CN114501856A - Multi-layer conductive circuit, manufacturing method thereof and display module - Google Patents
Multi-layer conductive circuit, manufacturing method thereof and display module Download PDFInfo
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- CN114501856A CN114501856A CN202111518337.8A CN202111518337A CN114501856A CN 114501856 A CN114501856 A CN 114501856A CN 202111518337 A CN202111518337 A CN 202111518337A CN 114501856 A CN114501856 A CN 114501856A
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- 238000000034 method Methods 0.000 claims description 23
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
Abstract
The present invention provides a multilayer conductive circuit comprising: the first conducting layer comprises a first conducting metal film and a first insulating photoresist layer, the first insulating photoresist layer is provided with a first window, and a first conducting part exposed out of the first window is formed on the first conducting metal film at the position corresponding to the first window; and the second conducting layer comprises a second conducting metal film and a second insulating photoresist layer, the second insulating photoresist layer is provided with a second window, the second conducting metal film is provided with an opening at the position corresponding to the second window so that the second conducting metal film forms a second conducting part which is exposed out of the second window and arranged around the opening, the second conducting metal film is attached to the first insulating photoresist layer, the first window and the second window are correspondingly arranged, and the first conducting part is electrically connected with the second conducting part. In addition, the invention also provides a display module and a manufacturing method of the multilayer conducting circuit. The technical scheme of the invention effectively solves the problems of complex manufacturing process and thicker thickness of the multilayer conducting circuit.
Description
Technical Field
The invention relates to the technical field of conductive circuits, in particular to a multilayer conductive circuit, a manufacturing method thereof and a display module.
Background
Printed circuit boards, i.e., copper clad laminates, include rigid copper clad laminates and flexible copper clad laminates. The substrate of the rigid copper-clad laminate is a resin laminate, including but not limited to epoxy, phenolic aldehyde and other resin plates; the substrate of the flexible copper clad laminate is a high molecular film or a single-layer heat-resistant glass varnished cloth, and the high molecular film comprises but is not limited to polyester, polyimide, a fluorine-containing polymer film and the like. In the conventional printed circuit board, a metal coating is usually disposed on a substrate, and conductive traces are formed on the metal coating. However, the printed circuit board with the substrate is thick.
The printed circuit board comprises a multilayer circuit board, wherein the multilayer circuit board is formed by mutually overlapping two or more conductive layers. The conductive layers in the multilayer wiring board are generally bonded together by an insulating material such as resin, and the manufacturing process is complicated.
Disclosure of Invention
The invention provides a multilayer conductive circuit, a manufacturing method thereof and a display module, the manufacturing process is simple, and the manufactured conductive circuit is thinner.
In a first aspect, embodiments of the present invention provide a multilayer conductive trace, comprising:
the first conductive layer comprises a first conductive metal film and a first insulating photoresist layer, the first insulating photoresist layer is arranged on one surface of the first conductive metal film, the first insulating photoresist layer is provided with a first window, and a first conductive part exposed out of the first window is formed on the first conductive metal film at the position corresponding to the first window; and
the second conducting layer comprises a second conducting metal film and a second insulating photoresist layer, the second insulating photoresist layer is arranged on one surface of the second conducting metal film, the second insulating photoresist layer is provided with a second window, the second conducting metal film is provided with an opening at the position corresponding to the second window, so that the second conducting metal film forms a second conducting part exposed out of the second window and surrounding the opening, one surface of the second conducting metal film departing from the second insulating photoresist layer is attached to one surface of the first insulating photoresist layer departing from the first conducting metal film, the first window and the second window are correspondingly arranged, and the first conducting part is electrically connected with the second conducting part.
In a second aspect, an embodiment of the present invention provides a display module, where the display module includes a plurality of LED lamp beads and the above-mentioned multilayer conductive circuit, and the LED lamp beads are electrically connected to the multilayer conductive circuit.
In a third aspect, an embodiment of the present invention provides a method for manufacturing a multilayer conductive circuit, where the method for manufacturing the multilayer conductive circuit includes:
manufacturing a first conductive layer, wherein the manufacturing of the first conductive layer specifically comprises:
providing a first conductive metal film;
coating an insulating photoresist on one surface of the first conductive metal film to form a first insulating photoresist layer on one surface of the first conductive metal film; and
etching the first insulation photoresist layer to form a first window on the first insulation photoresist layer, wherein the first conductive metal film forms a first conductive part exposed out of the first window at a position corresponding to the first window;
manufacturing a second conductive layer, wherein the manufacturing of the second conductive layer specifically comprises:
providing a second conductive metal film;
coating an insulating photoresist on one surface of the second conductive metal film to form a second insulating photoresist layer on one surface of the second conductive metal film;
etching the second insulating photoresist layer to form a second window in the second insulating photoresist layer, wherein the second conductive metal film forms a second conductive part exposed out of the second window at a position corresponding to the second window; and
etching the second conductive metal film to form an opening in the second conductive portion;
attaching one surface of the second conductive metal film, which is far away from the second insulating light resistance layer, to one surface of the first insulating light resistance layer, which is far away from the first conductive metal film, wherein the first window and the second window are correspondingly arranged; and
and coating a conductive material on the second window so as to electrically connect the first conductive part and the second conductive part.
According to the multilayer conductive circuit, the manufacturing method of the multilayer conductive circuit and the display module, the first insulating photoresist layer and the second insulating photoresist layer are respectively arranged on the first conductive metal film and the second conductive metal film to respectively form the first conductive layer and the second conductive layer, and the first conductive layer and the second conductive layer are arranged in a stacked mode to form the multilayer conductive circuit. The first insulating light resistance layer is attached to the second conductive metal film, so that the first conductive layer and the second conductive layer are attached together, and meanwhile, the first insulating light resistance layer can also insulate the first conductive metal film from the second conductive metal film. The first insulating photoresist layer and the second insulating photoresist layer are respectively provided with a corresponding first window and a corresponding second window, the second conductive metal film is provided with an opening at the position corresponding to the second window, and the first conductive part arranged corresponding to the first window is electrically connected with the second conductive part arranged corresponding to the second window through the first window, the second window and the opening. The multiple layers of conducting circuits are directly made of conducting metal films and insulating photoresist layers, so that substrates are saved, and cost is effectively saved. Meanwhile, the multilayer conductive circuit is thin in overall thickness, high in applicability and wide in applicable scene.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic cross-sectional view of a multilayer conductive circuit according to an embodiment of the invention.
Fig. 2 is another schematic cross-sectional view of a multi-layer conductive trace according to an embodiment of the invention.
Fig. 3 is a schematic cross-sectional view of a display module according to an embodiment of the invention.
Fig. 4 is a flowchart of a method for forming a multi-layer conductive circuit according to an embodiment of the present invention.
Fig. 5 is a first sub-flowchart of a method for forming a multi-layer conductive trace according to an embodiment of the present invention.
Fig. 6 is a second sub-flowchart of a method for forming a multi-layer conductive trace according to an embodiment of the present invention.
Fig. 7 is a third sub-flowchart of a method for forming a multi-layer conductive trace according to an embodiment of the present invention.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terms "first," "second," "third," "fourth," and the like in the description and in the claims of the present application and in the above-described drawings (if any) are used for distinguishing between similar items and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances, in other words that the embodiments described are to be practiced in sequences other than those illustrated or described herein. Moreover, the terms "comprises," "comprising," and any other variation thereof, may also include other things, such as processes, methods, systems, articles, or apparatus that comprise a list of steps or elements is not necessarily limited to only those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such processes, methods, articles, or apparatus.
It should be noted that the description relating to "first", "second", etc. in the present invention is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
Please refer to fig. 1, which is a schematic cross-sectional view of a multi-layer conductive circuit according to an embodiment of the present invention. The multilayer conductive trace 100 includes a first conductive layer 10 and a second conductive layer 20. In the present embodiment, the multi-layer conductive trace 100 is a dual-layer conductive trace.
The first conductive layer 10 includes a first conductive metal film 11 and a first insulating photoresist layer 12, and the first insulating photoresist layer 12 is disposed on one surface of the first conductive metal film 11. The first conductive metal film 11 includes, but is not limited to, a copper film, a silver film, etc., and the thickness of the first conductive metal film 11 is 3 to 500 micrometers. The first insulating photoresist layer 12 is made of a transparent insulating photoresist material, and the thickness of the first insulating photoresist layer 12 is 2 to 500 μm. Preferably, the first conductive metal film 11 is a copper film. The first insulating photoresist layer 12 is provided with a first window 121. The first window 121 is formed by etching, and the first window 121 includes a plurality of windows. The shape of the first window 121, the position of the first insulating photoresist layer 12, and the like may be set according to actual conditions. The first conductive metal film 11 forms a first conductive portion 111 exposed to the first window 121 at a position corresponding to the first window 121.
The surface of the first conductive metal film 11 facing away from the first insulating photoresist layer 12 is provided as a first wiring surface 113, and the first wiring surface 113 is provided with a first conductive trace 13 in a region outside the first conductive part 111. The first conductive traces 13 and the first conductive portions 111 do not overlap each other.
The second conductive layer 20 includes a second conductive metal film 21 and a second insulating photoresist layer 22, and the second insulating photoresist layer 22 is disposed on one side of the second conductive metal film 21. The second conductive metal film 21 includes, but is not limited to, a copper film, a silver film, etc., and the thickness of the second conductive metal film 21 is 3 to 500 micrometers. The second insulating photoresist layer 22 is made of a transparent insulating photoresist material, and the thickness of the second insulating photoresist layer 22 is 2-500 μm. Preferably, the second conductive metal film 21 is a copper film. The second insulating photoresist layer 22 has a second window 221. The second window 221 is formed by etching, and the second window 221 includes a plurality of windows. The number of the second windows 221 is the same as that of the first windows 121, and the shapes of the second windows 221 and the positions formed on the second insulating photoresist layer 22 correspond to the shapes of the first windows 121 and the positions formed on the first insulating photoresist layer 12 one by one. The second conductive metal film 21 has an opening 212 at a position corresponding to the second window 221, so that the second conductive metal film 21 forms a second conductive portion 211 exposed out of the second window 221 and surrounding the opening 212. The opening 212 is formed by etching, and the opening 212 includes a plurality of openings. The shape of the opening 212, the position of the second conductive metal film 21, and the like may be set according to actual conditions.
The surface of the second conductive metal film 21 away from the second insulating photoresist layer 22 is a second wiring surface 213, and the second wiring surface 213 is provided with a second conductive trace 23 in the region outside the second conductive portion 211. The second conductive line 23 and the second conductive line 211 do not overlap each other. The second conductive traces 23 may be the same as or different from the first conductive traces 13.
The surface of the second conductive metal film 21 away from the second insulating photoresist layer 22 is attached to the surface of the first insulating photoresist layer 12 away from the first conductive metal film 11. Wherein the transparent insulating photoresist material has viscosity such that the second conductive metal film 21 can be adhered to the first insulating photoresist layer 12, and thus the second conductive layer 20 is disposed together with the first conductive layer 10. The first conductive metal film 11, the first insulating photoresist layer 12, the second conductive metal film 21 and the second insulating photoresist layer 22 are sequentially stacked to form a multi-layer conductive circuit 100. In some possible embodiments, a material with viscosity such as glue may be disposed between the first conductive layer 10 and the second conductive layer 20 to tightly bond the first conductive layer 10 and the second conductive layer 20.
In the multi-layer conductive circuit 100, the first window 121 and the second window 221 are correspondingly disposed, and the first conductive portion 111 is electrically connected to the second conductive portion 211. In this embodiment, multilayer conductive trace 100 further includes conductive material 40. The conductive material 40 is disposed in the second window 221, such that the conductive material 40 is attached to the second conductive portion 211 and attached to the first conductive portion 111 through the opening 212, such that the first conductive portion 111 is electrically connected to the second conductive portion 211. It is understood that the conductive material 40 penetrates through the second window 221, the opening 212 and the first window 121, so that the first conductive portion 111 and the second conductive portion 211 are electrically connected. The conductive material 40 includes, but is not limited to, solder paste, silver paste, and the like.
In the above embodiment, the first conductive layer and the second conductive layer are formed by disposing the first insulating photoresist layer and the second insulating photoresist layer on the first conductive metal film and the second conductive metal film, respectively, and the first conductive layer and the second conductive layer are disposed in a stacked manner to form the multilayer conductive line. The first insulating light resistance layer is attached to the second conductive metal film, so that the first conductive layer and the second conductive layer are attached together, and meanwhile, the first insulating light resistance layer can also insulate the first conductive metal film from the second conductive metal film. The first insulating photoresist layer and the second insulating photoresist layer are respectively provided with a corresponding first window and a corresponding second window, the second conductive metal film is provided with an opening at the position corresponding to the second window, and the first conductive part arranged corresponding to the first window is electrically connected with the second conductive part arranged corresponding to the second window through the first window, the second window and the opening. The multiple layers of conducting circuits are directly made of conducting metal films and insulating photoresist layers, so that substrates are saved, and cost is effectively saved. Meanwhile, the multilayer conductive circuit is thin in overall thickness, high in applicability and wide in applicable scene. When the thickness of the insulating photoresist layer is thinner, the multiple layers of conducting circuits can be used for manufacturing a large-size display screen; when the thickness of the insulating photoresist layer is thicker, the multiple layers of conductive circuits can be used for manufacturing small-sized display screens, so that the multiple layers of conductive circuits have higher practicability.
In some possible embodiments, the first conductive metal film 11 may have an opening (not shown) at a position corresponding to the first window 121, so that the first conductive part 111 is disposed around the opening. Wherein, the opening can be formed by etching, and the opening comprises a plurality of openings. The number of openings is the same as the number of openings 212, and the positions where the openings are disposed in the first conductive metal film 11 are the same as the positions where the openings 212 are disposed in the second conductive metal film 21. The shape of the opening can be set according to actual conditions. The conductive material 40 penetrates the second window 221, the opening 212, the first window 121, and the opening, thereby enhancing the electrical connection between the first conductive portion 111 and the second conductive portion 211.
Please refer to fig. 2, which is a schematic cross-sectional view of a multi-layer conductive circuit according to an embodiment of the invention. Multilayer conductive trace 100 further includes at least one third conductive layer 30. The first conductive layer 10, the second conductive layer 20, and the at least one third conductive layer 30 form a multi-layer conductive trace 100. The structure of the third conductive layer 30 is the same as that of the second conductive layer 20. Specifically, the third conductive layer 30 includes a third conductive metal film 31 and a third insulating photoresist layer 32, and the third insulating photoresist layer 32 has a third window 321. The third conductive metal film 31 is provided with a through hole 312 at a position corresponding to the third window 321, so that the third conductive metal film 31 forms a third conductive portion 311 exposed out of the third window 321 and disposed around the through hole 312. The specific structure of the third conductive layer 30 corresponds to the specific structure of the second conductive layer 20 one to one, and is not described herein again.
The third conductive layer 30 is disposed on a side of the second conductive layer 20 away from the first conductive layer 10. Taking the multilayer conductive circuit 100 including two third conductive layers 30 as an example, the two third conductive layers 30, the second conductive layer 20, and the first conductive layer 10 are sequentially stacked. The third conductive metal films 31 and the third insulating photoresist layers 32 of the two third conductive layers 30 are sequentially stacked, and the outermost third conductive metal film 31 of the two third conductive layers 30 is attached to the second insulating photoresist layer 22. The conductive material 40 penetrates through the third window 321, the through hole 312, the second window 221, the opening 212 and the first window 121, so that the first conductive portion 111 is electrically connected to the second conductive portion 211 and the third conductive portion 311. The conductive lines of each third conductive layer 30 may be the same or different; the conductive traces of the third conductive layer 30 and the second conductive traces 23 of the second conductive layer 20 may be the same or different.
In the above embodiment, at least one third conductive layer is disposed on a side of the second conductive layer away from the first conductive layer, so as to form a plurality of layers of conductive traces. The structure of the third conducting layer is the same as that of the second conducting layer, and the multilayer conducting circuit is simple in overall structure, so that the manufacturing process of the multilayer conducting circuit is simple, and the production efficiency can be greatly improved.
Referring to fig. 4 to 7 in combination, fig. 4 is a flowchart of a method for fabricating a multilayer conductive circuit according to an embodiment of the present invention, fig. 5 is a first sub-flowchart of a method for fabricating a multilayer conductive circuit according to an embodiment of the present invention, fig. 6 is a second sub-flowchart of a method for fabricating a multilayer conductive circuit according to an embodiment of the present invention, and fig. 7 is a third sub-flowchart of a method for fabricating a multilayer conductive circuit according to an embodiment of the present invention. The method for fabricating the multilayer conductive circuit is used to fabricate the multilayer conductive circuit 100 according to the above embodiments. In the present embodiment, the multi-layer conductive trace 100 is a double-layer conductive trace, and includes a first conductive layer 10 and a second conductive layer 20. The method for manufacturing the multilayer conductive circuit specifically comprises the following steps.
In step S1, a first conductive layer is formed. The manufacturing of the first conductive layer 10 specifically includes the following steps.
Step S102, a first conductive metal film is provided. The first conductive metal film 11 includes, but is not limited to, a copper film, a silver film, etc., and the thickness of the first conductive metal film 11 is 3 to 500 micrometers. Preferably, the first conductive metal film 11 is a copper film.
Step S104, coating an insulation photoresist on one side of the first conductive metal film to form a first insulation photoresist layer on one side of the first conductive metal film. After an insulating photoresist is coated on one surface of the first conductive metal film 11, the insulating photoresist is baked to be cured, thereby forming a first insulating photoresist layer 12. Wherein the insulation photoresist is transparent insulation photoresist, and the baking temperature is 60-150 ℃. The first insulating photoresist layer 12 is formed to have a thickness of 2 to 500 μm.
In step S106, the first insulating photoresist layer is etched to form a first window in the first insulating photoresist layer. In this embodiment, a first preset mask is disposed to expose the first insulating photoresist layer 12, and then the first insulating photoresist layer 12 is developed by using a developing solution, so as to etch the first insulating photoresist layer 12, thereby forming first windows 121 corresponding to the first preset mask one to one on the first insulating photoresist layer 12. Wherein the first window 121 includes a plurality. The etched first insulating photoresist layer 12 is heated to cure the first insulating photoresist layer 12. Wherein the heating temperature is below 300 ℃. The first conductive metal film 11 forms a first conductive portion 111 exposed to the first window 121 at a position corresponding to the first window 121.
After step S106 is executed, the manufacturing of the first conductive layer 10 further includes: the first conductive trace 13 is printed on a surface of the first conductive metal film 11 away from the first insulating photoresist layer 12. One surface of the first conductive metal film 11 facing away from the first insulating photoresist layer 12 is provided as a first circuit surface 113, and the first conductive trace 13 is provided in an area of the first circuit surface 113 outside the first conductive part 111. The first conductive traces 13 and the first conductive portions 111 do not overlap each other.
In step S2, a second conductive layer is formed. The manufacturing of the second conductive layer 20 specifically includes the following steps.
Step S202, a second conductive metal film is provided. The second conductive metal film 21 includes, but is not limited to, a copper film, a silver film, etc., and the thickness of the second conductive metal film 21 is 3 to 500 micrometers. Preferably, the second conductive metal film 21 is a copper film.
Step S204, coating an insulating photoresist on one side of the second conductive metal film to form a second insulating photoresist layer on one side of the second conductive metal film. After the insulating photoresist is coated on one surface of the second conductive metal film 21, the insulating photoresist is baked to be cured, thereby forming a second insulating photoresist layer 22. Wherein the insulation photoresist is transparent insulation photoresist, and the baking temperature is 60-150 ℃. The second insulating photoresist layer 22 is formed to have a thickness of 2-500 μm.
In step S206, the second insulating photoresist layer is etched to form a second window on the second insulating photoresist layer. In this embodiment, a first predetermined mask is disposed to expose the second insulating photoresist layer 22, and then the second insulating photoresist layer 22 is developed by using a developing solution to etch the second insulating photoresist layer 22, so as to form second windows 221 corresponding to the first predetermined mask on the second insulating photoresist layer 22. Wherein the second window 221 includes a plurality. It is understood that the number of the second windows 221 is the same as the number of the first windows 121, and the positions of the second windows 221 formed on the second insulating photoresist layer 22 correspond to the positions of the first windows 121 formed on the first insulating photoresist layer 12 in a one-to-one manner. The etched second insulating photoresist layer 22 is heated to cure the second insulating photoresist layer 22. Wherein the heating temperature is below 300 ℃. The second conductive metal film 21 forms a second conductive portion 211 exposed to the second window 221 at a position corresponding to the second window 221.
In step S208, the second conductive metal film is etched to form an opening in the second conductive metal film. In this embodiment, a second preset mask is disposed to expose the second conductive metal film 21, and then the second conductive metal film 21 is developed by using a developing solution to etch the second conductive metal film 21, so that openings 212 corresponding to the second preset mask are formed in the second conductive metal film 21. The opening 212 includes a plurality thereof.
After step S208 is performed, the step of forming the second conductive layer 20 further includes: the second conductive traces 23 are printed on the surface of the second conductive metal film 21 away from the second insulating photoresist layer 22. Wherein, the surface of the second conductive metal film 21 departing from the second insulating photoresist layer 22 is set as a second line surface 213. The second conductive traces 23 are disposed on the second wiring surface 213 in regions other than the second conductive portion 211. Wherein the second conductive traces 23 and the second conductive portions 211 do not overlap each other. The second conductive traces 23 may or may not be the same as the first conductive traces 13.
Step S3, the surface of the second conductive metal film away from the second insulating photoresist layer is attached to the surface of the first insulating photoresist layer away from the first conductive metal film. In this embodiment, the insulating photoresist has viscosity, and the first insulating photoresist layer 12 can be heated during the attaching process, so that the second conductive metal film 21 can be attached to the first insulating photoresist layer 12, and the second conductive layer 20 and the first conductive layer 10 are disposed together. The first conductive metal film 11, the first insulating photoresist layer 12, the second conductive metal film 21, and the second insulating photoresist layer 22 are sequentially stacked. The first window 121 and the second window 221 are correspondingly disposed. In some possible embodiments, the first conductive layer 10 and the second conductive layer 20 may be tightly combined by disposing a material having viscosity such as glue between the first conductive layer 10 and the second conductive layer 20.
Step S4, a conductive material is coated on the second window to electrically connect the first conductive portion and the second conductive portion. The step of coating the conductive material 40 on the second window 221 specifically includes the following steps.
In step S402, solder paste is disposed in the second window. In this embodiment, the solder paste is disposed on the second window 221 by printing.
Step S404, heating the solder paste to make the solder paste fit with the second conductive portion and fit with the first conductive portion through the opening. The heated solder paste is molten and has fluidity. Then, the solder paste flows from the second window 221 to be attached to the second conductive portion 211, and then flows to the first window 121 through the opening 212, so that the solder paste is attached to the first conductive portion 111.
Step S406, solidifying the solder paste. In this embodiment, the solder paste may be solidified by cooling. The solidified solder paste penetrates through the second window 221, the opening 212 and the first window 121, so that the first conductive portion 111 and the second conductive portion 211 are electrically connected.
In some possible embodiments, a conductive material such as silver paste may be further disposed in the second window 221 to electrically connect the first conductive portion 111 and the second conductive portion 211.
In the embodiment, the plurality of openings are formed in the second conductive part at one time directly in an etching mode, so that the production efficiency is greatly improved. Meanwhile, the manufacturing flows of the first conducting layer and the second conducting layer are similar, the overall manufacturing process of the multilayer conducting circuit is simple, and the production efficiency can be greatly improved.
In some possible embodiments, multilayer conductive trace 100 further includes at least one third conductive layer 30. The manufacturing process of the third conductive layer 30 is the same as the manufacturing process of the second conductive layer 20, and is not described herein again.
In other possible embodiments, when the first insulating photoresist layer 12 and the second insulating photoresist layer 22 are formed to have a relatively thick thickness, the multilayer conductive circuit 100 can be used to fabricate a small-sized display screen; when the first insulating photoresist layer 12 and the second insulating photoresist layer 22 are formed to have a small thickness, the multi-layer conductive circuit 100 can be used to fabricate a large-sized display panel.
When the thicknesses of the first insulating photoresist layer 12 and the second insulating photoresist layer 22 are relatively thin, in the process of manufacturing the first conductive layer 10, after the etched first insulating photoresist layer 12 is heated to cure the first insulating photoresist layer 12, a protective film (not shown) is laminated on the surface of the first insulating photoresist layer 12 away from the first conductive metal film 11. Accordingly, in the process of manufacturing the second conductive layer 20, after the etched second insulating photoresist layer 22 is heated to cure the second insulating photoresist layer 22, a protective film (not shown) is laminated on a surface of the second insulating photoresist layer 22 away from the second conductive metal film 21. Wherein the protective film is made of high temperature resistant material, and the high temperature resistant temperature range is 140-. Before step S3 is executed, the protective film compounded on the first insulating photoresist layer 12 is removed, and then the first insulating photoresist layer 12 is attached to the second conductive metal film 21.
Please refer to fig. 3, which is a schematic cross-sectional view of a display module according to an embodiment of the invention. The display module 1000 comprises a plurality of LED lamp beads 200 and a plurality of layers of conductive circuits 100, wherein the plurality of layers of conductive circuits 100 are electrically connected with the plurality of LED lamp beads 200. In this embodiment, the plurality of LED beads 200 are disposed on a surface of the first conductive metal film 11 departing from the first insulating photoresist layer 12, and electrically connected to the first conductive traces 13. The specific structure of the multilayer conductive circuit 100 is described with reference to the above embodiments. Since the display module 1000 adopts all technical solutions of all the embodiments, at least all the beneficial effects brought by the technical solutions of the embodiments are achieved, and are not described in detail herein.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, insofar as these modifications and variations of the invention fall within the scope of the claims of the invention and their equivalents, the invention is intended to include these modifications and variations.
The above-mentioned embodiments are only examples of the present invention, which should not be construed as limiting the scope of the present invention, and therefore, the present invention is not limited by the claims.
Claims (10)
1. A multilayer conductive trace, comprising:
the first conductive layer comprises a first conductive metal film and a first insulating photoresist layer, the first insulating photoresist layer is arranged on one surface of the first conductive metal film, the first insulating photoresist layer is provided with a first window, and a first conductive part exposed out of the first window is formed on the first conductive metal film at the position corresponding to the first window; and
the second conducting layer comprises a second conducting metal film and a second insulating photoresist layer, the second insulating photoresist layer is arranged on one surface of the second conducting metal film, the second insulating photoresist layer is provided with a second window, the second conducting metal film is provided with an opening at the position corresponding to the second window, so that the second conducting metal film forms a second conducting part exposed out of the second window and surrounding the opening, one surface of the second conducting metal film departing from the second insulating photoresist layer is attached to one surface of the first insulating photoresist layer departing from the first conducting metal film, the first window and the second window are correspondingly arranged, and the first conducting part is electrically connected with the second conducting part.
2. The multilayer conductive trace of claim 1, further comprising a conductive material disposed in the second window such that the conductive material conforms to the second conductive portion and conforms to the first conductive portion through the opening such that the first conductive portion and the second conductive portion are electrically connected.
3. The multilayer conductive trace according to claim 1, wherein a surface of the first conductive metal film facing away from the first insulating resist layer is provided as a first trace surface provided with a first conductive trace in a region other than the first conductive portion, the first conductive trace and the first conductive portion being not overlapped with each other; one surface of the second conductive metal film, which is far away from the second insulating light resistance layer, is set to be a second line surface, a second conductive circuit is arranged on the second line surface in a region outside the second conductive part, and the second conductive circuit and the second conductive part are not overlapped.
4. The multilayer conductive trace of claim 1, wherein the first window, the second window, and the opening are formed by etching, and the first window, the second window, and the opening comprise a plurality.
5. The multilayer conductive trace of claim 1, further comprising at least one third conductive layer having the same structure as the second conductive layer, the third conductive layer being disposed on a side of the second conductive layer remote from the first conductive layer.
6. A display module, characterized in that, the display module includes a plurality of LED lamp pearls and the multilayer conducting circuit of any one of claims 1 to 5, the plurality of LED lamp pearls and the multilayer conducting circuit are electrically connected.
7. A method for manufacturing a multilayer conductive circuit is characterized by comprising the following steps:
manufacturing a first conductive layer, wherein the manufacturing of the first conductive layer specifically comprises:
providing a first conductive metal film;
coating an insulating photoresist on one surface of the first conductive metal film to form a first insulating photoresist layer on one surface of the first conductive metal film; and
etching the first insulation photoresist layer to form a first window on the first insulation photoresist layer, wherein the first conductive metal film forms a first conductive part exposed out of the first window at a position corresponding to the first window;
manufacturing a second conductive layer, wherein the manufacturing of the second conductive layer specifically comprises:
providing a second conductive metal film;
coating an insulating photoresist on one surface of the second conductive metal film to form a second insulating photoresist layer on one surface of the second conductive metal film;
etching the second insulating photoresist layer to form a second window in the second insulating photoresist layer, wherein the second conductive metal film forms a second conductive part exposed out of the second window at a position corresponding to the second window; and
etching the second conductive metal film to form an opening in the second conductive metal film;
attaching one surface of the second conductive metal film, which is far away from the second insulating light resistance layer, to one surface of the first insulating light resistance layer, which is far away from the first conductive metal film, wherein the first window and the second window are correspondingly arranged; and
and coating a conductive material on the second window so as to electrically connect the first conductive part and the second conductive part.
8. The method of claim 7, wherein applying a conductive material to the second window to electrically connect the first conductive portion and the second conductive portion comprises:
arranging solder paste on the second window;
heating the solder paste to enable the solder paste to be attached to the second conductive part and to be attached to the first conductive part through the opening; and
and solidifying the solder paste.
9. The method of forming a multilayer conductive trace according to claim 7, wherein etching the first insulating photoresist to form a first window in the first insulating photoresist further comprises:
printing a first conductive circuit on the first conductive metal film, wherein a first circuit surface is arranged on one surface of the first conductive metal film, which is far away from the first insulating photoresist layer, and the first conductive circuit is arranged in an area of the first circuit surface, which is outside the first conductive part.
10. The method of forming a multilayer conductive trace according to claim 7, wherein etching the second insulating photoresist layer to form a second window in the second insulating photoresist layer, the forming a second conductive layer further comprises:
and printing a second conductive circuit on the second conductive metal film, wherein one surface of the second conductive metal film, which is far away from the second insulating photoresist layer, is set as a second circuit surface, and the second conductive circuit is arranged in an area of the second circuit surface, which is outside the second conductive part.
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| CN202111518337.8A CN114501856A (en) | 2021-12-13 | 2021-12-13 | Multi-layer conductive circuit, manufacturing method thereof and display module |
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| CN202111518337.8A CN114501856A (en) | 2021-12-13 | 2021-12-13 | Multi-layer conductive circuit, manufacturing method thereof and display module |
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