CN105489738B - Color temperature refers white led tunable device, method for their preparation and regulation - Google Patents

Color temperature refers white led tunable device, method for their preparation and regulation Download PDF

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Publication number
CN105489738B
CN105489738B CN201610087840.5A CN201610087840A CN105489738B CN 105489738 B CN105489738 B CN 105489738B CN 201610087840 A CN201610087840 A CN 201610087840A CN 105489738 B CN105489738 B CN 105489738B
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color temperature
fluorescent
cups
white led
led chip
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CN201610087840.5A
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CN105489738A (en
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李漫铁
屠孟龙
余应森
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惠州雷曼光电科技有限公司
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item

Abstract

本发明揭示种色温显指可调的白光LED器件、其制备方法及调控方法。 The present invention discloses an adjustable color temperature CRI white LED device, a preparation method and regulation method. 白光LED器件包括:主体支架;形成于主体支架的第碗杯及第二碗杯;固定于第碗杯内的第蓝色LED芯片;以及固定于第二碗杯内的第二蓝色LED芯片;第荧光胶层,将第蓝色LED芯片密封于第碗杯内;以及,第二荧光胶层,将第二蓝色LED芯片密封于第二碗杯内;第荧光胶层具有低色温高显指配比,第二荧光胶层具有高色温低显指配比;或,第荧光胶层具有高色温低显指配比,第二荧光胶层具有低色温高显指配比。 White LED device comprising: a body frame; formed on the first body holder cups and second cups; blue LED chip fixed to the inside of the cups; and a second blue LED chip fixed to the second cups ; second phosphor layer, the first blue LED chip within the first seal cups; and, a second phosphor layer, the second blue LED chip is sealed within the second cups; first phosphor layer has a low color temperature high CRI ratio, a second adhesive layer having a high color temperature fluorescent low CRI ratio; or, first phosphor layer has a low color temperature significantly higher ratio means, a second adhesive layer having a low color temperature fluorescent high CRI ratio. 将两种不同荧光胶层分别注胶于两个碗杯中,分别控制两个芯片的电流,实现色温显指可控,突破传统至少需要两种颜色芯片才能实现色温可调的结构设计。 Each of two different fluorescent glue dispensing cups in two bowls, two chips are current control, controllable means of color temperature, breaking the traditional chip at least two colors to achieve color temperature of adjustable design.

Description

色温显指可调的白光LED器件、其制备方法及调控方法 Color temperature refers tunable white LED devices, methods for their preparation and regulation

技术领域 FIELD

[0001] 本发明涉及LED器件领域,尤其涉及一种色温显指可调的白光LED器件、其制备方法及调控方法。 [0001] The present invention relates to an LED device, and more particularly, to a tunable color temperature CRI white LED devices, preparation method and regulation method.

背景技术 Background technique

[0002] 现有技术中,实现色温可控的单颗LED器件,主要有以下结构: [0002] In the prior art, to achieve a color temperature controllable single LED devices, mainly in the following structure:

[0003] 1.单颗LED器件负载红、绿及蓝三种颜色的芯片,通过控制电流达到色温可控;2. 单颗LED器件负载红及蓝两种颜色的芯片,并使用黄色荧光粉封胶,通过控制红色芯片的电流达到色温可控;3.单颗LED器件负载白及红两种颜色芯片,通过控制红色芯片电流达到色温可控。 [0003] 1. Single LED load devices of red, green and blue color chips, color temperature controllable by controlling the current reached;. 2 and single red LED loads two colors blue chip devices, and using a yellow phosphor sealant, color temperature controllable by controlling the current to reach the red chip; 3. load single white LED device chips and two colors of red, the red color temperature controllable by controlling the current to reach the chip.

[0004] 上述三种结构的单颗LED器件虽然可以实现色温可控的目的,但需要至少两种不同颜色的LED芯片,并且还分别具有下述缺陷: [0004] The configuration of the three single LED device while the color temperature of controllable object can be achieved, but at least two different colors of LED chips, respectively, and further has the following drawbacks:

[0005] 1.传统红、绿及蓝三种颜色芯片相互搭配的结构,对应的单颗LED器件能耗大,造价昂贵,经济效益差。 [0005] 1. The traditional red, green and blue colors with each other in the chip structure, a single LED device corresponding energy consumption, expensive, and poor economic efficiency. 2.传统红、蓝及黄三种颜色芯片相互搭配的结构,则具有如下缺点:首先,对应的单颗LED器件生产工序相对繁琐,主要体现在红色芯片与蓝色芯片、黄色芯片分别需要使用不同的底胶进行固晶,较多的焊线会降低生产的速度;其次,对应的单颗LED器件中,一旦三种颜色芯片中的其中任意一种颜色芯片的出光出现问题,整个单颗LED器件都会失效,造成其他颜色芯片的浪费;再次,传统红、蓝及黄三种芯片相互搭配的结构中,生产单颗LED器件需要使用的基板线路更为复杂,并且需要搭配相对复杂的控制电源。 2. Traditional red, blue and yellow colors with each other in chip configuration, has drawbacks: first, the corresponding single LED device production process is relatively complicated, mainly in the blue chip and red chips, chips are required yellow different primer for die bonding, wire bonding more slows down production; secondly, the single LED corresponding to the device, once the three colors of chips wherein any color chip light problem, the entire single LED device will fail, resulting in waste of chip other colors; again, the traditional red, blue and yellow three-chip configuration with each other, the production of single LED devices require more complex wiring substrate used, and requires relatively complex control with power supply. 3.传统蓝及红色两种芯片相互搭配的结构,主要是通过封胶工序中所采用的黄色荧光粉控制色温, 这种结构相对红、绿及蓝三种颜色芯片相互搭配以及红、蓝及黄三种颜色芯片相互搭配的结构来说,能耗要低,但众所周知,红色芯片利用率低,经济效益没有得到太大改善,调控的色坐标点跟普朗克曲线无法契合。 3. The traditional red and blue two chips structure with each other, the yellow phosphor is mainly controlled by the sealant employed in the color temperature step, this structure is relatively red, green and blue colors with each chip and red, blue and yellow colors with each other chip structure, the energy consumption is lower, but we all know, the red chip utilization is low, the economic benefits have not been improved much, with color coordinates of the point regulation Planck curve can not fit. 4.传统白及红色两种芯片相互搭配的结构,由于白色芯片不成熟,经济效益也较差,光效低且显指不可控。 4. Traditional red and white with each other two chips structure, since the chip immature white, economic efficiency is poor, and the luminous efficiency is low CRI uncontrollable.

发明内容 SUMMARY

[0006] 针对现有技术中单颗LED器件需要至少两种不同颜色的LED芯片才能实现色温调控的问题,本发明提供一种色温显指可调的白光LED器件、其制备方法及调节方法,本发明中白光LED器件只需要一种颜色的LED芯片即能实现色温及显指的调控。 [0006] The preparation method and adjustment method for the prior art single LED devices require at least two different colors of LED chip to achieve color temperature regulation problem, the present invention provides an adjustable color temperature CRI white LED device, the white LED devices of the present invention requires only one color LED chips that can achieve regulation of color temperature and CRI.

[0007] 为了解决上述技术问题,本发明的第一方面,揭示了一种色温显指可调的白光LED 器件,其包括: [0007] To solve the above problems, a first aspect of the present invention, discloses a tunable color temperature CRI white LED device, comprising:

[0008] 主体支架; [0008] The main body bracket;

[0009] 形成于主体支架上的第一碗杯及第二碗杯; [0009] The bowl is formed on the first bracket and a second glass bowl body;

[0010] 固定于第一碗杯内的第一蓝色LED芯片; [0010] The first bowl is fixed to a first blue LED chip in the cup;

[0011] 固定于第二碗杯内的第二蓝色LED芯片; [0011] fixed to the second bowl of the second blue LED chip in the cup;

[0012] 第一荧光胶层,用以将第一蓝色LED芯片密封于第一碗杯内;以及, [0012] First phosphor layer, for the first blue LED chip within the first seal cups; and,

[0013] 第二荧光胶层,用以将第二蓝色LED芯片密封于第二碗杯内; [0013] The second phosphor layer, the second blue LED chip to be sealed in the second cups;

[0014] 其中,第一荧光胶层为低色温高显指配比的荧光胶层,第二荧光胶层为高色温低显指配比的荧光胶层;或,第一荧光胶层为高色温低显指配比的荧光胶层,第二荧光胶层为低色温高显指配比的荧光胶层。 [0014] wherein the first adhesive layer is a fluorescent low color temperature refers to the ratio of high color fluorescent layer, the second adhesive layer is a fluorescent low-high color temperature fluorescent glue CRI ratio; or fluorescent adhesive layer is a first high CRI low color temperature fluorescent ratio subbing layer, the second adhesive layer is a low color temperature fluorescent high CRI fluorescent matching glue.

[0015] 本发明中的白光LED器件,突破了传统至少需要两种颜色芯片相组合才能实现色温可调的结构设计,将低色温高显指配比的荧光胶层与高色温低显指配比的荧光胶层分别注胶于两个碗杯中,通过自由控制两个蓝色LED芯片的电流,即可实现色温显指可控。 [0015] In the white LED devices of the present invention, breaking the conventional design requires two colors to achieve at least the chip combining variable color temperature, high CRI low color temperature low fluorescence adhesive layer and a high proportion of color temperature assignments respectively, than the fluorescent glue dispensing cups in two bowls, two current through the blue LED chip freely controlled, controllable means of color temperature can be realized. 本发明白光LED器件只需通过控制两个蓝色LED芯片的电流大小,即可实现色温显指的调控,有效的降低了制备成本,经济效益好。 White LED devices of the present invention, simply by controlling the current size of the two blue LED chips, can be realized Color temperature regulation means, effectively reducing the manufacturing cost, good economic.

[0016] 根据本发明的一实施方式,白光LED器件还包括: [0016] According to one embodiment of the present invention, the white LED device further comprises:

[0017] 第一隔离支架,第一隔离支架纵向设置于第一碗杯与第二碗杯之间,用以隔开第一蓝色LED芯片以及第二蓝色LED芯片。 [0017] The first isolation bracket, the first bracket spacer disposed longitudinally between the first and second cups cups for separating the first blue LED chip and a second blue LED chip. 纵向隔离第一蓝色LED芯片及第二蓝色LED芯片,使主体支架中可以有更多有效的利用空间,利于两个蓝色LED芯片的放置,并提高白光LED器件生产工艺的可靠性及出光的均匀性。 A first longitudinal barrier blue LED chip and the second blue LED chip, the body of the stent may be more efficient use of space, which will help to place two blue LED chip, and increase the production process of the white LED device reliability and the uniformity of light.

[0018] 根据本发明的一实施方式,白光LED器件还包括: [0018] According to one embodiment of the present invention, the white LED device further comprises:

[0019] 用以隔开白光LED器件正极引脚及负极引脚的第二隔离支架及第三隔离支架; [0019] The white LED devices used for isolating the positive terminal and the negative terminal of the second separator and the third separator holder bracket;

[0020] 第二隔离支架横向设置于第一碗杯内; [0020] The second spacer disposed within the first stent transversely cups;

[0021] 第三隔离支架横向设置于第二碗杯内。 [0021] The third separator disposed within the second bracket transversely cups.

[0022] 根据本发明的一实施方式,白光LED器件中: [0022] According to one embodiment of the present invention, the white LED device:

[0023] 第二隔离支架与白光LED器件正极引脚的距离等于其与白光LED器件负极引脚的距离;第三隔离支架与白光LED器件正极引脚的距离等于其与白光LED器件负极引脚的距离; [0023] a second separation distance bracket pin and the white LED devices of the positive electrode is equal to its distance from the negative terminal of the white LED devices; LED device from the positive terminal of the third isolation bracket and white is equal to the white LED devices whose negative terminal the distance;

[0024] 或,第二隔离支架与白光LED器件正极引脚的距离大于其与白光LED器件负极引脚的距离;第三隔离支架与白光LED器件的正极引脚的距离大于其与白光LED器件的负极引脚的距离。 [0024] or from the positive terminal of the second LED device isolation bracket and the white light is larger than the distance from the negative terminal of the white LED devices; isolated from the positive terminal of the third holder and the white LED device is larger than the white LED devices the distance from the anode pins.

[0025] 根据本发明的一实施方式,白光LED器件中: [0025] According to one embodiment of the present invention, the white LED device:

[0026] 低色温高显指配比的荧光胶层包括以下组分:红粉、黄粉、A胶、B胶以及防沉粉;红粉、黄粉、A胶、B胶以及防沉粉的重量比依次为(0.005〜0.02) : (0.12〜0.48) :0.2:0.8: (0.005〜0.02); [0026] High CRI low color temperature fluorescent ratio subbing layer comprises the following components: Pink, gluten, A plastic, B gum, and anti-settling powder; Pink, gluten, A plastic, B gum, and the weight ratio of anti-settling sequentially powder It is (0.005~0.02): (0.12~0.48): 0.2: 0.8: (0.005~0.02);

[0027] 或,低色温高显指配比的荧光胶层包括以下组分:红粉、黄绿粉、A胶、B胶以及防沉粉;红粉、黄绿粉、A胶、B胶以及防沉粉的重量比依次为(0.0025〜0.01) : (0.15〜0.6) :0.2: 0.8: (0.005〜0.02) 〇 [0027] or, low color temperature fluorescent high CRI ratio subbing layer comprises the following components: Pink, yellow-green powder, A plastic, B gum, and anti-settling powder; Pink, yellow-green powder, A plastic, B gum, and anti- Shen powder by weight ratio were (0.0025~0.01): (0.15~0.6): 0.2: 0.8: (0.005~0.02) square

[0028] 根据本发明的一实施方式,白光LED器件中: [0028] According to one embodiment of the present invention, the white LED device:

[0029] 高色温低显指配比的荧光胶层包括以下组分:黄粉、A胶、B胶以及防沉粉,黄粉、A 胶、B胶以及防沉粉的重量比依次为:(0.08〜0.32) :0.2:0.8: (0.005〜0.02)。 [0029] The low-high color temperature fluorescent CRI ratio subbing layer comprises the following components: gluten, A plastic, B gum, and anti-settling powder, gluten, A plastic, B gum, and the weight ratio of anti-settling flour were: (0.08 ~0.32): 0.2: 0.8: (0.005~0.02).

[0030] 本发明的第二方面揭示了一种色温显指可调的白光LED器件的制备方法,其包括如下步骤: [0030] A second aspect of the present invention discloses a method for producing a color temperature adjustable CRI white LED device, comprising the steps of:

[0031] 开模:在主体支架上形成第一碗杯及第二碗杯; [0031] The mold: forming a first bowl and a second bowl cup on the cup body frame;

[0032] 固晶:将第一蓝色LED芯片固定于第一碗杯内,第二蓝色LED芯片固定于第二碗杯内; [0032] Solid crystal: a first blue LED chip is fixed in the first cups, a second blue LED chip is fixed to the second cups;

[0033] 焊线:分别焊接第一蓝色LED芯片及第二蓝色LED芯片的正负极; [0033] The bonding wire: positive and negative electrodes are welded to a first blue LED chip and the second blue LED chip;

[0034] 封胶:将第一荧光胶层注胶于第一碗杯内,密封第一蓝色LED芯片;将第二荧光胶层注胶于第二碗杯内,密封第二蓝色LED芯片; [0034] The sealant: a first phosphor in the first adhesive layer dispensing cups, seals the first blue LED chip; second phosphor in the second glue dispensing cups, sealed second blue LED chip;

[0035] 其中,第一荧光胶层为低色温高显指配比的荧光胶层,第二荧光胶层为高色温低显指配比的荧光胶层;或,第一荧光胶层为高色温低显指配比的荧光胶层,第二荧光胶层为低色温高显指配比的荧光胶层。 [0035] wherein the first adhesive layer is a fluorescent low color temperature refers to the ratio of high color fluorescent layer, the second adhesive layer is a fluorescent low-high color temperature fluorescent glue CRI ratio; or fluorescent adhesive layer is a first high CRI low color temperature fluorescent ratio subbing layer, the second adhesive layer is a low color temperature fluorescent high CRI fluorescent matching glue.

[0036] 根据本发明的一实施方式,其中的开模步骤中: [0036] According to one embodiment of the present invention, wherein the step of opening the mold:

[0037] 主体支架还形成有第一隔离支架: [0037] The stent body is also formed with a first spacer brackets:

[0038] 第一隔离支架纵向形成于第一碗杯与第二碗杯之间,用以隔开第一蓝色LED芯片以及第二蓝色LED芯片。 [0038] a first spacer formed between the first longitudinal bracket cups and a second cups for separating the first blue LED chip and a second blue LED chip.

[0039] 根据本发明的一实施方式,其中的开模步骤中: [0039] According to one embodiment of the present invention, wherein the step of opening the mold:

[0040] 主体支架还形成有用以隔开白光LED器件正极引脚及负极引脚的第二隔离支架及第三隔离支架; [0040] The bracket body further spaced apart to form useful to the white LED device pins positive electrode and the negative electrode lead and the second isolation third isolation bracket holder;

[0041] 第二隔离支架横向形成于第一碗杯内; [0041] The second spacer formed in a first transverse bracket cups;

[0042] 第三隔离支架横向形成于第二碗杯内。 [0042] The third isolator transversely formed in the second bracket cups.

[0043] 本发明的第三方面,揭示了一种白光LED器件色温显指调控方法,其包括如下步骤: [0043] The third aspect of the present invention, discloses a white LED devices of color temperature regulation means, comprising the steps of:

[0044] 电流调控:调节第一碗杯的电流,第一碗杯的功率由第一功率初始百分比变为第一功率调节百分比P1;调节第二碗杯的电流,第二碗杯的功率由第二功率初始百分比变为第二功率调节百分比P2; [0044] Current Regulation: adjusting the current first cups, the first cups of the power generated by the first power becomes a first percentage of the initial power adjustment percentage Pl; second current adjusting cups, cups power by the second The second percentage of the initial power to a second power adjustment percentage P2;

[0045] 亮度调控:白光LED器件的亮度由初始亮度变为: [0045] Brightness Control: brightness white LED device is changed from the initial brightness:

[0046] P1 X第一碗杯的最高亮度+P2 X第二碗杯的最高亮度; [0046] The maximum brightness maximum brightness P1 X first bowl cup bowl + P2 X of the second cup;

[0047] 色温调控:白光LED器件的色温由初始色温变为: [0047] Color Temperature regulation: the color temperature of white LED devices is changed from the initial color temperature:

[0048] [0048]

Figure CN105489738BD00081

[0049] 显指调控:白光LED器件的显指由初始显指变为: [0049] CRI regulation: CRI white LED device becomes the initial CRI:

[0050] [0050]

Figure CN105489738BD00082

[0051] 其中,电流调控步骤中,第一碗杯的电流调节及第二碗杯的电流调节顺序不分先后;在进行电流调控后,白光LED器件的亮度、色温及显指随电流调控同时发生变化。 [0051] wherein the current regulation step, the current of the current regulator a first and a second cups cups regulatory sequences in no particular order; current regulation is performed after the luminance of the white LED devices, color temperature and current regulation means simultaneously with change.

附图说明 BRIEF DESCRIPTION

[0052] 图1为本发明实施例一中采用正装芯片时白光LED器件的正面视图; [0052] The embodiment of Figure 1 when used in a white LED chip being installed in a front view of the device of the present embodiment of the invention;

[0053] 图2为本发明实施例一中采用倒装芯片时白光LED器件的正面视图; [0053] FIG. 2 illustrates a front view of the flip chip white LED device of the embodiment of the present invention;

[0054] 图3为本发明实施例一中白光LED器件的底面视图; [0054] Figure 3 a bottom plan view of the white LED devices of the embodiment of the present invention;

[0055] 图4为本发明实施例一中白光LED器件的侧视图。 [0055] FIG. 4 a side view of the white LED devices of the embodiment of the present invention.

[0056] 附图标记说明:10、主体支架;101、第一碗杯;102、第二碗杯;201、第一蓝色LED芯片、202、第二蓝色LED芯片;301、第一荧光胶层;302、第二荧光胶层;401、第一隔离支架; 402、第二隔离支架;403、第三隔离支架;404、第一正极引脚;405、第一负极引脚;406、第二正极引脚;407、第二负极引脚;408、第一金线;409、第二金线;410、第三金线;411、第四金线;412、第一热沉;413、第二热沉;414、第一防溢胶结构;415、第二防溢胶结构。 [0056] REFERENCE NUMERALS: 10, body frame; 101, the first cups; 102, the second cups; 201, a first blue LED chip 202, the second blue LED chip; 301, a first fluorescent glue; 302, a second fluorescent adhesive layer; 401, a first spacer bracket; 402, a second spacer bracket; 403, a third isolation bracket; 404, a first positive electrode pin; 405, a first negative terminal; 406, a second positive electrode pin; 407, a second negative terminal; 408, a first gold; 409, a second gold; 410, a third gold; 411, a fourth gold; 412, a first heat sink; 413 , a second heat sink; 414, a first adhesive spill structure; 415, a second spill plastic structure.

具体实施方式 Detailed ways

[0057] 以下将以图式揭露本发明的多个实施方式,为明确说明起见,许多实务上的细节将在以下叙述中一并说明。 [0057] The following drawings will be a plurality of embodiments disclosed embodiment of the present invention, is a clear illustration, many details of the practice will also be explained in the following description. 然而,应了解到,这些实务上的细节不应用以限制本发明。 However, it should be understood that these details are not substantive to limit the application of the present invention. 也就是说,在本发明的部分实施方式中,这些实务上的细节是非必要的。 That is, in some embodiments of the present invention, these details are not necessary to the practice. 此外,为简化图式起见, 一些习知惯用的结构与组件在图式中将以简单的示意的方式绘示之。 Further, for the sake of simplifying the drawings, some of the conventional structures and conventional components in the drawings will be illustrated in a simple manner the depicted.

[0058] 关于本文中所使用之“第一”、“第二”等,并非特别指称次序或顺位的意思,亦非用以限定本发明,其仅仅是为了区别以相同技术用语描述的组件或操作而已。 [0058] As used herein, regarding the "first," "second," and the like, not specifically alleged or meaning of the overall order of nor to limit the invention, which is only to distinguish the same components described in technical terms or operate it.

[0059] 本发明为有关于一种色温显指可调的白光LED器件的设计,以及白光LED器件的制备方法和白光LED器件色温显指调控方法,本发明白光LED器件一方面可以进行色温显指调控,另一方面,还具有现有技术所不具备的简单的结构设计,从而降低器件制备成本。 [0059] The present invention relates to a design of color temperature of white LED refers to an adjustable device, white LED devices and methods for preparing the white LED devices and methods for adjustment of color temperature refers to the white LED device of the present invention may be an aspect of color temperature refers to regulation, on the other hand, also it has a simple structural design of the prior art do not have, thereby reducing the production cost device. 以下, 分三个实施例分别详细介绍本发明中色温显指可调的白光LED器件的结构设计,其制备方法及调控方法。 Hereinafter, three embodiments described are means of color temperature of white LED devices adjustable structural design of the present invention, methods for their preparation and methods for adjustment detail.

[0060] 实施例一 [0060] Example a

[0061] 请参考图1-4,本实施例提供一种色温显指可调的白光LED器件,白光LED器件包括:主体支架10、第一碗杯101、第二碗杯102、芯片回路以及封胶体。 [0061] Please refer to FIGS. 1-4, the present embodiment provides a means of color temperature of white LED devices adjustable, white LED device comprising: a body frame 10, the first cups 101, the second cups 102, and the circuit chip encapsulant.

[0062] 如图1及2所示,沿着主体支架10的纵向方向,由主体支架10顶面向主体支架10的内部凹陷,形成第一碗杯101及第二碗杯102。 [0062] As shown in FIG. 1 and 2, along the longitudinal direction of the body frame 10 by the bracket body facing the inside of the recess 10 of the body frame 10, forming a first and second cups 101 cups 102. 第一碗杯101及第二碗杯102形状及尺寸相同。 The bowl of the first and second cups 101 102 the same shape and size. 在主体支架10上,还设有两组导电引脚,两组导电引脚与主体支架10—体成型;主体支架10 上的两组导电引脚同时作为白光LED器件的导电引脚,与外部电源或外部电路连接。 On the body frame 10 is also provided with two conductive pins, conductive pins with two 10- shaping body frame; two conductive pins 10 on the body frame while the conductive pin white LED device, with an external power supply or an external circuit. 两组导电引脚分别为第一组导电引脚及第二组导电引脚;第一组导电引脚包括第一正极引脚404 及第一负极引脚405;第二组导电引脚包括第二正极引脚406及第二负极引脚407,如图1及2,第一正极引脚404设于第一碗杯101的左侧,第一负极引脚405设于第一碗杯101的右侧; 第二正极引脚406设于第二碗杯102的左侧,第二负极引脚407设于第二碗杯102的右侧。 Two conductive pins, respectively first set of conductive pin and a second set of conductive leads; a first group of the conductive pin 404 includes a first positive terminal and a first negative terminal 405; the second set includes a first conductive pin two positive terminal 406 and the second negative terminal 407, as shown in FIG. 1 and 2, a first positive terminal 404 provided on the left side of the first bowl cup 101, first pin 405 provided on the negative electrode cup 101 of the first bowl right; a second positive terminal 406 provided on the left side of the second cups 102, a second pin 407 provided on the right side of the negative electrode of the second bowl of the cup 102.

[0063] 芯片回路包括第一芯片电路以及第二芯片电路。 [0063] chip circuit chip comprising a first circuit and a second circuit chip. 第一芯片电路包括电连接的第一电流控制电路及第一蓝色LED芯片201,第一电流控制电路用以控制第一蓝色LED芯片201的电流,第一蓝色LED芯片201固定于第一碗杯101内;第二芯片电路包括电连接的第二电流控制电路及第二蓝色LED芯片202,第二电流控制电路用以控制第二蓝色LED芯片202的电流, 第二蓝色LED芯片202固定于第二碗杯102内。 A first current circuit includes a first chip electrically connected to a first control circuit and a blue LED chip 201, a first current of a first current control circuit configured to control the blue LED chip 201, a first blue LED chip 201 is fixed to the first bowl of the cup 101; a second circuit chip including a second current control circuit and electrically connected to the second blue LED chip 202, a second current through the second current control circuit configured to control the blue LED chip 202, the second blue LED chip 202 is fixed to the cup 102 within the second bowl. 优选地,第一蓝色LED芯片201以及第二蓝色LED芯片202可以分别采用正装LED芯片或倒装LED芯片,第一蓝色LED芯片201及第二蓝色LED芯片202的主波长为440nm-480nm,440nm-480nm的波段包括了蓝光所有的波段,根据波段的不同,可以搭配不同的荧光粉达到更好的配光效果。 Preferably, the first blue LED chip 201 and the second blue LED chip 202 may be mounted respectively positive or flip-chip LED chips LED, the main wavelength of the first blue LED chip 201 and the second blue LED chip 202 to 440nm -480nm, 440nm-480nm blue wavelength band including all the bands, depending on the bands, can be used with different phosphors of the light distribution to achieve better results.

[0064] 第一电流控制电路可以采用现有技术的电路设计,第一蓝色LED芯片201采用正装芯片或倒装芯片。 [0064] The first current control circuit may be designed using the prior art circuit, a first blue LED chip 201 using a flip chip or chips being installed. 如图1,当第一蓝色LED芯片201采用正装芯片时,第一蓝色LED芯片201使用白胶固晶,固定于第一碗杯101内,优选固定于第一碗杯101底面正中间位置,第一蓝色LED芯片201采用第一金线408及第二金线409分别焊接其正负极,以与第一电流控制电路实现电连接,第一电流控制电路则分别连接第一正极引脚404及第一负极引脚405。 1, when the first blue LED chip 201 is loaded using the chip, the first blue LED chip 201 using the white plastic solid crystal, the first cups fixed to 101, preferably first secured to the bottom surface of the middle bowl cup 101 position, the first blue LED chip 201 with a first metal line 408 and the second metal wires 409 are welded to positive and negative terminals, with the first current control circuit electrically connected to a first current control circuit are respectively connected to the first positive a first negative terminal pins 404 and 405. 当第一蓝色LED芯片201采用倒装芯片时,如图2,第一蓝色LED芯片201使用锡膏或共晶焊接,固定于第一碗杯101内,并可直接与第一电流控制电路实现电连接,第一电流控制电路则分别连接第一正极引脚404及第一负极引脚405。 When the first blue LED chip is flip-chip 201, FIG. 2, the first blue LED chip 201 using a eutectic solder or solder paste, the first cups fixed to 101, and direct control of the first current circuit electrically connected, a first current control circuit are respectively connected to the positive terminal 404 and a first negative terminal 405 first.

[0065] 第二电流控制电路可以采用现有技术的电路设计,也可与第一电流控制电路的电路设计相同。 [0065] The second current control circuit may be designed using the prior art circuit, the first current may be the same as the circuit design of the control circuit. 第二蓝色LED芯片202采用正装芯片或倒装芯片。 The second blue LED chip 202 using a flip chip or chips being installed. 如图1,当第二蓝色LED芯片202采用正装芯片时,第二蓝色LED芯片202使用白胶固晶,固定于第二碗杯102内,优选固定于第二碗杯102底面正中间位置,第二蓝色LED芯片202采用第三金线410及第四金线411分别焊接其正负极,以与第二电流控制电路实现电连接,第二电流控制电路则分别连接第二正极引脚406及第二负极引脚407。 1, when the second blue LED chip 202 is loaded using the chip, the second blue LED chip 202 using the white plastic solid crystal, is fixed in the second cups 102, preferably cups 102 is fixed to the bottom surface of the second middle position, the second blue LED chip 202 using the third and fourth gold wire 410 welded gold wires 411 which are respectively positive and negative, with the second current control circuit electrically connected to a second current control circuit are respectively connected to the second positive pin 406 and the second negative terminal 407. 当第二蓝色LED芯片202采用倒装芯片时,如图2,第二蓝色LED芯片202使用锡膏或共晶焊接,固定于第二碗杯102内,并可直接与第二电流控制电路实现电连接,第二电流控制电路则分别连接第二正极引脚406及第二负极引脚407。 When the second blue LED chip using flip-chip 202, FIG. 2, the second blue LED chip 202 using a eutectic solder or welding, is fixed to the cup 102 within the second bowl, and a second current control and direct circuit electrically connected to a second current control circuit are respectively connected to the positive terminal of the second negative electrode 406 and the second pin 407.

[0066] 如图4,封胶体包括第一荧光胶层301及第二荧光胶层302。 [0066] FIG 4, a first encapsulant comprising fluorescent phosphor adhesive layer 301 and the second adhesive layer 302. 第一荧光胶层301用以将第一蓝色LED芯片201密封于第一碗杯101内;第二荧光胶层302用以将第二蓝色LED芯片202密封于第二碗杯102内。 The first phosphor of the first adhesive layer 301 for the blue LED chip 201 in the first seal cups 101; a second adhesive layer 302 to the second fluorescent blue LED chip 202 sealed in the cup 102 within the second bowl. 其中,第一荧光胶层301为低色温高显指配比的荧光胶层,第二荧光胶层302为高色温低显指配比的荧光胶层;或,第一荧光胶层301为高色温低显指配比的荧光胶层,第二荧光胶层302为低色温高显指配比的荧光胶层。 Wherein the first adhesive layer 301 is a low color temperature fluorescent high CRI ratio fluorescent layer, a second adhesive layer 302 is a high color temperature fluorescent low CRI fluorescence ratio subbing layer; or, a first adhesive layer 301 is high fluorescent CRI low color temperature fluorescent ratio subbing layer, the second adhesive layer 302 is a low color temperature fluorescent high CRI fluorescence ratio of the adhesive layer. 行业中,色温分为:冷白、 正白、暖白,分别以6000K,4500K,3000K为标准,本发明中,高色温指6000k,低色温指3000k; 低显指一般为80及以下显指,90显指及以上则属于高显指。 In industry, the color temperature is divided into: cool white, white, warm white, respectively, 6000K, 4500K, 3000K standard, the present invention refers to a high color temperature 6000K, 3000K refers low color temperature; generally low CRI CRI of 80 or less and , 90 or more, and CRI is a high CRI.

[0067] 第一荧光胶层301及第二荧光胶层302由荧光粉及封装用的外封胶配置而成,根据第一蓝色LED芯片201及第二蓝色LED芯片202选用的主波长为440nm-480nm的波段,为了达到更好的配光效果,荧光粉搭配如下:荧光粉为黄粉与红粉组合,或者为单黄粉,再或者为黄绿粉与红粉的组合。 [0067] The first outer sealant phosphor adhesive layer 301 and the second adhesive layer 302 by the phosphor and the phosphor configured from encapsulation, main wavelength 201 and optional second 202 blue LED chip according to a first blue LED chip to 440nm 480nm-wavelength band, the light distribution in order to achieve better results, with the following phosphors: pink combination with the phosphor of gluten, gluten or a single, or a combination of yellow-green powder and then with the pink. 具体地,进行第一荧光胶层301及第二荧光胶层302的配置时,低色温高显指配比的荧光胶层包括以下组分:红粉、黄粉、A胶、B胶以及防沉粉,其中,红粉、黄粉、A 胶、B胶以及防沉粉的重量比依次为(0.005〜0.02) : (0.12〜0.48) :0.2:0.8: (0.005〜 〇.02);优选为,红粉、黄粉、A胶、B胶以及防沉粉的重量比依次为0.01:0.24:0.2:0.8:0.01; 或者,低色温高显指配比的荧光胶层包括以下组分:红粉、黄绿粉、A胶、B胶以及防沉粉,其中,红粉、黄绿粉、A胶、B胶以及防沉粉的重量比依次为(0.0025〜0.01) : (0.15〜0.6) :0.2: 0.8: (0.005〜0.02),优选为,红粉、黄绿粉、A胶、B胶以及防沉粉的重量比依次为0.005: 0.3:0.2:0.8:0.01。 Specifically, when a first adhesive layer 301 and the second fluorescent phosphor adhesive layer 302 is disposed, a low color temperature refers to the proportions of high color fluorescent subbing layer comprises the following components: Pink, gluten, A plastic, B gum, and anti-settling powder wherein, pink, gluten, a plastic, B gum, and the weight ratio of anti-settling powder were (0.005~0.02): (0.12~0.48): 0.2: 0.8: (0.005~ 〇.02); preferably, pink, gluten, a plastic, B gum, and the weight ratio of anti-settling powder were 0.01: 0.24: 0.2: 0.8: 0.01; Alternatively, low color temperature fluorescent high CRI ratio subbing layer comprises the following components: pink, yellow-green powder, a plastic, B, and anti-settling plastic powder, wherein, pink, yellow-green powder, plastic a, B gum, and the weight ratio of anti-settling powder were (0.0025~0.01): (0.15~0.6): 0.2: 0.8: (0.005 ~0.02), preferably, pink, yellow-green powder, a plastic, B gum, and the weight ratio of anti-settling powder were 0.005: 0.3: 0.2: 0.8: 0.01. 高色温低显指配比的荧光胶层包括以下组分:黄粉、A胶、B胶以及防沉粉,其中,黄粉、A胶、B胶以及防沉粉的重量比依次为:(0.08〜0.32) :0.2:0.8: (0.005〜 〇.02);优选为,黄粉、A胶、B胶以及防沉粉的重量比依次为0.16:0.2:0.8:0.01。 Low ratio of high color temperature fluorescent CRI subbing layer comprises the following components: gluten, A plastic, B, and anti-settling plastic powder, wherein, gluten, A plastic, B gum, and the weight ratio of anti-settling flour were: (0.08~ 0.32): 0.2: 0.8: (0.005~ 〇.02); preferably, gluten, a plastic, B gum, and the weight ratio of anti-settling powder were 0.16: 0.2: 0.8: 0.01.

[0068] 本实施例中的白光LED器件,将低色温高显指配比的荧光胶层与高色温低显指配比的荧光胶层分别注胶于两个碗杯中,通过分别自由控制两个蓝色LED芯片的电流,即可实现色温显指可控,有效的降低了现有技术中白光LED器件的制备成本。 [0068] Examples of the white LED device of the present embodiment, a low color temperature refers to the proportions of high color adhesive layer and a high color temperature fluorescent low CRI fluorescence ratio subbing layer respectively in two bowls dispensing cups, respectively freely controlled by two current blue LED chip can be realized Color temperature controllable means, effectively reducing the production cost in the prior art white LED device. 另外,相对于现有技术中需要使用两种不同以上不同色温的LED器件,本实施例的单颗白光LED器件更加节省空间面积。 Further, with respect to the prior art requires using two or more different color temperatures of the different LED devices, save more space area single white LED device of the present embodiment of the embodiment.

[0069] 更进一步而言,主体支架10的材料选用PPA或EMC树脂材料,为了使主体支架10中可以有更多有效的利用空间,利于两个蓝色LED芯片的放置,并提高白光LED器件生产工艺的可靠性,提高白光LED器件出光的均匀性,白光LED器件还包括第一隔离支架401,如图1及2,第一隔离支架401纵向设置于第一碗杯101与第二碗杯102之间,用以隔开第一蓝色LED芯片以及第二蓝色LED芯片,具体的,用于隔开第一芯片电路及第二芯片电路。 [0069] Still further, the stent material of the body 10 or EMC selection PPA resin material for the body bracket 10 may have a more efficient use of space, which will help to place two blue LED chip, and increase the white LED devices the reliability of the production process, improve the uniformity of the white light LED device, the white LED device further comprises a first spacer bracket 401, as shown in FIG. 1 and 2, a first spacer 401 longitudinally disposed within a first bracket cups 101 and the second cups between 102 to the first blue LED chip and spaced apart from the second blue LED chip, particularly for separating the first circuit chip and a second chip circuit. 第一隔离支架401的材料与主体支架10的材料一致,可以与主体支架10—体成型,或者第一隔离支架401 为主体支架10的一部分,在开模步骤中直接形成。 A first spacer material conforming material holder 401 to the body mount 10 may be formed with the body frame 10- body, or the first bracket spacer 401 is part of the body of the stent 10, is formed directly in the mold opening step.

[0070] 另一优选方案中,白光LED器件还包括第二隔离支架402及第三隔离支架403。 [0070] In another preferred embodiment, the white LED device further comprises a second spacer bracket 402, and a third isolator bracket 403. 如图1及2,第二隔离支架402横向设置于第一碗杯101内,用以隔开白光LED器件的正极引脚及负极引脚,具体的,第二隔离支架402用于隔开第一正极引脚404及第一负极引脚405;第三隔离支架403横向设置于第二碗杯102内,用以隔开白光LED器件的正极引脚及负极引脚,具体的,第三隔离支架403用于隔开第二正极引脚406及第二负极引脚407。 1 and 2, the second spacer bracket 402 transversely disposed within the first cup bowl 101 for white LED devices spaced apart from the positive terminal and the negative terminal, particularly, a second spacer spaced apart from the first bracket 402 for a positive electrode lead 404 and a first negative terminal 405; a third isolator bracket 403 transversely disposed within the second cups 102 for white LED devices spaced apart from the positive terminal and the negative terminal, particularly, a third isolation a second bracket 403 for spacing the positive terminal 406 and negative terminal 407 second. 第二隔离支架402及第三隔离支架403的材料与主体支架10的材料一致,可以与主体支架10—体成型,或者第二隔离支架402及第三隔离支架403均为主体支架10的一部分,在开模步骤中直接形成。 Conforming material holder 402 and the second isolation third insulating material holder 403 to the body mount 10 may be formed with the body frame 10- body 402, and a third portion of the stent or stent 403 are isolated from the body frame 10, a second spacer, It is formed directly in the mold opening step. 具体来说,第二隔离支架402及第三隔离支架403的具体设置位置包括以下两种:(1)第二隔离支架402设置于第一碗杯101中间位置,其与白光LED器件正极引脚的距离等于其与白光LED器件负极引脚的距离;第三隔离支架403设置于第二碗杯102中间位置,其与白光LED器件正极引脚的距离等于其与白光LED器件负极引脚的距离。 Specifically, the specific position of the second set and the third insulating spacer bracket 402 includes a bracket 403 the following two: (1) a second holder 402 is provided to the first isolation cups intermediate position 101, the white LED devices whose positive terminal a distance equal to the distance from the negative terminal of the white LED devices; third bracket 403 disposed in the second isolation cups intermediate position 102, the white LED devices a distance equal to its distance from the positive terminal and the negative terminal of the white LED devices . 如图2,第二隔离支架402到第一正极引脚404的距离与其到第一负极引脚405的距离相等;第三隔离支架403到第二正极引脚406的距离与其到第二负极引脚407的距离相等。 2, a second spacer 402 to the bracket from its first positive terminal 404 of the first distance is equal to the negative terminal 405; distance from the third isolator 403 to the second bracket 406 with its positive terminal to the negative electrode of the second primer equal to the distance of 407 feet. (2)第二隔离支架402与白光LED器件正极引脚的距离大于其与白光LED器件负极引脚的距离;第三隔离支架403与白光LED器件的正极引脚的距离大于其与白光LED器件的负极引脚的距离。 (2) a second isolation from the holder 402 and the positive terminal of the white LED devices is larger than the distance from the white LED devices negative terminal; and a third spacer pin holder 403 from the positive electrode of the white LED devices is larger than the white LED devices the distance from the anode pins. 如图1,第二隔离支架402到第一正极引脚404的距离大于其到第一负极引脚405的距离;第三隔离支架403到第二正极引脚406的距离大于其到第二负极引脚407的距离。 1, a second separator 402 from the first holder to the positive terminal 404 is greater than the distance to the first negative terminal 405; isolated from the third to the second bracket 403 is greater than the positive terminal 406 to the second negative pin distance 407. 采用第二隔离支架402以及第三隔离支架403分隔白光LED器件的正负极引脚,有效防止白光LED器件的正负极引脚导电,并能合理规划芯片放置位置及空间。 Isolation bracket 402 using a second and a third isolator bracket 403 separated white LED devices of the positive and negative pins, prevent the positive and negative conductive pin white LED devices and chip reasonably planning and placement space. 另外,需要说明的是,本发明中所说的纵向及横向,根据工程学解释,如图1及2 正面视图中,平行较长边所在的方向称为纵向,平行较短边所在的方向称为横向。 Further, it is noted that the present invention is mentioned in the longitudinal and transverse, according to engineering explanation, a front view and FIG. 12, the direction parallel to the longer side where the called longitudinal direction parallel to said shorter side is located transversely.

[0071] 另外,由于本实施例中的白光LED器件具有第一碗杯101及第二碗杯102两个碗杯, 为了防止两个碗杯发生溢胶互相影响的境况,白光LED器件中设置第一防溢胶结构414及第二防溢胶结构415,如图4所示。 [0071] Further, since the present embodiment of the white LED device having a first and second cups 101 cups two cups 102, in order to prevent an overflow situation two plastic cups mutual influence occurs, the white LED devices is provided The first structure 414 and the adhesive spill overflow prevention second plastic structure 415, as shown in FIG. 在第一碗杯101及第二碗杯102的底部,还分别设置了第一热沉412及第二热沉413,如图3所示,第一热沉412及第二热沉413用以提高白光LED器件的散热功能。 In the bottom of the first and second cups 101 cups 102, are also provided with a first heat sink 412 and the second heat sink 413, shown in Figure 3, the first heat sink and the second heat sink 412 to 413 enhance the heat dissipation function of the white LED devices. 第一热沉412及第二热沉413具体使用铜镀银,更有利于白光LED器件中热量的传导,提高第一蓝色LED芯片201以及第二蓝色LED芯片202的寿命。 The first heat sink 412 and the first 413 life blue LED chip 201 and the second blue LED chip 202 of the second heat sink particular silver, copper, white LED device is more conducive to the heat conduction is improved.

[0072] 需要说明的是,根据本发明相同原理进行技术延伸,本发明白光LED器件还可以包括第三碗杯和第三蓝色LED芯片,或者更多碗杯及与碗杯个数相同的蓝色LED芯片。 [0072] Incidentally, according to the same extend technical principles of the present invention, the present invention is a white LED device may further include a third cups same blue LED chip, and a third, or more, and the number of cups and the cups a blue LED chip. 在大于两个碗杯及两个蓝色LED芯片的白光LED器件结构中,每个蓝色LED芯片之间及每个碗杯之间各自独立,每个碗杯内部用一荧光胶层密封一个蓝色LED芯片。 Greater than two cups and two white LED device structure blue LED chip, each independently between each blue LED chip and cups, cups inside each sealed with a subbing layer a fluorescent a blue LED chip. 若碗杯个数及蓝色LED芯片个数为偶数个,荧光胶层则按照一高色温低显指配比搭配一低色温高显指的配比依次进行配置;若碗杯个数及蓝色LED芯片为奇数个,荧光胶层先按照一高色温低显指配比搭配一低色温高显指的配比依次进行配置,剩余一个碗杯内采用的荧光胶层可以为高色温低显指配比或低色温高显指配比的荧光胶层,具体不做限制,白光LED器件按照上述同原理实现色温及显指可调。 The bowl and if the number of the blue LED chip number is an even number, the adhesive layer according to a fluorescence low high color temperature with a significant proportion of low color temperature refers to high CRI ratio sequentially arranged; if the number of cups and blue an odd number of color LED chips, the phosphor adhesive layer according to the color temperature of a high proportion of low CRI with a low color temperature refers to the ratio of high color sequentially arranged, a fluorescent glue remainder cups may be used in high color temperature significantly lower refers to the ratio of high or low color temperature fluorescent CRI matching glue, it is not particularly limited, and the color temperature of white LED devices implemented substantially as described above with the principles of the adjustable means.

[0073] 实施例二 [0073] Second Embodiment

[0074] 本实施例提供一种色温显指可调的白光LED器件的制备方法,其包括如下步骤: [0074] The present embodiment provides a method for the preparation of an adjustable color temperature CRI white LED device, comprising the steps of:

[0075] 开模:在主体支架10顶面形成第一碗杯101及第二碗杯102。 [0075] The mold: forming a first bowl and a second bowl cup 101 cup body 102 in the surface of the bracket 10. 如图1及2,用CAD设计SMD白光LED器件的模型,进行注塑开模。 1 and 2, a CAD design model SMD white LED devices, injection-mold. 白光LED器件尺寸可为5730,也可为2835或者其他。 Size may be a white LED devices 5730, 2835 may be, or other. 主体支架10为PPA也可为EMC树脂材料。 PPA is a holder main body 10 may also be a resin material EMC. 优选方案中,开模步骤中,主体支架10上还形成有第一隔离支架401;第一隔离支架401纵向形成于第一碗杯101与第二碗杯102之间,用以隔开第一蓝色LED芯片以及第二蓝色LED芯片。 In a preferred embodiment, the step of opening the mold, the body 10 also has a first bracket spacer bracket 401 formed; a first spacer 401 is formed between the first longitudinal bracket cups cups 101 and the second 102 to the first partition a second blue LED chip and a blue LED chip. 第一隔离支架401的材料与主体支架10的材料一致,可以与主体支架10—体成型。 The first insulating material 401 consistent with the stent body material of the stent 10, the stent may be molded with the body member 10-. 另一优选方案中,开模步骤中:主体支架10上还形成有第二隔离支架402及第三隔离支架403;第二隔离支架402横向形成于第一碗杯101内,用以隔开白光LED器件的正极引脚及负极引脚;第三隔离支架403横向形成于第二碗杯102内,用以隔开白光LED器件的正极引脚及负极引脚。 In another preferred embodiment, the mold opening step: the body frame 10 further has a second holder 402 and the third spacer 403 is formed spacer holder; a second spacer bracket 402 formed in a first lateral cups 101, spaced apart to white the positive terminal and negative terminal of the LED devices; third spacer bracket 403 formed transversely in the second cups 102 for white LED devices spaced from the positive electrode and the negative electrode lead pins. 第二隔离支架402及第三隔离支架403的材料与主体支架10的材料一致,可以与主体支架10—体成型。 Consistent material to the host material of the second stent 10 and the third insulating spacer bracket 402 of the bracket 403, the bracket body may be formed with the body 10-. 具体来说,第二隔离支架402及第三隔离支架403的具体设置位置与实施例一相同,这里不再赘述。 Specifically, same as the second and third insulation spacer bracket 402 specific position of the carriage 403 is provided with the first embodiment, is omitted here.

[0076] 固晶:将第一蓝色LED芯片201固定于第一碗杯101内,第二蓝色LED芯片202固定于第二碗杯102内。 [0076] Solid crystal: a first blue LED chip 201 is fixed in the first bowl cup 101, the second blue LED chip 202 is fixed to the cup 102 within the second bowl. 第一蓝色LED芯片201及第二蓝色LED芯片202可以采用分别正装芯片或倒装芯片。 The first blue LED chip 201 and the second blue LED chip 202 may be employed separately or flip-chip chips being installed. 当第一蓝色LED芯片201及第二蓝色LED芯片202采用正装芯片时,第一蓝色LED芯片201及第二蓝色LED芯片202都使用白胶固晶,使二者分别固定于第一碗杯101及第二碗杯102内;当第一蓝色LED芯片201及第二蓝色LED芯片202采用倒装芯片时,二者都使用锡膏或共晶焊接,使第一蓝色LED芯片201及第二蓝色LED芯片202分别固定于第一碗杯101及第二碗杯102内。 When the first blue LED chip 201 and the second blue LED chip 202 is loaded using the chip, the first blue LED chip 201 and the second blue LED chip 202 use a white plastic solid crystal, so that the two are fixed to the first bowl cup 101 and the second inner cup bowl 102; when the first blue LED chip 201 and the second blue LED chip 202 is flip-chip, both the use of eutectic solder or solder paste, the first blue LED chip 201 and the second blue LED chip 202 are fixed to the first 102 and second 101 cups cups.

[0077] 焊线:分别焊接第一蓝色LED芯片201及第二蓝色LED芯片202的正负极;当第一蓝色LED芯片201及第二蓝色LED芯片202采用正装芯片时,第一蓝色LED芯片201分别采用第一金线408及第二金线409分别焊接其正负极,第二蓝色LED芯片202分别采用第三金线410及第四金线411分别焊接其正负极;二者分别连接于第一芯片电路及第二芯片电路中。 [0077] The wire bonding: a first blue LED chip are soldered positive and negative electrode 201 and the second blue LED chip 202; when the first blue LED chip 201 and the second blue LED chip 202 is loaded using the chip, the first a blue LED chip 201 respectively of the first line 408 and the gold second metal line 409 which are welded to positive and negative, the second blue LED chip 202 respectively third and fourth gold wire 410 welded gold wires 411 which are positive a negative electrode; both are connected to a first circuit chip and the second chip circuits. 当第一蓝色LED芯片201及第二蓝色LED芯片202采用倒装正装芯片时,二者使用锡膏或共晶焊接时,不需要采用金线,二者便直接分别连接于第一芯片电路及第二芯片电路中。 201 when the first blue LED chip and the first chip 202 when the second blue LED chip flip-chip being installed, or when both using eutectic solder paste, gold wire need not be employed, it is directly connected both to the circuit and the second circuit chip.

[0078] 封胶:将第一荧光胶层301注胶于第一碗杯101内,密封第一蓝色LED芯片201;将第二荧光胶层302注胶于第二碗杯102内,密封第二蓝色LED芯片202。 [0078] The sealant: the first fluorescent adhesive layer 301 within the first dispensing cups 101, 201 seal the first blue LED chip; second phosphor adhesive layer 302 in the second dispensing cups 102, seal The second blue LED chip 202. 本实施例中,第一荧光胶层301及第二荧光胶层302具有与实施例一相同的参数特性:第一荧光胶层301为低色温高显指配比的荧光胶层,第二荧光胶层302为高色温低显指配比的荧光胶层;或,第一荧光胶层301为高色温低显指配比的荧光胶层,第二荧光胶层302为低色温高显指配比的荧光胶层。 The second adhesive layer 301 is the first fluorescent phosphor low color temperature fluorescent high CRI matching glue,: the present embodiment, the first phosphor and the second phosphor adhesive layer 301 adhesive layer 302 having a same parameters as in Example Characteristics adhesive layer 302 is a low-high color temperature fluorescent glue matching CRI; or, a first adhesive layer 301 is a high color temperature fluorescent low CRI fluorescence ratio of adhesive layer, a second adhesive layer 302 is a low color temperature fluorescent high color assignments than fluorescent adhesive layer. 第一荧光胶层301及第二荧光胶层302由荧光粉及封装用的外封胶配置而成,荧光粉为黄粉与红粉组合,或者为单黄粉,再或者为黄绿粉与红粉的组合。 A first outer sealant phosphor adhesive layer 301 and the second adhesive layer 302 by the phosphor and the phosphor configured by encapsulating the phosphor as yellow powder in combination with Pink, single or gluten, and then yellow-green powder or a combination of the Pink . 进行第一荧光胶层301及第二荧光胶层302的配置时,低色温高显指的配比及高色温低显指的配比与实施例一相同, 这里不再赘述。 When the first phosphor and the second phosphor adhesive layer 301 adhesive layer 302 is disposed, a low color temperature and high color refers to the ratio of high color temperature CRI low ratio the same as in Embodiment 1 is not repeated here.

[0079] 由于本实施方式只采用蓝色LED芯片,一方面,对应的单颗LED器件能耗小,造价相对传统技术较低。 [0079] Since this embodiment uses only a blue LED chip, on the one hand, a single LED device corresponding to low energy consumption, low cost compared to conventional techniques. 使用的基板线路也相对简单得多;另一方面,固晶步骤中采用的底胶相同;焊线步骤中,采用正装LED芯片,焊线数量较少,采用倒装LED芯片时,更无需焊线,工序简单,提高生产效率;再者,即使其中一颗蓝色LED芯片的出光出现问题,也不会造成整个白光LED器件的浪费,另一颗蓝色LED芯片仍然能够正常出光。 The substrate used is relatively much simpler line; the other hand, the same primer used in the die bonding step; wire bonding step using LED chips being installed, fewer wire bonds, when flip-chip LED, even without welding line, simple process, improve production efficiency; Furthermore, even if a blue LED chip light problems, will not cause the waste of the entire white LED devices, the other can be a blue LED chip is still normal light.

[0080] 实施例三 [0080] Example three

[0081 ] 本实施例提供一种白光LED器件色温显指调控方法,其包括如下步骤: [0081] The present embodiment provides a means of color temperature of white LED device regulation method comprising the steps of:

[0082] 电流调控:调节第一碗杯101的电流,第一碗杯101的功率由第一功率初始百分比变为第一功率调节百分比Pi;调节第二碗杯102的电流,第二碗杯102的功率由第二功率初始百分比变为第二功率调节百分比P2;其中,每个碗杯中电流大小的调节范围根据碗杯中固定的蓝色LED芯片而变化,可以为0-700mA。 [0082] Current Regulation: adjusting the first current bowl cup 101, the first cups 101 by the power of a first power becomes a first percentage of the initial power adjustment percentage Pi; 102 cups the second current is adjusted, the second cups 102 by the second power of the initial power to a second power adjustment percentage percentage P2; wherein each of the adjustment range of the current size of the bowl cup bowl cup varies in accordance with a fixed blue LED chip may be 0-700mA. 每个碗杯中功率的变化对应可以为0-100%。 Each power change corresponding cup bowl may be 0-100%.

[0083] 亮度调控:白光LED器件的亮度由初始亮度变为: [0083] Brightness Control: brightness white LED device is changed from the initial brightness:

[0084] P1X第一碗杯的最高亮度+P2 X第二碗杯的最高亮度。 [0084] a first maximum brightness maximum brightness P1X + P2 X cups of the second cup bowl.

[0085] 色温调控:白光LED器件的色温由初始色温变为: [0085] Color Temperature regulation: the color temperature of white LED devices is changed from the initial color temperature:

[0086] [0086]

Figure CN105489738BD00131

[0087] 显指调控:白光LED器件的显指由初始显指变为: [0087] CRI regulation: CRI white LED device becomes the initial CRI:

[0088] [0088]

Figure CN105489738BD00132

[0089] 其中,电流调控步骤中,第一碗杯101的电流调节及第二碗杯102的电流调节顺序不分先后;在进行电流调控后,白光LED器件的亮度、色温及显指随电流调控同时发生变化。 [0089] wherein the current regulation step, the first cups current and the second current regulator 101 102 cups regulatory sequences in no particular order; current regulation is performed after the luminance of the white LED device, with the current color temperature and CRI regulatory change simultaneously.

[0090] 本实施例中,第一碗杯101的色温显指由第一碗杯101中填充的第一荧光胶层301 决定,第一碗杯101的色温显指与第一荧光胶层301的色温显指相同;第二碗杯102的色温显指由第二碗杯102中填充的第二荧光胶层302决定,第二碗杯102的色温显指与第二荧光胶层302的色温显指相同;第一荧光胶层301的配比及第二荧光胶层302的配比与实施例一相同,这里不再赘述。 [0090] In this embodiment, the first cups color temperature was 101 by the first means is filled cups 101 determines a first phosphor adhesive layer 301, the first cups color temperature was 101 refers to the first adhesive layer 301 fluorescent Color temperature refers to the same; a second color temperature of the cups 102 substantially filled by the second bowl cup means 102 in the second adhesive layer 302 determines phosphor, color temperature was 102 cups the second means and the second color temperature fluorescent adhesive layer 302 CRI same; same as a ratio of the first phosphor and the second adhesive layer 301 of adhesive layer 302 fluorescence ratio and embodiments will not be repeated here. 白光LED器件的初始亮度、初始色温以及初始显指分别指:第一碗杯101 以及第二碗杯102分别在第一功率初始百分比及第二功率初始百分比的情况下,白光LED器件的亮度、色温以及显指。 Initial luminance of white LED devices, the initial initial color temperature and CRI refer respectively: in the case of a first power and second power percentage of the initial percentage of the initial luminance of the first and second cups 101 cups of white LED devices 102, respectively, Color temperature and CRI.

[0091] 该实施例中以第一碗杯101中注入的第一荧光胶层301为高色温低显指的荧光胶层,第二碗杯102中注入的第二荧光胶层302为低色温高显指的荧光胶层为例进行说明,第一碗杯101中注入的第一荧光胶层301的色温为6000K,第二碗杯102中注入的第二荧光胶层302的色温为3000K,本领域技术人员可以理解的是,该例仅用以使本领域技术人员更加清楚的理解白光LED器件的色温显指调控方法,不用以限定本发明。 [0091] The first phosphor adhesive layer to a first embodiment 101 in cups 301 is injected embodiments low CRI high color temperature fluorescent layer, a second injection of 102 cups the second adhesive layer 302 is a low color temperature fluorescent high CRI fluorescent paste layer as an example, a first color temperature cups 101 injected adhesive layer 301 is the first fluorescent 6000K, the second cups 102 implanted in a second fluorescent adhesive layer 302 is a color temperature 3000K, Those skilled in the art will appreciate that this embodiment only to enable those skilled in the art more clearly understand the color temperature of white LED devices CRI regulation method, not to limit the invention.

[0092] 亮度调控:白光LED器件亮度范围可为0-280Im,最高亮度为280Im,对应的,第一碗杯101及第二碗杯102的最高亮度均为1401m,调节第一碗杯101及第二碗杯102的电流分别为60-350mA之间的一个电流,使第一碗杯101的功率由第一功率初始百分比变为第一功率调节百分比Ρι,Ρι为50%,第二碗杯102的功率由第二功率初始百分比变为第二功率调节百分比P2,P2为50%,此时,白光LED器件的亮度变为0.5*140+0.5*140 = 1401m。 [0092] Brightness Control: luminance white LED devices may range 0-280Im, maximum brightness 280Im, corresponding to the first and second cups 101 cups 102 are the highest luminance 1401m, adjusting the first and cups 101 the bowl 102 of the second current respectively a current between 60-350mA, the first cups 101 of the power by the first power percentage of the initial power adjustment becomes a first percentage Ρι, Ρι 50%, the second cups power by the second power 102 to a second percentage of the initial power adjustment percentage P2, P2 is 50% at this time, the brightness of white LED devices becomes 0.5 * 140 + 0.5 * 140 = 1401m.

[0093] 色温调控:第一碗杯101的色温为6000k,第二碗杯102的色温为3000k,调节第一碗杯301及第二碗杯302的电流,第一碗杯101的功率由第一功率初始百分比变为第一功率调节百分比P1,,第二碗杯102的功率由第二功率初始百分比变为第二功率调节百分比P2,P2为50%,白光LED器件的色温则变为[0 · 5八0 · 5+0 · 5) ] *6000+ [0 · 5八0 · 5+0 · 5) ] *3000 = 4500K。 [0093] Color Temperature regulation: a first color temperature is 6000K cups 101, the second color temperature is 3000K cups 102, the first current 301 and the second cups cups 302 is adjusted, the first cups 101 by the second power a first power becomes a percentage of the initial power adjustment percentage P1 ,, 102 cups the second power from the second initial power to a second power adjustment percentage percentage P2, P2 is 50%, the color temperature of white LED devices becomes [ 0 · 5 80 · 5 + 0 · 5)] * 6000 + [Ba 0 · 5 0 · 5 + 0 · 5)] * 3000 = 4500K. 显指调控原理与色温调控相同,这里不再详述。 CRI and color temperature regulation of the same regulatory principles, not detailed here.

[0094] 因此,调控第一碗杯301及第二碗杯302的电流,即为控制二者的功率百分比,这样通过控制电流,就可以实现色温以及显指还有亮度的调控。 [0094] Accordingly, the regulation of the first and second cups 301 cups the current 302, power control is the percentage of both, so that by controlling the current, the regulation of the color temperature can be achieved and also the luminance CRI.

[0095] 上所述仅为本发明的实施方式而已,并不用于限制本发明。 [0095] the only embodiment of the present invention only, and are not intended to limit the present invention. 对于本领域技术人员来说,本发明可以有各种更改和变化。 Of ordinary skill in the art, the present invention may have various changes and variations. 凡在本发明的精神和原理的内所作的任何修改、等同替换、改进等,均应包括在本发明的权利要求范围之内。 Any modification within the spirit and principles of the present invention, equivalent substitutions and improvements should be included within the scope of the claims of the invention claims.

Claims (17)

1. 一种色温显指可调的白光LED器件,其特征在于,包括: 主体支架(10); 形成于主体支架(10)上的第一碗杯(101)及第二碗杯(102); 固定于第一碗杯(101)内的第一蓝色LED芯片(201); 固定于第二碗杯(102)内的第二蓝色LED芯片(202); 第一荧光胶层(301),用以将第一蓝色LED芯片(201)密封于第一碗杯(101)内;以及, 第二荧光胶层(302),用以将第二蓝色LED芯片(202)密封于第二碗杯(102)内; 其中,第一荧光胶层(301)为低色温高显指配比的荧光胶层,第二荧光胶层(302)为高色温低显指配比的荧光胶层;或,第一荧光胶层(301)为高色温低显指配比的荧光胶层,第二荧光胶层(302)为低色温高显指配比的荧光胶层; 所述低色温高显指配比的荧光胶层包括以下组分:红粉、黄粉、A胶、B胶以及防沉粉;所述红粉、黄粉、A胶、B胶以及防沉粉的重量比依次为(0.005〜0.02) : (0.12〜0.48) An adjustable means of color temperature of white LED devices, characterized by comprising: a body frame (10); forming on the first body holder cup bowl (101) (10) and a second bowl cup (102) ; blue LED chip fixed to the first (201) within the first cup bowl (101); fixed to the second blue LED chip (202) in the second cups (102); a first fluorescent adhesive layer (301 ) for the first blue LED chip (201) sealed to the first bowl cup (101); and, a second fluorescent adhesive layer (302) for a second blue LED chip (202) to seal a second bowl cup (102); wherein a first fluorescent adhesive layer (301) is a low color temperature high CRI fluorescence ratio subbing layer, the second fluorescent adhesive layer (302) is a low-high color temperature fluorescent matching CRI adhesive layer; or, a first fluorescent adhesive layer (301) is a low-high color temperature fluorescent CRI ratio subbing layer, the second fluorescent adhesive layer (302) is a low color temperature fluorescent glue high color matching means; said low refers to the ratio of high color temperature fluorescent significant subbing layer comprises the following components: pink, gluten, a plastic, B gum, and anti-settling powder; the pink, gluten, a plastic, B gum, and the weight ratio of anti-settling powder were ( 0.005~0.02): (0.12~0.48) :0.2: : 0.2:
0.8: (0.005〜0.02); 或,所述低色温高显指配比的荧光胶层包括以下组分:红粉、黄绿粉、A胶、B胶以及防沉粉;所述红粉、黄绿粉、A胶、B胶以及防沉粉的重量比依次为(0.0025〜0.01) : (0.15〜0.6): 0.2:0.8: (0.005〜0.02) 〇 0.8: (0.005~0.02); or, a low color temperature refers to the proportions of high color fluorescent subbing layer comprises the following components: Pink, yellow-green powder, A plastic, B gum, and anti-settling powder; the Pink, yellow powder, a plastic, B gum, and the weight ratio of anti-settling powder were (0.0025~0.01): (0.15~0.6): 0.2: 0.8: (0.005~0.02) square
2. 根据权利要求1所述的白光LED器件,其特征在于,还包括: 第一隔离支架(401),所述第一隔离支架(401)纵向设置于所述第一碗杯(101)与第二碗杯(102)之间,用以隔开第一蓝色LED芯片以及第二蓝色LED芯片。 The white LED device according to claim 1, characterized in that, further comprising: a first isolation bracket (401), the first isolation bracket (401) disposed in said first longitudinal cups (101) and between the second bowl cup (102) for separating the first blue LED chip and a second blue LED chip.
3. 根据权利要求1所述的白光LED器件,其特征在于,还包括: 用以隔开白光LED器件正极引脚及负极引脚的第二隔离支架(402)及第三隔离支架(403); 所述第二隔离支架(402)横向设置于所述第一碗杯(101)内; 所述第三隔离支架(403)横向设置于所述第二碗杯(102)内。 3. The white LED device according to claim 1, characterized in that, further comprising: means for isolating the second white LED devices spaced apart from the positive terminal and the negative electrode holder pin (402) and the third isolation bracket (403) ; the second isolation bracket (402) transversely disposed within the first cup bowl (101); said third isolation bracket (403) transversely disposed within the second bowl cup (102).
4. 根据权利要求3所述的白光LED器件,其特征在于: 第二隔离支架(402)与白光LED器件正极引脚的距离等于其与白光LED器件负极引脚的距离;第三隔离支架(403)与白光LED器件正极引脚的距离等于其与白光LED器件负极引脚的距离; 或,第二隔离支架(402)与白光LED器件正极引脚的距离大于其与白光LED器件负极引脚的距离;第三隔离支架(403)与白光LED器件的正极引脚的距离大于其与白光LED器件的负极引脚的距离。 4. The white LED devices according to claim 3, wherein: a second isolation bracket (402) and the white LED devices from the positive terminal of which is equal to the distance from the negative terminal of the white LED devices; third isolation bracket ( 403) from the positive terminal and the white LED devices is equal to its distance from the negative terminal of the white LED devices; or, a second isolation bracket (402) from the white LED devices is larger than the positive terminal and negative terminal white LED devices distance; third isolation bracket (403) and the distance from the positive terminal of the white LED device from the negative terminal of the white LED devices of its class.
5. 根据权利要求1-4任一所述的白光LED器件,其特征在于: 所述高色温低显指配比的荧光胶层包括以下组分:黄粉、A胶、B胶以及防沉粉,所述黄粉、A胶、B胶以及防沉粉的重量比依次为:(0.08〜0.32) :0.2:0.8: (0.005〜0.02)。 5. The white LED device of any of claims 1-4 according to one of the preceding claims, characterized in that: the ratio of high color temperature fluorescent low CRI subbing layer comprises the following components: gluten, A plastic, B gum, and anti-settling powder the gluten, a plastic, B gum, and the weight ratio of anti-settling flour were: (0.08~0.32): 0.2: 0.8: (0.005~0.02).
6. —种色温显指可调的白光LED器件,其特征在于,包括: 主体支架(10); 形成于主体支架(10)上的第一碗杯(101)及第二碗杯(102); 固定于第一碗杯(101)内的第一蓝色LED芯片(201); 固定于第二碗杯(102)内的第二蓝色LED芯片(202); 第一荧光胶层(301),用以将第一蓝色LED芯片(201)密封于第一碗杯(101)内;以及, 第二荧光胶层(302),用以将第二蓝色LED芯片(202)密封于第二碗杯(102)内; 其中,第一荧光胶层(301)为低色温高显指配比的荧光胶层,第二荧光胶层(302)为高色温低显指配比的荧光胶层;或,第一荧光胶层(301)为高色温低显指配比的荧光胶层,第二荧光胶层(302)为低色温高显指配比的荧光胶层; 所述高色温低显指配比的荧光胶层包括以下组分:黄粉、A胶、B胶以及防沉粉,所述黄粉、A胶、B胶以及防沉粉的重量比依次为:(0.08〜0.32) :0.2:0.8: (0.005〜0.02)。 6. - CRI adjustable color temperature white LED device, characterized in that, comprising: a body frame (10); forming a first bowl cup (101) in the body frame (10) and a second bowl cup (102) ; blue LED chip fixed to the first (201) within the first cup bowl (101); fixed to the second blue LED chip (202) in the second cups (102); a first fluorescent adhesive layer (301 ) for the first blue LED chip (201) sealed to the first bowl cup (101); and, a second fluorescent adhesive layer (302) for a second blue LED chip (202) to seal a second bowl cup (102); wherein a first fluorescent adhesive layer (301) is a low color temperature high CRI fluorescence ratio subbing layer, the second fluorescent adhesive layer (302) is a low-high color temperature fluorescent matching CRI adhesive layer; or, a first fluorescent adhesive layer (301) is a low-high color temperature fluorescent CRI matching layer, a second fluorescent adhesive layer (302) is a low color temperature refers to the proportions of high color fluorescent paste layer; a higher refers to the ratio of color temperature is low fluorescent subbing layer comprises the following components: gluten, a plastic, B gum, and anti-settling flour, the gluten, a plastic, B gum, and anti-heavy weight ratio of powder were: (0.08~0.32 ): 0.2: 0.8: (0.005~0.02).
7. 根据权利要求6所述的白光LED器件,其特征在于,还包括: 第一隔离支架(401),所述第一隔离支架(401)纵向设置于所述第一碗杯(101)与第二碗杯(102)之间,用以隔开第一蓝色LED芯片以及第二蓝色LED芯片。 The white LED device according to claim 6, characterized in that, further comprising: a first isolation bracket (401), the first isolation bracket (401) disposed in said first longitudinal cups (101) and between the second bowl cup (102) for separating the first blue LED chip and a second blue LED chip.
8. 根据权利要求6所述的白光LED器件,其特征在于,还包括: 用以隔开白光LED器件正极引脚及负极引脚的第二隔离支架(402)及第三隔离支架(403); 所述第二隔离支架(402)横向设置于所述第一碗杯(101)内; 所述第三隔离支架(403)横向设置于所述第二碗杯(102)内。 8. The white LED device according to claim 6, characterized in that, further comprising: means for isolating the second white LED devices spaced apart from the positive terminal and the negative electrode holder pin (402) and the third isolation bracket (403) ; the second isolation bracket (402) transversely disposed within the first cup bowl (101); said third isolation bracket (403) transversely disposed within the second bowl cup (102).
9. 根据权利要求8所述的白光LED器件,其特征在于: 第二隔离支架(402)与白光LED器件正极引脚的距离等于其与白光LED器件负极引脚的距离;第三隔离支架(403)与白光LED器件正极引脚的距离等于其与白光LED器件负极引脚的距离; 或,第二隔离支架(402)与白光LED器件正极引脚的距离大于其与白光LED器件负极引脚的距离;第三隔离支架(403)与白光LED器件的正极引脚的距离大于其与白光LED器件的负极引脚的距离。 9. The white LED device of claim 8, wherein: a second isolation bracket (402) and the white LED devices from the positive terminal of which is equal to the distance from the negative terminal of the white LED devices; third isolation bracket ( 403) from the positive terminal and the white LED devices is equal to its distance from the negative terminal of the white LED devices; or, a second isolation bracket (402) from the white LED devices is larger than the positive terminal and negative terminal white LED devices distance; third isolation bracket (403) and the distance from the positive terminal of the white LED device from the negative terminal of the white LED devices of its class.
10. —种色温显指可调的白光LED器件的制备方法,其特征在于,包括如下步骤: 开模:在主体支架(10)上形成第一碗杯(101)及第二碗杯(102); 固晶:将第一蓝色LED芯片(201)固定于第一碗杯(101)内,第二蓝色LED芯片(202)固定于第二碗杯(102)内; 焊线:分别焊接第一蓝色LED芯片(201)及第二蓝色LED芯片(202)的正负极; 封胶:将第一荧光胶层(301)注胶于第一碗杯(101)内,密封第一蓝色LED芯片(201);将第二荧光胶层(302)注胶于第二碗杯(102)内,密封第二蓝色LED芯片(202); 其中,第一荧光胶层(301)为低色温高显指配比的荧光胶层,第二荧光胶层(302)为高色温低显指配比的荧光胶层;或,第一荧光胶层(301)为高色温低显指配比的荧光胶层,第二荧光胶层(302)为低色温高显指配比的荧光胶层; 所述低色温高显指配比的荧光胶层包括以下组分:红粉、黄粉、A胶、B胶以及防沉粉; 10. - color temperature adjustable preparation CRI white LED device, characterized by comprising the steps of: opening the mold: forming a first bowl cup (101) and second cups (102 on the body frame (10) ); solid crystal: a first blue LED chip (201) is fixed in the first bowl cup (101), a second blue LED chip (202) is fixed to the second bowl cup (102); weld line: respectively welding a first blue LED chip (201) and the second blue LED chip (202) positive and negative electrodes; sealant: a first fluorescent adhesive layer (301) in the first dispensing cups (101), the seal the first blue LED chip (201); fluorescent second adhesive layer (302) to the second dispensing cups (102), a second sealing blue LED chip (202); wherein a first fluorescent adhesive layer ( 301) is a low color temperature high CRI fluorescence ratio subbing layer, the second fluorescent adhesive layer (302) is a low-high color temperature fluorescent glue matching CRI; or, a first fluorescent adhesive layer (301) low color temperature is high refers to the ratio of the fluorescence significantly subbing layer, a second fluorescent adhesive layer (302) is a low color temperature fluorescent glue high color matching means; said low color temperature refers to the ratio of high color fluorescent subbing layer comprises the following components: Pink, gluten, A plastic, B gum, and anti-settling powder; 所述红粉、黄粉、A胶、B胶以及防沉粉的重量比依次为(0.005〜0.02) : (0.12〜0.48) :0.2: The Pink, gluten, A plastic, B gum, and the weight ratio of anti-settling powder were (0.005~0.02): (0.12~0.48): 0.2:
0.8: (0.005〜0.02); 或,所述低色温高显指配比的荧光胶层包括以下组分:红粉、黄绿粉、A胶、B胶以及防沉粉;所述红粉、黄绿粉、A胶、B胶以及防沉粉的重量比依次为(0.0025〜0.01) : (0.15〜0.6): 0.2:0.8: (0.005〜0.02) 〇 0.8: (0.005~0.02); or, a low color temperature refers to the proportions of high color fluorescent subbing layer comprises the following components: Pink, yellow-green powder, A plastic, B gum, and anti-settling powder; the Pink, yellow powder, a plastic, B gum, and the weight ratio of anti-settling powder were (0.0025~0.01): (0.15~0.6): 0.2: 0.8: (0.005~0.02) square
11. 根据权利要求10所述的制备方法,其特征在于,其中所述的开模步骤中: 主体支架(10)还形成有第一隔离支架(401); 所述第一隔离支架(401)纵向形成于所述第一碗杯(101)与第二碗杯(102)之间,用以隔开第一蓝色LED芯片以及第二蓝色LED芯片。 11. The production method according to claim 10, wherein said step of opening the mold: the bracket body (10) is further formed with a first isolation bracket (401); the first isolation bracket (401) formed between said first longitudinal cups (101) and second cups (102) for separating the first blue LED chip and a second blue LED chip.
12. 根据权利要求10或11所述的制备方法,其特征在于,所述开模步骤中: 所述主体支架(10)还形成有用以隔开白光LED器件正极引脚及负极引脚的第二隔离支架(402)及第三隔离支架(403); 所述第二隔离支架(402)横向形成于所述第一碗杯(101)内; 所述第三隔离支架(403)横向形成于所述第二碗杯(102)内。 Preparation 10 or 12. The method according to claim 11, wherein said mold opening step of: said holder body (10) is also formed of white LED devices spaced Useful positive electrode and the negative electrode lead pin second isolation bracket (402) and the third isolation bracket (403); the second isolation bracket (402) laterally formed in said first bowl cup (101); said third isolation bracket (403) transversely formed on the second bowl cup (102).
13. 根据权利要求10或11所述的制备方法,其特征在于: 所述高色温低显指配比的荧光胶层包括以下组分:黄粉、A胶、B胶以及防沉粉,所述黄粉、A胶、B胶以及防沉粉的重量比依次为:(0.08〜0.32) :0.2:0.8: (0.005〜0.02)。 13. The production method according to claim 10 or claim 11, wherein: said low-high color temperature fluorescent CRI ratio subbing layer comprises the following components: gluten, A plastic, B, and anti-settling plastic powder, the gluten, a plastic, B gum, and the weight ratio of anti-settling flour were: (0.08~0.32): 0.2: 0.8: (0.005~0.02).
14. 一种色温显指可调的白光LED器件的制备方法,其特征在于,包括如下步骤: 开模:在主体支架(10)上形成第一碗杯(101)及第二碗杯(102); 固晶:将第一蓝色LED芯片(201)固定于第一碗杯(101)内,第二蓝色LED芯片(202)固定于第二碗杯(102)内; 焊线:分别焊接第一蓝色LED芯片(201)及第二蓝色LED芯片(202)的正负极; 封胶:将第一荧光胶层(301)注胶于第一碗杯(101)内,密封第一蓝色LED芯片(201);将第二荧光胶层(302)注胶于第二碗杯(102)内,密封第二蓝色LED芯片(202); 其中,第一荧光胶层(301)为低色温高显指配比的荧光胶层,第二荧光胶层(302)为高色温低显指配比的荧光胶层;或,第一荧光胶层(301)为高色温低显指配比的荧光胶层,第二荧光胶层(302)为低色温高显指配比的荧光胶层; 所述高色温低显指配比的荧光胶层包括以下组分:黄粉、A胶、B胶以及防沉粉,所述 14. A method for the preparation of an adjustable color temperature CRI white LED device, characterized by comprising the steps of: opening the mold: forming a first bowl cup (101) and second cups (102 on the body frame (10) ); solid crystal: a first blue LED chip (201) is fixed in the first bowl cup (101), a second blue LED chip (202) is fixed to the second bowl cup (102); weld line: respectively welding a first blue LED chip (201) and the second blue LED chip (202) positive and negative electrodes; sealant: a first fluorescent adhesive layer (301) in the first dispensing cups (101), the seal the first blue LED chip (201); fluorescent second adhesive layer (302) to the second dispensing cups (102), a second sealing blue LED chip (202); wherein a first fluorescent adhesive layer ( 301) is a low color temperature high CRI fluorescence ratio subbing layer, the second fluorescent adhesive layer (302) is a low-high color temperature fluorescent glue matching CRI; or, a first fluorescent adhesive layer (301) low color temperature is high refers to the ratio of the fluorescence significantly subbing layer, a second fluorescent adhesive layer (302) is a low color temperature fluorescent glue high color matching means; the high color temperature fluorescent low CRI ratio subbing layer comprises the following components: gluten, A plastic, B, and anti-settling plastic powder, the 粉、A胶、B胶以及防沉粉的重量比依次为:(0.08〜0.32) :0.2:0.8: (0.005〜0.02)。 Powder, A plastic, B gum, and the weight ratio of anti-settling flour were: (0.08~0.32): 0.2: 0.8: (0.005~0.02).
15. 根据权利要求14所述的制备方法,其特征在于,其中所述的开模步骤中: 主体支架(10)还形成有第一隔离支架(401); 所述第一隔离支架(401)纵向形成于所述第一碗杯(101)与第二碗杯(102)之间,用以隔开第一蓝色LED芯片以及第二蓝色LED芯片。 15. The production method according to claim 14, wherein said step of opening the mold: the bracket body (10) is further formed with a first isolation bracket (401); the first isolation bracket (401) formed between said first longitudinal cups (101) and second cups (102) for separating the first blue LED chip and a second blue LED chip.
16. 根据权利要求14或15所述的制备方法,其特征在于,所述开模步骤中: 所述主体支架(10)还形成有用以隔开白光LED器件正极引脚及负极引脚的第二隔离支架(402)及第三隔离支架(403); 所述第二隔离支架(402)横向形成于所述第一碗杯(101)内; 所述第三隔离支架(403)横向形成于所述第二碗杯(102)内。 14 or 16. A production method according to claim 15, wherein said mold opening step of: said holder body (10) is also formed of white LED devices spaced Useful positive electrode and the negative electrode lead pin second isolation bracket (402) and the third isolation bracket (403); the second isolation bracket (402) laterally formed in said first bowl cup (101); said third isolation bracket (403) transversely formed on the second bowl cup (102).
17. —种白光LED器件色温显指调控方法,其特征在于,包括如下步骤: 电流调控:调节第一碗杯(101)的电流,第一碗杯(101)的功率由第一功率初始百分比变为第一功率调节百分比Pi;调节第二碗杯(102)的电流,第二碗杯(102)的功率由第二功率初始百分比变为第二功率调节百分比P2; 亮度调控:白光LED器件的亮度由初始亮度变为: P1X第一碗杯的最高亮度+P2 X第二碗杯的最高亮度; 色温调控:白光LED器件的色温由初始色温变为: 17. - kind of the color temperature of white LED devices CRI regulation method comprising the steps of: a current regulation: a first current cups (101) is adjusted, the first cups (101) percent of the initial power by the first power becomes the first power adjustment percentage Pi; a second current cups (102) is adjusted, the second cups (102) from the second initial power to a second power adjustment power percentage percentage P2; brightness Control: white LED devices luminance changed from the initial brightness: maximum brightness maximum brightness P1X first bowl cup bowl + P2 X of the second cup; Color Temperature Control: color temperature of white LED devices is changed from the initial color temperature:
Figure CN105489738BC00051
第一碗杯的色温 The first bowl cup color temperature
Figure CN105489738BC00052
第二碗杯的色温; 显指调控:白光LED器件的显指由初始显指变为: The bowl of the second color temperature; CRI regulation: white LED device is significantly changed from the initial CRI means:
Figure CN105489738BC00053
第一碗杯的显指 The bowl was first means
Figure CN105489738BC00054
第二碗杯的显指; 其中,电流调控步骤中,第一碗杯(101)的电流调节及第二碗杯(102)的电流调节顺序不分先后;在进行电流调控后,白光LED器件的亮度、色温及显指随电流调控同时发生变化。 The bowl was the second means; wherein the current regulation step, the first cups (101) and a second current regulation bowl cup (102) has a current regulator in no particular order; performing current regulation, the white LED devices brightness, color temperature and current regulation means simultaneously with the change.
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