CN105489738B - Colour temperature is aobvious to refer to adjustable white light LED part, preparation method and regulation method - Google Patents
Colour temperature is aobvious to refer to adjustable white light LED part, preparation method and regulation method Download PDFInfo
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- CN105489738B CN105489738B CN201610087840.5A CN201610087840A CN105489738B CN 105489738 B CN105489738 B CN 105489738B CN 201610087840 A CN201610087840 A CN 201610087840A CN 105489738 B CN105489738 B CN 105489738B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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Abstract
The present invention discloses that a kind of colour temperature is aobvious to refer to adjustable white light LED part, preparation method and regulation method.White light LED part includes：Main body rack；It is formed in the first bowl and the second bowl of main body rack；The first blue LED die being fixed in the first bowl；And it is fixed on the second blue LED die in the second bowl；First blue LED die is sealed in the first bowl by the first fluorescent adhesive layer；And second fluorescent adhesive layer, the second blue LED die is sealed in the second bowl；First fluorescent adhesive layer has the aobvious assignment ratio of low color temperature height, and the second fluorescent adhesive layer has the low aobvious assignment ratio of high color temperature；Or, the first fluorescent adhesive layer has the low aobvious assignment ratio of high color temperature, the second fluorescent adhesive layer has the aobvious assignment ratio of low color temperature height.Two kinds of different fluorescent adhesive layers are distinguished into injecting glues in two bowls, control the electric current of two chips respectively, realize that aobvious refer to of colour temperature controllably breaks through the structure design that tradition at least needs two kinds of color chips to be just able to achieve adjustable color.
Description
Technical field
The present invention relates to LED component field more particularly to a kind of adjustable white light LED parts of the aobvious finger of colour temperature, its preparation side
Method and regulation method.
Background technique
In the prior art, it realizes the controllable single LED device of colour temperature, mainly has with flowering structure：
1. single LED device load is red, three kinds of colors of green and blue chip, by controlling electric current, to reach colour temperature controllable；2.
Single LED device load is red and the chip of blue two kinds of colors, and uses yellow fluorescent powder sealing, passes through the electricity of control red chip
It is controllable that stream reaches colour temperature；3. the red two kinds of color chips of single LED device load bletilla reach color by controlling red chip electric current
It is warm controllable.
Although the controllable purpose of colour temperature may be implemented in single LED device of above-mentioned three kinds of structures, but needs at least two are not
With the LED chip of color, and also it is respectively provided with following defects：
1. the structure that three kinds of conventional red, green and blue color chips are collocated with each other, corresponding list LED device power consumption is big, makes
High price is expensive, deficiency in economic performance.2. the structure that conventional red, indigo plant and yellow three kinds of color chips are collocated with each other, then have as a drawback that：It is first
First, corresponding list LED device production process is relatively cumbersome, is mainly reflected in red chip and blue chip, yellow chip point
It does not need to carry out die bond using different primers, more bonding wire can reduce the speed of production；Secondly, corresponding list LED device
In part, once the light that goes out of any of them color chips in three kinds of color chips goes wrong, entire list LED device is all
It can fail, cause the waste of other color chips；Again, in the structure that conventional red, indigo plant and yellow three kinds of chips are collocated with each other, production
Single LED device needs base plate line control power supply that is increasingly complex, and needing to arrange in pairs or groups relative complex to be used.3. traditional blue
And the structure that red two kinds of chips are collocated with each other, colour temperature is mainly controlled by yellow fluorescent powder employed in sealing process,
This structure is relatively red, three kinds of color chips of green and blue are collocated with each other and red, blue and yellow three kinds of color chips are collocated with each other
For structure, energy consumption wants low, it is well known that red chip utilization rate is low, economic benefit does not obtain too big improvement, regulation
Chromaticity coordinates point can not agree with Planck curve.4. the structure that traditional red two kinds of chips of bletilla are collocated with each other, due to white core
Piece is immature, and economic benefit is also poor, light efficiency it is low and it is aobvious refer to it is uncontrollable.
Summary of the invention
The LED chip of at least two different colours is needed just to be able to achieve colour temperature tune for single LED device in the prior art
The problem of control, the present invention provide that a kind of colour temperature is aobvious to refer to adjustable white light LED part, preparation method and adjusting method, the present invention
Middle white light LED part only needs a kind of LED chip of color to be able to achieve colour temperature and the aobvious regulation referred to.
In order to solve the above-mentioned technical problem, the first aspect of the present invention discloses a kind of aobvious adjustable white light LEDs of finger of colour temperature
Device comprising：
Main body rack；
The first bowl and the second bowl being formed on main body rack；
The first blue LED die being fixed in the first bowl；
The second blue LED die being fixed in the second bowl；
First fluorescent adhesive layer, the first blue LED die to be sealed in the first bowl；And
Second fluorescent adhesive layer, the second blue LED die to be sealed in the second bowl；
Wherein, the first fluorescent adhesive layer is the fluorescent adhesive layer of the aobvious assignment ratio of low color temperature height, and the second fluorescent adhesive layer is that high color temperature is low
The fluorescent adhesive layer of aobvious assignment ratio；Or, the first fluorescent adhesive layer is the fluorescent adhesive layer of the low aobvious assignment ratio of high color temperature, the second fluorescent adhesive layer is
The fluorescent adhesive layer of the aobvious assignment ratio of low color temperature height.
White light LED part in the present invention breaches tradition and at least needs two kinds of color chips to be combined just to be able to achieve color
The fluorescent adhesive layer of the fluorescent adhesive layer of the aobvious assignment ratio of low color temperature height aobvious assignment ratio low with high color temperature is distinguished in the adjustable structure design of temperature
In two bowls, by freely controlling the electric current of two blue LED dies, it is controllable that the aobvious finger of colour temperature can be realized in injecting glue.This hair
Bright white light LED part only need to be can be realized the aobvious regulation referred to of colour temperature, be had by the size of current of two blue LED dies of control
Effect reduces preparation cost, good in economic efficiency.
According to an embodiment of the present invention, white light LED part further includes：
First isolation mount, the first isolation mount are longitudinally disposed between the first bowl and the second bowl, to separate
One blue LED die and the second blue LED die.The first blue LED die of longitudinal isolation and the second blue LED die, make
Can have in main body rack more effectively using space, conducive to the placement of two blue LED dies, and improve white light LEDs device
The uniformity of the reliability of part production technology and out light.
According to an embodiment of the present invention, white light LED part further includes：
To separate the second isolation mount and third isolation mount of white light LED part anode pin and negative pin；
Second isolation mount is horizontally set in the first bowl；
Third isolation mount is horizontally set in the second bowl.
According to an embodiment of the present invention, in white light LED part：
Second isolation mount is equal to itself and white light LED part negative pin at a distance from white light LED part anode pin
Distance；Third isolation mount be equal at a distance from white light LED part anode pin its with white light LED part negative pin away from
From；
Or, the second isolation mount is greater than itself and white light LED part negative pin at a distance from white light LED part anode pin
Distance；Third isolation mount is greater than the negative pin of itself and white light LED part at a distance from the positive pin of white light LED part
Distance.
According to an embodiment of the present invention, in white light LED part：
The fluorescent adhesive layer of the aobvious assignment ratio of low color temperature height includes following components：Rouge and powder, bloom, A glue, B glue and anti-precipitation powder；It is red
Powder, bloom, A glue, B glue and anti-precipitation powder weight ratio be followed successively by (0.005~0.02)：(0.12~0.48)：0.2：0.8：
(0.005~0.02)；
Or, the fluorescent adhesive layer of the aobvious assignment ratio of low color temperature height includes following components：Rouge and powder, yellowish green powder, A glue, B glue and anti-settling
Powder；Rouge and powder, yellowish green powder, A glue, B glue and anti-precipitation powder weight ratio be followed successively by (0.0025~0.01)：(0.15~0.6)：0.2：
0.8：(0.005~0.02).
According to an embodiment of the present invention, in white light LED part：
The fluorescent adhesive layer of the low aobvious assignment ratio of high color temperature includes following components：Bloom, A glue, B glue and anti-precipitation powder, bloom, A
The weight ratio of glue, B glue and anti-precipitation powder is followed successively by：(0.08~0.32)：0.2：0.8：(0.005~0.02).
The second aspect of the present invention discloses a kind of aobvious preparation method for referring to adjustable white light LED part of colour temperature comprising
Following steps：
Die sinking：The first bowl and the second bowl are formed on main body rack；
Die bond：First blue LED die is fixed in the first bowl, the second blue LED die is fixed on the second bowl
It is interior；
Bonding wire：The positive and negative anodes of the first blue LED die and the second blue LED die are respectively welded；
Sealing：By the first fluorescent adhesive layer injecting glue in the first bowl, the first blue LED die is sealed；By the second fluorescent glue
Layer injecting glue seals the second blue LED die in the second bowl；
Wherein, the first fluorescent adhesive layer is the fluorescent adhesive layer of the aobvious assignment ratio of low color temperature height, and the second fluorescent adhesive layer is that high color temperature is low
The fluorescent adhesive layer of aobvious assignment ratio；Or, the first fluorescent adhesive layer is the fluorescent adhesive layer of the low aobvious assignment ratio of high color temperature, the second fluorescent adhesive layer is
The fluorescent adhesive layer of the aobvious assignment ratio of low color temperature height.
According to an embodiment of the present invention, in die sinking step therein：
Main body rack is also formed with the first isolation mount：
First isolation mount is formed in a longitudinal between the first bowl and the second bowl, to separate the first blue LED die
And second blue LED die.
According to an embodiment of the present invention, in die sinking step therein：
Main body rack be also formed with the second isolation mount to separate white light LED part anode pin and negative pin and
Third isolation mount；
Second isolation mount is formed laterally in the first bowl；
Third isolation mount is formed laterally in the second bowl.
The third aspect of the present invention discloses a kind of aobvious finger regulation method of white light LED part colour temperature comprising following step
Suddenly：
Current regulation：The electric current of the first bowl is adjusted, the power of the first bowl becomes from the first power initial percentage
One power regulation percentage P1；The electric current of the second bowl is adjusted, the power of the second bowl is become from the second power initial percentage
Second power regulation percentage P2；
Brightness control：The brightness of white light LED part is become from original intensity：
P1Maximum brightness+the P of × the first bowl2The maximum brightness of × the second bowl；
Colour temperature regulation：The colour temperature of white light LED part is become from initial colour temperature：
It is aobvious to refer to regulation：The aobvious finger of white light LED part is become from initially showing finger：
Wherein, in current regulation step, the current regulation sequence of the current regulation of the first bowl and the second bowl is regardless of elder generation
Afterwards；After carrying out current regulation, brightness, colour temperature and aobvious refer to of white light LED part change simultaneously with current regulation.
Detailed description of the invention
Fig. 1 is the front view of white light LED part when using positive cartridge chip in the embodiment of the present invention one；
Fig. 2 is the front view of white light LED part when using flip-chip in the embodiment of the present invention one；
Fig. 3 is the bottom view of white light LED part in the embodiment of the present invention one；
Fig. 4 is the side view of white light LED part in the embodiment of the present invention one.
Description of symbols：10, main body rack；101, the first bowl；102, the second bowl；201, the first blue led core
Piece, the 202, second blue LED die；301, the first fluorescent adhesive layer；302, the second fluorescent adhesive layer；401, the first isolation mount；
402, the second isolation mount；403, third isolation mount；404, the first positive pin；405, the first negative pin；406, second
Positive pin；407, the second negative pin；408, the first gold thread；409, the second gold thread；410, third gold thread；411, the 4th gold medal
Line；412, first is heat sink；413, second is heat sink；414, the first anti-overflow plastic structure；415, the second anti-overflow plastic structure.
Specific embodiment
Multiple embodiments of the invention will be disclosed with schema below, as clearly stated, the details in many practices
It will be explained in the following description.It should be appreciated, however, that the details in these practices is not applied to limit the present invention.Also
It is to say, in some embodiments of the invention, the details in these practices is non-essential.In addition, for the sake of simplifying schema,
Some known usual structures and component will be painted it in the drawings in simply illustrative mode.
About its " first " used herein, " second " etc., the meaning of order or cis-position is not especially censured, also non-use
The component described with limiting the present invention just for the sake of difference with same technique term or operation.
The present invention is the system about a kind of aobvious design for referring to adjustable white light LED part of colour temperature and white light LED part
On the one hand Preparation Method and the aobvious finger regulation method of white light LED part colour temperature, white light LED part of the present invention can carry out aobvious refer to of colour temperature and adjust
On the other hand control also has simple structure design not available for the prior art, to reduce device preparation cost.Hereinafter,
Divide three embodiments that the aobvious structure design for referring to adjustable white light LED part of neutral color temperature of the present invention, preparation side are discussed in detail respectively
Method and regulation method.
Embodiment one
Fig. 1-4 is please referred to, the present embodiment provides a kind of aobvious adjustable white light LED part of finger of colour temperature, white light LED part packets
It includes：Main body rack 10, the first bowl 101, the second bowl 102, chip circuit and adhesive body.
As shown in Fig. 1 and 2, along the longitudinal direction of main body rack 10, from 10 top surface of main body rack to main body rack 10
Inner recess forms the first bowl 101 and the second bowl 102.First bowl 101 and 102 shape of the second bowl and size are identical.
On main body rack 10, two groups of conductive pins are additionally provided with, two groups of conductive pins and main body rack 10 are integrally formed；Main body rack 10
On two groups of conductive pins be used as the conductive pin of white light LED part simultaneously, connect with external power supply or external circuit.Two groups are led
Electric pin is respectively first group of conductive pin and second group of conductive pin；First group of conductive pin includes the first positive pin 404
And first negative pin 405；Second group of conductive pin includes the second positive pin 406 and the second negative pin 407, such as Fig. 1 and
2, the first positive pin 404 is set to the left side of the first bowl 101, and the first negative pin 405 is set to the right side of the first bowl 101；
Second positive pin 406 is set to the left side of the second bowl 102, and the second negative pin 407 is set to the right side of the second bowl 102.
Chip circuit includes the first chip circuit and the second chip circuit.First chip circuit includes the first of electrical connection
Current control circuit and the first blue LED die 201, the first current control circuit is to control the first blue LED die 201
Electric current, the first blue LED die 201 are fixed in the first bowl 101；Second chip circuit includes the second electric current control of electrical connection
Circuit processed and the second blue LED die 202, electric current of second current control circuit to control the second blue LED die 202,
Second blue LED die 202 is fixed in the second bowl 102.Preferably, the first blue LED die 201 and the second blue
Packed LED chip or flip LED chips, the first blue LED die 201 and the second blue can be respectively adopted in LED chip 202
The dominant wavelength of LED chip 202 is 440nm-480nm, and the wave band of 440nm-480nm includes all wave bands of blue light, according to wave
The difference of section, the different fluorescent powder that can arrange in pairs or groups reach better light distribution effect.
First current control circuit can use the circuit design of the prior art, and the first blue LED die 201 uses formal dress
Chip or flip-chip.Such as Fig. 1, when the first blue LED die 201 is using positive cartridge chip, the first blue LED die 201 makes
It with white glue die bond, is fixed in the first bowl 101, is preferably fixed to 101 bottom surface middle position of the first bowl, the first blue
Its positive and negative anodes is respectively welded using the first gold thread 408 and the second gold thread 409 in LED chip 201, with real with the first current control circuit
It is now electrically connected, the first current control circuit is then separately connected the first positive pin 404 and the first negative pin 405.When the first indigo plant
When color LED chip 201 is using flip-chip, such as Fig. 2, the first blue LED die 201 is welded using tin cream or eutectic, is fixed on
It in first bowl 101, and can be directly electrically connected with the realization of the first current control circuit, the first current control circuit is then separately connected
First positive pin 404 and the first negative pin 405.
Second current control circuit can use the circuit design of the prior art, can also be with the electricity of the first current control circuit
Road design is identical.Second blue LED die 202 uses positive cartridge chip or flip-chip.Such as Fig. 1, when the second blue LED die
When the 202 positive cartridge chip of use, the second blue LED die 202 uses white glue die bond, is fixed in the second bowl 102, preferably fixed
In 102 bottom surface middle position of the second bowl, the second blue LED die 202 is divided using third gold thread 410 and the 4th gold thread 411
Its positive and negative anodes is not welded, and to be electrically connected with the realization of the second current control circuit, the second current control circuit is then separately connected second
Positive pin 406 and the second negative pin 407.When the second blue LED die 202 is using flip-chip, such as Fig. 2, second is blue
Color LED chip 202 is welded using tin cream or eutectic, is fixed in the second bowl 102, and can directly with the second current control circuit
Realize electrical connection, the second current control circuit is then separately connected the second positive pin 406 and the second negative pin 407.
Such as Fig. 4, adhesive body includes the first fluorescent adhesive layer 301 and the second fluorescent adhesive layer 302.First fluorescent adhesive layer 301 to
First blue LED die 201 is sealed in the first bowl 101；Second fluorescent adhesive layer 302 is to by the second blue LED die
202 are sealed in the second bowl 102.Wherein, the first fluorescent adhesive layer 301 is the fluorescent adhesive layer of the aobvious assignment ratio of low color temperature height, second
Fluorescent adhesive layer 302 is the fluorescent adhesive layer of the low aobvious assignment ratio of high color temperature；Or, the first fluorescent adhesive layer 301 is the low aobvious assignment ratio of high color temperature
Fluorescent adhesive layer, the second fluorescent adhesive layer 302 is the fluorescent adhesive layer of the aobvious assignment ratio of low color temperature height.In industry, colour temperature is divided into：Cool white,
Just white, warm white is respectively standard with 6000K, 4500K, 3000K, and in the present invention, high color temperature refers to 6000k, and low color temperature refers to 3000k；
Low aobvious refer to is generally 80 and following aobvious finger, and 90 aobvious fingers or more then belong to high aobvious finger.
First fluorescent adhesive layer 301 and the second fluorescent adhesive layer 302 are configured by fluorescent powder and the external sealant of encapsulation, according to
The wave band that the dominant wavelength that first blue LED die 201 and the second blue LED die 202 are selected is 440nm-480nm, in order to reach
To better light distribution effect, fluorescent powder is arranged in pairs or groups as follows：Fluorescent powder is that bloom is combined with rouge and powder, is perhaps single bloom again or is
The combination of yellowish green powder and rouge and powder.Specifically, when the configuration of the first fluorescent adhesive layer 301 of progress and the second fluorescent adhesive layer 302, low color temperature
The fluorescent adhesive layer of the aobvious assignment ratio of height includes following components：Rouge and powder, bloom, A glue, B glue and anti-precipitation powder, wherein rouge and powder, bloom, A
The weight ratio of glue, B glue and anti-precipitation powder is followed successively by (0.005~0.02)：(0.12~0.48)：0.2：0.8：(0.005~
0.02)；Preferably, the weight ratio of rouge and powder, bloom, A glue, B glue and anti-precipitation powder is followed successively by 0.01：0.24：0.2：0.8:0.01；
Alternatively, the fluorescent adhesive layer of the aobvious assignment ratio of low color temperature height includes following components：Rouge and powder, yellowish green powder, A glue, B glue and anti-precipitation powder,
In, rouge and powder, yellowish green powder, A glue, B glue and anti-precipitation powder weight ratio be followed successively by (0.0025~0.01)：(0.15~0.6)：0.2：
0.8：(0.005~0.02), preferably, rouge and powder, yellowish green powder, A glue, B glue and anti-precipitation powder weight ratio be followed successively by 0.005：
0.3：0.2：0.8：0.01.The fluorescent adhesive layer of the low aobvious assignment ratio of high color temperature includes following components：Bloom, A glue, B glue and anti-settling
Powder, wherein bloom, A glue, B glue and anti-precipitation powder weight ratio be followed successively by：(0.08~0.32)：0.2：0.8：(0.005~
0.02)；Preferably, the weight ratio of bloom, A glue, B glue and anti-precipitation powder is followed successively by 0.16：0.2：0.8:0.01.
White light LED part in the present embodiment, by the fluorescent adhesive layer aobvious assignment low with high color temperature of the aobvious assignment ratio of low color temperature height
The fluorescent adhesive layer difference injecting glue of ratio is in two bowls, by freely controlling the electric current of two blue LED dies, Ji Keshi respectively
Existing colour temperature is aobvious to be referred to controllably, and the preparation cost of white light LED part in the prior art is effectively reduced.In addition, relative to existing skill
The LED component using two kinds of above different-colours of difference is needed in art, the single white light LED part of the present embodiment more saves sky
Between area.
Still further, material selection PPA or the EMC resin material of main body rack 10, in order to make in main body rack 10
Can have more effectively using space, conducive to the placement of two blue LED dies, and improve white light LED part production technology
Reliability, improve white light LED part and go out the uniformity of light, white light LED part further includes the first isolation mount 401, such as Fig. 1 and
2, the first isolation mount 401 is longitudinally disposed between the first bowl 101 and the second bowl 102, to separate the first blue led core
Piece and the second blue LED die, specifically, for separating the first chip circuit and the second chip circuit.First isolation mount
401 material is consistent with the material of main body rack 10, can be with the integrated molding of main body rack 10 or the first isolation mount 401
For a part of main body support frame 10, directly formed in die sinking step.
In another preferred embodiment, white light LED part further includes the second isolation mount 402 and third isolation mount 403.Such as figure
1 and 2, the second isolation mount 402 is horizontally set in the first bowl 101, to separate the positive pin of white light LED part and bear
Pole pin, specifically, the second isolation mount 402 is for separating the first positive pin 404 and the first negative pin 405；Third every
It is horizontally set in the second bowl 102 from bracket 403, to separate the positive pin and negative pin of white light LED part, specifically
, third isolation mount 403 is for separating the second positive pin 406 and the second negative pin 407.Second isolation mount 402 and
The material of third isolation mount 403 is consistent with the material of main body rack 10, can be with the integrated molding of main body rack 10 or second
Isolation mount 402 and third isolation mount 403 are a part of main body rack 10, are directly formed in die sinking step.Specifically
For, the specific setting position of the second isolation mount 402 and third isolation mount 403 includes following two：(1) second isolation branch
Frame 402 is set to 101 middle position of the first bowl, itself and white light LEDs device are equal at a distance from white light LED part anode pin
The distance of part negative pin；Third isolation mount 403 is set to 102 middle position of the second bowl, with white light LED part anode
The distance of pin is equal to it at a distance from white light LED part negative pin.Such as Fig. 2, second the 402 to the first anode of isolation mount draws
The distance of foot 404 and its being equidistant to the first negative pin 405；The positive pin 406 of third isolation mount 403 to the second
Distance and its being equidistant to the second negative pin 407.(2) second isolation mounts 402 and white light LED part anode pin
Distance is greater than it at a distance from white light LED part negative pin；The positive pin of third isolation mount 403 and white light LED part
Distance be greater than its negative pin with white light LED part at a distance from.Such as Fig. 1, second the 402 to the first positive pin of isolation mount
404 distance is greater than it to the distance of the first negative pin 405；The distance of the positive pin 406 of third isolation mount 403 to the second
Greater than it to the distance of the second negative pin 407.White light is separated using the second isolation mount 402 and third isolation mount 403
The positive and negative anodes pin of LED component effectively prevent the positive and negative anodes pin of white light LED part conductive, and the chip placement that can make rational planning for
Position and space.In addition, it is necessary to illustrate, described longitudinal and transverse direction, is explained according to engineering science, such as Fig. 1 and 2 in the present invention
In front view, the direction where parallel longer sides is known as longitudinal direction, and the direction where parallel shorter edge is known as laterally.
In addition, there are 102 two bowls of the first bowl 101 and the second bowl by white light LED part in this present embodiment,
The circumstances that excessive glue interacts occurs for two bowls in order to prevent, and the first anti-overflow plastic structure 414 and the are arranged in white light LED part
Two anti-overflow plastic structures 415, as shown in Figure 4.In the bottom of the first bowl 101 and the second bowl 102, it is also respectively provided with the first heat
Heavy 412 and second heat sink 413, as shown in figure 3, first heat sink 412 and second heat sink 413 to improve dissipating for white light LED part
Heat function.First heat sink 412 and second heat sink 413 specifically used copper is silver-plated, is more advantageous to the biography of heat in white light LED part
It leads, improves the service life of the first blue LED die 201 and the second blue LED die 202.
It should be noted that same principle carries out technology extension according to the present invention, white light LED part of the present invention can also be wrapped
Include third bowl and third blue LED die, or more bowls and blue LED die identical with bowl number.It is being greater than
In two bowls and the white light LED part structure of two blue LED dies, between each blue LED die and each bowl it
Between it is respectively independent, with a fluorescent adhesive layer one blue LED die of sealing inside each bowl.If bowl number and blue led core
Piece number is even number, fluorescent adhesive layer then according to the low aobvious assignment of a high color temperature than the high aobvious finger of one low color temperature of collocation proportion successively into
Row configuration；If bowl number and blue LED die are odd number, fluorescent adhesive layer is first according to the low aobvious assignment of a high color temperature than collocation one
The aobvious proportion referred to of low color temperature height is successively configured, and the fluorescent adhesive layer used in a remaining bowl can be the low aobvious finger of high color temperature
The fluorescent adhesive layer of proportion or the aobvious assignment ratio of low color temperature height, specifically with no restrictions, white light LED part realizes color according to above-mentioned same principle
Temperature and aobvious finger are adjustable.
Embodiment two
The present embodiment provides a kind of aobvious preparation methods for referring to adjustable white light LED part of colour temperature comprising following steps：
Die sinking：The first bowl 101 and the second bowl 102 are formed in 10 top surface of main body rack.Such as Fig. 1 and 2, CAD design is used
The model of SMD white light LED part carries out injection molding die sinking.White light LED part size can be 5730, can also for 2835 or other.
Main body rack 10 is that PPA can also be EMC resin material.It in preferred embodiment, is opened in step, the is also formed on main body rack 10
One isolation mount 401；First isolation mount 401 is formed in a longitudinal between the first bowl 101 and the second bowl 102, to separate
First blue LED die and the second blue LED die.The material of first isolation mount 401 and the material one of main body rack 10
It causes, can be integrally formed with main body rack 10.In another preferred embodiment, it is opened in step：Is also formed on main body rack 10
Two isolation mounts 402 and third isolation mount 403；Second isolation mount 402 is formed laterally in the first bowl 101, to every
Open the positive pin and negative pin of white light LED part；Third isolation mount 403 is formed laterally in the second bowl 102, to
Separate the positive pin and negative pin of white light LED part.The material of second isolation mount 402 and third isolation mount 403 with
The material of main body rack 10 is consistent, can be integrally formed with main body rack 10.Specifically, the second isolation mount 402 and third
The specific setting position of isolation mount 403 is the same as example 1, and which is not described herein again.
Die bond：First blue LED die 201 is fixed in the first bowl 101, the second blue LED die 202 is fixed on
In second bowl 102.First blue LED die 201 and the second blue LED die 202 can use positive cartridge chip respectively or fall
Cartridge chip.When the first blue LED die 201 and the second blue LED die 202 are using positive cartridge chip, the first blue LED die
201 and second blue LED die 202 all use white glue die bond, both make to be individually fixed in the first bowl 101 and the second bowl
In 102；When the first blue LED die 201 and the second blue LED die 202 are using flip-chip, the two all use tin cream or
Eutectic welding, makes the first blue LED die 201 and the second blue LED die 202 be individually fixed in the first bowl 101 and second
In bowl 102.
Bonding wire：The positive and negative anodes of the first blue LED die 201 and the second blue LED die 202 are respectively welded；When the first indigo plant
When color LED chip 201 and the second blue LED die 202 are using positive cartridge chip, the first blue LED die 201 is respectively adopted first
Gold thread 408 and the second gold thread 409 are respectively welded its positive and negative anodes, the second blue LED die 202 be respectively adopted third gold thread 410 and
Its positive and negative anodes is respectively welded in 4th gold thread 411；The two is connected in the first chip circuit and the second chip circuit.When first
When positive using the upside-down mounting cartridge chip of blue LED die 201 and the second blue LED die 202, the two is welded using tin cream or eutectic
When, it does not need using gold thread, the two is just directly connected in the first chip circuit and the second chip circuit.
Sealing：By 301 injecting glue of the first fluorescent adhesive layer in the first bowl 101, the first blue LED die 201 is sealed；By
Two fluorescent adhesive layers, 302 injecting glue seals the second blue LED die 202 in the second bowl 102.In the present embodiment, the first fluorescent glue
Layer 301 and the second fluorescent adhesive layer 302 have the parameter characteristic being the same as example 1：First fluorescent adhesive layer 301 is that low color temperature is high
The fluorescent adhesive layer of aobvious assignment ratio, the second fluorescent adhesive layer 302 are the fluorescent adhesive layer of the low aobvious assignment ratio of high color temperature；Or, the first fluorescent glue
Layer 301 is the fluorescent adhesive layer of the low aobvious assignment ratio of high color temperature, and the second fluorescent adhesive layer 302 is the fluorescent glue of the aobvious assignment ratio of low color temperature height
Layer.First fluorescent adhesive layer 301 and the second fluorescent adhesive layer 302 are configured by fluorescent powder and the external sealant of encapsulation, and fluorescent powder is
Bloom is combined with rouge and powder, be perhaps single bloom again or for yellowish green powder and rouge and powder combination.Carry out the first fluorescent adhesive layer 301 and
When the configuration of the second fluorescent adhesive layer 302, the aobvious proportion with the when low aobvious finger of high color temperature referred to of low color temperature height is the same as example 1,
Which is not described herein again.
Since present embodiment is only with blue LED die, on the one hand, corresponding list LED device power consumption is small, cost phase
It is lower to traditional technology.The base plate line used is also much relatively easy；On the other hand, the primer phase used in die bond step
Together；In bonding wire step, using packed LED chip, bonding wire negligible amounts, when using flip LED chips, there are no need bonding wire, process
Simply, production efficiency is improved；Furthermore it even if wherein the light that goes out of a blue LED die goes wrong, will not cause entire white
The waste of light LED component, another blue LED die still are able to normally go out light.
Embodiment three
The present embodiment provides a kind of aobvious finger regulation methods of white light LED part colour temperature comprising following steps：
Current regulation：The electric current of the first bowl 101 is adjusted, the power of the first bowl 101 is by the first power initial percentage
Become the first power regulation percentage P1；The electric current of the second bowl 102 is adjusted, the power of the second bowl 102 is as at the beginning of the second power
Beginning percentage becomes the second power regulation percentage P2；Wherein, in each bowl the adjustable range of size of current according in bowl
Fixed blue LED die and change, can be 0-700mA.The variation correspondence of power can be 0-100% in each bowl.
Brightness control：The brightness of white light LED part is become from original intensity：
P1Maximum brightness+the P of × the first bowl2The maximum brightness of × the second bowl.
Colour temperature regulation：The colour temperature of white light LED part is become from initial colour temperature：
It is aobvious to refer to regulation：The aobvious finger of white light LED part is become from initially showing finger：
Wherein, in current regulation step, the current regulation sequence of the current regulation of the first bowl 101 and the second bowl 102
In no particular order；After carrying out current regulation, brightness, colour temperature and aobvious refer to of white light LED part change simultaneously with current regulation.
In the present embodiment, aobvious the first fluorescent adhesive layer 301 referred to by being filled in the first bowl 101 of the colour temperature of the first bowl 101
It determines, the aobvious finger of the colour temperature of the first bowl 101 is identical as the aobvious finger of the colour temperature of the first fluorescent adhesive layer 301；The colour temperature of second bowl 102 is aobvious
Finger is determined that the colour temperature of the second bowl 102 is aobvious to be referred to and the second fluorescent glue by the second fluorescent adhesive layer 302 filled in the second bowl 102
The aobvious finger of the colour temperature of layer 302 is identical；First fluorescent adhesive layer 301 matches the when proportion of the second fluorescent adhesive layer 302 and one phase of embodiment
Together, which is not described herein again.The original intensity of white light LED part, initial colour temperature and initial aobvious refer to respectively refer to：First bowl 101
And second bowl 102 respectively in the case where the first power initial percentage and the second power initial percentage, white light LEDs device
Brightness, colour temperature and the aobvious finger of part.
It is the fluorescent glue of the low aobvious finger of high color temperature with the first fluorescent adhesive layer 301 for being injected in the first bowl 101 in the embodiment
Layer, the second fluorescent adhesive layer 302 injected in the second bowl 102 is to be illustrated for low color temperature height shows the fluorescent adhesive layer referred to, the
The colour temperature of the first fluorescent adhesive layer 301 injected in one bowl 101 is 6000K, the second fluorescent adhesive layer injected in the second bowl 102
302 colour temperature is 3000K, it will be appreciated by persons skilled in the art that the example is only to keep those skilled in the art more clear
The colour temperature for understanding white light LED part of Chu is aobvious to refer to regulation method, not to limit the present invention.
Brightness control：White light LED part brightness range can be 0-280lm, maximum brightness 280lm, corresponding, first bowl
The maximum brightness of cup 101 and the second bowl 102 is 140lm, adjusts the electric current difference of the first bowl 101 and the second bowl 102
An electric current between 60-350mA, makes the power of the first bowl 101 become the first power from the first power initial percentage
Adjust percentage P1, P1It is 50%, the power of the second bowl 102 becomes the second power regulation hundred from the second power initial percentage
Divide and compares P2, P2It is 50%, at this point, the brightness of white light LED part becomes 0.5*140+0.5*140=140lm.
Colour temperature regulation：The colour temperature of first bowl 101 is 6000k, and the colour temperature of the second bowl 102 is 3000k, adjusts first bowl
The electric current of cup 301 and the second bowl 302, the power of the first bowl 101 become the first power tune from the first power initial percentage
Save percentage P1, P1It is 50%, the power of the second bowl 102 becomes the second power regulation percentage from the second power initial percentage
Compare P2, P2It is 50%, the colour temperature of white light LED part then becomes [0.5/ (0.5+0.5)] * 6000+ [0.5/ (0.5+0.5)] * 3000
=4500K.Aobvious to refer to that principle of adjustment and control is identical as colour temperature regulation, I will not elaborate.
Therefore, regulate and control the electric current of the first bowl 301 and the second bowl 302, the as power percentage of both control, in this way
By controlling electric current, so that it may realize colour temperature and the aobvious regulation referred to there are also brightness.
The upper only embodiments of the present invention, are not intended to restrict the invention.For those skilled in the art
For, the invention may be variously modified and varied.All any modifications made in spirit and principles of the present invention are equal
Replacement, improvement etc., should all be included within scope of the presently claimed invention.
Claims (17)
1. a kind of colour temperature is aobvious to refer to adjustable white light LED part, which is characterized in that including：
Main body rack (10)；
The first bowl (101) and the second bowl (102) being formed on main body rack (10)；
The first blue LED die (201) being fixed in the first bowl (101)；
The second blue LED die (202) being fixed in the second bowl (102)；
First fluorescent adhesive layer (301), the first blue LED die (201) to be sealed in the first bowl (101)；And
Second fluorescent adhesive layer (302), the second blue LED die (202) to be sealed in the second bowl (102)；
Wherein, the first fluorescent adhesive layer (301) is the fluorescent adhesive layer of the aobvious assignment ratio of low color temperature height, and the second fluorescent adhesive layer (302) is height
The fluorescent adhesive layer of the low aobvious assignment ratio of colour temperature；Or, the first fluorescent adhesive layer (301) is the fluorescent adhesive layer of the low aobvious assignment ratio of high color temperature, the
Two fluorescent adhesive layers (302) are the fluorescent adhesive layer of the aobvious assignment ratio of low color temperature height；
The fluorescent adhesive layer of the aobvious assignment ratio of the low color temperature height includes following components：Rouge and powder, bloom, A glue, B glue and anti-precipitation powder；Institute
The weight ratio for stating rouge and powder, bloom, A glue, B glue and anti-precipitation powder is followed successively by (0.005~0.02)：(0.12~0.48)：0.2：
0.8：(0.005~0.02)；
Or, the fluorescent adhesive layer of the aobvious assignment ratio of the low color temperature height includes following components：Rouge and powder, yellowish green powder, A glue, B glue and anti-settling
Powder；The rouge and powder, yellowish green powder, A glue, B glue and anti-precipitation powder weight ratio be followed successively by (0.0025~0.01)：(0.15~0.6)：
0.2：0.8：(0.005~0.02).
2. white light LED part according to claim 1, which is characterized in that further include：
First isolation mount (401), first isolation mount (401) are longitudinally disposed at first bowl (101) and second
Between bowl (102), to separate the first blue LED die and the second blue LED die.
3. white light LED part according to claim 1, which is characterized in that further include：
To separate the second isolation mount (402) and third isolation mount of white light LED part anode pin and negative pin
(403)；
Second isolation mount (402) is horizontally set in first bowl (101)；
The third isolation mount (403) is horizontally set in second bowl (102).
4. white light LED part according to claim 3, it is characterised in that：
Second isolation mount (402) is equal to itself and white light LED part negative pin at a distance from white light LED part anode pin
Distance；Third isolation mount (403) is equal to itself and white light LED part negative pin at a distance from white light LED part anode pin
Distance；
Draw or, the second isolation mount (402) is greater than it at a distance from white light LED part anode pin with white light LED part cathode
The distance of foot；Third isolation mount (403) is greater than itself and white light LED part at a distance from the positive pin of white light LED part
The distance of negative pin.
5. white light LED part according to claim 1 to 4, it is characterised in that：
The fluorescent adhesive layer of the low aobvious assignment ratio of the high color temperature includes following components：Bloom, A glue, B glue and anti-precipitation powder, the Huang
Powder, A glue, B glue and anti-precipitation powder weight ratio be followed successively by：(0.08~0.32)：0.2：0.8：(0.005~0.02).
6. a kind of colour temperature is aobvious to refer to adjustable white light LED part, which is characterized in that including：
Main body rack (10)；
The first bowl (101) and the second bowl (102) being formed on main body rack (10)；
The first blue LED die (201) being fixed in the first bowl (101)；
The second blue LED die (202) being fixed in the second bowl (102)；
First fluorescent adhesive layer (301), the first blue LED die (201) to be sealed in the first bowl (101)；And
Second fluorescent adhesive layer (302), the second blue LED die (202) to be sealed in the second bowl (102)；
Wherein, the first fluorescent adhesive layer (301) is the fluorescent adhesive layer of the aobvious assignment ratio of low color temperature height, and the second fluorescent adhesive layer (302) is height
The fluorescent adhesive layer of the low aobvious assignment ratio of colour temperature；Or, the first fluorescent adhesive layer (301) is the fluorescent adhesive layer of the low aobvious assignment ratio of high color temperature, the
Two fluorescent adhesive layers (302) are the fluorescent adhesive layer of the aobvious assignment ratio of low color temperature height；
The fluorescent adhesive layer of the low aobvious assignment ratio of the high color temperature includes following components：Bloom, A glue, B glue and anti-precipitation powder, the Huang
Powder, A glue, B glue and anti-precipitation powder weight ratio be followed successively by：(0.08~0.32)：0.2：0.8：(0.005~0.02).
7. white light LED part according to claim 6, which is characterized in that further include：
First isolation mount (401), first isolation mount (401) are longitudinally disposed at first bowl (101) and second
Between bowl (102), to separate the first blue LED die and the second blue LED die.
8. white light LED part according to claim 6, which is characterized in that further include：
To separate the second isolation mount (402) and third isolation mount of white light LED part anode pin and negative pin
(403)；
Second isolation mount (402) is horizontally set in first bowl (101)；
The third isolation mount (403) is horizontally set in second bowl (102).
9. white light LED part according to claim 8, it is characterised in that：
Second isolation mount (402) is equal to itself and white light LED part negative pin at a distance from white light LED part anode pin
Distance；Third isolation mount (403) is equal to itself and white light LED part negative pin at a distance from white light LED part anode pin
Distance；
Draw or, the second isolation mount (402) is greater than it at a distance from white light LED part anode pin with white light LED part cathode
The distance of foot；Third isolation mount (403) is greater than itself and white light LED part at a distance from the positive pin of white light LED part
The distance of negative pin.
10. a kind of aobvious preparation method for referring to adjustable white light LED part of colour temperature, which is characterized in that include the following steps：
Die sinking：The first bowl (101) and the second bowl (102) are formed on main body rack (10)；
Die bond：First blue LED die (201) is fixed in the first bowl (101), the second blue LED die (202) is fixed
In the second bowl (102)；
Bonding wire：The positive and negative anodes of the first blue LED die (201) and the second blue LED die (202) are respectively welded；
Sealing：By the first fluorescent adhesive layer (301) injecting glue in the first bowl (101), seal the first blue LED die (201)；It will
Second fluorescent adhesive layer (302) injecting glue seals the second blue LED die (202) in the second bowl (102)；
Wherein, the first fluorescent adhesive layer (301) is the fluorescent adhesive layer of the aobvious assignment ratio of low color temperature height, and the second fluorescent adhesive layer (302) is height
The fluorescent adhesive layer of the low aobvious assignment ratio of colour temperature；Or, the first fluorescent adhesive layer (301) is the fluorescent adhesive layer of the low aobvious assignment ratio of high color temperature, the
Two fluorescent adhesive layers (302) are the fluorescent adhesive layer of the aobvious assignment ratio of low color temperature height；
The fluorescent adhesive layer of the aobvious assignment ratio of the low color temperature height includes following components：Rouge and powder, bloom, A glue, B glue and anti-precipitation powder；Institute
The weight ratio for stating rouge and powder, bloom, A glue, B glue and anti-precipitation powder is followed successively by (0.005~0.02)：(0.12~0.48)：0.2：
0.8：(0.005~0.02)；
Or, the fluorescent adhesive layer of the aobvious assignment ratio of the low color temperature height includes following components：Rouge and powder, yellowish green powder, A glue, B glue and anti-settling
Powder；The rouge and powder, yellowish green powder, A glue, B glue and anti-precipitation powder weight ratio be followed successively by (0.0025~0.01)：(0.15~0.6)：
0.2：0.8：(0.005~0.02).
11. preparation method according to claim 10, which is characterized in that wherein in the die sinking step：
Main body rack (10) is also formed with the first isolation mount (401)；
First isolation mount (401) is formed in a longitudinal between first bowl (101) and the second bowl (102), to
Separate the first blue LED die and the second blue LED die.
12. preparation method described in 0 or 11 according to claim 1, which is characterized in that in the die sinking step：
The main body rack (10) is also formed with the second isolation branch to separate white light LED part anode pin and negative pin
Frame (402) and third isolation mount (403)；
Second isolation mount (402) is formed laterally in first bowl (101)；
The third isolation mount (403) is formed laterally in second bowl (102).
13. preparation method described in 0 or 11 according to claim 1, it is characterised in that：
The fluorescent adhesive layer of the low aobvious assignment ratio of the high color temperature includes following components：Bloom, A glue, B glue and anti-precipitation powder, the Huang
Powder, A glue, B glue and anti-precipitation powder weight ratio be followed successively by：(0.08~0.32)：0.2：0.8：(0.005~0.02).
14. a kind of aobvious preparation method for referring to adjustable white light LED part of colour temperature, which is characterized in that include the following steps：
Die sinking：The first bowl (101) and the second bowl (102) are formed on main body rack (10)；
Die bond：First blue LED die (201) is fixed in the first bowl (101), the second blue LED die (202) is fixed
In the second bowl (102)；
Bonding wire：The positive and negative anodes of the first blue LED die (201) and the second blue LED die (202) are respectively welded；
Sealing：By the first fluorescent adhesive layer (301) injecting glue in the first bowl (101), seal the first blue LED die (201)；It will
Second fluorescent adhesive layer (302) injecting glue seals the second blue LED die (202) in the second bowl (102)；
Wherein, the first fluorescent adhesive layer (301) is the fluorescent adhesive layer of the aobvious assignment ratio of low color temperature height, and the second fluorescent adhesive layer (302) is height
The fluorescent adhesive layer of the low aobvious assignment ratio of colour temperature；Or, the first fluorescent adhesive layer (301) is the fluorescent adhesive layer of the low aobvious assignment ratio of high color temperature, the
Two fluorescent adhesive layers (302) are the fluorescent adhesive layer of the aobvious assignment ratio of low color temperature height；
The fluorescent adhesive layer of the low aobvious assignment ratio of the high color temperature includes following components：Bloom, A glue, B glue and anti-precipitation powder, the Huang
Powder, A glue, B glue and anti-precipitation powder weight ratio be followed successively by：(0.08~0.32)：0.2：0.8：(0.005~0.02).
15. preparation method according to claim 14, which is characterized in that wherein in the die sinking step：
Main body rack (10) is also formed with the first isolation mount (401)；
First isolation mount (401) is formed in a longitudinal between first bowl (101) and the second bowl (102), to
Separate the first blue LED die and the second blue LED die.
16. preparation method according to claim 14 or 15, which is characterized in that in the die sinking step：
The main body rack (10) is also formed with the second isolation branch to separate white light LED part anode pin and negative pin
Frame (402) and third isolation mount (403)；
Second isolation mount (402) is formed laterally in first bowl (101)；
The third isolation mount (403) is formed laterally in second bowl (102).
17. a kind of white light LED part colour temperature is aobvious to refer to regulation method, which is characterized in that include the following steps：
Current regulation：The electric current of the first bowl (101) is adjusted, the power of the first bowl (101) is by the first power initial percentage
Become the first power regulation percentage P1；The electric current of the second bowl (102) is adjusted, the power of the second bowl (102) is by the second function
Rate initial percentage becomes the second power regulation percentage P2；
Brightness control：The brightness of white light LED part is become from original intensity：
P1Maximum brightness+the P of × the first bowl2The maximum brightness of × the second bowl；
Colour temperature regulation：The colour temperature of white light LED part is become from initial colour temperature：
It is aobvious to refer to regulation：The aobvious finger of white light LED part is become from initially showing finger：
Wherein, in current regulation step, the current regulation of the first bowl (101) and the current regulation sequence of the second bowl (102)
In no particular order；After carrying out current regulation, brightness, colour temperature and aobvious refer to of white light LED part change simultaneously with current regulation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201610087840.5A CN105489738B (en) | 2016-02-16 | 2016-02-16 | Colour temperature is aobvious to refer to adjustable white light LED part, preparation method and regulation method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610087840.5A CN105489738B (en) | 2016-02-16 | 2016-02-16 | Colour temperature is aobvious to refer to adjustable white light LED part, preparation method and regulation method |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106058017A (en) * | 2016-06-30 | 2016-10-26 | 宁波升谱光电股份有限公司 | LED assembly with continuous adjustable color temperature and preparation method thereof |
| CN107068839A (en) * | 2017-02-16 | 2017-08-18 | 安徽芯瑞达科技股份有限公司 | A kind of multicolor luminous CSP chip manufacture methods of microminiaturization |
| CN107482101A (en) * | 2017-09-18 | 2017-12-15 | 广东晶科电子股份有限公司 | A kind of LED packagings with more glasss of supports and preparation method thereof |
| CN109817609A (en) * | 2018-12-06 | 2019-05-28 | 浙江开元机电科技有限公司 | A kind of color temperature-tunable LED tunnel lamp of dual chip |
| CN109888073A (en) * | 2019-01-25 | 2019-06-14 | 浙江英特来光电科技有限公司 | A kind of full-spectrum LED packaging method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2290279A2 (en) * | 2009-08-26 | 2011-03-02 | Paragon Semiconductor Lighting Technology Co., Ltd | Light-mixing LED package structure for increasing color render index and brightness |
| CN202598208U (en) * | 2012-04-24 | 2012-12-12 | 厦门多彩光电子科技有限公司 | White light light-emitting diode (LED) with adjustable color-temperature and color-rendering index |
| CN104157637A (en) * | 2014-08-25 | 2014-11-19 | 北京大学东莞光电研究院 | MCOB LED package structure |
| CN205016555U (en) * | 2015-08-17 | 2016-02-03 | 陕西光电科技有限公司 | Packaging structure of adjustable color temperature's paster LED light source |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102278621A (en) * | 2011-04-22 | 2011-12-14 | 深圳市瑞丰光电子股份有限公司 | White light emitting diode (LED) module with adjustable color temperature, illumination equipment and manufacturing method |
| EP2613354B1 (en) * | 2012-01-03 | 2020-05-06 | Epistar Corporation | Multi-cavaties light emitting device |
| CN202549837U (en) * | 2012-02-09 | 2012-11-21 | 深圳市聚飞光电股份有限公司 | White light LED (Light-Emitting Diode) |
| CN103337495A (en) * | 2013-06-26 | 2013-10-02 | 晋城市环球利特光电技术有限公司 | Color temperature adjustable white-light LED |
| CN104183583B (en) * | 2014-08-14 | 2017-08-11 | 东莞市欧思科光电科技有限公司 | A kind of adjustable color temperature, the aobvious LED referred to |
-
2016
- 2016-02-16 CN CN201610087840.5A patent/CN105489738B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2290279A2 (en) * | 2009-08-26 | 2011-03-02 | Paragon Semiconductor Lighting Technology Co., Ltd | Light-mixing LED package structure for increasing color render index and brightness |
| CN202598208U (en) * | 2012-04-24 | 2012-12-12 | 厦门多彩光电子科技有限公司 | White light light-emitting diode (LED) with adjustable color-temperature and color-rendering index |
| CN104157637A (en) * | 2014-08-25 | 2014-11-19 | 北京大学东莞光电研究院 | MCOB LED package structure |
| CN205016555U (en) * | 2015-08-17 | 2016-02-03 | 陕西光电科技有限公司 | Packaging structure of adjustable color temperature's paster LED light source |
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