CN115241167A - COB display panel, display device and preparation method of display device - Google Patents

COB display panel, display device and preparation method of display device Download PDF

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CN115241167A
CN115241167A CN202210520341.6A CN202210520341A CN115241167A CN 115241167 A CN115241167 A CN 115241167A CN 202210520341 A CN202210520341 A CN 202210520341A CN 115241167 A CN115241167 A CN 115241167A
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circuit board
light
emitting element
grid structure
display panel
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李星明
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/852Encapsulations
    • H10H20/853Encapsulations characterised by their shape
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/857Interconnections, e.g. lead-frames, bond wires or solder balls
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • H10H20/0364Manufacture or treatment of packages of interconnections

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)

Abstract

The embodiment of the invention discloses a COB display panel, a display device and a preparation method of the display device, wherein the COB display panel comprises a circuit board, and a light-emitting element group and a grid structure which are positioned on one side of the circuit board; the light-emitting element group comprises at least one light-emitting element which is electrically connected with the circuit board; the grid structure is bonded with the circuit board; the grid structure comprises a plurality of meshes, and at least one group of light-emitting element groups are arranged in the meshes. According to the embodiment of the invention, the grid structure comprising the plurality of meshes is arranged, and the grid structure is bonded with the circuit board, so that the stress generated by the circuit board under different conditions of the COB display panel can be relieved, the circuit board is prevented from deforming, the stability of the electric connection between the light-emitting element and the circuit board is ensured, and the integral display effect of the COB display panel is improved.

Description

一种COB显示面板、显示装置及其制备方法A COB display panel, display device and preparation method thereof

技术领域technical field

本发明涉及显示屏技术领域,尤其涉及一种COB显示面板、显示装置及其 制备方法。The present invention relates to the technical field of display screens, in particular to a COB display panel, a display device and a preparation method thereof.

背景技术Background technique

相较于传统的表面贴附式封装(Surface Mounted Device,SMD)工艺的发光 二极管(LightEmitting Diode,LED)显示屏,新兴的板上芯片(Chip On Board,简 称COB)封装的显示屏具有提高光源的显色性和视觉一致性,更大视角,较高亮 度,更均匀的光斑,降低坏灯率,改善散热性能,降低厚度,以及避免点光、 眩光等优点。此外,使用COB封装工艺来制造显示屏可更好地避免焊接中的虚 焊、短焊等情况,减少制造工序,简化制造工艺过程,降低制造成本。Compared with the traditional Surface Mounted Device (SMD) process light emitting diode (Light Emitting Diode, LED) display, the emerging chip on board (Chip On Board, COB) packaged display has improved light source. Excellent color rendering and visual consistency, larger viewing angle, higher brightness, more uniform light spot, lower bad lamp rate, improved heat dissipation performance, reduced thickness, and avoid spot light, glare and other advantages. In addition, using the COB packaging process to manufacture the display screen can better avoid false welding, short welding, etc. in the welding, reduce the manufacturing process, simplify the manufacturing process, and reduce the manufacturing cost.

COB封装的显示屏是将多个LED裸芯片直接焊接在PCB电路板上,在LED 裸芯片与PCB电路板之间建立电气连接,然后以树脂覆盖设置在PCB电路板 表面上的LED裸芯片和导线来进行封装。但制备过程中PCB电路板易出现形 变,影响LED的显示效果。The COB packaged display screen is to directly solder multiple LED bare chips on the PCB circuit board, establish an electrical connection between the LED bare chips and the PCB circuit board, and then cover the LED bare chips and the LED bare chips arranged on the surface of the PCB circuit board with resin. lead to encapsulate. However, the PCB circuit board is prone to deformation during the preparation process, which affects the display effect of the LED.

发明内容SUMMARY OF THE INVENTION

本发明实施例提供了一种COB显示面板、显示装置及其制备方法,以解决 电路板受其他因素影响而产生形变,保证电路板和发光元件之间电连接的稳定 性。Embodiments of the present invention provide a COB display panel, a display device and a manufacturing method thereof, so as to solve the deformation of the circuit board under the influence of other factors, and ensure the stability of the electrical connection between the circuit board and the light-emitting element.

第一方面,本发明实施例提供了一种COB显示面板,包括:In a first aspect, an embodiment of the present invention provides a COB display panel, including:

电路板;circuit board;

位于所述电路板一侧的发光元件组和网格结构;所述发光元件组包括至少 一个发光元件,所述发光元件与所述电路板电连接;所述网格结构与所述电路 板粘结设置;A light-emitting element group and a grid structure on one side of the circuit board; the light-emitting element group includes at least one light-emitting element, and the light-emitting element is electrically connected to the circuit board; the grid structure is adhered to the circuit board knot setting;

所述网格结构包括多个网孔,所述网孔内设置有至少一组所述发光元件组。The grid structure includes a plurality of mesh holes, and at least one group of the light-emitting element groups is arranged in the mesh holes.

可选的,所述网格结构与所述电路板通过粘结胶水粘结设置;Optionally, the grid structure and the circuit board are bonded and arranged by bonding glue;

所述电路板的热膨胀系数为a;The thermal expansion coefficient of the circuit board is a;

所述连接胶水的热膨胀系数为b;The thermal expansion coefficient of the connecting glue is b;

所述网格结构的热膨胀系数为c;The thermal expansion coefficient of the grid structure is c;

其中,|b-a|/a≤5%,|b-c|/c≤5%。Wherein, |b-a|/a≤5%, |b-c|/c≤5%.

可选的,a=b=c。Optionally, a=b=c.

可选的,所述网格结构包括网格壁,所述网格壁限定所述网孔;Optionally, the grid structure includes grid walls, and the grid walls define the mesh holes;

沿所述COB显示面板的厚度方向,所述网格壁的高度大于所述发光元件的 高度。In the thickness direction of the COB display panel, the height of the grid wall is greater than the height of the light emitting element.

可选的,所述COB显示面板还包括封装结构;Optionally, the COB display panel further includes a packaging structure;

所述封装结构位于所述网格结构远离所述电路板一侧,并且所述封装结构 填充所述网孔。The encapsulation structure is located on the side of the grid structure away from the circuit board, and the encapsulation structure fills the mesh hole.

可选的,所述网格结构包括金属网格结构或者塑料网格结构。Optionally, the grid structure includes a metal grid structure or a plastic grid structure.

可选的,所述发光元件组包括蓝色发光元件、红色发光元件和绿色发光元 件;Optionally, the light-emitting element group includes blue light-emitting elements, red light-emitting elements and green light-emitting elements;

或者,所述发光元件组包括相同颜色的发光元件。Alternatively, the light-emitting element group includes light-emitting elements of the same color.

第二方面,本发明实施例提供了一种显示装置,包括第一方面任一项所述 的COB显示面板。In a second aspect, an embodiment of the present invention provides a display device, including the COB display panel described in any one of the first aspect.

第三方面,本发明实施例提供了一种COB显示面板的制备方法,用于制备 第一方面任一项所述的COB显示面板,所述制备方法包括:In a third aspect, an embodiment of the present invention provides a method for preparing a COB display panel for preparing the COB display panel described in any one of the first aspects, the preparation method comprising:

提供电路板;provide circuit boards;

在所述电路板一侧制备发光元件组,所述发光元件组包括至少一个发光元 件,所述发光元件与所述电路板电连接;A light-emitting element group is prepared on one side of the circuit board, the light-emitting element group includes at least one light-emitting element, and the light-emitting element is electrically connected to the circuit board;

提供网格结构,并粘结所述网格结构和所述电路板,所述网格结构包括多 个网孔,所述网孔内设置有至少一组所述发光元件组。A grid structure is provided, and the grid structure and the circuit board are bonded, the grid structure includes a plurality of mesh holes, and at least one group of the light-emitting element groups is arranged in the mesh holes.

可选的,粘结所述网格结构和所述电路板,包括:Optionally, bonding the grid structure and the circuit board includes:

在所述网格结构一侧涂覆粘结胶水;Coating adhesive glue on one side of the grid structure;

以所述粘结胶水朝向所述电路板一侧的方式,通过所述粘结胶水粘结所述 网格结构和所述电路板;Bonding the grid structure and the circuit board with the bonding glue in a manner that the bonding glue faces one side of the circuit board;

所述制备方法还包括:The preparation method also includes:

在所述网格结构远离所述电路板的一侧涂覆封装胶,所述封装胶覆盖所述 网格结构并填充所述网孔;The side of the grid structure away from the circuit board is coated with encapsulant, and the encapsulant covers the grid structure and fills the mesh;

真空环境下固化所述粘结胶水和所述封装胶,所述封装结构固化形成封装 结构。The bonding glue and the encapsulant are cured in a vacuum environment, and the encapsulation structure is cured to form an encapsulation structure.

本发明实施例提供了一种COB显示面板,该COB显示面板包括电路板、 发光元件组和网格结构,其中发光元件组包括的发光元件与电路板电连接。并 且通过将包括多个网孔的网格结构与电路板粘结设置,可以缓解COB显示面板 在不同条件下导致电路板产生的应力,避免电路板产生形变,进而保证发光元 件与电路板电连接的稳定,改善COB显示面板整体的显示效果。An embodiment of the present invention provides a COB display panel, the COB display panel includes a circuit board, a light-emitting element group and a grid structure, wherein the light-emitting elements included in the light-emitting element group are electrically connected to the circuit board. And by bonding the grid structure including a plurality of mesh holes to the circuit board, the stress of the COB display panel caused by the circuit board under different conditions can be alleviated, and the circuit board can be prevented from being deformed, thereby ensuring the electrical connection between the light-emitting element and the circuit board. stability, and improve the overall display effect of the COB display panel.

附图说明Description of drawings

为了更清楚地说明本发明实施例中的技术方案,下面将对实施例描述中所 需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明 的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下, 还可以根据这些附图获得其他的附图。In order to illustrate the technical solutions in the embodiments of the present invention more clearly, the following briefly introduces the accompanying drawings used in the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained from these drawings without any creative effort.

图1是本发明实施例提供的一种COB显示面板的结构示意图;1 is a schematic structural diagram of a COB display panel provided by an embodiment of the present invention;

图2是图1沿A-A’方向的一种截面结构示意图;Fig. 2 is a kind of cross-sectional structure schematic diagram of Fig. 1 along A-A' direction;

图3是图1沿A-A’方向的另一种截面结构示意图;Fig. 3 is another kind of cross-sectional structure schematic diagram of Fig. 1 along A-A' direction;

图4是本发明实施例提供的另一种COB显示面板的结构示意图;4 is a schematic structural diagram of another COB display panel provided by an embodiment of the present invention;

图5是图4沿B-B’方向的一种截面结构示意图;Fig. 5 is a kind of cross-sectional structure schematic diagram of Fig. 4 along B-B' direction;

图6是本发明实施例提供的一种显示装置的结构示意图;6 is a schematic structural diagram of a display device provided by an embodiment of the present invention;

图7是本发明实施例提供的一种COB显示面板的制备方法的流程示意图;7 is a schematic flowchart of a method for manufacturing a COB display panel according to an embodiment of the present invention;

图8是本发明实施例提供的另一种COB显示面板的制备方法的流程示意图。FIG. 8 is a schematic flowchart of another method for fabricating a COB display panel according to an embodiment of the present invention.

具体实施方式Detailed ways

为使本发明的目的、技术方案和优点更加清楚,以下将结合本发明实施例 中的附图,通过具体实施方式,完整地描述本发明的技术方案。显然,所描述 的实施例是本发明的一部分实施例,而不是全部的实施例,基于本发明的实施 例,本领域普通技术人员在没有做出创造性劳动的前提下获得的所有其他实施 例,均落入本发明的保护范围之内。In order to make the objectives, technical solutions and advantages of the present invention clearer, the following will fully describe the technical solutions of the present invention through specific embodiments in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are a part of the embodiments of the present invention, rather than all the embodiments, based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work, All fall within the protection scope of the present invention.

本发明实施例提供了一种COB显示面板,图1是本发明实施例提供的一种 COB显示面板的结构示意图,图2是图1沿A-A’方向的一种截面结构示意图, 如图1和图2所示,COB显示面板10包括电路板100以及位于电路板100一 侧的发光元件组200和网格结构300;发光元件组200包括至少一个发光元件 210,发光元件210与电路板100电连接;网格结构300与电路板100粘结设置; 网格结构300包括多个网孔310,网孔310内设置有至少一组发光元件组200。An embodiment of the present invention provides a COB display panel. FIG. 1 is a schematic structural diagram of a COB display panel provided by an embodiment of the present invention, and FIG. 2 is a schematic cross-sectional structural diagram of FIG. 1 along the AA' direction. 1 and FIG. 2, the COB display panel 10 includes a circuit board 100, a light-emitting element group 200 and a grid structure 300 located on one side of the circuit board 100; the light-emitting element group 200 includes at least one light-emitting element 210, the light-emitting element 210 and the circuit board. 100 is electrically connected; the grid structure 300 is adhesively arranged with the circuit board 100 ; the grid structure 300 includes a plurality of mesh holes 310 , and at least one group of light-emitting element groups 200 is arranged in the mesh holes 310 .

其中,COB显示面板是指将发光元件直接封装在电路板上,并且可以保证 发光元件封闭不外露,相比于传统的发光元件封装工艺,COB显示面板的封闭 性更强,制作工序更少同时产品可靠性更高。Among them, the COB display panel refers to the direct packaging of the light-emitting elements on the circuit board, and can ensure that the light-emitting elements are not exposed. Product reliability is higher.

具体的,本发明实施例提供的COB显示面板10包括电路板100和发光元 件组200,其中发光元件组200包括至少一个发光元件210,发光元件210是指 固态半导体的LED的光芯片,参考图1和图2所示,以每组发光元件组200包 括三个发光元件210为例进行说明,并且结合实际的生产需求可以在每组发光 元件200中对发光元件210的数量进行适应性的调整,本发明实施例对此不进 行具体的限定。进一步的,发光元件210与电路板100电连接,即可以通过焊 接或热处理的方式将发光元件210与电路板100之间建立电气连接,保证发光元件210正常的显示发光。Specifically, the COB display panel 10 provided by the embodiment of the present invention includes a circuit board 100 and a light-emitting element group 200, wherein the light-emitting element group 200 includes at least one light-emitting element 210, and the light-emitting element 210 refers to a solid-state semiconductor LED light chip. Referring to FIG. 1 and FIG. 2 , each group of light-emitting element groups 200 includes three light-emitting elements 210 as an example for illustration, and the number of light-emitting elements 210 in each group of light-emitting elements 200 can be adjusted adaptively according to actual production requirements. , which is not specifically limited in this embodiment of the present invention. Further, the light-emitting element 210 is electrically connected to the circuit board 100, that is, an electrical connection can be established between the light-emitting element 210 and the circuit board 100 by welding or heat treatment to ensure that the light-emitting element 210 normally displays and emits light.

具体的,参考图1和图2所示,COB显示面板10还包括网格结构300,并 且网格结构300包括多个网孔310,基于网格结构300与电路板100粘结设置, 网格结构300设置多个网孔310可以将电路板100分割成多个单元格,可以将 整个电路板100在不同温度条件下产生较大的内应力进行分散,避免因应力而 产生翘曲等形变,即可以缓解COB显示面板10在不同温度等因素影响下导致 电路板100产生形变。并且网孔310内至少设置一组发光元件组200,即在保 证电路板100不产生过大形变的同时,还可以保证电路板100和发光元件210的稳定电连接,保证COB显示面板10整体的显示效果。Specifically, as shown in FIG. 1 and FIG. 2 , the COB display panel 10 further includes a grid structure 300, and the grid structure 300 includes a plurality of mesh holes 310. Based on the bonding arrangement of the grid structure 300 and the circuit board 100, the grid The structure 300 is provided with a plurality of mesh holes 310, which can divide the circuit board 100 into a plurality of cells, and can disperse the large internal stress generated by the entire circuit board 100 under different temperature conditions, so as to avoid deformation such as warping due to stress. That is, the deformation of the circuit board 100 caused by the COB display panel 10 under the influence of factors such as different temperatures can be alleviated. In addition, at least one group of light-emitting element groups 200 is arranged in the mesh hole 310, that is, while ensuring that the circuit board 100 does not undergo excessive deformation, it can also ensure the stable electrical connection between the circuit board 100 and the light-emitting elements 210, and ensure the overall integrity of the COB display panel 10. display effect.

综上,本发明实施例提供的COB显示面板包括电路板、发光元件组和网格 结构,其中发光元件组包括的发光元件与电路板电连接。并且通过将包括多个 网孔的网格结构与电路板粘结设置,可以缓解COB显示面板在不同条件下导致 电路板产生的应力,避免电路板产生形变,进而保证发光元件与电路板电连接 的稳定,改善COB显示面板整体的显示效果。To sum up, the COB display panel provided by the embodiments of the present invention includes a circuit board, a light-emitting element group and a grid structure, wherein the light-emitting elements included in the light-emitting element group are electrically connected to the circuit board. And by bonding the grid structure including a plurality of mesh holes to the circuit board, the stress of the COB display panel caused by the circuit board under different conditions can be alleviated, and the circuit board can be prevented from being deformed, thereby ensuring the electrical connection between the light-emitting element and the circuit board. stability, and improve the overall display effect of the COB display panel.

图3是图1沿A-A’方向的另一种截面结构示意图,参考图1和图3所示, 网格结构300与电路板100通过粘结胶水400粘结设置;电路板100的热膨胀 系数为a;连接胶水400的热膨胀系数为b;网格结构300的热膨胀系数为c; 其中,|b-a|/a≤5%,|b-c|/c≤5%。FIG. 3 is another schematic cross-sectional structure of FIG. 1 along the AA' direction. Referring to FIG. 1 and FIG. 3 , the grid structure 300 and the circuit board 100 are bonded and arranged by the bonding glue 400; the thermal expansion of the circuit board 100 The coefficient is a; the thermal expansion coefficient of the connection glue 400 is b; the thermal expansion coefficient of the grid structure 300 is c; where |b-a|/a≤5%, |b-c|/c≤5%.

其中,COB显示面板10还包括粘结胶水400,并且网格结构300与电路板 100可以通过粘结胶水400粘结设置,保证网格结构300与电路板100之间稳 定的连接状态,可以有效的缓解COB显示面板10在不同条件下导致电路板100 产生的应力。The COB display panel 10 further includes adhesive glue 400, and the grid structure 300 and the circuit board 100 can be bonded and arranged by the adhesive glue 400 to ensure a stable connection state between the grid structure 300 and the circuit board 100, which can effectively The COB display panel 10 relieves the stress generated by the circuit board 100 caused by the COB display panel 10 under different conditions.

具体的,电路板100、网格结构300和粘结胶水400均存在一定的热膨胀 系数,其中热膨胀系数是指物体在单位温度改变的条件下,其长度、面积或者 体积进行相应的改变。电路板100的热膨胀系数为a,连接胶水400的热膨胀系 数为b,网格结构300的热膨胀系数为c,并且彼此之间的热膨胀系数相近,即 |b-a|/a≤5%,|b-c|/c≤5%。示例性的,电路板100、网格结构300和粘结胶水400 在所处环境的温度发生改变时,三者的长度、面积或者体积的变化趋势保持一 致,电路板100可以进一步保证不受压应力或者拉应力造成形变,例如弯折或 者翘曲等,保证电路板100和发光元件210的稳定电连接,进而保证COB显示 面板10整体的显示效果。Specifically, the circuit board 100, the grid structure 300 and the adhesive glue 400 all have a certain coefficient of thermal expansion, wherein the coefficient of thermal expansion refers to the corresponding change in the length, area or volume of the object under the condition of unit temperature change. The thermal expansion coefficient of the circuit board 100 is a, the thermal expansion coefficient of the connection glue 400 is b, and the thermal expansion coefficient of the grid structure 300 is c, and the thermal expansion coefficients are similar to each other, that is, |b-a|/a≤5%, |b-c| /c≤5%. Exemplarily, when the temperature of the circuit board 100, the grid structure 300 and the adhesive glue 400 is changed, the change trend of the length, area or volume of the three remains the same, and the circuit board 100 can be further guaranteed not to be compressed. Deformation caused by stress or tensile stress, such as bending or warping, ensures a stable electrical connection between the circuit board 100 and the light-emitting element 210 , thereby ensuring the overall display effect of the COB display panel 10 .

进一步的,继续参考图3所示,电路板100的热膨胀系数为a;连接胶水 400的热膨胀系数为b;网格结构300的热膨胀系数为c,其中,a=b=c。Further, referring to FIG. 3, the thermal expansion coefficient of the circuit board 100 is a; the thermal expansion coefficient of the connection glue 400 is b; the thermal expansion coefficient of the grid structure 300 is c, where a=b=c.

具体的,电路板100的热膨胀系数为a,连接胶水400的热膨胀系数为b, 网格结构300的热膨胀系数为c,在彼此之间的热膨胀系数相近的基础上,三者 的热膨胀系数可以相同,即a=b=c。电路板100、网格结构300和粘结胶水400 在所处环境的温度发生改变时,三者的长度、面积或者体积的变化保持完全一 致,电路板100可以进一步保证不受压应力或者拉应力造成形变,例如弯折或 者翘曲等,保证电路板100和发光元件210的稳定电连接,进而保证COB显示 面板10整体的显示效果。Specifically, the thermal expansion coefficient of the circuit board 100 is a, the thermal expansion coefficient of the connection glue 400 is b, and the thermal expansion coefficient of the grid structure 300 is c. On the basis that the thermal expansion coefficients are similar to each other, the thermal expansion coefficients of the three can be the same. , that is, a=b=c. When the temperature of the environment in which the circuit board 100, the grid structure 300 and the adhesive 400 are located changes, the length, area or volume changes of the three remain exactly the same, and the circuit board 100 can be further guaranteed to be free from compressive stress or tensile stress Deformation, such as bending or warping, is caused to ensure stable electrical connection between the circuit board 100 and the light-emitting element 210 , thereby ensuring the overall display effect of the COB display panel 10 .

继续参考图1和2所示,网格结构300包括网格壁320,网格壁320限定 网孔310;沿COB显示面板10的厚度方向,网格壁320的高度大于发光元件 210的高度。1 and 2, the grid structure 300 includes grid walls 320, and the grid walls 320 define the grid holes 310;

其中,网格结构300包括网格壁320,通过相邻的网格壁320可以限定得 到网孔310,网格结构300包括多个网格壁320所以限定多个网孔310。在图1 和图2中,网格结构300通过四个相邻的网格壁320限定出一个网孔310,在 其他实施例中还可以通过三个相邻的网格壁320限定出一个网孔310,本发明 实施例对此不进行具体的限定。The mesh structure 300 includes mesh walls 320, and the mesh holes 310 can be defined by adjacent mesh walls 320. The mesh structure 300 includes a plurality of mesh walls 320, so a plurality of mesh holes 310 are defined. In FIGS. 1 and 2 , the mesh structure 300 defines a mesh hole 310 by four adjacent mesh walls 320 , and in other embodiments, a mesh can also be defined by three adjacent mesh walls 320 . The hole 310 is not specifically limited in this embodiment of the present invention.

示例性的,参考图2所示,网格壁320的高度为L1,同时发光元件210的 高度为L2,L1大于L2,即网格壁320的高度大于发光元件210的高度。通过 提升网格壁320的高度,即增加网格结构300的质量,在通过网孔310将电路 板100分割成多个单元格进行分散应力的基础上,还可以更加稳定的保证网格 结构300与电路板100的粘结强度。即电路板100可以进一步保证不受压应力 或者拉应力造成形变,例如弯折或者翘曲等,实现电路板100和发光元件210 的稳定电连接,进而保证COB显示面板10整体的显示效果。2, the height of the grid wall 320 is L1, while the height of the light emitting element 210 is L2, and L1 is greater than L2, that is, the height of the grid wall 320 is greater than the height of the light emitting element 210. By increasing the height of the grid wall 320 , that is, increasing the quality of the grid structure 300 , on the basis of dividing the circuit board 100 into a plurality of cells through the mesh holes 310 to disperse the stress, the grid structure 300 can be more stably guaranteed. Adhesion strength to circuit board 100 . That is, the circuit board 100 can be further guaranteed not to be deformed by compressive stress or tensile stress, such as bending or warping, so as to realize stable electrical connection between the circuit board 100 and the light-emitting element 210, thereby ensuring the overall display effect of the COB display panel 10.

图4是本发明实施例提供的另一种COB显示面板的结构示意图,图5是图 1沿B-B’方向的一种截面结构示意图,参考图4和图5所示,COB显示面板 10还包括封装结构500;封装结构500位于网格结构300远离电路板100一侧, 并且封装结构500填充网孔310。4 is a schematic structural diagram of another COB display panel provided by an embodiment of the present invention, and FIG. 5 is a schematic cross-sectional structural diagram of FIG. 1 along the BB' direction. Referring to FIGS. 4 and 5 , the COB display panel 10 A package structure 500 is also included; the package structure 500 is located on the side of the grid structure 300 away from the circuit board 100 , and the package structure 500 fills the mesh holes 310 .

具体的,COB显示面板10还包括封装结构500,通过封装结构500实现 COB显示面板10封闭不外露的条件。其中,封装结构500的材质可以是环氧 树脂,其固化后可以较好的包括COB显示面板10。Specifically, the COB display panel 10 further includes an encapsulation structure 500, and the encapsulation structure 500 realizes the condition that the COB display panel 10 is sealed and not exposed. The material of the encapsulation structure 500 may be epoxy resin, which may preferably include the COB display panel 10 after curing.

进一步的,封装结构500还用于填充网孔310,固化后的封装结构500可 以更好的保证网孔310的形状,同时在网孔310内部填充后可以对电路板100 产生形变时产生相抵触的应力,进而有效避免电路板100温度异常情况下产生 形变,保证电路板100和发光元件210的稳定电连接,进而保证COB显示面板 10整体的显示效果。Further, the encapsulation structure 500 is also used to fill the mesh holes 310 , and the cured encapsulation structure 500 can better ensure the shape of the mesh holes 310 , and at the same time, after filling the inside of the mesh holes 310 , the circuit board 100 can be in conflict with each other when it is deformed. Therefore, the deformation of the circuit board 100 under abnormal temperature can be effectively avoided, and the stable electrical connection between the circuit board 100 and the light-emitting element 210 is ensured, thereby ensuring the overall display effect of the COB display panel 10 .

继续参考图1和图2所示,网格结构300包括金属网格结构或者塑料网格 结构。1 and 2, the grid structure 300 includes a metal grid structure or a plastic grid structure.

具体的,网格结构300可以包括金属网格结构,金属网格结构具有屏蔽电 磁辐射的作用,避免外界信号对发光元件210产生信号的干扰。进一步的,金 属网格结构具有导电的作用,可以将产生的静电进行导出避免对COB显示面板10中器件产生静电损伤。进一步的,网格结构300可以包括塑料网格结构或者 其他材质的网格结构300,本发明实施例对此不进行具体的限定。Specifically, the grid structure 300 may include a metal grid structure, and the metal grid structure has the function of shielding electromagnetic radiation, so as to avoid the interference of signals generated by the light-emitting element 210 from external signals. Further, the metal mesh structure has the function of conducting electricity, and can export the generated static electricity to avoid electrostatic damage to the devices in the COB display panel 10 . Further, the grid structure 300 may include a plastic grid structure or a grid structure 300 made of other materials, which is not specifically limited in this embodiment of the present invention.

继续参考图1和图2所示,发光元件组200包括蓝色发光元件、红色发光 元件和绿色发光元件;或者,发光元件组200包括相同颜色的发光元件。1 and 2, the light-emitting element group 200 includes blue light-emitting elements, red light-emitting elements and green light-emitting elements; alternatively, the light-emitting element group 200 includes light-emitting elements of the same color.

其中,发光元件组200包括发光元件210,发光元件210可以是蓝色发光 元件、红色发光元件和绿色发光元件,并且一个蓝色发光元件、红色发光元件 和绿色发光元件可以组成一个像素单元,便于实现显示面板的彩色显示。发光 元件组200中可以包括一个像素单元也可以包括多个像素单元,本发明实施例 对此不进行具体的限定。进一步的,结合实际的需求,发光元件组200可以包 括相同颜色的发光元件210,示例性的,对蓝色需求较大,发光元件组200中 包括的发光元件210可以均是蓝色发光元件,本发明实施例对此不进行具体的 限定。The light-emitting element group 200 includes a light-emitting element 210, the light-emitting element 210 may be a blue light-emitting element, a red light-emitting element and a green light-emitting element, and a blue light-emitting element, a red light-emitting element and a green light-emitting element may form a pixel unit, which is convenient for Realize the color display of the display panel. The light-emitting element group 200 may include one pixel unit or multiple pixel units, which is not specifically limited in this embodiment of the present invention. Further, in combination with actual requirements, the light-emitting element group 200 may include light-emitting elements 210 of the same color. Exemplarily, the light-emitting elements 210 included in the light-emitting element group 200 may be blue light-emitting elements because of a greater demand for blue color. This embodiment of the present invention does not specifically limit this.

基于相同的发明构思,本发明实施例还提供了一种显示装置,图6是本发 明实施例提供的一种显示装置的结构示意图,如图6所示,该显示装置1包括 上述任一实施例所述的COB显示面板10,因此,本发明实施例提供的显示装 置1具备上述实施例中相应的有益效果,这里不再赘述。Based on the same inventive concept, an embodiment of the present invention further provides a display device. FIG. 6 is a schematic structural diagram of a display device provided by an embodiment of the present invention. As shown in FIG. 6 , the display device 1 includes any of the above-mentioned implementations. The COB display panel 10 described in the example, therefore, the display device 1 provided by the embodiment of the present invention has the corresponding beneficial effects in the above-mentioned embodiments, which will not be repeated here.

基于相同的发明构思,本发明实施例还提供了一种COB显示面板的制备方 法,图7是本发明实施例提供的一种COB显示面板的制备方法的流程示意图, 如图7所示,本发明实施例提供的COB显示面板的制备方法包括:Based on the same inventive concept, an embodiment of the present invention also provides a method for manufacturing a COB display panel. FIG. 7 is a schematic flowchart of a method for manufacturing a COB display panel provided by an embodiment of the present invention. As shown in FIG. The preparation method of the COB display panel provided by the embodiment of the invention includes:

S110、提供电路板。S110, providing a circuit board.

示例性的,COB显示面板是指将发光元件直接封装在电路板上,并且可以 保证发光元件封闭不外露,相比于传统的发光元件封装工艺,COB显示面板的 封闭性更强,制作工序更少同时产品可靠性更高。Exemplarily, the COB display panel refers to directly encapsulating the light-emitting elements on the circuit board, and can ensure that the light-emitting elements are sealed and not exposed. At the same time, the product reliability is higher.

其中,电路板是指印制电路板(Printed Circuit Board,PCB),又称印刷线 路板,是重要的电子部件,是电子元器件的支撑体也是电子元器件电气相互连 接的载体。Among them, a circuit board refers to a printed circuit board (Printed Circuit Board, PCB), also known as a printed circuit board, which is an important electronic component, a support body for electronic components, and a carrier for electrical interconnection of electronic components.

S120、在电路板一侧制备发光元件组,发光元件组包括至少一个发光元件, 发光元件与电路板电连接。S120, prepare a light-emitting element group on one side of the circuit board, the light-emitting element group includes at least one light-emitting element, and the light-emitting element is electrically connected to the circuit board.

其中,发光元件是指固态半导体的LED的光芯片,将发光元件组中发光元 件与电路板电连接,即可以通过焊接或热处理的方式将发光元件与电路板之间 建立电气连接,保证发光元件正常的显示发光。Among them, the light-emitting element refers to the light chip of the solid-state semiconductor LED. The light-emitting element in the light-emitting element group is electrically connected to the circuit board, that is, electrical connection between the light-emitting element and the circuit board can be established by welding or heat treatment to ensure the light-emitting element. Normal display glows.

S130、提供网格结构,并粘结网格结构和电路板,网格结构包括多个网孔, 网孔内设置有至少一组发光元件组。S130 , providing a grid structure, and bonding the grid structure and the circuit board, where the grid structure includes a plurality of mesh holes, and at least one group of light-emitting element groups is arranged in the mesh holes.

其中,COB显示面板还包括网格结构,并且网格结构包括多个网孔,基于 网格结构与电路板粘结设置,网格结构设置多个网孔可以将电路板分割成多个 单元格,可以将整个电路板在不同温度条件下产生较大的内应力进行分散,避 免因应力而产生翘曲等形变。并且网孔内至少设置一组发光元件组,即在保证 电路板不产生过大形变的同时,还可以保证电路板和发光元件的稳定电连接, 保证COB显示面板整体的显示效果。Wherein, the COB display panel also includes a grid structure, and the grid structure includes a plurality of mesh holes. Based on the bonding arrangement between the grid structure and the circuit board, the grid structure is provided with a plurality of mesh holes to divide the circuit board into a plurality of cells. , which can disperse the large internal stress of the entire circuit board under different temperature conditions to avoid warping and other deformation due to stress. And at least one group of light-emitting element groups are arranged in the mesh, that is, while ensuring that the circuit board does not undergo excessive deformation, it can also ensure the stable electrical connection between the circuit board and the light-emitting elements, and ensure the overall display effect of the COB display panel.

综上,本发明实施例提供的一种COB显示面板的制备方法,通过将网格结 构与电路板粘结,并在网格结构上设置多个网孔,可以缓解COB显示面板在不 同条件下导致电路板产生的应力,避免电路板产生形变,进而保证发光元件与 电路板电连接的稳定,改善COB显示面板整体的显示效果。To sum up, a method for preparing a COB display panel provided by an embodiment of the present invention can alleviate the COB display panel under different conditions by bonding a grid structure to a circuit board and setting a plurality of mesh holes on the grid structure. The stress caused by the circuit board can avoid the deformation of the circuit board, thereby ensuring the stability of the electrical connection between the light-emitting element and the circuit board, and improving the overall display effect of the COB display panel.

图8是本发明实施例提供的另一种COB显示面板的制备方法的流程示意 图,如图8所示,制备方法还包括:FIG. 8 is a schematic flowchart of another method for preparing a COB display panel provided by an embodiment of the present invention. As shown in FIG. 8 , the preparation method further includes:

S210、提供电路板。S210, providing a circuit board.

S220、在电路板一侧制备发光元件组,发光元件组包括至少一个发光元件, 发光元件与电路板电连接。S220, prepare a light-emitting element group on one side of the circuit board, the light-emitting element group includes at least one light-emitting element, and the light-emitting element is electrically connected to the circuit board.

S230、在网格结构一侧涂覆粘结胶水。S230, coating adhesive glue on one side of the grid structure.

S240、以粘结胶水朝向电路板一侧的方式,通过粘结胶水粘结网格结构和 电路板。S240. Bond the grid structure and the circuit board with the bonding glue in a manner that the bonding glue faces one side of the circuit board.

示例性的,网格结构与电路板通过粘结胶水实现彼此粘结,保证网格结构 与电路板之间稳定的连接状态,可以有效的缓解COB显示面板在不同条件下导 致电路板产生的应力。进一步的,当网格结构、电路板和粘结胶水之间的热膨 胀系数相同或者相近时,可以更好的保证电路板不受压应力或者拉应力造成形 变,例如弯折或者翘曲等,保证电路板和发光元件的稳定电连接,进而保证COB 显示面板整体的显示效果。Exemplarily, the grid structure and the circuit board are bonded to each other through bonding glue, which ensures a stable connection state between the grid structure and the circuit board, which can effectively relieve the stress generated by the COB display panel caused by the circuit board under different conditions. . Further, when the thermal expansion coefficients between the grid structure, the circuit board and the bonding glue are the same or similar, it can better ensure that the circuit board is not deformed by compressive stress or tensile stress, such as bending or warping, etc. The stable electrical connection between the circuit board and the light-emitting element ensures the overall display effect of the COB display panel.

S250、在网格结构远离电路板的一侧涂覆封装胶,封装胶覆盖网格结构并 填充网孔。S250. Apply encapsulant on the side of the grid structure away from the circuit board, and the encapsulant covers the grid structure and fills the mesh holes.

示例性的,通过封装结构实现COB显示面板封闭不外露的条件。其中,封 装结构的材质可以是环氧树脂,其固化后可以较好的包括COB显示面板。Exemplarily, the condition that the COB display panel is closed and not exposed is achieved through the packaging structure. Wherein, the material of the encapsulation structure can be epoxy resin, which can preferably include a COB display panel after curing.

并且封装结构还用于填充网孔,固化后的封装结构可以更好的保证网孔的 形状,同时在网孔内部填充后可以对电路板产生形变时产生相抵触的应力,进 而有效避免电路板温度异常情况下产生形变,保证电路板和发光元件的稳定电 连接。And the packaging structure is also used to fill the mesh. The cured packaging structure can better ensure the shape of the mesh. At the same time, after filling the mesh, it can generate conflicting stress when the circuit board is deformed, thereby effectively avoiding the circuit board. Deformation occurs under abnormal temperature conditions to ensure stable electrical connection between the circuit board and the light-emitting element.

S260、真空环境下固化粘结胶水和封装胶,封装结构固化形成封装结构。S260 , curing the bonding glue and the encapsulating glue in a vacuum environment, and curing the encapsulating structure to form an encapsulating structure.

进一步的,在真空环境下对粘结胶水和封装胶进行固化,避免在空气中导 致粘结胶水和封装胶中存在气泡,影响COB显示面板整体的平整性。示例性的, 将涂覆粘结胶水和封装胶后的COB显示面板置于真空环境下静止24小时,实 现粘结胶水和封装胶的固化,本发明实施例对静止时长不进行具体的限定。Further, the adhesive glue and the encapsulant are cured in a vacuum environment to avoid air bubbles in the adhesive glue and the encapsulant, which will affect the overall flatness of the COB display panel. Exemplarily, the COB display panel coated with the adhesive glue and the encapsulant is placed in a vacuum environment for 24 hours at rest to realize the curing of the adhesive glue and the encapsulant. The embodiment of the present invention does not specifically limit the duration of the still time.

综上,通过细化COB显示面板的制备方法,更好的保证发光元件与电路板 电连接的稳定,改善COB显示面板整体的显示效果。To sum up, by refining the preparation method of the COB display panel, the stability of the electrical connection between the light-emitting element and the circuit board is better ensured, and the overall display effect of the COB display panel is improved.

注意,上述仅为本发明的较佳实施例及所运用技术原理。本领域技术人员 会理解,本发明不限于这里所述的特定实施例,对本领域技术人员来说能够进 行各种明显的变化、重新调整、相互结合和替代而不会脱离本发明的保护范围。 因此,虽然通过以上实施例对本发明进行了较为详细的说明,但是本发明不仅 仅限于以上实施例,在不脱离本发明构思的情况下,还可以包括更多其他等效 实施例,而本发明的范围由所附的权利要求范围决定。Note that the above are only preferred embodiments of the present invention and applied technical principles. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, mutual combinations and substitutions can be made to those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and can also include more other equivalent embodiments without departing from the concept of the present invention. The scope is determined by the scope of the appended claims.

Claims (10)

1. A COB display panel, comprising:
a circuit board;
the light-emitting element group and the grid structure are positioned on one side of the circuit board; the light emitting element group comprises at least one light emitting element which is electrically connected with the circuit board; the grid structure is bonded with the circuit board;
the grid structure comprises a plurality of meshes, and at least one group of the light emitting element groups is arranged in each mesh.
2. The COB display panel of claim 1, wherein the grid structure and the circuit board are adhesively disposed by a bonding glue;
the thermal expansion coefficient of the circuit board is a;
the thermal expansion coefficient of the connecting glue is b;
the thermal expansion coefficient of the grid structure is c;
wherein, | b-a |/a is less than or equal to 5 percent, and | b-c |/c is less than or equal to 5 percent.
3. The COB display panel of claim 2, wherein a = b = c.
4. The COB display panel of claim 1, wherein the grid structure includes grid walls that define the mesh;
along the thickness direction of the COB display panel, the height of the grid wall is larger than that of the light-emitting element.
5. The COB display panel of claim 1, further comprising an encapsulation structure;
the packaging structure is located on one side, away from the circuit board, of the grid structure, and the packaging structure fills the meshes.
6. The COB display panel of claim 1, wherein the grid structure includes a metal grid structure or a plastic grid structure.
7. The COB display panel of claim 1, wherein the light-emitting element group includes a blue light-emitting element, a red light-emitting element, and a green light-emitting element;
alternatively, the light emitting element groups include light emitting elements of the same color.
8. A display device, characterized by comprising the COB display panel according to any one of claims 1 to 7.
9. A manufacturing method of a COB display panel, for manufacturing the COB display panel according to any one of claims 1 to 7, the manufacturing method comprising:
providing a circuit board;
preparing a light-emitting element group on one side of the circuit board, wherein the light-emitting element group comprises at least one light-emitting element, and the light-emitting element is electrically connected with the circuit board;
and providing a grid structure, and bonding the grid structure and the circuit board, wherein the grid structure comprises a plurality of meshes, and at least one group of light-emitting element group is arranged in each mesh.
10. A manufacturing method of a COB display panel, wherein bonding the grid structure and the circuit board, comprises:
coating adhesive glue on one side of the grid structure;
bonding the grid structure and the circuit board through the bonding glue in a manner that the bonding glue faces one side of the circuit board;
the preparation method further comprises the following steps:
coating packaging glue on one side of the grid structure, which is far away from the circuit board, wherein the packaging glue covers the grid structure and fills the meshes;
and curing the bonding glue and the packaging glue in a vacuum environment, and curing the packaging structure to form a packaging structure.
CN202210520341.6A 2022-05-12 2022-05-12 COB display panel, display device and preparation method of display device Pending CN115241167A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117558859A (en) * 2023-12-29 2024-02-13 诺视科技(苏州)有限公司 Anti-crosstalk micro-display luminescent pixels and manufacturing method thereof, micro-display

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117558859A (en) * 2023-12-29 2024-02-13 诺视科技(苏州)有限公司 Anti-crosstalk micro-display luminescent pixels and manufacturing method thereof, micro-display

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