CN108533985A - A kind of manufacturing method of LED light strip - Google Patents
A kind of manufacturing method of LED light strip Download PDFInfo
- Publication number
- CN108533985A CN108533985A CN201810357450.4A CN201810357450A CN108533985A CN 108533985 A CN108533985 A CN 108533985A CN 201810357450 A CN201810357450 A CN 201810357450A CN 108533985 A CN108533985 A CN 108533985A
- Authority
- CN
- China
- Prior art keywords
- positive
- insulating film
- circuit board
- power supply
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
- F21S4/24—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
Abstract
A kind of manufacturing method of LED light strip of the present invention, includes the following steps：A) a kind of existing LED light strip flexible PCB is selected, the circuit board includes circuit layer and is covered in the first insulating film and the second insulating film of circuit layer upper and lower, the position for welding LED is needed to open up the positive and negative anodes LED pads of exposed circuits layer on the first insulating film, the position for connecting power supply is needed to open up positive and negative power supply pad in the first insulating film, the power pad penetrates second insulating film；B) in the second insulating film side of the circuit board through a) step process, the position of corresponding positive and negative anodes disk attaches positive and negative power supply line；C) LED is welded at the LED pads, with tin cream electrical connection circuit layer and positive and negative power supply line, d at the power pad) use plastic extrusion process in circuit board outer cladding crust, wrap up the circuit board and LED.
Description
Technical field
The present invention relates to a kind of methods of decorative lamp for illumination, more particularly to a kind of manufacturing method of LED light strip.
Background technology
Existing LED light strip is as shown in figure 8, including circuit board 01 and the LED02 being welded on circuit board 01, described in package
The core wire 03 of circuit board 01 and LED02.The corresponding position in 03 interior circuit board of core wire, 01 both sides is embedded with respectively to exist with circuit board 01
Conplane positive and negative polarity wire 04.The positive and negative anodes of each section of flexible PCB 01 are connected to the positive and negative anodes with lead 05 respectively
Conducting wire 04.The flexible PCB 01 is as shown in figure 9, including intermediate circuit layer 011 and the insulating film for being covered in circuit layer or more
012 and 013.The first pad 012a for welding LED02 is offered on upper nonconductive Film 012 and for connecting second with main traverse line
Pad 012b.The lead 05 is welded on the second pad 012b and is connect with positive and negative polarity wire 04.The LED of this structure
Light bar needs to connect positive and negative polarity wire 04 using connecting line 05, and technique is cumbersome, complicated, of high cost.
To overcome disadvantage mentioned above, one method is the methods cut using machinery to cut out circuit diagram in the prior art
Shape, then copper foil is attached as power cord at the back side of circuitous pattern.But due to circuitous pattern precision, thickness is thin, to equipment essence
Density requirements are high, and cost of goods manufactured is high, and yield is low.
Invention content
For overcome the deficiencies in the prior art, the present invention provides a kind of simple in structure, simple process, cost LED light strip
Manufacturing method.
Technological means is used by the present invention solves its technical problem：A kind of manufacturing method of LED light strip, feature exist
In including the following steps：
A) a kind of existing LED light strip flexible PCB, the circuit board include circuit layer and are covered in circuit layer upper and lower
The first insulating film and the second insulating film, needed on the first insulating film weld LED position open up the positive and negative of exposed circuits layer
Pole LED pads need the position for connecting power supply to open up positive and negative power supply pad in the first insulating film, and the power pad penetrates institute
State the second insulating film；
The position of second insulating film side of the circuit board b) through a) step process, corresponding positive and negative anodes disk attaches positive and negative anodes electricity
Source line；
C) LED is welded at the LED pads, with tin cream electrical connection circuit layer and positive and negative anodes electricity at the power pad
Source line.
D) it uses plastic extrusion process in circuit board outer cladding crust, wraps up the circuit board and LED.
The beneficial effects of the invention are as follows：Since the present invention attaches positive and negative power supply line at the back side of available circuit plate in advance,
Board circuit is electrically connected with positive and negative power supply conducting wire by tin cream again, therefore uses the LED light strip that makes of the present invention can be with
Conducting wire is omitted, the components such as lead and core wire are simple in structure；Embedded conducting wire, welding lead and manufacture core wire etc. are also omited simultaneously
Technology process is simple, of low cost.Simultaneously because being processed using the circuit board of existing market technical maturity, to manufacturing equipment
Required precision is low, and product price is cheap.
Description of the drawings
Fig. 1 is production equipment structural schematic diagram of the present invention；
Fig. 2 is one of the structural schematic diagram of circuit board of the present invention；
Fig. 3 is the second structural representation of circuit board of the present invention
Fig. 4 is the enlarged drawing at A in Fig. 3；
Fig. 5 is that power cord is adhered to the structural schematic diagram on third insulating film；
Fig. 6 is the structural schematic diagram of welding circuit board LED and power lead；
Fig. 7 is the structural schematic diagram after circuit board is encapsulated；
Fig. 8 is existing light bar structural schematic diagram；
Fig. 9 is the board structure of circuit schematic diagrames of existing light bar.
Specific implementation mode
The present invention is described in further detail with reference to the accompanying drawings and examples.
Fig. 1 is a kind of manufacture production equipment of the LED circuit board of self-powered line of intermediate products of the present invention, including lower stage
With the upper stage in lower stage.
Upper stage is by discharging direction main composition is fed to：Circuit board blowing roller T20, circuit board blowing roller T20
After be that device T21 is cut out in pad rolling, pad rolling cut out device T21 after be pad arbiter T22.
Lower stage leading portion is by discharging direction main composition is fed to：Copper foil roller T10.Copper is connected after copper foil roller T10
Strand oscillator T11 distributes copper bar 1 into line space so that copper bar 1 is by the arrangement of scheduled spacing.It is below copper bar strand oscillator T11
Insulating film blowing roller T12.The rears insulating film blowing roller T12 are the first hot press T13.Above first hot press T13 and absolutely
Velum blowing roller T12 height quite locates that release film recover roller T14 is arranged, and is second after release film recover roller T14
Hot press T15.
Lower stage back segment is by discharging direction main composition is fed to：After third hot press T31, third hot press T31 according to
Secondary is the 4th hot press T32, banding machine T33, dragger T34 and collector roller T35.
With reference to a kind of manufacturing method of LED light strip of the description of equipment present invention, include the following steps：
The first step is that available circuit plate opens up pad technique, with reference to figure 1 and Fig. 2.Select a kind of existing LED light strip flexible
Circuit board 2, the circuit board include circuit layer 21 and be covered each by circuit layer upper and lower the first insulating film 22 and second insulation
Film 23.Circuit board 2 is to coil to pack, and is placed on circuit board blowing roller T20, circuit board 2 is sent to through several tension rollers
Device T21 and pad arbiter T22 is cut out in pad rolling.Pad rolling cuts out device T21 and/or pad arbiter T22 in the first insulating film 22
On need the position for welding LED to open up the positive and negative anodes LED pad 23a/b of exposed circuits layer 20, need to connect in the first insulating film 22
The position for connecing power supply opens up positive and negative power supply pad 24a/b, the power pad 24a/b and penetrates second insulating film 23.It opens
If the circuit board 2 of good LED pads 23a/b and positive and negative power supply pad 24a/b are sent to third hot press 31.
The circuit board opens up in pad technique, and the circuit layer 21 includes two kinds of forms.One is as shown in Fig. 2, its circuit
Layer 21 by being in the center of circuit board 2, along the arrangement of 2 length direction of circuit board on the same line there is certain intervals multistage electricity
Road 211 forms.The positive and negative anodes LED pads 23a/b is opened on the circuit 211 at the interval both ends.The positive and negative power supply
Pad 24a/b is opened in circuit board both ends respectively, from the position of circuit board intermediate circuit 211 respectively to 2 width both sides of circuit board
Extend.Secondly as shown in figure 3, circuit 211 is arranged in 2 both sides of circuit board, the positive and negative anodes LED pads 23a/b is opened in circuit
2 both sides of plate, positive and negative power supply pad 24a/b are opened in 2 both ends of circuit board respectively, same with positive and negative anodes LED pads 23a/b
On straight line.As shown in Figures 2 and 3, the power pad 24 includes only penetrating the weld part 241 of the first insulating film and positioned at welding
The interconnecting piece 242 that the second insulation division is penetrated in portion, can increase the contact area of follow-up soldering and circuit 211 in this way.It is opening up
One end of cathode power supply pad 24a, is correspondingly arranged the position of anode power cord 1b, can open up auxiliary negative power pad side by side
24b ', auxiliary negative power pad 24b ' are not connect with circuit 211, are connect with anode power cord 1b only with soldering, in this way
Convenient for connecting the anode and cathode of external power supply in the same end of circuit board 2.Similarly opening up the one of negative power supply pad 24b
Section, can open up auxiliary positive power pad 24a ', can connect external power supply, electrical connection side at the both ends of circuit board in this way
Just.
Second step is the attachment process of positive and negative power supply line 1a/b, with reference to figure 1 and Fig. 5.First by multiple bands for coiling packaging
Shape copper foil 1 is placed on copper foil roller T10, and copper foil 1 enters the second hot press T15 after strand oscillator T11 setting spacing.Coil packet
The third insulating film 12 of dress is placed on insulating film blowing roller T12, and third insulating film 12 carries viscosity on one side, and by release film
120 coverings.Third insulating film 12 enters the second hot press T15 after the first hot press 13 heats separation release film 120.Second
Copper foil 1 is attached in the adhesive faces of third insulating film 12 at hot press T15, and copper foil 1 becomes positive and negative power supply line 1a/b.
Third step is power cord and circuit board adhesion technique, with reference to figure 1 and Fig. 5.Attach the of positive and negative power supply line 1a/b
Three insulating films 12 are sent to third hot press T31, at third hot press T31 so that third insulating film 12 adheres to positive and negative anodes electricity
The side of source line 1a/b and makes on positive and negative power supply line 1a/b and circuit board 2 towards the second insulating film 23 of circuit board 2
Positive and negative power supply pad 23a/b alignment, after third insulating film 12 and the second insulating film 23 are bonded, that is, form self-powered line
Circuit board.As needed, the 4th hot press T32 can be subsequently set, hot pressing again is carried out to the circuit board of self-powered line.For
It improves the production efficiency present invention a plurality of circuit board can also to be manufactured simultaneously side by side, then cutting is carried out with banding machine T33.Circuit board
2 onward impulse is drawn using dragger T34, and finally volume is coil shape on collector roller T35.
4th step is welding procedure, and with reference to figure 6, LED3 is welded at the LED pads 23a/b, in positive and negative anodes electricity
With soldering electrical connection circuit layer 21 and positive and negative power supply line 1a/b, auxiliary positive and negative power supply pad 24a '/b ' at the pad 24a/b of source
Place is electrically connected positive and negative power supply line 1a/b with soldering.A Series Sheet is formed in this way between positive and negative power supply pad 24a/b
Member, LED light strip can be composed in parallel by multiple series units.It welds and leads on power pad 24a/b and 24a '/b ' again
Electric body makes the solder joint be higher than circuit board during welding LED using soldering built-up welding, in this way, external power supply and circuit board
When 11 connection, identification and the tight ness rating of electrical connection can be increased, be electrically connected more convenient reliable..
5th step is encapsulated technique, and institute is wrapped up using plastic extrusion process in 2 outer cladding crust 4 of circuit board with reference to figure 7
State circuit board 2 and LED3.
The above is only the better embodiment of the present invention, therefore all constructions according to described in present patent application range,
The equivalent change or modification that feature and principle are done, is included within the scope of present patent application.
Claims (6)
1. a kind of manufacturing method of LED light strip, it is characterised in that include the following steps：
A) a kind of existing LED light strip flexible PCB, the circuit board is selected to include circuit layer and be covered in circuit layer upper and lower
The first insulating film and the second insulating film, needed on the first insulating film weld LED position open up the positive and negative of exposed circuits layer
Pole LED pads need the position for connecting power supply to open up positive and negative power supply pad in the first insulating film, and the power pad penetrates institute
State the second insulating film；
B) in the second insulating film side of the circuit board through a) step process, the position of corresponding positive and negative anodes disk attaches positive and negative power supply
Line；
C) LED is welded at the LED pads, with soldering electrical connection circuit layer and positive and negative power supply at the power pad
Line；
D) it uses plastic extrusion process in circuit board outer cladding crust, wraps up the circuit board and LED.
2. a kind of manufacturing method of LED light strip according to claim 1, it is characterised in that：Circuit in a) step
Between layer setting in the circuit board, the positive and negative anodes pad is opened among circuit board, and the positive and negative power supply pad opens up respectively
The both sides of LED pads, circuit board both ends.
3. a kind of manufacturing method of LED light strip according to claim 1, it is characterised in that：Circuit in a) step
Layer is arranged in circuit board both sides, and the positive and negative anodes pad is opened in circuit board both sides, and the positive and negative power supply pad opens up respectively
On the same straight line of positive and negative anodes LED pads, circuit board both ends.
4. a kind of manufacturing method of LED light strip according to claim 2 or 3, it is characterised in that：B) the step is first will
Positive and negative power supply line is attached at a predefined interval on third insulating film, then by positive and negative power supply line towards the second insulating film side
The third insulating film is attached on the second insulating film.
5. a kind of manufacturing method of LED light strip according to claim 1, it is characterised in that：The positive and negative power supply line is
Band-like copper foil.
6. a kind of manufacturing method of LED light strip according to claim 1, it is characterised in that：The power pad includes only
It penetrates the weld part of the first insulating film and penetrates the interconnecting piece of the second insulation division in weld part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810357450.4A CN108533985A (en) | 2018-04-20 | 2018-04-20 | A kind of manufacturing method of LED light strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810357450.4A CN108533985A (en) | 2018-04-20 | 2018-04-20 | A kind of manufacturing method of LED light strip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108533985A true CN108533985A (en) | 2018-09-14 |
Family
ID=63478838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810357450.4A Pending CN108533985A (en) | 2018-04-20 | 2018-04-20 | A kind of manufacturing method of LED light strip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108533985A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114994990A (en) * | 2022-06-13 | 2022-09-02 | 湖北联新显示科技有限公司 | LCM structure for preventing wire breakage |
| EP4045840A4 (en) * | 2019-11-19 | 2023-06-14 | Elemental Led, Inc. | Linear lighting channel optical systems technical field |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201925792U (en) * | 2011-01-28 | 2011-08-10 | 中山市科顺分析测试技术有限公司 | LED flexible light strip |
| CN206181548U (en) * | 2016-10-19 | 2017-05-17 | 王定锋 | LED stripe shape lamp double layers of circuit boards module |
| WO2017210253A1 (en) * | 2016-06-02 | 2017-12-07 | Elemental LED, Inc. | Through-insulation strip light connector |
| CN107859906A (en) * | 2017-12-07 | 2018-03-30 | 江门黑氪光电科技有限公司 | A kind of water-proof LED lamp belt |
| CN107940288A (en) * | 2017-12-07 | 2018-04-20 | 江门黑氪光电科技有限公司 | A kind of water-proof LED lamp belt using multilayer circuit board |
-
2018
- 2018-04-20 CN CN201810357450.4A patent/CN108533985A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201925792U (en) * | 2011-01-28 | 2011-08-10 | 中山市科顺分析测试技术有限公司 | LED flexible light strip |
| WO2017210253A1 (en) * | 2016-06-02 | 2017-12-07 | Elemental LED, Inc. | Through-insulation strip light connector |
| CN206181548U (en) * | 2016-10-19 | 2017-05-17 | 王定锋 | LED stripe shape lamp double layers of circuit boards module |
| CN107859906A (en) * | 2017-12-07 | 2018-03-30 | 江门黑氪光电科技有限公司 | A kind of water-proof LED lamp belt |
| CN107940288A (en) * | 2017-12-07 | 2018-04-20 | 江门黑氪光电科技有限公司 | A kind of water-proof LED lamp belt using multilayer circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4045840A4 (en) * | 2019-11-19 | 2023-06-14 | Elemental Led, Inc. | Linear lighting channel optical systems technical field |
| EP4336236A3 (en) * | 2019-11-19 | 2024-06-05 | Elemental Led, Inc. | Linear lighting channel optical systems technical field |
| CN114994990A (en) * | 2022-06-13 | 2022-09-02 | 湖北联新显示科技有限公司 | LCM structure for preventing wire breakage |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180914 |