CN202142527U - Emitter package - Google Patents
Emitter package Download PDFInfo
- Publication number
- CN202142527U CN202142527U CN201120187042.2U CN201120187042U CN202142527U CN 202142527 U CN202142527 U CN 202142527U CN 201120187042 U CN201120187042 U CN 201120187042U CN 202142527 U CN202142527 U CN 202142527U
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- China
- Prior art keywords
- encapsulation
- reflector
- cavity
- shell
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Led Device Packages (AREA)
Abstract
The utility model relates to an emitter package, comprising an outer casing, wherein the outer casing includes a cavity extending into the inner portion of the outer casing from the top surface of the outer casing; a conductive lead frame integrated to the outer casing; and multiple light emitting devices arranged on the conductive portion of the lead frame. Multiple portie portions of the light emitting devices and the lead frame are exposed through the cavity, the bottom of the cavity has a shape different from that of the top of the cavity, and the size of the bottom of the cavity is at least 30% larger than that of the top of the cavity. The emitter package provides an improved color emitting uniformity in different visual angles, has a thin/low section for flat applications, has an improved structure integrity, and has a proper surface area for mounting hoped number of LED chips and corresponding parts. Further, the emitter package can provide a margin for attaching to a standard mechanical/electrical support body.
Description
Technical field
The utility model is usually directed to a kind of reflector encapsulation, relates more specifically to a kind of mounted on surface encapsulation with thin/low section (profile) of a plurality of multifunctional application reflectors that form a line.
Background technology
Light-emitting diode (LED) is electric energy to be converted into the solid state device of light, and generally includes the active layer that is clipped in the one or more semi-conducting materials between the opposite doped layer.When crossing over doped layer and apply bias voltage, hole and electronics are injected in the active layer of their compound and generation light.Light penetrates from active layer and LED all surface.
In recent years, the LED technology has been improved significantly, as has enhanced brightness and color fidelity, the less LED that takes up room, and has proposed the emission effciency of whole raising.LED also has the working life of comparing prolongation with other reflector.For example, when the working life of incandescent lamp during near 2,000 hours, the working life of LED can be above 50,000 hours.Under the situation that consumes less power, LED also maybe be more firm than other light source.For some reason or other, it is more universal that LED is becoming, and be used for the increasing application of the traditional field of incandescent lamp, fluorescent lamp, Halogen lamp LED and other reflector now.
Owing to these improved LED and improved image processing techniques, LED can be as the light source of multiple display type at least in part.In order in these application types, to use led chip, well-known, one or more led chips of in encapsulation, packing into to be providing protection environment and/or machinery, the selection of color, and the focusing of light, or the like.The LED encapsulation also comprises in order to the LED encapsulation is electrically connected to electrical lead wire, contact or the trace of external circuit.The LED encapsulation is installed on the printed circuit board (PCB) (PCB) usually.
Different LED encapsulation not only can be used as large-scale but also can be as the light source of miniscope.When based on display than the small screen LED; Like television set, game machine and computer monitor, in a lot of indoor places, like family and company; Become more and more when popularizing, become more and more universal in a lot of indoor and outdoors places based on the display of big screen LED.These LED-based displays can comprise thousands of " pixels " or " picture element module ", its each can comprise a plurality of LED.Picture element module can use the LED of high efficiency and high brightness, and it allows display from various distances and all be visible under the situation of various surround lightings.Picture element module can have the minority LED like three or four, and it allows the light of pixel emission from a lot of different colours in the red, green, blue combination, and/or comprises gold-tinted sometimes.
The most traditional LED-based display can be by computer system control; It accepts input signal (like TV signal); And forming overall display image based on the particular color that the picture element module place needs, computer system is confirmed which (which) LED emission light in each picture element module and how is brightly sent out.Also can comprise the power-supply system that power is provided to each picture element module; Power to each LED provides can be modulated, so it launches the light of desirable brightness.Provide conductor to come each LED in picture element module to apply suitable power signal.
When watching, the beholder usually is not directly in LED-based display front.At indoor and outdoors, across off-axis angle in a big way in display all can watch, for example up to 145 ° or even bigger.Depend on the position at beholder place, level and/or vertical angle of view maybe be different.And, when the people when light-emitting diode display moves, can on a lot of different angles, watch.Has the decline that to experience the emissive porwer at different angles place at the typical LED display of launching near the peak of center.(far field pattern also can be different FFP), so that when watching from different perspectives, light-emitting diode display possibly experience the variation of picture quality to be used for the far-field pattern of different LED encapsulation of each picture element module.
No matter indoor still in outdoor application, thin flat-panel monitor becomes more and more universal.When the flat-panel monitor popularization increased, LED encapsulation was merged in the become display of thinner/lower section of this needs.The encapsulation of hoping this approaching/low section can be solid so that their keep their structural intergrity in manufacturing and use, but the integrality of this encapsulation possibly suffer damage.For example, in the encapsulation of the current thin/low section of prior art, encapsulating structure possibly be out of shape during reflux technique.And, make with use in, current thin/encapsulation of hanging down section suffers separating between package casing and the lead-in wire/lead frame possibly.
In addition, when reflector encapsulates the section that becomes more and more littler He more and more lower, be starved of for the available amount of space of radiated element (like LED) on the current-carrying part of encapsulation.Littler encapsulation also possibly have and hinders they and the corresponding size in mounting portion of traditional PCB or other suitable mechanical/electrical supporter.
The utility model content
The utility model provides reflector encapsulation and light-emitting diode display.
One embodiment comprises the reflector encapsulation; This encapsulation comprises shell; This shell has the cavity that extends into said enclosure from the top surface of said shell, is integrated into the conductive lead wire frame of said shell and is arranged in a plurality of light emitting devicess on the current-carrying part of said lead frame.Said lead frame comprises a plurality of characteristics that cooperate with said shell, so that the firm connection between said lead frame and the said shell to be provided.A plurality of parts of light emitting devices and said lead frame are exposed through said cavity.The bottom of said cavity comprises and the different shape in said cavity top that the shape of said cavity bottom has increased the surface area of the lead frame part of said exposure.
According to another embodiment; The reflector encapsulation is provided; It comprises shell; This shell comprises the cavity that extends into said enclosure from said shell top surface, is integrated into the lead frame of said shell and is arranged in a plurality of light emitting devicess on the each several part of the said lead frame that exposes through said cavity.Said lead frame comprises a plurality of characteristics that cooperate with said shell, so that the firm connection between said lead frame and the said shell to be provided.Said shell comprises stepped, so that the bottom size of said shell is greater than the top dimension of said shell.
Also according to another embodiment; The reflector encapsulation of low section is provided; It comprises shell, and this shell comprises the cavity that extends into said enclosure from said shell top surface, is integrated into the lead frame of said shell; With on said lead frame, be linearly aligned a plurality of LED, the part of said LED and said lead frame is exposed through said cavity.Said lead frame comprises a plurality of characteristics that cooperate with said shell, so that the firm connection between said lead frame and the said shell to be provided.The height of said encapsulation is between 0.9 to 1.35mm.
Also according to another embodiment of the utility model, the light emitting devices display is provided, it comprises the substrate that carries the reflector array of packages and is electrically connected drive circuit, is used for optionally said array being switched on said display, to produce visual image.Each said reflector encapsulation comprises shell; This shell comprises the cavity that extends into said enclosure from said shell top surface; Be integrated into the lead frame of said shell; With on said lead frame, be linearly aligned a plurality of LED, the part of said LED and said lead frame is exposed through said cavity.Cavity has the degree of depth that is less than or equal to 0.5mm.Said lead frame comprises a plurality of characteristics that cooperate with said shell, so that the firm connection between said lead frame and the said shell to be provided.
According to the utility model a kind of reflector encapsulation is provided, it comprises: shell, and this shell comprises the cavity that extends into the inside of said shell from the top surface of said shell; Be integrated into the conductive lead wire frame of said shell, wherein said lead frame comprises a plurality of characteristics that cooperate with said shell, so that the firm connection between said lead frame and the said shell to be provided; With a plurality of light emitting devicess on the current-carrying part that is arranged in said lead frame; A plurality of parts of said light emitting devices and said lead frame are exposed through said cavity; The bottom of wherein said cavity comprises the shape different with the top of said cavity, and the size of the bottom of said cavity is than the size big at least 30% at the top of said cavity.
Further, said lead frame further comprises: a plurality of conductive cathode parts; And the corresponding a plurality of conductive anode parts that separate with said cathode assembly; Wherein said cathode assembly or said anode component carry at least one in the said light emitting devices, and in said anode component and the said cathode assembly each is electrically connected in the said light emitting devices.
Further, said light emitting devices comprises the LED that arranges with linear array.
Further, said light emitting devices is suitable for being energized to produce FR color in combination.
Further, each in the said light emitting devices comprises at least two contacts, and one of them contact is electrically coupled at least one in the said cathode assembly, and other contact is electrically coupled in the said anode component at least one.
Further, said light emitting devices becomes to extend along first direction with arranged in linear arrays; Said anode component is arranged to parallel each other relation; Said cathode assembly is arranged to parallel each other relation, and wherein said anode component extends upward in the second party vertical with said first direction with said cathode assembly.
Further, said lead frame comprises conducting metal or metal alloy.
Further, said LED comprises a plurality of colors.
Further, each in the said light emitting devices is attached to said cathode assembly or said anode component and passes through solder attachment to corresponding cathode assembly or anode component through closing line.
Further, said shell is made up of plastics or resin.
Further; Said characteristic comprises one or more in following: the metal gap between the adjacent part of through hole, otch, bending lead, side recess, side clasp or said lead frame; Gap ratio those spacings in the lead frame that does not comprise said metal gap that said metal gap produces between the lead frame part are bigger; Compare with the encapsulation that does not comprise said characteristic, said shell surrounds said characteristic to strengthen the bonding between said shell and the said lead frame.
Further, said LED is vertical arrangement.
Further, said cavity further comprises the degree of depth that is less than or equal to 0.5mm, and the said degree of depth has increased the visual angle.
Further, said reflector encapsulation is included in the anti-UV sealant in the said encapsulation.
Further, said sealant comprises silicones.
Further, put down at the top of said sealant.
Further, said cavity is filled by packing material at least in part.
Further, the shape of said cavity bottom is limited four arcs, and the shape at said cavity top is circular.
Further, said cavity comprises reflector.
Further, the height of said encapsulation is between 0.9-1.0mm.
Further, the height of said encapsulation is less than 1.35mm.
Further, said reflector encapsulation comprises one or more Zener diodes of the lead frame part that is electrically connected to said exposure.
According to the utility model a kind of reflector encapsulation is provided, it comprises: shell, and this shell comprises the cavity that extends into the inside of said shell from the top surface of said shell; Be integrated into the lead frame of said shell, wherein said lead frame comprises a plurality of characteristics that cooperate with said shell, so that the firm connection between said lead frame and the said shell to be provided; With a plurality of light emitting devicess on a plurality of parts that are arranged in the said lead frame that exposes through said cavity; Wherein said shell comprises stepped; Make the size of bottom of said shell greater than the size at the top of said shell, and the size of the bottom of said cavity is than the size big at least 30% at the top of said cavity.
Further, said reflector encapsulation further comprises the one or more Zener diodes that are electrically connected to the lead frame part that is exposed.
Further, said lead frame further comprises: a plurality of conductive cathode parts, and each all carries in the said light emitting devices at least one; With the corresponding a plurality of conductive anode parts that separate with said cathode assembly; Each said anode component is electrically connected in the said light emitting devices; Wherein each said light emitting devices is attached to corresponding cathode assembly through closing line, and each said light emitting devices is through solder attachment to corresponding anode parts.
Further, said light emitting devices comprise with linear array arrange multi-colored led, said LED is suitable for being energized to produce FR color in combination.
Further; Said characteristic comprises one or more in following: the metal gap between the adjacent part of through hole, otch, bending lead, side recess, side clasp or said lead frame; Gap ratio those spacings in the lead frame that does not comprise said metal gap that said metal gap produces between the lead frame part are bigger; Compare with the encapsulation that does not comprise said characteristic, said shell surrounds said characteristic to strengthen the bonding between said shell and the said lead frame.
Further, the degree of depth of said cavity is less than or equal to 0.5mm, and the said degree of depth has increased the visual angle.
Further, said reflector encapsulation further comprises the Silicone Sealants in the said encapsulation, and put down at the top of said sealant.
Further, said cavity is filled by packing material at least in part.
Further, said cavity comprises reflector.
Further, the height of said encapsulation is between 1.25-1.35mm.
Further, the height of said encapsulation is less than 2.0mm.
Further, being used to be attached to printed circuit board (PCB), and the size at the top of said shell is to the application of various hope and customized by standardization for the size of the bottom of said shell.
Provide a kind of reflector of low section to encapsulate according to the utility model, it comprises: shell, and this shell comprises the cavity that extends into the inside of said shell from the top surface of said shell; Be integrated into the lead frame of said shell, wherein said lead frame comprises a plurality of characteristics that cooperate with said shell, so that the firm connection between said lead frame and the said shell to be provided; With a plurality of LED that are arranged in linear array on the said lead frame; A plurality of parts of said LED and said lead frame are exposed through said cavity; The height of wherein said encapsulation is less than 2.0mm, and the size of the bottom of said cavity is than the size big at least 30% at the top of said cavity.
Further, the bottom of said cavity comprises the shape different with the top of said cavity, and the shape of said cavity bottom has increased the surface area of the lead frame part of said exposure.
Further, said shell comprises stepped, makes the size of said first part of case shell greater than the size of the second portion of said shell.
Further; Said characteristic comprises one or more in following: the metal gap between the adjacent part of through hole, otch, bending lead, side recess, side clasp or said lead frame; Gap ratio those spacings in the lead frame that does not comprise said metal gap that said metal gap produces between the lead frame part are bigger; Compare with the encapsulation that does not comprise said characteristic, said shell surrounds said characteristic to strengthen the bonding between said shell and the said lead frame.
According to the utility model a kind of light emitting devices display is provided, it comprises: substrate, carry the array of reflector encapsulation; And electrical connection drive circuit; Be used for optionally said array being switched on said display, to produce visual image; Wherein each said reflector encapsulation comprises: shell, and this shell comprises the cavity that extends into the inside of said shell from the top surface of said shell; Be integrated into the lead frame of said shell, wherein said lead frame comprises a plurality of characteristics that cooperate with said shell, so that the firm connection between said lead frame and the said shell to be provided; With a plurality of LED that are arranged in linear array on the said lead frame; A plurality of parts of said LED and said lead frame are exposed through said cavity; Wherein the height of each said encapsulation is less than 2.0mm, and the size of the bottom of said cavity is than the size big at least 30% at the top of said cavity.
Further, each the said LED in said reflector encapsulation is driven by the corresponding signal of telecommunication, and each said LED further limits a pixel of said display.
Further, the said LED at least some in the said reflector encapsulation is a vertical arrangement.
Further, each said reflector encapsulation has the height that is changed to 1.35mm from 0.9mm.
According to the reflector encapsulation of the utility model, be provided at the color emission uniformity of the improvement at different visual angles place, said reflector encapsulation has thin/low section for flat application.The utility model also provides the reflector encapsulation of the structural intergrity with raising, and for led chip and corresponding component that desired number is installed, said encapsulation has suitable surface area.In addition, the utility model provides customizable reflector encapsulation, and it can make allowances for the mechanical/electrical supporter of the standard of being attached to.
Description of drawings
To those skilled in the art, from following detailed description and accompanying drawing, these of the utility model or other further characteristic and advantage will become obviously, wherein:
Fig. 1 is the perspective view according to the reflector encapsulation of the utility model;
Fig. 2 is the vertical view of the embodiment shown in Fig. 1;
Fig. 3 is the sectional view that the 3-3 line in Fig. 2 is seen embodiment among Fig. 1 in the past;
Fig. 4 is the bottom view of the embodiment shown in Fig. 1;
Fig. 5 is the end-view of the embodiment shown in Fig. 1, and the opposite end is similar basically;
Fig. 6 is the end view of the embodiment shown in Fig. 1, and opposite side is similar basically;
Fig. 7 is the top view that can be used on the lead frame in the device among Fig. 1 according to an embodiment;
Fig. 7 a is the sectional view that the 7a-7a line in Fig. 7 is seen Fig. 7 embodiment in the past;
Fig. 8 is the end view of the lead frame shown in Fig. 7;
Fig. 9 is the top dimension figure of the embodiment shown in Fig. 1;
Figure 10 is the lateral dimension figure of the embodiment shown in Fig. 1;
Figure 11 is the perspective view according to another embodiment of the reflector encapsulation of the utility model;
Figure 12 is the vertical view of the embodiment shown in Figure 11;
Figure 13 is the bottom view of embodiment shown in Figure 11;
Figure 14 is the end-view of the embodiment shown in Figure 11, and the opposite end is similar basically;
Figure 15 is the end view of the embodiment shown in Figure 11, and opposite side is similar basically;
Figure 16 is the top view that can be used on the lead frame in the device among Figure 11 according to an embodiment;
Figure 16 a sees the sectional view of Figure 16 embodiment in the past along the 16a-16a line among Figure 16;
Figure 17 is the top dimension figure of embodiment shown in Figure 11;
Figure 18 is the lateral dimension figure of embodiment shown in Figure 11;
Figure 19 a works as and Figure 20 a, the legend that the expression H-H the when transmission path of describing among the 20b is relevant arranges;
Figure 19 b works as and Figure 21 a, the legend that the expression V-V the when transmission path of describing among the 21b is relevant arranges;
Figure 20 a shows the curve chart of the H-H transmission path of the surface mounted device embodiment shown in Fig. 1;
Figure 20 b shows the curve chart of the H-H transmission path of the surface mounted device embodiment shown in Figure 11;
Figure 21 a shows the curve chart of the V-V transmission path of the surface mounted device embodiment shown in Fig. 1; And
Figure 21 b shows the curve chart of the V-V transmission path of the surface mounted device embodiment shown in Figure 11.
Embodiment
Here describe the utility model with reference to some embodiment, but be appreciated that the utility model can and should not be construed as the embodiment that is confined to describe in detail here with different form realizations.
In some embodiment according to the utility model; The pilosity that is provided for approaching/hang down section is penetrated the structure of encapsulation; It allows to be encapsulated in the light of locating to launch the color uniformity with improvement with great visual angle through arranging reflector and minimize the encapsulation cavity depth in the encapsulation internal linear.Some embodiment of the utility model provide the reflector encapsulation of thin/low section in addition; Partly because the characteristic in the package leadframe can be adhered to package casing and lead frame each other securely; Strong connection is provided like this, so these reflectors are encapsulated in the integrality of making and can keeping structure between the operating period between them.Such characteristic can comprise the metal gap that changes size between the lead frame adjacent part, the otch in the lead frame, and the through hole in the lead frame, the recess in the lead frame, bending lead, or the like.
In other embodiments, when cavity top when being conventional shape (like circle) with the emission of maximization light with the visual angle, shape that can the custom encapsulation cavity provides useable surface area greatly to engage the peculiar shape of the diode of institute's desired number so that cavity bottom has.This special cavity makes allowances for comprising more diode in the encapsulation, otherwise for the diode that carries institute's desired number its too little (and therefore having too little surface area).Other embodiment according to the utility model; The shell of encapsulation can comprise stepped variation; Said stepped variation makes the bottom of encapsulation be installed on the habitual electronic/mechanical supporter (like the PCB of standard), and possibly descend for the size on the top of less application encapsulation.
The utility model is suitable for dissimilar reflector encapsulation, as can be used on a lot of different illumination application, like the surface mounted device in LED color/graphics or the decorative lighting (SMD).Can describe below and use the different embodiments of light-emitting diode, but be appreciated that other reflector encapsulation embodiment can use dissimilar reflectors as the reflector encapsulation of their reflector.
Will be understood that when mentioning that an element " on another element ", " being connected to another element ", " being coupled to another element " perhaps " contact with another element "; It can be directly on this another element; Be connected to this another element or be coupled to this another element; Or contact with this another element, perhaps can there be the insertion element.By contrast, when mentioning that an element " directly on other element ", " being connected directly to other element ", " coupling directly to other element " perhaps " directly contact with other element ", then there is not the insertion element.Similarly, when mentioning first element " electric contact second element " or " electrical couplings to the second element ", there is the electrical path that allows electric current mobile between first element and second element here.Electrical path can comprise capacitor, coupling inductor and/or even not have directly contact and other element of allowing the electric current between the conducting element to flow.
Although first, second grade of term can be used to describe various elements, parts, zone and/or part here, these terms will not limit these elements, parts, zone and/or part.These terms only are used to distinguish an element, parts, zone or part and another element, parts, zone or part.Therefore, first element that is discussed below, parts, zone or part can be called second element, parts, zone or partly not depart from the instruction of the utility model.
Here describe the embodiment of the utility model with reference to sectional view, wherein sectional view shows the illustrative diagram of the embodiment of the utility model.According to this, the actual (real) thickness of parts can be different, and owing to for example manufacturing technology and/or tolerance limit, can expect to change illustrated shape.The embodiment of the utility model will be not interpreted as the given shape in the zone that is confined to illustrate here, but owing to the reason of for example making comprises departing from shape.Typically, because the manufacturing tolerance limit of standard, diagram or square or the rectangular area described will have circle or arc characteristic.Therefore the zone shown in the figure is actually schematically, and their shape is not intended to explain the accurate shape in the zone of device, and also is not intended to limit the scope of the utility model.
Fig. 1-10 shows an embodiment according to the multiple love dart encapsulation 10 of the thin/low section of the utility model, and it comprises SMD.According to above mentioned, be appreciated that the utility model can be used for the reflector encapsulation except other type of SMD.This encapsulation 10 comprises shell 12, and it carries integrated-lead frame 14.This lead frame 14 comprises and being used for a plurality of conductive connection part branches of electrical signal conduction to the optical transmitting set of encapsulation.This lead frame can also assist to be dissipated in the heat that is produced by reflector in the application, and the reflector that in said application, encapsulates can produce a large amount of heat.
This lead frame 14 can be arranged with many different modes, and in different encapsulation embodiment, can use the parts of varying number.Use three reflectors to describe this encapsulation 10 below, and in the illustrated embodiment, lead frame is arranged such that each reflector is driven by the corresponding signal of telecommunication.Therefore six conductive components are arranged in the illustrated embodiment, each reflector comprises that conductive component is right, and the signal of telecommunication through its conductive component to being applied on each reflector.For encapsulation 10, conductive component comprises first, second and third anode parts 16,18,20 and first, second and the 3rd cathode assembly 22,24,26 (best is shown among Fig. 7), and each has the attached pad of reflector.But, be appreciated that some embodiment can comprise and be less than three LED, be less than six LED and other can comprise more than three LED more arranged can comprising of other simultaneously.In these various embodiment, it is right that each LED can have their own corresponding conductive components, or can with the shared conductive component of other LED.Led chip is few more, and the cost of encapsulation and complexity usually maybe be low more.
Tapered through the ring 42 that makes cavity 40 and wherein inwardly carried towards enclosure, can strengthen effect and the angle of departure of encapsulation of the reflectivity of this ring 42.As an example but be not restriction, and best being shown among Figure 10, the cavity angle 46 of about 50.0 degree can provide suitable and visual angle hope, if comprise reflector parts then the reflectivity of hope also can be provided.In another possible embodiment, the cavity angle of about 90.0 degree can provide suitable and visual angle hope.Still have some maybe embodiment,,, between the 50.0-90.0 degree and/or greater than the cavity angle of 90.0 degree, suitable and visual angle hope can be provided greater than 50.0 degree less than 50.0 degree.
The degree of depth that in addition, can customize cavity 40 is to increase the visual angle of encapsulation.As an example but be not restriction, in the encapsulation of thin/low section of this embodiment, the degree of depth be 0.45mm+/-the loculus body 40 (as shown in Figure 10) of 0.05mm can provide visual angle hope, that increase.In another possible embodiment, the visual angle of hope can be provided less than the cavity depth of 0.45mm.Still have some maybe embodiment, the visual angle of hope can be provided greater than 0.45mm but less than the cavity depth of the total height of reflector encapsulation.
In certain embodiments, the base section 41 of cavity 40 that is close to the expose portion of lead frame 14 can comprise the shape different with the top section of cavity 40 43.In this embodiment shown in Fig. 1 and 2, the base section 41 of cavity 40 is limited the shape that comprises four arcs best, and this shape is similar to the square with curvilinear.This top section 43 is limited circle.Be appreciated that according to the utility model bottom and top section 41,43 can comprise the suitable shape of any kind.With keep round-shaped traditional cavity from top to bottom and compare; The difformity of base section 41 makes allowances for the more lead frame 14 that exposes through cavity 40, and this has increased the useable surface area (being discussed below more details) that the lead frame 14 of all kinds LED or other diode can be installed above that.The useable surface area that increases the lead frame 14 that exposes in the cavity 40 possibly be essential; Especially in little reflector encapsulation; Lacking for base section 41 under the situation of suitable shape, it may not assemble installation diode or other device component of desired number.
In certain embodiments, cavity 40 can be filled by packing material/sealant 48 at least in part, and it can be protected and this lead frame 14 of strong fix reaches the reflector that carries thus.In some instances, packing material/sealant 48 can cover reflector and pass through cavity 40 exposed portions lead frames 14.In order to strengthen projection, can select packing material/sealant 48 for having predetermined optical characteristics, and packing material/sealant 48 is transparent for the light by the reflector emission of encapsulation basically in certain embodiments from the light of LED.This packing material/sealant 48 can be put down along its upper surface basically, perhaps also shape can be arranged, and like hemisphere or bullet shaped, or can be recessed in wholly or in part in the cavity 40.This packing material/sealant 48 can being combined to form by silicones, resin, epoxy resin, thermoplastic condensed polymer, glass and/or other suitable material or material.In certain embodiments, can in packing material/sealant 48, add material to strengthen emission, absorption and/or the scattering that gets into and/or come from the light of LED.
This shell 12 can be by the electrical insulating material manufacturing; It also can be a thermal conducting.This material is well-known in the art, and can include but not limited to thermoplastic condensed polymer (for example polyphthalamide (polyphthalamide, PPA)), some pottery, resin, epoxy resin and glass.This shell 12 can also be processed improving the aborning contrast of SMD package image by dark color or black material, as has the SMD that uses in the video display.
This encapsulation 10 and shell 12 thereof can be through forming and/or assemble like any one of various known methods in this area.For example, can be around anode component 16,18,20 and cathode assembly 22,24,26 for example forms through injection moulding or this shell 12 of moulding.Can have the hole 47 shown in Fig. 4 in the encapsulation that is formed by known injection molding technology, it has represented the inlet point of injection molding sheathing material on said lead frame 14.Replacedly, shell can be formed in a plurality of, for example top and bottom, and anode component 16,18,20 and cathode assembly 22,24,26 are formed on the bottom.This top and bottom can use known method and material to be bonded together afterwards, as passing through epoxy resin, adhesive or other suitable bond material.
In described illustrative example, first, second and the 3rd LED 50,52,54 are used in encapsulation 10, its each can launch same color with comparing of other light or the light of different colours.In this embodiment that illustrates, LED50,52,54 launches blue, red and green respectively, and therefore when suitably being powered up, producing through combination LED is FR color basically.Further, when suitably being powered up, LED50,52,54 can launch the white light combination of different-colour.Be appreciated that according to the utility model and in encapsulation, can use, and these LED launch the color of any hope greater or less than 3 LED.
This encapsulation 10 can also comprise that protection does not receive the element of Electrostatic Discharge infringement.Can use different elements,, be arranged in parallel and compare the different LED (not shown) that is reverse biased with led chip 50,52,54, mounted on surface rheostat (not shown) and horizontal Si diode (not shown) like various vertical Zener diode (not shown).In the embodiment that uses Zener diode, can use known mounting technique to attach it to the attached pad of separation.Diode can make it not cover the lip-deep too much area of the lead frame 14 that is exposed by cavity 40 relatively forr a short time.When the many groups of use LED series coupled, only need an ESD element for the group of each series connection.
LED structure, characteristic and manufacturing thereof and operation are normally known in the art, and brief discussion only here.LED can have a lot of different semiconductor layers of arranging by different way and can launch different colours.Can use processes well known to make the layer of LED, and a kind of suitable manufacturing process is to use Organometallic Chemistry gas deposition (MOCVD).The layer of led chip generally includes the active layer/district that is clipped between the first and second opposite doped epitaxial layers, and its all these be to be formed on continuously on growth substrates or the wafer.The led chip that is formed on the wafer can and be used for different application by singulation, as is installed in the encapsulation.Be appreciated that growth substrates/wafer can be used as final singulation LED a part and keep or growth substrates can be removed whole or in part.
Be further appreciated that in LED, to comprise other layer and element, include but not limited to resilient coating, nucleating layer, contact layer and current extending, and light-extraction layer and element.Active area can comprise single quantum well (SQW), MQW (MQW), double heterojunction or superlattice structure.
Active area and doped layer can be made by the different materials system, and a this system is an III nitride material system.The III group-III nitride refers to the semiconducting compound that forms between those elements (normally aluminium (Al), gallium (Ga) and indium (In)) in the III of nitrogen and periodic table family.This term also relates to ternary and quaternary compound, like aluminum gallium nitride (AlGaN) and aluminium indium gallium nitrogen (AlInGaN).In a possible embodiment, doped layer is that gallium nitride (GaN) and active layer are InGaN.In alternative embodiment, doped layer can be AlGaN, gallium aluminium arsenic (AlGaAs) or Al-Ga-In-As phosphorus (AlGaInAsP) or aluminium indium gallium phosphorus (AlInGaP) or zinc oxide (ZnO).
Growth substrates/wafer can be processed by a lot of materials; Like silicon, glass, sapphire, carborundum, aluminium nitride (AlN), gallium nitride (GaN); Suitable substrate is a 4H polytype carborundum, yet also can use other carborundum polytype that comprises 3C, 6H and 15R polytype.Carborundum has some advantage, as comparing lattice match with sapphire more near the III group-III nitride, therefore causes producing to have higher-quality III nitride films.Carborundum also has very high thermal conductivity so that the gross output of the III nitride devices on the carborundum can not limited (situation that is formed on some devices on the sapphire possibly be like this) by the heat radiation of substrate.The SiC substrate can be from the North Carolina Cree Research, Inc of Du Lun obtain, and about the method for making them in scientific literature with United States Patent (USP) No.Re.34, stated in 861, No.4,946,547 and No.5,200,022.
LED can also comprise supplementary features, like the current-dispersing structure of conduction, and current extending and closing line pad, all these can be made by the well known materials of using the known method deposition.Can use the some or all of LED of one or more phosphor-coated, phosphor absorbs at least some LED light and launches the light of different wave length, so that the LED emission is from the combination of the light of LED and phosphor.Can use a lot of distinct methods to be the led chip associated with phosphor coated; In sequence number is No.11/656; 759 and No.11/899; Described a kind of suitable method in 790 the U.S. Patent application, the utility model title of these two patent applications all is " Wafer Level Phosphor Coating Method and Devices Fabricated Utilizing Method ", and the two is merged in here by reference.Replacedly; Can use other method to apply LED; Like electrophoretic deposition (EPD); The U.S. Patent application No.11/473 that is called " Close Loop Electrophoretic Deposition of Semiconductor Devices " in the utility model name has described a kind of suitable EPD method in 089, and it is also incorporated into here by reference.
In addition, as as known in the art, LED can have vertical or horizontal geometry.Those that comprise vertical geometry can have first contact and on P type layer, have second and contact on the substrate.The propagation of electrical signals that is applied to first contact gets into n type layer, and the signal that is applied to second contact is propagated entering p type layer.Under the situation of III nitride devices, be well known that thin translucent typically cover part or whole p type layer.Be appreciated that second contact can comprise such layer, it typically is metal, like platinum (Pt), or transparent conductive oxide, like indium tin oxide (ITO).
LED can also comprise lateral geometry, and wherein two contacts are all at the top of LED.As remove the part of p type layer and active area through etching, to expose the contact table top on the n type layer.The second horizontal n type contact is provided on the table top of n type layer.These contacts can comprise the well known materials of using known techniques of deposition.
In the illustrative example that illustrates, the outwards outstanding apparent surface 36 and 38 who passes shell 12 of the anode of lead frame and cathode assembly 16,18,20,22,24,26. Anode component 16,18,20 is 36 extensions from the surface, and cathode assembly 22,24,26 38 extensions from the surface.When mounted on surface encapsulates 10 for operation, arrange that anode and cathode assembly are to operate electrical signal conduction to they optical transmitting sets separately in couples.In the illustrated embodiment; Anode and cathode assembly 16,18,20,22,24,26 vertical curve are to extend to housing exterior and to extend along their shell end surface 36 and 38 downwards; And then vertical curve to be to form end 82,84,86,88,90,92, and its lower surface 30 along shell 12 extends.The surface towards outer of the end 82,84,86,88,90,92 of lead-in wire flushes the mechanical/electrical supporting construction 94 below conveniently being connected to the bottom of shell 12 basically, like PCB.
As preferably be shown among Fig. 3, can use any one in a plurality of known interconnection technique that comprises welding, with the lead-in wire end 82,84,86,88,90,92 (only the end the 86, the 88th, and is visible) electrical connection or join trace or the pad on the supporting construction 94 to.Be appreciated that in other embodiments, can with end 82,84,86,88,90,92 all or some crooked in the opposite direction, still make allowances simultaneously for mounted on surface.
As be preferably in and see among Fig. 1 and 2 that cavity 40 extends into the enough degree of depth of enclosure to expose attached pad and connection gasket 68,70,72,76,78,80.In a possible embodiment, each LED50,52,54 have its oneself contact to or electrode pair, said contact to or electrode pair be arranged such that LED is luminous when crossing over contact when applying the signal of telecommunication.The contact of LED is electrically connected to anode and cathode assembly is right.Guarantee that each LED50,52,54 has its oneself negative electrode and anode to having superiority, reason is a lot, as is easier to each LED electrical control is provided.
According to shown in the exemplary embodiment of embodiment, LED50,52,54 one of them Contact Coupled to chip carrier pad 68,70,72, and LED50,52, other Contact Coupled of 54 are to filling up 76,78,80.But be appreciated that alternatively carries chips of pad 76,78,80, pad 68,70,72 is electrically connected to pad 76,78,80.Can use different known configurations and method to make this connection, the closing line (wire bond) 95,97,99 that a kind of such structure is to use known method to apply.Although show a kind of possible closing line structure, be appreciated that structure according to each chip, various other suitable closing line structures also are fine.For example, the closing line more than can be arranged on a chip, a closing line is attached on the connection gasket, and other closing line is attached on the chip carrier pad.
Each LED50,52,54 can be through conduction and heat conduction grafting material 100, like scolder, adhesive, coating, film, sealant, paste, grease and/or other suitable material, with its one of them pad 68,70,72 electric coupling.In one embodiment, can use solder pads on the LED bottom with the LED electric coupling and be fixed on their pads separately.The manufacturing of connector component 16,18,20 and carrier body 22,24,26 possibly accomplished through punching press, injection moulding, cutting, etching, bending or through the combination of other known method and/or method, to realize desirable structure.For example, connector component and/or carrier body can be by metal stamping partly (for example by the single sheet of associated materials by the while punching press), and be suitably crooked, and at last form some or all after the shell by separation fully.
In some manufacturing approaches, can before moulding around the connection gasket and/or package shell 12, LED be coupled to pad 68,70,72.Replacedly, can after anode and cathode assembly are partly put into shell, LED be coupled to 68,70,72.The cavity 40 that extends into shell can be set, as through difform base section 41,, and allow LED through cavity 40 emission bright dippings in order that expose pad 68,70,72 and fill up enough parts of 76,78,80 holding LED and relevant closing line.
In conventional package, the anode of smooth surface and lead frame and the narrow path between the cathode assembly, and the top and the bottom of shell make that reliable bonding is difficult.The smooth surface of these cooperations and the narrow path between metal gap possibly reduce the fastness of reflector encapsulation, and use with manufacturing process as during refluxing owing to shell separates from lead frame, possibly increase the chance of component failure.In order to make encapsulation more solid, improve the structural intergrity of encapsulation through the bonding reliability that increases between shell and the lead frame.This can be through comprising one or more recesses, through hole, hole, extension and/or further feature anode component 16,18,20 and one or more realization the in the cathode assembly 22,24,26, it helps stability, integrality and/or the robustness of SMD encapsulation.In addition, can metal gap 102,104,106 and 108 be provided at all places between adjacent anode component and the adjacent cathode assembly, being seen narrow path is compared in these gaps and the conventional emitter encapsulation, has big and the width that changes.Compare with the encapsulation that does not comprise big metal gap, fill these gaps between these lead frame parts, to form thicker path and/or route segment by sheathing material laterly.
As preferably be shown among Fig. 7, anode component 16,18 and 18 and 20 can have bigger metal gap 102,104 between them, and cathode assembly 22 and 24 and 24 and 26 can have bigger metal gap 106 and 108 between them.When cast envelope material above lead frame 14; This sheathing material is inserted bigger metal gap 102,104,106,108 to produce wide path and/or route segment; Said path and/or route segment can improve the bonding between shell 12 and the lead frame 14, and improve the general structure integrality/fastness of encapsulation 10.Anode and cathode assembly can also comprise a plurality of characteristics, and like recess (not shown), through hole (not shown) or otch (like V-otch 110), it can be on the upper surface and lower surface of anode component 16,18,20 and cathode assembly 22,24,26.The characteristic of metal gap 102,104,106,108, through hole, recess, otch, bending lead and/or other this lead frame cooperates with shell and/or packing material, strengthens the structural stability and the integrality of encapsulation 10 at least in part.Sheathing material and/or packing material extend at least in part and/or these characteristics through lead frame to increase fastness.Under the situation of the characteristic of these types of not improving the encapsulating structure integrality, encapsulation during manufacture may damage or during encapsulation operation lead frame possibly separate with shell.
With reference now to Fig. 9-10,, shows some instances of the various size of component characteristics of reflector encapsulation 10.As an example rather than restriction, encapsulation 10 can have 3.20+/-total length 112 of 0.1mm, the overall width 114 of about 2.80mm, and 0.95+/-height 116 of 0.05mm.In other embodiments, length can be less than 3.20mm, less than 5.0mm or greater than 3.20mm.Overall width can be less than 2.80mm, less than 4.0mm or greater than 2.80mm.According to the possible embodiment of the reflector encapsulation of thin/low section, the height/thickness of encapsulation can change at 0.9-1.3mm, can be less than 0.95mm or can be less than 1.5mm.
Figure 11-18 shows another the possible embodiment according to the multiple love dart encapsulation 200 of the thin/low section of the utility model, and it can comprise SMD.This encapsulation 200 comprises the shell 212 with integrated-lead frame 214.Lead frame 214 comprises and is used to encapsulate a plurality of conductive connecting elements of 10 as previously mentioned.
Use three reflectors to describe encapsulation 200 below, and in the illustrated embodiment, arrange lead frame so that each reflector is driven by separately the signal of telecommunication.But be appreciated that the utility model also considered other layout of encapsulation and lead frame.Therefore, in the encapsulation 200 six conductive components are arranged, comprise first, second and third anode parts 216,218,220, and first, second and the 3rd cathode assembly 222,224,226.
Tapered through the reflector parts that makes cavity 240 and wherein inwardly carried towards enclosure, can strengthen the effect of reflection part (if comprising) and the angle of departure of encapsulation.As an example but be not restriction, and best being shown among Figure 18, the cavity angle 246 of about 90.0 degree can provide suitable and visual angle hope, if comprise reflector parts then the reflectivity of hope also can be provided.In another possible embodiment, the cavity angle of about 50.0 degree can provide suitable and visual angle hope.Still have some maybe embodiment,,, between the 50.0-90.0 degree and/or less than the cavity angle of 50.0 degree, suitable and visual angle hope can be provided greater than 90.0 degree less than 90.0 degree.
The degree of depth that in addition, can customize cavity 240 is to increase the visual angle of encapsulation.As an example but be not restriction, in the encapsulation of thin/low section of this embodiment, the degree of depth be 0.45mm+/-the loculus body 240 (as shown in Figure 18) of 0.05mm can provide visual angle hope, that increase.In another possible embodiment, the visual angle of hope can be provided less than the cavity depth of 0.45mm.Still have some maybe embodiment, the visual angle of hope can be provided greater than 0.45mm but less than the cavity depth of the total height of reflector encapsulation.
In certain embodiments, shell 212 can comprise stepped variation, and the size of the base section 213 of shell 212 is bigger than the top section 215 of shell 212.At least one purpose of this staged shell 212 is that the mechanical/electrical that makes the bottom of the encapsulation with lead frame member that it comprises can be installed to conventional size supports on (like PCB), simultaneously for the application of various hope can custom encapsulation top dimension.Like this, said supporter is gone up and be electrically connected to the supporter (for example PCB) that new encapsulation 200 can easily be mounted in use.Be appreciated that the encapsulation according to the utility model can comprise the variation of any amount and type so that the top dimension of shell 212 is different from the bottom size of shell 212.For example, in according to the encapsulation of the utility model, can comprise, perhaps also can consider gradual change, tilt variation more than two stepped.Preferably, the size of the bottom of cavity is than the size big at least 30% at the top of cavity
In certain embodiments, cavity 240 can be filled by packing material and/or covered by the sealant (not shown) as previously mentioned at least in part.In addition, shell 212 can comprise foregoing material and be formed as previously mentioned.
In described illustrative example, first, second and the 3rd LED250,252,254 are used in encapsulation 200, its each can launch same color with comparing of other light or the light of different colours.In this embodiment that illustrates, LED250,252,254 launches blue, red and green respectively, and therefore when suitably being powered up, producing through combination LED is FR color basically.Further, when suitably being powered up, LED250,252,254 can launch the white light combination of different-colour.Be appreciated that according to the utility model and in encapsulation, can use, and these LED launch the color or the color combination of any hope greater or less than 3 LED.
The same with encapsulation recited above 10, encapsulation 200 can comprise that protection does not receive the element (not shown) of ESD infringement.This element can comprise Zener diode, is arranged in parallel and compares the different LED that is reverse biased with led chip 250,252,254, mounted on surface rheostat and horizontal Si diode.When the many groups of use LED series coupled, only need an ESD element for the group of each series connection.
In the illustrative example that illustrates, the outwards outstanding apparent surface 236 and 238 who passes shell 212 of the anode of lead frame and cathode assembly 216,218,220,222,224,226.Anode component 216,218,220 is 236 extensions from the surface, and cathode assembly 222,224,226 238 extensions from the surface.When mounted on surface encapsulates 200 for operation, arrange that anode and cathode assembly are to operate electrical signal conduction to they optical transmitting sets separately in couples.In the illustrated embodiment; Anode and cathode assembly 216,218,220,222,224,226 vertical curve with extend to housing exterior and downwards along they shell end surface 236 and 238 and the base section 213 of shell extend; And then vertical curve to be to form end 282,284,286,288,290,292, and its lower surface 230 along the base section 213 of shell 212 extends.The surface towards outer of the end 282,284,286,288,290,292 of lead-in wire flushes the mechanical/electrical supporting construction below conveniently being connected to the bottom of shell 212 basically; Like the PCB (not shown), PCB comprises the electrical connections that conforms to end 282,284,286,288,290,292.
Cathode assembly 222,224,226 comprises center surface or pad 268,270,272 is installed; Be used to carry the led chip 250,252,254 that is linear array; It extends along the direction 274 perpendicular to side surface 232 and 234, and LED250,252,254 aligns along the central shaft of shell 212 usually.Compare the encapsulation that has otherwise the LED that arranges (as arranging in a cluster), this color uniformity of improvement at place, different horizontal visual angle that be arranged as makes allowances.Be appreciated that along the linear array that extends perpendicular to the direction of side surface 236,238 and make allowances for the color uniformity that improves at different places, vertical angle of view.
Anode component 216,218,220 stretches usually in parallel to each other, and cathode assembly 222,224,226 stretches usually in parallel to each other, all on the direction perpendicular to the direction 274 of linear led array, extends.
The contact of LED is electrically connected to anode and negative electrode is right.According to shown in the exemplary embodiment of embodiment, LED250,252,254 one of them Contact Coupled to chip carrier pad 268,270,272, and LED250,252, other Contact Coupled of 254 are to filling up 276,278,280.But be appreciated that alternatively carries chips of pad 276,278,280, pad 268,270,272 is electrically connected to pad 276,278,280.Closing line 295,297,299 can be used to make this connection.Although show a kind of possible closing line structure, 10 described about encapsulating like the front, various other suitable closing line structures also are possible.
According to shown in the exemplary embodiment of embodiment, LED50,52,54 one of them Contact Coupled to chip carrier pad 68,70,72, and LED50,52, other Contact Coupled of 54 are to filling up 76,78,80.Can use different known configurations and method to make this connection, the closing line 95,97,99 that a kind of such structure is to use known method to apply.
Like the front in greater detail; In order to increase the bonding reliability and the structural intergrity of encapsulation 200; One or more one or more recesses, through hole, hole, extension and/or further features of may further include in anode component 216,218,220 and the cathode assembly 222,224,226, it helps the stability, integrality and/or the robustness that encapsulate.In addition; Can metal gap 302,304,306 and 308 be provided at all places between adjacent anode component and the adjacent cathode assembly; Compare with the encapsulation that does not comprise big metal gap, fill these gaps between these lead frame parts, to form thicker path and/or route segment by sheathing material laterly.
As preferably be shown among Figure 16, anode component 216,218 and 218 and 220 can have metal gap 302,304 between them, and cathode assembly 222 and 224 and 224 and 226 can have metal gap 306 and 308 between them.When sheathing material is inserted metal gap 302,304,306,308, produce wide path and/or route segment, it can improve the bonding between shell 212 and the lead frame 214, and improves the general structure integrality/intensity of encapsulation 200.Anode and cathode assembly can also comprise a plurality of characteristics, like recess 314, through hole 312 or otch (for example the V-otch 310).The characteristic of metal gap 302,304,306,308, through hole 312, recess 314, otch 310, bending lead and/or other this lead frame cooperates with shell and/or packing material/sealant, strengthens the structural stability and the integrality of encapsulation 200 at least in part.Sheathing material and/or packing material/sealant extend at least in part and/or these characteristics through lead frame to increase fastness.Under the situation of the characteristic of these types of not improving the encapsulating structure integrality, encapsulation during manufacture may damage or be out of shape and/or during encapsulation operation lead frame possibly separate with shell.
With reference now to Figure 17-18,, shows some instances of the various size of component characteristics of reflector encapsulation 200.As an example rather than restriction, encapsulation 200 can have 6.0+/-total length 316 of 0.1mm, the overall width 318 of about 5.2mm, and 1.30+/-height 320 of 0.05mm.In other embodiments, length can be less than 6.0mm, less than 7.0mm or greater than 6.0mm.Overall width can be less than 5.20mm, less than 6.0mm or greater than 5.20mm.The top section 215 of shell 212 can have about 5.20mm, less than 6.0mm, less than 5.20mm or greater than the total length 322 of 5.20mm.The base section 213 of shell 212 can have greater than 5.20mm but be less than or equal to the total length of 6.0mm, or can be dimensionally greater than top section 215.The width of top section 215 can less than, be equal to or greater than the width of base section 213.According to the possible embodiment of the reflector encapsulation 200 of thin/low section, the height/thickness of encapsulation can change at 1.0-1.35mm, can be less than 1.35mm, can be greater than 1.30mm, and can be less than 1.8mm or can be less than 2.0mm.
With reference to figure 19a-21b, show curve chart, illustrated relative brightness according to vertical, the versicolor led chip that linear array is installed in the encapsulation of the reflector of the utility model.Figure 20 a and 20b have described the indigo plant according to the horizontal view angle, the relative brightness of red and green LED chip.Figure 21 a and 21b have described the indigo plant according to the vertical angle of view, the relative brightness of red and green LED chip.When these figure indications for as a result the time, being appreciated that to obtain other result according to the possible visual angle of the encapsulation of the utility model, if for example led chip in horizontal arrangement by linear array.
In light-emitting diode display according to the utility model, driver PCB can be provided, a plurality of SMD according to the utility model can be installed above that.SMD can be arranged in row and column, and each SMD confirms a pixel.SMD can comprise the reflector encapsulation, like those encapsulation by encapsulation 10 and 200 practical implementations.SMD can be electrically connected to trace or the pad on the PCB, and PCB is connected to handle and drive circuit in response to the suitable signal of telecommunication.As previously mentioned, each SMD carries the linear array of the vertical orientation of an indigo plant, red and green LED.Have been found that such linear orientation of LED is used for improving the fidelity of the color in wide angular field of view.But, be appreciated that each SMD can alternatively carry the linear array of the horizontal orientation of indigo plant, red and green LED.According to the utility model, LED can arrange with any linear precedence, and in the color combination of any hope, can provide and be less than or more than three LED.
Although illustrated and described several illustrative example of the utility model, for a person skilled in the art, a lot of distortion and alternate embodiment will appear, as the utility model being used for LED decorative lighting or analogue.This distortion and alternate embodiment can be taken into account, and can under the situation that does not break away from the spirit of liking the utility model that claim limits enclosed and scope, implement this distortion and alternate embodiment.
Claims (36)
1. a reflector encapsulation is characterized in that, comprising:
Shell, this shell comprises the cavity that extends into the inside of said shell from the top surface of said shell;
Be integrated into the conductive lead wire frame of said shell; With
Be arranged in a plurality of light emitting devicess on the current-carrying part of said lead frame, a plurality of parts of said light emitting devices and said lead frame are exposed through said cavity,
The bottom of wherein said cavity comprises the shape different with the top of said cavity, and the size of the bottom of wherein said cavity is than the size big at least 30% at the top of said cavity.
2. according to the reflector encapsulation of claim 1, it is characterized in that said lead frame further comprises:
A plurality of conductive cathode parts; And
The corresponding a plurality of conductive anode parts that separate with said cathode assembly,
Wherein said cathode assembly or said anode component carry at least one in the said light emitting devices, and in said anode component and the said cathode assembly each is electrically connected in the said light emitting devices.
3. according to the reflector encapsulation of claim 1, it is characterized in that said light emitting devices comprises the LED that arranges with linear array.
4. the reflector according to claim 2 encapsulates; It is characterized in that; In the said light emitting devices each comprises at least two contacts, and one of them contact is electrically coupled at least one in the said cathode assembly, and other contact is electrically coupled in the said anode component at least one.
5. according to the reflector encapsulation of claim 2, it is characterized in that:
Said light emitting devices becomes to extend along first direction with arranged in linear arrays;
Said anode component is arranged to parallel each other; With
Said cathode assembly is arranged to parallel each other,
Wherein said anode component extends upward in the second party vertical with said first direction with said cathode assembly.
6. according to the reflector encapsulation of claim 1, it is characterized in that said lead frame is made up of conducting metal or metal alloy.
7. according to the reflector encapsulation of claim 3, it is characterized in that said LED comprises the LED of a plurality of colors.
8. according to the reflector encapsulation of claim 2, it is characterized in that each in the said light emitting devices is attached to said cathode assembly or said anode component and passes through solder attachment to corresponding cathode assembly or anode component through closing line.
9. according to the reflector encapsulation of claim 1, it is characterized in that said shell is made up of plastics or resin.
10. according to the encapsulation of the reflector of claim 1, it is characterized in that said lead frame comprises one or more in the following characteristics: the metal gap between the adjacent part of through hole, otch, bending lead, side recess, side clasp or said lead frame.
11. the reflector encapsulation according to claim 7 is characterized in that said LED is vertical arrangement.
12. the reflector encapsulation according to claim 1 is characterized in that said cavity further comprises the degree of depth that is less than or equal to 0.5mm.
13. the reflector encapsulation according to claim 1 is characterized in that, said reflector encapsulation is included in the anti-UV sealant in this encapsulation.
14. the reflector encapsulation according to claim 13 is characterized in that said sealant comprises silicones.
15. the reflector encapsulation according to claim 13 is characterized in that the top of said sealant is put down.
16. the reflector encapsulation according to claim 1 is characterized in that said cavity is filled by packing material at least in part.
17. the reflector encapsulation according to claim 1 is characterized in that the shape of the bottom of said cavity is limited four arcs, and the shape at the top of said cavity is circular.
18. the reflector encapsulation according to claim 1 is characterized in that said cavity comprises reflector.
19. the reflector encapsulation according to claim 1 is characterized in that the height of said encapsulation is between 0.9-1.0mm.
20. the reflector encapsulation according to claim 1 is characterized in that the height of said encapsulation is less than 1.35mm.
21. the reflector encapsulation according to claim 1 is characterized in that, said reflector encapsulation comprises the one or more Zener diodes that are electrically connected to the lead frame part that is exposed.
22. a reflector encapsulation is characterized in that, comprising:
Shell, this shell comprises the cavity that extends into the inside of said shell from the top surface of said shell;
Be integrated into the lead frame of said shell; With
Be arranged in a plurality of light emitting devicess on a plurality of parts of the said lead frame that exposes through said cavity,
Wherein said shell comprises stepped, make the size of bottom of said shell greater than the size at the top of said shell, and the size of the bottom of said cavity is than the size big at least 30% at the top of said cavity.
23. the reflector encapsulation according to claim 22 is characterized in that, said reflector encapsulation further comprises the one or more Zener diodes that are electrically connected to the lead frame part that is exposed.
24. the reflector encapsulation according to claim 22 is characterized in that said lead frame further comprises:
A plurality of conductive cathode parts, each all carries in the said light emitting devices at least one; With
The corresponding a plurality of conductive anode parts that separate with said cathode assembly, each said anode component is electrically connected in the said light emitting devices,
Wherein each said light emitting devices is attached to corresponding cathode assembly through closing line, and each said light emitting devices is through solder attachment to corresponding anode parts.
25. according to the encapsulation of the reflector of claim 22, it is characterized in that, said light emitting devices comprise with linear array arrange multi-colored led.
26., it is characterized in that said lead frame comprises one or more in the following characteristics: the metal gap between the adjacent part of through hole, otch, bending lead, side recess, side clasp or said lead frame according to the encapsulation of the reflector of claim 22.
27. the reflector encapsulation according to claim 22 is characterized in that the degree of depth of said cavity is less than or equal to 0.5mm.
28. the reflector encapsulation according to claim 22 is characterized in that, said reflector encapsulation further comprises the Silicone Sealants in this encapsulation, and put down at the top of said sealant.
29. the reflector encapsulation according to claim 22 is characterized in that said cavity is filled by packing material at least in part.
30. the reflector encapsulation according to claim 22 is characterized in that said cavity comprises reflector.
31. the reflector encapsulation according to claim 22 is characterized in that the height of said reflector encapsulation is between 1.25-1.35mm.
32. the reflector encapsulation according to claim 22 is characterized in that the height of said reflector encapsulation is less than 2.0mm.
33. the encapsulation of the reflector of a low section is characterized in that, comprising:
Shell, this shell comprises the cavity that extends into the inside of said shell from the top surface of said shell;
Be integrated into the lead frame of said shell; With
Be arranged in a plurality of LED on the said lead frame with linear array, a plurality of parts of said LED and said lead frame are exposed through said cavity,
The height of wherein said encapsulation is less than 2.0mm, and the size of the bottom of said cavity is than the size big at least 30% at the top of said cavity.
34. the reflector encapsulation according to the low section of claim 33 is characterized in that the bottom of said cavity comprises the shape different with the top of said cavity.
35. the reflector encapsulation according to the low section of claim 33 is characterized in that said shell comprises stepped.
36. reflector encapsulation according to the low section of claim 33; It is characterized in that said lead frame comprises one or more in the following characteristic: the metal gap between the adjacent part of through hole, otch, bending lead, side recess, side clasp or said lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120187042.2U CN202142527U (en) | 2010-11-22 | 2011-05-27 | Emitter package |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2010/001864 WO2011127636A1 (en) | 2010-04-12 | 2010-11-22 | Surface mount device thin package |
| CNPCT/CN2010/001864 | 2010-11-22 | ||
| CN201120187042.2U CN202142527U (en) | 2010-11-22 | 2011-05-27 | Emitter package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202142527U true CN202142527U (en) | 2012-02-08 |
Family
ID=45553572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120187042.2U Expired - Lifetime CN202142527U (en) | 2010-11-22 | 2011-05-27 | Emitter package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202142527U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106653978A (en) * | 2017-03-24 | 2017-05-10 | 深圳成光兴光电技术股份有限公司 | Integrated patch LED |
| CN110139509A (en) * | 2018-02-09 | 2019-08-16 | 伊顿智能动力有限公司 | Configurable electron device package |
-
2011
- 2011-05-27 CN CN201120187042.2U patent/CN202142527U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106653978A (en) * | 2017-03-24 | 2017-05-10 | 深圳成光兴光电技术股份有限公司 | Integrated patch LED |
| CN110139509A (en) * | 2018-02-09 | 2019-08-16 | 伊顿智能动力有限公司 | Configurable electron device package |
| CN110139509B (en) * | 2018-02-09 | 2022-06-03 | 伊顿智能动力有限公司 | Configurable electronic device package |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210301 Address after: 516029 No.38, Hechang 6th Road East, Zhongkai high tech Zone, Huizhou City, Guangdong Province Patentee after: CREE HUIZHOU SOLID STATE LIGHTING Co.,Ltd. Address before: 516003 TCL Industrial Park, 21 Yunshan East Road, Jiangbei, Huizhou, Guangdong Patentee before: Cree Huizhou Opto Ltd. |
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| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120208 |
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| CX01 | Expiry of patent term |