CN103022335B - Led倒装芯片dpc陶瓷基板电子制冷一体化模组及其制作方法 - Google Patents
Led倒装芯片dpc陶瓷基板电子制冷一体化模组及其制作方法 Download PDFInfo
- Publication number
- CN103022335B CN103022335B CN201210519963.3A CN201210519963A CN103022335B CN 103022335 B CN103022335 B CN 103022335B CN 201210519963 A CN201210519963 A CN 201210519963A CN 103022335 B CN103022335 B CN 103022335B
- Authority
- CN
- China
- Prior art keywords
- dpc
- substrate
- heat conduction
- thermal resistance
- low thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 96
- 239000000919 ceramic Substances 0.000 title claims abstract description 89
- 238000001816 cooling Methods 0.000 title claims abstract description 57
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 31
- 238000007789 sealing Methods 0.000 claims abstract description 12
- 238000004806 packaging method and process Methods 0.000 claims abstract description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 24
- 230000010354 integration Effects 0.000 claims description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
- 241000218202 Coptis Species 0.000 claims description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 6
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 239000011224 oxide ceramic Substances 0.000 abstract 1
- 229910052574 oxide ceramic Inorganic materials 0.000 abstract 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 abstract 1
- 238000005286 illumination Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005057 refrigeration Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 238000005474 detonation Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210519963.3A CN103022335B (zh) | 2012-12-07 | 2012-12-07 | Led倒装芯片dpc陶瓷基板电子制冷一体化模组及其制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210519963.3A CN103022335B (zh) | 2012-12-07 | 2012-12-07 | Led倒装芯片dpc陶瓷基板电子制冷一体化模组及其制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103022335A CN103022335A (zh) | 2013-04-03 |
CN103022335B true CN103022335B (zh) | 2015-06-03 |
Family
ID=47970682
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210519963.3A Active CN103022335B (zh) | 2012-12-07 | 2012-12-07 | Led倒装芯片dpc陶瓷基板电子制冷一体化模组及其制作方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103022335B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104465956A (zh) * | 2014-12-31 | 2015-03-25 | 深圳市晶台股份有限公司 | 一种一体化led的封装结构 |
CN107178714A (zh) * | 2017-06-08 | 2017-09-19 | 苏州晶品新材料股份有限公司 | 一种大功率多色贴片式led光源 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1873973A (zh) * | 2006-06-19 | 2006-12-06 | 朱建钦 | 一种大功率半导体发光元件的封袋 |
CN102519001A (zh) * | 2011-12-16 | 2012-06-27 | 重庆科鹰电气有限公司 | 车用 led前照灯 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101463984A (zh) * | 2007-12-17 | 2009-06-24 | 富士迈半导体精密工业(上海)有限公司 | 照明装置 |
US20100127299A1 (en) * | 2008-11-25 | 2010-05-27 | Cooper Technologies Company | Actively Cooled LED Lighting System and Method for Making the Same |
-
2012
- 2012-12-07 CN CN201210519963.3A patent/CN103022335B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1873973A (zh) * | 2006-06-19 | 2006-12-06 | 朱建钦 | 一种大功率半导体发光元件的封袋 |
CN102519001A (zh) * | 2011-12-16 | 2012-06-27 | 重庆科鹰电气有限公司 | 车用 led前照灯 |
Also Published As
Publication number | Publication date |
---|---|
CN103022335A (zh) | 2013-04-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN201117676Y (zh) | 集成微结构的大功率发光二极管封装结构 | |
CN102610735B (zh) | 一种具有电热分离结构的发光器件及其制造方法 | |
CN102034925B (zh) | 平板倒装焊GaN基LED芯片结构 | |
CN201787386U (zh) | 一种照明用金属基板led模组 | |
CN201576701U (zh) | Led灯芯片金属散热装置 | |
CN101984510A (zh) | 基于液态金属基底的软性连接的led装置 | |
TW201330337A (zh) | 發光二極體晶片之結構、發光二極體封裝基板之結構、發光二極體封裝結構及其製法 | |
CN103022335B (zh) | Led倒装芯片dpc陶瓷基板电子制冷一体化模组及其制作方法 | |
Cheng | Thermal management of high-power white LED package | |
CN102969438A (zh) | Led用蓝宝石支架 | |
CN202616297U (zh) | 一种高功率led散热陶瓷基板 | |
TW201429009A (zh) | 發光二極體裝置及散熱基板的製造方法 | |
CN204011481U (zh) | 电热分离并集成led芯片的高反射率电路板 | |
CN203950803U (zh) | 发光器件 | |
CN202523755U (zh) | 一种具有热电分离结构的发光器件 | |
CN204227119U (zh) | 一种led灯丝 | |
CN205264751U (zh) | 一种低热阻led光源 | |
CN203260619U (zh) | 新型高导热cob基板 | |
CN208422957U (zh) | 一种集成式led多芯片三维封装光源 | |
CN203746850U (zh) | 一种全方位出光的高效led模组器件 | |
CN102646673A (zh) | 高集成高光效的热电分离功率型发光二极体及封装方法 | |
CN203434195U (zh) | 一种热电分离的cob封装结构 | |
CN201570516U (zh) | 一种led封装结构 | |
CN203671320U (zh) | 一种集成led驱动光源 | |
CN202712254U (zh) | 具有高集成高光效的热电分离功率型发光二极体 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
DD01 | Delivery of document by public notice |
Addressee: Zhao Jianguang Document name: Notification of Patent Invention Entering into Substantive Examination Stage |
|
ASS | Succession or assignment of patent right |
Free format text: FORMER OWNER: HUANG LIEWU DING PING Effective date: 20140208 Owner name: NANJING ZHONGJIANG NEW MATERIAL TECHNOLOGY CO., LT Free format text: FORMER OWNER: ZHAO JIANGUANG Effective date: 20140208 |
|
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: NANJING, JIANGSU PROVINCE TO: 211161 NANJING, JIANGSU PROVINCE |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20140208 Address after: Binjiang Development Zone in Nanjing City, Jiangsu province 211161 Sheng Road No. 739 Binjiang branch 412-416 Applicant after: Nanjing Zhongjiang New Material Technology Co., Ltd. Address before: Binjiang Development Zone in Nanjing City, Jiangsu province Sheng Road No. 739 Binjiang branch 412-416 Applicant before: Zhao Jianguang Applicant before: Huang Liewu Applicant before: Ding Ping |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Integrated electronic cooling module of diaphragm panel ceramic (DPC) substrate of light-emitting diode (LED) flip chip and manufacturing method of integrated electronic cooling module Effective date of registration: 20200302 Granted publication date: 20150603 Pledgee: Bank of Nanjing Co., Ltd. Jiangning sub branch Pledgor: Nanjing Zhongjiang New Material Technology Co., Ltd. Registration number: Y2020980000399 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220225 Granted publication date: 20150603 Pledgee: Bank of Nanjing Co.,Ltd. Jiangning sub branch Pledgor: NANJING ZHONGJIANG NEW MATERIAL TECHNOLOGY Co.,Ltd. Registration number: Y2020980000399 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right |