TW200726353A - Structure of circuit board and method for fabricating the same - Google Patents

Structure of circuit board and method for fabricating the same

Info

Publication number
TW200726353A
TW200726353A TW094145205A TW94145205A TW200726353A TW 200726353 A TW200726353 A TW 200726353A TW 094145205 A TW094145205 A TW 094145205A TW 94145205 A TW94145205 A TW 94145205A TW 200726353 A TW200726353 A TW 200726353A
Authority
TW
Taiwan
Prior art keywords
layer
circuit board
circuit structure
openings
fabricating
Prior art date
Application number
TW094145205A
Other languages
Chinese (zh)
Other versions
TWI295550B (en
Inventor
Shing-Ru Wang
Hsien-Shou Wang
Shih-Ping Hsu
Original Assignee
Phoenix Prec Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenix Prec Technology Corp filed Critical Phoenix Prec Technology Corp
Priority to TW094145205A priority Critical patent/TWI295550B/en
Priority to JP2006249779A priority patent/JP2007173775A/en
Priority to US11/588,911 priority patent/US7906850B2/en
Priority to KR1020060120239A priority patent/KR20070065789A/en
Publication of TW200726353A publication Critical patent/TW200726353A/en
Application granted granted Critical
Publication of TWI295550B publication Critical patent/TWI295550B/en
Priority to KR1020100132506A priority patent/KR20110003453A/en
Priority to US13/046,441 priority patent/US8709940B2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

A structure of a circuit board and a method for fabricating the same are proposed. A carrier board, which is an insulating layer with a metal layer forming on a surface thereof, is provided. A insulating protecting layer is formed on the carrier board, and a plurality of openings are formed in the insulating protecting layer for exposing the metal layer. A circuit structure is formed on the surface of the insulating protecting layer and in the openings, and the circuit structure is electrically connected to the metal layer. A dielectric layer is formed on the insulating protecting layer and the circuit structure, and a plurality of openings are formed in the dielectric layer to expose part of the circuit structure. Subsequently, the carrier board is removed and the circuit board without the core is formed. Thus, the thickness of the circuit board is reduced, and it is beneficial to shrink the package size and improve the performance. Therefore, the present invention is fulfilled the development of the electronic devices with smaller volume.
TW094145205A 2005-12-20 2005-12-20 Structure of circuit board and method for fabricating the same TWI295550B (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
TW094145205A TWI295550B (en) 2005-12-20 2005-12-20 Structure of circuit board and method for fabricating the same
JP2006249779A JP2007173775A (en) 2005-12-20 2006-09-14 Circuit board structure and manufacturing method therefor
US11/588,911 US7906850B2 (en) 2005-12-20 2006-10-27 Structure of circuit board and method for fabricating same
KR1020060120239A KR20070065789A (en) 2005-12-20 2006-11-30 Structure of circuit board and method for fabricating the same
KR1020100132506A KR20110003453A (en) 2005-12-20 2010-12-22 Structure of circuit board and method for fabricating the same
US13/046,441 US8709940B2 (en) 2005-12-20 2011-03-11 Structure of circuit board and method for fabricating the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094145205A TWI295550B (en) 2005-12-20 2005-12-20 Structure of circuit board and method for fabricating the same

Publications (2)

Publication Number Publication Date
TW200726353A true TW200726353A (en) 2007-07-01
TWI295550B TWI295550B (en) 2008-04-01

Family

ID=38299877

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094145205A TWI295550B (en) 2005-12-20 2005-12-20 Structure of circuit board and method for fabricating the same

Country Status (3)

Country Link
JP (1) JP2007173775A (en)
KR (2) KR20070065789A (en)
TW (1) TWI295550B (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102821559A (en) * 2011-06-09 2012-12-12 日本特殊陶业株式会社 Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate
TWI406342B (en) * 2009-04-30 2013-08-21 Lg Innotek Co Ltd Semiconductor package with nsmd type solder mask and method for manufacturing the same
TWI492681B (en) * 2011-06-09 2015-07-11 Ngk Spark Plug Co Manufacturing method of multilayer wiring board, and multilayer wiring board
TWI548030B (en) * 2014-04-15 2016-09-01 矽品精密工業股份有限公司 Conductive blind-hole structure and manufacturing method thereof
CN114173479A (en) * 2021-11-18 2022-03-11 苏州群策科技有限公司 Circuit board and manufacturing method thereof
CN114501856A (en) * 2021-12-13 2022-05-13 深圳市华鼎星科技有限公司 Multi-layer conductive circuit, manufacturing method thereof and display module

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100902128B1 (en) * 2007-09-28 2009-06-09 삼성전기주식회사 Heat radiating printed circuit board and semiconductor chip package
KR100979818B1 (en) 2007-12-13 2010-09-06 삼성전기주식회사 Manufacturing method of PCB
KR100925666B1 (en) * 2007-12-18 2009-11-10 대덕전자 주식회사 Method of fabricating solder bump for flip chip technology
KR100895820B1 (en) 2008-01-02 2009-05-06 주식회사 하이닉스반도체 Circuit substrate for semiconductor package, and method of manufacturing the same and semiconductor package having the circuit substrate
KR100969412B1 (en) 2008-03-18 2010-07-14 삼성전기주식회사 Multilayer printed circuit board and a fabricating method of the same
KR101032463B1 (en) 2008-04-02 2011-05-03 삼성전기주식회사 Printed circuit board and manufacturing method thereof
KR101051565B1 (en) * 2008-05-13 2011-07-22 삼성전기주식회사 Printed circuit board and manufacturing method thereof
JP5203108B2 (en) 2008-09-12 2013-06-05 新光電気工業株式会社 Wiring board and manufacturing method thereof
KR20100043547A (en) 2008-10-20 2010-04-29 삼성전기주식회사 Coreless substrate having filled via pad and a fabricating method the same
KR101025520B1 (en) * 2008-11-26 2011-04-04 삼성전기주식회사 manufacturing method for multi-layer PCB
JP5269563B2 (en) * 2008-11-28 2013-08-21 新光電気工業株式会社 Wiring board and manufacturing method thereof
KR101055586B1 (en) * 2009-07-03 2011-08-08 삼성전기주식회사 Manufacturing Method of Printed Circuit Board with Metal Bump
KR101067031B1 (en) 2009-07-31 2011-09-22 삼성전기주식회사 A printed circuit board and a fabricating method the same
KR101077380B1 (en) * 2009-07-31 2011-10-26 삼성전기주식회사 A printed circuit board and a fabricating method the same
TWI393233B (en) * 2009-08-18 2013-04-11 Unimicron Technology Corp Coreless package substrate and method of forming the same
KR101140882B1 (en) * 2009-08-31 2012-05-03 삼성전기주식회사 A printed circuit board having a bump and a method of manufacturing the same
JP5504149B2 (en) * 2009-12-28 2014-05-28 日本特殊陶業株式会社 Multilayer wiring board
TWI422000B (en) * 2010-01-26 2014-01-01 Unimicron Technology Corp Coreless packaging substrate and method for manufacturing the same
KR101340348B1 (en) * 2011-11-30 2013-12-11 주식회사 심텍 Embedded chip package board using mask pattern and method for manufacturing the same
JP5580374B2 (en) * 2012-08-23 2014-08-27 新光電気工業株式会社 Wiring board and manufacturing method thereof
JP6029958B2 (en) * 2012-12-04 2016-11-24 新光電気工業株式会社 Wiring board manufacturing method
KR101501902B1 (en) * 2013-07-16 2015-03-13 주식회사 심텍 Printed circuit board substrate having metal post and the method of manufacturing the same
CN104576596B (en) 2013-10-25 2019-01-01 日月光半导体制造股份有限公司 Semiconductor substrate and its manufacturing method
US9679841B2 (en) * 2014-05-13 2017-06-13 Qualcomm Incorporated Substrate and method of forming the same
JP7338991B2 (en) * 2019-03-04 2023-09-05 リンクステック株式会社 Wiring board with support, electronic component package with support, and manufacturing method thereof
CN114126257B (en) * 2020-08-27 2024-03-22 深南电路股份有限公司 Circuit board and manufacturing method thereof
TW202329340A (en) * 2021-12-06 2023-07-16 日商Ｍｇｃ電子科技股份有限公司 Wiring board with support, method for manufacturing wiring board with support, and method for manufacturing electronic component mounting board
WO2023127470A1 (en) * 2021-12-27 2023-07-06 株式会社村田製作所 Method for producing multilayer ceramic capacitor

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI406342B (en) * 2009-04-30 2013-08-21 Lg Innotek Co Ltd Semiconductor package with nsmd type solder mask and method for manufacturing the same
CN102821559A (en) * 2011-06-09 2012-12-12 日本特殊陶业株式会社 Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate
US9006580B2 (en) 2011-06-09 2015-04-14 Ngk Spark Plug Co., Ltd. Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate
TWI492681B (en) * 2011-06-09 2015-07-11 Ngk Spark Plug Co Manufacturing method of multilayer wiring board, and multilayer wiring board
TWI548030B (en) * 2014-04-15 2016-09-01 矽品精密工業股份有限公司 Conductive blind-hole structure and manufacturing method thereof
CN114173479A (en) * 2021-11-18 2022-03-11 苏州群策科技有限公司 Circuit board and manufacturing method thereof
CN114501856A (en) * 2021-12-13 2022-05-13 深圳市华鼎星科技有限公司 Multi-layer conductive circuit, manufacturing method thereof and display module

Also Published As

Publication number Publication date
KR20070065789A (en) 2007-06-25
KR20110003453A (en) 2011-01-12
TWI295550B (en) 2008-04-01
JP2007173775A (en) 2007-07-05

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