CN108321282A - A kind of ultraviolet LED packaging - Google Patents
A kind of ultraviolet LED packaging Download PDFInfo
- Publication number
- CN108321282A CN108321282A CN201810287695.4A CN201810287695A CN108321282A CN 108321282 A CN108321282 A CN 108321282A CN 201810287695 A CN201810287695 A CN 201810287695A CN 108321282 A CN108321282 A CN 108321282A
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- Prior art keywords
- light transmission
- ultraviolet led
- hollow housing
- transmission hollow
- substrate
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 39
- 230000005540 biological transmission Effects 0.000 claims abstract description 70
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 239000000463 material Substances 0.000 claims description 23
- 238000000576 coating method Methods 0.000 claims description 19
- 239000011248 coating agent Substances 0.000 claims description 18
- 239000004411 aluminium Substances 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 14
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 10
- 239000010931 gold Substances 0.000 claims description 10
- 229910052737 gold Inorganic materials 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 4
- 241001062009 Indigofera Species 0.000 claims 1
- 239000010437 gem Substances 0.000 claims 1
- 229910001751 gemstone Inorganic materials 0.000 claims 1
- 239000005022 packaging material Substances 0.000 abstract description 13
- 238000005538 encapsulation Methods 0.000 abstract description 12
- 238000005516 engineering process Methods 0.000 abstract description 8
- 230000032683 aging Effects 0.000 abstract description 6
- 239000007789 gas Substances 0.000 description 15
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 8
- 230000004224 protection Effects 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 230000005496 eutectics Effects 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000006750 UV protection Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052754 neon Inorganic materials 0.000 description 2
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000011514 reflex Effects 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 230000001954 sterilising effect Effects 0.000 description 2
- 238000004659 sterilization and disinfection Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- SWPMTVXRLXPNDP-UHFFFAOYSA-N 4-hydroxy-2,6,6-trimethylcyclohexene-1-carbaldehyde Chemical compound CC1=C(C=O)C(C)(C)CC(O)C1 SWPMTVXRLXPNDP-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 210000000234 capsid Anatomy 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 210000003739 neck Anatomy 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Abstract
The present invention relates to ultraviolet LED encapsulation technology fields, disclose a kind of ultraviolet LED packaging, including the upper light transmission hollow housing for being respectively arranged at ultraviolet LED both sides and lower light transmission hollow housing, the side of upper light transmission hollow housing and the side of lower light transmission hollow housing have open end, ultraviolet LED includes substrate and multiple chips for being set on substrate, the open end of the one side closed upper light transmission hollow housing of substrate and the open end of the lower light transmission hollow housing of the other side closing of substrate, the inside of upper light transmission hollow housing is with the inner vacuum of lower light transmission hollow housing or full of filling gas.Above-mentioned packaging realizes the encapsulation to ultraviolet LED by light transmission hollow housing and full of filling gas therein or vacuum, entire packaging does not use organic packaging materials, aging of the ultraviolet light to organic packaging materials can be overcome completely from source, to effectively improve the performance of ultraviolet LED and extend its service life.
Description
Technical field
The present invention relates to ultraviolet LED encapsulation technology field more particularly to a kind of ultraviolet LED packagings.
Background technology
Ultraviolet light (ultraviolet, abbreviation UV) is the general name that electromagnetic spectrum medium wavelength is radiated from 100nm to 400nm.Root
According to the difference of wavelength, ultraviolet light is generally divided into tri- wave bands of A, B, C, UV-A is 400~315nm, and UV-B is 315~280nm,
UV-C is 280~100nm.In the markets UV LED are applied, the most important application markets of UV-A are the necks such as solidification, ink printing
Domain, it is sterilization, disinfection that UV-B is based on medical treatment, deep ultraviolet UV-C is then mainly used in.
Light emitting diode (Light Emitting Diode, abbreviation LED), in daily life and industrial use now
It is more and more extensive, it is low in energy consumption with its, luminescence response is fast, reliability is high, radiation efficiency is high, long lifespan, environmentally safe, structure
Many advantages, such as compact, obtains a large amount of market share, is a kind of environmentally protective light source of great foreground.Compared to Ultraluminescence
Lamp, ultraviolet LED have very high surface emissivity light intensity, can be widely applied to the fields such as sterilizing, be because its light-emitting area is small
Most promising a new generation's ultraviolet source.The application of ultraviolet LED technology will keep rapid growth, ultraviolet LED also will persistently keep
Height research hotspot, the encapsulation including ultraviolet LED are researched and developed.
Currently, the luminous power of ultraviolet LED is not high, and other than the raising of chip manufacturing level, spy of the encapsulation technology to LED
Property also has important influence.Existing ultraviolet LED encapsulating material mainly has the organic materials such as epoxy resin and silica gel, due to ultraviolet
The energy of light is higher, it is easy to which so that the performance of organic packaging materials is changed makes its flavescence aging, leads to the performance of ultraviolet LED
And service life declines.Therefore, encapsulating material resistance to UV aging how to be overcome to make to improve ultraviolet LED performance and extend it
It is the technical issues that need to address with the service life.
Invention content
In order to solve above-mentioned technological deficiency of the existing technology, the purpose of the present invention is to provide a kind of ultraviolet LED envelopes
Device is filled, realizes the encapsulation to ultraviolet LED by light transmission hollow housing and full of filling gas therein or vacuum, entirely
Packaging does not use organic packaging materials, can overcome aging of the ultraviolet light to organic packaging materials completely from source, from
And it effectively improves the performance of ultraviolet LED and extends its service life.
In order to achieve the above objectives, the embodiment of the present invention adopts the following technical scheme that：
A kind of ultraviolet LED packaging, the packaging include：The upper light transmission for being respectively arranged at ultraviolet LED both sides is hollow
The side of shell and lower light transmission hollow housing, the side of upper light transmission hollow housing and lower light transmission hollow housing has open end, purple
Outer LED includes substrate and multiple chips for being set on substrate, the open end of the one side closed upper light transmission hollow housing of substrate and
The open end of the lower light transmission hollow housing of other side closing of substrate, the inside of upper light transmission hollow housing and lower light transmission hollow housing
Inner vacuum is full of filling gas.
Above-mentioned ultraviolet LED packaging is passed through compared to traditional using organic packages devices such as epoxy resin or silica gel
Light transmission hollow housing with realize the encapsulation to ultraviolet LED full of filling gas therein or vacuum, entire packaging is not
Using organic packaging materials, aging of the ultraviolet light to organic packaging materials can be overcome completely from source, to effectively improve
The performance of ultraviolet LED simultaneously extends its service life.
Further, it is anti-to be coated with first for upper light transmission hollow housing and/or lower medial surface of the light transmission hollow housing towards substrate
Penetrate film.
Further, the material of the first reflectance coating is any one in gold, silver or aluminium.
Further, reflector is arranged in the outside of chip, and reflector inner surface is coated with the second reflectance coating.
Further, the height of reflector is 0.3-1.0mm, a diameter of 1.5-3.0mm of bottom of a cup of reflector, and reflector inclines
The angle of inclined-plane and substrate is 30 ° -120 °.
Further, the material of reflector is any one in gold, silver, copper, aluminium；The material of second reflectance coating be gold,
Any one of silver or aluminium.
Further, reflector inner surface is the rough surface for being provided with multiple dimpling pips, and dimpling pip includes cone
Shape pip or spherical pip.
Further, the height of taper pip is 0.1-0.3mm, and rib angle is 30 ° -120 °；The shape of spherical pip
Shape is hemispherical or circle, a diameter of 0.1-0.3mm of spherical pip.
Further, the refractive index of filling gas is 1.0-1.6, thermal coefficient 0.01-0.1w/m.k.
Further, the material of substrate includes glass, sapphire, ceramics, copper-based, any one or more in aluminium base.
Compared with the prior art, the present invention has the following technical effect that：
Ultraviolet LED packaging provided by the invention, including it is respectively arranged at the upper light transmission hollow housing of ultraviolet LED both sides
With lower light transmission hollow housing, the side of upper light transmission hollow housing and the side of lower light transmission hollow housing have open end, ultraviolet LED
Including substrate and multiple chips for being set on substrate, the open end of the one side closed upper light transmission hollow housing of substrate and substrate
The open end of the lower light transmission hollow housing of other side closing, the inside of upper light transmission hollow housing and the inside of lower light transmission hollow housing are true
It is empty or full of high refractive index and the high filling gas of thermal coefficient.Above-mentioned packaging is by light transmission hollow housing and full of wherein
Filling gas or vacuum realize the encapsulation to ultraviolet LED, entire packaging does not use organic packaging materials, can be complete
Aging of the ultraviolet light to organic packaging materials is overcome entirely, to effectively improve the performance of ultraviolet LED and extend its service life.This
Outside, by the way that reflector and reflectance coating is arranged, it can effectively change the light-emitting angle of ultraviolet LED, so that light is more concentrated, light is strong
Degree enhancing, to effectively improve light extraction efficiency.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
Obtain other attached drawings according to these attached drawings.
Fig. 1 is a kind of front view of ultraviolet LED packaging provided in an embodiment of the present invention；
Fig. 2 is a kind of vertical view of ultraviolet LED packaging provided in an embodiment of the present invention；
Fig. 3 is the front view of another ultraviolet LED packaging provided in an embodiment of the present invention；
Fig. 4 is the left view of another ultraviolet LED packaging provided in an embodiment of the present invention；
Fig. 5 is a kind of vertical view of ultraviolet LED packaging provided in an embodiment of the present invention；
Fig. 6 is a kind of front view of ultraviolet LED packaging provided in an embodiment of the present invention；
Fig. 7 is the partial structural diagram of reflector provided in an embodiment of the present invention；
Wherein：1, ultraviolet LED；11, substrate；12, chip；13, elargol or eutectic solder；14, conductive lead wire；15, polarity
Pin；2, upper light transmission hollow housing；3, lower light transmission hollow housing；4, filling gas；5, the first reflectance coating；6, reflector；7,
Two reflectance coatings；8, dimpling pip.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
In addition, the terms "and/or", only a kind of incidence relation of description affiliated partner, indicates may exist
Three kinds of relationships, for example, A and/or B, can indicate：Individualism A exists simultaneously A and B, these three situations of individualism B.Separately
Outside, character "/" herein, it is a kind of relationship of "or" to typically represent forward-backward correlation object.
As shown in Figs. 1-2, an embodiment of the present invention provides a kind of ultraviolet LED packaging, which includes：Respectively
Be set to the upper light transmission hollow housings 2 of 1 both sides of ultraviolet LED and lower light transmission hollow housing 3, the side of upper light transmission hollow housing 2 with
There is open end, ultraviolet LED 1 to include substrate 11 and the multiple chips 12 being set on substrate for the side of lower light transmission hollow housing 3,
Light transmission hollow housing 3 under the open end of the one side closed upper light transmission hollow housing 2 of substrate 11 and the other side closing of substrate 11
Open end, the inside of upper light transmission hollow housing is with the inner vacuum of lower light transmission hollow housing or full of filling gas 4.
Ultraviolet LED 1 includes substrate 11 and the multiple chips 12 being set on substrate 11, and multiple chips 12 are generally arranged with array
The formal distribution of cloth is on substrate 11, wherein each chip 12 is fixed on by elargol or eutectic solder 13 on substrate 11,
Specifically, the material of substrate 11 includes glass, sapphire, ceramics, copper-based, any one or more in aluminium base.
Wherein, the high thermal conductive substrates material such as ceramic (HTCC or AlN), aluminium base, copper-based, is generally used for the encapsulation of high-power UV, such base
Plate thermal conductivity is at least in 150w/m k；The substrate materials such as glass, sapphire, in being generally used for, the encapsulation of small-power UV, such base
Plate requires purple light section light transmittance to be more than 90% or more.
Preferably, substrate thickness is between 0.1~0.3mm, and shape can be rectangle, square, length and width size according to
The photoelectric parameter of specific UV LED requires adjustment.
It before fixed wafer 12 needs that the positive and negative of substrate 11 is carried out covering copper, cabling on the substrate 11, makes adjacent chip
Required electrical connection is formed between 12 by conductive lead wire 14.
Chip 12 is fixed on the substrate 11, chip 12 includes the chip of the types such as single electrode, bipolar electrode, upside-down mounting, it is non-fall
Dress class chip, which can be welded on by way of gold ball bonding on substrate, forms circuit connection；Flip chip passes through elargol or eutectic
Solder 13 fix on the substrate 11, and by conductive lead wire 14 formed circuit connection, 12 quantity of chip be 1~20, chip it
Between can connect can also be in parallel.
Preferably, chip 12 is ultraviolet light of the launch wavelength in 190~400nm ranges.
Preferably, conductive lead wire 14 is connected to by way of laser pressure welding on electrode of substrate.Conductive lead wire 14 can be
Bilateral outlet can also be unilateral outlet, can be adjusted according to circuit design.
Specifically, the material of conductive lead wire 14 is heat conduction, electric conductivity is excellent and surface can be with the metal of plated film or conjunction
Golden material, to prevent the irradiation of ultraviolet light.
Preferably, the material of conductive lead wire 14 includes copper, aluminium etc..
Specifically, polarity pin 15 and the polarity pad at basic both ends are welded and fixed.Polarity pin 15 is according to using
Occasion is adjusted, and can be unilateral extraction positive and negative anodes, can also be that positive and negative anodes are drawn in both sides.
As shown in Fig. 2, upper light transmission hollow housing 2 is respectively arranged at the both sides of ultraviolet LED 1 with lower light transmission hollow housing 3, on
The side of light transmission hollow housing 2 and the side of lower light transmission hollow housing 3 have open end, in the one side closed upper light transmission of substrate 11
The open end of empty capsid 2, while the open end of lower light transmission hollow housing 3, upper light transmission hollow housing are closed in the other side of substrate 11
Inside and lower light transmission hollow housing inner vacuum or be full of filling gas 4.
Upper light transmission hollow housing 2 is greater than or equal to the hollow housing that lower light transmission hollow housing 3 is one end open, length
The length of substrate, width are all higher than the width and height of substrate with height so that entire substrate is enclosed in enclosure interior, base
Plate is fixed on by both ends between upper light transmission hollow housing 2 and lower light transmission hollow housing 3.
Preferably, the material of upper light transmission hollow housing 2 and lower light transmission hollow housing 3 is transparent glass.
Preferably, filling gas 4 is high refractive index, thermal coefficient is high and is not susceptible to the gas of reaction, wherein refractive index
For 1.0-1.6, thermal coefficient 0.01-0.1w/m.k.
Preferably, filling gas 4 includes the inert gases such as nitrogen, argon, neon or helium.
Specifically, the operation principle of the present embodiment is：First power as needed welds institute with luminous flux on the substrate 11
The chip 12 of quantity is needed, then circuit connection is formed by welding conductive lead wire 14 between chip 12, draws polarity pin 15,
The ultraviolet LED being welded is positioned between upper light transmission hollow housing 2 and lower light transmission hollow housing 3 and forms confined space, to close
It closes space to vacuumize to form vacuum environment or be filled with filling gas to confined space, then the surrounding of confined space be carried out close
Envelope forms complete ultraviolet LED packaging.
Compared to traditional ultraviolet LED packaging using organic materials such as epoxy resin or silica gel, above-mentioned ultraviolet LED
Packaging realizes the encapsulation to ultraviolet LED by light transmission hollow housing and full of filling gas therein or vacuum, whole
A packaging does not use any organic packaging materials, ultraviolet light can be overcome to the old of organic packaging materials completely from source
Change, to effectively improve the performance of ultraviolet LED and extend its service life.
Preferably, as shown in Figure 3-4, on the basis of the above embodiments, upper light transmission in another embodiment of the invention
Hollow housing 2 and/or lower medial surface of the light transmission hollow housing 3 towards substrate are needing the region reflected to be coated with the first reflectance coating 5,
First reflectance coating 5 is changed the light-emitting angle of ultraviolet LED emergent light and light direction using reflex, makes emergent light more
It concentrates, light loss is smaller, and light intensity increases, and then improves optical energy utilization efficiency.
Preferably, the material of the first reflectance coating 5 is to have good reflection rate and ultraviolet resistance line in ultraviolet light spectral coverage
The material of irradiation.
Preferably, the material of the first reflectance coating 5 includes any one in gold, aluminium, silver.
Preferably, as seen in figs. 5-6, on the basis of the above embodiments, in chip in an alternative embodiment of the invention
Reflector 6 is arranged in 11 outside, and 6 inner surface of reflector is coated with the second reflectance coating 7.
Specifically, reflector is in bowl-shape, rounded at the top of the cup of reflector, the bottom of a cup of reflector is rounded, connection cup top
With bottom of a cup be reflector inclined surface, the height of reflector refers to the vertical height from cup top to bottom of a cup reflector, reflector
Inner surface be reflector inclined surface, thereon degree have metallic reflective coating, make ultraviolet LED by using the reflex of reflectance coating
The light-emitting angle of emergent light changes with light direction, plays the role of optically focused and guiding to emergent ray, makes emergent ray more
It concentrates, light loss reduces, and light intensity increases, and then improves optical energy utilization efficiency.
Preferably, the height of reflector is 0.3-1.0mm, a diameter of 1.5-3.0mm of bottom of a cup of reflector, reflector inclination
The angle of face and substrate is 30 ° -120 °.
Preferably, the material of reflector is any one in gold, silver, copper, aluminium；The material of second reflectance coating is ultraviolet
There are good reflection rate and the material of ultraviolet resistance line irradiation, preferably any one of gold, silver or aluminium in spectrum segment.
Preferably, Fig. 7 is the partial enlarged view of Fig. 6, as shown in fig. 7,6 inner surface of reflector is anti-to be provided with multiple dimplings
The rough surface of exit point 8, dimpling pip 8 include taper pip or spherical pip.
Preferably, the height of taper pip is 0.1-0.3mm, and rib angle is 30 ° -120 °；The shape of spherical pip
For hemispherical or circle, a diameter of 0.1-0.3mm of spherical pip.
Compared to smooth inner surface, the inner surface of reflector is set as the rough surface with multiple dimpling pips, energy
It is enough further to play the role of optically focused and guiding to emergent ray, the total reflection ratio of light is reduced, emergent ray is made more to collect
In, reduce light loss, increases light intensity, and then improve optical energy utilization efficiency.
The simple production process of above-mentioned ultraviolet LED packaging, and be easy to produce in enormous quantities, it can be formed directly in illuminator
Tool, the glow discharge spot lamps such as similar traditional incandescent lamp, neon bulb.The light source bayonet of standard is easily connected in source outer, such as
The interfaces such as common E14, E27 can facilitate and share lamp interface with conventional light source, be suitble to 190~400nm sections of UV LED envelopes
Dress.
Compared with the prior art, ultraviolet LED packaging provided in an embodiment of the present invention, by light transmission hollow housing with fill
Full filling gas or vacuum therein realize that the encapsulation to ultraviolet LED, entire packaging do not use organic packaging materials,
The irradiation defect that short wavelength UV light is avoided from theoretical source, can overcome ultraviolet light to the old of organic packaging materials completely
Change, to effectively improve the performance of ultraviolet LED and extend its service life.In addition, by the way that reflector and reflectance coating is arranged, it can
Light-emitting angle and the direction for effectively changing the emergent light of ultraviolet LED, make light more concentrate, light intensity enhancing, to effectively
Improve light extraction efficiency.
Through the above description of the embodiments, it is apparent to those skilled in the art that, for description
It is convenienct and succinct, it, can as needed will be upper only with the division progress of above-mentioned each functional unit for example, in practical application
It states function distribution to be completed by different functional units, i.e., the internal structure of device is divided into different functional units, to complete
All or part of function described above.The specific work process of the system, apparatus, and unit of foregoing description, before can referring to
The corresponding process in embodiment of the method is stated, details are not described herein.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (10)
1. a kind of ultraviolet LED packaging, which is characterized in that the packaging includes：It is respectively arranged at the ultraviolet LED two
The upper light transmission hollow housing of side and lower light transmission hollow housing, the side of the upper light transmission hollow housing and the lower light transmission hollow shell
It includes substrate and multiple chips for being set on the substrate that the side of body, which has open end, the ultraviolet LED, the substrate
The open end of the one side closed upper light transmission hollow housing and lower light transmission hollow housing is closed in the other side of the substrate
Open end, the inside of the upper light transmission hollow housing is with the inner vacuum of the lower light transmission hollow housing or full of filling gas.
2. ultraviolet LED packaging as described in claim 1, which is characterized in that the upper light transmission hollow housing and/or described
Lower medial surface of the light transmission hollow housing towards the substrate is coated with the first reflectance coating.
3. ultraviolet LED packaging as claimed in claim 2, which is characterized in that the material of first reflectance coating is gold, silver
Or any one of aluminium.
4. ultraviolet LED packaging as described in claim 1, which is characterized in that reflector, institute is arranged in the outside of the chip
It states reflector inner surface and is coated with the second reflectance coating.
5. ultraviolet LED packaging as claimed in claim 4, which is characterized in that the height of the reflector is 0.3-
1.0mm, a diameter of 1.5-3.0mm of bottom of a cup of the reflector, the angle of the reflector inclined surface and the substrate is 30 °-
120°。
6. ultraviolet LED packaging as claimed in claim 4, which is characterized in that the material of the reflector be gold, silver, copper,
Any one in aluminium；The material of second reflectance coating is any one of gold, silver or aluminium.
7. ultraviolet LED packaging as claimed in claim 4, which is characterized in that the reflector inner surface is more to be provided with
The rough surface of a dimpling pip, the dimpling pip include taper pip or spherical pip.
8. ultraviolet LED packaging as claimed in claim 7, which is characterized in that the height of the taper pip is 0.1-
0.3mm, rib angle are 30 ° -120 °；It is described spherical shape pip shape be hemispherical or circle, it is described spherical shape pip it is straight
Diameter is 0.1-0.3mm.
9. ultraviolet LED packaging as described in claim 1, which is characterized in that the refractive index of the filling gas is 1.0-
1.6, thermal coefficient 0.01-0.1w/m.k.
10. ultraviolet LED packaging as described in claim 1, which is characterized in that the material of the substrate includes glass, indigo plant
Jewel, ceramics, copper-based, any one or more in aluminium base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810287695.4A CN108321282A (en) | 2018-04-03 | 2018-04-03 | A kind of ultraviolet LED packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810287695.4A CN108321282A (en) | 2018-04-03 | 2018-04-03 | A kind of ultraviolet LED packaging |
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| Publication Number | Publication Date |
|---|---|
| CN108321282A true CN108321282A (en) | 2018-07-24 |
Family
ID=62899349
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810287695.4A Pending CN108321282A (en) | 2018-04-03 | 2018-04-03 | A kind of ultraviolet LED packaging |
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| Country | Link |
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| CN (1) | CN108321282A (en) |
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