CN206259380U - Heat dissipation type lamp plate - Google Patents
Heat dissipation type lamp plate Download PDFInfo
- Publication number
- CN206259380U CN206259380U CN201620621455.XU CN201620621455U CN206259380U CN 206259380 U CN206259380 U CN 206259380U CN 201620621455 U CN201620621455 U CN 201620621455U CN 206259380 U CN206259380 U CN 206259380U
- Authority
- CN
- China
- Prior art keywords
- chip
- interface
- lens
- flip
- pcb board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 18
- 239000012790 adhesive layer Substances 0.000 claims abstract description 6
- 239000003292 glue Substances 0.000 claims description 22
- 239000010410 layer Substances 0.000 claims description 6
- 239000000565 sealant Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 6
- 238000012858 packaging process Methods 0.000 abstract description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 8
- 239000006071 cream Substances 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- 239000000741 silica gel Substances 0.000 description 5
- 229910002027 silica gel Inorganic materials 0.000 description 5
- 239000011324 bead Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 241000218202 Coptis Species 0.000 description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000009738 saturating Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model discloses a kind of heat dissipation type lamp plate, and the lamp plate includes pcb board, multiple flip-chips and multiple PC lens, and the pcb board includes pad, multigroup chip interface, panel anode interface and panel negative pole interface；Multigroup chip interface is evenly distributed on pad, the panel anode interface and panel negative pole interface are arranged on the side of pad, each flip-chip is electrically connected with corresponding chip interface, each PC lens is pressed together on corresponding flip-chip, and full fluorescent adhesive layer is filled between the inner surface of each PC lens and corresponding flip-chip outer surface.All process steps are synthesized one packaging process by lamp plate of the present utility model, are improve efficiency, are reduced cost, improve lamp plate life-span and brightness.
Description
Technical field
The utility model is related to the technical field of illuminator, more particularly to a kind of heat dissipation type lamp plate.
Background technology
As expanding economy is more and more faster, requirement of the people to living standard also more and more higher, wherein people are to house
Attention degree high it is particularly evident.Common lamp plate is on aluminium base on note SMD lamp beads element and then along with PC is saturating now
Mirror.One complete lamp plate module needs first packaged lamp bead to paste again onboard, and PC lens are then covered again.The many efficiency of operation are low
Lamp plate radiating effect is general.
Utility model content
For weak point present in above-mentioned technology, the utility model improves the heat dissipation type lamp of lamp plate life-span and brightness
Plate.
In order to achieve the above object, a kind of heat dissipation type lamp plate of the utility model, pcb board, multiple flip-chips and multiple
PC lens, the pcb board includes pad, multigroup chip interface, panel anode interface and panel negative pole interface；Multigroup core
Piece interface is evenly distributed on pad, and the panel anode interface and panel negative pole interface are arranged on the side of pad, and each falls
Cartridge chip is electrically connected with corresponding chip interface, and each PC lens is pressed together on corresponding flip-chip, and each
Full fluorescent adhesive layer is filled between the inner surface of PC lens and corresponding flip-chip outer surface.
Wherein, the chip interface on every group of pcb board includes a chip anode interface and a chip negative pole interface, institute
The positive pole and negative pole for stating flip-chip are in same level, and each flip-chip is electrically connected with one group of chip interface, and
The positive pole of flip-chip is electrically connected with chip anode interface, and the negative pole of flip-chip is electrically connected with chip negative pole interface.
Wherein, one layer of sealant, the sealing are both provided with the aperture slots that each PC lens is in contact with pcb board
Layer, the closed cavity to form an accommodating flip-chip is enclosed between PC lens and pcb board.
Wherein, the marginal position of each PC lens offers a circle screwed hole, and multigroup and spiral shell is offered on the pcb board
The location hole that pit is adapted, each PC lens are connected through a screw thread between structure and pcb board and are fixedly connected.
Wherein, the PC lens include arc groove body and annular cover plate, and the annular cover plate is enclosed in arc groove
Be formed in one structure between the marginal position of body, and the arc groove body and annular cover plate, and the annular cover plate is fitted in
On pcb board, the fluorescent glue is contained in arc groove body.
The beneficial effects of the utility model are：
Compared with prior art, heat dissipation type lamp plate of the present utility model, is made by the combination of flip-chip and PC lens
With, and be directly pressed together on fluorescent adhesive layer is seamless between flip-chip and PC lens；It is using tin cream that flip-chip is solid in lamp plate
On, save the heat on this raw material of support and flip-chip and can directly conduct and remove support thermal resistance on lamp plate.This reality
All process steps are synthesized into one packaging process with new lamp plate, efficiency is improve, is reduced cost, improves the lamp plate life-span
And brightness.
Brief description of the drawings
Fig. 1 is the utility model heat dissipation type lamp plate sectional view；
Fig. 2 is the pcb board front view of the utility model heat dissipation type lamp plate；
Fig. 3 is the flip chip structure figure of the utility model heat dissipation type lamp plate.
Main element symbol description is as follows：
10th, pcb board 11, PC lens
12nd, flip-chip 13, fluorescent adhesive layer
101st, chip anode interface 102, chip negative pole interface
103rd, panel anode interface 104, panel negative pole interface
111st, arc groove body 112, annular cover plate 112
Specific embodiment
In order to more clearly state the utility model, the utility model is further described below in conjunction with the accompanying drawings.
Refering to Fig. 1, the utility model discloses a kind of heat dissipation type lamp plate, pcb board 10, multiple flip-chips 12 and multiple
PC lens 11, pcb board 10 includes pad, multigroup chip interface, panel anode interface 103 and panel negative pole interface 104；It is multigroup
Chip interface is evenly distributed on pad, and the anode interface of pcb board 10 and the negative pole interface of pcb board 10 are arranged on the one of pad
Side, each flip-chip 12 is electrically connected with corresponding chip interface, and each PC lens 11 is pressed together on corresponding upside-down mounting
Full fluorescent adhesive layer 13 is filled on chip 12, and between the inner surface of each PC lens 11 and the outer surface of corresponding flip-chip 12.
Fig. 2-3 are further regarded to, the chip interface on every group of pcb board 10 includes a chip anode interface 101 and
Individual chip negative pole interface 102, the positive pole and negative pole of flip-chip 12 are in same level, and each flip-chip 12 is with one
Group chip interface electrical connection, and the positive pole of flip-chip 12 electrically connects with chip anode interface 101, the negative pole of flip-chip 12 and
Chip negative pole interface 102 is electrically connected.
12 two electrodes of flip-chip are all in lower section and the larger dimpling of electrode pad goes out available tin cream heating welding；Formal dress
Up the smaller level of electrode pad need to turn on chip to chip electrode by the welding of gold thread；With gold thread welding procedure gold thread
Easily breaking causes light source fails, more preferable with the more reliable radiating of tin cream welding procedure.
In the present embodiment, one layer of sealing is both provided with the aperture slots that each PC lens 11 is in contact with pcb board 10
Layer, encloses the closed cavity to form an accommodating flip-chip 12 between sealant, PC lens 11 and pcb board 10.
In the present embodiment, the marginal position of each PC lens 11 offers a circle screwed hole, is offered on pcb board 10
Multigroup location hole being adapted with screwed hole, each PC lens 11 are connected through a screw thread between structure and pcb board 10 and are fixed
Connection.
In the present embodiment, PC lens 11 include arc groove body 111 and annular cover plate 112, and annular cover plate 112 is enclosed
Be formed in one structure between the marginal position of arc groove body 111, and arc groove body 111 and annular cover plate 112, annular
Cover plate 112 is fitted on pcb board 10, and fluorescent glue is contained in arc groove body 111.
Traditional lamp plate needs luminous intensity distribution twice to adjust rising angle by fluorescent glue height size for the first time, and dress PC lens 11 also will
The size of selection PC lens 11 completes luminous intensity distribution；Directly be filled in fluorescent glue in lens recess and reheat by new lamp plate, makes fluorescent glue
Together with being closely bonded with lens, lens cover is then made in chip surface by pressing, direct once light-distribution can just be completed.
The performance comparison table of the traditional lamp plate of table 1 and the utility model lamp plate
| Classification | Brightness（LM) | Colour temperature（K） | It is aobvious to refer to |
| Traditional lamp plate | 101.55 | 2418 | 56.85 |
| The utility model lamp plate | 114.47 | 2664 | 59.01 |
Can be obtained by the data of table 2, new lamp plate brightness of the present utility model improves 10% or so.
Advantage of the present utility model is：
1st, it is cost-effective：Save support this raw material, save patch lamp bead and secondary light-distribution operation.
2nd, more resistant to high temperature：The thermal resistance radiating for removing support is more preferable.
3rd, brightness is higher：Light passes to a kind of outer middle dielectric loss of reduction of lens and reduces, and brightness improves about 10%.
Heat dissipation type lamp plate preparation method of the present utility model, including following operating procedure：
S1, pcb board 10 are molded：Pcb board 10 is carried out into die sinking treatment, opening up pad, multiple chips on the surface of pcb board 10 connects
Mouth, panel anode interface 103 and panel negative pole interface 104, multiple chip interfaces are evenly distributed on pad, panel anode interface
103 and panel negative pole interface 104 be arranged on the side of pad；
S2, fixed chip：By tin cream point to chip interface position, and flip-chip 12 is fixed on tin cream, and upside-down mounting
The positive pole of chip 12 is fixed at the chip anode interface 101 of pcb board 10, and the negative pole of flip-chip 12 is fixed to pcb board 10
At chip negative pole interface 102；After flip-chip 12 is fixed on tin cream, to be toasted, baking temperature is 250 DEG C, baking
Time is 1.5h, tin cream, flip-chip 12 and panel is solidified to together；
S3, preparation fluorescent glue：With silica gel be proportionally stirred fluorescent material and mix by colour temperature as required, and is stirring
Ensure that teeter chamber is in vacuum state to avoid producing bubble during mixing；
The fluorescent material of table 2 matches table with silica gel
| Colour temperature（K） | YAG-04 | O5742 | A glue | B glue |
| 5000-5500 | 0.12 | 0.01 | 2 | 2 |
| 5500-6000 | 0.12 | 0.003 | 2.2 | 2.2 |
| 6000-6500 | 0.12 | - | 2.4 | 2.4 |
YAG-04 and O5742 is fluorescent material type, and A glue and B glue are mixing silica gel glue.
S4, filling PC lens 11：By fluorescent glue along the inwall direction of PC lens 11, the whole recessed of full PC lens 11 is filled
Groove, then heating solidification, heating setting temperature is 150 DEG C, plus the thermoset time is 1.5h, makes fluorescent glue tight with PC lens 11
It is close to bond together；
S5, pressing pcb board 10：The PC lens 11 that fluorescent glue will be poured in are placed in dust free room, are pressed to fluorescent glue face and set
Have on the pcb board 10 of flip-chip 12, be poured in the PC lens 11 of fluorescent glue in dust free room by the fixed spiral shell on PC lens 11
Silk makes PC lens 11 be pressed together on completely on pcb board 10, flip-chip 12 is entrenched in fluorescent glue the inside；
S6, sealing pcb board 10：After PC lens 11 are pressed on pcb board 10 completely, in PC lens 11 and pcb board 10
One layer of sealing ring is set at connection gap carries out seamless seal.
Compared to prior art, the preparation method of heat dissipation type lamp plate of the present utility model, using tin cream by flip-chip 12
Gu on lamp plate, save the heat on this raw material of support and flip-chip 12 and can directly conduct and remove support on lamp plate
Thermal resistance.Direct solid patch lamp bead this procedure of can saving on lamp plate of chip.Fluorescent material and the collocation of silica gel ratio are reached into needs
Colour temperature, fluorescent glue is filled in the groove of PC lens 11 makes silica gel just fill up groove, reheat solidification make fluorescent glue with it is saturating
Mirror is closely bonded together, then will be poured in around the PC lens 11 of fluorescent glue are pressed together on lamp plate completely, makes flip-chip 12 embedding
Close inside fluorescent glue, once light-distribution can just reach target.Lamp plate preparation method of the present utility model synthesizes all process steps
It is one packaging process, improves efficiency, reduce cost, improve lamp plate life-span and brightness.
Disclosed above is only several specific embodiments of the present utility model, but the utility model is not limited to this,
The changes that any person skilled in the art can think of should all fall into protection domain of the present utility model.
Claims (5)
1. a kind of heat dissipation type lamp plate, it is characterised in that including pcb board, multiple flip-chips and multiple PC lens, the PCB
Plate includes pad, multigroup chip interface, panel anode interface and panel negative pole interface；Multigroup chip interface is uniformly distributed
On pad, the panel anode interface and panel negative pole interface are arranged on the side of pad, each flip-chip with it is corresponding
Chip interface electrical connection, each PC lens is pressed together on corresponding flip-chip, and each PC lens inner surface
Full fluorescent adhesive layer is filled between corresponding flip-chip outer surface.
2. heat dissipation type lamp plate according to claim 1, it is characterised in that the chip interface on every group of pcb board includes
Chip anode interface and a chip negative pole interface, the positive pole and negative pole of the flip-chip are in same level, often
Individual flip-chip is electrically connected with one group of chip interface, and the positive pole of flip-chip is electrically connected with chip anode interface, upside-down mounting core
The negative pole of piece is electrically connected with chip negative pole interface.
3. heat dissipation type lamp plate according to claim 1, it is characterised in that the opening that each PC lens is in contact with pcb board
One layer of sealant is both provided with gap, encloses to form an accommodating flip-chip between the sealant, PC lens and pcb board
Closed cavity.
4. heat dissipation type lamp plate according to claim 1, it is characterised in that the marginal position of each PC lens offers
Circle screwed hole, offers multigroup location hole being adapted with screwed hole on the pcb board, each PC lens is connected through a screw thread knot
It is fixedly connected between structure and pcb board.
5. heat dissipation type lamp plate according to claim 1, it is characterised in that the PC lens include arc groove body and ring
Shape cover plate, the annular cover plate is enclosed between the marginal position of arc groove body, and the arc groove body and annular cover plate
Be formed in one structure, and the annular cover plate is fitted on pcb board, and the fluorescent glue is contained in arc groove body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620621455.XU CN206259380U (en) | 2016-06-22 | 2016-06-22 | Heat dissipation type lamp plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620621455.XU CN206259380U (en) | 2016-06-22 | 2016-06-22 | Heat dissipation type lamp plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206259380U true CN206259380U (en) | 2017-06-16 |
Family
ID=59023697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620621455.XU Expired - Fee Related CN206259380U (en) | 2016-06-22 | 2016-06-22 | Heat dissipation type lamp plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206259380U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108831985A (en) * | 2018-07-23 | 2018-11-16 | 广东华辉煌光电科技有限公司 | A kind of digital tube chip of no lead |
-
2016
- 2016-06-22 CN CN201620621455.XU patent/CN206259380U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108831985A (en) * | 2018-07-23 | 2018-11-16 | 广东华辉煌光电科技有限公司 | A kind of digital tube chip of no lead |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170616 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |