M339082 八、新型說明： 【新型所屬之技術領域】 本新型是涉及一種多晶封裝單元。 【先前技術】 〜傳統表面黏著裝置發光二極體構造，如圖i、圖2所示， 付知匕疋-種具⑥散熱性的表轉練置發光二極體⑺，包 含一具高散熱性之基板⑻及設於該基板⑻上，封裝用的膠 體（73) ’其特徵在於該基板⑻包含：一金屬板材⑽），該基 板⑻用以承載該膠體⑽之支持物，並具有複數個貫穿孔 (82)，·-絕緣層⑻）’在該金屬板材⑽表面及該貫穿孔㈣ 内壁包覆-層絕緣物質’該絕緣層⑻）之厚度小於該金屬板 材⑽)之厚度，及—電路層（74) ’設於該絕緣 及該貫穿孔（82)内。 上述的構造’是為改良傳統表面黏著裝置發光二極體 (SMD LED)封裝，其玻璃纖維印刷電路板的構 材擁有的高散鮮紐，以提高表_著裝置發光 粒（7〇)的發光效率、亮度以及壽命。 曰曰 【新型内容】 一、所欲解決的問題點： 前述表面轉裝置發光二極體存在著下觸題點. 1.金屬板材（80)，需要鑽孔，且孔 ‘ 緣物皙盥雷攸sw、 ―調土遇要包覆一層絕 、，彖物貝糾闕（74)，在撼過財，所 多’使製造成本增加，對整體轉效財大。因/^為繁 工序簡化，降健造穌，料轉效益，便㈣本新= M339082 目的之'一。 2·該基板(8)只能供一個晶粒（70)設置，亮度有限，當需 要=量度時，要安好解元，需要的卽祕大，電路佈 置複雜’更有散熱不佳的醜會發生。因此，如何使晶粒的 。又置i曰加、空間需求降低、提高散熱效果，便成為本新型的 目的之二。 3. 因為要做為照明光源·，但產生的熱量依然报高， 所以它須藉由要安絲熱裝置，如散熱則、水冷裝置等系 統^才能安錢用，因此在燈具製造及材料箱歸的成本 車乂夕’成本’施向。因此’如何使燈具製造及材料的成本降 低’便成為本新型的目的之三。 4. 雖然疋文t於金屬板材（8〇)上，但因只有單獨一個晶 粒(70j，發光效率依然無多大改善，而亮度及壽命，因長期 處於高溫環境的影響下’會錢差與驗關題。因此，如 何使發光效率、亮度以及壽命細紐的提高，便成為本新 型的目的之四。 二、本新型的技術手段： 本新型目的在於提供-種製程簡化、散熱良好、亮度高 的多晶封裝單元與製造方法。 為解決前述問題及達縣新制目的，本新型技術手段 如以下所述，為—鮮晶封裝單元，其特徵在於包括： 具回政熱性且*金屬㈣並呈料板狀的基板⑴，該 基板⑴具有-設於基板⑴表面的絕緣層⑽、—設於絕緣 層α〇)頂魏供線連接的電路層⑵、及—設於電路層⑵ 6 M339082 頂侧能供遮蓋電路用且具絕緣性的保護層（3); 至少一设於該保護層（3)表面且小於基板（！）並呈中空狀 的固定框（4); 複數個設於該固定框（4)内並與電路層（2)電性連接的 LED晶粒（6);以及 • —設霞111定框⑷内且㈣D晶粒⑹覆蓋並能透光的 . 封裝膠體(5)。 根據上述的多晶封裝單元，所述電路層（2)是由一N型導 電電路(20)、及p型導電電路(21)所組成。 根據上述W乡⑼愤單元，其彳椒在於··所耻ED晶粒⑹ 設有-能供LED晶粒⑹定位用的轉⑽）；及一能供㈣晶粒 (6)與電路層（2)電性連接的金屬導線(61)。 根據上述的多晶封裝單元，所騎歸體⑸是由一膠體 (50—)，及-能吸收短波長光，放出長波長光的螢光粉⑸）以 特定比例混合而成；而所述膠體⑽為卿、螢光粉⑸）的 • 材質為下列之一 ：YAG螢光粉、Μ螢光粉、RG螢光粉。 根據上述的多晶封裝單元，所述固定框⑷的形狀為下列 ·· 之一：圓形、方形、多角形。 ； 根據上述的多晶封裝單元，所述基板⑴的材《下列之 一：紹、銅、鎂合金。 根據上述的多晶封裝單元，所述電路層⑵的材質為 之一：銅、金、銀。 〜 根據上述的多晶封料元，所述絕緣層⑽的材質為下 列之-.金屬化合物、金屬氧化物、金屬氮化物、陶竟材料、 7 M339082 南分子材料。 根據上述的多晶封裝單元，所述固定框⑷的材質為下列 之一：金屬材料、陶瓷材料、高分子材料。 根據上述的多韻裝單元，所賴裝膠體⑸的厚度為下 列之一：等於該固定框⑷的厚度、大於該固定框⑷的厚度、 小於該固定框(4)的厚度。 . 二、對照先前技術之功效： 藉由本新型的實施可獲至下列優點： 1·使用多個LED晶粒（6)與基板⑴結合，並非傳統一基 板、一LED晶粒的結合方式，並且透過加設一固定框與一 =膠體=)，使兩者進—步穩固結合，直接製作成高亮度的 夕日曰縣單凡，藉此方式，與一般LED製程相比，能減少生產 過程中的工序，簡化製程，大幅降低生產成本，提高整體經 濟效益。 8 M339082 般同亮度的照明用LE：D相比較之下，厚度超薄，所佔空間小， 而且無豐影的問題，在薄型化的現代，除能降低成本外，還 能符合時代潮流。 【實施方式】 以下依據圖面所示的實施例詳細說明如後： • 如圖3所示為本新型的立體示意圖，如圖4所示為圖3 的B-B剖面示意圖。 • 圖中揭示出，一種多晶封裝單元，其特徵在於包括： 具咼政熱性，由金屬製成，呈薄平板狀的基板（1)，該 基板（1)設有一設於基板（1)表面的絕緣層（1〇)、一設於絕緣 層（10)頂侧，ab供電源線連接的電路層（2);及一設於電路層 (2)頂側，能供遮蓋電路用，具絕緣性的保護層; 至少一没於该保護層（3)表面，小於基板（1)，呈中空狀 的固定框（4); 數個設於該固定框（4)内，與電路層（2)電性連接的LED晶 粒（6);以及 一設於該固定框⑷内，且將LED晶粒⑹覆蓋，能透光的 封裴膠體(5)。 其中’將多個LED晶粒⑹與基板⑴結合，並透過加設一 中央鏤空的固定框(4)與-封袭膠體⑸，使兩者進一步穩固 結合，形成-高亮度的多晶塊單元，藉此方式，一次性的 達到需要的亮度，使用為高熱#'導材的基板⑴，取代低熱膨 脹係數陶£晶片基板’讓封裝内部的溫差變小，使孰流不會 呈局雜針’麟LEDW整體產㈣減，呈賴狀流至 9 M339082 封裝内部各角落，所以利用以高熱傳導材料的基板(1)，可提 高内部的熱擴散性。 並且能減少生產過程中加裝散熱器的工序，簡化製程， 降低生產成本，以提高整體經濟效益，更因本新型是將多個 LED晶粒（6)，依積少成多的原理，結合在一基板（丨）上，故能 … 獲得與HighPower LE：D比美的亮度，且發光效率、光源角度， • 比一般LED好且大，亮度更平均，亦無一般多Lm)燈有疊影的 問題。 其次，如果是設置固定框(4)内，設置100個]晶粒（6)， 當其中有一個故障時，其他99個]^!)晶粒（6)依然會亮，對整 體光源的影響”J、到可以忽略，與一般多LED燈不㈤，而當需 要更換本新型時，十分方便，與一般的SMDLED更換麻煩的狀 況，更是大不相同。 再者，本新型的亮度高低，能依廠商的需要，增加或減 少LED晶粒⑹數量，且因一體化的設置，使散熱性良好，如 • 使祕絲燈上，燈具不需要加設額外的散熱裝置，只要使 用燈罩即可散熱，细？飢咖粒⑹只_—個基板⑴， :· 所健間又小，所以整體的金屬材料使用能大幅減少，成本 、 能降低。 ，又再者’其由金屬製成’呈薄平板狀的基板⑴，能在四 周增設定減（11) ’以方便螺設安其他裝置上，使基板 ⑴能直接將熱量導出，相較一般的SMD LED，本新型的散執 及安裝維護性更佳。 … 另外本新型的党度及壽命，在與一般同亮度的照明用 M339082 LED相比較之下，因基板（1)面積較大，散熱更好，故不會有 LED晶粒（6)亮度變差’與壽命縮短的問題，有顯著性的提高， 且整體的厚度在2mm左右，厚度超薄，所佔空間小，在薄型化 的現代，除能降低成本外，還能符合時代潮流。 上述中，所述電路層（2)是由一N型導電電路(20)、及p型 … 導電電路(21)所組成。簡潔的設置，使LED晶粒（6)在安裝時， ， 能正確的安裝，以避免極性安裝錯誤，使裝置無法運作，增 加廢品，浪費資源。 上述中，所述LED晶粒⑹設有一能供LED晶粒⑹定位用 的銀膠（60);及一能供LE1D晶粒（6)與電路層（2)電性連接的金 屬導線（61)。其為一般所知悉的傳統技術，因此於後即不予 詳述。 上述中，所述封裝膠體（5)是由一膠體（50);及一能吸收 短波長光，放出長波長光的螢光粉（51)以特定比例混合而 成；而所述膠體(50)為AB膠、螢光粉(51)的材質為下列之一： • YAG螢光粉、ί^Β螢光粉、RG螢光粉。當使用不同的LE1D晶粒（6) 時’應對其變化，就要進行變更膠體（50)與螢光粉(51)，以 ; 完整的保護LED晶粒（6)，且發出正確的光，讓其能發揮出最 大且正確的功效。 上述中，所述固定框(4)的形狀為下列之一：圓形、方形、 多角形。其相較於一般的LED，燈光能更為多變，適用範圍更 多、更廣。 上述中’所述基板（1)的材質為下列之一：紹、銅、鎮合 金。選用散熱快、價格低、加工方便的金屬做為基板（1)用， 11 M339082 能減少成本，以大量生產。 上述中，所述電路層（2)的材質為下列之一：鋼、金、銀。 選用導電性佳，價格低，又不影響導熱的材質，做為電路用， 以提咼整體的運作效率，並減少故障率。 上述中，所述絕緣層（10)的材質為下列之一：金屬化合 物、金屬氧化物、金屬氮化物、高分子材料。選用無導電性， - 價格低，又獨響導熱的材質，進行實施，以提高散熱效率， 並減少漏電的可能性。 上述中，所述固定框⑷的材質為下列之一：金屬材料、 陶究材料、高分子材料。顧價格低、強度適合、耐久性佳 的材質，進行實施，以提高保護晶片的效果。 猎由上述得知’本新型依據廠商的需要，為求擁有最符 合規格的性能，能透過改變其上述各部分的材質，以迎合 費者的需求。 上述中，所述封裝膠體(5)的厚度為下列之一：等於該固 • 雜⑷的厚度、大於該固定框⑷的厚度、小於該固定框⑷ 的厚度。透過簡單的改變封裝膠體⑸的厚度，讓本新型的照 明特徵有所改變’能進-步增加適用的範圍。 ； __本新型在製法方面，如圖5〜7所示為本新型的製造流程 示思圖，圖8所示為本新型的製造流程方塊圖。 ® t揭示丨，搞型乡晶封裝單元的製妨法，其包括 下列步驟： 第步驟·將絕緣層〇〇)、電路層（2)、保護層（3)依序 认置於基板（1)上，是為基板前置處理(A)(如圖$〜6)。其目 12 M339082 的是將一設計的迴路設置於基板（1)上，以設置LE：D晶粒（6)。 第二步驟··將數個LED晶粒（6)，用表面黏著的方式，以 銀膠(60)設置於基板(1)上，是為固晶(如圖6)。其目的 是將一顆顆分離的LED晶粒（6)，放置在基板（1)上的電路層 (2)線路焊點上，並用銀膠(6〇)(Ερ〇χγ)黏著固定，而數個LED 晶粒（6)，可排列成各種排列的方式。 首先’要在黏著LED晶粒（6)的位置上，點上銀膠（6〇)， 此時稱為點膠，然後移至下一位置，將Lm)晶粒放置於其 上；而由經過切割的晶圓，所形成的LED晶粒（6)，則由取放 臂一顆一顆放置在已點膠的晶粒座上。 第三步驟··進行加溫，使LE：d晶粒（6)穩固，是為短烤（c); 其目的在於使LED晶粒（6)與基板（1)上，所黏著的銀膠（6〇)， 硬化’以確保晶粒穩固，及進行後續步驟時LED晶粒（6)不會 滑動。 第四步驟··以金屬導線(61)與電路層（2)連接，使LE])晶 粒（6)能將電子訊號外傳，是為焊線(D)(如圖6)。其是將led 晶粒（6)上的接點，以極細（18〜5〇咖）、金所製成的金屬導線 (61)，連接到基板（1)上電路層（2)所劃分出的N型導電電路 (20)與P型導電電路⑻，藉而將晶粒⑹的電路訊號直接 傳輸到基板（1)，再至外界。當導線架從彈匣内傳送至定位 後，應用電子影像處理技術，來確定^^晶粒“)上各個接點， 以及每一接點所相對應接點的位置，然後做嬋線的動作。 丈干線時，以LED晶粒（6)上的接點為第一焊點，板上 點則稱為第二焊點。 、接 13 M339082 首先’將金屬導線(61)之一端，燒結成小球，而後將小 球壓焊在第一點上（此稱為第一焊/FIRST BOND)。 接著依設計好的路徑拉金屬導線(61)，最後將金屬導線 (61)壓焊在第二焊點上（此稱為第二焊/sEcoNj) B〇ND)，同時 並拉斷第二焊點與鋼嘴間的金屬導線(61)，而完成一條金屬 導線(61)的焊線動作，接著便又結成小球，開始下一條金屬 導線(61)之焊線動作。 第五步驟：將一能包圍所有LED晶粒（6)的固定框(4)設置 於基板（1)上，是為安裝固定框(E)(如圖7)。其目的有以下幾 [1] 防止封膠時，封裝膠體(5)外流； [2] 使範圍内的封裝膠體(5)平整不變形。 女I固定框（E)的過程比較簡單，首先將能夠涵蓋所有 LED晶粒（6)、金屬導線(61)及線路範圍在内的固定框(4)，上 一層透明且黏性極佳的膠，並將固定框（4)之中心點，對正於 所有範圍的中心位置而固定。 第六步驟··以封裝膠體(5)，填入固定框(4)内，將LE1D晶 粒（6)與線路覆蓋，是為封膠(F)(如圖7)。其目的有以下幾點·· [1] 防止溼氣等由外部侵入； [2] 以機械方式支持導線； [3] 有效的將内部產生的熱排出於外部； [4] 提供能夠手持的形體。一M339082 VIII. New Description: [New Technology Field] The present invention relates to a polycrystalline package unit. [Prior Art] ~ The traditional surface mount device has a light-emitting diode structure, as shown in Fig. i and Fig. 2, and the Fuzhi--6 heat-dissipating table is converted into a light-emitting diode (7), which includes a high heat dissipation property. The substrate (8) and the substrate (8) are provided, and the colloid (73) for packaging is characterized in that the substrate (8) comprises: a metal plate (10), the substrate (8) is for supporting the support of the colloid (10), and has a plurality of The through hole (82), the insulating layer (8)) 'the thickness of the insulating layer (8) on the surface of the metal plate (10) and the inner wall of the through hole (4) is less than the thickness of the metal plate (10), and A circuit layer (74)' is disposed in the insulation and the through hole (82). The above-mentioned structure 'is to improve the traditional surface mount device LED (SMD LED) package, and the glass fiber printed circuit board has a high-dispersion material to improve the surface of the device (7 〇) Luminous efficiency, brightness and longevity.曰曰[New content] First, the problem to be solved: The surface-emitting device LED has the following touch points. 1. Metal plate (80), need to drill, and the hole 'edge material thunder攸sw, ― 调 遇 要 包覆 包覆 包覆 包覆 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调Because /^ is a simplification of the process, reducing the health of the work, and turning to the benefits, then (four) this new = M339082 purpose of one. 2. The substrate (8) can only be set for one die (70), and the brightness is limited. When it is necessary to measure the amount, it is necessary to solve the problem, the need for the secret is large, the circuit layout is complicated, and the heat is not good. will happen. So how do you make the grain? It is also the second purpose of this new type to increase the space requirement and improve the heat dissipation effect. 3. Because it is used as a lighting source, but the heat generated is still high, so it must be installed by the heat-receiving device, such as heat dissipation, water cooling device, etc., so in the manufacture of lamps and materials boxes The cost of returning to the car is the 'cost'. Therefore, 'how to reduce the cost of luminaire manufacturing and materials' has become the third objective of the present invention. 4. Although the 疋文t is on the metal sheet (8〇), because there is only one single crystal grain (70j, the luminous efficiency is still not much improved, and the brightness and life span are affected by the high temperature environment for a long time. Therefore, how to improve the luminous efficiency, brightness and life fineness has become the fourth purpose of this new type. Second, the technical means of the new model: The purpose of the new model is to provide a simplified process, good heat dissipation and high brightness. Polycrystalline package unit and manufacturing method. In order to solve the aforementioned problems and the new purpose of Daxian, the novel technical means, as described below, is a fresh-crystal package unit, which is characterized in that: it has a heat of return and * metal (four) and a plate-shaped substrate (1) having an insulating layer (10) disposed on a surface of the substrate (1), a circuit layer (2) disposed on the insulating layer α〇), and a circuit layer (2) disposed on the circuit layer (2) 6 M339082 a protective layer (3) capable of covering the circuit and having an insulating property; at least one fixing frame (4) disposed on the surface of the protective layer (3) and smaller than the substrate (!) and having a hollow shape; Fixed frame (4) The LED die (6) electrically connected to the circuit layer (2); and - the cover colloid (5) in the frame (4) of the Xia 111 and the (4) D die (6). According to the above polycrystalline package unit, the circuit layer (2) is composed of an N-type conductive circuit (20) and a p-type conductive circuit (21). According to the above-mentioned W Xiang (9) anger unit, its 彳 pepper lies in the shame of the ED die (6) - can be used for the positioning of the LED die (6) (10); and one can supply (4) the die (6) and the circuit layer ( 2) Electrically connected metal wires (61). According to the above polycrystalline package unit, the riding body (5) is formed by mixing a specific colloid (50-), and - a phosphor powder (5) capable of absorbing short-wavelength light and emitting long-wavelength light; The colloid (10) is Qing, fluorescent powder (5)) • The material is one of the following: YAG fluorescent powder, Μ fluorescent powder, RG fluorescent powder. According to the above polycrystalline package unit, the shape of the fixing frame (4) is one of the following: a circle, a square, and a polygon. According to the above polycrystalline package unit, the material of the substrate (1) is one of the following: a copper, a magnesium alloy. According to the above polycrystalline package unit, the circuit layer (2) is made of one of materials: copper, gold, and silver. ~ According to the polycrystalline sealing material described above, the insulating layer (10) is made of the following materials: a metal compound, a metal oxide, a metal nitride, a ceramic material, and a 7 M339082 south molecular material. According to the above polycrystalline package unit, the fixing frame (4) is made of one of the following materials: a metal material, a ceramic material, and a polymer material. According to the above multi-fitting unit, the thickness of the rubber (5) to be attached is one of the following: equal to the thickness of the fixing frame (4), larger than the thickness of the fixing frame (4), and smaller than the thickness of the fixing frame (4). Second, according to the efficacy of the prior art: With the implementation of the present invention, the following advantages can be obtained: 1. The use of a plurality of LED dies (6) combined with the substrate (1) is not a combination of a conventional substrate and an LED die, and By adding a fixed frame and a = colloid =), the two can be stably combined and directly produced into a high-brightness Xixian County, which can reduce the production process compared with the general LED process. The process simplifies the process, greatly reduces production costs, and improves overall economic efficiency. 8 M339082 Compared with LE:D, the brightness of the same brightness is small, the space is small, and there is no problem of rich shadow. In the modernization of thinning, in addition to reducing the cost, it can also conform to the trend of the times. [Embodiment] The following is a detailed description of the following embodiments in accordance with the embodiments shown in the drawings: • FIG. 3 is a perspective view of the present invention, and FIG. 4 is a cross-sectional view taken along line B-B of FIG. • The figure discloses a polycrystalline package unit, characterized by comprising: a substrate (1) made of metal and having a thin flat plate, and the substrate (1) is provided with a substrate (1) The surface of the insulating layer (1〇), one on the top side of the insulating layer (10), a circuit layer (2) for the power line connection, and one on the top side of the circuit layer (2), can be used for covering the circuit, An insulating protective layer; at least one fixed frame (4) which is smaller than the surface of the protective layer (3) and smaller than the substrate (1); and is disposed in the fixing frame (4) and the circuit layer (2) an electrically connected LED die (6); and a sealing colloid (5) disposed in the fixing frame (4) and covering the LED die (6) to transmit light. Wherein, a plurality of LED dies (6) are combined with the substrate (1), and a central hollowed-out fixing frame (4) and a sealant colloid (5) are added to further firmly combine the two to form a high-brightness polycrystalline block unit. In this way, the required brightness can be achieved at one time, and the substrate (1) which is a high-heat material is used instead of the low thermal expansion coefficient. The temperature difference inside the package is made small, so that the turbulence does not become a needle. 'Lin LEDW's overall production (four) minus, flowing to 9 M339082 inside the package, so the use of high thermal conductivity material substrate (1), can improve the internal thermal diffusivity. Moreover, the process of installing a radiator in the production process can be reduced, the process can be simplified, the production cost can be reduced, and the overall economic benefit can be improved, and the novel is a combination of multiple LED dies (6). On a substrate (丨), it can... Get better brightness than HighPower LE:D, and the luminous efficiency, light source angle, • Better and larger than the average LED, the brightness is more average, and there is no more than Lm) The problem. Secondly, if it is set in the fixed frame (4), set 100] die (6), when there is one fault, the other 99]^!) die (6) will still be bright, affecting the overall light source "J, can be neglected, and the general multi-LED lights are not (five), and when it is necessary to replace the new type, it is very convenient, and the situation of the troublesome replacement of the general SMDLED is very different. Moreover, the brightness of the new type is high, According to the needs of the manufacturer, the number of LED dies (6) can be increased or decreased, and the heat dissipation is good due to the integrated setting. For example, the illuminating lamp does not need to be provided with additional heat sinks, as long as the lampshade is used. Heat dissipation, fineness, hunger and granules (6) only _-substrate (1), :· The size of the joint is small, so the overall use of metal materials can be greatly reduced, the cost can be reduced, and the other is 'made of metal' The thin flat substrate (1) can be set and reduced (11)' around it to facilitate the screwing of other devices, so that the substrate (1) can directly derive heat. Compared with the general SMD LED, the new type of dispersal and installation and maintenance Better sex. ... In addition to the new party Compared with the general M339082 LED with the same brightness, the life of the substrate (1) is larger and the heat dissipation is better, so there is no problem that the LED die (6) has poor brightness and shortened life. There is a significant improvement, and the overall thickness is about 2mm, the thickness is ultra-thin, and the space occupied is small. In the modernization of thinning, in addition to reducing the cost, it can also conform to the trend of the times. In the above, the circuit layer (2) ) is composed of an N-type conductive circuit (20) and a p-type... conductive circuit (21). The simple setting enables the LED die (6) to be properly mounted during installation to avoid polarity mounting errors. In order to make the device inoperable, increase waste, and waste resources. In the above, the LED die (6) is provided with a silver paste (60) for positioning the LED die (6); and a LE1D die (6) and circuit The layer (2) is electrically connected to the metal wire (61), which is a conventionally known conventional technique, and therefore will not be described in detail later. In the above, the encapsulant (5) is composed of a colloid (50); And a phosphor powder (51) capable of absorbing short-wavelength light and emitting long-wavelength light, mixed in a specific ratio The colloid (50) is made of AB glue or phosphor powder (51) and is made of one of the following materials: • YAG phosphor powder, ίΒ phosphor powder, RG phosphor powder. When different LE1D crystals are used. When the particle (6) is changed, it is necessary to change the colloid (50) and the phosphor powder (51) to completely protect the LED die (6) and emit the correct light to maximize its performance. In the above, the shape of the fixing frame (4) is one of the following: circular, square, polygonal. Compared with the general LED, the light can be more varied, and the application range is more. Further, the material of the substrate (1) is one of the following: Shao, copper, and alloy. Metals with fast heat dissipation, low price and easy processing are used as the substrate (1). 11 M339082 can reduce costs and mass production. In the above, the material of the circuit layer (2) is one of the following: steel, gold, silver. Use materials with good conductivity, low price, and no influence on heat conduction, as a circuit, to improve the overall operating efficiency and reduce the failure rate. In the above, the insulating layer (10) is made of one of the following: a metal compound, a metal oxide, a metal nitride, or a polymer material. Use non-conducting, low-cost, and unique heat-conducting materials to improve heat dissipation and reduce the possibility of leakage. In the above, the fixing frame (4) is made of one of the following materials: a metal material, a ceramic material, and a polymer material. Materials that are low in price, suitable in strength, and excellent in durability are implemented to improve the effect of protecting the wafer. Hunting is known from the above. According to the needs of the manufacturers, the new model can meet the needs of the consumers by changing the materials of the above-mentioned parts in order to have the best performance. In the above, the thickness of the encapsulant (5) is one of the following: equal to the thickness of the solid (4), greater than the thickness of the fixing frame (4), and smaller than the thickness of the fixing frame (4). By simply changing the thickness of the encapsulant (5), the illumination characteristics of the present invention are changed, and the range of application can be further increased. __ This new method in the manufacturing process, as shown in Figures 5 to 7, is a schematic diagram of the manufacturing process of the new type, and Figure 8 is a block diagram of the manufacturing process of the present invention. ® t reveals the method of making the enamel package unit, which includes the following steps: the first step: the insulating layer 〇〇), the circuit layer (2), and the protective layer (3) are sequentially placed on the substrate (1) ), is for the substrate pre-processing (A) (as shown in Figures 〜6). Its purpose 12 M339082 is to set a design loop on the substrate (1) to set the LE:D die (6). The second step is to set a plurality of LED dies (6) on the substrate (1) by means of surface adhesion, which is a solid crystal (Fig. 6). The purpose is to place a separate LED die (6) on the circuit layer (2) solder joint on the substrate (1) and fix it with silver glue (6〇) (Ερ〇χγ). Several LED dies (6) can be arranged in a variety of arrangements. First of all, 'At the position where the LED die (6) is adhered, silver glue (6〇) is spotted, which is called dispensing, and then moved to the next position, where the Lm) grains are placed; After the diced wafer, the formed LED dies (6) are placed one by one on the glued die pad by the pick and place arms. The third step is to heat the LE:d grains (6) to be short-baked (c); the purpose is to make the silver paste adhered to the LED die (6) and the substrate (1). (6〇), hardened to ensure grain stability, and the LED die (6) does not slip when the subsequent steps are performed. The fourth step is to connect the metal wire (61) to the circuit layer (2) so that the LE]) crystal grain (6) can transmit the electronic signal, which is the bonding wire (D) (Fig. 6). The metal wire (61) made of a very thin (18~5 〇), gold is connected to the circuit layer (2) on the substrate (1) by a contact on the led die (6). The N-type conductive circuit (20) and the P-type conductive circuit (8), thereby transmitting the circuit signal of the die (6) directly to the substrate (1), and then to the outside. After the lead frame is transferred from the magazine to the positioning, electronic image processing technology is applied to determine the positions of the contacts on the ^^ die and the corresponding contacts of each contact, and then perform the action of the twisting line. When the trunk line is used, the contact point on the LED die (6) is the first solder joint, and the on-board point is called the second solder joint. Then, 13 M339082 firstly, one end of the metal wire (61) is sintered. The ball is then welded to the first point (this is called the first welding / FIRST BOND). Then the metal wire (61) is pulled according to the designed path, and finally the metal wire (61) is pressure welded. On the second solder joint (this is called second solder/sEcoNj) B〇ND), and simultaneously break the metal wire (61) between the second solder joint and the steel nozzle, and complete the wire bonding action of a metal wire (61) Then, it is formed into a small ball to start the welding action of the next metal wire (61). The fifth step: a fixing frame (4) capable of surrounding all the LED chips (6) is disposed on the substrate (1), It is for mounting the fixing frame (E) (Fig. 7). Its purpose is as follows [1] to prevent the encapsulation colloid (5) from flowing out when sealing, [2] to make the encapsulation colloid in the range ( 5) Flat and not deformed. The process of female I fixed frame (E) is relatively simple. Firstly, it will cover all the LED dies (6), metal wires (61) and the line frame (4), the upper layer is transparent. And the adhesive is excellent in adhesion, and the center point of the fixing frame (4) is fixed to the center position of all the ranges. The sixth step··filling the fixing frame (4) with the encapsulating colloid (5) The LE1D die (6) and the line cover are used for sealing (F) (see Figure 7). The purpose is as follows: [1] Prevent moisture from entering from the outside; [2] Mechanically Support wire; [3] Effectively discharges internally generated heat to the outside; [4] Provides a form that can be held by hand.
封膠(F)_^鮮純，首先將完成上述各步驟的基板 ⑴’放置於_上’並先行韻，再將_置於麵機(MOLD 14 M339082 PRESS)上的封裝模。 先〜透光之相的賴(5g)(sil⑽雜，並覆蓋至 晶體頂端待乾顺_電子影像處理技術 ，來確定LED晶粒 ⑹、金屬導線(61)是賴定於正確位置，且接觸正常。 而後將高透日轉體⑽料絲⑻，作—比例之調配 (依色服而求作比例分配），並將此-混合的封裝膠體⑸化合 . _熱’亦準備好投入封㈣上的樹脂進料口。 啟動機器後’壓模機壓下，封閉上下模，再將半溶化後 之封裝膠體⑸擠人針，觸歸體⑸填充至固定框⑷頂 端之水平面後，開模取出成品。 …第七步驟：進行加溫’使封裝膠體⑸，完全乾酒、包覆， 以固結構’疋為長烤(G)。其可以確储裝賴⑸内部完 全乾酒、包覆’以免結構不穩，造成金屬導線㈤鬆脫，增 加不良率的發生。 其中，金屬製的基板⑴，經過前置處理之後，配合其上 φ 纟夕飢ED曰曰粒⑹’依然保有良好的散熱性，能快速的將敎 量帶^與-般的SDM LED不同，能提供使用者一種照明範圍 : 大、尚壳度、咼散熱的多晶封裳單元。 : 其次’將所需要的⑽晶粒⑹，先行組合於基板⑴上， 如此便不需要進行多次的分割（singl_iQn)、測試 (testing)、及分類（SGrting)等流程，能加速生產過程，而 在整體工序方面，相對來講比傳統SMD⑽加工的工序為少。 再者，上述步驟中，所提及的部分技術，為—般所知悉 的傳統技術，因此於後即不予詳述。 15 M339082 而上述中的電路層（2)則是藉由下列之一方法所形成··化 學鍍膜法、物理鍍膜法、貼附法。依絕緣層（1〇)的不同、使 用者的需要，使用相應對的方法，以符合需要及降低成本。 另外，絕緣層（10)則能藉由下列之一方法所產生：熱氧 化法、氣相沈積、陽極處理。依基板⑴的不同、絕緣層（1〇) 的材質、使用者的需要，使用相應對的方法，以符合需要及 降低成本。 還有，其固定框（4)是藉由黏貼的方式設置於基板g) 上。是為最方便的方式，能將固定框(4)定位，避免在填充封 I膠體（5)時，固定框(4)位移，造成不良率上升。 其組裝及結合方式如圖5〜7所示，先將基板（1)，拿去 做前置處理，依序將絕緣層（1〇)、電路層（2)、保護層（3)設 置於基板（1)上，再將數個LED晶粒（6)，用表面黏著的方式， 以銀膠⑽)設置於基板⑴上，進行加溫，使各㈣晶粒⑹ 一端與電路層⑵電性連接，隨後LED晶粒⑹另端，拉一金 屬導線(61)，與電路層⑵躲連接，緊接著，固定框⑷設 :土板（1)上並將Led晶粒（6)包圍在内，之後在固定框 (^)内，加入以特定比例混合而成的膠體(50)與螢光粉(51)， 最後以一疋的溫度及時間，進行加溫，使封裝膠體（5)硬化， 再、、、工過後I貝的包裝’便完成本新型。經過上述的步驟，能得 知本新型較-般傳統，不浪費材料，節省成本，能提高經 濟效益。 以上依據圖式所示的實施例詳細說明了本新型的構造、 特效及作帛效果，由於符合賴及進步性要件，遂纽法提 16 M339082 出新型專利申請；惟以上所述僅為本創作之較佳實施例，但 本創作不以圖面所示限定實施範圍，因此舉凡與本創作意旨 相符的修飾性變化，只要在均等範圍内都應涵屬於本創作專 利範圍内。The sealant (F) _^ is fresh, firstly, the substrate (1)' which has completed the above steps is placed on the _ upper side, and then the stencil is placed on the mold (MOLD 14 M339082 PRESS). First, the light-transmitting phase of the Lai (5g) (sil(10) impurity, and covered to the top of the crystal to be dry _ electron image processing technology to determine that the LED die (6), metal wire (61) is in the correct position, and contact Normally, the high-transparent day-turning body (10) filament (8) is used as a proportioning ratio (proportional distribution according to the color suit), and the mixed-packaged colloid (5) is combined. _Hot' is also ready to be put into the seal (4) After the machine is started, the presser presses down, closes the upper and lower molds, and then squeezes the semi-dissolved encapsulant (5) into the needle. After the touch body (5) is filled to the level of the top of the fixed frame (4), the mold is opened. Take out the finished product. ...The seventh step: heating the 'encapsulation colloid (5), completely dry wine, coated, solid structure '疋 long-baked (G). It can be surely stored in the interior (5) completely dry wine, coated 'In order to avoid structural instability, the metal wire (5) is loosened, which increases the occurrence of defective rate. Among them, the metal substrate (1), after pre-treatment, matches the φ 纟 饥 曰曰 曰曰 曰曰 ( ( ( ( ( 依然Heat dissipation, can quickly take the amount of ^ and the general SDM LED It can provide users with a range of illumination: large, still shell, heat-dissipating polycrystalline sealing unit. : Next, 'require the required (10) grain (6) to be combined on the substrate (1) first, so that it does not need to be repeated multiple times. The processes of segmentation (singl_iQn), testing, and classification (SGrting) can speed up the production process, and in terms of overall processes, relatively less processing than conventional SMD (10) processing. Furthermore, in the above steps, Some of the techniques mentioned are conventional techniques that are generally known, and therefore will not be described in detail later. 15 M339082 The above circuit layer (2) is formed by one of the following methods. , physical coating method, attachment method. According to the different insulation layers (1〇), the user needs to use the corresponding method to meet the needs and reduce costs. In addition, the insulation layer (10) can be used by the following A method produces: thermal oxidation, vapor deposition, and anode treatment. Depending on the substrate (1), the material of the insulation layer (1〇), and the needs of the user, the corresponding method is used to meet the needs and reduce the cost. , Fixed frame (4) is provided by the adhesive on the substrate g). It is the most convenient way to position the fixing frame (4) to avoid the displacement of the fixing frame (4) when filling the sealing gel (5), resulting in an increase in the defect rate. The assembly and bonding methods are as shown in Figures 5 to 7. First, the substrate (1) is taken for pre-processing, and the insulating layer (1 〇), the circuit layer (2), and the protective layer (3) are sequentially disposed. On the substrate (1), a plurality of LED dies (6) are placed on the substrate (1) by means of surface adhesion, and silver (10) is applied to the substrate (1) for heating, so that one end of each (4) die (6) and the circuit layer (2) are electrically charged. Sexual connection, then the other end of the LED die (6), pull a metal wire (61), and the circuit layer (2) to hide, and then, the fixed frame (4) is set: the soil plate (1) and the Led die (6) Inside, then in the fixed frame (^), the colloid (50) and the phosphor powder (51) mixed in a specific ratio are added, and finally, the temperature is heated at a temperature and time to harden the encapsulant (5). , and then, after the work, I shell packaging 'will complete this new type. Through the above steps, it can be known that the new type is more traditional, without wasting materials, saving costs, and improving economic efficiency. The above structure, special effects and smashing effect are explained in detail according to the embodiment shown in the figure. Due to the compliance with the progressive requirements, the new patent application of New Zealand 16 M339082 is only for the present application. The preferred embodiments are not limited by the scope of the present invention, and thus modifications that are consistent with the spirit of the present invention are intended to fall within the scope of the present invention as long as they are within the scope of the present invention.
17 M339082 【圖式簡單說明】 圖1:舊式表面黏著裝置發光二極體的立體示意圖。 圖2 :為圖1的A-A剖面示意圖。 圖3:本新型的立體示意圖。 圖4 :為圖3的B-B剖面示意圖。 圖5〜圖7:本新型的製造流程示意圖。 圖8:本新型的製造流程方塊圖。 【主要元件符號說明】17 M339082 [Simple description of the diagram] Figure 1: Stereoscopic diagram of the LED of the old surface adhesion device. Figure 2 is a cross-sectional view taken along line A-A of Figure 1. Figure 3: A perspective view of the novel. Figure 4 is a cross-sectional view taken along line B-B of Figure 3. Figure 5 to Figure 7: Schematic diagram of the manufacturing process of the present invention. Figure 8: Block diagram of the manufacturing process of the present invention. [Main component symbol description]
1 基板 10 絕緣層 11 定位孔 2 電路層 20 N型導電電路 21 P型導電電路 3 保護層 4 固定框 5 封裝膠體 50 膠體 51 螢光粉 6 LED晶粒 60 銀膠 61 金屬導線 7 表面黏著裝置發光二極體 70 晶粒 18 M3390821 Substrate 10 Insulation layer 11 Positioning hole 2 Circuit layer 20 N-type conductive circuit 21 P-type conductive circuit 3 Protective layer 4 Fixing frame 5 Package colloid 50 Colloid 51 Fluorescent powder 6 LED die 60 Silver glue 61 Metal wire 7 Surface bonding device Light Emitting Body 70 Grain 18 M339082
71 金屬導線 72 銀膠 73 膠體 74 電路層 75 N型導電銅箔 76 P型導電銅箔 8 基板 80 金屬板材 81 絕緣層 82 貫穿孔 A 基板前置處理 B 固晶 C 短烤 D 焊線 E 安裝固定框 F 封膠 G 長烤71 Metal wire 72 Silver glue 73 Colloid 74 Circuit layer 75 N type conductive copper foil 76 P type conductive copper foil 8 Substrate 80 Metal plate 81 Insulation layer 82 Through hole A Substrate pretreatment B Solid crystal C Short roast D Solder wire E Installation Fixed frame F sealant G long baked