CN203775515U - FPC with reflow soldering magnetic fixture - Google Patents
FPC with reflow soldering magnetic fixture Download PDFInfo
- Publication number
- CN203775515U CN203775515U CN201320895200.9U CN201320895200U CN203775515U CN 203775515 U CN203775515 U CN 203775515U CN 201320895200 U CN201320895200 U CN 201320895200U CN 203775515 U CN203775515 U CN 203775515U
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- CN
- China
- Prior art keywords
- layer
- fpc
- reflow soldering
- magnetic
- substrate layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses an FPC with a reflow soldering magnetic fixture. The FPC comprises a base material layer, a copper wire layer and an insulating layer. The base material layer, the copper wire layer and the insulating layer are glued together from the bottom to the top in turn. The surface of the base material layer is provided with multiple fixing holes used for connection. The bottom part of the base material layer is provided with an adsorption layer which covers the base material layer. One surface, which is away from the base material layer, of the adsorption layer is provided with a magnetic layer. Poor soldering caused by blowing of reflow soldering wind can be avoided, soldering quality is ensured to be stable, yield rate is enhanced and enterprise productivity is enhanced.
Description
Technical field
The utility model relates to a kind of FPC with Reflow Soldering magnetic tool.
Background technology
Existing FPC, when surface mount reflow soldering, is easily blown afloat, and impact is welding normally, causes product rejection, has increased the loss of enterprise, has reduced the productivity of enterprise, is not suitable for promoting the use of.
Summary of the invention
The technical problems to be solved in the utility model is to provide a kind of FPC with Reflow Soldering magnetic tool, and this FPC can not blown afloat when reflow soldering, has reduced welding percent defective, improves the productivity of enterprise.
For addressing the above problem, the utility model adopts following technical scheme:
A kind of FPC with Reflow Soldering magnetic tool, comprise substrate layer, copper wire layer and insulating barrier, described substrate layer, copper wire layer and insulating barrier glue together from the bottom to top successively, on described substrate layer surface, offer the fixing hole that several connect use, the bottom of described substrate layer is provided with adsorption layer, described adsorption layer covers described substrate layer, and described adsorption layer is provided with magnetosphere in the side away from substrate layer.
As preferred technical scheme, described insulating barrier is plastic film.
As preferred technical scheme, described adsorption layer is iron plate or steel disc.
As preferred technical scheme, described magnetosphere is the magnetic magnetic sheet of tool.
The beneficial effects of the utility model are: this device can be avoided being refluxed weldering wind and work caused failure welding, guarantees welding quality stable, improves rate of finished products, improves business productivity.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is cutaway view of the present utility model;
Fig. 2 is vertical view of the present utility model.
Embodiment
Below in conjunction with accompanying drawing, preferred embodiment of the present utility model is described in detail, thereby so that advantage of the present utility model and feature can be easier to be it will be appreciated by those skilled in the art that, protection range of the present utility model is made to more explicit defining.
Consult a kind of FPC with Reflow Soldering magnetic tool shown in Fig. 1 and Fig. 2, comprise substrate layer 1, copper wire layer 2 and insulating barrier 3, described substrate layer 1, copper wire layer 2 and insulating barrier 3 glue together from the bottom to top successively, on described substrate layer 1 surface, offer the fixing hole 101 that several connect use, the bottom of described substrate layer 1 is provided with adsorption layer 4, described adsorption layer 4 covers described substrate layer 1, and described adsorption layer 4 is provided with magnetosphere 5 in the side away from substrate layer 1.
Wherein, described insulating barrier 3 is plastic film.
Described adsorption layer 4 is iron plate or steel disc.
Described magnetosphere 5 is the magnetic magnetic sheet of tool.
The beneficial effects of the utility model are: this device can be avoided being refluxed weldering wind and work caused failure welding, guarantees welding quality stable, improves rate of finished products, improves business productivity.
More than show and described basic principle of the present utility model, principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; that in above-described embodiment and specification, describes just illustrates principle of the present utility model; under the prerequisite that does not depart from the utility model spirit and scope, the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (4)
1. a FPC with Reflow Soldering magnetic tool, comprise substrate layer, copper wire layer and insulating barrier, described substrate layer, copper wire layer and insulating barrier glue together from the bottom to top successively, on described substrate layer surface, offer the fixing hole that several connect use, it is characterized in that: the bottom of described substrate layer is provided with adsorption layer, described adsorption layer covers described substrate layer, and described adsorption layer is provided with magnetosphere in the side away from substrate layer.
2. the FPC with Reflow Soldering magnetic tool according to claim 1, is characterized in that: described insulating barrier is plastic film.
3. the FPC with Reflow Soldering magnetic tool according to claim 1, is characterized in that: described adsorption layer is iron plate or steel disc.
4. the FPC with Reflow Soldering magnetic tool according to claim 1, is characterized in that: described magnetosphere is the magnetic magnetic sheet of tool.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320895200.9U CN203775515U (en) | 2013-12-31 | 2013-12-31 | FPC with reflow soldering magnetic fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320895200.9U CN203775515U (en) | 2013-12-31 | 2013-12-31 | FPC with reflow soldering magnetic fixture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203775515U true CN203775515U (en) | 2014-08-13 |
Family
ID=51292655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320895200.9U Expired - Fee Related CN203775515U (en) | 2013-12-31 | 2013-12-31 | FPC with reflow soldering magnetic fixture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203775515U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783754A (en) * | 2016-12-26 | 2017-05-31 | 通富微电子股份有限公司 | A kind of substrate and its sealed in unit, preparation method, electronic equipment |
-
2013
- 2013-12-31 CN CN201320895200.9U patent/CN203775515U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783754A (en) * | 2016-12-26 | 2017-05-31 | 通富微电子股份有限公司 | A kind of substrate and its sealed in unit, preparation method, electronic equipment |
| CN106783754B (en) * | 2016-12-26 | 2019-09-20 | 通富微电子股份有限公司 | A kind of substrate and its sealed in unit, production method, electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140813 Termination date: 20151231 |
|
| EXPY | Termination of patent right or utility model |