TW200637448A - Method for fabricating conducting bump structures of circuit board - Google Patents

Method for fabricating conducting bump structures of circuit board

Info

Publication number
TW200637448A
TW200637448A TW094110691A TW94110691A TW200637448A TW 200637448 A TW200637448 A TW 200637448A TW 094110691 A TW094110691 A TW 094110691A TW 94110691 A TW94110691 A TW 94110691A TW 200637448 A TW200637448 A TW 200637448A
Authority
TW
Taiwan
Prior art keywords
layer
circuit board
formed
conducting
bump structures
Prior art date
Application number
TW094110691A
Other versions
TWI270329B (en
Inventor
Wen-Hung Hu
Original Assignee
Phoenix Prec Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenix Prec Technology Corp filed Critical Phoenix Prec Technology Corp
Priority to TW94110691A priority Critical patent/TWI270329B/en
Publication of TW200637448A publication Critical patent/TW200637448A/en
Application granted granted Critical
Publication of TWI270329B publication Critical patent/TWI270329B/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02Electroplating of selected surface areas
    • C25D5/022Electroplating of selected surface areas using masking means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3473Plating of solder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007Surface contacts, e.g. bumps
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/421Blind plated via connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0364Conductor shape
    • H05K2201/0367Metallic bump or raised conductor not used as solder bump
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09372Pads and lands
    • H05K2201/09436Pads or lands on permanent coating which covers the other conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/09563Metal filled via
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04Soldering or other types of metallurgic bonding
    • H05K2203/043Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0502Patterning and lithography
    • H05K2203/054Continuous temporary metal layer over resist, e.g. for selective electroplating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0562Details of resist
    • H05K2203/0568Resist used for applying paste, ink or powder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061Etching masks
    • H05K3/062Etching masks consisting of metals or alloys or metallic inorganic compounds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061Etching masks
    • H05K3/064Photoresists
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3478Applying solder paste, particles or preforms; Transferring prefabricated solder patterns
    • H05K3/3484Paste or slurry or powder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/423Plated through-holes or plated via connections characterised by electroplating method

Abstract

A method for fabricating conducting bump structures of a circuit board is proposed. A circuit board has a plurality of electrical connecting pads thereon, and an insulating protection layer with openings for exposing the electrical connecting pads covers the circuit board. A conducting layer is formed on the insulating protection layer and surface of openings. A metal layer is formed on the conducting layer by electroplating. A resist layer is formed on the metal layer, a plurality of openings corresponding to the electrical connection pads are formed in the resist layer, and an adhesive layer is formed on the resist layer and surface of openings. After removing the resist layer, and the conducting layer and the metal layer that are covered by the resist layer, the conducting bump structures for electrically connecting the circuit board to other means are formed on the electrical connecting pads.
TW94110691A 2005-04-04 2005-04-04 Method for fabricating conducting bump structures of circuit board TWI270329B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94110691A TWI270329B (en) 2005-04-04 2005-04-04 Method for fabricating conducting bump structures of circuit board

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW94110691A TWI270329B (en) 2005-04-04 2005-04-04 Method for fabricating conducting bump structures of circuit board
US11/397,417 US20060219567A1 (en) 2005-04-04 2006-04-03 Fabrication method of conductive bump structures of circuit board

Publications (2)

Publication Number Publication Date
TW200637448A true TW200637448A (en) 2006-10-16
TWI270329B TWI270329B (en) 2007-01-01

Family

ID=37069006

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94110691A TWI270329B (en) 2005-04-04 2005-04-04 Method for fabricating conducting bump structures of circuit board

Country Status (2)

Country Link
US (1) US20060219567A1 (en)
TW (1) TWI270329B (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI261329B (en) * 2005-03-09 2006-09-01 Phoenix Prec Technology Corp Conductive bump structure of circuit board and method for fabricating the same
TWI327876B (en) * 2007-08-23 2010-07-21 Unimicron Technology Corp Circuit board having electrical connecting structure and fabrication method thereof
EP2180770A1 (en) * 2008-10-21 2010-04-28 Atotech Deutschland Gmbh Method to form solder deposits on substrates
US8507376B2 (en) * 2008-10-21 2013-08-13 Atotech Deutschland Gmbh Method to form solder deposits on substrates
EP2244285A1 (en) 2009-04-24 2010-10-27 ATOTECH Deutschland GmbH Method to form solder deposits on substrates
TWI419284B (en) * 2010-05-26 2013-12-11 Chipmos Technologies Inc Chip bump structure and method for forming chip bump structure
EP2405469B1 (en) 2010-07-05 2016-09-21 ATOTECH Deutschland GmbH Method to form solder alloy deposits on substrates
EP2405468A1 (en) * 2010-07-05 2012-01-11 ATOTECH Deutschland GmbH Method to form solder deposits on substrates
EP2416634A1 (en) 2010-08-02 2012-02-08 ATOTECH Deutschland GmbH Method to form solder deposits on substrates
US20130105329A1 (en) 2010-08-02 2013-05-02 Atotech Deutschland Gmbh Method to form solder deposits and non-melting bump structures on substrates
EP2453471A3 (en) * 2010-11-15 2013-05-15 Dyconex AG Method for electrodeposition of an elctrode on a dielectric substrate
EP2503029B1 (en) 2011-03-22 2013-03-20 Atotech Deutschland GmbH Process for etching a recessed structure filled with tin or a tin alloy
EP2506690A1 (en) 2011-03-28 2012-10-03 Atotech Deutschland GmbH Method to form solder deposits and non-melting bump structures on substrates
CN103635017B (en) * 2012-08-24 2016-12-28 碁鼎科技秦皇岛有限公司 The circuit board and manufacturing method thereof
EP2709160B1 (en) * 2012-09-14 2016-03-30 ATOTECH Deutschland GmbH Method for metallization of solar cell substrates
US10115690B2 (en) * 2015-02-26 2018-10-30 Taiwan Semiconductor Manufacturing Co., Ltd. Method of manufacturing micro pins and isolated conductive micro pin
TW201831064A (en) 2016-12-23 2018-08-16 德商德國艾托特克公司 The method of forming a solder deposit on the contact pads solderable

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2728693A (en) * 1953-08-24 1955-12-27 Motorola Inc Method of forming electrical conductor upon an insulating base
US5545308A (en) * 1995-06-19 1996-08-13 Lynntech, Inc. Method of using conductive polymers to manufacture printed circuit boards
TWI255158B (en) * 2004-09-01 2006-05-11 Phoenix Prec Technology Corp Method for fabricating electrical connecting member of circuit board
TWI261329B (en) * 2005-03-09 2006-09-01 Phoenix Prec Technology Corp Conductive bump structure of circuit board and method for fabricating the same

Also Published As

Publication number Publication date
TWI270329B (en) 2007-01-01
US20060219567A1 (en) 2006-10-05

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees