CN205406561U - Ultraviolet LED device packaging hardware - Google Patents
Ultraviolet LED device packaging hardware Download PDFInfo
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- CN205406561U CN205406561U CN201620074800.2U CN201620074800U CN205406561U CN 205406561 U CN205406561 U CN 205406561U CN 201620074800 U CN201620074800 U CN 201620074800U CN 205406561 U CN205406561 U CN 205406561U
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- ceramics bracket
- lens
- led device
- aln
- device packaging
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
The utility model discloses an ultraviolet LED device packaging hardware, ceramic support sets up the support into concave structures, " L " shape platform of symmetry is seted up to two protruding tip inboards of concave structures support, the quartz lens block sets up on " L " shape platform, quartz lens and ceramic support encapsulate in taking out the glove box of nearly vacuum state, alN subbase board is put the flip -chip of ultraviolet wafer at ceramic support's bottom central point, positive negative pole above the alN subbase board passes through the gold thread with the positive negative pole on the ceramic substrate and is connected. Form inclosed chip guard space after lens and the ceramic support sealing -in, reduced gaseous absorption to dark purple outer light, improved the luminous power of device, completely cut off steam and oxygen to the corruption of dark purple outer chip, lengthened the life -span of device, adopt the factor of high heat conductance alN subbase board and embedding high heat conductance material for the produced thermal conduction of packaging body chip during operation, improved the working life of device, increased the letter patience of ultraviolet device.
Description
Technical field
This utility model relates to technical field of semiconductor illumination, is specifically related to a kind of uv-LED device packaging system and packaging technology thereof.Especially the encapsulating structure of deep ultraviolet LED, material and packaged type.
Background technology
The every field such as ultraviolet LED may be used for industry photocuring, and the bacterium that disappears is killed virus, false proof, medical treatment, beauty treatment, are widely used, and market is huge, particularly with deep ultraviolet, it is possible in Treatment of Industrial Water, and the bacterium virus killing aspect that disappears plays good effect.
Owing to the wavelength of ultraviolet LED is shorter, the especially LED of deep ultraviolet, energy is very strong, causes that material property deterioration is serious, so encapsulation technology and encapsulating material are required harshness.Ultraviolet LED encapsulating products in the market, near ultraviolet main touching based on ultraviolet silica gel pushes up technique, the decay of luminous flux but without reaching more satisfactory state (as shown in Figure 8), plastic stent ultraviolet packaging top view (as shown in Figure 9) such as PPA/PCT/EMC in prior art.Deep ultraviolet be then encapsulated as master with the TOK with glass lens, although last a long time, but compared with SMD type LED lamp bead, shortcoming be that letter patience is poor；Some conventional SMD type occurred on the market or the ultraviolet lamp bead of imitative lumen type, owing to selected material is PPA, the green oil being easily subject to ultraviolet radiation rear surface reflectance reduction is contained on PCT or surface, or the reason of white oil, make the light decay of device for white light LEDs, the long-term light decay poor-performing of device.Or chip surface and gold thread have protection, but are the use of silica gel, thus causing device there is bigger luminous flux attenuation; also some producer is proposed the packaged type of quartz glass; but the purity of quartz glass is inadequate, thus causing producing when deep ultraviolet to turn yellow, thus producing light decay.Therefore, the encapsulation technology of prior art medium ultraviolet LED component how is improved, it is provided that a kind of uv-LED device packaging system and packaging technology thereof, especially the encapsulating structure of deep ultraviolet LED, material and packaged type, have important practical significance.
Utility model content
In order to solve the technical problem existed in prior art, the purpose of this utility model is in that to provide a kind of uv-LED device packaging system and packaging technology, the especially encapsulating structure of deep ultraviolet LED, material and packaged type.
The technical scheme that this utility model is taked is:
A kind of uv-LED device packaging system, including ceramics bracket, quartz lens, binding agent and AlN submounts, described ceramics bracket is set to concave structure support, the protruding tip inside of the two of concave structure support offers " L " shape platform of symmetry, quartz lens engaging is arranged on " L " shape platform, described quartz lens and ceramics bracket encapsulate in the glove box taking out nearly vacuum state, described AlN submounts is by the ultraviolet flip-chip bottom centre position at ceramics bracket, and the both positive and negative polarity above AlN submounts is connected by gold thread with the both positive and negative polarity on ceramic substrate.
Further, described ceramics bracket is AlN or Al2O3Ceramics bracket prepared by material.
Further, the inside bottom center of described ceramics bracket is embedded with highly heat-conductive material.
Further, described ceramics bracket adopts surface to carry out the SMD type formula ceramics bracket of coating, and coating adopts Ag coating or Au coating.
Further, described quartz lens is set to flat quartz glass, hemispherical quartz glass lens or different angles quartz glass lens, described different angles quartz glass lens for can to realize half-angular breadth be 120 degree, 30 degree, the luminous light type of 60 degree or other angle.
Further, " L " shape platform of described quartz lens and ceramics bracket passes through binding agent close adhesion under nearly vacuum or vacuum condition.
Further, " L " shape platform of described quartz lens and ceramics bracket adopts highly purified glass dust under nearly vacuum or vacuum condition, carries out sealing-in by laser welding, soldering or any one mode of welding resistance.
Further, described quartz lens and ceramics bracket inside are filled with by silica gel, or are encapsulated by subatmospheric rarefied air.
Further, described AlN submounts is fixed on ceramic substrate by the mode of slurry or soldering.
A kind of uv-LED device packaging technology, specifically includes following steps:
(1) choose ceramics bracket: choose do not embed highly heat-conductive material by AlN or Al2O3Ceramics bracket prepared by material or the ceramics bracket of common material, ceramics bracket is set to concave structure support, embeds highly heat-conductive material bottom the ceramics bracket of common material；
(2) " L " shape platform is offered: the two of the concave structure support chosen protruding tip inside are offered " L " shape platform of symmetry, and the horizontal width of " L " shape platform is consistent with the diameter of quartz lens, it is simple to quartz lens is encapsulated on " L " shape platform；
(3) upside-down mounting ultraviolet wafer: adopt AlN submounts elder generation upside-down mounting ultraviolet wafer, then uses gold thread to connect the both positive and negative polarity above AlN submounts and the both positive and negative polarity on ceramic substrate；
(4) quartz lens is chosen: choose flat quartz glass, hemispherical quartz glass lens or different angles quartz glass lens, described different angles quartz glass lens are 120 degree for realizing half-angular breadth, 30 degree, the luminous light type of 60 degree or other angle；
(5) encapsulation quartz lens: the quartz lens chosen is encapsulated in the glove box taking out nearly vacuum state with the ceramics bracket matched; or in protective atmosphere, adopt highly purified glass dust, carry out sealing-in by laser welding, soldering or any one mode of welding resistance.
The beneficial effects of the utility model are:
This utility model optimization improves the encapsulation technology of uv-LED device, the quartzy plate glass of special construction or quartz lens, internal not just for quartz glass, and purity is higher, it is not easy to be subject to the phenomenon of ultraviolet light irradiation post yellowing.For ceramic substrate, the ceramic substrate interior surface of longer wavelength adopts silver-plated technique, and for deep ultraviolet, surface substrate then adopts gold-plated mode, and first adopt the ALN substrate that thermal conductivity is high to fix the UV chip of upside-down mounting, using gold thread connexon AlN submounts and the corresponding both positive and negative polarity of ceramic substrate, and carry out sealing-in in the state of rarefied air or near vacuum by the mode of specific glass welding or soldering with the special ceramics support matched, form airtight chip guard space and completely cut off the corrosion to deep ultraviolet chip of steam and oxygen, extend the working life of device.In addition adopt high heat conductance AlN submounts and embed the factor of high heat conductivity metal, the excellent heat dispersion of packaging body and the efficient reflecting layer of surface-stable, while reducing heat accumulation, accelerate the conduction of produced heat during chip operation, improve the working life of device.
Ceramics bracket adopts the SMD type formula ceramics bracket of Gold plated Layer ceramic material, adopts the packaging of SMD type formula ceramics bracket to can ensure that the letter patience of device.Ceramics bracket choose do not embed highly heat-conductive material by AlN or Al2O3nullCeramics bracket prepared by material or embed highly heat-conductive material bottom the ceramics bracket of common material，Ceramics bracket can not contain the die bond region of high heat conduction，And directly adopt pure ceramic material，In the glove box of specific protective gas，The mode adopting laser welding carries out corresponding welding or adopts the mode of soldering to carry out sealing-in，When nearly vacuum or rarefied air，Ceramics bracket after die bond and quartz lens are combined by the mode adopting laser glass welding，Because forming the chip guard space that air-tightness is good after lens and ceramics bracket sealing-in，It it is the state of nearly vacuum in confined space，Nearly vacuum or few rarefied air avoid the corrosion to deep ultraviolet chip of oxygen and steam，Extend the life-span of device，And owing to inside adopts the packaged type of nearly vacuum or rarefied air，Decrease the air absorption for deep ultraviolet UV light；Add the luminous power of device；Heat dispersion that ceramics bracket is excellent and thermal coefficient of expansion, accelerate the conduction of produced heat during chip operation, add the reliability of device, improve the working life of device.
Accompanying drawing explanation
Fig. 1 is the encapsulation overall structure schematic diagram of this utility model middle plateform quartz glass；
Fig. 2 is the encapsulation overall structure schematic diagram of hemispherical quartz glass lens in this utility model；
Fig. 3 is the encapsulation overall structure schematic diagram of different angles quartz glass lens in this utility model；
Fig. 4 is the overall structure schematic diagram of ceramics bracket in utility model；
Fig. 5 is the structural representation of the flat quartz glass in this utility model；
Fig. 6 is the structural representation of the hemispherical quartz glass lens in this utility model；
Fig. 7 is the structural representation of the different angles quartz glass lens in this utility model；
Fig. 8 is that in prior art, top ultraviolet product lateral plan touched by silica gel；
Fig. 9 is the plastic stent ultraviolet packaging top view such as PPA/PCT/EMC in prior art；
Wherein, 1, ceramics bracket；2, flat quartz glass；3, " L " shape platform；4, binding agent；5, highly heat-conductive material is embedded；6, hemispherical quartz glass lens；7, different angles quartz glass lens；8, AlN submounts.
Detailed description of the invention
This utility model is further illustrated below in conjunction with accompanying drawing.
Embodiment 1
nullAs shown in Figure 1 and Figure 5，A kind of uv-LED device packaging system，Including ceramics bracket 1、Quartz lens、Binding agent 4 and AlN submounts 8，Described ceramics bracket 1 is set to concave structure support，The inside bottom center of described ceramics bracket 1 is embedded with highly heat-conductive material，Described ceramics bracket 1 adopts the SMD type formula ceramics bracket 1 that surface carries out coating，Coating adopts Ag coating，The protruding tip inside of the two of concave structure support offers symmetry " L " shape platform 3 (as shown in Figure 4)，Quartz lens engaging is arranged on " L " on shape platform 3，Described quartz lens adopts highly purified quartz glass lens，It is set to flat quartz glass 2，Described quartz lens and ceramics bracket 1 encapsulate in the glove box taking out nearly vacuum state，Described quartz lens and ceramics bracket 1 " L " shape platform 3 under nearly vacuum or vacuum condition by binding agent 4 close adhesion，Described quartz lens and ceramics bracket 1 inside are encapsulated by subatmospheric rarefied air，Described AlN submounts 8 is the support plate of fixing ultraviolet flip chip，Described AlN submounts 8 is by the ultraviolet flip-chip bottom centre position at ceramics bracket 1，AlN submounts 8 both positive and negative polarity above is connected by gold thread with the both positive and negative polarity on ceramic substrate，Described AlN submounts 8 is fixed on ceramic substrate by the mode of viscous paste.
Embodiment 2
nullAs shown in Figure 2 and Figure 6，A kind of uv-LED device packaging system，Including ceramics bracket 1、Quartz lens、Binding agent 4 and AlN submounts 8，Described ceramics bracket 1 is set to concave structure support，The inside bottom center of described ceramics bracket 1 is embedded with highly heat-conductive material，Described ceramics bracket 1 adopts the SMD type formula ceramics bracket 1 that surface carries out coating，Coating adopts Au coating，The protruding tip inside of the two of concave structure support offers symmetry " L " shape platform 3 (as shown in Figure 4)，Quartz lens engaging is arranged on " L " on shape platform 3，Described quartz lens adopts highly purified quartz glass lens，It is set to hemispherical quartz glass lens 6，Described quartz lens and ceramics bracket 1 " L " shape platform 3 adopts highly purified glass dust under nearly vacuum or vacuum condition，Sealing-in is carried out by the mode of laser welding，Described quartz lens and ceramics bracket 1 inside are encapsulated by subatmospheric rarefied air，Described AlN submounts 8 is the support plate of fixing ultraviolet flip chip，Described AlN submounts 8 is by the ultraviolet flip-chip bottom centre position at ceramics bracket 1，AlN submounts 8 both positive and negative polarity above is connected by gold thread with the both positive and negative polarity on ceramic substrate，Described AlN submounts 8 is fixed on ceramic substrate by the mode of soldering.
Embodiment 3
nullAs shown in Figure 3 and Figure 7，A kind of uv-LED device packaging system，Including ceramics bracket 1、Quartz lens、Binding agent 4 and AlN submounts 8，Described ceramics bracket 1 is set to concave structure support，The inside bottom center of described ceramics bracket 1 is embedded with highly heat-conductive material，Described ceramics bracket 1 adopts the SMD type formula ceramics bracket 1 that surface carries out coating，Coating adopts Ag coating，The protruding tip inside of the two of concave structure support offers symmetry " L " shape platform 3 (as shown in Figure 4)，Quartz lens engaging is arranged on " L " on shape platform 3，Described quartz lens adopts highly purified quartz glass lens，It is set to realize the luminous light type quartz glass lens 7 that half-angular breadth is 30 degree，Described quartz lens and ceramics bracket 1 " L " shape platform 3 adopts highly purified glass dust under nearly vacuum or vacuum condition，Sealing-in is carried out by the mode of soldering，Described quartz lens and ceramics bracket 1 inside are encapsulated by subatmospheric rarefied air，Described AlN submounts 8 is the support plate of fixing ultraviolet flip chip，Described AlN submounts 8 is by the ultraviolet flip-chip bottom centre position at ceramics bracket 1，AlN submounts 8 both positive and negative polarity above is connected by gold thread with the both positive and negative polarity on ceramic substrate，Described AlN submounts 8 is fixed on ceramic substrate by the mode of viscous paste.
Embodiment 4
A kind of uv-LED device packaging system, including ceramics bracket 1, quartz lens, binding agent 4 and AlN submounts 8, described ceramics bracket 1 is set to concave structure support, and described ceramics bracket 1 is Al2O3nullCeramics bracket 1 prepared by material，Described ceramics bracket 1 adopts the SMD type formula chip ceramic support 1 that surface carries out coating，Coating adopts silvering，The protruding tip inside of the two of concave structure support offers symmetry " L " shape platform 3 (as shown in Figure 4)，Quartz lens engaging is arranged on " L " on shape platform 3，Described quartz lens adopts highly purified quartz glass lens，It is set to realize the luminous light type quartz glass lens 7 that half-angular breadth is 60 degree，Described quartz lens and ceramics bracket 1 " L " shape platform 3 adopts highly purified glass dust under nearly vacuum or vacuum condition，Sealing-in is carried out by the mode of welding resistance，Described quartz lens and ceramics bracket 1 inside are filled with by silica gel，Described AlN submounts 8 is the support plate of fixing ultraviolet flip chip，Described AlN submounts 8 is by the ultraviolet flip-chip bottom centre position at ceramics bracket 1，AlN submounts 8 both positive and negative polarity above is connected by gold thread with the both positive and negative polarity on ceramic substrate，Described AlN submounts 8 is fixed on ceramic substrate by the mode of soldering.
A kind of uv-LED device packaging technology, specifically includes following steps:
(1) choose ceramics bracket 1: choose do not embed highly heat-conductive material 5 by AlN or Al2O3Ceramics bracket 1 prepared by material or the ceramics bracket 1 of common material, ceramics bracket 1 is set to concave structure support, highly heat-conductive material 5 is embedded bottom the ceramics bracket 1 of common material, heat dispersion that ceramics bracket 1 is excellent and thermal coefficient of expansion, accelerate the conduction of produced heat during chip operation, add the reliability of device, improve the working life of device, described ceramics bracket 1 adopts the SMD type formula ceramics bracket 1 that surface carries out coating, adds the letter patience of ultraviolet device；
(2) offer " L " shape platform 3: the two of the concave structure support chosen protruding tip inside are offered symmetry " L " shape platform 3; " L " horizontal width of shape platform 3 is consistent with the diameter of quartz lens, it is simple to quartz lens is encapsulated in " L " on shape platform 3；
(3) upside-down mounting ultraviolet wafer: adopt the first upside-down mounting ultraviolet wafer of AlN submounts 8, then gold thread is used to connect AlN submounts 8 both positive and negative polarity above and the both positive and negative polarity on ceramic substrate, high heat conductance AlN submounts 8 and ceramics bracket 1 is adopted to embed the factor of high heat conductivity metal, accelerate the conduction of produced heat during packaging body chip operation, improve the working life of device；
(4) quartz lens is chosen: choose flat quartz glass 2, hemispherical quartz glass lens 6 or different angles quartz glass lens 7, described different angles quartz glass lens 7 are 120 degree for realizing half-angular breadth, 30 degree, the luminous light type of 60 degree or other angle；
(5) encapsulation quartz lens: the quartz lens chosen is encapsulated in the glove box taking out nearly vacuum state with the ceramics bracket 1 matched; or in protective atmosphere, adopt highly purified glass dust; sealing-in is carried out by laser welding, soldering or any one mode of welding resistance; airtight chip guard space is formed after lens and ceramics bracket 1 sealing-in; the internal packaged type adopting nearly vacuum, extends the life-span of device；Particularly with the chip of deep ultraviolet, between quartz glass and ceramics bracket 1, the packaged type of evacuation or rarefied air decreases the gas absorption for deep ultraviolet light, improves the luminous power of device.
The above is not to restriction of the present utility model; it is noted that, for those skilled in the art; under the premise without departing from this utility model essential scope; can also making some changes, remodeling, interpolation or replacement, these improvements and modifications also should be regarded as protection domain of the present utility model.
Claims (9)
1. a uv-LED device packaging system, it is characterized in that, including ceramics bracket, quartz lens, binding agent and AlN submounts, described ceramics bracket is set to concave structure support, the protruding tip inside of the two of concave structure support offers " L " shape platform of symmetry, quartz lens engaging is arranged on " L " shape platform, described quartz lens and ceramics bracket encapsulate in the glove box taking out nearly vacuum state, described AlN submounts is by the ultraviolet flip-chip bottom centre position at ceramics bracket, both positive and negative polarity above AlN submounts is connected by gold thread with the both positive and negative polarity on ceramic substrate.
2. a kind of uv-LED device packaging system according to claim 1, it is characterised in that described ceramics bracket is AlN or Al2O3Ceramics bracket prepared by material.
3. a kind of uv-LED device packaging system according to claim 1, it is characterised in that the inside bottom center of described ceramics bracket is embedded with highly heat-conductive material.
4. a kind of uv-LED device packaging system according to claim 1 or 2 or 3, it is characterised in that described ceramics bracket adopts surface to carry out the SMD type formula ceramics bracket of coating, and coating adopts Ag coating or Au coating.
5. a kind of uv-LED device packaging system according to claim 1, it is characterized in that, described quartz lens is set to flat quartz glass, hemispherical quartz glass lens or to realize half-angular breadth be 120 degree, the luminous light type quartz glass lens of 30 degree or 60 degree angles.
6. a kind of uv-LED device packaging system according to claim 1, it is characterised in that " L " shape platform of described quartz lens and ceramics bracket is under vacuum by binding agent close adhesion.
7. a kind of uv-LED device packaging system according to claim 1, it is characterised in that " L " shape platform of described quartz lens and ceramics bracket carries out sealing-in by laser welding, soldering or any one mode of welding resistance.
8. a kind of uv-LED device packaging system according to claim 1 or 6 or 7, it is characterised in that described quartz lens and ceramics bracket inside are filled with by silica gel, or are encapsulated by subatmospheric rarefied air.
9. a kind of uv-LED device packaging system according to claim 1, it is characterised in that described AlN submounts is fixed on ceramic substrate by the mode of slurry or soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620074800.2U CN205406561U (en) | 2016-01-26 | 2016-01-26 | Ultraviolet LED device packaging hardware |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620074800.2U CN205406561U (en) | 2016-01-26 | 2016-01-26 | Ultraviolet LED device packaging hardware |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106935695A (en) * | 2017-05-17 | 2017-07-07 | 广东工业大学 | A kind of uv-LED device |
| CN107123719A (en) * | 2017-04-27 | 2017-09-01 | 深圳市明空光电科技有限公司 | A kind of SMD ultraviolet LED method for packing |
| CN107180904A (en) * | 2017-05-12 | 2017-09-19 | 广东工业大学 | A kind of ultraviolet LED packaging |
| CN107527978A (en) * | 2017-08-15 | 2017-12-29 | 江苏稳润光电科技有限公司 | A kind of high-power ultraviolet LED Vacuum Package device and its manufacture method |
| CN108257947A (en) * | 2016-12-29 | 2018-07-06 | 晶能光电（江西）有限公司 | A kind of UVLED area sources module |
| CN109103319A (en) * | 2018-08-21 | 2018-12-28 | 华中科技大学鄂州工业技术研究院 | A kind of deep ultraviolet LED encapsulation structure and its packaging method |
| CN109427991A (en) * | 2017-08-25 | 2019-03-05 | Tcl集团股份有限公司 | Packaging film, electronic device and preparation method thereof |
| CN110931365A (en) * | 2019-12-13 | 2020-03-27 | 武汉大学 | Method for realizing inorganic packaging by laser welding |
| CN111162152A (en) * | 2020-01-03 | 2020-05-15 | 广东省半导体产业技术研究院 | COB packaging substrate and structure |
| CN111370374A (en) * | 2020-03-17 | 2020-07-03 | 深圳深旨科技有限公司 | Deep ultraviolet LED packaging structure and welding method thereof |
| CN112289753A (en) * | 2019-07-25 | 2021-01-29 | 松山湖材料实验室 | Method for manufacturing enclosure dam ceramic substrate for ultraviolet LED packaging and product thereof |
| US20210408344A1 (en) * | 2020-06-30 | 2021-12-30 | Schott Ag | Packaged optoelectric module and method for its production |
| CN117293257A (en) * | 2023-11-27 | 2023-12-26 | 徐州稻源龙芯电子科技有限公司 | Ultraviolet LED packaging structure with high light source utilization rate and preparation method |
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2016
- 2016-01-26 CN CN201620074800.2U patent/CN205406561U/en active Active
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108257947A (en) * | 2016-12-29 | 2018-07-06 | 晶能光电（江西）有限公司 | A kind of UVLED area sources module |
| CN107123719A (en) * | 2017-04-27 | 2017-09-01 | 深圳市明空光电科技有限公司 | A kind of SMD ultraviolet LED method for packing |
| CN107180904A (en) * | 2017-05-12 | 2017-09-19 | 广东工业大学 | A kind of ultraviolet LED packaging |
| CN106935695A (en) * | 2017-05-17 | 2017-07-07 | 广东工业大学 | A kind of uv-LED device |
| CN107527978A (en) * | 2017-08-15 | 2017-12-29 | 江苏稳润光电科技有限公司 | A kind of high-power ultraviolet LED Vacuum Package device and its manufacture method |
| CN109427991A (en) * | 2017-08-25 | 2019-03-05 | Tcl集团股份有限公司 | Packaging film, electronic device and preparation method thereof |
| CN109103319A (en) * | 2018-08-21 | 2018-12-28 | 华中科技大学鄂州工业技术研究院 | A kind of deep ultraviolet LED encapsulation structure and its packaging method |
| CN112289753A (en) * | 2019-07-25 | 2021-01-29 | 松山湖材料实验室 | Method for manufacturing enclosure dam ceramic substrate for ultraviolet LED packaging and product thereof |
| CN112289753B (en) * | 2019-07-25 | 2023-12-22 | 松山湖材料实验室 | Manufacturing method of wall dam ceramic substrate for ultraviolet LED packaging and product thereof |
| CN110931365A (en) * | 2019-12-13 | 2020-03-27 | 武汉大学 | Method for realizing inorganic packaging by laser welding |
| CN111162152A (en) * | 2020-01-03 | 2020-05-15 | 广东省半导体产业技术研究院 | COB packaging substrate and structure |
| CN111370374B (en) * | 2020-03-17 | 2021-10-15 | 深圳深旨科技有限公司 | Deep ultraviolet LED packaging structure and welding method thereof |
| CN111370374A (en) * | 2020-03-17 | 2020-07-03 | 深圳深旨科技有限公司 | Deep ultraviolet LED packaging structure and welding method thereof |
| US20210408344A1 (en) * | 2020-06-30 | 2021-12-30 | Schott Ag | Packaged optoelectric module and method for its production |
| CN117293257A (en) * | 2023-11-27 | 2023-12-26 | 徐州稻源龙芯电子科技有限公司 | Ultraviolet LED packaging structure with high light source utilization rate and preparation method |
| CN117293257B (en) * | 2023-11-27 | 2024-02-06 | 徐州稻源龙芯电子科技有限公司 | Ultraviolet LED packaging structure with high light source utilization rate and preparation method |
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