JP2009239036A - Led substrate - Google Patents

Led substrate Download PDF

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Publication number
JP2009239036A
JP2009239036A JP2008083504A JP2008083504A JP2009239036A JP 2009239036 A JP2009239036 A JP 2009239036A JP 2008083504 A JP2008083504 A JP 2008083504A JP 2008083504 A JP2008083504 A JP 2008083504A JP 2009239036 A JP2009239036 A JP 2009239036A
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Prior art keywords
led
led substrate
hole
reflection member
wiring board
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JP2008083504A
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Japanese (ja)
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Hideki Yoshida
英樹 吉田
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Lincstech Circuit Co Ltd
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Hitachi AIC Inc
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Priority to JP2008083504A priority Critical patent/JP2009239036A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

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  • Led Device Packages (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an LED substrate that has high luminous efficiency, causes a small change in luminance with time, has high heat radiation properties, and causes small deterioration by selecting a reflection member having high reflectance and heat radiation properties. <P>SOLUTION: The LED substrate has the reflection member, and a wiring board adhered to the reflection member by an adhesive layer. The wiring board has a through-hole for exposing the reflection member. An LED element is arranged directly above the reflection member in the through-hole of the LED substrate. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、ＬＥＤ素子に代表される発光素子を搭載するＬＥＤ基板に関し、より詳細には、搭載した発光素子から発光される光を効率よく反射し、かつ放熱性のよい反射部材を有するＬＥＤ基板に関する。   The present invention relates to an LED substrate on which a light emitting element typified by an LED element is mounted, and more specifically, an LED substrate having a reflecting member that efficiently reflects light emitted from the mounted light emitting element and has good heat dissipation. About.

発光素子から発光される光を反射させる反射部材として、銅箔に銅めっきや金めっきを使用したＬＥＤ基板が知られているが、このようなＬＥＤ基板では、ＬＥＤ素子からの光が赤色系の反射光となり、反射率が低下する。このため、十分な発光輝度が得難い。そこで、反射部材の表面に、銀、ニッケルなどの銀白色系の金属めっき薄膜を備えたＬＥＤ基板が開示されている（特許文献１、２）。
特開２００６−０８０１１７号公報 特開２００７−１８９００６号公報 As a reflecting member that reflects light emitted from a light emitting element, an LED board using copper plating or gold plating on a copper foil is known. In such an LED board, light from the LED element is red. It becomes reflected light, and the reflectance decreases. For this reason, it is difficult to obtain sufficient light emission luminance. Thus, LED substrates having a silver-white metal plating thin film such as silver or nickel on the surface of a reflecting member are disclosed (Patent Documents 1 and 2).
JP 2006-080117 A JP 2007-189006 A

しかしながら、反射部材の表面が銀の場合、反射率が比較的高く、初期の発光輝度は得られるものの、点灯時間と共に発光輝度が低下する経時変化が生じ易い。このため、照明用途の場合は、輝度半減寿命４万時間が目標とされるが、このような要求には対応が難しい。   However, when the surface of the reflecting member is silver, the reflectance is relatively high and an initial light emission luminance can be obtained, but a change with time in which the light emission luminance decreases with the lighting time tends to occur. For this reason, in the case of lighting applications, the luminance half life of 40,000 hours is targeted, but it is difficult to meet such demands.

また、照明用途では、発光輝度の大きいことが要求されるが、同時に発熱も大きくなるため、ＬＥＤ基板としての劣化が生じ易い。このため、劣化抑制のために、放熱性向上が要求されるが、上記従来技術では、反射部材にめっきを行うため、使用できる反射部材の材質が限られていた。したがって、アルミニウムのような放熱性の高い部材を使用することが難しかった。   In addition, in lighting applications, it is required to have a high emission luminance, but at the same time, heat generation also increases, so that deterioration as an LED substrate is likely to occur. For this reason, although heat dissipation improvement is requested | required in order to suppress deterioration, in the said prior art, since the reflecting member is plated, the material of the reflecting member which can be used was restricted. Therefore, it is difficult to use a member with high heat dissipation such as aluminum.

本発明は、上記問題点に鑑みてなされたものであり、反射率と放熱性が高い反射部材を選択できることにより、発光効率が高く、輝度の経時的な変化が少ないうえ、高放熱性で劣化の少ないＬＥＤ基板を提供することを目的とする。   The present invention has been made in view of the above problems, and by selecting a reflective member having high reflectivity and heat dissipation, it has high luminous efficiency, little change in luminance over time, and deterioration due to high heat dissipation. An object of the present invention is to provide an LED substrate with a small amount.

本発明は、次のものに関する。
（１） 反射部材と、この反射部材に接着層により接着される配線板とを備え、上記配線板が、反射部材を露出させる貫通孔を有し、この貫通孔内であって、反射部材の直上にＬＥＤ素子を配置するＬＥＤ基板。
（２） （１）において、配線板が、絶縁層と、その片面に回路形成面を有する片面板であり、前記回路形成面と反対の面を反射部材に接着するＬＥＤ基板。
（３） （１）又は（２）において、回路形成面の高さが、ＬＥＤ素子高さ以下であるＬＥＤ基板。
（４） （１）乃至（３）の何れかにおいて、反射部材が、その表面に酸化皮膜を有するＬＥＤ基板。
（５） （１）乃至（４）の何れかにおいて、貫通孔の周縁が、回路形成面の配線回路との間に離間を有するＬＥＤ基板。 The present invention relates to the following.
(1) A reflecting member and a wiring board bonded to the reflecting member by an adhesive layer, the wiring board having a through hole exposing the reflecting member, the inside of the through hole, An LED substrate on which LED elements are arranged immediately above.
(2) The LED substrate according to (1), wherein the wiring board is an insulating layer and a single-sided board having a circuit forming surface on one side thereof, and a surface opposite to the circuit forming surface is bonded to a reflecting member.
(3) In (1) or (2), the LED board whose height of a circuit formation surface is below LED element height.
(4) The LED substrate according to any one of (1) to (3), wherein the reflecting member has an oxide film on the surface thereof.
(5) In any one of (1) to (4), the peripheral edge of the through hole is spaced from the wiring circuit on the circuit forming surface.

本発明によれば、反射率と放熱性が高い反射部材を選択できることにより、発光効率が高く、輝度の経時的な変化が少ないうえ、高放熱性で劣化の少ないＬＥＤ基板を提供することができる。   According to the present invention, it is possible to select a reflective member having high reflectance and heat dissipation, and thus it is possible to provide an LED substrate that has high luminous efficiency, little change in luminance over time, and high heat dissipation and little deterioration. .

図１に、本発明のＬＥＤ基板１６の一例の断面図を示す。本発明のＬＥＤ基板１６は、反射部材４と、この反射部材４に接着層２により接着される配線板１５とを備え、上記配線板１５が、反射部材４を露出させる貫通孔３を有し、この貫通孔３内であって、反射部材４の直上にＬＥＤ素子６を配置するＬＥＤ基板１６である。   In FIG. 1, sectional drawing of an example of the LED board 16 of this invention is shown. The LED substrate 16 of the present invention includes a reflective member 4 and a wiring board 15 bonded to the reflective member 4 with an adhesive layer 2, and the wiring board 15 has a through hole 3 through which the reflective member 4 is exposed. In this through hole 3, the LED substrate 16 is arranged with the LED element 6 disposed immediately above the reflecting member 4.

本発明の反射部材４は、ＬＥＤ素子６からの発光を反射するとともに、生じた熱を放熱するためのものである。反射部材４は、ＬＥＤ素子６からの発光を反射し、放熱性を有し、かつ後述する接着層２により接着可能なものであれば使用できる。例えば、銅や金等の赤色系金属材料や、銀、ニッケル、アルミニウムなどの銀白色系の金属材料が挙げられる。ＬＥＤ素子６からの発光が青色の場合（超高輝度ＬＥＤ素子）は、反射部材４として、銀、ニッケル、アルミニウムなどの銀白色系の金属材料が望ましい。また、室内照明用途等で、高い発光強度とともに高放熱性が要求される場合は、反射面を鏡面に調整した、いわゆる高反射アルミニウムであって、板厚が０．１〜０．８ｍｍのものを用いるのが望ましい。なお、高反射アルミニウムとは、金属アルミニウムの表面を鏡面に仕上げたうえで、その表面に反射率の高い酸化皮膜を形成したものである。これにより、超高輝度ＬＥＤ素子を搭載した場合でも、ＬＥＤ素子６からの発光を効率で反射でき、放熱性もよいので、高い発光強度とともに高放熱性が実現できる。このように、反射率と放熱性が高い反射部材４を選択できることにより、発光効率が高く、輝度の経時的な変化が少ないうえ、高放熱性で劣化の少ないＬＥＤ基板１６を提供することができる。   The reflecting member 4 of the present invention reflects light emitted from the LED element 6 and radiates the generated heat. The reflection member 4 can be used as long as it reflects light emitted from the LED element 6, has a heat dissipation property, and can be bonded by the adhesive layer 2 described later. Examples thereof include red metal materials such as copper and gold, and silver white metal materials such as silver, nickel, and aluminum. When the light emitted from the LED element 6 is blue (ultra-high brightness LED element), a silver white metal material such as silver, nickel, or aluminum is desirable as the reflecting member 4. In addition, when high heat dissipation is required in addition to high emission intensity for indoor lighting applications, etc., so-called highly reflective aluminum with a reflective surface adjusted to a mirror surface with a plate thickness of 0.1 to 0.8 mm It is desirable to use The highly reflective aluminum is obtained by finishing the surface of metal aluminum into a mirror surface and forming an oxide film with high reflectivity on the surface. Thereby, even when an ultra-high brightness LED element is mounted, light emission from the LED element 6 can be reflected efficiently and heat dissipation is good, so that high heat dissipation can be realized together with high light emission intensity. Thus, by selecting the reflecting member 4 having high reflectance and heat dissipation, it is possible to provide the LED substrate 16 that has high luminous efficiency, little change in luminance with time, high heat dissipation, and little deterioration. .

本発明の接着層２は、配線板１５と反射部材４とを接着するものである。配線板１５の絶縁層１と接着層２とを直接接着するものに限定されず、これらの間に銅箔や銅めっき等の他の部材を介在して接着するものを含む。接着層２としては、仮接着可能であるものであればよく、一般のパッケージ基板の製造において、構成材間の接着に使用されているものを使用することができる。例えば、高分子量エポキシ樹脂を主成分とする接着シート２等を使用することができる。接着シート２としては、ＡＳ−３０００、ＡＳ２６００Ｗ（日立化成工業株式会社製 商品名）等が例示できる。接着シート２の厚みは、ＬＥＤ素子６の発光面の高さが約０．１ｍｍであるため、これと同等以下の０．０１〜０．１０ｍｍとするのが好ましい。   The adhesive layer 2 of the present invention adheres the wiring board 15 and the reflecting member 4. The insulating layer 1 and the adhesive layer 2 of the wiring board 15 are not limited to those that are directly bonded, but include those that are bonded by interposing another member such as a copper foil or copper plating therebetween. Any adhesive layer 2 may be used as long as it can be temporarily bonded, and in the manufacture of a general package substrate, those used for bonding between components can be used. For example, the adhesive sheet 2 etc. which have a high molecular weight epoxy resin as a main component can be used. Examples of the adhesive sheet 2 include AS-3000 and AS2600W (trade name, manufactured by Hitachi Chemical Co., Ltd.). Since the height of the light emitting surface of the LED element 6 is about 0.1 mm, the thickness of the adhesive sheet 2 is preferably 0.01 to 0.10 mm which is equal to or less than this.

本発明の配線板１５は、絶縁層１と、その表層に形成された配線回路１４と、これらを貫通する貫通孔３とを有する。絶縁層１は、一般のパッケージ基板に用いられるものを使用することができ、例えば、ガラスクロスにエポキシ樹脂やポリイミド樹脂を含浸させた、いわゆるガラスエポキシ基板やガラスポリイミド基板を用いることができる。配線回路１４は、ＬＥＤ素子６への電力を供給するものであり、銅箔や銅めっきをエッチングすること等により形成され、表面にはワイアボンディングやはんだ付け性を付与するため、ニッケル−金めっき１２等により被覆される。配線回路１４は、絶縁層１の片面または両面に形成され、配線回路１４を形成した面を、回路形成面８という。貫通孔３は、配線板１５と反射部材４が接着層２により一体化された際に、反射部材４が露出する領域を設けるためのものであり、この領域内にＬＥＤ素子６を搭載するものである。例えば、絶縁基板をルータ、ドリル、レーザ等で加工することにより形成することができる。   The wiring board 15 of the present invention has an insulating layer 1, a wiring circuit 14 formed on the surface layer, and a through hole 3 penetrating them. As the insulating layer 1, a material used for a general package substrate can be used. For example, a so-called glass epoxy substrate or glass polyimide substrate in which a glass cloth is impregnated with an epoxy resin or a polyimide resin can be used. The wiring circuit 14 supplies power to the LED element 6 and is formed by etching a copper foil or copper plating. The surface of the wiring circuit 14 is nickel-gold plated to provide wire bonding or solderability. 12 etc. The wiring circuit 14 is formed on one or both surfaces of the insulating layer 1, and the surface on which the wiring circuit 14 is formed is referred to as a circuit forming surface 8. The through-hole 3 is for providing a region where the reflective member 4 is exposed when the wiring board 15 and the reflective member 4 are integrated by the adhesive layer 2, and the LED element 6 is mounted in this region. It is. For example, the insulating substrate can be formed by processing with a router, a drill, a laser, or the like.

反射部材４は、接着層２によって配線板１５と接着され、貫通孔３内に表面が露出する。このような構成により、反射部材４の表面を、高反射状態（鏡面状態）のまま、貫通孔３内に露出させることができる。また、接着層２により配線板１５と接着したままの状態で、めっき等を行わずに反射部材４として使用するので、反射部材４の材質を選択する際の自由度が拡大する。これにより、高反射率でかつ高放熱性である高反射アルミニウムを使用することも可能であり、ＬＥＤ素子６からの発光が青色の場合でも、ＬＥＤ素子６からの発光を高効率で反射できるので、高い発光強度が実現でき、また、反射率の経時変化も抑制される。さらに、ＬＥＤ素子６からの発熱が大きくても、放熱性が優れるので、長期間使用しても、熱による基板自体の劣化が少ないＬＥＤ基板１６を提供できる。   The reflecting member 4 is bonded to the wiring board 15 by the adhesive layer 2, and the surface is exposed in the through hole 3. With such a configuration, the surface of the reflecting member 4 can be exposed in the through hole 3 while remaining in a highly reflective state (mirror surface state). Moreover, since it is used as the reflecting member 4 without performing plating or the like while being adhered to the wiring board 15 by the adhesive layer 2, the degree of freedom in selecting the material of the reflecting member 4 is increased. Thereby, it is also possible to use highly reflective aluminum having high reflectivity and high heat dissipation, and even when the light emitted from the LED element 6 is blue, the light emitted from the LED element 6 can be reflected with high efficiency. High emission intensity can be realized, and a change in reflectance with time is also suppressed. Furthermore, even if the heat generated from the LED element 6 is large, the heat dissipation is excellent, so that the LED substrate 16 can be provided with little deterioration of the substrate itself due to heat even when used for a long time.

本発明において、ＬＥＤ（Ｌｉｇｈｔ Ｅｍｉｔｔｉｎｇ Ｄｉｏｄｅ）素子は、光を放射する発光素子６の一種をいう。本発明で使用するＬＥＤ素子６としては、一般にＬＥＤ基板１６に使用されるものが使用できるが、特には青色の、いわゆる超高輝度ＬＥＤ素子であると、高反射率でかつ高放熱性である特徴を生かすことができるため望ましい。   In the present invention, an LED (Light Emitting Diode) element refers to a kind of light emitting element 6 that emits light. As the LED element 6 used in the present invention, those generally used for the LED substrate 16 can be used. In particular, a blue so-called ultra-high brightness LED element has high reflectivity and high heat dissipation. It is desirable because it can take advantage of its features.

ＬＥＤ素子６は、貫通孔３内であって、反射部材４の直上に搭載される。つまり、貫通孔３内であって、反射部材４の露出面５に、直接、ダイボンド剤等により搭載される。これにより、ＬＥＤ素子６の上部が開放された状態となる。このため、ＬＥＤ素子６から上方への発光に、反射部材４からの反射が加わり、開放された上方への発光を高効率で実現できる。   The LED element 6 is mounted in the through hole 3 and immediately above the reflecting member 4. That is, it is directly mounted on the exposed surface 5 of the reflecting member 4 in the through hole 3 with a die bond agent or the like. Thereby, it will be in the state where the upper part of LED element 6 was opened. For this reason, the reflection from the reflecting member 4 is added to the upward light emission from the LED element 6, and the upward upward light emission can be realized with high efficiency.

配線板１５が、絶縁層１と、その片面に回路形成面８を有する片面板であり、前記回路形成面８と反対の面を反射部材４に接着するのが望ましい。これにより、絶縁層１と接着層２とが接着されるので、配線回路１４と接着層２とを接着する場合に比べて、高い接着強度を得ることができる。配線回路１４と接着層２とを接着する場合は、配線回路１４の表面を、化学研磨や機械研磨等により粗面化することで、接着強度を満足することが可能となる。   The wiring board 15 is preferably a single-sided board having the insulating layer 1 and the circuit forming surface 8 on one side thereof, and the surface opposite to the circuit forming surface 8 is preferably bonded to the reflecting member 4. Thereby, since the insulating layer 1 and the adhesive layer 2 are bonded together, higher adhesive strength can be obtained as compared with the case where the wiring circuit 14 and the adhesive layer 2 are bonded. When the wiring circuit 14 and the adhesive layer 2 are bonded, it is possible to satisfy the bonding strength by roughening the surface of the wiring circuit 14 by chemical polishing or mechanical polishing.

回路形成面８の高さが、ＬＥＤ素子６高さ以下であるのが望ましい。これにより、ＬＥＤ素子６の上面が回路形成面８と同等以上の高さになるため、少なくとも、ＬＥＤ素子６の上面からの発光は貫通孔３の内壁に妨げられることがないため、上方に向かう発光輝度を確保できる。   It is desirable that the height of the circuit forming surface 8 is not more than the height of the LED element 6. Thereby, since the upper surface of the LED element 6 has a height equal to or higher than that of the circuit forming surface 8, at least light emission from the upper surface of the LED element 6 is not hindered by the inner wall of the through hole 3. Luminance can be ensured.

反射部材４が、その表面に酸化皮膜を有するのが望ましい。つまり、反射部材４が金属の場合に、金属自体がＬＥＤ素子６からの発光を反射するのではなく、金属表面に形成した酸化皮膜の反射率が高いことによって、ＬＥＤ素子６からの発光を高効率で反射するのが望ましい。金属は一般に腐食を起こすいため、経時的に反射率が変化しやすいが、安定な酸化皮膜を形成し、この酸化皮膜に反射機能を持たせることにより、金属の腐食の進行を抑制し、反射率の経時変化を抑制することが可能になる。このような酸化皮膜は、例えば、高反射アルミニウムを使用することで実現できる。   It is desirable that the reflecting member 4 has an oxide film on its surface. That is, when the reflecting member 4 is a metal, the metal itself does not reflect the light emitted from the LED element 6 but the oxide film formed on the metal surface has a high reflectance, thereby increasing the light emitted from the LED element 6. It is desirable to reflect with efficiency. Since metals generally corrode, the reflectivity tends to change over time, but by forming a stable oxide film and providing this oxide film with a reflective function, the progress of metal corrosion is suppressed, and the reflectivity It is possible to suppress the change with time. Such an oxide film can be realized, for example, by using highly reflective aluminum.

貫通孔３の周縁が、回路形成面８の配線回路１４との間に離間９を有するのが望ましい。これにより、配線板１５に貫通孔３を設ける際に、ルータやドリルで加工する場合、加工する部分に配線回路１４がないので、バリが発生し難いため、配線板１５を複数枚重ねて貫通孔３を加工する際の加工性が向上する。また、レーザで貫通孔３を加工する場合も、加工する部分に配線回路１４がないので、絶縁層１のみを加工することになるため、加工が容易となる。このため、貫通孔３の仕上りが良好で、バリ除去の必要がないため、低コストでの加工が可能となる。   It is desirable that the periphery of the through-hole 3 has a separation 9 between the circuit forming surface 8 and the wiring circuit 14. As a result, when the through hole 3 is provided in the wiring board 15, when processing with a router or a drill, since there is no wiring circuit 14 in the processed part, burrs are unlikely to occur. Workability at the time of processing the hole 3 is improved. Further, when processing the through-hole 3 with a laser, since there is no wiring circuit 14 in the processed portion, only the insulating layer 1 is processed, so that the processing becomes easy. For this reason, since the finish of the through-hole 3 is good and there is no need to remove burrs, processing at a low cost is possible.

以下、本発明の実施例を説明するが、本発明はこれに限定されない。   Examples of the present invention will be described below, but the present invention is not limited thereto.

絶縁基板の両面に、１８μｍの銅箔を有した、厚さ０．０６ｍｍのＣＣＬ−ＨＬ８２０（三菱ガス化学株式会社製 商品名）を準備し、一方の面（Ｌ１面）だけを全面マスキングし、他方の面（Ｌ２面）の全面の銅箔をエッチングで除去した。一方の面（Ｌ１面）にエッチングにより、配線回路１４を形成し、片面板を作成した。   Prepare CCL-HL820 (trade name, manufactured by Mitsubishi Gas Chemical Co., Ltd.) with a thickness of 18 μm on both sides of the insulating substrate, and mask only one side (L1 side). The copper foil on the entire surface of the other surface (L2 surface) was removed by etching. A wiring circuit 14 was formed on one surface (L1 surface) by etching to produce a single-sided plate.

次に、配線回路１４を形成した回路形成面８に、ソルダーレジスト１８を形成し、必要部分に金めっき処理を行った。使用したソルダーレジスト１８は、ＤＳＲ−２２００ Ｗ１０−１３（タムラ化研株式会社製 商品名）である。   Next, a solder resist 18 was formed on the circuit forming surface 8 on which the wiring circuit 14 was formed, and a gold plating process was performed on a necessary portion. The used solder resist 18 is DSR-2200 W10-13 (trade name, manufactured by Tamura Kaken Co., Ltd.).

次に、ニッケル−金めっき１２処理後、全面エッチングを行った面（Ｌ２面）に、接着シート２を仮付けした。使用した接着シート２は、ＡＳ−３０００（日立化成工業株式会社製 商品名）の２５μｍタイプである。仮付け条件は、１４０℃、４ＭＰａ、３０分である。   Next, after the nickel-gold plating 12 treatment, the adhesive sheet 2 was temporarily attached to the surface where the entire surface was etched (L2 surface). The used adhesive sheet 2 is a 25 μm type of AS-3000 (trade name, manufactured by Hitachi Chemical Co., Ltd.). Temporary conditions are 140 degreeC, 4 Mpa, and 30 minutes.

次に、接着シート２を仮付けした状態で、ＬＥＤ搭載部となるアルミ面を露出させるための貫通孔３の穴あけを行った。穴あけは、ドリルまたはエンドミル、レーザのいずれを用いてもよい。貫通孔３は、長径６ｍｍ×短径１ｍｍ〜長径２０ｍｍ×短径２ｍｍである。   Next, with the adhesive sheet 2 temporarily attached, a through hole 3 for exposing an aluminum surface serving as an LED mounting portion was formed. For drilling, either a drill, an end mill, or a laser may be used. The through hole 3 has a major axis 6 mm × minor axis 1 mm to a major axis 20 mm × minor axis 2 mm.

次に、穴あけ後、高反射アルミニウムと、接着シート２を仮付けした状態の配線板１５を、加熱加圧して本接着した。使用した高反射アルミニウムは、ＡＣＡ４２５ＯＥ（ＡＣＡ社製 商品名）、または、ＭＩＲＯ２（ＡＬＡＮＯＤ社製 商品名）である。板厚は、０．８ｍｍのものを用いた。本接着は、１８０℃、４ＭＰａ、６０分の条件で行う。これにより、貫通孔３内に、高反射アルミニム板の鏡面仕上げの面が露出したＬＥＤ基板１６が形成される。   Next, after drilling, the highly reflective aluminum and the wiring board 15 temporarily attached with the adhesive sheet 2 were heat-pressed and finally bonded. The highly reflective aluminum used is ACA425OE (trade name, manufactured by ACA) or MIRO2 (trade name, manufactured by ALANOD). The plate thickness was 0.8 mm. The main bonding is performed under the conditions of 180 ° C., 4 MPa, and 60 minutes. As a result, the LED substrate 16 in which the mirror-finished surface of the highly reflective aluminum plate is exposed is formed in the through hole 3.

本発明の実施例に係るＬＥＤ基板の断面図である。It is sectional drawing of the LED board which concerns on the Example of this invention.

符号の説明Explanation of symbols

１．絶縁層、２．接着層（接着シート）、３．貫通孔、４．反射部材、５．反射部材の露出面（貫通孔内露出面）、６．ＬＥＤ素子、８．回路形成面、９．離間、１２．ニッケル−金めっき、１３．金ワイヤ、１４．配線回路、１５．配線板、１６．ＬＥＤ基板、１７…ボンディングパッド、１８…ソルダーレジスト 1. Insulation layer, 2. 2. adhesive layer (adhesive sheet); Through hole, 4. Reflective member, 5. 5. Exposed surface of reflective member (exposed surface in through hole), LED element, 8. Circuit forming surface, 9. Separation, 12. Nickel-gold plating, 13. Gold wire, 14. Wiring circuit, 15. Wiring board, 16. LED substrate, 17 ... bonding pad, 18 ... solder resist

Claims (5)

反射部材と、この反射部材に接着層により接着される配線板とを備え、上記配線板が、反射部材を露出させる貫通孔を有し、この貫通孔内であって、反射部材の直上にＬＥＤ素子を配置するＬＥＤ基板。   A reflection member; and a wiring board bonded to the reflection member by an adhesive layer. The wiring board has a through hole that exposes the reflection member. The LED is in the through hole and directly above the reflection member. LED substrate on which elements are placed. 請求項１において、配線板が、絶縁層と、その片面に回路形成面を有する片面板であり、前記回路形成面と反対の面を反射部材に接着するＬＥＤ基板。   2. The LED substrate according to claim 1, wherein the wiring board is a single-sided board having an insulating layer and a circuit forming surface on one side thereof, and a surface opposite to the circuit forming surface is bonded to a reflecting member. 請求項１又は２において、回路形成面の高さが、ＬＥＤ素子高さ以下であるＬＥＤ基板。   The LED substrate according to claim 1 or 2, wherein the height of the circuit formation surface is equal to or less than the LED element height. 請求項１乃至３の何れかにおいて、反射部材が、その表面に酸化皮膜を有するＬＥＤ基板。   4. The LED substrate according to claim 1, wherein the reflecting member has an oxide film on the surface thereof. 請求項１乃至４の何れかにおいて、貫通孔の周縁が、回路形成面の配線回路との間に離間を有するＬＥＤ基板。   5. The LED substrate according to claim 1, wherein the periphery of the through hole is spaced from the wiring circuit on the circuit forming surface.
JP2008083504A 2008-03-27 2008-03-27 Led substrate Pending JP2009239036A (en)

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