CN202423286U - 一种led集成式点光源 - Google Patents

一种led集成式点光源 Download PDF

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Publication number
CN202423286U
CN202423286U CN2011205750580U CN201120575058U CN202423286U CN 202423286 U CN202423286 U CN 202423286U CN 2011205750580 U CN2011205750580 U CN 2011205750580U CN 201120575058 U CN201120575058 U CN 201120575058U CN 202423286 U CN202423286 U CN 202423286U
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China
Prior art keywords
led
light source
source
electrical layer
aluminium base
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Expired - Fee Related
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CN2011205750580U
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English (en)
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李佳伟
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Hangzhou Regent Au Optronics Co
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HANGZHOU LIJING LIGHTING CO Ltd
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909Post-treatment of the connector or wire bonding area
    • H01L2224/8592Applying permanent coating, e.g. protective coating

Abstract

本实用新型公开了一种LED集成式点光源,包括若干个LED光源,每个LED光源内部包含若干个LED芯片,还包括铝基板,所述铝基板上设有电气层,LED芯片有两个电极,其中一个电极通过金球与金线的一端连接,另一个电极直接封装在电气层上,金线的另一端与电气层连接,LED芯片上封装有荧光胶层,荧光胶层上还灌封有透明胶层。本实用新型将LED芯片直接封装在铝基板的电气层上,具有加快散热、提高LED光效的优点,节省了材料成本和生产成本,降低了LED灯每瓦特的单位成本。

Description

一种LED集成式点光源
技术领域
[0001] 本实用新型涉及LED光源技术领域,特别涉及一种集成式LED点光源。
背景技术
[0002] LED光源,又称半导体发光二极管,是一种新型环保节能光源,正越来越广泛的应用于各照明领域,LED在工作期间也会产生热量,产生的热量多少取决于LED光源整体的发光效率。而利用LED光源制成的LED灯工作是否稳定,品质的好坏,与灯体本身散热性能息息相关。目前市场上的高亮度LED灯的散热,通常采用自然散热方式,但效果并不理想,一旦LED灯不能很好地散热、它的使用寿命也会受到影响。
[0003] 按LED灯发光方式的不同一般可将LED封装分为两大类:点光源和面光源。点光源是将LED芯片通过固晶-短烤-焊线-前测-灌胶-长烤等工序安装在支架上,常规LED支架由塑料和部分金属组成,少数由陶瓷组成。封装完成后再通过回流焊接或手工焊接在铝基板上。这种封装在支架上的LED产品在LED芯片-支架间由于需要热电分离,故中间会有一个绝缘层,此绝缘层会对LED芯片工作中产生的热量有阻隔的作用,不利于芯片的散热。而由于支架-铝基板间同样会由于受到支架导热系数影响的热阻,两者叠加将非常不利于LED芯片的散热。面光源是在芯片上覆上一层厚度达2-3mm的荧光胶,如此,既不利于LED芯片的散热,也由于过厚的荧光胶降低了 LED灯的光效。
实用新型内容
[0004] 为了克服上述现有技术存在的缺陷,本实用新型提供一种新型环保节能的集成式LED点光源。
[0005] 为了实现上述目的,本实用新型的技术方案如下:
[0006] —种LED集成式点光源,包括若干个LED光源,每个LED光源内部包含若干个LED芯片,还包括铝基板,所述铝基板上设有电气层,LED芯片有两个电极,其中一个电极通过金球与金线的一端连接,另一个电极直接封装在电气层上,降低绝缘层厚度,减少了热阻,金线的另一端与电气层连接,导通LED芯片与电气层的电流。
[0007] 本实用新型LED芯片上封装有荧光胶层,荧光胶层上还灌封有透明胶层,以保护芯片和金线。
[0008] 本实用新型铝基板上设有将LED光源包围住的塑料圈,铝基板边缘还设有定位孔,定位孔旁设有两个焊盘,所述LED集成式点光源通过焊盘连接电源线。
[0009] 本实用新型的有益效果是,本实用新型LED芯片到铝基板间只有35um的高绝缘低热阻的绝缘层,大大减小了 LED散热的热阻。从而提高了 LED芯片工作的可靠性,降低了LED芯片由于温度过高而产生较大光衰。并且完全省去了 LED支架的材料成本和回流焊加工的生产成本,降低了 LED灯每瓦特的单位成本,更加利于环保节能的LED灯全面推广。
附图说明[0010] 图I是本实用新型每一个LED光源的结构图;
[0011] 图2是本实用新型光源俯视图。
[0012] 图中,I、金球,2、金线,3、铝基板,4、透明胶层,5、电气层,6、荧光胶层,7、LED芯片,8、LED光源,9、定位孔,10、焊盘,11、塑料圈。
具体实施方式:
[0013] 为了使本实用新型的创作特征、技术手段与达成目的易于明白理解,以下结合附图进一步阐述本实用新型。
[0014] 参看图I和图2,本实用新型LED集成式点光源,包括若干个LED光源8,每个LED 光源8内部包含若干个LED芯片7,还包括铝基板3,铝基板3上设有电气层5,LED芯片7有两个电极,其中一个电极通过金球I与金线2的一端连接,另一个电极可通过银胶直接封装在电气层5上,使LED芯片7固定在电气层5上并导通电流,金线2的另一端与电气层5连接,导通LED芯片7与电气层5的电流,LED芯片7上封装有荧光胶层6,荧光胶层6上还灌封有透明胶层4,透明胶层4可以是树脂。铝基板3上设有将LED8包围住的塑料圈11,铝基板3边缘还设有定位孔9,定位孔9旁设有两个焊盘10,所述LED光源通过焊盘10连接外界电源线。
[0015] 金球I和金线2的制作材料为金属金。
[0016] 以上显示和描述了本实用新型的基本原理、主要特征和本实用新型的优点。本行业的技术人员应该了解,本实用新型不受上述实施例的限制,上述实施例和说明书中描述的只是说明本实用新型的原理,在不脱离本实用新型精神和范围的前提下本实用新型还会有各种变化和改进,这些变化和改进都落入要求保护的本实用新型范围内。本实用新型要求保护范围由所附的权利要求书及其等同物界定。

Claims (3)

1. 一种LED集成式点光源,包括若干个LED光源,姆个LED光源内部包含若干个LED芯片,还包括铝基板,其特征在于,所述铝基板上设有电气层,LED芯片有两个电极,其中ー个电极通过金球与金线的一端连接,另ー个电极直接封装在电气层上,金线的另一端与电气层连接。
2.根据权利要求I所述的ー种LED集成式点光源,其特征在于,所述LED芯片上封装有荧光胶层,荧光胶层上还灌封有透明胶层。
3.根据权利要求2所述的ー种LED集成式点光源,其特征在干,所述铝基板上设有将LED光源包围住的塑料圈,铝基板边缘还设有定位孔,定位孔旁设有两个焊盘,所述LED集成式点光源通过焊盘连接电源线。
CN2011205750580U 2011-12-27 2011-12-27 一种led集成式点光源 Expired - Fee Related CN202423286U (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106764561A (zh) * 2016-12-27 2017-05-31 江苏稳润光电科技有限公司 一种基于倒装led芯片真空封装的一体式灯具及制作方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106764561A (zh) * 2016-12-27 2017-05-31 江苏稳润光电科技有限公司 一种基于倒装led芯片真空封装的一体式灯具及制作方法

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C56 Change in the name or address of the patentee

Owner name: HANGZHOU LIJING OPTOELECTRONICS CO., LTD.

Free format text: FORMER NAME: HANGZHOU LIJING LIGHTING CO., LTD.

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Address after: 311199 Zhejiang province Hangzhou Yuhang District Nanyuan Street Highland Village

Patentee after: Hangzhou Regent Au Optronics Co

Address before: 311100 Zhejiang province Hangzhou Yuhang District Nanyuan Street Highland Village

Patentee before: Hangzhou Lijing Lighting Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120905

Termination date: 20171227