CN110475425A - A kind of flexible circuit board and preparation method thereof for LED light strip - Google Patents
A kind of flexible circuit board and preparation method thereof for LED light strip Download PDFInfo
- Publication number
- CN110475425A CN110475425A CN201910829592.0A CN201910829592A CN110475425A CN 110475425 A CN110475425 A CN 110475425A CN 201910829592 A CN201910829592 A CN 201910829592A CN 110475425 A CN110475425 A CN 110475425A
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- reverse side
- line layer
- layer
- circuit board
- aluminium foil
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- 238000002360 preparation method Methods 0.000 title claims description 15
- 239000005030 aluminium foil Substances 0.000 claims abstract description 57
- 229920002799 BoPET Polymers 0.000 claims abstract description 36
- 239000011248 coating agent Substances 0.000 claims abstract description 32
- 238000000576 coating method Methods 0.000 claims abstract description 32
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 21
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 21
- 238000009826 distribution Methods 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 233
- 238000003466 welding Methods 0.000 claims description 54
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 18
- 239000003292 glue Substances 0.000 claims description 16
- 238000009413 insulation Methods 0.000 claims description 15
- 239000006071 cream Substances 0.000 claims description 12
- 239000004411 aluminium Substances 0.000 claims description 7
- 239000004568 cement Substances 0.000 claims description 7
- 239000003814 drug Substances 0.000 claims description 6
- 238000000608 laser ablation Methods 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 3
- 239000011888 foil Substances 0.000 abstract description 15
- 238000005476 soldering Methods 0.000 abstract description 15
- 229910052751 metal Inorganic materials 0.000 abstract description 7
- 239000002184 metal Substances 0.000 abstract description 7
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract description 6
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 6
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract description 6
- 230000000694 effects Effects 0.000 description 18
- 238000004519 manufacturing process Methods 0.000 description 15
- 238000012536 packaging technology Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 239000011324 bead Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000002985 plastic film Substances 0.000 description 4
- 229920006255 plastic film Polymers 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000006467 substitution reaction Methods 0.000 description 3
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Led Device Packages (AREA)
Abstract
A kind of flexible circuit board for LED light strip, it include PET film layer, the obverse and reverse distribution of PET film layer is coated with front insulating bond and reverse side insulating bond, front line layer is bonded on the insulating bond of front, reverse side line layer is bonded on reverse side insulating bond, front line layer is equipped with front covering layer, reverse side line layer is equipped with reverse side coating, front line layer and reverse side line layer are the aluminium foil with certain ductility, front covering layer and/or reverse side coating are equipped with pad layer, one layer of reverse side line layer is equipped at the back side of circuit board, using metal aluminum foil material, there is the support of metal aluminum foil on the two sides of PET film, in the case where high-temperature soldering would not harmomegathus deformation, circuit board can show very smooth, by largely facts have proved that can prevent component sets up a monument, The bad phenomenons such as rosin joint, dry joint, yield of the flexible circuit board of the application Jing Guo Reflow Soldering can reach 99% or more, have significant economic value.
Description
Technical field
The present invention relates to circuit board and preparation method thereof technical field, in particular to a kind of flexible electrical for LED light strip
Road plate and preparation method thereof.
Background technique
LED light strip, which refers to, is by welding welded on LED lamp bead on flexible circuitry substrate, reconnects external core wire
Power supply is accessed, band-like FPCB (Flexible Printed Circuit Board flexible printed circuit board) electrified light emitting is made,
Because its shape of product is as a band, it arbitrarily can bend to any shape and gain the name.Its component part mainly has FPCB, SMDLED
Lamp bead, resistance etc.；LED light strip is generally divided into low-pressure lamp band and high-pressure lamp band.Low-pressure lamp band uses switching box by 220V alternating current
Become 12V or less direct current supply, belong to safe voltage, general length is 6~10 meters, is suitable for civil use.High-pressure lamp band is straight
It connects in 220V operating at voltages, belongs to dangerous voltage, be suitable for commercial use.For high-pressure lamp band, since its voltage is higher, In
Calorific value is just more much larger than low-pressure lamp band in unit length, will have a direct impact on the service life of LED lamp bead in light bar in this way.
Existing LED is with traditional handicraft production process: 1. downstream clients are soldered the circuit board that purchase comes by reflux
At the welding of the electronic components such as lamp bead, resistance；2. circuit board splicing or severing that electronic component is welded are to required length
Degree；3. encapsulated for conductive conducting wire；4. wrapping the conducting wire of glue together with circuit board manual welding；5. be welded and to lead
The circuit plate injection moulding of line obtains finished product LED light strip, and above-mentioned technique production is complicated, and it is automatic to be not suitable for scale for higher cost
Metaplasia produces.
It is conventionally used to the flexible circuit board of LED light strip at present, preparation includes that plastics are thin for the flexible circuit board of LED light strip
Film layer, insulation glue-line, line layer, solder mask, pad layer, the circuit board is realized by following technique: 1.PI, PET,
The plastic film one side that PVC etc. can be bent is adhesively-bonded together to form substrate by insulating cement with copper foil；2. in the copper foil of substrate
It makes route and forms line layer in face；3. the reserved region for needing welding component forms pad when line layer covers solder mask
Layer；4, ink is covered in line layer or plastic film forms solder mask.The circuit board worked it out by above step, due to modeling
Material film only has copper foil support on one side, and in addition one side is exposed, Reflow Soldering is passed through when pasting component, typical temperature is 220
DEG C or so, it is easy to make plastic film harmomegathus to deform under high-temperature condition, so as to cause rosin joint, dry joint, the patches failure welding such as set up a monument,
Quality is seriously affected, circuit board is will cause and the direct of electronic component is scrapped, virtually increase cost, circuit board rises
Compression deformation is mainly the plastic film layers such as PI, PET, PVC under high temperature and line layer, the insulation inconsistent institute of glue-line harmomegathus ratio
It causes.
Therefore, the preparation process for how simplifying the flexible circuit board for LED light strip, avoids since harmomegathus ratio is inconsistent
Caused by it is bad, to manufacture process be the application technical problem underlying to be solved to reduction downstream client.
Summary of the invention
In view of the above-mentioned deficiencies in the prior art, it is an object of the present invention to provide a kind of flexible circuit board for LED light strip and
Preparation method.
To solve the above problems, the present invention the following technical schemes are provided:
A kind of flexible circuit board for LED light strip includes PET film layer, the obverse and reverse of the PET film layer
Distribution is coated with front insulating bond and reverse side insulating bond, is bonded with front route on the front insulating bond
Layer, reverse side line layer is bonded on the reverse side insulating bond, the front line layer is equipped with front covering layer, described anti-
Face line layer is equipped with reverse side coating, and the front line layer and the reverse side line layer are the aluminium with certain ductility
Foil, the front covering layer and/or the reverse side coating are equipped with pad layer.
Specifically, the front covering layer and the reverse side coating are ink layer or film layer.
Specifically, the front insulating bond and reverse side insulating bond are the insulating cement of coating.
Specifically, it is connected between the front line layer and the reverse side line layer by via hole, the via hole is logical
Cross red needle the elongation of the aluminium foil of front line layer or reverse side line layer is tight with the aluminium foil of reverse side line layer or front line layer
Contiguity is touched and realizes conducting.
Specifically, the tip end of the red needle be provided with several to increase red needle tip end and front line layer or
The pit of the frictional force of person's reverse side line layer.
The preparation method of the above-mentioned flexible circuit board for LED light strip, comprising the following steps:
S1. insulative glue is coated in the front and back sides of PET film layer and forms front insulating bond and reverse side insulating bond:
S2. aluminium foil is fitted in again the front and back sides of insulative glue, liquid medicine is passed through according to pre-designed line pattern
It learns etching or mold cross cutting or laser ablation removes the unwanted aluminium foil in front and back sides, form front line layer and reverse side route
Layer:
S3. ink is covered on the surface of front line layer and reverse side line layer or film forms front covering layer and reverse side
Coating, front covering layer and reverse side coating reserve welding electronic component region, expose part front line layer or
Reverse side line layer is as pad for welding:
S4. the circuit board produced by above step pad covering can scolding tin substance for common tin cream welding
Electronic component；Or in the downstream endpoint customers' place direct welding electronic component of tin cream of welding aluminium.
The preparation method of flexible circuit board for LED light strip, comprising the following steps:
S1. insulative glue is coated in the front and back sides of PET film layer and forms front insulating bond and reverse side insulating bond:
S2. aluminium foil is fitted in again the front and back sides of insulative glue, liquid medicine is passed through according to pre-designed line pattern
It learns etching or mold cross cutting or laser ablation removes the unwanted aluminium foil in front and back sides, form front line layer and reverse side route
Layer:
S3. by red needle on press machine elongate aluminium foil pierce through simultaneously front insulating bond and reverse side insulating bond and
PET film layer contacts the aluminium foil between front line layer and reverse side line layer directly to which front line layer and reverse side be connected
Line layer forms via hole；
S4. ink is covered on the surface of front line layer and reverse side line layer or film forms front covering layer and reverse side
Coating, front covering layer and reverse side coating reserve welding electronic component region, expose part front line layer or
Reverse side line layer is as pad for welding:
S5. the circuit board produced by above step pad covering can scolding tin substance for common tin cream welding
Electronic component；Or in the downstream endpoint customers' place direct welding electronic component of tin cream of welding aluminium.
The utility model has the advantages that a kind of flexible circuit board for LED light strip of the invention, wherein PET film layer primarily serves load
The effect of body, front insulating bond mainly bond PET film layer and front line layer, play the role of bonding and insulation；
Front line layer is made by aluminium foil, and conductive effect is primarily served；Front covering layer is to cover ink or film, mainly
Play the role of welding resistance and protection front side aluminum foil line layer when welding；Reverse side insulating bond mainly bond PET film layer and
Reverse side aluminium foil line layer, plays the role of bonding and insulation；Reverse side aluminium foil line layer is made by aluminium foil, and downstream is mainly substituted
Conducting wire in client's packaging technology plays conductive effect, and reverse side coating is covering ink or film, primarily serves welding
When welding resistance and protection reverse side aluminium foil line layer effect, via hole be red needle elongate aluminium foil pierce through front insulating cement water layer, reverse side
Insulating bond and PET film layer contact the aluminium foil between front line layer and reverse side line layer directly positive and negative to be connected
Upper thread road plays the role of that front and back sides route is connected, and the present invention is suitble to promote the use of in circuit board Related product field；
Compared with prior art, present invention reduction downstream client manufactures process, improves patch yield, reduces life
Cost is produced, flexible circuit board of the invention is widely used in LED illumination industry, and substitution is in the market after existing circuit board, can be with
The processing step 2,3 and 4 of tradition preparation LED high-voltage light bar is saved, specifically: because the present invention can be with roll-to-roll unlimited long production
Product, therefore the flexible circuit board that required length is disposably produced according to downstream customer requirement can be shifted to an earlier date, production process can be saved
Step 2, without the circuit board splicing or severing that electronic component is welded to required length；Because the present invention utilizes reverse side aluminium
Foil line layer substitutes the conducting wire in downstream client packaging technology, can save production process step 3, without for conductive conducting wire
It is encapsulated；Because the present invention can save production process using the conducting wire in reverse side aluminium foil line layer substitution downstream client packaging technology
Step 4, without wrapping the conducting wire of glue together with circuit board manual welding；
Importantly, the application is equipped with one layer of reverse side line layer at the back side of circuit board, using metal aluminum foil material,
There is the support of metal aluminum foil on the two sides of PET film, in the case where high-temperature soldering would not harmomegathus deformation, circuit board can show
It is very smooth, by largely facts have proved can prevent component and occur setting up a monument, rosin joint, the bad phenomenons such as dry joint, improve product
Yield has saved repair time, improves production efficiency, reduces production cost, has saved vast resources, conventional flexible electrical
Patch yield of the road plate Jing Guo Reflow Soldering can only achieve 80% or so, and yield of the flexible circuit board of the application Jing Guo Reflow Soldering
99% or more can be reached, there is significant economic value.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of this hair；
Fig. 2 is another structural schematic diagram of the invention；
Fig. 3 is that figure is connected in product front of the invention；
Fig. 4 is that figure is connected in product reverse side of the invention；
Specific embodiment
With reference to the accompanying drawings of the specification and embodiment, specific embodiments of the present invention are described in further detail:
Referring to Fig.1, a kind of flexible circuit board for LED light strip includes PET film layer 1, the PET film layer 1
Obverse and reverse distribution is coated with front insulating bond 2 and reverse side insulating bond 3, glues on the front insulating bond 2
Front line layer 4 is had, reverse side line layer 5 is bonded on the reverse side insulating bond 3, the front line layer 4 is equipped with
Front covering layer 6, the reverse side line layer 5 are equipped with reverse side coating 7, the front line layer 4 and the reverse side line layer 5
It is the aluminium foil with certain ductility, the front covering layer 6 and/or the reverse side coating 7 are equipped with pad layer 10.
Wherein, PET film layer 1 is used as substrate, primarily serves the effect of carrier；
Front insulating bond 2 mainly bonds PET film layer and front line layer, plays the role of bonding and insulation；
Front line layer 4 is made by aluminium foil, and conductive effect is primarily served；
Front covering layer 6 is covering ink or film, welding resistance and protection front side aluminum foil line layer when primarily serving welding
Effect；
Reverse side insulating bond 3 mainly bonds PET film layer 1 and reverse side line layer 5, plays the work of bonding and insulation
With；
Reverse side line layer 5 is made by aluminium foil, and the main conducting wire substituted in downstream client packaging technology plays conduction
Effect；
Reverse side coating 7 is covering ink or film, the work of welding resistance and protection reverse side line layer when primarily serving welding
With；
The front covering layer 6 and the reverse side coating 7 are ink layer or film layer, welding resistance when primarily serving welding
With the effect of protection circuit layer.
The front insulating bond 2 and reverse side insulating bond 3 are the insulating cement of coating, play the work of bonding and insulation
With.
More importantly the back side of circuit board, which redesigns one layer of reverse side line layer 5, has metal aluminum foil using aluminum foil material
Support, in the case where high-temperature soldering will not harmomegathus deformation, circuit board will be very smooth, can shut out by largely facts have proved
The bad phenomenons such as setting up a monument occurs in exhausted component, rosin joint, dry joint, improve product yield, traditional flexible circuit board high-temperature soldering
Yield is about 80%, and the flexible circuit board high-temperature soldering yield of the application can achieve 99%.
The preparation method of the above-mentioned flexible circuit board for LED light strip, comprising the following steps:
S1. insulative glue is coated in the front and back sides of PET film layer 1 and forms front insulating bond 2 and reverse side insulation adhesive
Layer 3:
S2. aluminium foil is fitted in again the front and back sides of insulative glue, liquid medicine is passed through according to pre-designed line pattern
It learns etching or mold cross cutting or laser ablation removes the unwanted aluminium foil in front and back sides, form front line layer 4 and reverse side route
Layer 5；
S3. ink is covered on the surface of front line layer 4 and reverse side line layer 5 or film forms 6 He of front covering layer
Reverse side coating 7, front covering layer 6 and reverse side coating 7 reserve welding electronic component region, expose the frontal line of part
Road floor or reverse side line layer are used to weld as pad；
S4. the circuit board produced by above step pad covering can scolding tin substance for common tin cream welding
Electronic component；Or in the downstream endpoint customers' place direct welding electronic component of tin cream of welding aluminium.
Embodiment 2
Referring to Fig. 2-4, a kind of flexible circuit board for LED light strip includes PET film layer 1, the PET film layer 1
Obverse and reverse distribution be coated with front insulating bond 2 and reverse side insulating bond 3, on the front insulating bond 2
It is bonded with front line layer 4, reverse side line layer 5 is bonded on the reverse side insulating bond 3, is set on the front line layer 4
There is front covering layer 6, the reverse side line layer 5 is equipped with reverse side coating 7, the front line layer 4 and the reverse side route
Layer 5 is the aluminium foil with certain ductility, is led between the front line layer 4 and the reverse side line layer 5 by via hole 8
It is logical, the via hole 8 by red needle 9 by the aluminium foil of front line layer 4 or reverse side line layer 5 elongate with reverse side line layer 5 or
The aluminium foil of person front line layer 4 is in close contact and realizes conducting, sets on the front covering layer 6 and/or the reverse side coating 7
There is pad layer 10.
Wherein, PET film layer 1 is used as substrate, primarily serves the effect of carrier；
Front insulating bond 2 mainly bonds PET film layer and front line layer, plays the role of bonding and insulation；
Front line layer 4 is made by aluminium foil, and conductive effect is primarily served；
Front covering layer 6 is covering ink or film, welding resistance and protection front side aluminum foil line layer when primarily serving welding
Effect；
Reverse side insulating bond 3 mainly bonds PET film layer 1 and reverse side line layer 5, plays the work of bonding and insulation
With；
Reverse side line layer 5 is made by aluminium foil, and the main conducting wire substituted in downstream client packaging technology plays conduction
Effect；
Reverse side coating 7 is covering ink or film, the work of welding resistance and protection reverse side line layer when primarily serving welding
With；
Via hole 8 is that red needle elongates aluminium foil, pierces through front insulating bond, reverse side insulating bond and PET film layer, makes
Aluminium foil between front line layer and reverse side line layer directly contacts that front line layer and reverse side line layer is connected；
The front covering layer 6 and the reverse side coating 7 are ink layer or film layer, welding resistance when primarily serving welding
With the effect of protection circuit layer.
The front insulating bond 2 and reverse side insulating bond 3 are the insulating cement of coating, play the work of bonding and insulation
With.
Specifically, the tip end of the red needle 9 be provided with several to increase red needle tip end and front line layer 4
Or the pit of the frictional force of reverse side line layer 5, red needle 9 are mounted on punching machine, according to the thickness of product, the stroke of red needle needs
High precision is controlled, the line layer of one side can be pierced through just, insulate glue-line and pet layer, and will not pierce through another side
Line layer is connected so that the aluminium foil route of the face aluminium foil route and another side that stretch is realized by punching exact contact, due to
The small reason in hole, aluminium foil contact is very close very substantial, will not loosen under external force, pit is more, and the punching of formation is got over
More, contact is closer, and punching can be 1, be also possible to multiple.
More importantly the back side of circuit board, which redesigns one layer of reverse side line layer 5, has metal aluminum foil using aluminum foil material
Support, in the case where high-temperature soldering will not harmomegathus deformation, circuit board will be very smooth, can shut out by largely facts have proved
The bad phenomenons such as setting up a monument occurs in exhausted component, rosin joint, dry joint, improve product yield, traditional flexible circuit board high-temperature soldering
Yield is about 80%, and the flexible circuit board high-temperature soldering yield of the application can achieve 99%.
The preparation method of the above-mentioned flexible circuit board for LED light strip, comprising the following steps:
S1. insulative glue is coated in the front and back sides of PET film layer 1 and forms front insulating bond 2 and reverse side insulation adhesive
Layer 3:
S2. aluminium foil is fitted in again the front and back sides of insulative glue, liquid medicine is passed through according to pre-designed line pattern
It learns etching or mold cross cutting or laser ablation removes the unwanted aluminium foil in front and back sides, form front line layer 4 and reverse side route
Layer 5；
S3. aluminium foil is elongated by the red needle 8 on press machine and pierces through front insulating bond 2, reverse side insulating bond 3 simultaneously
With PET film layer 1, contact the aluminium foil between front line layer 4 and reverse side line layer 5 directly to which front line layer 4 be connected
With reverse side line layer 5, via hole 8 is formed；
S4. ink is covered on the surface of front line layer 4 and reverse side line layer 5 or film forms 6 He of front covering layer
Reverse side coating 7, front covering layer 6 and reverse side coating 7 reserve welding electronic component region, expose the frontal line of part
Road floor or reverse side line layer are used to weld as pad；
S5. the circuit board produced by above step pad covering can scolding tin substance for common tin cream welding
Electronic component；Or in the downstream endpoint customers' place direct welding electronic component of tin cream of welding aluminium.
The utility model has the advantages that a kind of flexible circuit board for LED light strip of the invention, wherein PET film layer primarily serves load
The effect of body, front insulating bond mainly bond PET film layer and front line layer, play the role of bonding and insulation；
Front line layer is made by aluminium foil, and conductive effect is primarily served；Front covering layer is to cover ink or film, mainly
Play the role of welding resistance and protection front side aluminum foil line layer when welding；Reverse side insulating bond mainly bond PET film layer and
Reverse side aluminium foil line layer, plays the role of bonding and insulation；Reverse side aluminium foil line layer is made by aluminium foil, and downstream is mainly substituted
Conducting wire in client's packaging technology plays conductive effect, and reverse side coating is covering ink or film, primarily serves welding
When welding resistance and protection reverse side aluminium foil line layer effect, via hole be red needle elongate aluminium foil pierce through front insulating cement water layer, reverse side
Insulating bond and PET film layer contact the aluminium foil between front line layer and reverse side line layer directly positive and negative to be connected
Upper thread road；
Compared with prior art, present invention reduction downstream client manufactures process, improves patch yield, reduces life
Cost is produced, flexible circuit board of the invention is widely used in LED illumination industry, can save after substituting existing circuit board in the market
Go tradition preparation LED high-voltage light bar step 2,3,4, specifically: because the present invention can roll-to-roll production endless, therefore can press
The flexible circuit board of required length is disposably produced according to downstream customer requirement, can save production process step 2, is not had to welding
The circuit board of good electronic component splices or severing is to required length；Because the present invention substitutes downstream using reverse side aluminium foil line layer
Conducting wire in client's packaging technology can save production process step 3, without encapsulated for conductive conducting wire；Because of the invention
Using the conducting wire in reverse side aluminium foil line layer substitution downstream client packaging technology, production process step 4 can be saved, is wrapped without
The conducting wire of glue is together with circuit board manual welding；
Importantly, the application has reverse side line layer in the design of the back side of circuit board, using aluminum foil material, PET film
Two sides have the support of metal aluminum foil, in the case where high-temperature soldering will not harmomegathus deformation, circuit board will be very smooth, warp
The bad phenomenons such as crossing, which largely facts have proved, can prevent component and occur setting up a monument, rosin joint, dry joint, improve product yield, save
Repair time, improves production efficiency, reduces production cost, has saved vast resources, and conventional flexible circuit board passes through
The yield of Reflow Soldering can only achieve 80% or so, and yield of the flexible circuit board of the application Jing Guo Reflow Soldering can reach 99% with
On, there is significant economic value.
The above described is only a preferred embodiment of the present invention, not making any limit to technical scope of the invention
System, therefore any subtle modifications, equivalent variations and modifications to the above embodiments according to the technical essence of the invention,
In the range of still falling within technical solution of the present invention.
Claims (7)
1. a kind of flexible circuit board for LED light strip, it is characterised in that: it include PET film layer, the PET film layer
Obverse and reverse distribution is coated with front insulating bond and reverse side insulating bond, is bonded on the front insulating bond
Front line layer, reverse side line layer is bonded on the reverse side insulating bond, and the front line layer is equipped with front covering
Layer, the reverse side line layer are equipped with reverse side coating, and the front line layer and the reverse side line layer are to have centainly
The aluminium foil of ductility, is connected between the front line layer and the reverse side line layer by via hole, and the via hole passes through
Red needle elongates the aluminium foil of front line layer or reverse side line layer close with the aluminium foil of reverse side line layer or front line layer
It contacts and realizes conducting, the front covering layer and/or the reverse side coating are equipped with pad layer.
2. the flexible circuit board according to claim 1 for LED light strip, it is characterised in that: the front covering layer and
The reverse side coating is ink layer or film layer.
3. the flexible circuit board according to claim 1 for LED light strip, it is characterised in that: the front insulation adhesive
Layer and reverse side insulating bond are the insulating cement of coating.
4. the flexible circuit board according to claim 1 for LED light strip, it is characterised in that: the front line layer and
It is connected between the reverse side line layer by via hole, the via hole passes through red needle for front line layer or reverse side line layer
Aluminium foil elongate and be in close contact with the aluminium foil of reverse side line layer or front line layer and realize and be connected.
5. the flexible circuit board according to claim 4 for LED light strip, it is characterised in that: the tip end of the red needle
Several are provided with to the pit that increases the tip end of red needle and the frictional force of front line layer or reverse side line layer.
6. the preparation method of the flexible circuit board according to claim 1 for LED light strip, which is characterized in that including with
Lower step:
S1. insulative glue is coated in the front and back sides of PET film layer and forms front insulating bond and reverse side insulating bond:
S2. aluminium foil is fitted in again the front and back sides of insulative glue, is lost according to pre-designed line pattern by liquid medicine chemistry
It carves or mold is die cut or laser ablation removes the unwanted aluminium foil in front and back sides, form front line layer and reverse side line layer；
S3. ink is covered on the surface of front line layer and reverse side line layer or film forms front covering layer and reverse side covering
Layer, front covering layer and reverse side coating reserve welding electronic component region, expose the front line layer or reverse side of part
Line layer is as pad for welding；
S4. the circuit board produced by above step pad covering can scolding tin substance for common tin cream weld electronics
Component；Or in the downstream endpoint customers' place direct welding electronic component of tin cream of welding aluminium.
7. the preparation method of the flexible circuit board according to claim 4 for LED light strip, which is characterized in that including with
Lower step:
S1. insulative glue is coated in the front and back sides of PET film layer and forms front insulating bond and reverse side insulating bond:
S2. aluminium foil is fitted in again the front and back sides of insulative glue, is lost according to pre-designed line pattern by liquid medicine chemistry
It carves or mold is die cut or laser ablation removes the unwanted aluminium foil in front and back sides, form front line layer and reverse side line layer:
S3. aluminium foil is elongated by the red needle on press machine and pierces through front insulating bond and reverse side insulating bond and PET simultaneously
Film layer contacts the aluminium foil between front line layer and reverse side line layer directly to which front line layer and reverse side route be connected
Layer forms via hole；
S4. ink is covered on the surface of front line layer and reverse side line layer or film forms front covering layer and reverse side covering
Layer, front covering layer and reverse side coating reserve welding electronic component region, expose the front line layer or reverse side of part
Line layer is as pad for welding:
S5. the circuit board produced by above step pad covering can scolding tin substance for common tin cream weld electronics
Component；Or in the downstream endpoint customers' place direct welding electronic component of tin cream of welding aluminium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910829592.0A CN110475425A (en) | 2019-09-03 | 2019-09-03 | A kind of flexible circuit board and preparation method thereof for LED light strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910829592.0A CN110475425A (en) | 2019-09-03 | 2019-09-03 | A kind of flexible circuit board and preparation method thereof for LED light strip |
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| CN110475425A true CN110475425A (en) | 2019-11-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910829592.0A Pending CN110475425A (en) | 2019-09-03 | 2019-09-03 | A kind of flexible circuit board and preparation method thereof for LED light strip |
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| CN111963680A (en) * | 2020-09-11 | 2020-11-20 | 东莞广华汽车饰件科技有限公司 | Production method of light-transmitting decorative gear cover |
| WO2022000107A1 (en) * | 2020-06-28 | 2022-01-06 | 南通大学 | Electronic curtain wall |
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