CN110379324A - A kind of LED luminous display unit and preparation method thereof - Google Patents
A kind of LED luminous display unit and preparation method thereof Download PDFInfo
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- CN110379324A CN110379324A CN201910664706.0A CN201910664706A CN110379324A CN 110379324 A CN110379324 A CN 110379324A CN 201910664706 A CN201910664706 A CN 201910664706A CN 110379324 A CN110379324 A CN 110379324A
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- 238000002360 preparation method Methods 0.000 title description 2
- 239000000758 substrate Substances 0.000 claims abstract description 158
- 229910052751 metal Inorganic materials 0.000 claims abstract description 77
- 239000002184 metal Substances 0.000 claims abstract description 77
- 235000012431 wafers Nutrition 0.000 claims abstract description 74
- 239000003292 glue Substances 0.000 claims abstract description 40
- 238000004519 manufacturing process Methods 0.000 claims abstract description 27
- 230000005540 biological transmission Effects 0.000 claims abstract description 17
- 238000001746 injection moulding Methods 0.000 claims abstract description 11
- 238000004806 packaging method and process Methods 0.000 claims description 20
- 238000007789 sealing Methods 0.000 claims description 15
- 238000003466 welding Methods 0.000 claims description 12
- 239000003822 epoxy resin Substances 0.000 description 22
- 229920000647 polyepoxide Polymers 0.000 description 22
- 239000000843 powder Substances 0.000 description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 13
- 239000000741 silica gel Substances 0.000 description 13
- 229910002027 silica gel Inorganic materials 0.000 description 13
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 241000218202 Coptis Species 0.000 description 8
- 235000002991 Coptis groenlandica Nutrition 0.000 description 8
- 229910000831 Steel Inorganic materials 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 239000004568 cement Substances 0.000 description 8
- 230000005404 monopole Effects 0.000 description 8
- 239000000565 sealant Substances 0.000 description 8
- 239000010959 steel Substances 0.000 description 8
- 239000000084 colloidal system Substances 0.000 description 7
- 239000000203 mixture Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000013066 combination product Substances 0.000 description 1
- 229940127555 combination product Drugs 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a kind of LED luminous display unit, shell and PCB substrate；Wherein PCB substrate is mounted on housings, and multiple metal electrodes and multiple LED wafers are provided in PCB substrate, is connected between LED wafer and PCB substrate by conductive metal wire, is provided with transmission region in shell, translucency glue is filled in transmission region upper space.The invention also discloses a kind of production methods of LED luminous display unit, comprising: multiple metal electrodes are fixedly connected in PCB substrate, form pin；Multiple LED wafers are fixed in PCB substrate, LED wafer is connect with PCB substrate by conductive metal wire, and light source is formed in PCB substrate；Shell is made by injection molding manner, and transmission region upper space inside the shell fills translucency glue；By PCB substrate and cage connection.The present invention by forming hollow cavity structure between shell and PCB substrate, can effectively reduce finished product as internal each mass expanded coefficient is different and caused by deformation.
Description
Technical field
The present invention relates to LED display screen technical field more particularly to a kind of LED luminous display unit and its production sides
Method.
Background technique
LED charactrons are as new type light source, with small in size, the service life is long, high reliablity, is easy to modulate and integrate excellent
Point, is widely used in every field.
The traditional production method of LED plug-in unit charactron is progress die bond bonding wire after accomplishing fluently metal electrode in PCB substrate,
Epoxy resin is inserted in shell, with making epoxy cure form to obtain into high-temperature baking after PCB substrate and housing combination
Product.
Conventionally produced product, due to filling epoxy resin in entire shell, during baking molding, by
It is different in the coefficient of expansion of each material, cause finished product different degrees of deformation occur.Further, since equal ring type filling in entire shell
Oxygen resin, is easy to produce bubble, to generate potential quality problems, and due to dog-eat-dog in industry, each manufacturer's expectation is pushed away
There is the product of price competitiveness out, therefore also higher and higher to the control of production cost requirement, but uses more epoxy resin
It will definitely increase Material Cost.
Summary of the invention
The present invention at least solves one of above-mentioned technical problem.For this purpose, it is an object of the present invention to provide a kind of LED to shine
Display device, effectively reduce finished product as internal each mass expanded coefficient is different and caused by deformation.
For this purpose, can reduce life a second object of the present invention is to provide a kind of production method of LED luminous display unit
Cost is produced, the generation of undesirable condition in production process is reduced.
The technical scheme adopted by the invention is that:
In a first aspect, the present invention provides a kind of LED luminous display unit, comprising: shell and PCB substrate；The wherein PCB
Substrate is mounted on the housings, and multiple metal electrodes and multiple LED wafers are provided in the PCB substrate, and the LED is brilliant
It is connected between piece and the PCB substrate by conductive metal wire, is provided with transmission region in the shell, translucency glue is filled in
In the transmission region upper space.
Further, the LED wafer and the conductive metal wire cover translucency packaging body.
Further, the metal electrode is fixedly connected with the PCB substrate, described to be fixedly connected including riveting, welding.
Further, there is position limiting structure corresponding with the PCB substrate on the shell.
Further, the position limiting structure includes stud bolt structure, buckle structure.
Further, the stud bolt structure includes the riveting column on shell, and inserting in PCB substrate corresponding with riveting column
Hole；The buckle structure includes corresponding grab in grab and the PCB substrate on the shell.
Further, the PCB substrate back side is attached with one layer of sealing structure.
Second aspect, the present invention provide a kind of LED luminous display unit production method, comprising:
Multiple metal electrodes are fixedly connected in PCB substrate by S1, form pin；
Multiple LED wafers are fixed in the PCB substrate by S2, and the LED wafer and the PCB substrate pass through conduction
Metal wire connection, forms light source in the PCB substrate；
S3 makes shell by injection molding manner, and the transmission region upper space in the shell fills translucency glue；
S4, by the PCB substrate and the cage connection；
Wherein, step S1, the sequence of S2 and S3 can be exchanged arbitrarily.
It further, upon step s 2 further include that the LED wafer and the conductive metal wire are coated with translucency envelope
Fill body.
Further, the metal electrode is fixedly connected with the PCB substrate, described to be fixedly connected including riveting, welding.
Further, there is position limiting structure corresponding with the PCB substrate on the shell.
It further, after step s4 further include that the PCB substrate back side is attached with one layer of sealing structure.
The beneficial effects of the present invention are:
The present invention is riveted by PCB and metal electrode, subsequent painting sealing material strike-through caused by overcoming because of associativity deficiency
Bad phenomenon is generated, PCB and the closer combination of metal electrode are realized.In addition, the present invention also passes through transmission region inside the shell
Interior filling translucency colloid, such as epoxy resin form hollow cavity structure, can effectively reduce finished product between shell and PCB substrate
It is deformed caused by as internal each mass expanded coefficient difference, and reduces the dosage of epoxy resin, reduced and be produced into
This.The present invention also by applying one layer of sealing material at the PCB substrate back side, shrink by the stress impact that can reduce glue.
Detailed description of the invention
Fig. 1 is the structure chart of one shown device of the embodiment of the present invention；
Fig. 2 is the sectional view of one shown device of the embodiment of the present invention；
Fig. 3 is the structure chart of two shown device of the embodiment of the present invention；
Fig. 4 is the sectional view of two shown device of the embodiment of the present invention；
Fig. 5 is the structure chart of three shown device of the embodiment of the present invention；
Fig. 6 is the sectional view of three shown device of the embodiment of the present invention；
Fig. 7 is the structure chart of four shown device of the embodiment of the present invention；
Fig. 8 is the sectional view of four shown device of the embodiment of the present invention；
Fig. 9 is the flow chart of production method shown in the embodiment of the present invention five；
Figure 10 is the flow chart of production method shown in the embodiment of the present invention six；
Figure 11 is the flow chart of production method shown in the embodiment of the present invention seven；
Figure 12 is the flow chart of production method shown in the embodiment of the present invention eight
Description of symbols
10: shell；
20:PCB substrate；
30: metal electrode；
40:LED chip；
50: luminous zone；
60: hollow cavity structure；
70: translucency packaging body
80: conductive metal wire；
90: sealing structure；
100: crystal-bonding adhesive.
Specific embodiment
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually combination.
Embodiment one
The structure chart for present embodiments providing a kind of LED luminous display unit, referring to Fig. 1, which includes: shell
10, PCB substrate 20, PCB substrate 20 are mounted on 10 the inside of shell, and shell 10 is riveted with PCB substrate 20 by riveting column, PCB substrate
Several metal electrodes 30 and LED wafer 40 are provided on 20, LED wafer 40 may include monopole chip and bipolar chip, and LED is brilliant
It is connected between piece 40 and PCB substrate 20 by conductive metal wire, metal electrode 30 and PCB substrate 20 rivet.It is arranged on shell 10
There is luminous zone 50 corresponding with LED wafer 40, as shows that byte area inner upper space fills translucency glue, such as epoxy resin
Deng formation hollow cavity structure between shell 10 and PCB substrate 20.
The present embodiment additionally provides a kind of sectional view of LED luminous display unit, referring to fig. 2, the LED luminous display unit
Structure include: shell 10, PCB substrate 20, PCB substrate 20 is mounted on 10 the inside of shell, and shell 10 and PCB substrate 20 pass through riveting
Column rivets, several metal electrodes 30 and LED wafer 40 is provided in PCB substrate 20, between LED wafer 40 and PCB substrate 20
It is connected by conductive metal wire 80, conductive metal wire 80 can be gold thread or aluminum steel etc., and LED wafer 40 is fixed by crystal-bonding adhesive 100
On the pcb substrate 20, crystal-bonding adhesive 100 can be conducting resinl or insulating cement, and it can be elargol that monopole chip, which uses conducting resinl die bond,；It is double
Pole chip uses insulating cement die bond.Metal electrode 30 and PCB substrate 20 rivet.It is provided on shell 10 corresponding with LED wafer 40
Luminous zone 50, as show byte area, display byte area inner upper space fill translucency glue.Shell 10 and PCB
Hollow cavity structure 60 is formed between substrate 20.It is as aobvious due to the only luminous zone 50 corresponding with LED wafer 40 on shell 10
Show that byte area inner upper space fills translucency glue, reduces the dosage of translucency glue, saved production cost.
Embodiment two
The present embodiment additionally provides a kind of structure chart of LED luminous display unit, and referring to Fig. 3, which includes: outer
Shell 10, PCB substrate 20, PCB substrate 20 are mounted on 10 the inside of shell, and shell 10 is riveted with PCB substrate 20 by riveting column, PCB base
Several metal electrodes 30 and LED wafer 40 are provided on plate 20, LED wafer 40 may include monopole chip and bipolar chip, LED
It is connected between chip 40 and PCB substrate 20 by conductive metal wire, LED wafer 40 and conductive metal wire surface cladding translucency envelope
Body is filled, wherein translucency packaging body is the glue of silica gel or epoxy resin or epoxy resin and fluorescent powder or silica gel and fluorescent powder composition
Body.Metal electrode 30 and PCB substrate 20 rivet.It is provided with luminous zone 50 corresponding with LED wafer 40 on shell 10, as shows
Byte area inner upper space fills translucency glue, such as epoxy resin, forms hollow cavity between shell 10 and PCB substrate 20
Structure.
The present embodiment additionally provides a kind of sectional view of LED luminous display unit, referring to fig. 4, the LED luminous display unit
Structure include: shell 10, PCB substrate 20, PCB substrate 20 is mounted on 10 the inside of shell, and shell 10 and PCB substrate 20 pass through riveting
Column rivets, several metal electrodes 30 and LED wafer 40 is provided in PCB substrate 20, between LED wafer 40 and PCB substrate 20
It is connected by conductive metal wire 80, conductive metal wire 80 can be gold thread or aluminum steel etc., and LED wafer 40 is fixed by crystal-bonding adhesive 100
On the pcb substrate 20, crystal-bonding adhesive 100 can be conducting resinl or insulating cement, and it can be elargol that monopole chip, which uses conducting resinl die bond,；It is double
Pole chip uses insulating cement die bond.LED wafer 40 and 80 surface of conductive metal wire coat translucency packaging body 70, wherein translucency
Packaging body 70 is the colloid of silica gel or epoxy resin or epoxy resin and fluorescent powder or silica gel and fluorescent powder composition.Metal electrode 30
It is riveted with PCB substrate 20.It is provided with luminous zone 50 corresponding with LED wafer 40 on shell 10, as shows byte area, aobvious
Show that byte area inner upper space fills translucency glue.Hollow cavity structure 60 is formed between shell 10 and PCB substrate 20.Due to
The only luminous zone 50 corresponding with LED wafer 40 on shell 10 as shows that byte area inner upper space fills translucency glue,
The dosage for reducing translucency glue, has saved production cost.
The difference of embodiment two and embodiment one is to encapsulate pcb board surface texture using translucency in embodiment two
The characteristics of body is packaged, and embodiment one is not used translucency packaging body for pcb board surface texture and is packaged, embodiment one
It is that production cost can be effectively reduced, simplifies production technology；The characteristics of embodiment two, is that pcb board surface can be tied
Structure plays better protective effect.
Embodiment three
Based on the improvement to embodiment one, a kind of structure chart of LED luminous display unit is present embodiments provided, referring to figure
5, which includes: shell 10, PCB substrate 20, and PCB substrate 20 is mounted on 10 the inside of shell, shell 10 and PCB substrate 20
It is riveted by riveting column, several metal electrodes 30 and LED wafer 40 is provided in PCB substrate 20, LED wafer 40 may include monopole
Chip and bipolar chip are connected between LED wafer 40 and PCB substrate 20 by conductive metal wire, metal electrode 30 and PCB substrate
20 rivetings.It is provided with luminous zone 50 corresponding with LED wafer 40 on shell 10, as shows that byte area inner upper space is filled
Translucency glue, such as epoxy resin form hollow cavity structure between shell 10 and PCB substrate 20.The attachment of 20 back side of PCB substrate
One layer of sealing structure, sealing structure can be sealant.
The present embodiment additionally provides a kind of sectional view of LED luminous display unit, referring to Fig. 6, structure include: shell 10,
PCB substrate 20, PCB substrate 20 are mounted on 10 the inside of shell, and shell 10 is riveted with PCB substrate 20 by riveting column, in PCB substrate 20
It is provided with several metal electrodes 30 and LED wafer 40, is connected between LED wafer 40 and PCB substrate 20 by conductive metal wire 80
It connects, conductive metal wire can be gold thread or aluminum steel etc., and LED wafer 40 is fixed on the pcb substrate 20 by crystal-bonding adhesive 100, crystal-bonding adhesive
100 can be conducting resinl or insulating cement etc., and it can be elargol that monopole chip, which uses conducting resinl die bond,；Bipolar chip is solid using insulating cement
It is brilliant.Metal electrode 30 and PCB substrate 20 rivet.It is provided with luminous zone 50 corresponding with LED wafer 40 on shell 10, as shows
Byte area fills translucency glue in display byte area inner upper space.Hollow cavity is formed between shell 10 and PCB substrate 20
Body structure 60.Due to the only luminous zone 50 corresponding with LED wafer 40 on shell 10, byte area inner upper space is as shown
Translucency glue is filled, reduces the dosage of translucency glue, has saved production cost.Adhere to one layer of sealing at 20 back side of PCB substrate
Structure 90, sealing structure can be sealant, and the stress impact that can be reduced glue is shunk.
Example IV
Based on the improvement to embodiment two, a kind of structure chart of LED luminous display unit is present embodiments provided, referring to figure
7, which includes: shell 10, PCB substrate 20, and PCB substrate 20 is mounted on 10 the inside of shell, shell 10 and PCB substrate 20
It is riveted by riveting column, several metal electrodes 30 and LED wafer 40 is provided in PCB substrate 20, LED wafer 40 may include monopole
Chip and bipolar chip are connected between LED wafer 40 and PCB substrate 20 by conductive metal wire, LED wafer 40 and conductive metal
Line surface coats translucency packaging body, and wherein translucency packaging body is silica gel or epoxy resin or epoxy resin and fluorescent powder or silicon
The colloid of glue and fluorescent powder composition.Metal electrode 30 and PCB substrate 20 rivet.It is provided on shell 10 corresponding with LED wafer 40
Luminous zone 50, as show that byte area inner upper space fills translucency glue, such as epoxy resin, shell 10 and PCB base
Hollow cavity structure is formed between plate 20.One layer of sealing structure is adhered at 20 back side of PCB substrate, and sealing structure can be sealant.
The present embodiment additionally provides a kind of sectional view of LED luminous display unit, referring to Fig. 8, structure include: shell 10,
PCB substrate 20, PCB substrate 20 are mounted on 10 the inside of shell, and shell 10 is riveted with PCB substrate 20 by riveting column, in PCB substrate 20
It is provided with several metal electrodes 30 and LED wafer 40, is connected between LED wafer 40 and PCB substrate 20 by conductive metal wire 80
It connects, conductive metal wire can be gold thread or aluminum steel etc., and LED wafer 40 is fixed on the pcb substrate 20 by crystal-bonding adhesive 100, crystal-bonding adhesive
100 can be conducting resinl or insulating cement etc., and it can be elargol that monopole chip, which uses conducting resinl die bond,；Bipolar chip is solid using insulating cement
Crystalline substance, LED wafer 40 and 80 surface of conductive metal wire coat translucency packaging body 70, and wherein translucency packaging body is silica gel or epoxy
The colloid of resin or epoxy resin and fluorescent powder or silica gel and fluorescent powder composition.Metal electrode 30 and PCB substrate 20 rivet.Shell
It is provided with luminous zone 50 corresponding with LED wafer 40 on 10, as shows byte area, in display byte area inner upper space
Fill translucency glue.Hollow cavity structure 60 is formed between shell 10 and PCB substrate 20.Due to only on shell 10 with LED crystalline substance
The corresponding luminous zone 50 of piece 40 as shows that byte area inner upper space fills translucency glue, reduces the use of translucency glue
Amount, has saved production cost.Adhere to one layer of sealing structure 90 at 20 back side of PCB substrate, sealing structure can be sealant, can be reduced
The stress impact of glue is shunk.
The difference of example IV and embodiment three is to encapsulate pcb board surface texture using translucency in example IV
The characteristics of body is packaged, and embodiment three is not used translucency packaging body for pcb board surface texture and is packaged, embodiment three
It is that production cost can be effectively reduced, simplifies production technology；The characteristics of example IV, is that pcb board surface can be tied
Structure plays better protective effect.
Embodiment five
The production method for present embodiments providing a kind of LED luminous display unit, referring to Fig. 9, comprising:
Multiple metal electrodes are fixedly connected in PCB substrate by S1, form pin；
LED wafer is fixed in PCB substrate by S2, and light source is formed in PCB substrate；
S3 makes shell by injection molding manner, and transmission region upper space inside the shell fills translucency glue；
S4, by PCB substrate and cage connection；
Wherein, step S1, the sequence of S2 and S3 can be exchanged arbitrarily.
Specifically,
S1 is provided with several jacks in PCB substrate, and metal electrode is fixed on PCB substrate pair by modes such as welding
In the jack answered, power pins are formed；
LED wafer is fixed on the corresponding electrode of PCB substrate, LED wafer and PCB substrate by S2 by modes such as welding
It is connected by conductive metal wire, conductive metal wire can be gold thread, aluminum steel etc., and light source is formed in PCB substrate；
S3 makes digital pipe shell by injection molding manner, transmission region is provided on shell, in the top of translucent area
Translucency colloidal materials, such as resin glue are filled in space, there are hollow cavity structures between shell and PCB substrate.
S4, by similar stud bolt structure, the structures such as buckle structure are designed PCB substrate and cage connection.
Embodiment six
The production method for present embodiments providing a kind of LED luminous display unit, referring to Figure 10, comprising:
Multiple metal electrodes are fixedly connected in PCB substrate by S1, form pin；
LED wafer is fixed in PCB substrate by S2, passes through translucency packaging body coats LED wafer and conductive metal wire
Form forms light source in PCB substrate；
S3 makes shell by injection molding manner, and transmission region upper space inside the shell fills translucency glue；
S4, by PCB substrate and cage connection；
Wherein, step S1, the sequence of S2 and S3 can be exchanged arbitrarily.
Specifically,
S1 is provided with several jacks in PCB substrate, and metal electrode is fixed on PCB base by the modes such as welding, riveting
In the corresponding jack of plate, power pins are formed；
LED wafer is fixed on the corresponding electrode of PCB substrate, LED wafer and PCB substrate by S2 by modes such as welding
It is connected by conductive metal wire, conductive metal wire can be gold thread, aluminum steel etc., pass through translucency packaging body coats LED wafer, conduction
The form of metal wire, translucency packaging body can be silica gel or epoxy resin or epoxy resin and fluorescent powder or silica gel and fluorescent powder group
At colloid, light source is formed in PCB substrate；
S3 makes digital pipe shell by injection molding manner, transmission region is provided on shell, in the top of translucent area
Translucency colloidal materials, such as resin glue are filled in space, there are hollow cavity structures between shell and PCB substrate.
S4, by similar stud bolt structure, the structures such as buckle structure are designed PCB substrate and cage connection.
Embodiment seven
Based on the improvement to embodiment five, the production method for present embodiments providing a kind of LED luminous display unit, referring to
Figure 11, comprising:
Multiple metal electrodes are riveted in PCB substrate by S1, form power pins；
LED wafer is fixed in PCB substrate by S2, and light source is formed in PCB substrate；
S3 makes shell with the mode of injection molding, has display byte area corresponding with LED wafer on shell, in shell
Show that upper space fills one layer of translucency glue in byte area, forms hollow cavity structure, on shell top between shell and PCB
Face forms a luminous zone corresponding with LED wafer；
S4 makes PCB substrate and cage connection by the riveting column in PCB substrate；
S5 applies one layer of sealant at the PCB substrate back side.
Wherein, step S1, the sequence of S2 and S3 can be exchanged arbitrarily.
Specifically,
S1 is provided with several jacks in PCB substrate, and metal electrode is fixed on PCB base by the modes such as welding, riveting
In the corresponding jack of plate, power pins are formed；
LED wafer is fixed on the corresponding electrode of PCB substrate, LED wafer and PCB substrate by S2 by modes such as welding
It is connected by conductive metal wire, conductive metal wire can be gold thread or aluminum steel etc., and light emitting source is formed in PCB substrate；
S3 makes digital pipe shell by modes such as injection moldings, is provided on shell and position is arranged with LED wafer in PCB substrate
Corresponding display byte area is set, translucency colloidal materials, such as resin glue are filled in the upper space of display byte area,
There are hollow cavity structures between shell and PCB substrate, corresponding with light emitting source in cover top portion formation one by the transmission of light
Transmission diffusion region.It is caused in addition, the formation of hollow cavity structure can effectively avoid because internal each mass expanded coefficient is different
Deformation, and reduce the dosage of translucency glue.
S4, by similar stud bolt structure, the structures such as buckle structure are designed PCB substrate and cage connection.
S5 coats one layer of sealing structure, such as sealant at the PCB substrate back side, prevents the stress impact of glue from shrinking.
Embodiment eight
Based on the improvement to embodiment six, the production method for present embodiments providing a kind of LED luminous display unit, referring to
Figure 12, comprising:
Multiple metal electrodes are riveted in PCB substrate by S1, form power pins；
LED wafer is fixed in PCB substrate by S2, passes through translucency packaging body coats LED wafer and conductive metal wire
Form, wherein translucency packaging body is the glue of silica gel or epoxy resin or epoxy resin and fluorescent powder or silica gel and fluorescent powder composition
Body forms light source in PCB substrate；
S3 makes shell with the mode of injection molding, has display byte area corresponding with LED wafer on shell, in shell
Show that upper space fills one layer of translucency glue in byte area, forms hollow cavity structure, on shell top between shell and PCB
Face forms a luminous zone corresponding with LED wafer；
S4 makes PCB substrate and cage connection by the riveting column in PCB substrate；
S5 applies one layer of sealant at the PCB substrate back side.
Wherein, step S1, the sequence of S2 and S3 can be exchanged arbitrarily.
Specifically,
S1 is provided with several jacks in PCB substrate, and metal electrode is fixed on PCB base by the modes such as welding, riveting
In the corresponding jack of plate, power pins are formed；
LED wafer is fixed on the corresponding electrode of PCB substrate, LED wafer and PCB substrate by S2 by modes such as welding
It is connected by conductive metal wire, conductive metal wire can be gold thread or aluminum steel etc., by translucency packaging body coats LED wafer, lead
The form of electric metal line, translucency packaging body can be silica gel or epoxy resin or epoxy resin and fluorescent powder or silica gel and fluorescent powder
The colloid of composition, forms light emitting source in PCB substrate；
S3 makes digital pipe shell by modes such as injection moldings, is provided on shell and position is arranged with LED wafer in PCB substrate
Corresponding display byte area is set, translucency colloid, such as resin glue, shell are filled in the upper space of display byte area
There are hollow cavity structures between PCB substrate, corresponding with light emitting source in cover top portion formation one by the transmission of light
Penetrate diffusion region.In addition, the formation of hollow cavity structure can effectively avoid change caused by due to internal each mass expanded coefficient is different
Shape, and reduce the dosage of translucency glue.
S4, by similar stud bolt structure, the structures such as buckle structure are designed PCB substrate and cage connection.
S5 coats one layer of sealing structure, such as sealant at the PCB substrate back side, prevents the stress impact of glue from shrinking.
It is to be illustrated to preferable implementation of the invention, but the invention is not limited to the implementation above
Example, those skilled in the art can also make various equivalent variations on the premise of without prejudice to spirit of the invention or replace
It changes, these equivalent deformations or replacement are all included in the scope defined by the claims of the present application.
Claims (10)
1. a kind of LED luminous display unit characterized by comprising
Shell and PCB substrate；Wherein the PCB substrate is mounted on the housings,
Multiple metal electrodes and multiple LED wafers are provided in the PCB substrate, between the LED wafer and the PCB substrate
It is connected by conductive metal wire, transmission region is provided in the shell, it is empty that translucency glue is filled in the transmission region top
In.
2. LED luminous display unit according to claim 1, which is characterized in that the LED wafer and the conductive metal
Line covers translucency packaging body.
3. LED luminous display unit according to claim 1, which is characterized in that the metal electrode and the PCB substrate
It is fixedly connected, it is described to be fixedly connected including riveting, welding.
4. LED luminous display unit according to claim 1 or 2, which is characterized in that have on the shell and the PCB
The corresponding position limiting structure of substrate, the position limiting structure include stud bolt structure, buckle structure.
5. LED luminous display unit according to claim 1 or 2, which is characterized in that the PCB substrate back side is attached with
One layer of sealing structure.
6. a kind of production method of LED luminous display unit, comprising:
Multiple metal electrodes are fixedly connected in PCB substrate by S1, form pin；
Multiple LED wafers are fixed in the PCB substrate by S2, and the LED wafer and the PCB substrate pass through conductive metal
Line connection, forms light source in the PCB substrate；
S3 makes shell by injection molding manner, and the transmission region upper space in the shell fills translucency glue；
S4, by the PCB substrate and the cage connection；
Wherein, step S1, the sequence of S2 and S3 can be exchanged arbitrarily.
7. LED luminous display unit according to claim 6, which is characterized in that further include upon step s 2, it is described
LED wafer and the conductive metal wire are coated with translucency packaging body.
8. the production method of LED luminous display unit according to claim 6 or 7, which is characterized in that the metal electrode
It is fixedly connected with the PCB substrate, it is described to be fixedly connected including riveting, welding.
9. the production method of LED luminous display unit according to claim 6 or 7, which is characterized in that have on the shell
Position limiting structure corresponding with the PCB substrate.
10. the production method of LED luminous display unit according to claim 6 or 7, which is characterized in that step S4 it
After further include that the PCB substrate back side is attached with one layer of sealing structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| CN114783313A (en) * | 2022-05-11 | 2022-07-22 | 建德市五星车业有限公司 | Novel LED instrument display structure |
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