CN202134534U

CN202134534U - Conductive lead frame and light emitting device package

Info

Publication number: CN202134534U
Application number: CN 201120187068
Authority: CN
Inventors: C·K·A·陈; Y·K·V·刘; X·王; D·埃默森
Original assignee: Cree Huizhou Opto Ltd
Current assignee: Cree Huizhou Solid State Lighting Co Ltd
Priority date: 2011-05-27
Filing date: 2011-05-27
Publication date: 2012-02-01
Anticipated expiration: 2021-05-27

Abstract

The utility model discloses a conductive lead frame for a package of multiple light emitting devices and a light emitting device package. The conductive lead frame comprises multiple conductive cathode portions and multiple conductive anode portions separately corresponding thereto, wherein each of the conductive cathode portions has an adhesion solder pad for bearing at least one light emitting device, and each adhesion solder pad is electrically coupled to at least one light emitting device thereof; each of the anode portions has a connecting solder pad configured to be electrically connected to the at least one light emitting device; the adhesion solder pad and the connecting solder pad are configured to keep the light emitting devices linearly aligned; and at least half of the surface area of the lead frame is visible through the housing of the light emitting device package. The array of the light emitting device package can be used in an LED display, such as an indoor and/or outdoor LED screen, so as to increase the color fidelity and heat radiation, improve the current control, and enhance the rigid of a packaging component.

Description

Conductivity lead frame and light body

Technical field

The utility model is usually directed to conductivity lead frame and multiple optical device packaging body, more specifically, relates to the mounted on surface packaging body with a plurality of photophores, and said a plurality of photophore alignment are to improve uniformity of luminance.

Background technology

Recent years, light-emitting diode (LED) technology has had huge improvement, thereby has introduced the brightness with increase and the LED of color fidelity.Because these improved LED and improved image processing techniques, significantly, panchromatic LED video screen is available and be widely used now.Significantly light-emitting diode display generally includes the combination of each LED panel that the image resolution ratio that is determined by the distance between neighbor or " pel spacing " is provided.

Be used for the outdoor display that farther distance watches, can have big relatively pel spacing and generally include discrete led array.In discrete led array, the ruddiness, green glow and the blue-ray LED that drive independent installation are bunch to form the full-color pixel for the beholder.On the other hand, indoor screen, it needs shorter pel spacing for example be 3mm or littler, can comprise the light body of have a plurality of surface mounted devices (SMD or a plurality of SMD) or other type, wherein each limits a pixel.Each light body can carry ruddiness, green glow and blue light emitting LED, and the light combination of their emissions is to produce the light of required wavelength or color.

Indoor and outdoor display all can be watched in the scope of sizable off-axis angle usually, for example reaches 145 ° or even bigger.LED in some traditional light bodies can suffer the different characteristics of luminescences in different viewing angles.LED in these packaging bodies can be provided with cluster near the central authorities of packaging body or central authorities, and in different viewing angles, luminous the most outstanding near beholder's specific LED.For example, if making red-light LED watch this packaging body near beholder's angle, luminous more outstanding when this ruddiness can be than this packaging body of direct viewing.This maybe be suitable equally to blue light and green light LED.Therefore, the color that is produced by packaging body is felt according to viewing angle differently.

Traditional light body possibly also can be subjected to along with viewing angle increases the problem that color fidelity has significantly sacrificing.In addition, the material of each packaging body and/or be used for is installed each LED at packaging body material possibly have reflection characteristic, and it can further reduce color fidelity through producing undesired light reflection and/or dazzle.

No matter light body such as SMD comprises integrated circuit or discrete parts such as diode or power transistor, all can produce significant heat, particularly in high-power component.This heat need be left to prevent too early component degradation or inefficacy usually.This possibly need extra thermal management component distributing enough heats, thereby the working temperature that maintains the knot side of source circuit or parts is lower than target temperature (for example, 110 ℃ or following).The various thermal management policy that comprise the heat conduction transmission are extensively adopted.A kind of conventional method for electronic packing body heat radiation enforcement heat conduction transmission is to allow heat to conduct along the lead-in wire of device.But lead-in wire does not usually have enough quality or exposed surface area so that effective heat radiation to be provided.For example, mainly the radiative high-brightness LED of visible light part can produce a large amount of heat in electromagnetic spectrum, uses this conventional art to be difficult to it is left.

The utility model content

The utility model provides a kind of light body lead frame, light body and the inhomogeneity LED screen of improved color emission of different viewing angles is provided.The utility model also provides the light body, the packaging body operation of the rigidity of the Current Control of photophore, packaging body assembly and waterproof in its packaging body that allows to improve.

Be used for multiple optical device packaging body the conductivity lead frame one embodiment comprises a plurality of conductivity negative pole parts, its each have the attach pad that is used to carry at least one luminescent device, each attach pad electrical couplings is to its at least one luminescent device.Offer with each cathode portion and to be equipped with corresponding a plurality of conductivity anode portion, each of said anode portion has connection pads, and said connection pads is arranged to allow to be electrically connected to luminescent device.Wherein attach pad and connection pads are arranged to keep the luminescent device linear alignment.

According to the housing that one embodiment comprises of the light body of the utility model, this housing has the cavity that extends to enclosure interior from the housing upper surface.Comprising with housing becomes whole lead frame, and this lead frame comprises the conductive part that keeps a plurality of luminescent device linear alignment, and said a plurality of luminescent devices are luminous outside said cavity.This lead frame also allows through this lead frame the signal of telecommunication to be applied to luminescent device.

The substrate that carries the light volume array that one embodiment comprises according to the light emitting device display of the utility model.The luminescent device that each light body comprises housing and comprises linear alignment.The drive circuit that comprises electrical connection, it is used for optionally the light volume array being powered up on said display, to produce visual image.

The utility model provides a kind of conductivity lead frame that is used for multiple optical device packaging body; Said conductivity lead frame comprises: a plurality of conductivity negative pole parts; Each has the attach pad that is used to carry at least one luminescent device, wherein each attach pad with its corresponding luminescent device electric coupling; Corresponding a plurality of conductivity anode portion of separating with said negative pole part; In the said anode portion each has connection pads; Said connection pads is arranged to and can be electrically connected with one of said luminescent device; Wherein said attach pad and said connection pads are arranged to keep the luminescent device linear alignment, the surface area of wherein said lead frame half at least through the cavity in the housing of said light body it is thus clear that.

Further, said luminescent device is suitable for energising with the panchromatic scope of combination results.

Further, said luminescent device comprises LED.

Further, said LED comprises at least two contacts, the electric coupling of one of one of them and said attach pad and wherein one of another and said connection pads electric coupling.

Further; The linear array of luminescent device extends upward in first party; And each relation that is set to be parallel to each other in the said anode portion; And the relation that said negative pole part is set to be parallel to each other, and extend with the direction of said first direction quadrature on each edge in said negative pole part and the said anode portion.

Further, said anode portion and negative pole part are processed by sheet metal.

Further, said LED comprises ruddiness, green glow and blue-ray LED.

Further, each among the said LED is through wire-bonded and connection pads electric coupling.

Further, each in the said light-emitting diode is through scolder and corresponding attach pad coupling.

Further, said lead frame further comprises dark color and/or black ceramic housing.

Further, said lead frame further comprises through hole.

Further, said lead frame further comprises V-notch.

The utility model provides a kind of light body, and it comprises: housing comprises the cavity that extends to the inside of said housing from the end face of said housing; And become whole lead frame with said housing; Said lead frame comprises the conductive part that keeps a plurality of luminescent devices; Said a plurality of luminescent device linear alignment is also launched light outside said cavity; Said lead frame also makes it possible to through said lead frame the signal of telecommunication is applied to said luminescent device, and the surface area of wherein said lead frame half at least is through said cavity and visible.

Further; Said lead frame comprises a plurality of conductivity negative pole parts; Each conductivity negative pole part has the attach pad that is used to carry at least one said luminescent device; Each said attach pad with its corresponding said luminescent device electric coupling, said lead frame also comprises corresponding a plurality of conductivity anode portion of separating with said negative pole part, each in the said anode portion has connection pads; Said connection pads is arranged so that and can be electrically connected with one of said luminescent device that wherein said attach pad and connection pads are arranged to keep the luminescent device linear alignment.

Further, said luminescent device comprises LED, and said LED is suitable for energising with the panchromatic scope of combination results.

Further, said lead frame is arranged to allow the mounted on surface of said packaging body.

Further, said lead frame further comprises through hole and/or V-notch, and said through hole and said otch improve the resistance to overturning of surface mounted device and make the said surface mounted device can waterproof.

Further, said device further comprises the heat conductor that extends through said supporting body at least in part.

Further, said LED comprises ruddiness, green glow and blue-ray LED.

Further, said second electric terminal of each said photophore is through wire bond and connection pads electric coupling.

The utility model provides a kind of light emitting device display, and it comprises: be loaded with the substrate of light volume array, the LED that each said light body comprises plastic casing and comprises linear alignment; And the drive circuit that is electrically connected, in order to selectivity said array is applied electric power on said display, to produce visual image.

Further, said light body is with vertical row and horizontal line setting.

Further, each the said LED in the said light body is driven by separately the signal of telecommunication.

Further, said LED is suitable for switching on the panchromatic scope of combination results and limits a pixel of said display.

Further, each said light body is through the bond pads and the coupling of said substrate of each light body bottom surface.

Further, when watching said display, said bond pads is invisible.

Further, each said light body is a waterproof, makes said display in indoor and outdoor use, all can use.

Further, the said LED at least some said light bodies is a vertical alignment.

The utility model provides a kind of light body, and it comprises: housing comprises the cavity that extends to the inside of said housing from the end face of said housing; And become integral body with said housing and join the lead frame of said housing to; Said lead frame comprise support a plurality of outside said housing the conductive part of radiative luminescent device; Said lead frame further comprises a plurality of characteristics or shape; Said characteristic or shape match with said housing not having the packaging body of said characteristic and shape and between said lead frame and housing, to provide improved waterproof to be rigidly connected than the lead frame that is had, and the surface area of wherein said lead frame half at least is through said cavity and visible.

Further, said characteristic or shape comprise the through hole in the said lead frame.

Further, said characteristic or shape are included in the V-notch in the said lead frame.

Further, said characteristic or shape comprise the side breach.

Further, said characteristic or structure comprise lateral process.

Conductivity lead frame that is used for multiple optical device packaging body and light body according to the utility model can be used for light-emitting diode display; In indoor and/or outdoor LED screen, it makes it possible to increase color fidelity and heat radiation, improves the rigidity of Current Control, increase package assembling.

Description of drawings

To those skilled in the art, these of the utility model will become from the following detailed description that combines accompanying drawing obviously with other additional features and advantage, wherein:

Fig. 1 is the perspective view according to the surface mounted device of the utility model;

Fig. 2 is the vertical view of embodiment shown in Fig. 1;

Fig. 3 is the sectional view of embodiment among the Fig. 1 that sees along Fig. 2 center line 3-3;

Fig. 4 is the upward view of embodiment shown in Fig. 1;

Fig. 5 is the left side view of embodiment shown in Fig. 1, and the right side is similar basically;

Fig. 6 is the front view of embodiment shown in Fig. 1, and dorsal part is similar basically;

Fig. 7 is the perspective view of an embodiment of the lead frame that can in Fig. 1, use in the device;

Fig. 8 is the end view of lead frame shown in Fig. 7;

Fig. 9 is the sectional view along lead frame among Fig. 8 of hatching 9-9 intercepting, and shows the through hole of lead frame;

Figure 10 is the sectional view along lead frame among Fig. 8 of hatching 10-10 intercepting, and shows the lead frame V-notch;

Figure 11 be according to another embodiment of the surface mounted device of the utility model, along the sectional view of the line shown in Fig. 3;

Figure 12 is the upward view of embodiment shown in Figure 11;

Figure 13 is the end view of embodiment shown in Figure 11;

Figure 14 is the top perspective view according to an embodiment of the surface mounted device of the utility model;

Figure 15 is the front view of embodiment shown in Fig. 1, and dorsal part is similar basically;

Figure 16 is an isometric front view embodiment illustrated in fig. 15; And

Figure 17 be comprise according to the LED display of the surface mounted device of the embodiment of the utility model the front view at a position.

Embodiment

The utility model is provided for the structure of multiple optical device packaging body, and it allows packaging body luminous with improved color homogeneity at different viewing angles through at packaging body internal linear alignment photophore.In one embodiment, photophore vertical alignment, but should be appreciated that in different application, photophore can horizontal alignments or with an angular alignment.In certain embodiments, packaging body also can have lead frame structure, and it allows each photophore in packaging body to be driven by its oneself the signal of telecommunication.This is for to allow some leeway to the color of light light that body sends and the improved control of intensity.

Among the embodiment according to the light body of the utility model, photophore can be included in the packaging body centerline or near redness, green and the blue-light-emitting device of vertical alignment it, so that red, green consistent mutually with blue viewing angle.Compare with the packaging body that has the cluster photophore in the prior art, this allows the color of light body to seem more even in different viewing angles.Light body according to the utility model can comprise that also lead frame remains potted the housing of body waterproof with helping, and also comprises the characteristic of improving the packaging body rigidity, such as through hole.

The utility model can be applicable to dissimilar light bodies, surface mounted device (SMD) for example, and it can be used in many different illumination application, such as LED color line screen or decorative lighting and the application that needs the waterproof device.Below described and utilized light-emitting diode, but should be appreciated that other light body embodiment can use dissimilar photophores as the different embodiment of the light body of their photophores.

Be to be understood that; When an element is called as " on another element ", " being connected to another element ", " being coupled in another element " or " contacting another element "; It can be directly on this another element, be connected in or be coupled in or contact this another element, perhaps can have the insertion element.By contrast, when an element is called as " directly on another element ", " being directly connected in ", " being coupled directly to " or " directly contact " another element, there is not the insertion element.Same, when first element is called as " electrically contacting " or " being electrically coupled to " second element, between this first element and this second element, there is the power path that allows electric current to flow.This power path can comprise capacitor, coupled inductors and/or other element that allows electric current to flow, even not directly contact between conducting element.

Though first, second grade of term is used to describe various elements, parts, zone and/or part here, these elements, parts, zone and/or part are not limited by these terms.These terms only are used for an element, parts, zone or part and the difference mutually of another element, parts, zone or part.Therefore, first element of discussing below, parts, zone or part can be called as second element, parts, zone or part, and do not deviate from the instruction of the utility model.

The embodiment of the utility model reference herein describes as the cross-sectional view diagram of the schematic illustration of the utility model embodiment.Therefore, the actual (real) thickness of parts can be different, and, because for example manufacturing technology and/or tolerance and be not both expection with illustrated shape.The embodiment of the utility model should not be understood as that and be limited to the given shape in diagram zone here, but should comprise the deviation in shape that causes owing to for example making.The zone that illustrates or be described as square or rectangle is usually owing to normal fabrication tolerance has circle or curvilinear characteristic.Therefore, the zone shown in the accompanying drawing comes down to schematically, and its shape is not intended to represent the accurate shape in the zone of device, and is not intended to limit the scope of the utility model.

Following description explanation preferred embodiment.This description is not only to be in order to describe the General Principle of the utility model for restriction, and the scope of the utility model is further understood by appended claim.

Fig. 1-8 shows an embodiment according to the multiple optical device packaging body 10 of the utility model, and it comprises surface mounted device (SMD) 10.As stated, be appreciated that the utility model can be used for the light body of other type except SMD.Packaging body 10 comprises the housing 12 that is loaded with whole lead frame 14.This lead frame 14 comprises a plurality of conductivity connecting portions, is used for the photophore with electrical signal conduction to this packaging body, and the heat that also helps dissipation to be produced by photophore.

This lead frame 14 can use many different modes to be provided with and the embodiment of different packaging bodies in adopt the parts of varying number.Following this packaging body 10 uses three photophores, and in the embodiment shown, and this lead frame is arranged so that each photophore is driven by separately the signal of telecommunication.Correspondingly have six conductive parts in an illustrated embodiment, comprise the pair of conductive portion that is used for each photophore, the signal of telecommunication puts on this photophore through that of each reflector to conductive part.For packaging body 10, conductive part comprises first, second and

third anode portion

16,18,20, and each all has first, second and the 3rd

negative pole part

22,24,26 (best image among Fig. 7) of photophore attach pad.

Housing 12 can have many different shape and size, is roughly square or rectangle in the embodiment shown, has upper surface 28 and lower surface 30,

side

32 and 34 and end face 36 and 38.The top of this housing further comprises groove or cavity 40, and it extends into from upper surface 28 in the body of housing 12 to lead frame 14.Photophore is arranged on the light that makes photophore send on the lead frame and passes cavity 40 and launch from packaging body 10.In certain embodiments, the reflection insert or encircle 42 (shown in Fig. 1-3) can be along the side of cavity 40 or at least a portion of wall 44 location and fixing.Encircle 42 reflectivity validity and packaging body the angle of departure can through make cavity 40 be stated from its inner ring 42 and narrow down gradually towards the inside of housing and strengthen.Mode by way of example but be not to limit shows like Figure 15 best, and the reflector angles 46 of about 50 degree provides suitable reflectivity and watched the angle.

In certain embodiments, cavity 40 can at least partly be filled with packing material 48, and packing material 48 can be protected and firmly locate lead frame 14 and its photophore that is loaded with.In some cases, this packing material 48 can cover photophore and lead frame 14 through cavity 40 exposed portions.This packing material 48 can be chosen to have predetermined optical characteristics with the ejaculation of enhancing light from LED, and its light that photophore of packaging body is launched is transparent basically in certain embodiments.This packing material 48 also can have shape, for example hemisphere or bullet shaped, or packing material can be recessed in the cavity 40 wholly or in part.This packing material 48 can be formed by resin, epoxy resin, thermoplastic condensed polymer, glass and/or other suitable material or combination of materials.In certain embodiments, can material be added in this packing material 48 to strengthen from LED and/or to emission, absorption and/or the chromatic dispersion of the light of LED.

Housing 12 can be with preferably not only electric insulation but also heat conducting material made.This material is being known in the art and can including, but not limited to some pottery, resin, epoxy resin, thermoplastic condensed polymer's (for example polyphthalamide (PPA)) and glass.In a preferred embodiment, housing 12 can be processed by (one or more) ceramic material of dark color or black, can improve the contrast that image produces the SMD packaging body, the SMD that for example in video display, adopts because it comes to light.Packaging body 10 and housing 12 thereof can form and/or assemble through the one of any of the various known method concerning this area, known.For example, housing 12 can for example form around

anode portion

16,18,20 and

negative pole part

22,24,26 through injection molding or be molded.Optional, housing can divide several parts to form, for example, top and bottom, wherein

anode portion

16,18,20 and

negative pole part

22,24,26 are formed on the bottom.Top and bottom can use known method and material to be bonded together, for example through epoxy resin, adhesive or other suitable grafting material.

In described illustrative example, packaging body 10 uses first, second and the 3rd LED50,52,54, and each LED can send the light of same color or the light of different colors from one another.In an illustrated embodiment,

LED

50,52,54 launches blue light, green glow and ruddiness respectively, so when switching on suitably for said LED, said LED can the panchromatic substantially scope of combination results.Further, when suitable energising, LED50,52,54 sends the white light combination of different-colour.

LED structure, characteristic and manufacturing thereof and operation are known in this area usually, here only briefly discuss.LED can have a plurality of different semiconductor layers that are provided with by different way and can send various colors.The layer of LED can enough known technology be made, and a kind of suitable technology is to use metal-organic chemical vapor deposition equipment (MOCVD) to make.The layer of led chip generally includes the active layer/district between first and second epitaxial loayers that are clipped in the phase contra-doping, and all these layer/districts order on growth substrate or wafer forms.The led chip that is formed on the wafer can use by singleization and in different application, for example is installed in the packaging body.Be appreciated that a part or growth substrate that growth substrate/wafer can be left the LED of final singleization can remove wholly or in part.

Be appreciated that equally among the LED also can comprise extra play and element that said extra play includes but not limited to resilient coating, nucleating layer with element, contacts and current extending and light-extraction layer and element.Active area can comprise single quantum well (SQW), MQW (MQW), double heterojunction or superlattice structure.

Active area and doped layer can be processed by the material different system, and a kind of such system is an III nitride material system.The III group-III nitride refers to those semiconducting compounds of forming by between nitrogen and the cycle Table III family element (being generally aluminium (Al), gallium (Ga) and indium (In)).This term also refers to ternary and quaternary compound, such as aluminium gallium nitride alloy (AlGaN) and aluminum indium nitride gallium (AlInGaN).In a preferred embodiment, doped layer is that gallium nitride (GaN) and active area are InGaN.In alternative, doped layer can be AlGaN, aluminum gallium arsenide (AlGaAs) or phosphorus aluminium arsenide gallium indium (AlGaInAsP) or AlGaInP (AlInGaP) or zinc oxide (ZnO).

Growth substrate/wafer can be processed by many materials; Such as silicon, glass, sapphire, carborundum, aluminium nitride (AlN), gallium nitride (GaN); Suitable substrate is the many types of carborundum of 4H, also can use but other carborundum is many types of, comprises that 3C, 6H and 15R are many types of.Carborundum has some advantage, for example than sapphire, and the lattice match more close and produce higher-quality III nitride films with the III group-III nitride.Carborundum also has very high thermal conductivity, makes the gross output in the III nitride devices on the carborundum can not receive the restriction (and this is for some device that is formed on the sapphire, just has this situation) of substrate heat radiation.The SiC substrate can from the Cree Research, Inc of the Durham of the North Carolina state (Cree Research Inc.) obtains, the method for producing them be recorded in the scientific and technical literature and U.S. Pat 34,861, US 4,946,547 and US 5,200,022 in.

LED also can comprise additional characteristic, and such as current-dispersing structure, current extending and the wire bond pads of conduction, all these can be made by the known material with known method deposition.Some or all of LED can apply one or more fluorescent materials, and said fluorescent material absorbs the light of at least some LED and sends the light of different wave length, makes LED launch the combination from the light of LED and fluorescent material.Led chip can use many diverse ways to apply fluorescent material; A kind of suitable method is 11/656 at sequence number; 759 and 11/899; Describe in 790 the U.S. Patent application, the two title is " Wafer Level Phosphor Coating Method and Devices Fabricated Utilizing Method (wafer scale fluorescent material painting method and the device that utilizes this method to make) ", and all is incorporated among this paper by reference at this.Optional; LED can utilize other method to apply; Such as electrophoretic deposition (EPD); A kind of suitable EPD method is at the U.S. Patent application No.11/473 that is entitled as " Close Loop Electrophoretic Deposition of Semicoductor Devices (the closed loop electrophoretic deposition of semiconductor device) ", describes in 089, and it is incorporated among this paper at this equally by reference.In addition, LED can have vertical or lateral geometry known in the art.Those LED that comprise vertical geometry can have in contact of first on the substrate and second contact on p type layer.The signal of telecommunication that is applied to first contact is expanded in the n type layer, and the signal extension that is applied to second contact is advanced in the p type layer.Under the situation of III nitride devices, thin common cover part of semitransparent layer or whole p type layer, this is well-known.Be appreciated that second contact can comprise such layer, it typically is such as the metal of platinum (Pt) or such as the transparent conductive oxide of indium tin oxide (ITO).

LED also can comprise lateral geometry, and wherein two contacts are all on the LED top.For example remove the part of p type layer and active area, to be exposed to the contact table top on the n type layer through etching.The second horizontal n type contact is provided on this table top of n type layer.Said contact can comprise the known materials of utilizing the well known deposition techniques deposition.

Shown in illustrative embodiment in, the anode portion 16,18,20 of lead frame and negative pole part 22,24,26 pass housing 12 opposed 36 and 38 outwards the protrusion.Illustrate best like Fig. 4, anode portion 16,18,20 is 36 extensions from the surface, and negative pole part 22,24,26 38 extensions from the surface.Anode portion and negative pole part are arranged to work in couples with when packaging body 10 is carried out work by mounted on surface, and conducting electrical signals is to its optical transmitting set separately.In an illustrated embodiment; Anode portion 16,18,20 and negative pole part 22,24,26 vertical curve with the end face 36 of the housing that extends to them and 38 outside and along said end face 36 and 38 to extending below, then again vertical curve to form the end 82,84,86,88,90,92 of extending along the lower surface 30 of housing 12.The end 82,84,86,88,90,92 of lead-in wire is concordant substantially so that the substrate below being connected to towards the surface of outside.Illustrate best like Fig. 3, any technology in the multiple known interconnection technique that comprises in being welded on can be used in the end 82,84,86,88,90,92 of lead-in wire (only the end the 86, the 88th, and is visible), is electrically connected or joins to trace or pad on the substrate 94.Be appreciated that all ends 82,84,86,88,90,92 or some bendings round about wherein in other embodiments, and still allow some leeway for mounted on surface.

Negative pole part

22,24,26 comprises that central surface or

installation pad

68,70,72 are used to carry the led

chip

50,52,54 that extends into linear array along the direction 74 that is orthogonal to

side

32 and 34, and

LED

50,52,54 aligns along the axis of housing 12 usually.Than the packaging body of the LED that has otherwise (for example, cluster) setting, this alignment allows to have improved color homogeneity in different viewing angles.

Pad

68 and 78 is installed is extended towards the central authorities of housing 12, this allows

LED

50,54 more to install near the central authorities of housing 12, so that it can launch cavity 40 with

light.Anode portion

16,18,20 comprises respectively and is electrically connected

pad

76,78,80, is positioned at and the adjacent but separated position of

pad

68,70,72 is

installed.Connection pads

76 and 80 is extended to allow to be electrically connected to

LED

50,54 towards the center of housing 12, and

LED

50,54 more installs near housing 12 centers through the extension that

pad

68,70 is installed.

Anode portion 16,18,20 is advanced usually in parallel with each other and negative pole part 22,24,26 is advanced usually in parallel with each other, and extend with the direction of direction 74 quadratures of linear led array on their whole edges.Lead-in wire can have different widths and can be enough little, and when packaging body 10 was watched at the top, its minimum degree ground was visible or invisible with box lunch.Additional and/or conduct is replaced, and when the top is watched, goes between and can be covered by housing 12.Illustrate best like Fig. 1 and 2, cavity 40 extends to the enough degree of depth of enclosure interior to expose attach pad 68,70,72 and connection pads 76,78,80.In a preferred embodiment, LED50,52,54 each have its oneself contact to or electrode pair, said contact to or electrode pair to be arranged to when in said contact, applying the signal of telecommunication LED luminous.The contact of LED is electrically connected with paired anode portion and negative pole part.Owing to multiple reason, the easier electric control to each LED for example is provided, negative electrode and the anode that each that guarantee LED 50,52,54 has himself is to being favourable.According to shown in the exemplary embodiment of embodiment, one of contact of LED 50,52,54 is coupled in chip bearing pad 68,70,72, and in the contact of LED another is coupled in pad 76,78,80.Different known structure can be used to make this with method and be connected, and a kind of such structure is the bonding wire 95,97,99 that utilizes known method to use.

Anode portion

16,18,20 and

negative pole part

22,24,26 can be made by conducting metal or metal alloy, are for example processed by copper, copper alloy and/or other suitable low-resistivity, corrosion-resistant material or combination of materials.As previously mentioned, to a certain extent, the thermal conductivity of lead-in wire can help heat is conducted from the

LED

50,52,54 that SMD carried, as along shown in the arrow 98.Illustrate best like Fig. 7, for further helping heat radiation, anode portion 18 can comprise the part near the expansion of shell rim with negative pole part 24.The part of these expansions provides the surface area of increase being opened by the spread heat that LED 50,52,54 produces.

Among the

LED

50,52,54 each can be through the grafting

material

100 and 68,70,72 electric coupling of an one of which pad of conduction and heat conduction, and this grafting material is such as being scolder, adhesive, coating, film, sealant, paste, grease and/or other suitable material.In a preferred embodiment, use the bond pads that is positioned on the LED bottom and to be fixed on its pad separately, make and can't see scolder from the top with the LED electric coupling.The manufacturing of

connector portion

16,18,20 and supporting

part

22,24,26 can be accomplished through punching press, injection molding, cutting, etching, bending or through the combination of other known method and/or method, to realize required structure.For example, connector portion and/or supporting part can be by part metals punching press (for example from the while punching press of monolithic associated materials), suitably crooked and separation or separation fully after partly or entirely housing forms fully at last.

In some manufacturing approaches, LED can be in before connection pads molded about and/or assemble case 12, being coupled to pad 68,70,72.Optional, can after part has been packed in the housing, LED be coupled to pad 68,70,72 at anode portion and negative pole part.The cavity 40 that extends into housing can be arranged such that

pad

68,70,72 and

pad

76,78,80 enough parts expose, and holding LED and relevant bonding wire, and the light that permission LED launches passes cavity 40 outgoing.

In the conventional package body, the smooth surface between the

anode portion

16,18,20 of lead frame and the upper and lower of

negative pole part

22,24,26 and housing 12 makes and is difficult to reliable bonding.These supporting smooth surfaces possibly reduce the rigidity of light body, and possibly separate with lead frame owing to housing, and increase the probability of component failure.This smooth surface is also allowed some leeway for the permeation pathway of moisture entering housing.This also can cause component failure, and can reduce the ability that the light body need to be used to the application of waterproof operation.Operate with rigidity and for waterproof and allow some leeway for increasing the bonding reliability, one or more in

anode portion

16,18,20 and the

negative pole part

22,24,26 may further include one or more breach, through hole, hole, extension and/or other helps the characteristic of stability, integrality and/or the robustness of SMD packaging body.These characteristics also make housing 12 and/or packing material 48 better to combine with lead frame 14, and this prevents the moisture vapour transmission device and allows some leeway for waterproof use.

Show best that like Fig. 7 and 9

anode portion

16,18,20 and

negative pole part

22,24,26 can comprise through hole 102,104,106,108,110,112 separately, these through holes are usually located on the end face of lead frame.Show best like Fig. 7 and 10, anode portion and negative pole part also can comprise such as with the characteristic of the V-notch 114 of the adjacent setting of through hole.This V-notch 114 can be positioned on the upper surface and lower surface of

anode portion

16,18,20 and

negative pole part

22,24,26.Other this characteristic of through hole 102,104,106,108,110,112, V-notch 114, breach and/or lead-in wire at least in part with housing and/or packing material cooperation, strengthen the structural stability and the integrality of packaging body 10.In some embodiments, case material and/or packing material extend into and/or pass one or more in the through hole 102,104,106,108,110,112 that forms in the lead-in wire at least in part, to increase rigidity.Housing and/or packing material also can be filled V-notch with the increase rigidity, and stop liquid to be penetrated into the inside of packaging body 10.

With reference to Fig. 7, be rigidity that further strengthens packaging body 10 and the reliability that increases combination between housing 12 and the lead frame 14,

anode portion

16,20 and

negative pole part

22,26 can have side breach 115 so that they have waveform.When manufacturing and encapsulation body 10, case material is filled breach, and the case material of sclerosis and breach cooperation are to remain on housing 12 on the lead frame.Similarly, anode portion 18 has lateral process (tab) 117 with negative pole part 24, its also with the housing of sclerosis or packing material cooperation so that housing 12 is remained on the lead frame 14.

Figure 11-13 illustrates another embodiment according to the light body 200 of the utility model, and it is mounted on surface equally.Packaging body 200 overwhelming majority with shown in Fig. 1-8 and the packaging body of describing in the above 10 similar, just also comprise heat conductor 202,204,206.Heat conductor 202,204,206 is arranged in the housing 208 so that the thermally conductive pathways from LED to the housing lower surface to be provided.Said heat conductor can further be arranged to exchange with one or more radiator heats, effectively from LED, to dispel the heat.Packaging body 200 can use with the many different radiators with many different modes settings together.

Heat conductor 202,204,206 can have many shape and size, and can comprise, for example vertical extent also at least partly passes the rectangular block or the cylinder of housing 208.In an illustrated embodiment, heat conductor 202,204,206 extends through housing 208 and arrives housing lower surface 212 from the surface with LED.Show best that like Figure 11 the hole 210 in the underrun lower surface 212 of heat conductor 204 exposes at lower surface 212 places and is set to concordant with lower surface 212 substantially.Shown in figure 12,

heat conductor

202 and 206 also can expose at the place, bottom surface.The basal surface of heat conductor is set to and radiator or 214 one-tenth thermally conductive relations of heat dissipation device of carrying such as the substrate of printed substrate or circuit board 216.Heat conductor, given their big relatively quality and the cross-sectional area vertical with direction of heat flow, can be used as is effectively heat sinkly providing low thermal resistive path (arrow 218) by carrying between heating LED that pad carries and the radiator 214.Some heats also distribute along lead-in wire (arrow 220).

Similar with packaging body 10, the packaging body 200 shown in Figure 11-13 comprises preferred dark color or black ceramic housing 208, and this housing 208 comprises relative upper surface 222 and lower surface 212, side 208,224 and end face 226,228.The SMD 200 that carries lead frame 230 comprises, as previously mentioned, and three anode portion, three negative pole parts.But, as above preferred embodiment, should be appreciated that connecting portion, supporting part and other lead frame part of any amount can be used in needed application, and do not break away from the scope of the utility model.Chip bearing portion 218 comprises surface or the pad that is used to hold led chip, and said led chip generally includes ruddiness, green glow and blue-ray LED, and the LED of other various other colors also can use.As previously mentioned, connecting portion comprises the wire bond pads of the expansion that is arranged in but separated zone adjacent with chip bearing portion.

As previously mentioned, lead-in wire is bent perpendicular to extend along its housing end face separately is outside, then again vertical curve so that the end 232,234,236,238,240,242 of lead-in wire extend along the bottom surface 212 of housing.Use any interconnection technique in many well-known interconnection techniques, facing trace or the pad electrical connection on outer surface and the substrate that is generally printed circuit board (PCB) 216 or engage with the end 232,234,236,238,240,242 of lead.As previously mentioned, housing has cavity 244, and cavity 244 extends enough degree of depth to expose the pad of connecting portion and supporting part.This connecting portion and supporting part preferably by from forming through the conductive gold metal thin plate or the manufacturing of metal alloy thin plate of punch press operation from sheet metal raw material (sheet metal stock) cutting, bent to their final structure then before or after forming around the lead frame at housing.

Each of LED has pair of electrical terminal or electrode, negative electrode wherein with carry the pad electric coupling, and the anode of LED is coupled with the pad of different connecting portion through single bonding wire respectively.

Referring now to Figure 14-16, show some examples of size characteristic of the various parts of SMD 10 or 200.Mode by way of example but be not limited thereto,

SMD

10 or 200 can have～total length of 5.50mm ,～overall width of 5.50mm and～height of 2.50mm.

With reference to Figure 17; The part of LED display 300 is shown in schematic form, and LED display 300 for example is indoor and/or outdoor screen, in general; Comprise the driving PCB 302 that is loaded with in a large number the surface mounted device 304 that is provided with row and column, each SMD limits a pixel.SMD304 can comprise the device of the embodiment shown in Fig. 1-8 and 11-13.SMD device 304 is electrically connected with trace or pad on the PCB 302, and PCB 302 connects into the suitable signal of telecommunication is handled and the drive circuit (not shown) is made response.Disclose as above, each SMD carries the vertical orientated linear array 306 of ruddiness, green glow and blue-ray LED.This linear orientation of LED is found in the wide viewing angle scope and improves color fidelity.

Although illustrated and described many illustrative example of the utility model, those skilled in the art can carry out many changes and alternative embodiment, for example the utility model are used for LED decorative lighting etc.The embodiment of these changes and replacement expects, and can under the situation of the spirit of the utility model in not breaking away from appended claim definition and scope, make.

Claims

1. a conductivity lead frame that is used for multiple optical device packaging body is characterized in that, said conductivity lead frame comprises:

A plurality of conductivity negative pole parts, each has the attach pad that is used to carry at least one luminescent device, wherein each attach pad with the corresponding luminescent device electric coupling of this attach pad;

Corresponding a plurality of conductivity anode portion of separating with said negative pole part; In the said anode portion each has connection pads; Said connection pads is arranged to be electrically connected with one of said luminescent device, and wherein said attach pad and said connection pads are arranged to keep said luminescent device linear alignment

Wherein, the surface area of said lead frame is half at least visible through the cavity in the housing of said light body.

2. lead frame according to claim 1 is characterized in that said luminescent device comprises LED.

3. lead frame according to claim 2 is characterized in that said LED comprises at least two contacts, the electric coupling of one of one of them and said attach pad and wherein one of another and said connection pads electric coupling.

4. lead frame according to claim 1; It is characterized in that; The linear array of said luminescent device extends upward in first party; And each in the said anode portion is set to be parallel to each other, and said negative pole part is set to be parallel to each other, and extend with the direction of said first direction quadrature on each edge in said negative pole part and the said anode portion.

5. lead frame according to claim 1 is characterized in that, said anode portion and said negative pole part are processed by sheet metal.

6. according to the lead frame described in the claim 2, it is characterized in that said LED comprises red-light LED, green light LED and blue-ray LED.

7. according to the lead frame described in the claim 1, it is characterized in that each among the said LED is through wire-bonded and connection pads electric coupling.

8. according to the lead frame described in the claim 1, it is characterized in that each among the said LED is through scolder and corresponding attach pad coupling.

9. according to the lead frame described in the claim 1, it is characterized in that said lead frame further comprises the black ceramic housing.

10. according to the lead frame described in the claim 1, it is characterized in that said lead frame further comprises through hole.

11. the lead frame according to described in the claim 1 is characterized in that, said lead frame further comprises V-notch.

12. a light body is characterized in that, comprising:

Housing, it comprises the cavity that extends to the inside of said housing from the end face of said housing; And

Become whole lead frame with said housing; Said lead frame comprises the conductive part that keeps a plurality of luminescent devices; Said luminescent device linear alignment is also launched light outside said cavity, said lead frame also allows through said lead frame the signal of telecommunication to be applied to said luminescent device

Wherein, the surface area of said lead frame half at least is through said cavity and visible.

13. according to the light body described in the claim 12; It is characterized in that; Said lead frame comprises a plurality of conductivity negative pole parts, and each conductivity negative pole part has the attach pad that is used to carry at least one said luminescent device, each said attach pad and its that said luminescent device electric coupling; And corresponding a plurality of conductivity anode portion of separating with said negative pole part; In the said anode portion each has connection pads, and said connection pads is arranged to be electrically connected with one of said luminescent device, and wherein said attach pad and said connection pads are arranged to keep said luminescent device linear alignment.

14. the light body according to described in the claim 12 is characterized in that said luminescent device comprises LED.

15. the light body according to described in the claim 12 is characterized in that said lead frame is arranged to allow the mounted on surface of said packaging body.

16. the light body according to described in the claim 12 is characterized in that said lead frame further comprises through hole and/or V-notch.

17. the light body according to described in the claim 12 is characterized in that, said luminescent device further comprises the heat conductor that extends through said supporting body at least in part.

18. the light body according to described in the claim 14 is characterized in that said LED comprises red-light LED, green light LED and blue-ray LED.

19. the light body according to described in the claim 12 is characterized in that, the electric terminal of each said luminescent device is through wire bond and connection pads electric coupling.

20. a light body is characterized in that, comprising:

Housing comprises the cavity that extends to the inside of said housing from the end face of said housing; And

Become integral body with said housing and join the lead frame of said housing to; Said lead frame comprises the conductive part of support radiative a plurality of luminescent devices outside said housing; Said lead frame further comprises a plurality of characteristics or shape, and said characteristic or shape match with said housing

21. the light body according to described in the claim 20 is characterized in that said characteristic or shape comprise the through hole in the said lead frame.

22. the light body according to described in the claim 20 is characterized in that said characteristic or shape comprise the V-notch in the said lead frame.

23. the light body according to described in the claim 20 is characterized in that said characteristic or shape comprise the side breach.

24. the light body according to described in the claim 20 is characterized in that said characteristic or structure comprise lateral process.