CN102646673A - 高集成高光效的热电分离功率型发光二极体及封装方法 - Google Patents
高集成高光效的热电分离功率型发光二极体及封装方法 Download PDFInfo
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- CN102646673A CN102646673A CN2012100763013A CN201210076301A CN102646673A CN 102646673 A CN102646673 A CN 102646673A CN 2012100763013 A CN2012100763013 A CN 2012100763013A CN 201210076301 A CN201210076301 A CN 201210076301A CN 102646673 A CN102646673 A CN 102646673A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
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Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012100763013A CN102646673A (zh) | 2012-03-13 | 2012-03-13 | 高集成高光效的热电分离功率型发光二极体及封装方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN2012100763013A CN102646673A (zh) | 2012-03-13 | 2012-03-13 | 高集成高光效的热电分离功率型发光二极体及封装方法 |
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CN102646673A true CN102646673A (zh) | 2012-08-22 |
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CN2012100763013A Pending CN102646673A (zh) | 2012-03-13 | 2012-03-13 | 高集成高光效的热电分离功率型发光二极体及封装方法 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103000789A (zh) * | 2012-11-30 | 2013-03-27 | 惠州雷曼光电科技有限公司 | 贴片式led支架、贴片式led及贴片式led支架的成型方法 |
CN104993033A (zh) * | 2015-07-21 | 2015-10-21 | 福建天电光电有限公司 | 分布式ⅲ族氮化物发光半导体的emc金属接合装置及封装方法 |
CN110473952A (zh) * | 2018-05-09 | 2019-11-19 | 深圳市聚飞光电股份有限公司 | 电路led支架及led |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201946596U (zh) * | 2010-12-15 | 2011-08-24 | 南京华鼎电子有限公司 | 一种具有热能与电能分离式散热的led光源封装结构 |
CN202712254U (zh) * | 2012-03-13 | 2013-01-30 | 广东奥其斯科技有限公司 | 具有高集成高光效的热电分离功率型发光二极体 |
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2012
- 2012-03-13 CN CN2012100763013A patent/CN102646673A/zh active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201946596U (zh) * | 2010-12-15 | 2011-08-24 | 南京华鼎电子有限公司 | 一种具有热能与电能分离式散热的led光源封装结构 |
CN202712254U (zh) * | 2012-03-13 | 2013-01-30 | 广东奥其斯科技有限公司 | 具有高集成高光效的热电分离功率型发光二极体 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103000789A (zh) * | 2012-11-30 | 2013-03-27 | 惠州雷曼光电科技有限公司 | 贴片式led支架、贴片式led及贴片式led支架的成型方法 |
CN103000789B (zh) * | 2012-11-30 | 2015-08-19 | 惠州雷曼光电科技有限公司 | 贴片式led支架、贴片式led及贴片式led支架的成型方法 |
CN104993033A (zh) * | 2015-07-21 | 2015-10-21 | 福建天电光电有限公司 | 分布式ⅲ族氮化物发光半导体的emc金属接合装置及封装方法 |
CN104993033B (zh) * | 2015-07-21 | 2019-01-08 | 福建天电光电有限公司 | 分布式iii族氮化物发光半导体的emc金属接合装置及封装方法 |
CN110473952A (zh) * | 2018-05-09 | 2019-11-19 | 深圳市聚飞光电股份有限公司 | 电路led支架及led |
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Owner name: JIANGXI OUTRACE TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: GUANGDONG OUTRACE TECHNOLOGY CO., LTD. Effective date: 20131031 |
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Effective date of registration: 20131031 Address after: 330800 hi tech Industrial Zone, Jiangxi Applicant after: Outrace (Jiangsu) Technology Co., Ltd. Address before: 523000 Guangdong province Dongguan city Humen Town Industrial Zone Huaide Village Lane Applicant before: Guangdong Outrace Technology Co., Ltd. |
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Address after: 330800 hi tech Industrial Zone, Jiangxi Applicant after: Ao Qisi Science and Technology Co., Ltd. Address before: 330800 hi tech Industrial Zone, Jiangxi Applicant before: Outrace (Jiangsu) Technology Co., Ltd. |
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Application publication date: 20120822 |