CN115084340A - Lamp panel and packaging method thereof - Google Patents
Lamp panel and packaging method thereof Download PDFInfo
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- CN115084340A CN115084340A CN202210836291.2A CN202210836291A CN115084340A CN 115084340 A CN115084340 A CN 115084340A CN 202210836291 A CN202210836291 A CN 202210836291A CN 115084340 A CN115084340 A CN 115084340A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 94
- 238000000034 method Methods 0.000 title claims abstract description 13
- 239000012790 adhesive layer Substances 0.000 claims abstract description 121
- 239000000758 substrate Substances 0.000 claims abstract description 116
- 239000010410 layer Substances 0.000 claims abstract description 55
- 239000002245 particle Substances 0.000 claims description 28
- 239000000853 adhesive Substances 0.000 claims description 21
- 230000001070 adhesive effect Effects 0.000 claims description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 16
- 239000008393 encapsulating agent Substances 0.000 claims description 16
- 239000000843 powder Substances 0.000 claims description 14
- 229910000679 solder Inorganic materials 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- 239000000377 silicon dioxide Substances 0.000 claims description 7
- 229920002050 silicone resin Polymers 0.000 claims description 5
- 230000007423 decrease Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000005538 encapsulation Methods 0.000 description 33
- 239000003292 glue Substances 0.000 description 12
- 230000006872 improvement Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 230000002411 adverse Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention is suitable for the technical field of LED packaging, and provides a lamp panel which comprises a substrate, a circuit layer, an LED chip, a first packaging adhesive layer and a second packaging adhesive layer, wherein the circuit layer is arranged on one side of the substrate and is provided with a bonding pad; the LED chip is connected to the bonding pad; the first packaging adhesive layer is arranged on one side of the substrate and covers the LED chip and the circuit layer, and the first packaging adhesive layer allows light emitted by the LED chip to penetrate through; the second packaging adhesive layer is arranged on the other side of the substrate and used for partially or completely offsetting the stress of the first packaging adhesive layer on the substrate. The invention also provides a lamp panel packaging method. The lamp panel and the packaging method thereof provided by the invention can effectively improve the poor layering, deformation and air tightness caused by the warping of the substrate after the lamp panel is packaged, avoid the bad risks such as the peeling of the LED chip and the like, and have low production cost.
Description
Technical Field
The invention belongs to the technical field of LED (light emitting diode) packaging, and particularly relates to a lamp panel and a packaging method thereof.
Background
In recent years, the Mini LED backlight display module and the direct display product are widely popularized in the market and become the futureThe main flow scheme of the display market is that a flip chip process structure adopted by a lamp panel of a Mini LED backlight display module is suitable for the requirement of ultra-small space dense distribution and is suitable for packaging substrates made of various materials, the substrate for packaging the Mini LED backlight display module is generally made of a PCB (printed Circuit Board) substrate or a glass substrate, a packaging adhesive layer on the surface of the Mini LED backlight display module is generally selected from a silicon resin material or an epoxy resin material, and the thermal expansion coefficient of the PCB substrate or the glass substrate is (1-15) multiplied by 10 -6 a/DEG C, and a coefficient of thermal expansion of the silicone resin or the epoxy resin is 50 to 220 x 10 -6 Around/° c, the substrate and the encapsulation adhesive layer have large thermal expansion mismatch, so that the substrate is warped, and risks of delamination, deformation, poor air tightness, chip peeling and the like exist. The substrate and the packaging adhesive are separated due to asynchronous deformation caused by cooling or heating (such as during a cold and heat shock experiment) due to large difference of thermal expansion coefficients (the packaging adhesive is far larger than the substrate), and the deformation is reduced by reducing the difference of the thermal expansion coefficients of the substrate and the adjacent packaging adhesive in the prior art, but the stress existing in the substrate is not eliminated, so that the substrate is easy to deform; the difficulty in reducing the difference of the thermal expansion coefficients of the substrate and the adjacent packaging adhesive is high, and the production cost is high.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, and provides the lamp panel and the packaging method thereof, so that the problems of layering, deformation, poor air tightness and the like caused by warping of the substrate after the lamp panel is packaged are effectively solved, the substrate is not easy to deform, the adverse risks of peeling off and the like of an LED chip are avoided, and the production cost is low.
The technical scheme of the invention is as follows: a lamp panel comprises a substrate, a circuit layer, an LED chip, a first packaging adhesive layer and a second packaging adhesive layer, wherein the circuit layer is arranged on one side of the substrate and is provided with a bonding pad; the LED chip is connected to the bonding pad; the first packaging adhesive layer is arranged on one side of the substrate and covers the LED chip and the circuit layer, and the first packaging adhesive layer allows light emitted by the LED chip to penetrate through; the second packaging adhesive layer is arranged on the other side of the substrate and used for partially or completely offsetting the stress of the first packaging adhesive layer on the substrate.
As a further improvement of the technical solution, the thickness of the first encapsulation adhesive layer is greater than the thickness of the second encapsulation adhesive layer, the first encapsulation adhesive layer has a first thermal expansion coefficient, and the second encapsulation adhesive layer has a second thermal expansion coefficient greater than the first thermal expansion coefficient.
As a further improvement of the technical solution, the first encapsulating adhesive layer and the second encapsulating adhesive layer are made of the same material and are both epoxy resin or silicone resin.
As a further improvement of the technical solution, the first encapsulating adhesive layer is dispersedly provided with inorganic light-transmitting particles for adjusting the thermal expansion coefficient thereof.
As a further improvement of the present technical solution, the inorganic light-transmitting particles are settled in the first encapsulating adhesive layer, so that the content of the inorganic light-transmitting particles is gradually reduced along a direction away from the substrate.
As a further improvement of the present technical solution, the particle size of the inorganic light-transmitting particles ranges from 50 nanometers to 5 micrometers.
As a further improvement of the technical solution, the inorganic light-transmitting particles are at least one of silica powder or alumina powder.
As a further improvement of the technical solution, the thickness range of the first encapsulation glue layer is 150 micrometers to 400 micrometers; and/or the thickness of the second packaging adhesive layer ranges from 20 micrometers to 200 micrometers.
As a further improvement of this technical scheme, the lamp plate is still including setting up the circuit layer with solder mask between the first encapsulation glue film, solder mask is provided with a plurality of structures of windowing, every it is a pair at least to have in the region that the structure of windowing corresponds the pad, the LED chip set up in the structure of windowing and connect in corresponding in the structure of windowing the pad, first encapsulation glue film passes through the structure of windowing with base plate direct contact.
The invention also provides a lamp panel packaging method, which comprises the following steps:
preparing a substrate;
providing a circuit layer having a pad on the substrate;
connecting an LED chip to the bonding pad;
arranging a first packaging adhesive layer formed by first packaging adhesive and used for covering the LED chip and the circuit layer on one side of the substrate, wherein the first packaging adhesive layer allows light emitted by the LED chip to penetrate through;
and a second packaging adhesive layer formed by second packaging adhesive is arranged on the other side of the substrate and used for partially or completely offsetting the stress of the first packaging adhesive layer on the substrate.
According to the lamp panel and the packaging method thereof, the first packaging adhesive layer is arranged on one side of the substrate and covers the LED chip and the circuit layer, the first packaging adhesive layer allows light emitted by the LED chip to penetrate through, the second packaging adhesive layer is arranged on the other side of the substrate and is used for partially or completely offsetting stress generated by the first packaging adhesive layer on the substrate, warping and deformation of the substrate caused by the stress are effectively reduced, the problems of poor layering, deformation, air tightness and the like after the lamp panel is packaged are effectively solved, adverse risks such as peeling of the LED chip are avoided, and the production cost is low.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a substrate in a lamp panel according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a lamp panel provided with a circuit layer on a substrate according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a lamp panel according to an embodiment of the present invention, where an LED chip is connected to a pad;
fig. 4 is a schematic structural diagram of a lamp panel provided in an embodiment of the present invention, in which a first encapsulation adhesive layer is disposed on one side of a substrate;
fig. 5 is a schematic structural diagram of a lamp panel provided in an embodiment of the present invention, in which a second encapsulation adhesive layer is disposed on the other side of a substrate;
fig. 6 is a schematic view illustrating inorganic light-transmitting particles in a lamp panel settling in a first encapsulating adhesive layer according to an embodiment of the present invention.
Reference numbers in the figures:
the LED packaging structure comprises a substrate, 1-an LED chip, 2-a solder paste layer, 3-a circuit layer, 4-a substrate, 5-inorganic light-transmitting particles, 6-a first packaging adhesive layer, 7-a second packaging adhesive layer and 8-a solder mask.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It should be noted that the terms "disposed" and "connected" should be interpreted broadly, and may be, for example, directly disposed or connected, or indirectly disposed or connected through intervening elements or intervening structures.
In addition, in the embodiments of the present invention, if there are terms of orientation or positional relationship indicated by "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., it is only for convenience of describing the present invention and simplifying the description, but not for indicating or implying that the structure, feature, device or element referred to must have a specific orientation or positional relationship, nor must be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
The various features and embodiments described in the embodiments may be combined in any suitable manner, for example, different embodiments may be formed by combining different features/embodiments, and in order to avoid unnecessary repetition, various possible combinations of features/embodiments in the present invention will not be described in detail.
As shown in fig. 5, the lamp panel provided in the embodiment of the present invention may be used for a Mini LED backlight display module and a direct display product, and includes a substrate 4 (as shown in fig. 1), a circuit layer 3 and an LED chip 1, where the circuit layer 3 is disposed on one side of the substrate 4, and the circuit layer 3 has a pad; the LED chip 1 is connected to the bonding pad, in this embodiment, the LED chip 1 is a flip chip, specifically, a flip blue LED chip or a flip RGB LED chip, and the substrate 4 may be an FR4 circuit substrate or a glass substrate; the lamp panel further comprises a first packaging adhesive layer 6 and a second packaging adhesive layer 7, the first packaging adhesive layer 6 is arranged on one side of the substrate 4 and covers the LED chip 1 and the circuit layer 3, and the first packaging adhesive layer 6 allows light emitted by the LED chip 1 to penetrate through; the second encapsulation adhesive layer 7 is disposed on the other side of the substrate 4 and is used for partially or completely offsetting the stress of the first encapsulation adhesive layer 6 on the substrate 4, and it should be noted that, if only the first encapsulation adhesive is used to form the first encapsulation adhesive layer 6 through dispensing or mold pressing, the first encapsulation adhesive layer 6 has stress acting on the substrate 4, so that the substrate 4 is easily deformed, which is usually expressed as two ends of the substrate 4 being warped and having a concave middle, so that the LED chip 1 is easily peeled off; in this embodiment, the first encapsulant layer 6 and the second encapsulant layer 7 are separately disposed on two sides of the substrate 4, and form a "sandwich" structure with the substrate 4 through the first encapsulant layer 6 and the second encapsulant layer 7, wherein the first encapsulant layer 6 has a tensile stress acting on the substrate 4 and facing one side of the substrate 4, and the second encapsulant layer 7 has a tensile stress acting on the substrate 4 and facing the other side of the substrate 4, so that the tensile stresses acting on two sides of the substrate 4 are largely offset, thereby effectively reducing warpage deformation in the substrate 4 (especially the substrate 4) caused by the stress applied by the encapsulant layers, effectively improving the problems of delamination, deformation, and poor air tightness after the lamp panel is packaged, and avoiding undesirable risks such as peeling off of the LED chip 1, and the first encapsulant layer 6 and the second encapsulant layer 7 form a "sandwich" structure with the substrate 4 without using multiple encapsulant layers, the manufacturing process is simple and the cost is low.
In a specific application, the first encapsulation adhesive layer 6 is in the projection area of the substrate 4 can cover the substrate 4, that is, the first encapsulation adhesive layer 6 can completely cover the surface of one side of the substrate 4, or the first encapsulation adhesive layer 6 can be composed of non-connected first segment adhesive layers, the first encapsulation adhesive layer is formed on one side of the substrate 4 (specifically, one side of the circuit layer 3 and the top of the LED chip 1) through adhesive dispensing and forms a plurality of non-connected first segment adhesive layers, in another embodiment, the second encapsulation adhesive layer 7 can also be composed of non-connected second segment adhesive layers, the second encapsulation adhesive layer is formed on the other side of the substrate 4 through adhesive dispensing and forms a plurality of non-connected second segment adhesive layers, so that the stress between the substrates 4 at two sides of the segment adhesive layers is offset, and the substrate 4 is prevented from deforming. As an alternative embodiment, the first encapsulant layer 6 may completely cover one side of the substrate 4, and the second encapsulant layer 7 partially covers the other side of the substrate 4, so that a space is reserved on the back side of the substrate 4 for mounting other components.
In a specific application, the thickness of the first encapsulating adhesive layer 6 is not less than the thickness of the second encapsulating adhesive layer 7. Specifically, the first encapsulation glue film 6 that is located 4 one sides of base plate can play the effect of protection LED chip 1, needs certain thickness, and the second encapsulation glue film 7 that is located 4 opposite sides of base plate is additional thickness, can increase the whole thickness of product, is not conform to the market trend requirement of the whole attenuation of LED module, through control the thickness of first encapsulation glue film 6 is not less than the thickness of second encapsulation glue film 7 is favorable to the whole attenuation of lamp plate, device miniaturization, satisfies the market needs.
In a specific application, the thickness of the first encapsulating adhesive layer 6 is greater than the thickness of the second encapsulating adhesive layer 7, the first encapsulating adhesive layer 6 has a first thermal expansion coefficient, the second encapsulating adhesive layer 7 has a second thermal expansion coefficient, and the second thermal expansion coefficient is greater than the first thermal expansion coefficient. The product of the thickness of the first packaging adhesive layer 6 and the first thermal expansion coefficient is A, the product of the thickness of the second packaging adhesive layer 7 and the second thermal expansion coefficient is B, and A is equal to or approximately equal to B. It should be explained that the thickness of the first encapsulation adhesive layer 6 is larger and the first thermal expansion coefficient is smaller, and the thickness of the second encapsulation adhesive layer 7 is smaller and the first thermal expansion coefficient is larger, so that the stress acting on the two sides of the substrate 4 can be balanced and offset, meanwhile, the first encapsulation adhesive layer 6 can have a certain thickness to play a role in protecting the LED chip, and the thickness of the second encapsulation adhesive layer 7 can be relatively smaller, which is beneficial to thinning the lamp panel; in another embodiment, the thickness of the first encapsulating adhesive layer 6 is equal to the thickness of the second encapsulating adhesive layer 7, the first encapsulating adhesive layer 6 has a first thermal expansion coefficient, the second encapsulating adhesive layer 7 has a second thermal expansion coefficient, and the second thermal expansion coefficient is the same as the first thermal expansion coefficient. In the concrete application, the most main parameters of the stress acting on the substrate 4 by the packaging adhesive layer are the thickness and the thermal expansion coefficient of the packaging adhesive layer, and in the concrete application, the packaging adhesive materials with different thermal expansion coefficients can be correspondingly selected according to the thickness of the packaging adhesive layer, so that the regulation and the control are flexible, the stress acting on the two sides of the substrate 4 can be offset, and the whole product tends to be thinned.
Furthermore, the first packaging adhesive layer 6 and the second packaging adhesive layer 7 are made of the same material and are both epoxy resin or silicon resin, so that cost reduction is facilitated. In another embodiment, the materials of the first encapsulating glue layer 6 and the second encapsulating glue layer 7 may also be different. The first packaging adhesive layer 6 is dispersedly provided with the inorganic light-transmitting particles 5 for adjusting the thermal expansion coefficient of the first packaging adhesive layer, the thermal expansion coefficient of the packaging adhesive layer can be adjusted by adding the inorganic light-transmitting particles into the packaging adhesive, and the first packaging adhesive layer is convenient to adjust and low in cost. The inorganic light-transmitting particles 5 are deposited in the first encapsulating adhesive layer 6, so that the content of the inorganic light-transmitting particles 5 is gradually reduced along the direction away from the substrate 4, that is, the added inorganic light-transmitting particles 5 are naturally deposited in the first encapsulating adhesive, and the thermal expansion coefficient of the area closer to the substrate 4 is smaller, so that the deformation of the substrate 4 can be effectively reduced. The particle size of the inorganic light-transmitting particles 5 ranges from 50 nanometers to 5 micrometers. The inorganic light-transmitting particles 5 can transmit light, so that the light emission of the LED chip is ensured. In this embodiment, the inorganic light-transmitting particles 5 are silica powder or alumina powder, or silica powder and alumina powder are mixed, and the inorganic light-transmitting particles 5 are added into the first encapsulating adhesive layer 6. In this embodiment, it is preferable that the particle size of the inorganic light-transmitting particles 5 is in a range from 100 nm to 1 μm, silica is a main component of glass, alumina is a main component of sapphire, silica powder and alumina powder are both light-transmitting particles, and the doping ratio of silica powder or alumina powder in the first encapsulant layer 6 is 0 to 100%, preferably 20% to 60%; by controlling the standing time before the first packaging adhesive is cured, the silicon dioxide powder or the aluminum oxide powder naturally settles in the first packaging adhesive and presents a step distribution, the content of the silicon dioxide powder or the aluminum oxide powder is increased in the area closer to the substrate 4, namely the thermal expansion coefficient of the area closer to the substrate 4 is smaller, and the deformation of the substrate 4 is further reduced. In addition, the projection area of the packaging adhesive layer positioned on the other side of the substrate 4 on the substrate 4 can be flexibly adjusted, and the packaging adhesive layer does not necessarily cover the other side of the substrate 4 completely based on cost factors; the light-transmitting particles do not influence the light emission of the LED chip 1, the thermal expansion coefficient is adjusted, the adjusting effect is good, and the cost is low.
As an alternative embodiment, the thickness of the first encapsulating glue layer 6 ranges from 150 micrometers to 400 micrometers; the thickness of the second packaging adhesive layer 7 ranges from 20 micrometers to 200 micrometers. In a specific application, the thickness of the first encapsulating adhesive layer 6 is not less than that of the second encapsulating adhesive layer 7, and the thickness of the first encapsulating adhesive layer 6 is preferably in a range from 250 micrometers to 300 micrometers. The first encapsulating adhesive layer 6 may be made of epoxy resin or silicone resin, and the second encapsulating adhesive layer 7 may also be made of any one of epoxy resin or silicone resin.
Further, as shown in fig. 4 and 5, the lamp plate is still including setting up circuit layer 3 with solder mask 8 between the first encapsulation glue film 6, solder mask 8 is provided with a plurality of structures of windowing, every it is at least a pair of to have in the region that the structure of windowing corresponds the pad, LED chip 1 set up in the structure of windowing and connect in corresponding in the structure of windowing the pad, first encapsulation glue film 6 passes through the structure of windowing with base plate direct contact. Specifically, the first packaging adhesive layer 6 comprises an outer adhesive layer located on the outer peripheral side of the LED chip 1 and a bottom adhesive layer located on the window structure, the bottom adhesive layer is formed by filling the first packaging adhesive into the window structure and is directly connected with the substrate 4, so that the die bonding is facilitated, the light efficiency is improved, the backlight brightness is improved, the process yield is improved, and the manufacturing cost is low.
The embodiment of the invention also provides a lamp panel packaging method, which is used for packaging the lamp panel and comprises the following steps:
as shown in fig. 1, a substrate 4 is prepared, and an FR4 circuit substrate or a glass substrate may be used.
As shown in fig. 2, the circuit layer 3 having pads is disposed on the substrate 4, in a specific application, a solder resist layer 8 is disposed above the circuit layer 3, and the solder resist layer 8 is disposed in other areas of the circuit layer except for the pads to have an insulating and oxidation-preventing function, and the solder resist layer 8 is generally made of ink, white ink is used for backlight products, and black ink is used for direct display products.
As shown in fig. 3, the LED chip 1 is connected to the pad; in specific application, the solder pad can be provided with the solder paste layer 2, so that the soldering is easy.
As shown in fig. 4, a first packaging adhesive layer 6 formed by a first packaging adhesive and used for covering the LED chip 1 and the circuit layer 3 is disposed on one side of the substrate 4; specifically, the first encapsulation adhesive is disposed on one side of the substrate 4 by dispensing or molding for curing and forming, so as to form the first encapsulation adhesive layer 6.
As shown in fig. 5, a second packaging adhesive layer 7 formed by a second packaging adhesive is arranged on the other side of the substrate 4; specifically, the second packaging adhesive is arranged on the other side of the substrate 4 in a dispensing or mould pressing mode for curing and forming to form a second packaging adhesive layer 7, and a sandwich structure is formed by the first packaging adhesive layer 6, the second packaging adhesive layer 7 and the substrate 4, so that the tensile stress acting on the two sides of the substrate 4 can be counteracted to a greater extent, the warping deformation of the substrate 4 (especially the substrate 4) caused by the stress applied by the packaging adhesive layer is effectively reduced, the problems of layering, deformation, poor air tightness and the like after the lamp panel is packaged are effectively improved, and the adverse risks of peeling off and the like of the LED chip 1 are avoided.
According to the lamp panel and the packaging method thereof provided by the embodiment of the invention, the first packaging adhesive layer 6 is arranged on one side of the substrate 4 and covers the LED chip 1 and the circuit layer 3, the second packaging adhesive layer 7 is arranged on the other side of the substrate 4, and a sandwich structure is formed by the first packaging adhesive layer 6 and the second packaging adhesive layer 7 and the substrate 4, so that the stress acting on two sides of the substrate 4 can be counteracted to a greater extent, the problems of warping and deformation of the substrate 4 caused by the stress and the like are effectively reduced, the problems of poor layering, deformation and air tightness after the lamp panel is packaged are effectively improved, the adverse risks of peeling off of the LED chip 1 and the like are avoided, and the production cost is low.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents or improvements made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (10)
1. The utility model provides a lamp plate, its characterized in that includes:
a substrate;
the circuit layer is arranged on one side of the substrate and is provided with a bonding pad;
the LED chip is connected to the bonding pad;
the lamp plate still includes:
the first packaging adhesive layer is arranged on one side of the substrate and covers the LED chip and the circuit layer, and the first packaging adhesive layer allows light emitted by the LED chip to penetrate through;
and the second packaging adhesive layer is arranged on the other side of the substrate and used for partially or completely offsetting the stress generated by the first packaging adhesive layer on the substrate.
2. The lamp panel of claim 1, wherein the thickness of the first adhesive layer is greater than the thickness of the second adhesive layer, the first adhesive layer having a first coefficient of thermal expansion, the second adhesive layer having a second coefficient of thermal expansion greater than the first coefficient of thermal expansion.
3. The lamp panel of claim 1 or 2, wherein the first and second adhesive layers are made of the same material and are epoxy resin or silicone resin.
4. The lamp panel of claim 2, wherein the first encapsulant layer is dispersed with inorganic light-transmissive particles for adjusting a thermal expansion coefficient thereof.
5. The lamp panel of claim 4, wherein the inorganic light-transmitting particles are deposited in the first encapsulant layer such that the content of the inorganic light-transmitting particles decreases in a direction away from the substrate.
6. The lamp panel of claim 4, wherein the inorganic light-transmitting particles have a particle size in a range of 50 nm to 5 μm.
7. The lamp panel of claim 4, wherein the inorganic light-transmitting particles are at least one of silica powder or alumina powder.
8. The lamp panel of claim 1, wherein the first encapsulant layer has a thickness in a range of 150 to 400 microns; and/or the thickness of the second packaging adhesive layer ranges from 20 micrometers to 200 micrometers.
9. The lamp panel of claim 1, wherein the lamp panel further includes a solder mask layer disposed between the circuit layer and the first package adhesive layer, the solder mask layer is provided with a plurality of windowing structures, each windowing structure has at least one pair of the pads in a corresponding region, the LED chip is disposed in the windowing structure and connected to the corresponding pad in the windowing structure, and the first package adhesive layer directly contacts the substrate through the windowing structure.
10. A method for encapsulating a lamp panel is characterized by comprising the following steps:
preparing a substrate;
providing a circuit layer having a pad on the substrate;
connecting an LED chip to the bonding pad;
arranging a first packaging adhesive layer formed by first packaging adhesive and used for covering the LED chip and the circuit layer on one side of the substrate, wherein the first packaging adhesive layer allows light emitted by the LED chip to penetrate through;
and a second packaging adhesive layer formed by second packaging adhesive is arranged on the other side of the substrate and used for partially or completely offsetting the stress of the first packaging adhesive layer on the substrate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210836291.2A CN115084340A (en) | 2022-07-15 | 2022-07-15 | Lamp panel and packaging method thereof |
| PCT/CN2023/102012 WO2023246932A1 (en) | 2022-06-24 | 2023-06-24 | Led lamp panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210836291.2A CN115084340A (en) | 2022-07-15 | 2022-07-15 | Lamp panel and packaging method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115084340A true CN115084340A (en) | 2022-09-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210836291.2A Pending CN115084340A (en) | 2022-06-24 | 2022-07-15 | Lamp panel and packaging method thereof |
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| Country | Link |
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| CN (1) | CN115084340A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116360159A (en) * | 2023-06-02 | 2023-06-30 | 惠科股份有限公司 | Light-emitting module and display device |
| WO2023246932A1 (en) * | 2022-06-24 | 2023-12-28 | 惠州市聚飞光电有限公司 | Led lamp panel |
-
2022
- 2022-07-15 CN CN202210836291.2A patent/CN115084340A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023246932A1 (en) * | 2022-06-24 | 2023-12-28 | 惠州市聚飞光电有限公司 | Led lamp panel |
| CN116360159A (en) * | 2023-06-02 | 2023-06-30 | 惠科股份有限公司 | Light-emitting module and display device |
| CN116360159B (en) * | 2023-06-02 | 2023-09-05 | 惠科股份有限公司 | Light-emitting module and display device |
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