CN114173479A - Circuit board and manufacturing method thereof - Google Patents

Circuit board and manufacturing method thereof Download PDF

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Publication number
CN114173479A
CN114173479A CN202111366264.5A CN202111366264A CN114173479A CN 114173479 A CN114173479 A CN 114173479A CN 202111366264 A CN202111366264 A CN 202111366264A CN 114173479 A CN114173479 A CN 114173479A
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CN
China
Prior art keywords
layer
circuit
conductive
forming
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111366264.5A
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Chinese (zh)
Inventor
许怡雯
许弘煜
方柏凯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unimicron Technology Suzhou Corp
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Unimicron Technology Suzhou Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unimicron Technology Suzhou Corp filed Critical Unimicron Technology Suzhou Corp
Priority to CN202111366264.5A priority Critical patent/CN114173479A/en
Publication of CN114173479A publication Critical patent/CN114173479A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The invention discloses a circuit board and a manufacturing method thereof, and provides a core board.A conductive layer is formed on the surface of the core board, a first resistance layer is formed on the surface of the conductive layer, a plurality of opening areas are formed on the first resistance layer, and part of the conductive layer of a circuit in each opening area is formed; then, the conductive layer forms a first circuit layer in an electroplating form; then, removing the first resistance layer and the conductive layer covered by the first resistance layer to expose the first circuit layer; and finally, forming a circuit layer adding structure on the surface of the core board and the surface of the first circuit layer, forming an insulating protective layer on the circuit layer adding structure, and forming a plurality of openings in the insulating protective layer.

Description

Circuit board and manufacturing method thereof
Technical Field
The invention relates to the technical field of PCB manufacturing, in particular to a circuit board and a manufacturing method thereof.
Background
With the rapid advance of the production technology in the electronic industry in recent years, the circuit board can be mounted with various electronic components with exquisite volume so as to be widely applied to electronic products with different functions. On some precise electronic components, the lines to be arranged are thin.
In the prior art, an etching process is adopted to remove part of the conductive layer and the copper foil layer exposed by the patterned photoresist layer, and the etching degree of the etching solution to the copper foil layer and the conductive layer cannot be controlled, so that the width of the obtained circuit does not meet the specification of the required fine circuit.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides a circuit board and a manufacturing method thereof, which adopt a process means of a copper increasing method to solve the technical problem that the circuit width does not meet the circuit specification due to over etching of an etching solution.
The invention discloses a manufacturing method of a circuit board, which comprises the following steps:
providing a core board;
forming a conductive layer on the surface of the core board;
forming a first resistance layer on the surface of the conductive layer, wherein the first resistance layer forms a plurality of opening areas, and part of the conductive layer is exposed from the opening areas;
forming a first circuit layer on the conductive layer;
removing the first resistance layer and the conductive layer covered by the first resistance layer to expose the first circuit layer and the core board;
forming a circuit layer adding structure on the surface of the exposed core board and the surface of the first circuit board;
and forming an insulating protection layer on the surface of the line layer adding structure, wherein a plurality of openings are formed in the insulating protection layer.
Further, in the above method for manufacturing a circuit board, the step of "forming a first circuit layer on the conductive layer" forms the first circuit layer by electroplating.
Further, in the manufacturing method of the circuit board, a circuit build-up structure is formed on the surface of the core board and the surface of the first circuit layer, the circuit build-up structure includes a dielectric layer, a second circuit layer and a conductive blind hole, the second circuit layer and the conductive blind hole are arranged on the dielectric layer, and the conductive blind hole is formed in the dielectric layer and electrically connected with the second circuit layer.
Furthermore, in the manufacturing method of the circuit board, part of the conductive blind holes are electrically connected with the first circuit layer.
Furthermore, in the manufacturing method of the circuit board, the end face of the second circuit layer is provided with a plurality of electrical connection pads.
Further, in the manufacturing method of the circuit board, an insulating protection layer is formed on the surface of the line build-up structure, and a plurality of openings are formed in the insulating protection layer, and a plurality of openings exposing the electrical connection pads are formed in the insulating protection layer.
Furthermore, the invention also discloses a circuit board, which comprises a core board;
the conducting layers are arranged on the surface of the core plate at intervals;
the first circuit layer is arranged on the surface of the conductive layer;
the circuit layer-adding structure is arranged on the surfaces of the core board and the first circuit layer;
and the insulating protective layer is arranged on the surface of the line layer-adding structure.
Furthermore, in the above circuit board, the circuit layer adding structure includes a dielectric layer, a second circuit layer and a conductive blind hole, the second circuit layer and the conductive blind hole are disposed on the dielectric layer, the conductive blind hole is disposed in the dielectric layer and electrically connected to the second circuit layer, a part of the conductive blind hole is electrically connected to the first circuit layer, and a plurality of electrically connected pads are disposed on an end surface of the second circuit layer.
Furthermore, in the circuit board, the insulating protection layer is provided with a plurality of openings exposing the electrical connection pads.
The invention has the following beneficial effects:
the circuit width of the circuit board manufactured by the copper increasing method meets the specification, the circuit width of the circuit board meets the specification of a fine circuit, the dielectric layers and the circuit layers are alternately stacked by utilizing a circuit layer increasing technology, and the conductive blind holes are formed in the core board and can be electrically connected with the multiple circuit layers.
In order to make the aforementioned and other objects, features and advantages of the invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic flow chart illustrating steps of a method for manufacturing a circuit board according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of a conductive layer and a first resist layer formed in an embodiment of the invention;
FIG. 3 is a cross-sectional view of a first circuit layer formed in an embodiment of the invention;
FIG. 4 is a cross-sectional view of an embodiment of the present invention showing the formation of a layer with the first resist layer and a portion of the line layer removed;
FIG. 5 is a schematic cross-sectional view of a circuit board with a build-up structure and an insulating protection layer formed thereon according to an embodiment of the invention.
Reference numerals of the above figures: 10-a core board; 11-a conductive layer; 12-a first resist layer; 12 a-an open area; 13-a first circuit layer; 20 line build-up structure; 21-a dielectric layer; 231-a second line layer; 232-conductive blind holes; 235-electrical connection pads; 24-an insulating protective layer; 24 a-opening of the hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature.
The present invention will be described in detail with reference to the accompanying drawings 1 to 5 and examples.
Examples
As shown in fig. 1, the method for manufacturing a circuit board according to this embodiment includes the following steps:
as shown in fig. 2, a core board 10 is provided;
forming a conductive layer 11 on a surface of the core board 10;
forming a first resist layer 12 on the surface of the conductive layer 11, wherein the first resist layer 12 forms a plurality of opening areas 12a, and the opening areas 12a expose part of the conductive layer 11;
as shown in fig. 3, a first wiring layer 13 is formed on the conductive layer 11;
as shown in fig. 4, the first resist layer 12 and the conductive layer 13 covered by the first resist layer are removed, and the first circuit layer 13 and the core board 10 are exposed;
as shown in fig. 5, a circuit build-up structure 20 is formed on the exposed surface of the core board 10 and the surface of the first circuit layer 13;
an insulating protection layer 24 is formed on the surface of the line build-up structure 20, and a plurality of openings 24a are formed in the insulating protection layer 24.
By the method, firstly, an operator provides a core board 10, a conductive layer 11 is formed on the surface of the core board 10, a first resist layer 12 is formed on the surface of the conductive layer 11, a plurality of opening areas 12a are formed on the first resist layer 12, and the opening areas 12a are partially connected with the conductive layer 11; then, as shown in fig. 3, the conductive layer 11 forms a first wiring layer 13 in the form of plating; then, as shown in fig. 4, the first resist layer 12 and the conductive layer 11 covered by the first resist layer are removed to expose the first circuit layer 13; finally, as shown in fig. 5, a build-up structure 20 is formed on the surface of the core board 10 and the surface of the first circuit layer 13, an insulating protective layer 24 such as a solder mask layer is formed on the build-up structure 20, and a plurality of openings 24a are formed in the insulating protective layer 24, so as to implement a manufacturing method of a circuit board, which can effectively control the circuit width on the circuit board, the circuit width of the obtained circuit board conforms to the specification of a fine circuit, and conductive blind vias are formed in the core board by alternately stacking dielectric layers and circuit layers by using a circuit build-up technology, and the conductive blind vias can be electrically connected to a plurality of circuit layers.
Specifically, in the present embodiment, the step "forming the first circuit layer 13 on the conductive layer 11" forms the first circuit layer 13 by electroplating.
Specifically, in this embodiment, the step "forming a line build-up structure 20 on the surface of the core board 10 and the surface of the first line layer 13", where the line build-up structure 20 includes a dielectric layer 21, a second line layer 231 disposed on the dielectric layer 21, and a conductive blind via 232, and the conductive blind via 232 is formed in the dielectric layer 21 and electrically connected to the second line layer 231.
Specifically, in the present embodiment, a portion of the conductive blind via 232 is electrically connected to the first circuit layer 13.
Specifically, in the present embodiment, the end surface of the second circuit layer 231 is provided with a plurality of electrical connection pads 235.
Specifically, in this embodiment, the step of "forming an insulating protection layer 24 on the surface of the line build-up structure 20, and forming a plurality of openings in the insulating protection layer 24" is to form a plurality of openings 24a exposing the electrical connection pads 235 in the insulating protection layer 24. The dielectric layer and the circuit layer are alternately stacked by using a circuit layer-adding technology, and a conductive blind hole is formed in the core board to be electrically connected with the plurality of circuit layers.
As shown in fig. 5, a circuit board according to the present embodiment includes a core board 10; the surface of the core board 10 is provided with conducting layers 11 at intervals; a first circuit layer 13 is electroplated on the surface of the conductive layer 11; the line layer-adding structure 20 is arranged on the surfaces of the core board 10 and the first line layer 13; an insulating protective layer 24 is disposed on the surface of the line build-up structure 20. The circuit build-up structure 20 includes a dielectric layer 21, a second circuit layer 231 disposed on the dielectric layer 21, and a conductive blind via 232, wherein the conductive blind via 232 is disposed in the dielectric layer 21 and electrically connected to the second circuit layer 231, a portion of the conductive blind via 232 is electrically connected to the first circuit layer 13, and a plurality of electrically connected pads 235 are disposed on an end surface of the second circuit layer 231; the insulating passivation layer 24 has a plurality of openings 24a exposing the pads 235, providing a circuit board having a width conforming to the circuit specification.
The principle and the implementation mode of the invention are explained by applying specific embodiments in the invention, and the description of the embodiments is only used for helping to understand the method and the core idea of the invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.

Claims (9)

1. A manufacturing method of a circuit board is characterized by comprising the following steps:
providing a core board;
forming a conductive layer on the surface of the core board;
forming a first resistance layer on the surface of the conductive layer, wherein the first resistance layer forms a plurality of opening areas, and part of the conductive layer is exposed from the opening areas;
forming a first circuit layer on the conductive layer;
removing the first resistance layer and the conductive layer covered by the first resistance layer to expose the first circuit layer and the core board;
forming a circuit layer adding structure on the surface of the exposed core board and the surface of the first circuit board;
and forming an insulating protection layer on the surface of the line layer-adding structure, and forming a plurality of openings in the insulating protection layer.
2. The method for manufacturing a wiring board according to claim 1, wherein the step of "forming a first wiring layer on the conductive layer" forms the first wiring layer by electroplating.
3. The method according to claim 1, wherein the step of forming a build-up structure on the surface of the core board and the surface of the first circuit layer includes forming a build-up structure on the core board, the build-up structure including a dielectric layer, a second circuit layer disposed on the dielectric layer, and a conductive blind via formed in the dielectric layer and electrically connected to the second circuit layer.
4. The method of claim 3, wherein a portion of the conductive vias are electrically connected to the first circuit layer.
5. The method of claim 3, wherein the second circuit layer has a plurality of pads on an end surface thereof.
6. The method of claim 5, wherein an insulating protection layer is formed on the surface of the build-up structure, and a plurality of openings are formed in the insulating protection layer, and a plurality of openings exposing the pads are formed in the insulating protection layer.
7. A circuit board, comprising:
a core board;
the conducting layers are arranged on the surface of the core plate at intervals;
the first circuit layer is arranged on the surface of the conductive layer;
the circuit layer-adding structure is arranged on the surfaces of the core board and the first circuit layer;
and the insulating protective layer is arranged on the surface of the line layer-adding structure.
8. The circuit board of claim 7, wherein the build-up structure comprises a dielectric layer, a second circuit layer disposed on the dielectric layer, and conductive blind vias disposed in the dielectric layer and electrically connected to the second circuit layer, wherein a portion of the conductive blind vias are electrically connected to the first circuit layer, and a plurality of electrically connected pads are disposed on an end surface of the second circuit layer.
9. The circuit board of claim 8, wherein the insulating protective layer has a plurality of openings exposing the pads.
CN202111366264.5A 2021-11-18 2021-11-18 Circuit board and manufacturing method thereof Pending CN114173479A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111366264.5A CN114173479A (en) 2021-11-18 2021-11-18 Circuit board and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111366264.5A CN114173479A (en) 2021-11-18 2021-11-18 Circuit board and manufacturing method thereof

Publications (1)

Publication Number Publication Date
CN114173479A true CN114173479A (en) 2022-03-11

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111366264.5A Pending CN114173479A (en) 2021-11-18 2021-11-18 Circuit board and manufacturing method thereof

Country Status (1)

Country Link
CN (1) CN114173479A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200726353A (en) * 2005-12-20 2007-07-01 Phoenix Prec Technology Corp Structure of circuit board and method for fabricating the same
TW200917911A (en) * 2007-10-09 2009-04-16 Phoenix Prec Technology Corp Printed circuit board and fabrication method thereof
CN101567356A (en) * 2008-04-23 2009-10-28 全懋精密科技股份有限公司 Circuit board structure and manufacture method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200726353A (en) * 2005-12-20 2007-07-01 Phoenix Prec Technology Corp Structure of circuit board and method for fabricating the same
TW200917911A (en) * 2007-10-09 2009-04-16 Phoenix Prec Technology Corp Printed circuit board and fabrication method thereof
CN101567356A (en) * 2008-04-23 2009-10-28 全懋精密科技股份有限公司 Circuit board structure and manufacture method thereof

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