CN87100490A - method for manufacturing multilayer printed circuit board - Google Patents
method for manufacturing multilayer printed circuit board Download PDFInfo
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- CN87100490A CN87100490A CN87100490.9A CN87100490A CN87100490A CN 87100490 A CN87100490 A CN 87100490A CN 87100490 A CN87100490 A CN 87100490A CN 87100490 A CN87100490 A CN 87100490A
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Abstract
A process for manufacturing a multilayer circuit board by using composite structures which are designed and manufactured separately, each of which is composed of a patterned conductive metal foil supported by a photo-processable insulating film. The foil-patterned side of the composite layer is bonded down to the substrate or pre-existing multi-layer structure, and the surface of the insulating film is selectively removed down to the underlying metal points for electroless plating. All the holes in the insulating film are then electroless plated with metal until flush with the top surface. Additional patterned composite layers are added and plated as needed to create blind vias and new conductor pattern layers one after the other.
Description
The application relates to the U.S. Patent application of being submitted to simultaneously by us 742,742 that is called " method of making printing circuit board anti-corrosion figure ", and this application was submitted on June 10th, 1985, and the assignee who has transferred the application, and this introduces for your guidance now.
In general, the present invention relates to the manufacturing of printed circuit board (PCB), refer more particularly to and use common superposition process to make multilayer board.
Integrated and the miniaturization of the electronic component that carries out over nearly 20 years has become a complicated problems day by day to the restriction of printed-board technology.Printed circuit board (PCB) or be referred to as printed substrate (PWB) more accurately and play some main effects, at first, the integrated circuit of electronic component such as special package, resistance or the like are mounted or are carried on the planar surface of the plug-in unit-similar plate that is generally solid.Like this, PWB has played a supporting role to element.Secondly, adopt chemical corrosion or at the surperficial plated conductor figure of plate, PWB forms required being electrically connected between element.In addition, PWB can also comprise the metal area as fin.Along with the use of integrated circuit increases gradually, more highdensity connection needs two-sided PWB, so that the connection that utilizes the conductor fig on the plate another side to be used as adding.This trend has expanded to the connection of the many laminates that are called multilayer PWB.The layer with layer between be connected by plated-through-hole (plated-through hole) usually.
Conductor fig generally is the epoxy resin fiberglass substrate that is covered with Copper Foil to be carried out photo etching form.On Copper Foil, be coated with the last layer photo-sensitive resin, and make ultraviolet ray pass through stencil ... the figure mask exposure of similar film forms figure.Exposed areas is aggregated on the photoresist.Remove unpolymerized zone with chemical solution and stay the zone of copper.Below the remaining process photoresist protective layer of polymerization is exactly needed conductor fig.Etch away the Copper Foil that exposes then, and remove remaining photoresist, just exposed the conductor fig that forms thus with chemical method.Certainly, there are many general variations in this procedure, for example, and by resist pattern additional plated layer of copper is formed conductor.But all need carry out etched conductor fig all in various degree sapping (undercut), and this is the etching of avoiding etchant because have only surface on the top to be protected.When the extremely thin conductor figure line of needs, the sapping especially easy break-down that becomes.
Along with the increase of circuit level, surface mounting technology (SMT) has quickened the densification of electronic circuit widely, can make the space requirement reduction reach 70% more than.Surface mounted device (SMD) is directly installed to the surface of PWB, and uses the vapour phase scolder, and scolder adverse current or other technology are welded.For the integrated circuit surface installing and locating that in small spacing, has many lead ends, require the conductor of PWB to have extraordinary resolution.
Simultaneously, the electroless plating technology is improved rapidly.In this system, employed by Japanese manufactory widely is on multilayer papery substrate, generates conductor circuit by metal deposition with chemical method in big coating bath.Recently, the improvement of electroplate liquid formulation and coating bath operating system has promoted the use of electroless plating technology country beyond Japan.With regard to someway, scribble one deck photoresist on the substrate of a catalytic action.After the protective layer that forms figure, pass the hole of protective layer and adopt the electroless plating method to fill with metal.Because be with superposeing metal rather than deduct (being etching) metal and produce conductor, therefore, this technology is called " stack " technology.Adopt this method, conductor circuit can be made into required thickness.In general, the electroless plating technology has reduced or eliminated the sapping consequence, and produces the straight flange conductor of primary metal.But this method need be used foreign made catalyst to promote the deposition of copper and increase adhesive force.
Yet it is so intensive that the SMD circuit has become, so that the multilayer PWB focus that become people to note, and have some kinds of technology to compete.Single-layer glass fiber epoxy resin PWB can be bonded together, and uses the hole hole metallization that is bored is done inner the connection.The Cofired ceramic production technology uses in other lamination process, and the prototype of shielding conductor has also put forward.All there are many defectives in all these systems.For example, 2,3 layers in four layers of PWB just need an intermediate connecting layer, and perforation must be passed total, will waste " free time " (the real estate) that can put to use in addition on 1 layer 4 layers like this.Therefore, be the hidden path of between two-layer or more internal layer, imbedding connection that can not finely provide usually said by prior art.
Therefore, general purpose of the present invention provides on single substrate the technology of making the multi-layer conductive circuit that comprises hidden path and new conductor fig.Another object of the present invention is the multilayer PWB with hidden path that produces a kind of not wasting space on unconnected each layer.A relevant purpose of the present invention is for being used for making the technology that complicated multilayer PWB provides a kind of practicality on the single substrate of SMD.
These and other purpose of the present invention is made well respectively by adopting, and is achieved by being covered with the composite construction that dielectric film forms on the conductive foil.Conductive side is formed figure and through independently technology etching.The conductive foil figure side of this composite bed is adhered on the following substrate or on the sandwich construction that has before had then, and the dielectric film of removing selected zone is up to following metal position, so that carry out electroless plating.All aperture figures that enter dielectric film are full of primary metal by electroless plating, and this metal exceeds to upper surface, to form conductor and path.Comprise and when in fact not being subjected to the sandwich construction of limitation of complexity, can adopting hidden path the figure composite bed of more uniquenesses and apply plating when needs form.
With regard to optimised process, but dielectric film is an optical treatment.Preferably permanent desciccator diaphragm (PDF).Metal forming preferably uses the conventional method can be by the Copper Foil of photoetch.Because Copper Foil has stopped the energy of exposure, uncured PDF just is not subjected to make in advance the influence of conductor wiring graphic operation, (this operation makes paper tinsel produce " taking off plate ").When carry out on the PWB below paillon foil figure side is adhered to compound after, PDF is by mask exposure, and remove need below the coating of exposure own or the coating in the lower metal district of the preexist on the PWB top surface.At latter event, any adhesives can be removed simultaneously.Aperture on PDF subsequently by electroless plating to form conductor and path.Work on all plates and all finish under stacked system, the continuous primary metal conductive channel of multilayer that this method produces adopts higher that subtractive processes can reliably reach in (higher resolution) aspect the fineness of lead than prior art.Because electroless plating can not have to carry out again in the zone of metal on multilager base plate, this technology is under the influence that is not subjected to front one deck, and designing circuit pattern provides maximum flexibility.And composite members can side by side be made as auxiliary element in parallel component system.
In the adoptable technology of another kind, also used the composite members of foliation, the paper tinsel upside of this composite members (i.e. outside) bonds on the PWB structure of preexist, subsequently the paper tinsel on the plate is formed resist pattern, so that expose the insulating material of bonding pad, intermediate layer selectively.Remove the insulating material that is exposed to the lower metal place through etch process, so that electroplate or electroless plating.Aperture on all insulating material applies to plate and is full of metal then, makes it exceed the paper tinsel laminar surface.This layer is to for the second time processing resist pattern then, is applicable to any one or both sides of PWB structure so that form the attached foil that conductor is covered with insulating barrier on the paper tinsel layer, thereby the hidden path that can form in fact multilayer PWB that can any combination connects.
Fig. 1 is to use the schematic cross-section of the body plan order of the made multilayer circuit board of the inventive method.
Fig. 2 is used for the multilayer circuit plate structure shown in Fig. 1 step 7 at the composite bed schematic cross-section that is covered with the figure front and back.
Fig. 3-the 6th, the schematic cross-section of the multilager base plate among Fig. 1 between the step 6 and 8 on the point of different in kind.
Fig. 7 is the schematic cross-section that is used for the composite bed of the another kind of multilayer circuit plate structure shown in Fig. 1 step 8 before and after paillon foil is covered with figure.
Fig. 8 is an order sketch, has represented to make with the foliation composite members the another kind of method of multilayer PWB.
The following describes the technology of multilayer PWB, this technology uses the chemical plating method to apply operation continuously in the coating bath in jumbo technology, to set up the independent stratum of very dense complexity on conventional substrate, (this deposited coating bath once can hold a large amount of circuit boards).When needs carried out independently compound manufacturing, whole technology can be finished highly automatedly.This technology will show to be not only multiduty, and to compare with the competition technology also be highly economical.
Fig. 1 shows the cross section of the multilayer PWB structure of representing nine stages.Because conductor fig on any given plane is very complicated, so, omitted the scope of the given conductor channel on the given layer plane for for the purpose of the simplified illustration.As seeing in the cross section of Fig. 1, given layer is gone up the metal area that exposes can be just corresponding to the vertical tie point between two-layer, maybe can be for example vertical with paper on this layer plane or the passing conductor of oblique and a part of going.The conductive layer on the single same plane of the permanent desciccator diaphragm electroless plating generation of one deck is passed in step 1 to 5 explanations.Two different composite members are added in step 7 and 8 respectively.Cause the detailed step of step 8 among Fig. 1 to be shown in Fig. 3-6 particularly.
In step 1, substrate 10 is by topped last layer conductive metal foil 12.Substrate can be the thin plate of being made by any insulating material, for example by synthetic resin, and glass, pottery scribbles the pottery of metal, laminated paper, ivory board, or fiber material is made.Comprise phenolic resins in the example of synthetic resin, melamine and epoxy resin.Best substrate is the glass-epoxy composite plate.
Required electric and mechanical property and chemical resistance and thermal endurance are selected-had to conductor metal paper tinsel 12 from such metal.The best metal that is used for paillon foil 12 is a copper, and typical thickness is about 0.5 to 3 mil.
In step 2, metal forming 12 is configured figure, so that form conductive line.On paillon foil 12, can add last layer photoresist (not shown), and pass through mask exposure.Then, remove the photosensitive resin that has exposed, and the metal of etching lower floor, to stay required metallic circuit pattern line 14.The photoresist structure generally adopts tradition stacked or use the form coating of liquid protective film with the centrifugal process dried film.Protective layer can expose with ultraviolet ray (UV) irradiation by an artwork master, or directly uses electron beam, or laser forms figure.In the other method that forms wiring figure on the metal forming is to instruct in our the above referenced application of awaiting the reply jointly.Because lines 14 are not used for constituting the conductor of finally finishing, nature, metal forming 12 is preferably extremely thin, and to allow having high-resolution hachure figure under the situation that does not have the sapping problem, sapping often occurs in the subduction technology that has than thick-layer.
Best PDF material is by E.I.Dupout de Nemours ﹠amp; CO. the polyacrylonitrile of the ultraviolet curing that accurate concentration is arranged that is called PAR-001 of Sheng Chaning.A undesirable feature of this material is to adhere on the copper well.Like this, more widely used and general available PDF includes the adhesion strength promoter that is used for copper, so that this material is suitable for being used as the welding protection film, or insulate as the figure of other type.The shortcoming that the PDF of known type is more common is to be not suitable for as applying the plating mask.Particularly, promote the additives of copper adhesion strength to leach in the coating bath, coating bath was lost efficacy.Make PAR-001 used in this invention, do not add copper adhesion strength promoter, therefore, can coating bath be poisoned.But after curing, it can not be bonded on the copper well.Uncured PDF is soft and is clamminess a little a little, and it can be temporary transient attached on the copper.Be layered in the uncured PDF on the non-copper base, in case when solidifying, just for good and all be bonded at baseplate material (being epoxy resin in the case) and gone up.
In step 4, PDF16 is formed figure by ultraviolet ray by the mask exposure that is decorated with required conductor fig profile.Photosensitive resin mask negative in mask and the step 2 is identical.The zone 18 that is exposed is with regard to polymerization, hardens and remains (as shown in Figure 4).Remove with chemical method in zone between the PDF18 of sclerosis, and to form hole or aperture, it is to expose to the open air out that these apertures make the copper lines 14 of lower floor.Copper point by aperture so exposes is used for electroless plating.The copper lines that exposes plays catalytic site, and this catalytic site has affinity to the copper ion in the plating bath.Increase the thickness of " growth " metal by chemistry, all be full of or deposited plating and the same high fine copper 20 of upper surface shown in step 5 up to all apertures.
In step 1-5 as shown in Figure 1,, all copper lines 14 in whole one deck apply plating because all being exposed, so apply the plating mask and do not adhere to problem on the copper with regard to not running into PDF.Have only the interface between layer and the layer to be between the epoxy resin of PDF and substrate.Like this, just for good and all adhered on the substrate 10 through overcuring PDF and the conductor that has plated metal according to original copper lines 14 that is clipped between the layer, and copper lines 14 has also just been adhered on the substrate 10 itself.
As among Fig. 1 shown in the step 6, added second layer PDF and through handling, to stay permanent insulation patterns 22.Be noted that aperture is to form on the metal that is pre-existing in.But in this case, some metallic conductor district is topped rather than exposure by PDF.
Because exist copper and PDF layer to the interface between the layer in step 6, therefore the layer easy " take off " of copper conductor to having earlier, must propose bonding problem there.The result proves that PDF will inevitably very adhere on the tin well.Therefore, be in step 5, to make topped one deck tin on the exposed surface of metallic conductor 20 as the bonding a kind of technology of PDF.This can be before PDF stacked uncured, and the step by a kind of dip-coating tin layer realizes.Dip-coating tin layer is used as flash plating to quicken the welding in other operation.The coating that is produced is extremely thin, is approximately several dusts, but is to be suitable for fully as getting in touch between copper and the PDF.Another kind of technology also can be satisfied the demand to the plate upper conductor electroless plating tin of depositing in advance in step 5.
Through stacked and after forming figure on the PDF 22, essentially apply the metal dots 20 that plating exposes.Is copper, more valuable metal electroless plating difficult to tin, preferably considers at first to use " tin peel groove " to remove the ultra-thin tin coating of exposure before applying plating.As step 4 and 5, the copper that exposes is carried out electroless plating then by the hole on the PDF.Formed structure is shown in Fig. 3.
To add new independent circuit conductor figure in the place that does not have lower metal, will be used in independently in " taking off plate " operation and make, by " compound " 24 shown in Figure 2.About half mil thick of Copper Foil coating 26(half ounce Copper Foil that one deck is extremely thin) is laminated to a side of uncured PDF sheet 28 by hot rolling.The Copper Foil side joint and is constituted the photograph figure to produce thin conductor graph line 30.Thin paper tinsel can be etched into very thin lines.Metal forming 26 can use traditional technology to carry out photoetch, such as using the UV-radiation-sensitive resin, is exposed under the actinic ultraviolet ray, peels off exposed portions and also follows the Copper Foil of etching lower floor, and remove unexposed protective layer.The effect of metal forming 26 is the shadow shields as the PDF 28 of light sensitivity, so that PDF is by the conductor fig shading and maintain the original state (that is, staying not polymerization position).
Then, still have the composite members 24 of uncured PDF, adhere under its copper clad patterns side direction on the upper surface 32 of multilager base plate (drawn) as Fig. 3.But, at first to apply two-sided effective film adhesive and be plated on the substrate surface 32 of preexist.The polypropylene screen adhesive is to be applicable to the peelable interlayer that former degree between the body is 1,2 or 3 mils that unloads.After adhering to composite members on the substrate, promptly PDF 28 carry out optical processing with the insulator figure 34(that stays sclerosis shown in Figure 4 and 5).Fig. 5 is corresponding to the step 7 of whole operation sketch map among Fig. 1.Copper Foil lines anywhere all are present in the downside of composite members, above topped PDF be porose, form path and conductor to reserve hole and groove.The Copper Foil lines are that the beginning when plating is applied in catalytic site or conduct.Like this, Copper Foil and PDF are bonding only to be temporary transient, and does not have what problem under the PDF its uncured state.In addition, the metal area on substrate surface 32 will apply plating by this new layer, and they are to expose by the aperture on the PDF.Identical solvent (for example 1.1.1 trichloroethanes) is removed the PDF and the polypropylene screen of not polymerization.Then, as shown in Figure 6, the hole at the bottom of the copper is by electroless plating.
PDF formation figure shown in Fig. 5 and 6 and deposited plating operating process are similar to the step 4 and 5 among Fig. 1.But, applying the starting point of plating as some, the copper point that copper point 30 promptly shown in Figure 5 and (for example) are specifically designed to the preexist of step 4 among Fig. 1 and 6 is obvious different.Point 30 among Fig. 5 is actually paper tinsel coating 26(Fig. 2) below, conductor fig 30 forms on this one deck.These extremely thin foil conductors 30 on composite members (do not have metal below these zones, previous layer) in some zone and go up the new electroless plating point of formation.The sclerosis PDF insulating barrier 22 and the bonding film of polypropylene be located in Copper Foil point 30 below.Be noted that and remove not consistent compound PDF in the zone 36, so that be connected to adjacent layer with applying plating with the conductive pattern coating of oneself.Therefore, adopt composite members to make to apply the existing or new connection metal of plating to have flexibility.The conductor that exposes on some substrate surface that formerly exists 32 will not re-use in addition, that is, be not connected electrically on the new layer.Like this, polypropylene screen adhesion layer between composite bed and the substrate has solved two different problems: it not only adheres to the lines at the bottom of the composite bed on the PDF that the lower floor on the substrate surface 32 solidifies, and a no copper conductor that exposes is adhered on the uncured PDF of composite bed.
Replace conductor fig zinc-plated though be noted that the step 1-5 that the bonding membrane technology of same polypropylene can be used among Fig. 1, preferably will reduce the number of coherent film as far as possible, because their temperature stability is not as PDF.Like this, when adding PDF separately (, non-compound), be preferably on the copper of lower floor plating with tin.
When needs produce a special multilayer PWB, can change or repeat step 3 among Fig. 1 to 5 and 7 to 9.
Though this compound is to illustrate on the multilager base plate of preexist as being used for,, this compound also can be equally easily as first circuit layer on the insulated substrate such as the expoxy glass plate.When needing, can then add additional compound and insulating barrier.
A main feature of this method is on-line operation on the top of sandwich construction without difficulty, design neatly any conductive metal pattern 30 and 30 '.For example, can adopt with the various of multilager base plate different in kind that originally constituted and improve one's methods.Also have, can side by side prepare a large amount of circuit or the practical set time is minimized.
Utilize light can handle insulating material and figure conductive foil composite methods has the following attendant advantages that is better than the prior art method: (1) figure Copper Foil forms the conducting channel that can be directly applied on the multi-layer sheet, and does not need further to apply plating or etching; (2) do not need to imbed lead; (3) composite members forms vertical connection and hidden path, and needn't hole on a plurality of insulating barriers and to its overlay metallization, and (4) along with conductor resolution, the improvement of profile and shape, and technology is the addition method fully on the plate.The conductive channel that produces is to be formed by continuous primary metal.Reduce processing step in the electroless plating groove and increase the metallized ability of substrate conductor by being immersed in simply, the supercircuit plate can be made with bigger capacity, this method is compared with traditional handicraft, and mass production cost is lower.Moreover electroless plating is intensive for manufacturing has, and smaller-diameter path (big depth-width ratio) more high-density plate provides a kind of method, and this method is different from false add technology or utilizes the technology of electroplating technology.
An inherent defect of illustrated above-mentioned technology is in Fig. 1-7: owing to uncured PDF is soft and can stretches a little, therefore when it being overlapped ready-made multilayer PWB surface, need consider the dimensional stability of graphic foil composite members.In addition, be suitable for the extra bonding or zinc-plated preface of the bonding needs of the non-copper of PDF that coating bath is used.Yet the advantage of above-mentioned technology has substantially exceeded its these shortcomings, shows in detail the technology that another kind can be avoided these peculiar shortcomings fully in Fig. 8, this technology use a kind of can etched insulating material foliation, and do not use up accessible PDF insulator.
This method is applied two sides at a kind of insulating material 50 with Copper Foil, and (step 1) of Fig. 8 begins, and the paper tinsel layer 52 and the 54 usefulness method against corrosion of outside are etched, forms aperture or micropore 56 on paper tinsel, so that expose insulating material selectively.Hole 56 is not a conductor fig, but enters the little window or the passage (step 2) of insulator 50.
Mask against corrosion when the paper tinsel layer 52 of outside and 54 is used as insulating barrier 50 etchings.Insulator 50 is exposed by aperture 56, so that etch into another layer with any method from a paper tinsel layer.Be applicable to that the insulating material of polymer etching method has various chemical liquids, plasma or " dry type " etching, or a kind of suitable laser energy. Paper tinsel layer 52 and 54 has been protected the insulator of lower floor in etching work procedure, thereby makes the hole or the cavity 58 of the lower floor paper tinsel layer of insulation physical efficiency on forming from each window 56 on the paper tinsel to the composite bed another side selectively thereon.
Then, the cavity 58 on the insulator 50 shown in step 4 by fair full metal, thereby form between paper tinsel layer 52 and 54 in connect post or path 60.Because path 60 is to penetrate into another layer fully from one deck, thus shown in this and the step 2 and 3 no matter from a face still be on another face or two faces on formed window without any difference.Under any circumstance, cavity 58 utilizes the method for overlay metallization to be filled metal.Can use electroless plating, perhaps, because paper tinsel layer 52 and 54 is intact (promptly not forming figure), therefore on the wall in cavity 58, plate the thin initial layers of one deck with the electroless plating in the gauge orifice metallization operation after, also can adopt plating.The electroless plating sensitization technology of then electroplating is included in to apply in the cavity has plated the sensitized solution of catalytic action, carries out electroless plating skim copper so that form catalytic site.In case through applying plating, the thin layer copper in the hole and the paper tinsel surface of outside have just formed an electric conductor continuously, so just can adopting faster, electro-plating method goes to carry out the deposited plating of remainder.It is difficult electroplating for the hole with big depth-width ratio, and still, the cavity on the extremely thin insulator of Fig. 1 can have smaller depth-width ratio, can electroplate in this case.In a word, it can utilize any known technology that meets the requirements (apply plating such as pulse, mechanical agitation and air spray) to strengthen the electroplating effect in hole.It is wide that typical hole or window are approximately 4 mils.Desirable external insulation is approximately 1 to 2 mil thick, so for ease of applying plating, the depth-width ratio in insulator cavity is approximately 2.
Then, the paper tinsel layer 52 and 54 of outside utilize traditional technology or with the method for the etched figure shown in the application that awaits the reply jointly of our above-mentioned reference be etched into again conductor fig 52 ' and 54 '.The paper tinsel layer has stayed a two-sided conductor fig when forming figure, can adhere to its one or both sides to the insulating material superimposed layer (coating is outside) that has only a foliation.The step 6 of Fig. 8 shows a kind of two-sided method, and in the method, the insulating barrier 64 and 66 that its outside has Copper Foil coating 68 and 70 is adhered on the structure of step 5.As shown in the step 7, Copper Foil coating 68 and 70 forms apertures 72 through etchings, and the lower floor's copper point on the surface of these apertures and original insulating barrier 50 on the formed two-layer conductor fig is aimed at.The insulating material that exposes utilizes arbitrary technology above-mentioned to be etched away once more, just forms aperture on two-layer different insulating barrier 64 and 66.Shown in the step 8 of Fig. 8, metal is expired by plating subsequently in the cavity 74 of formation, thereby the paper tinsel layer (shown in step 9) of linking the outside such as 52 ' such lower floor's point.And add plating again with independent electroless plating or through the electroless plating of sensitization once more.
The technology of prior figures 8 is useful to miscellaneous material system.For example, the foliation insulating barrier can utilize to be realized bondingly as the adhering technique that uses in Fig. 1 method, or utilization itself has the thermosetting or the thermoplastic insulation material of viscosity, realizes bonding with the bonding operation of pressing or roll.The present invention also is particularly suitable for extremely thin material.(for example use (0.001-0.002 inch) thin thermoplastic sheet as an example, Dupont polytetrafluoroethylene FEP) also with the hot rolling method outside paper tinsel layer and insulation board are adhered on " central layer " structure simultaneously, this central layer can be rigid double sided board (PTH type) or the flexible thin central layer such as polyimides as above-mentioned method is made.When using the thermoplastic insulation material, must consider the dimensional stability of core plate structure, and in this case, should avoid using polytetrafluoroethylene thermoplastic central layer.
Represented a kind of multilayer PWB by the structure that step 10 produced of Fig. 8 with four layers of conductor layer and three-layer insulated layer.Intermediate insulating layer 50 should be the material that a kind of dimensional stability is suitable for using.Special Ideal Match can be made central layer 50 with the polyimides Kapton material that Dupont makes, and does insulator 64 and 66 with polytetrafluoroethylene floor.After the step 10 of Fig. 8, if do not need extra play, then the naked copper body that is exposed on this surface should be by topped one deck solder protective film, and this film exposes and is used for the required end points of SMD welding.These points are coated with scolder then.
For the complicated circuit figure, use the plasma glow discharge of dry type or the chemical etching of wet type to be better than the laser beam etching such as the etching of Kapton or this quasi-polyimide insulating material of polytetrafluoroethylene.Because the laser-induced thermal etching right and wrong are technology in batch, each passage is essential to form an one deck separately.For polytetrafluoroethylene by plasma etching fast, to polyimides, the suitable etching technique of spraying or immersing with the ethanol potassium hydroxide solution.
The deposited plating of access points can realize with multiple variation in many ways.For example, whole outside paper tinsel layer while and access points can be applied together and be plated to given thickness.With the method for another kind remodeling, before applying plating, apply protective film coating on the paper tinsel layer outside, so that have only required conductor fig all to be applied plating, or have only passage to be applied plating.Because the paper tinsel layer of outside is continuous; plated metal can be used as the etching protective film at this place; such as applying plating one deck leypewter by topped photosensitive resin film on the Copper Foil conductor fig selectively, this photosensitive resin film is used as a kind of etching protective film during removing the copper of background.A kind of similar techniques is specified in the application of the formation resist pattern method that we that quote as proof above await the reply jointly.
The method of Fig. 8 is at material and be easy to aim at this respect superiority is provided, and finally syntheticly comprises that the conductor fig of hidden path becomes possibility thereby make.When path itself and without optical processing; but when forming by the etching of paper tinsel diaphragm; the selection of insulating material is not limited to the photoreaction polymer, and is fragile when permanent on the other hand desciccator diaphragm solidifies, so the method for Fig. 8 can be used as insulating barrier with the material of flexible thermoplastic.But, use insulating barrier that polytetrafluoroethylene makes to be connected (for example), and for ease of aligning with stable core material, on a guidance tape in the operation during all conductor fig of formation, can be regardless of its dimensional stability.When using the bonding insulating barrier of jointing material if desired, there are many materials to be applicable to the technology of Fig. 8.For example, can use the polypropylene jointing material also to put available plasma etching for being removed to following copper.Stable multilayer PWB core plate structure can pass through such as stack, and the PWB technology that half lap adds or the deposited depositing process of figure is made this quasi-tradition of two-sided PTH plate provides.As the replacement to the protection of outer scolder, except the passage of central layer inboard adopts the method for PTH, multiple stratification can be added to the structure shown in the step 6 that constitutes similar Fig. 8 on the central layer surface conductor figure by the foliation insulation board.
Typical multilayer PWB has an inside central layer with dielectric layers, and one deck is a voltage layer and another layer is a ground plane, to realize high power capacity.Signals layer is formed on the skin of PWB.Particularly advantageous system should make and have the voltage layer that is used for various circuit and the inside central layer standardization of ground plane.Promptly should have the voltage of the sufficient amount that is used for various circuit and the break-through of ground plane layer and all places is connected.The complicated circuit model machine that standardized voltage aground plane structure constitutes with multilayer PWB form for test provides turnover faster.
For the technology of Fig. 8, another kind can be applicable the insulating material system be to use (for example) to inject the glass web or the sieve of polytetrafluoroethylene or other thermoplastic or thermosetting resin.Use net or sieve not only to strengthen the dimensional stability of plastics, and can obtain accurate thickness.Another kind of possibility scheme be to use the epoxy glass fiber plate as insulating barrier.Plasma etching is removed the plastics from glass cloth, but must consider to pass the desirability that glass cloth applies plating.
Those skilled in the art can make various changes and modifications to this method of making multilayer circuit board without departing from the principles and spirit of the present invention according to top detailed description and accompanying drawing.For example, though Fig. 1 shows the method for making single face multilayer PWB, but in many cases, the method for Fig. 1 is used on the two sides of layering making simultaneously to be similar to another kind of method two-sided such double sided board illustrated in fig. 8 a little be possible, and best beyond doubt.In addition, though biasing toward light in one case, Fig. 1 and Fig. 8 transform method can handle insulating barrier, lay particular stress on non-light in another case and can handle insulating barrier, but right and wrong light can be handled insulating barrier and can use the method for Fig. 1 directly for example to hole on insulating barrier by laser beam, and laser beam can be by the structural lower metal point reflection of existing multilayer PWB.Be used for the composite bed 24 of manuscript 2 in advance.The shortcoming of this method is not to be " batch process ", and needs direct energy.But this class remodeling all is contemplated as falling with within the scope of appended claims.
Claims (57)
1, a kind of method of making the electrical interconnect plate is characterized in that may further comprise the steps:
--on the metallic conductor supporting substrates, lay permanent insulating film layer,
--on the predetermined pattern of described insulating barrier, form aperture, so as to expose the lower metal point and
--light overlay metallization from the metal of described exposure, up to the aperture that is filled on the described insulating barrier, to form solid conductor and internal layer path.
2, method as claimed in claim 1 is characterised in that wherein said insulating barrier can handle material by light and make, and the described step that forms aperture on insulating barrier is finished by described insulating barrier is carried out optical processing.
3, method as claimed in claim 2 is characterised in that wherein said insulating material is permanent desciccator diaphragm.
4, method as claimed in claim 3 is characterised in that wherein said permanent desciccator diaphragm is a kind of unreacted sensitivity to ultraviolet light film when it is coated onto on the described substrate.
5, method as claimed in claim 1, be characterised in that wherein said insulating barrier is before forming aperture, just be covered with the layer of metal paper tinsel, and described be by at first on foliation, forming aperture, finishing by the described insulating barrier of aperture etching on the foliation then in the step that forms aperture on the insulating barrier.
6, method as claimed in claim 1 is characterised in that wherein described insulating barrier is added to before the described substrate that described insulating barrier is covered with the paper tinsel layer, and described insulating barrier with the outer mode of paper tinsel side direction be added to described substrate and
In the described step that forms aperture on the described insulating barrier is by at first forming aperture on described paper tinsel, then the expose portion of the described insulating barrier of etching and finishing down to the lower metal paper tinsel point on the described substrate.
7, method as claimed in claim 1, be characterised in that wherein described insulating barrier is added to before the described substrate, on the one side of described insulating barrier, be defined a conductive metal pattern, and described insulating barrier is added on the described substrate in the conductor fig mode that is contiguous to described substrate surface that faces down.
8, method as claimed in claim 7, be characterised in that wherein the step that is included in the such aperture of formations in the described insulation in the step that forms aperture on the described insulating barrier, these empty points can arrive the metal dots on described substrate by the conductive pattern of described insulating barrier supporting and arrival downwards.
9, a kind of method of making the electrical interconnect plate is characterized in that may further comprise the steps:
-prepare simultaneously to be covered with the dielectric film that can form figure at it, can form figure with having, but the composite bed of the metal forming of electroless plating,
-remove the described paper tinsel of part on the described composite bed determining a conductor fig,
-described composite bed is added to the substrate conductor picture surface of depositing earlier downwards,
-remove the described film of part selectively to form hole, these holes expose at least in part as below the described foliation conductor fig that applies the plating catalytic site and
-electroless plating makes hole be full of metal.
10, method as claimed in claim 9 is characterised in that also to comprise based on composite bed, constitutes each step that repeats to describe in detail of MULTILAYER COMPOSITE layer.
11, method as claimed in claim 9, but be characterised in that wherein said dielectric film is that the step of removing described film optical processing and described is finished by described film is carried out optical processing.
12,, be characterised in that wherein said dielectric film is uncured PDF as the method for claim 11.
13,, be characterised in that wherein said metal is a copper as the method for claim 12; In fact described PDF does not have the adhesive force of copper to promote additives, in order to avoid plating bath used in the described electroless plating step is poisoned.
14,, be characterised in that the wherein said step that applies composite bed comprises that a kind of adhesive linkage is applied between described substrate and the described composite bed as the method for claim 13.
15,, be characterised in that wherein said adhesive linkage is by being removed with the material that forms described hole formed with described membrane portions as the method for claim 17.
16, method as claimed in claim 9 is characterised in that the wherein said paper tinsel step of removing comprises and uses photoresist to determine described conductor fig.
17, method as claimed in claim 9 is characterised in that further comprising the steps of:
-at first expose the substrate that metallic conductor is arranged on the preparation surface, and
-remove the step of the described film of part selectively, to expose the following of all described foliation figures and some metallic conductor point on substrate surface at least.
18,, be characterised in that the wherein said step that applies comprises described composite bed is adhered on the substrate that has layer of adhesive material as the method for claim 17.
19, make the method for PWB composite bed, be characterised in that to comprise:
-conductive metal foil is added to that a kind of unreacted light can be handled on the insulating material and
-metal forming adopts the method that the unreacted insulating material is isolated by metal forming to form figure.
20, as the method for claim 19; be characterised in that wherein metal forming is by applying photosensitive resin; photosensitive resin is exposed to actinic rayed gets off to form figure; wherein metal forming makes not exposure of polymerization insulating material; remove diaphragm and exposing metal paper tinsel; to form conductive metal pattern, then remove the diaphragm that stays on the conductive metal pattern.
21, method as claimed in claim 1 is characterised in that also to comprise the mode of the composite bed of the metal forming of insulating material-formation figure with this metal forming abuts substrate is added on the substrate.
22, make the method for circuit board, be characterised in that to comprise:
The composite bed that-preparation is made up of the dielectric panel that is used to support the conductive metal layer that has formed figure,
-described composite bed is added on the substrate and
-be attached to composite bed on the substrate after, on described dielectric panel, form figure.
23,, be characterised in that wherein said insulating material is that a kind of unreacted light can be handled material as the method for claim 22; The step that forms figure on described dielectric panel is finished with optical processing.
24,, be characterised in that the lower floor's copper point that also comprises from the described substrate carries out electroless plating by the insulating material that forms figure as the method for claim 22.
25, make the method for multilayer circuit board, be characterised in that to comprise:
1) conductive metal foil is coated onto on the insulated substrate,
2) on conductive metal foil, form figure,
3) the accessible insulating material of light is applied on the metal forming of this formation figure,
4) form figure forming the cavity on insulating material, these cavities expose the surface of metal forming of the formation figure of lower floor,
5) by described cavity the conducting metal that exposes is carried out electroless plating, until the surface of described insulating material and
6) add glazing and can handle the insulating material extra play, and form figure thereon, the conducting metal that exposes by the insulating material optical processing is carried out electroless plating forming vertical connection,
7) prepare its light that simultaneously is covered with conductive metal foil and can handle the insulating material composite bed, wherein be formed the figure as the conducting metal circuit on the paper tinsel, insulating material is wherein isolated by paper tinsel in the operation that forms figure,
8) the metallic circuit face that forms figure on the composite bed is bonded to the top layer through the insulating material of electroless plating-formation figure on the substrate,
9) on the insulating material of composite bed, form figure, and to the conducting metal that exposes carry out electroless plating with form a flat surface and
10) step 6 and step 7 to 9 exchanges to form multilayer circuit board.
26, as the method for claim 25, be characterised in that also to comprise select insulating material from one group of such material: these materials do not need the catalytic site of adding, just can come electroless plating with conducting metal solution.
27,, be characterised in that further to comprise the processing that makes insulating material form catalytic site, so that then carry out electroless plating with conducting metal solution as the method for claim 25.
28,, be characterised in that also to be included in to apply photosensitive resin on the conductive metal foil and form figure that make the photosensitive resin exposure by mask, the lower metal paper tinsel of etching photosensitive resin and exposure is to form circuitous pattern as the method for claim 25.
29, as the method for claim 25, be characterised in that its described metal is a copper, and further be included in step (3) before, the paper tinsel that forms figure is plated with tin.
30,, be characterised in that wherein bonding step (8) is finished by add a bonding rete between substrate and composite bed as the method for claim 29.
31,, be characterised in that to comprise that also insulating material utilizes laser beam to form figure as the method for claim 25.
32, make the method for multilayer PWB, be characterised in that to comprise:
Form the foliation insulating barrier on the substrate of-supporting conductor fig formerly deposited,
-on predetermined intermediate layer, pass foliation to form the window that connects figure,
-remove the insulating barrier part that is exposed to below the described window, forming perforate, this perforate arrives the choice point of the described lower floor conductor fig on the described substrate downwards by described insulating barrier,
-from described by described aperture apply the plating and
-remove the surface of described paper tinsel selectively, on the upper surface of described PWB, stay new conductor fig.
33,, be characterised in that to comprise that also these steps of repetition are to produce new (insulating barrier by separately the is connected to lower floor) conductor layer of multilayer as the method for claim 32.
34,, be characterised in that wherein said substrate is the PWB flat board of a perforation as the method for claim 32.
35, as the method for claim 32, be characterised in that wherein said substrate is the two-sided PWB flat board of a perforation, its procedure of processing is to carry out simultaneously on the two sides of described substrate.
36,, be characterised in that the step of wherein said formation window is finished by described paper tinsel is carried out photoetch as the method for claim 32.
37,, be characterised in that wherein said step of removing insulating barrier part utilizes method for plasma etching to finish as the method for claim 32.
38,, be characterised in that wherein said insulating barrier is to be made by a kind of material of selecting from thermoplastic and thermosetting resin group as the method for claim 32.
39,, be characterised in that wherein said depth-width ratio of passing the perforate of described insulating barrier is about 2 or littler as the method for claim 32.
40, make the method for multilayer PWB, be characterised in that to comprise:
-insulating core the flaggy that provides a two sides to be covered with paper tinsel,
-on the paper tinsel at least simultaneously in predetermined intermediate layer, form the window that connects figure,
-eliminate the described core layer part be exposed to below the described window, so that the opening of downward arrival another side lower floor paper tinsel to be provided,
-from described lower floor paper tinsel pass described perforate apply the plating and
-remove the surface of selected described central layer two sides of foil, stay conductor fig separately.
41,, be characterised in that also to comprise as the method for claim 40:
-be formed with on described central layer two sides and make the foliation insulating barrier on the top of conductor fig,
-formation connects the window of figure on the foliation that gives fixed corresponding intermediate layer,
-remove the described insulating barrier part be exposed to below the described window, so that the perforate of downward arrival lower floor conductor fig point to be provided,
-from described point pass described insulating barrier apply the plating and
-remove the surface of the above foliation of selected PWB two sides, stay conductive pattern separately.
42,, be characterised in that the step of wherein said formation window is finished by carrying out photoetch as the method for claim 40.
43,, be characterised in that wherein said step of removing the insulating barrier part realizes with method for plasma etching as the method for claim 40.
44, as the method for claim 41, be characterised in that wherein said insulating core flaggy is to make with the material of dimensionally stable, the described insulating barrier that is added on the described core layer top is to be made by a kind of material of selecting from thermoplastic and thermosetting resin group.
45, as the method for claim 41, be characterised in that wherein said insulating core flaggy made by Kapton, described supplemental dielectric layer is made by polytetrafluoroethylene.
46, the PWB that utilizes the method for claim 1 to make.
47, the PWB that utilizes the method for claim 9 to make.
48, the PWB that utilizes the method for claim 19 to make.
49, the PWB that utilizes the method for claim 22 to make.
50, the PWB that utilizes the method for claim 25 to make.
51, the PWB that utilizes the method for claim 32 to make.
52, the PWB that utilizes the method for claim 40 to make.
53, the PWB that utilizes the method for claim 41 to make.
54, a kind of multilayer PWB is characterised in that to have the plate upper conductor that forms with adding technology fully that comprises hidden path.
55, a kind of multilayer PWB, the connector that is characterised in that wherein all intermediate layers are made of the solid vias of applying plating from lower metal point.
56, a kind of multilayer PWB is characterised in that to have the insulating barrier of being made by PDF, has the cavity that begins to form from the previous layer metal dots on this insulating barrier, and described cavity is filled to apply the metal of plating, to form solid conductor and intermediate layer path.
57, a kind of multilayer PWB, be characterised in that the central layer that comprises a two-sided dimensionally stable, have the inner conductor fig that connects and at least two skins that respectively form composite bed with the plasticity insulating barrier on the two sides of this plate, the plasticity insulating barrier of supporting outside conductor fig is to be made of a kind of material of selecting from thermoplastic and thermosetting resin group, form aperture above the selected metal dots of lower floor's conductor fig of described plasticity insulating barrier on described central layer, described aperture is filled with the conductor layer of solid metal on the outer surface of described insulating barrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 87100490 CN1021878C (en) | 1987-01-24 | 1987-01-24 | Multi-layer circuit board fabrication process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 87100490 CN1021878C (en) | 1987-01-24 | 1987-01-24 | Multi-layer circuit board fabrication process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN87100490A true CN87100490A (en) | 1988-08-03 |
| CN1021878C CN1021878C (en) | 1993-08-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 87100490 Expired - Fee Related CN1021878C (en) | 1987-01-24 | 1987-01-24 | Multi-layer circuit board fabrication process |
Country Status (1)
| Country | Link |
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| CN (1) | CN1021878C (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100419997C (en) * | 2005-07-20 | 2008-09-17 | 精工爱普生株式会社 | Manufacturing method for electronic substrate and manufacturing method for electro-optical device |
| CN106783754A (en) * | 2016-12-26 | 2017-05-31 | 通富微电子股份有限公司 | A kind of substrate and its sealed in unit, preparation method, electronic equipment |
| CN107615898A (en) * | 2015-06-04 | 2018-01-19 | 住友电气工业株式会社 | The manufacture method of printed substrate substrate, printed substrate and printed substrate substrate |
| CN107635385A (en) * | 2017-07-31 | 2018-01-26 | 武汉芯宝科技有限公司 | ESD full-shield functions paper tinsel, ESD full-shields function paper tinsel circuit board and manufacture method |
| CN114501856A (en) * | 2021-12-13 | 2022-05-13 | 深圳市华鼎星科技有限公司 | Multi-layer conductive circuit, manufacturing method thereof and display module |
| CN107635385B (en) * | 2017-07-31 | 2024-04-30 | 武汉芯宝科技有限公司 | ESD full-shielding functional foil, full-shielding functional foil circuit board and manufacturing method |
-
1987
- 1987-01-24 CN CN 87100490 patent/CN1021878C/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100419997C (en) * | 2005-07-20 | 2008-09-17 | 精工爱普生株式会社 | Manufacturing method for electronic substrate and manufacturing method for electro-optical device |
| CN107615898A (en) * | 2015-06-04 | 2018-01-19 | 住友电气工业株式会社 | The manufacture method of printed substrate substrate, printed substrate and printed substrate substrate |
| CN107615898B (en) * | 2015-06-04 | 2020-11-24 | 住友电气工业株式会社 | Substrate for printed wiring board, and method for manufacturing substrate for printed wiring board |
| CN106783754A (en) * | 2016-12-26 | 2017-05-31 | 通富微电子股份有限公司 | A kind of substrate and its sealed in unit, preparation method, electronic equipment |
| CN106783754B (en) * | 2016-12-26 | 2019-09-20 | 通富微电子股份有限公司 | A kind of substrate and its sealed in unit, production method, electronic equipment |
| CN107635385A (en) * | 2017-07-31 | 2018-01-26 | 武汉芯宝科技有限公司 | ESD full-shield functions paper tinsel, ESD full-shields function paper tinsel circuit board and manufacture method |
| CN107635385B (en) * | 2017-07-31 | 2024-04-30 | 武汉芯宝科技有限公司 | ESD full-shielding functional foil, full-shielding functional foil circuit board and manufacturing method |
| CN114501856A (en) * | 2021-12-13 | 2022-05-13 | 深圳市华鼎星科技有限公司 | Multi-layer conductive circuit, manufacturing method thereof and display module |
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| Publication number | Publication date |
|---|---|
| CN1021878C (en) | 1993-08-18 |
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