and two blue LED die, independent separately between each blue LED die and between each bowl of cup, each bowl of cup inside seals a blue LED die with a fluorescent adhesive layer.If bowl cup number and blue LED die number are even number, fluorescent adhesive layer is then configured successively according to the proportioning of the low aobvious assignment of high color temperature finger more aobvious than collocation one low colour temperature height; If bowl cup number and blue LED die are odd number, fluorescent adhesive layer is first configured successively according to the proportioning of the low aobvious assignment of high color temperature finger more aobvious than collocation one low colour temperature height, remain the fluorescent adhesive layer that the fluorescent adhesive layer adopted in a bowl cup can be the low aobvious assignment ratio of high color temperature or low colour temperature height aobvious assignment ratio, specifically do not limit, white light LED part realizes colour temperature according to above-mentioned same principle and aobvious finger is adjustable.
Embodiment two
The present embodiment provides a kind of colour temperature to show the preparation method referring to adjustable white light LED part, and it comprises the steps:
Die sinking: form first bowl of cup 101 and second bowl of cup 102 at main body rack 10 end face.As Fig. 1 and 2, the model designing SMD white light LED part with CAD, carries out injection moulding die sinking.White light LED part size can be 5730, also can be 2835 or other.Main body rack 10 also can be EMC resin material for PPA.In preferred version, in die sinking step, main body rack 10 is also formed with the first isolation mount 401; First isolation mount 401 is longitudinally formed between first bowl of cup 101 and second bowl of cup 102, in order to separate the first blue LED die and the second blue LED die.The material of the first isolation mount 401 is consistent with the material of main body rack 10, can be one-body molded with main body rack 10.In another preferred version, in die sinking step: main body rack 10 is also formed with the second isolation mount 402 and the 3rd isolation mount 403; Second isolation mount 402 is laterally formed in first bowl of cup 101, in order to separate positive pole pin and the negative pole pin of white light LED part; 3rd isolation mount 403 is laterally formed in second bowl of cup 102, in order to separate positive pole pin and the negative pole pin of white light LED part.The material of the second isolation mount 402 and the 3rd isolation mount 403 is consistent with the material of main body rack 10, can be one-body molded with main body rack 10.Specifically, the concrete setting position of the second isolation mount 402 and the 3rd isolation mount 403 is identical with embodiment one, repeats no more here.
Die bond: be fixed on by the first blue LED die 201 in first bowl of cup 101, the second blue LED die 202 is fixed in second bowl of cup 102.First blue LED die 201 and the second blue LED die 202 can adopt positive cartridge chip or flip-chip respectively.When the first blue LED die 201 and the second blue LED die 202 adopt positive cartridge chip, the first blue LED die 201 and the second blue LED die 202 all use white glue die bond, make the two be individually fixed in first bowl of cup 101 and second bowl of cup 102; When the first blue LED die 201 and the second blue LED die 202 adopt flip-chip, the two all uses tin cream or eutectic welding, and the first blue LED die 201 and the second blue LED die 202 are individually fixed in first bowl of cup 101 and second bowl of cup 102.
Bonding wire: the both positive and negative polarity welding the first blue LED die 201 and the second blue LED die 202 respectively; When the first blue LED die 201 and the second blue LED die 202 adopt positive cartridge chip, first blue LED die 201 adopts the first gold thread 408 and the second gold thread 409 to weld its both positive and negative polarity respectively respectively, and the second blue LED die 202 adopts the 3rd gold thread 410 and the 4th gold thread 411 to weld its both positive and negative polarity respectively respectively; The two is connected in the first chip circuit and the second chip circuit.When the first blue LED die 201 and the second blue LED die 202 adopt the positive cartridge chip of upside-down mounting, when the two uses tin cream or eutectic welding, do not need to adopt gold thread, the two is just directly connected in the first chip circuit and the second chip circuit.
Sealing: by the first fluorescent adhesive layer 301 injecting glue in first bowl of cup 101, seal the first blue LED die 201; By the second fluorescent adhesive layer 302 injecting glue in second bowl of cup 102, seal the second blue LED die 202.In the present embodiment, first fluorescent adhesive layer 301 and the second fluorescent adhesive layer 302 have the parameter characteristic identical with embodiment one: the first fluorescent adhesive layer 301 is the aobvious fluorescent adhesive layer assigning ratio of low colour temperature height, and the second fluorescent adhesive layer 302 is the fluorescent adhesive layer of the low aobvious assignment ratio of high color temperature; Or the first fluorescent adhesive layer 301 is the fluorescent adhesive layer of the low aobvious assignment ratio of high color temperature, the second fluorescent adhesive layer 302 is the fluorescent adhesive layer of low colour temperature height aobvious assignment ratio.First fluorescent adhesive layer 301 and the second fluorescent adhesive layer 302 are configured by the external sealant of fluorescent material and encapsulation and form, and fluorescent material is that bloom and rouge and powder combine, or is single bloom, then or are the combination of yellowish green powder and rouge and powder.When carrying out the configuration of the first fluorescent adhesive layer 301 and the second fluorescent adhesive layer 302, the proportioning that low colour temperature height shows proportioning and the low aobvious finger of high color temperature referred to is identical with embodiment one, repeats no more here.
Because present embodiment only adopts blue LED die, on the one hand, corresponding single LEDs device power consumption is little, and cost is lower relative to conventional art.The base plate line used is also relatively simply too much; On the other hand, the primer adopted in die bond step is identical; In bonding wire step, adopt packed LED chip, bonding wire negligible amounts, when adopting flip LED chips, more without the need to bonding wire, operation is simple, enhances productivity; Moreover even if wherein the bright dipping of a blue LED die goes wrong, also can not cause the waste of whole white light LED part, another blue LED die still can normally bright dipping.
Embodiment three
The present embodiment provides a kind of white light LED part colour temperature aobvious finger regulate and control method, and it comprises the steps:
Current regulation: the electric current regulating first bowl of cup 101, the power of first bowl of cup 101 becomes the first power adjustments percentage P from the first power initial percentage
1; Regulate the electric current of second bowl of cup 102, the power of second bowl of cup 102 becomes the second power adjustments percentage P from the second power initial percentage
2; Wherein, in each bowl of cup, the adjustable range of size of current changes according to blue LED die fixing in bowl cup, can be 0-700mA.In each bowl of cup, the change correspondence of power can be 0-100%.
Brightness control: the brightness of white light LED part is become from original intensity:
P
1maximum brightness+the P of × the first bowl of cup
2the maximum brightness of × the second bowl of cup.
Colour temperature regulates and controls: the colour temperature of white light LED part is become from initial colour temperature:
Aobvious finger regulation and control: the aobvious finger of white light LED part becomes from initially showing finger:
Wherein, in current regulation step, the Current adjustment order of the Current adjustment of first bowl of cup 101 and second bowl of cup 102 in no particular order; After carrying out current regulation, the brightness of white light LED part, colour temperature and aobvious finger, change with current regulation simultaneously.
In the present embodiment, the colour temperature of first bowl of cup 101 shows and refers to that the first fluorescent adhesive layer 301 by filling in first bowl of cup 101 determines, the colour temperature of first bowl of cup 101 show refer to show with the colour temperature of the first fluorescent adhesive layer 301 refer to identical; The colour temperature of second bowl of cup 102 shows and refers to that the second fluorescent adhesive layer 302 by filling in second bowl of cup 102 determines, the colour temperature of second bowl of cup 102 show refer to show with the colour temperature of the second fluorescent adhesive layer 302 refer to identical; The proportioning of the first fluorescent adhesive layer 301 and the proportioning of the second fluorescent adhesive layer 302 identical with embodiment one, repeat no more here.The original intensity of white light LED part, initial colour temperature and initial aobvious finger refer to respectively: first bowl of cup 101 and second bowl of cup 102 respectively when the first power initial percentage and the second power initial percentage, the brightness of white light LED part, colour temperature and aobviously to refer to.
Be the fluorescent adhesive layer of the low aobvious finger of high color temperature with the first fluorescent adhesive layer 301 injected in first bowl of cup 101 in this embodiment, the second fluorescent adhesive layer 302 injected in second bowl of cup 102 is the aobvious fluorescent adhesive layer referred to of low colour temperature height is that example is described, the colour temperature of the first fluorescent adhesive layer 301 injected in first bowl of cup 101 is 6000K, the colour temperature of the second fluorescent adhesive layer 302 injected in second bowl of cup 102 is 3000K, it will be understood by those skilled in the art that, only in order to make, the colour temperature of those skilled in the art's understanding white light LED part is clearly aobvious refers to regulate and control method to this example, not in order to limit the present invention.
Brightness control: white light LED part brightness range can be 0-280lm, maximum brightness is 280lm, corresponding, the maximum brightness of first bowl of cup 101 and second bowl of cup 102 is 140lm, regulate the electric current of first bowl of cup 101 and second bowl of cup 102 to be respectively an electric current between 60-350mA, make the power of first bowl of cup 101 become the first power adjustments percentage P from the first power initial percentage
1, P
1be that the power of 50%, second bowl of cup 102 becomes the second power adjustments percentage P from the second power initial percentage
2, P
2be 50%, now, the brightness of white light LED part becomes 0.5*140+0.5*140=140lm.
Colour temperature regulates and controls: the colour temperature of first bowl of cup 101 is 6000k, and the colour temperature of second bowl of cup 102 is 3000k, regulates the electric current of first bowl of cup 301 and second bowl of cup 302, and the power of first bowl of cup 101 becomes the first power adjustments percentage P from the first power initial percentage
1, P
1be that the power of 50%, second bowl of cup 102 becomes the second power adjustments percentage P from the second power initial percentage
2, P
2be 50%, the colour temperature of white light LED part then becomes [0.5/ (0.5+0.5)] * 6000+ [0.5/ (0.5+0.5)] * 3000=4500K.Aobvious finger principle of adjustment and control regulates and controls identical with colour temperature, no longer describes in detail here.
Therefore, regulating and controlling the electric current of first bowl of cup 301 and second bowl of cup 302, be the power percentage of both control, like this by controlling electric current, just can realize colour temperature and the aobvious regulation and control referring to also have brightness.
Be only embodiments of the present invention described in upper, be not limited to the present invention.To those skilled in the art, the present invention can have various modifications and variations.All do in spirit of the present invention and principle any amendment, equivalent replacement, improvement etc., all should be included within right of the present invention.
Claims (10)
1. colour temperature shows and refers to an adjustable white light LED part, it is characterized in that, comprising:
Main body rack (10);
Be formed at first bowl of cup (101) on main body rack (10) and second bowl of cup (102);
Be fixed on the first blue LED die (201) in first bowl of cup (101);
Be fixed on the second blue LED die (202) in second bowl of cup (102);
First fluorescent adhesive layer (301), in order to be sealed in first bowl of cup (101) by the first blue LED die (201); And,
Second fluorescent adhesive layer (302), in order to be sealed in second bowl of cup (102) by the second blue LED die (202);
Wherein, the first fluorescent adhesive layer (301) is the fluorescent adhesive layer of low colour temperature height aobvious assignment ratio, and the second fluorescent adhesive layer (302) is the fluorescent adhesive layer of the low aobvious assignment ratio of high color temperature; Or the first fluorescent adhesive layer (301) is the fluorescent adhesive layer of the low aobvious assignment ratio of high color temperature, the second fluorescent adhesive layer (302) is the fluorescent adhesive layer of low colour temperature height aobvious assignment ratio.
2. white light LED part according to claim 1, is characterized in that, also comprises:
First isolation mount (401), described first isolation mount (401) is longitudinally arranged between described first bowl of cup (101) and second bowl of cup (102), in order to separate the first blue LED die and the second blue LED die.
3. white light LED part according to claim 1, is characterized in that, also comprises:
In order to separate the second isolation mount (402) and the 3rd isolation mount (403) of white light LED part positive pole pin and negative pole pin;
Described second isolation mount (402) is horizontally set in described first bowl of cup (101);
Described 3rd isolation mount (403) is horizontally set in described second bowl of cup (102).
4. white light LED part according to claim 3, is characterized in that:
The distance of the second isolation mount (402) and white light LED part positive pole pin equals the distance of itself and white light LED part negative pole pin; The distance of the 3rd isolation mount (403) and white light LED part positive pole pin equals the distance of itself and white light LED part negative pole pin;
Or the distance of the second isolation mount (402) and white light LED part positive pole pin is greater than the distance of itself and white light LED part negative pole pin; The distance of the positive pole pin of the 3rd isolation mount (403) and white light LED part is greater than the distance of the negative pole pin of itself and white light LED part.
5., according to the arbitrary described white light LED part of claim 1-4, it is characterized in that:
The fluorescent adhesive layer of described low colour temperature height aobvious assignment ratio comprises following component: rouge and powder, bloom, A glue, B glue and anti-precipitation powder; The weight ratio of described rouge and powder, bloom, A glue, B glue and anti-precipitation powder is followed successively by (0.005 ~ 0.02): (0.12 ~ 0.48): 0.2:0.8:(0.005 ~ 0.02);
Or the fluorescent adhesive layer of described low colour temperature height aobvious assignment ratio comprises following component: rouge and powder, yellowish green powder, A glue, B glue and anti-precipitation powder; The weight ratio of described rouge and powder, yellowish green powder, A glue, B glue and anti-precipitation powder is followed successively by (0.0025 ~ 0.01): (0.15 ~ 0.6): 0.2:0.8:(0.005 ~ 0.02).
6., according to the arbitrary described white light LED part of claim 1-4, it is characterized in that:
The fluorescent adhesive layer of the low aobvious assignment ratio of described high color temperature comprises following component: bloom, A glue, B glue and anti-precipitation powder, and the weight ratio of described bloom, A glue, B glue and anti-precipitation powder is followed successively by: (0.08 ~ 0.32): 0.2:0.8:(0.005 ~ 0.02).
7. colour temperature shows the preparation method referring to adjustable white light LED part, it is characterized in that, comprises the steps:
Die sinking: the upper formation first bowl of cup (101) of main body rack (10) and second bowl of cup (102);
Die bond: the first blue LED die (201) is fixed in first bowl of cup (101), the second blue LED die (202) is fixed in second bowl of cup (102);
Bonding wire: the both positive and negative polarity welding the first blue LED die (201) and the second blue LED die (202) respectively;
Sealing: by the first fluorescent adhesive layer (301) injecting glue in first bowl of cup (101), seal the first blue LED die (201); By the second fluorescent adhesive layer (302) injecting glue in second bowl of cup (102), seal the second blue LED die (202);
Wherein, the first fluorescent adhesive layer (301) is the fluorescent adhesive layer of low colour temperature height aobvious assignment ratio, and the second fluorescent adhesive layer (302) is the fluorescent adhesive layer of the low aobvious assignment ratio of high color temperature; Or the first fluorescent adhesive layer (301) is the fluorescent adhesive layer of the low aobvious assignment ratio of high color temperature, the second fluorescent adhesive layer (302) is the fluorescent adhesive layer of low colour temperature height aobvious assignment ratio.
8. preparation method according to claim 7, is characterized in that, in wherein said die sinking step:
Main body rack (10) is also formed with the first isolation mount (401);
Described first isolation mount (401) is longitudinally formed between described first bowl of cup (101) and second bowl of cup (102), in order to separate the first blue LED die and the second blue LED die.
9. the preparation method according to claim 7 or 8, is characterized in that, in described die sinking step:
Described main body rack (10) is also formed with the second isolation mount (402) and the 3rd isolation mount (403) that separate white light LED part positive pole pin and negative pole pin;
Described second isolation mount (402) is laterally formed in described first bowl of cup (101);
Described 3rd isolation mount (403) is laterally formed in described second bowl of cup (102).
10. white light LED part colour temperature is aobvious refers to a regulate and control method, it is characterized in that, comprises the steps:
Current regulation: the electric current regulating first bowl of cup (101), the power of first bowl of cup (101) becomes the first power adjustments percentage P from the first power initial percentage
1; Regulate the electric current of second bowl of cup (102), the power of second bowl of cup (102) becomes the second power adjustments percentage P from the second power initial percentage
2;
Brightness control: the brightness of white light LED part is become from original intensity:
P
1maximum brightness+the P of × the first bowl of cup
2the maximum brightness of × the second bowl of cup;
Colour temperature regulates and controls: the colour temperature of white light LED part is become from initial colour temperature:
Aobvious finger regulation and control: the aobvious finger of white light LED part becomes from initially showing finger:
Wherein, in current regulation step, the Current adjustment of first bowl of cup (101) and the Current adjustment order of second bowl of cup (102) are in no particular order; After carrying out current regulation, the brightness of white light LED part, colour temperature and aobvious finger, change with current regulation simultaneously.
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| CN106058017A (en) * | 2016-06-30 | 2016-10-26 | 宁波升谱光电股份有限公司 | LED assembly with continuous adjustable color temperature and preparation method thereof |
| CN107068839A (en) * | 2017-02-16 | 2017-08-18 | 安徽芯瑞达科技股份有限公司 | A kind of multicolor luminous CSP chip manufacture methods of microminiaturization |
| CN107482101A (en) * | 2017-09-18 | 2017-12-15 | 广东晶科电子股份有限公司 | A kind of LED packagings with more glasss of supports and preparation method thereof |
| CN109817609A (en) * | 2018-12-06 | 2019-05-28 | 浙江开元机电科技有限公司 | A kind of color temperature-tunable LED tunnel lamp of dual chip |
| CN109888073A (en) * | 2019-01-25 | 2019-06-14 | 浙江英特来光电科技有限公司 | A kind of full-spectrum LED packaging method |
| CN111457264A (en) * | 2020-04-13 | 2020-07-28 | 浙江阳光美加照明有限公司 | Light-emitting device capable of adjusting color temperature |
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