CN203707120U

CN203707120U - Solid state transmitter package unit and multi-pixel transmitting package unit

Info

Publication number: CN203707120U
Application number: CN201320304753.2U
Authority: CN
Inventors: 彭泽厚; 陈志强; D·埃默森; Y·K·V·刘; 钟振宇
Original assignee: Cree Huizhou Solid State Lighting Co Ltd
Current assignee: Cree Huizhou Solid State Lighting Co Ltd
Priority date: 2013-05-29
Filing date: 2013-05-29
Publication date: 2014-07-09
Anticipated expiration: 2023-05-29

Abstract

The utility model discloses a solid state transmitter package unit and a multi-pixel transmitting package unit. The solid state transmitter package unit comprises a plurality of pixels, wherein each pixel is provided with at least one solid state transmitter and a reflector. The solid state transmitter package unit also comprises a common base platform which transmits an electric signal, wherein the electric signal is used for controlling the light emission of the first and second pixels. The solid state transmitter package unit provided by the utility model has an advantage of reducing the cost of packaging and a display, and the interconnection complexity.

Description

Soild state transmitter encapsulation and many pixels transmitting encapsulation

Technical field

The utility model relates to soild state transmitter encapsulation and many pixels transmitting encapsulation, especially, relates to LED package and utilizes the display of LED package as its light source.

Background technology

Light-emitting diode (LED) is the solid-state device that converts electric energy to light, generally includes the active layer of the semi-conducting material between one or more layers that are interposed in phase contra-doping.When apply bias voltage on doped layer time, hole and electronic injection are in active layer, and hole and electronics reconfigure to produce light at active layer.Light sends and sends from all surface of LED from active layer.

Technical development since nearly ten years or longer time has produced has the more LED of the emission effciency of small footprint size, increase and the cost of reduction.Compared with other reflectors, LED also has the working life of increase.For example, the working life of LED can exceed 50,000 hours, and the working life of incandescent lamp bulb is approximately 2,000 hours.LED also comparable other light sources is firmer and consume power still less.Due to these reasons and other reasons, it is more popular that LED becomes, and, in increasing application scenario, use now, and traditionally, these application scenarios are fields of incandescent lamp, fluorescent lamp, Halogen lamp LED and other reflectors.

In order to use LED chip in traditional application scenario, known LED chip is encapsulated in encapsulation, so that environment and/or mechanical protection, color selection, convergence of rays etc. to be provided.LED encapsulation also comprises electric lead, contact or trace, for LED encapsulation is electrically connected with external circuit.In the typical two pin LED encapsulation/elements 10 shown in Fig. 1, by solder joints or conductive epoxy resin, single led chip 12 is arranged on reflector 13.One or more wires joint portion 11 is connected the ohm contact of LED chip 12 with lead-in wire 15A and/or 15B, lead-in wire 15A and/or 15B can be attached to reflector 13 or form entirety with reflector.Available encapsulant 16 is filled reflector 13, and, on LED chip or in seal, can comprise material for transformation of wave length, for example phosphor.The light that LED issues out at the first wavelength can be absorbed by phosphor, and phosphor can responsively send the light of second wave length.Then, can, by whole component package in transparent protection resin 14, this protection resin may be molded as to the shape of lens, to guide the light sending from LED chip 12 or this light is shaped.

Traditional LED encapsulation 20 shown in Fig. 2 can be more suitable in high power operation, and it can produce more heats.In LED encapsulation 20, one or more LED chips 22 are arranged on carrier to described carrier such as printed circuit board (PCB) (PCB) carrier, substrate or base station (submount) 23.The solid metal reflector 24 being installed on base station 23 surrounds LED chip 22, and the light being sent by LED chip 22 is reflected away from encapsulation 20.Reflector 24 also provides mechanical protection to LED chip 22.Between electric trace 25A, 25B on ohm contact on LED chip 22 and base station 23, form one or more wires and be combined connecting portion 21.Then, cover installed LED chip 22 with sealant 26, sealant can provide environment and mechanical protection to chip, simultaneously also as lens.Typically, by welding or epoxy resin combination, solid metal reflector 24 is attached to carrier.

Fig. 3 shows another kind of LED encapsulation 30, and it comprises housing 32 and is embedded at least in part the lead frame 34 in housing 32.Lead frame 34 is arranged as for encapsulating 30 surface and installs.By the part of the cavity exposed leads frame 34 in housing 32, wherein three LED36a-c are arranged in the part of lead frame 34 and are connected in other parts of lead frame by wire joint portion 38.Can use dissimilar LED36a-c, some of them encapsulation have glow, the LED of green light and blue light-emitting.Encapsulation 30 comprises the pin efferent structure with six pins 40, and lead frame is arranged to control independently the luminous of each LED36a-c by corresponding a pair of pin 40.This allows this encapsulation to send versicolor combination from LED36a-c.

Available different LED encapsulation (example as shown in Figure 1 to Figure 3 those) as a token of and the light source of display (large with little).The display (being conventionally called huge screen) that comprises big screen LED is just becoming more general at multiple indoor and outdoor location, for example, and in stadium, runway, concert, and in large-scale common area, for example, in the Times Square of New York.By current technology, these displays of part or screen can be greatly to 60 feet high 60 feet wide.Along with technical development, estimate screen larger exploitation.

These screens can comprise millions of or hundreds thousand of " pixel " or " picture element module ", eachly comprise one or more LED chips or encapsulation.Picture element module can use the LED chip of high efficiency and high brightness, and its permission can be seen display from place relatively far away, or even by day in the time being subject to sunlight.In some marks, each pixel can have a LED chip, picture element module can have few to three or four LED(for example, a redness, a green, a blueness), it allows pixel from the combination of ruddiness, green glow and/or blue light, to send the light of multiple different colours.Picture element module can be arranged in square-grid, it can comprise hundreds thousand of LED or LED encapsulation.In the display of a type, grid can be that 640 wide 480 modules of module are high, and the size of screen depends on the actual size of picture element module.In the time that the quantity of pixel increases, the interconnect complexity of display also increases.This interconnect complexity can be in the main spending of these displays, and, can be in manufacture process and the working life process of display in major failure source in one.

Utility model content

The utility model relates to soild state transmitter encapsulation, many pixels transmitting encapsulation and uses the light-emitting diode display of described encapsulation, is to reduce cost and the interconnect complexity of display by this package arrangement.Some encapsulation execution modes are arranged as in an encapsulation multiple display pixels are provided, make the cost of each pixel, and simplify the Design and manufacture of the display that uses this encapsulation.

According to an execution mode of the present utility model, a kind of soild state transmitter encapsulation is provided, it comprises: multiple pixels, each pixel all has at least one soild state transmitter and reflector; And shared base station, transmit the first pixel luminous for controlling pixel and control the luminous signal of telecommunication of the second pixel in pixel.

Further, base station is arranged as and controls independently the luminous of the first pixel and the second pixel.

Further, the first pixel or the second pixel transmitting white.

Further, soild state transmitter comprises LED.

Further, at least one in pixel comprises the LED of the blue light-emitting with phosphor.

Further, at least one in pixel comprises the LED emitting white light and the LED glowing.

Further, each in the first pixel and the second pixel includes redness, green and blue led.

Further, base station comprises housing, and pin and lead frame structure and housing form entirety.

Further, encapsulation further comprises the multiple cavitys that are arranged in housing, and each cavity limits a pixel.

Further, each cavity has at least one solid-state light emitters.

Further, encapsulation further comprises the contrast district on the end face that is positioned at housing.

Further, base station comprises pottery, printed circuit board (PCB), metal-core printed circuit board or FR-4 plate at least in part.

Further, base station comprises pin and lead frame structure.

Further, pixel is in matrix layout.

Further, pixel is in square matrices layout.

Further, pixel is in linear array layout.

Further, at least two pixel sharing one transmitter power signals, and at least two pixel sharing one reflector control signals.

Further, pixel is arranged with matrix layout, the wherein shared transmitter power signal of one-row pixels, an and row pixel sharing one reflector control signal.

According to another execution mode of the present utility model, a kind of many pixel transmitting encapsulation are provided, comprising: housing, there are multiple cavitys, each cavity has at least one LED, and each cavity forms reflector; And lead frame structure, form entirety with housing, at least one LED of each cavity is mounted to lead frame structure, encapsulation can receive for controlling and come from the first cavity of cavity and the luminous signal of telecommunication of the second cavity, wherein, each described cavity and corresponding described at least one LED thereof comprise pixel, and each pixel all has at least one soild state transmitter and reflector.

Further, encapsulation is arranged to reception and controls independently the first cavity of coming from cavity and the luminous signal of telecommunication of the second cavity.

Further, described in each, cavity includes redness, green and blue led.

Further, pixel is in matrix layout or linear placement.

Further, pixel is in square matrices layout.

Further, pixel is in linear array layout.

Further, encapsulation further comprises the pin efferent that is arranged to the surface installation that allows encapsulation.

Further, at least two LED in two cavitys share a LED power signal, and at least two LED in two cavitys share a reflector control signal.

Further, cavity arranges with matrix layout, and wherein, the LED in one-row pixels shares a transmitter power signal, and LED in a row cavity shares a LED control signal.

Comprise multiple pixels according to an execution mode of soild state transmitter encapsulation of the present utility model, each pixel has at least one soild state transmitter.Comprise the shared base station for transmitting the signal of telecommunication, to control the luminous of the first pixel and to control the luminous of the second pixel.

Comprise the housing with multiple cavitys according to many pixels light emitting package of the present utility model execution mode, each cavity has at least one LED.Comprise with housing and form overall lead frame structure, described at least one LED of each cavity is mounted to lead frame structure.This encapsulation can receive the luminous signal of telecommunication that comes from the first and second cavitys for controlling.

Comprise multiple LED encapsulation according to light-emitting diode display of the present utility model execution mode, the plurality of LED encapsulation is relative to each other installed, to produce message or image.At least some LED encapsulation in described LED encapsulation comprise multiple pixels, and each pixel has at least one LED.Each encapsulation can receive the luminous signal of telecommunication of at least the first and second pixels for controlling described pixel.

The utility model provides such advantage, for example, reduces cost and the interconnect complexity of encapsulation and display.

From following the detailed description and the accompanying drawings, these and other aspects of the present utility model and advantage will become apparent, and accompanying drawing shows feature of the present utility model by example.

Accompanying drawing explanation

Fig. 1 is a kind of end view of traditional LED package;

Fig. 2 is the end view of another traditional LED package;

Fig. 3 is the plane graph of another traditional LED package;

Fig. 4 is according to the plane graph of an execution mode of LED encapsulation of the present utility model;

Fig. 5 is the end view of the LED encapsulation shown in Fig. 4;

Fig. 6 is the opposite side view of the LED encapsulation shown in Fig. 4;

Fig. 7 is according to the plane graph of light-emitting diode display of the present utility model execution mode;

Fig. 8 shows according to the schematic diagram of the interconnection between the LED in LED encapsulation of the present utility model;

Fig. 9 is according to the plane graph of another execution mode of LED encapsulation of the present utility model;

Figure 10 shows according to the schematic diagram of the interconnection between the LED in another LED encapsulation of the present utility model;

Figure 11 is according to the plane graph of another execution mode of LED encapsulation of the present utility model;

Figure 12 is according to the plane graph of another execution mode of LED encapsulation of the present utility model;

Figure 13 is according to the plane graph of another execution mode of LED encapsulation of the present utility model;

Figure 14 is according to the plane graph of the another execution mode of LED encapsulation of the present utility model;

Figure 15 is according to the plane graph of light-emitting diode display of the present utility model execution mode;

Figure 16 is according to the plane graph of another execution mode of light-emitting diode display of the present utility model;

Figure 17 is according to the perspective view of another execution mode of LED encapsulation of the present utility model;

Figure 18 is the plane graph not encapsulating at the LED of the LED shown in pixel shown in Figure 17;

Figure 19 is the plane graph of a pixel during the LED of Figure 17 and Figure 18 encapsulates;

Figure 20 is the end view of the LED cutting open along the hatching 20-20 encapsulation shown in Figure 17 and Figure 18;

Figure 21 is the bottom view of the LED encapsulation shown in Figure 17 and Figure 18;

Figure 22 is the end perspective view of the LED encapsulation shown in Figure 17 and Figure 18;

Figure 23 is another bottom view of the LED encapsulation with a pin numbering layout shown in Figure 17 and Figure 18;

Figure 24 is according to the schematic diagram of an execution mode of the pin mark in an execution mode of LED encapsulation of the present utility model;

Figure 25 shows according to the schematic diagram of the interconnection between the LED in LED encapsulation of the present utility model, and this LED encapsulation utilizes the pin mark shown in Figure 24;

Figure 26 is according to the plane graph of another execution mode of light-emitting diode display of the present utility model;

Figure 27 is according to the plane graph of another execution mode of light-emitting diode display of the present utility model.

Embodiment

The utility model relates to improved LED encapsulation and uses the light-emitting diode display of this LED encapsulation, comprises " many pixels " encapsulation according to LED encapsulation of the present utility model.That is to say, this encapsulation comprises more than one pixel, and each pixel comprises one or more light-emitting diodes.Different execution modes comprises the different characteristic for the LED of pixel being applied to the signal of telecommunication.In some embodiments, can apply the corresponding signal of telecommunication to each pixel, to control its glow color and/or intensity, and in other embodiments, available identical two or more pixels of signal of telecommunication control.Have in the execution mode of multiple LED in pixel, the one or more LED in the each pixel of available corresponding signal controlling, and in other embodiments, the LED in available identical signal controlling different pixels.In some execution modes in these execution modes, can control the luminous of two or more pixels with identical signal, and in other embodiments, can control each pixel with corresponding signal.

In some embodiments, term pixel is interpreted as in its its ordinary meaning to the element of the image that can process or control separately in display system.In some execution modes in these execution modes, some or all of pixels can comprise glow, the LED of green light and blue light-emitting, at least some in pixel are arranged to and allow the intensity of the each LED in pixel to control.This allows each pixel to send a kind of light of color, and it is the combination of ruddiness, green glow or blue light, and allows to drive flexibility when each pixel, makes it can send different colors, and described different color is the combination from the light of LED.

In other embodiments, this encapsulation can comprise the pixel that can send single light of planting color, and these are encapsulated in different application scenarios and use, for example, and illumination or backlight.In some execution modes in these execution modes, pixel can be sent white light, and can comprise that at least one has the blue led of one or more phosphors, and this LED sends the white light combination of blue light and phosphorescence.Different execution modes in these execution modes can allow to control each LED in each pixel, and in other embodiments, available identical drive LED.In some embodiments, pixel can comprise one or more LED that emit white light, and itself and the LED combination glowing are luminous to realize desired pixel, for example, and required colour temperature.In other embodiments, can control like this luminous of LED in pixel, make pixel to the scope of hot temperature, send different colour temperatures in cold temperature.

Can there are multiple different shape and size according to encapsulation of the present utility model, and can be arranged to the pixel with multiple varying number.In some embodiments, this encapsulation can be foursquare, and can have the pixel of 2 × 2,4 × 4,8 × 8 etc. form.In other embodiments, this encapsulation can be rectangular shape, and pixel can have a form that the pixel in direction is fewer than the pixel on other direction.For example, this encapsulation can have 2 × 3,2 × 4,2 × 5,2 × 6 etc., 3 × 4,3 × 5,3 × 6,3 × 7 etc. or 4 × 5,4 × 6,4 × 7,4 × 8 etc. pixel form.In other execution mode, pixel can be formed as pixel linear array, and the length of this linear array is 2,3,4,5 etc.These be only encapsulation shape a part, other be triangle, circle or irregularly shaped.

Provide according to LED encapsulation of the present utility model the special advantage that is better than the single pixel encapsulation of prior art.This LED encapsulation can for example,, by reducing material cost (, lead frame material), make the cost of every pixel lower.In keeping lambert's beam profile, also can reduce the spacing between neighbor.By reducing the spacing between pixel, can manufacture more high-resolution display.Also can, by reducing processing cost and picking up and the cost of placing modules, reduce display manufacturing cost.Also can reduce the complexity of pixel interconnection, thereby reduce material cost and display manufacturing level.This also can reduce the possible interconnection that there will be fault along with the useful life of display.

The utility model can relate to multiple different encapsulated type, and some execution modes are below surface mounted devices.Should be understood that the utility model also can be used for other encapsulated types, for example, there is the encapsulation for the pin of through hole mounting process.

In LED mark and display, can use according to LED encapsulation of the present utility model, it should be understood that, it can be used in multiple different application scenario.This LED encapsulation can be deferred to different industry standards, so that it is suitable in LED-based mark, channel letter illumination or common backlight and illumination application.Some execution modes also can comprise and make the flat-top surface of emission of its compatibility to mate with light pipe.These are only according to the several application in the multiple different application occasion of LED encapsulation of the present utility model and oneself.

Single LED chip or many LED chips can be comprised according to LED encapsulation execution modes more of the present utility model, and the reflector that surrounds this list LED chip or many LED chips can be comprised.The upper surface of each reflector housing around can comprise the material contrary with the material of the light being sent by LED chip.The reflecting surface being exposed in part and/or the cup of the housing in cup also can comprise that reflection comes from the material of light of LED chip.In some execution modes in these execution modes, the light sending from LED chip can be the light of white light or the conversion of other wavelength, and the reflecting surface of the surface of the base station in reflector and cup can be white, or the light of reflected white-light or wavelength conversion otherwise.(contrasting, relative) upper surface of the contrast of reflector can be multiple different color, and still, in some embodiments, it can be black.

Describe the utility model with reference to some execution mode herein, however, it should be understood that, the utility model can multiple different form be implemented, and, should be interpreted as being limited to the execution mode of setting forth here.Especially, except those above-mentioned embodiment, can provide multiple different LED chip, reflector and lead frame to arrange, and sealant can provide further feature to improve LED encapsulation and use reliability and the characteristics of luminescence of the light-emitting diode display of this LED encapsulation.Although the different execution modes of LED encapsulation discussed here are used for light-emitting diode display,, can in multiple different illuminations application, use LED encapsulation.

Should also be understood that it can be located immediately on this another element, or also may have insertion element when being called as such as the element of layer, region or substrate while being positioned on another element.In addition, may use here such as the relational terms of " in ... top " and " in ... below " and similarly term the relation in a layer or another region is described.Should be understood that these terms are intended to comprise the different directions except the direction shown in figure of device.

Although can various elements, parts, region, layer and/or part be described by first, second grade of term here,, these elements, parts, region, layer and/or part should not be limited to these terms.These terms are only used for an element, parts, region, layer or part and another region, layer or part to distinguish.Therefore, do not deviating under the prerequisite of instruction of the present utility model, the first element discussed below, parts, region, layer or part also can be called the second element, parts, region, layer or part.

, described execution mode of the present utility model with reference to cross-sectional illustration here, this diagram is the schematic diagram of execution mode of the present utility model.Similarly, the actual (real) thickness of these layers can be different, and estimates for example different from illustrated shape due to the result of manufacturing technology and/or tolerance.Execution mode of the present utility model should be interpreted as being limited to the special shape in shown here region, but should comprise for example by manufacturing the form variations producing.Due to normal manufacturing tolerance, the region that illustrates or be described as square or rectangle will typically have fillet or bending features.Therefore, the region shown in figure is that schematically its shape is not intended to the accurate shape in the region that device is shown, nor is intended to limit scope of the present utility model in essence.

Fig. 4 to Fig. 7 shows according to many pixels emitter package 50 of the present utility model execution mode, and wherein illustrate in greater detail can be according to the pixel reflector using in execution modes more of the present utility model for Fig. 7.This encapsulation comprises four pixel 52a-d that are arranged as 2 × 2 forms or layout, and encapsulation 50 has common foursquare floor space.Encapsulation 50 features that can comprise for different installation methods, wherein illustrated embodiment has the feature that allows surface to install.That is to say, encapsulation 50 comprises surface mounted device (SMD), and it has pin and lead frame structure, and wherein pin efferent is arranged such that to utilize surface mounting technology that encapsulation is mounted to structure (for example, printed circuit board (PCB) (PCB)).As mentioned above, should be understood that except SMD, the utility model also can be applicable to other emitter package types, and for example, pin is installed emitter package.Encapsulation 50 comprises housing or base station 54, and this housing or base station carry overall lead frame 56.Lead frame 56 comprises multiple conductive connection parts, and the plurality of conductive connection part is used for the extremely optical transmitting set of encapsulation of electrical signal conduction, and with helping disperse the heat being produced by reflector.

Housing or base station (housing) 54 can be by being combined to form of multiple different material or material, and, in different parts, can there is different materials.Acceptable case material is an electric insulation, for example, and dielectric material.Housing 54 can comprise pottery at least in part, for example aluminium oxide, aluminium nitride, carborundum or polymeric material (for example polyimides and polyester).In some embodiments, housing 54 can comprise the dielectric material with relatively high thermal conductivity, for example, and aluminium nitride and aluminium oxide.In other embodiments, base station 54 can comprise printed circuit board (PCB) (PCB), sapphire or silicon or any other suitable material, and for example, the thermal insulation backing material of plating T, can obtain from the Bergquist company of Minnesota State Chanhassen.For PCB execution mode, can use different PCB types, for example, the printed circuit board (PCB) of the FR-4PCB of standard, metal-cored PCB or any other type.

Can multiple different mode arrange lead frame 56, and in different encapsulation execution modes, can use the part of varying number.Pixel can have identical one or more reflectors, for example LED, and in some embodiments, different pixels can have the LED of varying number.As illustrated best in Fig. 7, the each pixel in encapsulation 50 all can comprise three LED58a-c, and in illustrated embodiment, lead frame 56 is arranged as LED58a-c is applied to the signal of telecommunication.Lead frame 56 comprises conductive pieces, for will from encapsulation installed surface (for example PCB) electrical signal conduction to LED58a-c.Lead frame also can comprise such feature, that is, this feature can be included and stability is installed and is provided for dispersing the extra hot path from the heat of reflector so that LED is provided.Lead frame also can comprise physical features, for example, hole, otch etc., to increase stability and the reliability of encapsulation, and, in some embodiments, help the waterproof sealing between holding member.Authorizing the people's such as Chan the U.S. Patent application the 13/192nd of by name " encapsulation of Water Resistant Surface Mount Device Package(water-proof surface installing device) ", in No. 293, described these different features, the full content of this U.S. Patent application is incorporated herein by reference.

Can realize desired structure by punching press, injection moulding, cutting, etching, bending or the combination by other known methods and/or these methods, thereby realize the manufacture of lead frame 56.For example, conductive pieces can by metal stamping partly (for example,, simultaneously from the punching press of monolithic associated materials), suitably bending and separate completely or form housing a part or all after separation completely.

Lead frame 56 can for example, be made up of conducting metal or metal alloy (, copper, copper alloy) and/or the combination of other suitable low resistances, resistant material or these materials.As mentioned above, the thermal conductivity of lead-in wire may help to conduct away heat from LED58a-c to a certain extent.

Housing 54 can have multiple different shape and size, and in the embodiment shown, and normally square or rectangle, has upper surface 60 and lower surface 62(illustrates best in Fig. 5 and Fig. 6) and the first and second side surfaces 64 and 66.The top of housing further comprises groove or cavity 72, described groove or cavity from upper surface 60 stretches into the body of housing 54, arrive lead frame 56.The LED58a-c of each pixel is arranged on the lead frame 56 in a corresponding cavity 72, makes to send from encapsulating 50 by cavity 72 from the light of LED.Each cavity 72 can have angled side surface, and described angled side surface forms reflector around LED58a-c, with help by the light of reflector reflex to encapsulation 50 outside.In some embodiments, can locate and fixation reflex insert or ring (not shown) along at least a portion of the side surface of cavity 72 74.Can be by cavity 72 being tapered increase the reflection efficiency of ring and the angle of departure of encapsulation, and, in cavity towards the inside load-carrying ring in inside of housing.By example, the angle of reflection of about 50 degree provides suitable reflectivity and visual angle.

In some embodiments, available packing material (or sealant) filled chamber 72 at least in part, this packing material can be protected lead frame 56 and LED58a-c, and makes lead frame and LED stable in position.In some embodiments, packing material may cover the part that cavity 72 exposes of passing through of reflector and lead frame 56.Packing material can be chosen as and have predetermined optical characteristics, to strengthen from the light of LED projection, and in some embodiments, packing material is transparent substantially for the light of being launched by the reflector encapsulating.Packing material can also be flat, make its with upper surface 60 in approximately identical plane, or, can make its form with lens be shaped, for example, hemisphere or bullet shaped.Alternatively, packing material can completely or partially be recessed in one or more cavitys 72.Packing material may be by resin, epoxy resin, thermoplastic condensed polymer, glass, and/or being combined to form of other suitable materials or these materials.In some embodiments, can increase material to packing material, to strengthen towards LED and/or to come from transmitting, absorption and/or the diffusion of the light of LED.

Housing 54 can be made up of the material of preferably electric insulation and heat conduction.This material is well-known in the art, can include but not limited to some pottery, resin, epoxy resin, thermoplastics, condensation polymer (for example, polyphthalamide (PPA)) and glass.Encapsulation 50 and housing 54 thereof may be formed and/or be assembled by any in several different methods as known in the art.For example, can around lead frame, form or molded shell 54, for example, by injection moulding.Alternatively, can for example, in some parts (top and bottom), form housing, wherein conductive pieces is formed on bottom.Then, can utilize known method and material (for example,, by epoxy resin, adhesive or other suitable grafting materials) that top and bottom are combined.

Can use multiple different reflector according to encapsulation of the present utility model, wherein encapsulate 50 use LED58a-c.Different execution modes can have the different LED chip of the light that sends different colours, and, in illustrated embodiment, the each pixel of encapsulation in 50 comprise glow, the LED chip of green light and blue light-emitting, these LED chips can produce luminous (the comprising white light) of the combined colors of multiple different wave length.

LED chip structure, feature, with and manufacture and operation is conventionally known in the art, only discuss briefly here.LED chip can have the multiple different semiconductor layer of arranging by different way, and can send different colors.Available known method is manufactured these layers of LED chip, and a kind of suitable method is to use Organometallic Chemistry vapor deposition (MOCVD) manufacture.These of LED chip layer generally include the active layer/region between the epitaxial loayer that is interposed in the first and second phase contra-dopings, and all these active layer/regions are formed on growth substrates or wafer continuously.Being formed at LED chip on wafer can be by individualized (singulated separates), and can be used for different application scenarios, for example, is arranged in encapsulation.Should be understood that grown substrate/wafer can keep the part as final individualized LED chip, or the substrate of growing can completely or partially be removed.

Should also be understood that and in LED chip, also can comprise extra layer and element, described extra layer and element include but not limited to resilient coating, nucleating layer, contact layer and current distribution layer and light-extraction layer and element.Active region can comprise single quantum well (SQW), Multiple Quantum Well (MQW), double-heterostructure or superstructure.

Active region and doped layer may be made up of different material systems, and a this system is the material system based on III group-III nitride.III group-III nitride refers to those semiconducting compounds forming between the III of nitrogen and periodic table family element (normally aluminium (Al), gallium (Ga) and indium (In)).This term also refers to ternary and quaternary compound, for example, and aluminium gallium nitride alloy (AlGaN) and aluminum indium nitride gallium (AlInGaN).In a preferred implementation, doped layer is gallium nitride (GaN), and active region is InGaN.In alternate embodiments, doped layer can be AlGaN, aluminum gallium arsenide (AlGaAs) or phosphatization aluminum gallium arsenide indium (AlGaInAsP) or AlGaInP (AlInGaP) or zinc oxide (ZnO).

The substrate/wafer of growing can be made of a variety of materials, for example, silicon, glass, sapphire, carborundum, aluminium nitride (AlN), gallium nitride (GaN), wherein suitable substrate is the 4H polytype of carborundum, although also can use other carborundum polytypes, comprise 3C, 6H and 15R polytype.Carborundum has some advantages, for example, compared with sapphire, the lattice more mating with III group-III nitride, and generation has higher-quality III group-III nitride film.Carborundum also has very high thermal conductivity, makes the gross output of the III nitride devices on carborundum can't help the heat dissipation restriction (identical as the situation that is formed at some devices on sapphire) of substrate.SiC substrate can obtain from the Cree Research Inc. of North Carolina state Durham, and, in scientific literature and in United States Patent (USP) Re34,861; 4,946,547 and 5,200, set forth its manufacture method in No. 022.LED also can comprise extra feature, for example, conductive current distributed architecture and current distribution layer, all these can be made up of the known materials that depositing with known method.

LED58a-c can be mounted to lead frame 56, and for example, be electrically coupled with lead frame 56 by the bond material (, scolder, adhesive, coating, film, sealant, slurry, lubricating oil and/or other suitable materials) of conductive and heat-conductive.In a preferred implementation, can be with the weld pad on LED bottom by LED electric coupling and be fixed to its corresponding liner, make to cannot see scolder from top.Can be included in shown in the wire joint portion 74(Fig. 7 extending between LED58a-c and lead frame 56).

Different execution mode of the present utility model can have different pin efferents and arrange, this layout can be depending on different factors, for example, the separation on the each LED in the interconnection of the quantity of LED, LED and each pixel and/or pixel and the independent level of controlling.Fig. 7 shows the encapsulation 50 in its pin efferent structure with 8 pins 76, and Fig. 8 shows according to interconnection structure 80 of the present utility model execution mode, and it can utilize the pin efferent of 8 pins.Interconnection structure 80 shows four pixel 52a-d, and each pixel comprises three LED58a-c, and electrical connection between LED58a-c can provide by the wire joint portion 74 shown in lead frame 56 and/or Fig. 7.Signal of telecommunication V1 on pin and V2 provide the power of driving LED, wherein V1 driving first and the 3rd pixel 52a, 52c, and V2 drives another two pixel 52b, 52d.Signal of telecommunication R1, G1 on pin and B1 control the luminous of LED58a-c in the first two pixel 52a, 52b, and signal R2, G2 and B2 control the luminous of LED58a-c in latter two pixel 52c, 52d.This layout allows dynamically to control pixel 52a-d, and each pixel is by the respective combination control of driving and control signal.In illustrated embodiment, V1, R1, G1 and B1 control the luminous of the first pixel 52a, and V1, R2, G2 and B2 control the luminous of the 3rd pixel 52c.Similarly, V2, R1, G1 and B1 control the luminous of the second pixel 52b, and V2, R2, G2 and B2 control the luminous of the 4th pixel 52d.

It should be understood that the different pins can in its pin efferent structure with varying number that is encapsulated in, and pixel and LED can multiple different mode interconnect, this different mode is different lead frame structure and wire joint portion.Fig. 9 shows according to another execution mode of LED encapsulation 100 of the present utility model, and it also has four pixel 102a-d of 2 × 2 layouts.This encapsulation further comprises housing 104 and lead frame 106, and each in housing and lead frame can be with method same as described above and material manufacture.Each pixel 102a-d also can comprise one or more LED, described execution mode comprise three to above-mentioned similar LED108a-c.Encapsulation 100 also can comprise wire joint portion 110, to provide electrical connection between the LED108a-c in lead frame 106 and pixel 102a-d.

Encapsulation 100 also comprises the pin efferent structure with 16 pin ones 12, and Figure 10 shows according to interconnection structure 120 of the present utility model execution mode, this execution mode can use the structure with 16 pin ones 12 and four pixels, as in the execution mode of Fig. 9.Interconnection structure 120 is provided by lead frame 106 and wire joint portion 110, and allows the independent control of pixel 102a-d.That is to say, each pixel 102a-d has its oneself pin, so that corresponding power signal to be provided, and has one group of pin, provides control with the LED108a-c in its pixel luminous.For pixel 102a, can on pin V11, provide power signal, this signal controlling is arranged at the luminous of LED108a-c on pin R11, G11 and B11.For pixel 102b, power is provided on V12, and on pin R12, G12 and B12, provides LED to control.Similarly, provide power and control by V22, R22, G22 and B22 to pixel 102c, and provide power and control by V21, R21, G21 and B21 to pixel 102d.Compared with above-mentioned encapsulation 50, this arranges needs more pin one 12, but allows correspondingly to control the luminous of each pixel 102a-d.These are only can be by two kinds in the multiple different pin efferents that provide according to encapsulation of the present utility model and interconnection structure.

As discussed above, except encapsulating 2 × 2 layouts shown in 50 and 100, can be provided with multiple different matrix layout according to encapsulation of the present utility model.Figure 11 shows the encapsulation 130 of another execution mode, and it has six pixel 132a-f that arrange with 2 × 3 matrix layout.Figure 12 shows the encapsulation 140 of another execution mode, and it has eight pixel 142a-h that arrange with 2 × 4 matrix layout.Each encapsulation 130,140 comprises housing, and its lead frame, pin and wire joint portion be to above-described those are similar, but is arranged to the pixel of the larger quantity of adaptation.Each pixel also can comprise the LED of varying number, as mentioned above, shown in pixel there are three LED.

Can also array or linear placement provide according to LED encapsulation of the present utility model.Figure 13 shows the LED encapsulation 150 according to another execution mode of the present utility model, and it has two pixel 152a-b that are arranged to 2 × 1 linear forms.Figure 14 shows the LED encapsulation 160 according to another execution mode of the present utility model, and it has four pixel 162a-d that are arranged to 4 × 1 linear forms.Each encapsulation also comprises housing as above, lead frame, pin and wire joint portion, and each pixel can comprise LED as above.

Can be by multiple being installed together in above-mentioned LED encapsulation, to form display, the display of different size has the encapsulation of varying number.Figure 15 shows a part for display 170, and it has the LED encapsulation 50 of 16 above-mentioned 2 × 2 that is surface-mounted to display panel 172.Encapsulation 50 has eight pins 76, and panel 172 can comprise interconnection, to allow dynamically to drive the pixel 52a-d in each encapsulation 50, as mentioned above.Panel can comprise the multiple different structure of arranging with multitude of different ways, and one of them execution mode comprises the printed circuit board (PCB) (PCB) with conductive trace at least in part, and encapsulation is installed as with trace and electrically contacts by surface.Should be understood that typical display will have more kinds of encapsulation, to form display, some of them display has enough encapsulation provides hundreds thousand of pixels.

Similarly, can in display, provide other above-mentioned encapsulation.Figure 16 shows another part of display 180, and it has the LED encapsulation 100 of 16 above-mentioned 2 × 2 that is surface-mounted to display panel 182.These encapsulation have 16 pins, and panel 182 can comprise interconnection, to allow driving individually pixel 102a-d, as mentioned above.Panel 182 can comprise the PCB with conductive trace at least in part, and full screen monitor (full display) also can have more encapsulation 100.

By arrange multiple pixels on single package, can be more close (, nearer spacing) each other by pixel arrangement, this can produce more high-resolution light-emitting diode display.Meanwhile, compared with using single pixel LED encapsulation, many pixel encapsulation allow to reduce the complexity of light-emitting diode display.In some embodiments, LED encapsulation can have scope in 0.5 to 3.0mm spacing, and in other embodiments, spacing can be in 1.0 to 2.0mm scope.In other execution mode, the spacing between pixel is approximately 1.5mm.

This encapsulation also can have according to the quantity of the pixel in encapsulation the floor space of different size.For above-mentioned 2 × 2 LED encapsulation 50,100, floor space can be square or rectangle, and the side of the floor space of some of them execution mode is in 2 to 6mm scope.In other embodiments, side can be in 3 to 5mm scope.At some substantially in foursquare execution mode, side can be in 3 to 4mm scope, and in the execution mode of some general rectangular, and side can be in 3 to 4mm scope, and another side can be in 4 to 5mm scope.Should be understood that these are only according to some examples of the size of LED of the present utility model encapsulation, and these sizes can with encapsulation in the increase of quantity of pixel increase pro rata.

Also can comprise the square matrices layout larger than above-mentioned 2 × 2 matrix layout according to the different execution modes of LED of the present utility model encapsulation, comprise 4 × 4,5 × 5,6 × 6 etc.Figure 17 to Figure 22 shows the LED encapsulation 200 according to another execution mode of the present utility model, and it comprises 16 pixels 202 of arranging with 4 × 4 matrix layout.Encapsulation 200 can comprise shown in housing 204, lead frame 206 and wire joint portion 208(Figure 19), be made up of the material identical with above-mentioned material by the method identical with said method housing, lead frame and wire joint portion.Each pixel also can comprise one or more LED, and similar to above-mentioned those pixels, illustrated embodiment has the pixel that comprises three LED208a-c.

The different execution modes of encapsulation 200 can have the lead frame with the pin of varying number, and lead frame and wire joint portion interconnect LED in a different manner.In illustrated embodiment, lead frame 206 comprises the pin efferent structure with 20 pin twos 10, as illustrated best in Figure 21 and Figure 22.Pin two 10 extends from the side surface of encapsulation, and bending below housing 204, installs with the surface of providing convenience, and for example, surface is installed on display panel.The bottom surface of encapsulation 200 also can comprise polarity indicator, can use described polarity indicator to encapsulation is arranged in suitable orientation by picking up with place machine.With reference now to Figure 21,, the polarity indicator 212 of "+" shape is set in the corner of encapsulation 200, however, it should be understood that, polarity indicator can adopt multiple different shape, and can be in multiple different position.For example, Figure 22 arranges leg-of-mutton polarity indicator 214 in the different corners of encapsulation 200.

With reference now to Figure 23,, 20 pin twos 10 have been labeled digital 1-20 around the periphery of encapsulation.The function of being carried out by the signal of telecommunication providing on different pin twos 10 is provided Figure 24.Represent pin one-4 with R1P, R2P, R3P and R4P, each pin provides power to the red LED in four pixels.Represent pin one 2-15 with GB1P, GB2P, GB3P and GB4P, each pin provides power to green and blue led in four pixels.Represent pin 5-8 with R1, R2, R3 and R4, the red LED in four pixels of each pin control luminous.Similarly, represent pin 9-11 and 16 with G1, G2, G3 and G4, the green LED in four pixels of each pin control luminous.Finally, represent pin one 7-20 with B1, B2, B3 and B4, the blue led in four pixels of each pin control luminous.

Figure 25 shows an execution mode of the interconnection 240 between the LED in the different pixels in the time of the pin efferent mark using shown in Figure 24.Each pin one-4(R1P-R4P that is applied to) the signal of telecommunication red LED 208a in corresponding one-row pixels 202 is applied to power, meanwhile, be applied to the luminous of red LED 208a in the signal controlling one row pixel 202 of pin 5-8.The layout of this row and column allows to control the luminous of each red LED.For example, the luminous of the red LED R8 in the second row and secondary series can be by putting on pin two (R2P) and pin 6(R2) signal of telecommunication control.

Can control by similar method the illumination of green and blue led 208b, 208c.Each pin one 2-15(GB1P-GB4P that is applied to) the signal of telecommunication green in corresponding one-row pixels 202 and blue led 208b, 208c are applied to power.Be applied to pin 9-11 and 16(G1-G4) the corresponding row pixel 202 of signal controlling in green LED 208b luminous, and, be applied to pin one 7-20(B1-B4) the corresponding row pixel 202 of signal controlling in blue led 208c luminous.The layout of this row and column allows to control the luminous of each green and blueness.For example, can be by being applied to pin one 4(GB2P) and pin one 0(G2) signal of telecommunication control the second row and secondary series in pixel in green LED G8 luminous.Can be by being also applied to pin one 4(GB2P) and pin one 8(B2) signal of telecommunication control the second row and secondary series in pixel in blue led B8 luminous.This interconnect arrangements is only can be according to the one in the multiple layout using in execution mode of the present utility model.

Identical with above-mentioned encapsulation, multiple 4 × 4 LED encapsulation can be installed together to form display, the display of different size has the encapsulation of varying number.Figure 26 shows an execution mode of a part for display or display 300, and it has the encapsulation 200 of 60 4 × 4, and these encapsulation are installed on display panel 302 with 6 × 10 layout.Panel 302 can comprise the interconnection with the pin efferent structure of encapsulation 20 pins of 200, to allow to drive pixel 202.Panel 302 can comprise the multiple different structure of arranging with multitude of different ways, and one of them execution mode comprises the printed circuit board (PCB) (PCB) with conductive trace at least in part, and encapsulation is installed as with trace and electrically contacts by surface.

Figure 27 shows another execution mode of display 350, and it has the LED encapsulation of 70 4 × 4, and these encapsulation are arranged on display panel 352 with 6 × 12 layouts.Panel 352 can comprise the interconnection with the pin efferent structure of encapsulation 20 pins of 200, to allow to drive pixel 202.Should be understood that typical display will have more encapsulation, to form display, some of them display has enough encapsulation so that hundreds thousand of pixels to be provided.

Refer again to Figure 17, encapsulation 200 can be arranged so that housing 204 upper surface color with compare from the color that encapsulates 200 light that send by groove/cavity 211.In most cases, the light sending from cavity 211 can comprise the combination of the light being sent by LED208a-c.In some embodiments, LED can send white light, and the upper surface of housing can comprise the color comparing with white light.Can use multiple different color, for example, blue, brown, grey, redness, green, purple etc., illustrated embodiment has black on surface thereon.Available multiple different known method applies black colorant.It can apply in the molding process of housing 204, or can in the process of manufacturing and encapsulation, apply with diverse ways in a rear step, for example, and silk screen printing, ink jet printing, japanning etc.Authorizing the people's such as Chan the U.S. Patent application the 12/875th of by name " LED Packagae With Contrasting Face(has the LED encapsulation to specific surface) ", in No. 873, described the LED encapsulation having specific surface, the full content of this U.S. Patent application is incorporated herein by reference.

Although describe the utility model in detail with reference to some preferred structure of the present utility model,, also can carry out other modification.This encapsulation can have multiple different shape and size, can multiple different mode arrange, and can be made up of multiple different material.Can multiple different mode laying out pixel cavity, and can be arranged to multiple different pattern.Can use multiple different feature and make pixel interconnection by multiple interconnection structure.Therefore, spirit and scope of the present utility model should not be limited to above-mentioned modification.

Claims

1. a soild state transmitter encapsulation, is characterized in that, comprising:

Multiple pixels, each pixel all has at least one soild state transmitter and reflector; And

Share base station, transmit the first pixel luminous for controlling described pixel and control the luminous signal of telecommunication of the second pixel in described pixel.

2. encapsulation according to claim 1, is characterized in that, described base station is arranged as and controls independently the luminous of described the first pixel and described the second pixel.

3. encapsulation according to claim 1, is characterized in that, described the first pixel or described the second pixel transmitting white.

4. encapsulation according to claim 1, is characterized in that, described soild state transmitter comprises LED.

5. encapsulation according to claim 4, is characterized in that, at least one in described pixel comprises the LED of the blue light-emitting with phosphor.

6. encapsulation according to claim 4, is characterized in that, at least one in described pixel comprises the LED emitting white light and the LED glowing.

7. encapsulation according to claim 2, is characterized in that, each in described the first pixel and described the second pixel includes redness, green and blue led.

8. encapsulation according to claim 1, is characterized in that, described base station comprises housing, and pin and lead frame structure and described housing form entirety.

9. encapsulation according to claim 8, is characterized in that, further comprises the multiple cavitys that are arranged in described housing, and each cavity limits a pixel.

10. encapsulation according to claim 9, is characterized in that, each cavity has at least one solid-state light emitters.

11. encapsulation according to claim 8, further comprise the contrast district on the end face that is positioned at described housing.

12. encapsulation according to claim 1, is characterized in that, described base station comprises pottery, printed circuit board (PCB), metal-core printed circuit board or FR-4 plate at least in part.

13. encapsulation according to claim 1, is characterized in that, described base station comprises pin and lead frame structure.

14. encapsulation according to claim 1, is characterized in that, described pixel is in matrix layout.

15. encapsulation according to claim 1, is characterized in that, described pixel is in square matrices layout.

16. encapsulation according to claim 1, is characterized in that, described pixel is in linear array layout.

17. encapsulation according to claim 1, is characterized in that, at least two pixel sharing one transmitter power signals, and at least two pixel sharing one reflector control signals.

18. encapsulation according to claim 1, is characterized in that, described pixel is arranged with matrix layout, the described pixel sharing one reflector control signal of the wherein shared transmitter power signal of one-row pixels, and row.

The transmitting of pixel more than 19. 1 kinds encapsulation, comprising:

Housing, has multiple cavitys, and each cavity has at least one LED, and each cavity forms reflector; And

Lead frame structure, forms entirety with described housing, and described at least one LED of each described cavity is mounted to described lead frame structure, and described encapsulation can receive for controlling and come from the first cavity of described cavity and the luminous signal of telecommunication of the second cavity,

Wherein, each described cavity and corresponding described at least one LED thereof comprise pixel, and each pixel all has at least one soild state transmitter and reflector.

20. encapsulation according to claim 19, described encapsulation is arranged to reception and controls independently described the first cavity of coming from described cavity and the luminous signal of telecommunication of described the second cavity.

21. encapsulation according to claim 19, is characterized in that, described in each, cavity includes redness, green and blue led.

22. encapsulation according to claim 19, further comprise the contrast district on the end face that is positioned at described housing.

23. encapsulation according to claim 19, is characterized in that, described pixel is in matrix layout or linear placement.

24. encapsulation according to claim 19, is characterized in that, described pixel is in square matrices layout.

25. encapsulation according to claim 19, is characterized in that, described pixel is in linear array layout.

26. encapsulation according to claim 19, is characterized in that, further comprise and are arranged to the pin efferent that allows the surface of described encapsulation to install.

27. encapsulation according to claim 19, is characterized in that, at least two LED in two cavitys share a LED power signal, and at least two LED in two cavitys share a reflector control signal.

28. encapsulation according to claim 19, is characterized in that, described cavity arranges with matrix layout, and wherein, the LED in one-row pixels shares a transmitter power signal, and LED in the described cavity of row shares a LED control signal.