CN106783754B - A kind of substrate and its sealed in unit, production method, electronic equipment - Google Patents
A kind of substrate and its sealed in unit, production method, electronic equipment Download PDFInfo
- Publication number
- CN106783754B CN106783754B CN201611217330.1A CN201611217330A CN106783754B CN 106783754 B CN106783754 B CN 106783754B CN 201611217330 A CN201611217330 A CN 201611217330A CN 106783754 B CN106783754 B CN 106783754B
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- Prior art keywords
- substrate
- conductive layer
- magnetic field
- magnetic
- base
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- 239000000758 substrate Substances 0.000 title claims abstract description 69
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000002184 metal Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 9
- 229920002120 photoresistant polymer Polymers 0.000 claims description 8
- 238000001259 photo etching Methods 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 6
- 230000000694 effects Effects 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910017052 cobalt Inorganic materials 0.000 claims description 3
- 239000010941 cobalt Substances 0.000 claims description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 239000000696 magnetic material Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims 1
- 229910001092 metal group alloy Inorganic materials 0.000 claims 1
- 230000000717 retained effect Effects 0.000 claims 1
- 150000002739 metals Chemical class 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 230000003442 weekly effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a kind of substrate is provided, including base and it is set to the magnetic element of the base, magnetic element guides the base to be in predetermined shape under the influence of a magnetic field.The present invention also provides a kind of sealed in unit, carrier and the magnetic field generating arrangement being oppositely arranged with the carrier, magnetic field generating arrangement generates the magnetic field acted on the carrier upper substrate generation, and the substrate and the magnetic field are above-mentioned substrate and magnetic field.By the above-mentioned means, substrate of the present invention can be directly fixed on the carrier of sealed in unit, without special design cover board, to reduce production cost.The present invention also provides a kind of production method for making aforesaid substrate and use the electronic equipment of aforesaid substrate.
Description
Technical field
The present invention relates to encapsulation fields, more particularly to a kind of magnetic substrate of tool and sealed in unit, production method, electricity
Sub- equipment.
Background technique
Currently, Reflow Soldering is widely used in manufacture field of electronic elements, such as in chip package process, chip package is completed
It needs to flow back by reflow ovens afterwards and completes the welding of salient point and substrate pads or route.It encapsulation, Reflow Soldering and subsequent cleaned
Cheng Zhong is needed to be fixed using carrier and matched cover board to chip substrate, base is especially kept in reflow process
Plate it is smooth, prevent rosin joint, reduce crash rate.
In the prior art, as shown in Figure 1, substrate passes through the pilot pin 8 of carrier 1 and the location hole 9 on cover board 2 in carrier 1
Upper positioning is placed, and cover board 2 and carrier 1 lock substrate by the suction-operated of the magnet 7 in carrier 1；In reflow process,
Because cover board 2 and carrier 1 to the locking effect of substrate, avoid substrate because warpage cause it is bad.But in this mode, need to be directed to
Different chip design specialized cover boards, higher cost.
Summary of the invention
The invention mainly solves the technical problem of providing a kind of substrate without cover board and sealed in unit, production method,
Electronic equipment can simplify technique, reduce cost.
In order to solve the above technical problems, one technical scheme adopted by the invention is that: a kind of substrate is provided, including base and
It is set to the magnetic element of the base, magnetic element guides the base to be in predetermined shape under the influence of a magnetic field.
Wherein, the base includes: the first conductive layer and the second conductive layer, and first conductive layer realizes circuit function,
The magnetic element is set to second conductive layer.
Wherein, first conductive layer and second conductive layer are layers of copper or layer gold.
Wherein, the magnetic element is at least set to the surrounding of the base.
Wherein, the magnetic element is the alloy of not carrying magnetic or magnetic iron, cobalt, nickel or the above metal.
The present invention also provides a kind of electronic equipment, including above-mentioned substrate.
The present invention also provides a kind of sealed in unit, carrier and the magnetic field generating arrangement being oppositely arranged with the carrier, magnetic fields
Generating means generate the magnetic field acted on the carrier upper substrate generation, and the substrate and the magnetic field are above-mentioned substrate and magnetic
?.
Wherein, the magnetic element, the magnetic field generating arrangement generate magnetic identical or opposite magnetic field, magnetic when generating
It is the placement space of the substrate when identical magnetic field, between the carrier and the magnetic field generating arrangement, when the magnetic phase of generation
When anti-magnetic field, the magnetic field generating arrangement is located at the carrier backwards to the side of the substrate.
Wherein, the magnetic field generating arrangement is the coil that permanent magnet or energization can produce magnetic field.
The present invention also provides a kind of production methods for producing aforesaid substrate, comprising the following steps:
There is provided raw substrate: the raw substrate has a base, and the base includes having the first of circuit function to lead
It electric layer and is stacked in the second conductive layer on first conductive layer；
Etching: part metals are left in the predetermined position of the second conductive layer of the base；
It buries magnetic: magnetic element is set in above-mentioned part metals position.
Wherein, the etch step includes:
A layer photoresist is coated in second conductive layer surface；
It performs etching, is left in predetermined position described in second conductive layer surface with photoetching development and lithographic technique
Part metals；
A layer photoresist is coated on the second conductive layer；
Window is outputed in the part-metallic surface with photoetching development technology.
Wherein, the magnetic step of burying includes:
Magnetic material is plated by chemical plating in described the window's position；
The photoresist on the second conductive layer is removed, magnetic element is formed；
The beneficial effects of the present invention are: being in contrast to the prior art, substrate and sealed in unit provided by the present invention
In, substrate can be directly fixed on the carrier of sealed in unit using the magnetic original part of itself, it is not absolutely required to specially design cover board,
To simplify technique, reduce production cost.
Detailed description of the invention
Fig. 1 is the fixture schematic diagram of sealed in unit and substrate in the prior art；
Fig. 2 is the structural schematic diagram of substrate embodiment of the present invention；
Fig. 3 is the flow diagram of the production method embodiment of substrate of the present invention；
Fig. 4 to Fig. 9 is form schematic diagram of the substrate in each making step in Fig. 3；
Figure 10 is the structural schematic diagram of sealed in unit embodiment of the present invention, shows in figure and utilizes magnetic original part fixed substrate
Effect.
Figure 11 is the structural schematic diagram of electronic equipment embodiment of the present invention.
Specific embodiment
Referring to Fig. 2, substrate embodiment of the present invention includes base 100, which includes the first conductive layer 10 and second
Conductive layer 20, first conductive layer 10 are kernel layer implementation circuit function, which is layers of copper, second conductive layer
20 are equipped with several magnetic elements 30, these magnetic elements 30 are arranged in the predetermined position of the second conductive layer 20.
The selection in predetermined position mainly considers how the shape of substrate can be maintained at predetermined with least point and space
Shape, while not influencing the function and specification of substrate as far as possible again.
For example, the case where four weekly assembly of substrate tilts when being placed in carrier surface for substrate, then predetermined position selection is in base
The surrounding of plate.The case where arching upward among substrate when being placed in carrier surface for substrate, then predetermined position selects in a substrate
Portion, in short, the embodiment of the present invention to the selection in predetermined position with no restriction, as long as can allow substrate under the influence of a magnetic field
Predetermined shape is in by 30 tractions of magnetic element/guidance.Similarly, predetermined shape can be smooth, bending or other shapes
Shape is decided according to the actual requirements.
Magnetic element 30 can be the alloy of magnetic iron, cobalt, nickel or these metals, be also possible to energizing magnetic
Electromagnet.In the present embodiment, which is set side by side with the second conductive layer 20, and the first conductive layer 10 may be used also
Being stacked with the second conductive layer 20.
Please refer to Fig. 3 to Fig. 9, the production method of substrate of the present invention the following steps are included:
S1 provides raw substrate, and the raw substrate has a base 100, which includes having circuit function
First conductive layer 10 and the second conductive layer 20 being stacked on first conductive layer 10；
S2 gluing: a layer photoresist 22 is coated on 20 surface of the second conductive layer；
S3 etching: it performs etching, is being pre-positioned on 20 surface of the second conductive layer with photoetching development and lithographic technique
It sets and leaves part metals 24；
S4 opens up window: being coated with a layer photoresist 26 on the surface of above-mentioned part metals 24, exists with photoetching development technology
Output window 28 in 24 surface of part metals；
S5 buries magnetic: plating magnetic material by chemical plating in 28 position of window, removes the photoetching on the second conductive layer
Glue 26 forms magnetic element 30；
Referring to Fig. 10, the present invention also provides a kind of packaging system for aforesaid substrate, including platform 200, set up with
Carrier 300 on platform 200, the carrier 300 are equipped with positioning column 50.Location hole 60 is opened up in the base 100 of substrate, on substrate
After the completion of flip-chip, substrate is fixed on the positioning column 50 of carrier by location hole 60.
Several magnetic field generating arrangements 310 are distributed in the platform 300, it, should in the case where magnetic element 30 has magnetism
The electromagnetism field direction that the energization of magnetic field generating arrangement 310 generates is identical as the magnetic direction of magnetic element 30 of substrate, in magnetic force
Under adelphotaxy, substrate can be firmly secured to carrier 300.
In the present embodiment, magnetic element 30 is permanent magnet, and the magnetic field generating arrangement 310 in platform 200 is coil, is needed
It can be powered to forming electromagnetic field when fixing, attract magnetic element 30 using magnetic force；Power supply can be cut off when needing to unload and eliminate magnetic
To dismantle.In other embodiments, magnetic field generating arrangement 310 may be additionally located above substrate, substrate be located at platform 200 and
Between carrier 300, the magnetic direction and magnetic element 30 that magnetic field generating arrangement 310 generates it is magnetic on the contrary, magnetic force mutual row
Under reprimand effect, substrate is firmly secured to carrier 300.In other embodiments, platform 200 can also be permanent magnet.
Please refer to Figure 10, the present invention also provides it is a kind of include with aforesaid substrate upside-down mounting formed chip electronic equipment
400.The substrate of the flip-chip includes base 100 and several magnetic elements 30 in base 100.
Mode the above is only the implementation of the present invention is not intended to limit the scope of the invention, all to utilize this
Equivalent structure or equivalent flow shift made by description of the invention and accompanying drawing content, it is relevant to be applied directly or indirectly in other
Technical field is included within the scope of the present invention.
Claims (9)
1. a kind of substrate applied to installation encapsulation chip characterized by comprising
Base, comprising: the first conductive layer and the second conductive layer, first conductive layer realize circuit function；
Several magnetic elements are arranged at intervals at the predetermined of second conductive layer along the direction for being parallel to first conductive layer
On position, to guide the base to be in predetermined shape under the influence of a magnetic field；
Wherein, the predetermined position is at least surrounding or the center of the base, first conductive layer and second conduction
Layer is set side by side or is stacked.
2. substrate according to claim 1, which is characterized in that first conductive layer and second conductive layer are copper
Layer or layer gold.
3. substrate according to claim 1 or 2, which is characterized in that the magnetic element is not carrying magnetic or magnetic
Iron, cobalt, nickel or the above metal alloy.
4. a kind of electronic equipment, which is characterized in that including substrate as claimed in claim 1 or 2.
5. a kind of sealed in unit characterized by comprising
Carrier；
Magnetic field generating arrangement is oppositely arranged with the carrier, described to generate the magnetic field acted on the carrier upper substrate generation
Substrate and the magnetic field are substrate as described in any one of claims 1 to 3 and magnetic field.
6. sealed in unit according to claim 5, which is characterized in that the magnetic element, the magnetic field generating arrangement are raw
At the identical or opposite magnetic field in direction, when generating contrary magnetic field, between the carrier and the magnetic field generating arrangement
It is the placement space of the substrate, when the identical magnetic field in generation direction, the magnetic field generating arrangement is located at the carrier backwards
The side of the substrate, the magnetic field generating arrangement are the coils that permanent magnet or energization can produce magnetic field.
7. a kind of production method for producing substrate as claimed in claim 1 or 2, which comprises the following steps:
There is provided raw substrate: the raw substrate has a base, and the base includes having the first of circuit function to lead
Electric layer and the second conductive layer for being set side by side or being stacked with first conductive layer；
Etching: retaining the metal on the predetermined position of the second conductive layer of the base, so that on the predetermined position retained
The metal interval setting；
Bury magnetic: the magnetic element is arranged in the metal sites on the predetermined position of above-mentioned reservation, so that the magnetic element
Along the direction for being parallel to first conductive layer, it is arranged at intervals on the predetermined position of second conductive layer, in magnetic field
The effect lower guidance base is in predetermined shape；
Wherein, the predetermined position is at least surrounding or the center of the base.
8. production method according to claim 7, which is characterized in that the etch step includes:
A layer photoresist is coated in second conductive layer surface；
It is performed etching with photoetching development and lithographic technique in second conductive layer surface, leaves the gold in predetermined position
Belong to；
A layer photoresist is coated on the second conductive layer；
Window is outputed in the metal surface with photoetching development technology.
9. production method according to claim 8, which is characterized in that the magnetic step of burying includes:
Magnetic material is plated by chemical plating in described the window's position；
The photoresist on the second conductive layer is removed, the magnetic element is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611217330.1A CN106783754B (en) | 2016-12-26 | 2016-12-26 | A kind of substrate and its sealed in unit, production method, electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611217330.1A CN106783754B (en) | 2016-12-26 | 2016-12-26 | A kind of substrate and its sealed in unit, production method, electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106783754A CN106783754A (en) | 2017-05-31 |
| CN106783754B true CN106783754B (en) | 2019-09-20 |
Family
ID=58925878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611217330.1A Active CN106783754B (en) | 2016-12-26 | 2016-12-26 | A kind of substrate and its sealed in unit, production method, electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106783754B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87100490A (en) * | 1987-01-24 | 1988-08-03 | 福克斯保罗公司 | method for manufacturing multilayer printed circuit board |
| CN2735064Y (en) * | 2004-09-28 | 2005-10-19 | 吴泓志 | Magnetic adsorption bonding substrate structure |
| CN102566336A (en) * | 2010-12-30 | 2012-07-11 | 上海微电子装备有限公司 | Fixing device and fixing method for mask plate |
| CN203775515U (en) * | 2013-12-31 | 2014-08-13 | 东莞市奥思睿德世浦电子科技有限公司 | FPC with reflow soldering magnetic fixture |
| CN204391051U (en) * | 2014-12-09 | 2015-06-10 | 南通富士通微电子股份有限公司 | Semiconductor flip Reflow Soldering fixture |
| CN104936379A (en) * | 2015-07-01 | 2015-09-23 | 电子科技大学 | Fabrication method for embedding magnetic core induction of printed circuit board |
-
2016
- 2016-12-26 CN CN201611217330.1A patent/CN106783754B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87100490A (en) * | 1987-01-24 | 1988-08-03 | 福克斯保罗公司 | method for manufacturing multilayer printed circuit board |
| CN2735064Y (en) * | 2004-09-28 | 2005-10-19 | 吴泓志 | Magnetic adsorption bonding substrate structure |
| CN102566336A (en) * | 2010-12-30 | 2012-07-11 | 上海微电子装备有限公司 | Fixing device and fixing method for mask plate |
| CN203775515U (en) * | 2013-12-31 | 2014-08-13 | 东莞市奥思睿德世浦电子科技有限公司 | FPC with reflow soldering magnetic fixture |
| CN204391051U (en) * | 2014-12-09 | 2015-06-10 | 南通富士通微电子股份有限公司 | Semiconductor flip Reflow Soldering fixture |
| CN104936379A (en) * | 2015-07-01 | 2015-09-23 | 电子科技大学 | Fabrication method for embedding magnetic core induction of printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106783754A (en) | 2017-05-31 |
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