CN115241167A - COB display panel, display device and preparation method of display device - Google Patents
COB display panel, display device and preparation method of display device Download PDFInfo
- Publication number
- CN115241167A CN115241167A CN202210520341.6A CN202210520341A CN115241167A CN 115241167 A CN115241167 A CN 115241167A CN 202210520341 A CN202210520341 A CN 202210520341A CN 115241167 A CN115241167 A CN 115241167A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- emitting element
- grid structure
- display panel
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Abstract
The embodiment of the invention discloses a COB display panel, a display device and a preparation method of the display device, wherein the COB display panel comprises a circuit board, and a light-emitting element group and a grid structure which are positioned on one side of the circuit board; the light-emitting element group comprises at least one light-emitting element which is electrically connected with the circuit board; the grid structure is bonded with the circuit board; the grid structure comprises a plurality of meshes, and at least one group of light-emitting element groups are arranged in the meshes. According to the embodiment of the invention, the grid structure comprising the plurality of meshes is arranged, and the grid structure is bonded with the circuit board, so that the stress generated by the circuit board under different conditions of the COB display panel can be relieved, the circuit board is prevented from deforming, the stability of the electric connection between the light-emitting element and the circuit board is ensured, and the integral display effect of the COB display panel is improved.
Description
Technical Field
The invention relates to the technical field of display screens, in particular to a COB display panel, a display device and a preparation method of the display device.
Background
Compared with a traditional Light Emitting Diode (LED) display screen adopting a Surface Mounted Device (SMD) process, a display screen adopting a newly developed Chip On Board (abbreviated as COB) package has the advantages of improving the color rendering property and the visual uniformity of a light source, having a larger viewing angle, higher brightness, more uniform light spots, reducing the lamp failure rate, improving the heat dissipation performance, reducing the thickness, avoiding spot light and glare, and the like. In addition, the display screen manufactured by the COB packaging process can better avoid the conditions of virtual welding, short welding and the like in welding, reduce the manufacturing procedures, simplify the manufacturing process and reduce the manufacturing cost.
The COB packaged display screen is formed by directly welding a plurality of LED bare chips on a PCB (printed circuit board), establishing electrical connection between the LED bare chips and the PCB, and then covering the LED bare chips and wires arranged on the surface of the PCB with resin for packaging. However, the PCB is easily deformed during the preparation process, which affects the display effect of the LED.
Disclosure of Invention
The embodiment of the invention provides a COB display panel, a display device and a preparation method thereof, which aim to solve the problem that a circuit board is deformed due to the influence of other factors and ensure the stability of electric connection between the circuit board and a light-emitting element.
In a first aspect, an embodiment of the present invention provides a COB display panel, including:
a circuit board;
the light-emitting element group and the grid structure are positioned on one side of the circuit board; the light emitting element group comprises at least one light emitting element which is electrically connected with the circuit board; the grid structure is bonded with the circuit board;
the grid structure comprises a plurality of meshes, and at least one group of the light emitting element groups is arranged in each mesh.
Optionally, the grid structure and the circuit board are bonded by bonding glue;
the thermal expansion coefficient of the circuit board is a;
the thermal expansion coefficient of the connecting glue is b;
the thermal expansion coefficient of the grid structure is c;
wherein, | b-a |/a is less than or equal to 5 percent, and | b-c |/c is less than or equal to 5 percent.
Optionally, a = b = c.
Optionally, the lattice structure comprises lattice walls defining the mesh openings;
along the thickness direction of the COB display panel, the height of the grid wall is larger than that of the light-emitting element.
Optionally, the COB display panel further includes an encapsulation structure;
the packaging structure is located on one side, away from the circuit board, of the grid structure, and the packaging structure fills the meshes.
Optionally, the grid structure comprises a metal grid structure or a plastic grid structure.
Optionally, the light emitting element group includes a blue light emitting element, a red light emitting element, and a green light emitting element;
alternatively, the light emitting element groups include light emitting elements of the same color.
In a second aspect, an embodiment of the present invention provides a display device, including the COB display panel according to any one of the first aspects.
In a third aspect, an embodiment of the present invention provides a method for manufacturing a COB display panel, where the method is used to manufacture the COB display panel according to any one of the first aspects, and the method includes:
providing a circuit board;
preparing a light-emitting element group on one side of the circuit board, wherein the light-emitting element group comprises at least one light-emitting element, and the light-emitting element is electrically connected with the circuit board;
and providing a grid structure, and bonding the grid structure and the circuit board, wherein the grid structure comprises a plurality of meshes, and at least one group of light-emitting element group is arranged in each mesh.
Optionally, bonding the grid structure and the circuit board comprises:
coating adhesive glue on one side of the grid structure;
bonding the grid structure and the circuit board through the bonding glue in a manner that the bonding glue faces one side of the circuit board;
the preparation method further comprises the following steps:
coating packaging glue on one side of the grid structure, which is far away from the circuit board, wherein the packaging glue covers the grid structure and fills the meshes;
and curing the bonding glue and the packaging glue in a vacuum environment, and curing the packaging structure to form a packaging structure.
The embodiment of the invention provides a COB display panel, which comprises a circuit board, a light-emitting element group and a grid structure, wherein the light-emitting element group comprises a light-emitting element which is electrically connected with the circuit board. And through the grid structure that will include a plurality of meshs and circuit board bonding setting, can alleviate COB display panel and lead to the stress that the circuit board produced under different conditions, avoid the circuit board to produce deformation, and then guarantee the stability that light-emitting component and circuit board electricity are connected, improve the holistic display effect of COB display panel.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a COB display panel according to an embodiment of the present invention;
FIG. 2 isbase:Sub>A schematic cross-sectional view taken along line A-A' of FIG. 1;
FIG. 3 isbase:Sub>A schematic view of another cross-sectional configuration of FIG. 1 taken along line A-A';
fig. 4 is a schematic structural diagram of another COB display panel according to an embodiment of the present invention;
FIG. 5 is a schematic cross-sectional view taken along line B-B' of FIG. 4;
fig. 6 is a schematic structural diagram of a display device according to an embodiment of the present invention;
fig. 7 is a schematic flowchart of a method for manufacturing a COB display panel according to an embodiment of the present invention;
fig. 8 is a schematic flowchart of another method for manufacturing a COB display panel according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail below with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are a part of the embodiments of the present invention, not all embodiments, and all other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without inventive efforts fall within the scope of the present invention.
Fig. 1 isbase:Sub>A schematic structural view illustratingbase:Sub>A COB display panel according to an embodiment of the present invention, and fig. 2 isbase:Sub>A schematic structural view illustratingbase:Sub>A cross-section of fig. 1 alongbase:Sub>A-base:Sub>A' direction, where as shown in fig. 1 and fig. 2,base:Sub>A COB display panel 10 includesbase:Sub>A circuit board 100, andbase:Sub>A light emitting element group 200 andbase:Sub>A grid structure 300 on one side of the circuit board 100; the light emitting element group 200 includes at least one light emitting element 210, and the light emitting element 210 is electrically connected to the circuit board 100; the grid structure 300 is arranged to be bonded to the circuit board 100; the grid structure 300 comprises a plurality of mesh openings 310, at least one group of light emitting element groups 200 being arranged in the mesh openings 310.
Wherein, COB display panel means directly encapsulates on the circuit board with light emitting component to can guarantee that light emitting component seals and does not expose, compare in traditional light emitting component packaging technology, COB display panel's closure is stronger, and the product reliability is higher when the preparation process is still less.
Specifically, the COB display panel 10 provided by the embodiment of the present invention includes a circuit board 100 and a light emitting element group 200, where the light emitting element group 200 includes at least one light emitting element 210, and the light emitting element 210 refers to a photo chip of an LED of a solid-state semiconductor, and as shown in fig. 1 and fig. 2, it is described that each light emitting element group 200 includes three light emitting elements 210, and the number of the light emitting elements 210 in each light emitting element group 200 may be adaptively adjusted according to actual production requirements, which is not specifically limited by the embodiment of the present invention. Further, the light emitting element 210 is electrically connected to the circuit board 100, that is, the light emitting element 210 and the circuit board 100 can be electrically connected by soldering or heat treatment, so as to ensure that the light emitting element 210 emits light normally.
Specifically, as shown in fig. 1 and 2, COB display panel 10 further includes grid structure 300, and grid structure 300 includes a plurality of meshes 310, based on grid structure 300 and circuit board 100 bonding setting, grid structure 300 sets up a plurality of meshes 310 and can cut apart circuit board 100 into a plurality of cells, can produce great internal stress with whole circuit board 100 under different temperature conditions and disperse, avoid producing deformation such as warpage because of stress, can alleviate COB display panel 10 and lead to circuit board 100 to produce deformation under the influence of factors such as different temperatures. And at least one group of light emitting element groups 200 is arranged in the mesh 310, that is, while the circuit board 100 is not deformed excessively, the stable electrical connection between the circuit board 100 and the light emitting elements 210 can be ensured, and the overall display effect of the COB display panel 10 is ensured.
To sum up, the COB display panel provided by the embodiment of the invention includes a circuit board, a light emitting element group and a grid structure, wherein the light emitting element included in the light emitting element group is electrically connected to the circuit board. And through the grid structure that will include a plurality of meshs and circuit board bonding setting, can alleviate COB display panel and lead to the stress that the circuit board produced under different conditions, avoid the circuit board to produce deformation, and then guarantee the stability that light-emitting component and circuit board electricity are connected, improve COB display panel holistic display effect.
Fig. 3 isbase:Sub>A schematic view of another cross-sectional structure alongbase:Sub>A directionbase:Sub>A-base:Sub>A' in fig. 1, and referring to fig. 1 and 3,base:Sub>A grid structure 300 is adhesively disposed withbase:Sub>A circuit board 100 by an adhesive glue 400; the thermal expansion coefficient of the circuit board 100 is a; the thermal expansion coefficient of the connecting glue 400 is b; the thermal expansion coefficient of the lattice structure 300 is c; wherein, | b-a |/a is less than or equal to 5 percent, and | b-c |/c is less than or equal to 5 percent.
Wherein, COB display panel 10 still includes bonding glue 400 to grid structure 300 and circuit board 100 can be through the setting of bonding glue 400 bonding, guarantee the steady connected state between grid structure 300 and the circuit board 100, can effectually alleviate COB display panel 10 and lead to the stress that circuit board 100 produced under different conditions.
Specifically, the circuit board 100, the grid structure 300, and the adhesive 400 all have a certain thermal expansion coefficient, where the thermal expansion coefficient refers to a length, an area, or a volume of an object changing correspondingly under a condition of unit temperature change. The thermal expansion coefficient of the circuit board 100 is a, the thermal expansion coefficient of the connecting glue 400 is b, the thermal expansion coefficient of the grid structure 300 is c, and the thermal expansion coefficients are similar to each other, i.e., | b-a |/a is less than or equal to 5%, and | b-c |/c is less than or equal to 5%. For example, when the temperature of the environment where the circuit board 100, the grid structure 300, and the bonding glue 400 are located changes, the variation trends of the length, the area, or the volume of the three components are kept consistent, so that the circuit board 100 can further ensure that the circuit board 100 is not deformed by compressive stress or tensile stress, such as bending or warping, and the like, and ensure stable electrical connection between the circuit board 100 and the light emitting element 210, thereby ensuring the overall display effect of the COB display panel 10.
Further, with continued reference to fig. 3, the circuit board 100 has a coefficient of thermal expansion of a; the thermal expansion coefficient of the connecting glue 400 is b; the thermal expansion coefficient of the lattice structure 300 is c, wherein a = b = c.
Specifically, the thermal expansion coefficient of the circuit board 100 is a, the thermal expansion coefficient of the connection glue 400 is b, and the thermal expansion coefficient of the grid structure 300 is c, and the thermal expansion coefficients of the three may be the same on the basis of being similar to each other, that is, a = b = c. When the temperature of the environment where the circuit board 100, the grid structure 300, and the bonding glue 400 are located changes, the changes of the length, the area, or the volume of the three elements are kept completely consistent, and the circuit board 100 can further ensure that the circuit board 100 is not deformed, such as bent or warped, due to compressive stress or tensile stress, and ensure stable electrical connection between the circuit board 100 and the light emitting element 210, thereby ensuring the overall display effect of the COB display panel 10.
With continued reference to fig. 1 and 2, lattice structure 300 includes lattice walls 320, lattice walls 320 defining mesh openings 310; the height of the mesh wall 320 is greater than the height of the light emitting element 210 in the thickness direction of the COB display panel 10.
Wherein grid structure 300 includes grid walls 320, wherein a plurality of grid 310 may be defined by adjacent grid walls 320, and wherein grid structure 300 includes a plurality of grid walls 320. In fig. 1 and 2, the mesh structure 300 defines a mesh 310 by four adjacent mesh walls 320, and in other embodiments, a mesh 310 may also be defined by three adjacent mesh walls 320, which is not specifically limited by the embodiment of the present invention.
Illustratively, referring to fig. 2, the height of the grid wall 320 is L1, while the height of the light emitting element 210 is L2, and L1 is greater than L2, i.e. the height of the grid wall 320 is greater than the height of the light emitting element 210. By increasing the height of the mesh wall 320, that is, increasing the mass of the mesh structure 300, the bonding strength between the mesh structure 300 and the circuit board 100 can be more stably ensured on the basis of dispersing the stress by dividing the circuit board 100 into a plurality of unit cells through the mesh 310. That is, the circuit board 100 may further ensure that the circuit board 100 is not deformed, such as bent or warped, due to compressive stress or tensile stress, so as to achieve stable electrical connection between the circuit board 100 and the light emitting element 210, and further ensure the overall display effect of the COB display panel 10.
Fig. 4 is a schematic structural view of another COB display panel according to an embodiment of the present invention, and fig. 5 is a schematic structural view of a cross-section of fig. 1 along a direction B-B', and referring to fig. 4 and 5, the COB display panel 10 further includes an encapsulation structure 500; the encapsulation structure 500 is located at a side of the grid structure 300 away from the circuit board 100, and the encapsulation structure 500 fills the mesh 310.
Specifically, the COB display panel 10 further includes an encapsulation structure 500, and the encapsulation structure 500 is used to implement the condition that the COB display panel 10 is sealed and not exposed. The material of the package structure 500 may be epoxy resin, and after being cured, the package structure may preferably include the COB display panel 10.
Further, packaging structure 500 still is used for filling mesh 310, and packaging structure 500 after the solidification can be better guarantees mesh 310's shape, produces inconsistent stress when can producing deformation to circuit board 100 after mesh 310 is inside to be filled simultaneously, and then effectively avoids producing deformation under the circuit board 100 temperature abnormal conditions, guarantees that circuit board 100 and light emitting component 210's stable electricity is connected, and then guarantees the holistic display effect of COB display panel 10.
With continued reference to fig. 1 and 2, the mesh structure 300 comprises a metal mesh structure or a plastic mesh structure.
Specifically, the mesh structure 300 may include a metal mesh structure, and the metal mesh structure has an effect of shielding electromagnetic radiation, so as to prevent an external signal from interfering with the light emitting element 210. Furthermore, the metal grid structure has a conductive function, and can lead out generated static electricity to avoid electrostatic damage to devices in the COB display panel 10. Further, the mesh structure 300 may include a plastic mesh structure or a mesh structure 300 made of other materials, which is not specifically limited by the embodiment of the present invention.
With continued reference to fig. 1 and 2, the light emitting element group 200 includes a blue light emitting element, a red light emitting element, and a green light emitting element; alternatively, the light emitting element group 200 includes light emitting elements of the same color.
The light emitting element group 200 includes light emitting elements 210, the light emitting elements 210 may be blue light emitting elements, red light emitting elements and green light emitting elements, and one blue light emitting element, one red light emitting element and one green light emitting element may form one pixel unit, which facilitates color display of the display panel. The light emitting element group 200 may include one pixel unit or a plurality of pixel units, which is not specifically limited in the embodiment of the present invention. Further, in combination with actual requirements, the light emitting element group 200 may include light emitting elements 210 of the same color, for example, the requirement for blue is large, and the light emitting elements 210 included in the light emitting element group 200 may all be blue light emitting elements, which is not specifically limited in the embodiment of the present invention.
Based on the same inventive concept, an embodiment of the present invention further provides a display device, fig. 6 is a schematic structural diagram of the display device provided in the embodiment of the present invention, and as shown in fig. 6, the display device 1 includes the COB display panel 10 described in any of the embodiments above, so that the display device 1 provided in the embodiment of the present invention has the corresponding beneficial effects in the embodiments above, and details are not repeated here.
Based on the same inventive concept, an embodiment of the present invention further provides a method for manufacturing a COB display panel, and fig. 7 is a schematic flow diagram of the method for manufacturing the COB display panel according to the embodiment of the present invention, as shown in fig. 7, the method for manufacturing the COB display panel according to the embodiment of the present invention includes:
and S110, providing a circuit board.
Exemplarily, the COB display panel means directly encapsulate light emitting component on the circuit board to can guarantee that light emitting component seals and does not expose, compare in traditional light emitting component packaging technology, COB display panel's closure is stronger, and the product reliability is higher when the manufacturing process is still less.
The Circuit Board is a Printed Circuit Board (PCB), which is also called a Printed Circuit Board, and is an important electronic component, and a support of the electronic component is also a carrier for electrical and gas interconnection of the electronic component.
And S120, preparing a light-emitting element group on one side of the circuit board, wherein the light-emitting element group comprises at least one light-emitting element, and the light-emitting element is electrically connected with the circuit board.
The light-emitting element is a solid semiconductor LED (light-emitting diode) optical chip, and the light-emitting element in the light-emitting element group is electrically connected with the circuit board, namely, the light-emitting element and the circuit board can be electrically connected in a welding or heat treatment mode, so that the normal display luminescence of the light-emitting element is ensured.
S130, providing a grid structure, and bonding the grid structure and the circuit board, wherein the grid structure comprises a plurality of meshes, and at least one group of light-emitting element groups are arranged in the meshes.
Wherein, COB display panel still includes grid structure to grid structure includes a plurality of meshs, bonds the setting based on grid structure and circuit board, and grid structure sets up a plurality of meshs and can cut apart into a plurality of unit check with the circuit board, can disperse whole circuit board production great internal stress under different temperature conditions, avoids producing deformation such as warpage because of stress. And set up a set of light emitting component group at least in the mesh, when guaranteeing that the circuit board does not produce too big deformation promptly, can also guarantee the stable electricity of circuit board and light emitting component and connect, guarantee COB display panel holistic display effect.
In summary, according to the manufacturing method of the COB display panel provided by the embodiment of the invention, the grid structure is bonded with the circuit board, and the plurality of meshes are arranged on the grid structure, so that stress generated by the circuit board under different conditions of the COB display panel can be relieved, deformation of the circuit board is avoided, further, the stability of electric connection between the light-emitting element and the circuit board is ensured, and the overall display effect of the COB display panel is improved.
Fig. 8 is a schematic flow chart illustrating a manufacturing method of another COB display panel according to an embodiment of the present invention, and as shown in fig. 8, the manufacturing method further includes:
and S210, providing a circuit board.
S220, preparing a light-emitting element group on one side of the circuit board, wherein the light-emitting element group comprises at least one light-emitting element, and the light-emitting element is electrically connected with the circuit board.
And S230, coating adhesive glue on one side of the grid structure.
And S240, bonding the grid structure and the circuit board through the bonding glue in a mode that the bonding glue faces one side of the circuit board.
Illustratively, the grid structure and the circuit board are bonded with each other through bonding glue, so that a stable connection state between the grid structure and the circuit board is ensured, and the stress generated by the circuit board under different conditions of the COB display panel can be effectively relieved. Furthermore, when the thermal expansion coefficients of the grid structure, the circuit board and the bonding glue are the same or similar, the circuit board can be better ensured not to be deformed by compressive stress or tensile stress, such as bending or warping, and the stable electric connection between the circuit board and the light-emitting element is ensured, so that the integral display effect of the COB display panel is ensured.
And S250, coating packaging glue on one side of the grid structure, which is far away from the circuit board, covering the grid structure with the packaging glue, and filling meshes.
Illustratively, the COB display panel is sealed and not exposed through the packaging structure. The packaging structure can be made of epoxy resin, and the packaging structure can better comprise a COB display panel after being cured.
And packaging structure still is used for filling the mesh, and packaging structure after the solidification can be better the shape of assurance mesh, can produce inconsistent stress when producing deformation to the circuit board after mesh inside filling simultaneously, and then effectively avoids producing deformation under the circuit board temperature abnormal conditions, guarantees circuit board and light emitting component's stable electric connection.
And S260, curing the bonding glue and the packaging glue in a vacuum environment, and curing the packaging structure to form the packaging structure.
Furthermore, glue water and encapsulation are solidified under the vacuum environment, and the phenomenon that bubbles exist in the glue water and the encapsulation glue in the air to influence the overall flatness of the COB display panel is avoided. Illustratively, the COB display panel coated with the glue and the encapsulating glue is placed in a vacuum environment and stands still for 24 hours to cure the glue and the encapsulating glue, and the standing time period is not particularly limited in the embodiments of the present invention.
In conclusion, by refining the preparation method of the COB display panel, the stability of the electric connection between the light-emitting element and the circuit board is better ensured, and the overall display effect of the COB display panel is improved.
It is to be noted that the foregoing description is only exemplary of the invention and that the principles of the technology may be employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious modifications, rearrangements, combinations and substitutions without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (10)
1. A COB display panel, comprising:
a circuit board;
the light-emitting element group and the grid structure are positioned on one side of the circuit board; the light emitting element group comprises at least one light emitting element which is electrically connected with the circuit board; the grid structure is bonded with the circuit board;
the grid structure comprises a plurality of meshes, and at least one group of the light emitting element groups is arranged in each mesh.
2. The COB display panel of claim 1, wherein the grid structure and the circuit board are adhesively disposed by a bonding glue;
the thermal expansion coefficient of the circuit board is a;
the thermal expansion coefficient of the connecting glue is b;
the thermal expansion coefficient of the grid structure is c;
wherein, | b-a |/a is less than or equal to 5 percent, and | b-c |/c is less than or equal to 5 percent.
3. The COB display panel of claim 2, wherein a = b = c.
4. The COB display panel of claim 1, wherein the grid structure includes grid walls that define the mesh;
along the thickness direction of the COB display panel, the height of the grid wall is larger than that of the light-emitting element.
5. The COB display panel of claim 1, further comprising an encapsulation structure;
the packaging structure is located on one side, away from the circuit board, of the grid structure, and the packaging structure fills the meshes.
6. The COB display panel of claim 1, wherein the grid structure includes a metal grid structure or a plastic grid structure.
7. The COB display panel of claim 1, wherein the light-emitting element group includes a blue light-emitting element, a red light-emitting element, and a green light-emitting element;
alternatively, the light emitting element groups include light emitting elements of the same color.
8. A display device, characterized by comprising the COB display panel according to any one of claims 1 to 7.
9. A manufacturing method of a COB display panel, for manufacturing the COB display panel according to any one of claims 1 to 7, the manufacturing method comprising:
providing a circuit board;
preparing a light-emitting element group on one side of the circuit board, wherein the light-emitting element group comprises at least one light-emitting element, and the light-emitting element is electrically connected with the circuit board;
and providing a grid structure, and bonding the grid structure and the circuit board, wherein the grid structure comprises a plurality of meshes, and at least one group of light-emitting element group is arranged in each mesh.
10. A manufacturing method of a COB display panel, wherein bonding the grid structure and the circuit board, comprises:
coating adhesive glue on one side of the grid structure;
bonding the grid structure and the circuit board through the bonding glue in a manner that the bonding glue faces one side of the circuit board;
the preparation method further comprises the following steps:
coating packaging glue on one side of the grid structure, which is far away from the circuit board, wherein the packaging glue covers the grid structure and fills the meshes;
and curing the bonding glue and the packaging glue in a vacuum environment, and curing the packaging structure to form a packaging structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210520341.6A CN115241167A (en) | 2022-05-12 | 2022-05-12 | COB display panel, display device and preparation method of display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210520341.6A CN115241167A (en) | 2022-05-12 | 2022-05-12 | COB display panel, display device and preparation method of display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115241167A true CN115241167A (en) | 2022-10-25 |
Family
ID=83667829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210520341.6A Pending CN115241167A (en) | 2022-05-12 | 2022-05-12 | COB display panel, display device and preparation method of display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115241167A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117558859A (en) * | 2023-12-29 | 2024-02-13 | 诺视科技(苏州)有限公司 | Anti-crosstalk micro-display luminous pixel, manufacturing method thereof and micro-display screen |
-
2022
- 2022-05-12 CN CN202210520341.6A patent/CN115241167A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117558859A (en) * | 2023-12-29 | 2024-02-13 | 诺视科技(苏州)有限公司 | Anti-crosstalk micro-display luminous pixel, manufacturing method thereof and micro-display screen |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8563338B2 (en) | Light emitting diode package having an LED chip mounted on a phosphor substrate | |
| US10431567B2 (en) | White ceramic LED package | |
| EP1900040B1 (en) | Light emitting diode and method of fabricating the same | |
| EP2479810B1 (en) | Light-emitting device package and method of manufacturing the same | |
| CN210245539U (en) | Molded surface mount device LED display module | |
| CN102456820B (en) | For the substrate of installing light emitting element, luminescent device and manufacture method thereof | |
| US20100084683A1 (en) | Light emitting diode package and fabricating method thereof | |
| CN101060157A (en) | Light emitting diode package and fabrication method thereof | |
| EP3591697A1 (en) | Qfn surface-mounted rgb-led packaging module and manufacturing method therefor | |
| JP2014078686A (en) | Light emitting device and manufacturing method of the same | |
| US8216864B2 (en) | LED device and packaging method thereof | |
| US9685592B2 (en) | Miniature surface mount device with large pin pads | |
| CN115241167A (en) | COB display panel, display device and preparation method of display device | |
| KR101310107B1 (en) | Encapsulant For UVLED Device, UVLED Device Using The Same And Manufacturing Method thereof | |
| CN113054059A (en) | Display device, LED package and manufacturing method thereof | |
| JP5936885B2 (en) | Semiconductor light emitting device | |
| KR101329194B1 (en) | Optical module and manufacturing method thereof | |
| CN111682018A (en) | LED display module, display screen unit board, display screen and preparation method | |
| CN111640850A (en) | LED display device, preparation method thereof and display equipment | |
| CN217640570U (en) | COB display panel and display device | |
| JP2003077318A (en) | Led lamp | |
| CN212570994U (en) | LED display module and have its display screen cell board and display screen | |
| JP2013187269A (en) | Optical semiconductor device and manufacturing method of the same | |
| JP2013135077A (en) | Substrate for semiconductor package, semiconductor package, and method of manufacturing substrate for semiconductor package and semiconductor package | |
| CN214411240U (en) | LED packaging structure, LED module and LED display screen |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |