CN206379374U - LED EMC area sources - Google Patents

LED EMC area sources Download PDF

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Publication number
CN206379374U
CN206379374U CN201720117417.5U CN201720117417U CN206379374U CN 206379374 U CN206379374 U CN 206379374U CN 201720117417 U CN201720117417 U CN 201720117417U CN 206379374 U CN206379374 U CN 206379374U
Authority
CN
China
Prior art keywords
emc
copper material
led
strip
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201720117417.5U
Other languages
Chinese (zh)
Inventor
刘志亮
林群超
林群立
洪马余
李辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhuhai Jinsheng Electronics Co Ltd
Original Assignee
Zhuhai Jinsheng Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhuhai Jinsheng Electronics Co Ltd filed Critical Zhuhai Jinsheng Electronics Co Ltd
Priority to CN201720117417.5U priority Critical patent/CN206379374U/en
Application granted granted Critical
Publication of CN206379374U publication Critical patent/CN206379374U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model relates to LED EMC area sources, including strip EMC supports, pad, copper material, LED wafer, the strip EMC supports are I-shaped structure, if housing cavity up and down, the copper material is inlaid in the accommodating cavity, the LED wafer die bond is in the middle part of the body frame of the I-shaped structure, the copper material interval overground part of the accommodating cavity opposing upper and lower is from the left side, bottom is from the right, or top is from the right, bottom is from the left side, mutually conducted with the copper material of the adjacent accommodating cavity, the strip EMC supports both sides are the pad be arrangeding in parallel vertically, two electrodes of the LED wafer are realized by the adhesion of metal dust silica-gel mixture with the copper material be up and down electrically connected respectively.LED of the present utility model EMC area sources, chip is directly inverted in support upper point gum forming, reduces hot-fluid transmission channels, reduces thermal resistance, and the radiating of lifting product, product brightness and lighting angle, photochromic uniform, color area centrality are good.

Description

LED EMC area sources
Technical field
The utility model belongs to LED encapsulation technologies field, especially relates to LED EMC area sources.
Background technology
The area source of prior art is that single LEDs patch is made in the circuit board, and process is more, production efficiency, production yield It is low, photochromic uniformity is poor, LED chip by being transferred heat to again in environment after LED support, tin cream, wiring board, thermal resistance is high, Weak heat-dissipating, LED light decline soon, brightness it is low.
Utility model content
Based on this, for prior art, it is good that technical problem to be solved of the present utility model is just to provide a kind of radiating The LED EMC area sources that good, brightness is high, photochromic uniform, color area is concentrated.
The technical solution of the utility model is:
A kind of LED EMC area sources, including strip EMC supports, pad, copper material, LED wafer, the strip EMC Support is I-shaped structure, if housing cavity up and down, the copper material is inlaid in the accommodating cavity, the LED wafer die bond In the middle part of the body frame of the I-shaped structure, the copper material interval overground part of the accommodating cavity opposing upper and lower from the left side, Bottom is mutually conducted from the right, or top from the right, bottom from the left side with the copper material of the adjacent accommodating cavity, The strip EMC supports both sides are the pad that be arranged in parallel vertically, two electrodes of the LED wafer respectively with institute up and down State copper material and electrical connection is realized by the adhesion of metal dust silica-gel mixture.
In one of the embodiments, the strip EMC supports include I-shaped encapsulation body frame, epicoele conducting orifice and cavity of resorption Conducting orifice, the copper material is inlaid in the I-shaped encapsulation body frame both sides, and the copper material passes through the epicoele conducting orifice and top phase The adjacent copper material is conducted, or is conducted by the cavity of resorption conducting orifice copper material adjacent with bottom.
In one of the embodiments, the pad includes positive terminal pad and negative terminal pad.
In one of the embodiments, LED wafer is flip LED chips.
In one of the embodiments, the flip LED chips dispensing die bond is on the strip EMC supports.
Compared with the prior art, LED of the present utility model EMC area sources, chip be directly inverted in above support dispensing into Type, reduces hot-fluid transmission channels, reduces thermal resistance, the radiating of lifting product, product brightness and lighting angle, photochromic uniform, color area Centrality is good.
Brief description of the drawings
Fig. 1 is LED of the present utility model EMC area source structure top views.
In figure, 10-- pads;11-- positive terminal pads;12-- negative terminal pads;20-- copper materials;30-- strip EMC supports; 31-- I-shapeds encapsulate body frame;32-- epicoele conducting orifices;33-- cavity of resorption conducting orifices;40--LED chips.
Embodiment
Below with reference to the accompanying drawings and in conjunction with the embodiments the utility model is described in detail.It should be noted that not rushing In the case of prominent, the feature in following embodiment and embodiment can be mutually combined.
Fig. 1 gives LED of the present utility model EMC area source structure top views, as seen from the figure, LED EMC faces light Source, including strip EMC supports 30, pad 10, copper material 20, LED wafer 40, strip EMC supports 30 are I-shaped structure, if Cavity is housed up and down, and copper material 20 is inlaid in 0 accommodating cavity, and the die bond of LED wafer 40 is in the middle part of the body frame of I-shaped structure, up and down The copper material 20 of relative accommodating cavity is spaced overground part from the left side, bottom from the right, or top is from the right, bottom from the left side, with The copper material 20 of adjacent accommodating cavity is mutually conducted, and the both sides of strip EMC supports 30 are the pad 10 be arrangeding in parallel vertically, Two electrodes of LED wafer 40 are realized by the adhesion of metal dust silica-gel mixture with copper material 20 be up and down electrically connected respectively.
Strip EMC supports 30 include I-shaped encapsulation body frame 31, epicoele conducting orifice 32 and cavity of resorption conducting orifice 33, and copper material 20 is embedding Mounted in I-shaped encapsulation body frame 31 both sides, copper material 20 is conducted by the copper material 20 adjacent with top of epicoele conducting orifice 32, or is passed through The copper material 20 adjacent with bottom of cavity of resorption conducting orifice 33 is conducted.Pad 10 includes positive terminal pad 11 and negative terminal pad 12.LED wafer 40 be flip LED chips.Flip LED chips dispensing die bond is on strip EMC supports 10.
From the above, it may be appreciated that LED of the present utility model EMC area sources, chip is directly inverted in support upper point gum forming, Hot-fluid transmission channels are reduced, thermal resistance, the radiating of lifting product, product brightness and lighting angle, photochromic uniform, color area concentration is reduced Property is good.
Embodiment described above only expresses several embodiments of the present utility model, and it describes more specific and detailed, But therefore it can not be interpreted as the limitation to the utility model the scope of the claims.It should be pointed out that for the common of this area For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to In protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.

Claims (5)

1. a kind of LED EMC area sources, it is characterised in that described including strip EMC supports, pad, copper material, LED wafer Strip EMC supports are I-shaped structure, if housing cavity up and down, the copper material is inlaid in the accommodating cavity, the LED Chip die bond is in the middle part of the body frame of the I-shaped structure, the copper material interval overground part of the accommodating cavity opposing upper and lower From the left side, bottom from the right, or top, from the right, bottom from the left side, the copper material with the adjacent accommodating cavity is mutual Conduct, the strip EMC supports both sides are the pad be arrangeding in parallel vertically, the two electrodes difference of the LED wafer Realized and be electrically connected by the adhesion of metal dust silica-gel mixture with the copper material up and down.
2. LED according to claim 1 EMC area sources, it is characterised in that the strip EMC supports include I-shaped Body frame, epicoele conducting orifice and cavity of resorption conducting orifice are encapsulated, the copper material is inlaid in the I-shaped encapsulation body frame both sides, and the copper material leads to Cross the epicoele conducting orifice copper material adjacent with top to conduct, or pass through the cavity of resorption conducting orifice institute adjacent with bottom Copper material is stated to conduct.
3. LED according to claim 1 EMC area sources, it is characterised in that the pad includes positive terminal pad and negative pole Pad.
4. the EMC area sources of the LED according to any one of claims 1 to 3, it is characterised in that the LED wafer is upside-down mounting LED chip.
5. LED according to claim 4 EMC area sources, it is characterised in that the flip LED chips dispensing die bond exists On the strip EMC supports.
CN201720117417.5U 2017-02-08 2017-02-08 LED EMC area sources Expired - Fee Related CN206379374U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201720117417.5U CN206379374U (en) 2017-02-08 2017-02-08 LED EMC area sources

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720117417.5U CN206379374U (en) 2017-02-08 2017-02-08 LED EMC area sources

Publications (1)

Publication Number Publication Date
CN206379374U true CN206379374U (en) 2017-08-04

Family

ID=59400376

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201720117417.5U Expired - Fee Related CN206379374U (en) 2017-02-08 2017-02-08 LED EMC area sources

Country Status (1)

Country Link
CN (1) CN206379374U (en)

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Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170804

Termination date: 20200208

CF01 Termination of patent right due to non-payment of annual fee