CN203351143U

CN203351143U - LED displayer

Info

Publication number: CN203351143U
Application number: CN2013203047710U
Authority: CN
Inventors: 彭泽厚; 陈志强; D·埃默森; Y·K·V·刘; 钟振宇
Original assignee: Cree Huizhou Solid State Lighting Co Ltd
Current assignee: Cree Huizhou Solid State Lighting Co Ltd
Priority date: 2013-05-29
Filing date: 2013-05-29
Publication date: 2013-12-18
Anticipated expiration: 2023-05-29

Abstract

The utility model discloses an LED displayer comprising a plurality of LED packages. The plurality of LED packages are relatively arranged to generate messages or images; at least some LED packages of the plurality of LED packages comprise a plurality of pixels; each pixel is provided with at least one LED and a reflector; and each package can receive an electrical signal controlling at least a first pixel and a second pixel. The LED displayer is advantageous in that for instance, cost and interconnection complexity of the packages and the display are reduced.

Description

Light-emitting diode display

Technical field

The utility model relates to LED package and utilizes the display of LED package as its light source.

Background technology

Light emitting diode (LED) is the solid-state device that converts electric energy to light, generally includes the active layer of semiconductor material between one or more layers that are interposed in the phase contra-doping.When on doped layer, applying bias voltage, hole and electronic injection are in active layer, and hole and electronics reconfigure to produce light at active layer.Light sends and sends from all surface of LED from active layer.

Technical development since nearly ten years or longer time has produced the LED of the cost of emission efficiency with more small footprint size, increase and reduction.With other transmitters, compare, LED also has the mission life of increase.For example, the mission life of LED can surpass 50,000 hours, and the mission life of incandescent lamp bulb is approximately 2,000 hours.LED also comparable other light sources is firmer and consume power still less.Due to these reasons and other reasons, it is more popular that LED becomes, and, in increasing application scenario, use now, and traditionally, these application scenarios are fields of incandescent lamp, fluorescent light, Halogen lamp LED and other transmitters.

In order in traditional application scenario, to use LED chip, known LED chip is encapsulated in encapsulation, so that environment and/or mechanical protection, color selection, convergence of rays etc. to be provided.LED encapsulation also comprises electrical lead, contact or trace, with for the LED encapsulation is electrically connected to external circuit.In the typical two pin LED encapsulation/elements 10 shown in Fig. 1, by solder joints or conductive epoxy resin, single led chip 12 is arranged on reflector 13.One or more wires joint portion 11 is connected the ohm contact of LED chip 12 with lead-in wire 15A and/or 15B, lead-in wire 15A and/or 15B can be attached to reflector 13 or form integral body with reflector.Available encapsulant 16 is filled reflector 13, and, on LED chip or in seal, can comprise material for transformation of wave length, for example phosphor.The light that LED issues out at the first wavelength can be absorbed by phosphor, and phosphor can responsively send the light of second wave length.Then, can by whole component package in transparent protection resin 14, this protection resin may be molded as to the shape of lens, to guide the light sent from LED chip 12 or this light is shaped.

Traditional LED encapsulation 20 shown in Fig. 2 can be more suitable in high power operation, and it can produce more heats.In LED encapsulation 20, one or more LED chips 22 are arranged on carrier to described carrier such as printed circuit board (PCB) (PCB) carrier, substrate or base station (submount) 23.The solid metal reflector 24 be installed on base station 23 surrounds LED chip 22, and the light that will be sent by LED chip 22 is away from encapsulation 20 reflections.Reverberator 24 also provides mechanical protection to LED chip 22.Form one or more wires between electric trace 25A, the 25B of ohm contact on LED chip 22 on base station 23 and be combined connecting portion 21.Then, with sealant 26, cover the LED chip 22 of installing, sealant can provide environment and mechanical protection to chip, simultaneously also as lens.Typically, by welding or epoxy resin combination, solid metal reflector 24 is attached to carrier.

Fig. 3 shows another kind of LED encapsulation 30, and it comprises housing 32 and is embedded at least in part the lead frame 34 in housing 32.Lead frame 34 is arranged as the surface installation for encapsulating 30.By the part of the cavity exposed leads frame 34 in housing 32, wherein three LED 36a-c are arranged on the part of lead frame 34 and are connected in other parts of lead frame by wire joint portion 38.Can use dissimilar LED 36a-c, some of them encapsulation have glow, the LED of green light and blue light-emitting.Encapsulation 30 comprises the pin efferent structure with six pins 40, and lead frame is arranged to control independently the luminous of each LED 36a-c by corresponding a pair of pin 40.This allows this encapsulation to send versicolor combination from LED 36a-c.

Available different LED encapsulation (example as shown in Figure 1 to Figure 3 those) as a token of and the light source of display (large with little).The display that comprises big screen LED (usually being called huge screen) is just becoming more general at multiple indoor and outdoor location, for example, and in stadium, runway, concert, and in large-scale common area, for example, the Times Square in New York.By current technology, these displays of part or screen can be greatly to 60 feet high 60 feet wide.Along with technical development, expectation will be developed larger screen.

These screens can comprise millions of or hundreds thousand of " pixel " or " picture element module ", and each can comprise one or more LED chips or encapsulation.Picture element module can be used the LED chip of high-level efficiency and high brightness, and its permission can be seen display from place relatively far away, or even by day when being subject to sunlight.In some signs, each pixel can have a LED chip, picture element module can have few to three or four LED(for example, a redness, a green, a blueness), it allows pixel to send the light of multiple different colours from the combination of ruddiness, green glow and/or blue light.Picture element module can be arranged in square-grid, it can comprise hundreds thousand of LED or LED encapsulation.In the display of a type, grid can be that 640 wide 480 modules of module are high, and the size of screen depends on the physical size of picture element module.When the quantity of pixel increases, the interconnect complexity of display also increases.This interconnect complexity can be in the main spending of these displays, and, can be in manufacture process and the mission life process of display in the major failure source in one.

The utility model content

The utility model relates to emitter package and uses the light-emitting diode display of this encapsulation, cost and interconnect complexity by this package arrangement for the reduction display.Some encapsulation embodiments are arranged as in an encapsulation a plurality of display pixels are provided, make the cost of each pixel, and simplify the Design and manufacture of the display that uses this encapsulation.

According to an embodiment of the present utility model, a kind of light-emitting diode display is provided, it comprises: a plurality of LED encapsulation, install related to each other to produce message or image, at least some LED encapsulation in the LED encapsulation comprise a plurality of pixels, each pixel all has at least one LED and reverberator, and wherein, and each in encapsulation all can receive at least the first pixel for controlling pixel and the luminous electric signal of the second pixel.

Further, at least some encapsulation of encapsulation are arranged at least the first pixel of receiving for controlling independently pixel and the luminous electric signal of the second pixel.

Further, at least some encapsulation in encapsulation comprise surface mount device.

Further, the first pixel and the second pixel comprise lead frame structure and the pin for the luminous electric signal of transfer control pixel.

Further, at least one LED comprises redness, green and blue led.

Further, pixel is in matrix layout or linear placement.

Comprise a plurality of pixels according to an embodiment of soild state transmitter encapsulation of the present utility model, each pixel has at least one soild state transmitter.Comprise for transmitting the shared base station of electric signal, to control the luminous of the first pixel and to control the luminous of the second pixel.

Comprise the housing with a plurality of cavitys according to an embodiment of many pixels light emitting package of the present utility model, each cavity has at least one LED.Comprise with housing and form whole lead frame structure, described at least one LED of each cavity is mounted to lead frame structure.This encapsulation can receive the luminous electric signal that comes from the first and second cavitys for control.

Comprise a plurality of LED encapsulation according to an embodiment of light-emitting diode display of the present utility model, the plurality of LED encapsulation is relative to each other installed, to produce message or image.At least some LED encapsulation in described LED encapsulation comprise a plurality of pixels, and each pixel has at least one LED.Each encapsulation can receive the luminous electric signal of at least the first and second pixels for controlling described pixel.

The utility model provides such advantage, for example, reduces cost and the interconnect complexity of encapsulation and display.

From following the detailed description and the accompanying drawings, these and other aspects of the present utility model and advantage will become apparent, and accompanying drawing shows feature of the present utility model by example.

The accompanying drawing explanation

Fig. 1 is a kind of side view of traditional LED package;

Fig. 2 is the side view of another traditional LED package;

Fig. 3 is the planimetric map of another traditional LED package;

Fig. 4 is the planimetric map according to an embodiment of LED encapsulation of the present utility model;

Fig. 5 is the side view of the LED encapsulation shown in Fig. 4;

Fig. 6 is the opposite side view of the LED encapsulation shown in Fig. 4;

Fig. 7 is the planimetric map according to an embodiment of light-emitting diode display of the present utility model;

Fig. 8 shows the schematic diagram according to the interconnection between the LED in LED encapsulation of the present utility model;

Fig. 9 is the planimetric map according to another embodiment of LED encapsulation of the present utility model;

Figure 10 shows the schematic diagram according to the interconnection between the LED in another LED encapsulation of the present utility model;

Figure 11 is the planimetric map according to another embodiment of LED encapsulation of the present utility model;

Figure 12 is the planimetric map according to another embodiment of LED encapsulation of the present utility model;

Figure 13 is the planimetric map according to another embodiment of LED encapsulation of the present utility model;

Figure 14 is the planimetric map according to the another embodiment of LED encapsulation of the present utility model;

Figure 15 is the planimetric map according to an embodiment of light-emitting diode display of the present utility model;

Figure 16 is the planimetric map according to another embodiment of light-emitting diode display of the present utility model;

Figure 17 is the skeleton view according to another embodiment of LED encapsulation of the present utility model;

Figure 18 is the planimetric map do not encapsulated at the LED of the LED shown in pixel shown in Figure 17;

Figure 19 is the planimetric map of a pixel during the LED of Figure 17 and Figure 18 encapsulates;

Figure 20 is the side view of the LED cut open along the profile line 20-20 encapsulation shown in Figure 17 and Figure 18;

Figure 21 is the backplan of the LED encapsulation shown in Figure 17 and Figure 18;

Figure 22 is the end skeleton view of the LED encapsulation shown in Figure 17 and Figure 18;

Figure 23 is another backplan of the LED encapsulation with a pin numbering layout shown in Figure 17 and Figure 18;

Figure 24 is the schematic diagram according to an embodiment of the pin mark in an embodiment of LED encapsulation of the present utility model;

Figure 25 shows the schematic diagram according to the interconnection between the LED in LED encapsulation of the present utility model, and this LED encapsulation utilizes the pin mark shown in Figure 24;

Figure 26 is the planimetric map according to another embodiment of light-emitting diode display of the present utility model;

Figure 27 is the planimetric map according to another embodiment of light-emitting diode display of the present utility model.

Embodiment

The utility model relates to improved LED encapsulation and uses the light-emitting diode display of this LED encapsulation, according to LED encapsulation of the present utility model, comprises " many pixels " encapsulation.That is to say, this encapsulation comprises more than one pixel, and each pixel comprises one or more light emitting diodes.Different embodiments comprises the different characteristic that applies electric signal for the LED to pixel.In some embodiments, can apply corresponding electric signal to each pixel, to control its glow color and/or intensity, and in other embodiments, available identical electric signal is controlled two or more pixels.There is in the embodiment of a plurality of LED one or more LED in available each pixel of corresponding signal controlling, and in other embodiments, the LED in available identical signal controlling different pixels in pixel.In some embodiments in these embodiments, can control the luminous of two or more pixels with identical signal, and in other embodiments, can control each pixel with corresponding signal.

In some embodiments, the term pixel is interpreted as in its its ordinary meaning to the element of the image that can in display system, process or control separately.In some embodiments in these embodiments, some or all of pixels can comprise glow, the LED of green light and blue light-emitting, at least some in pixel are arranged to and allow the intensity of each LED in pixel to control.This allows each pixel to send a kind of light of color, and it is the combination of ruddiness, green glow or blue light, and the dirigibility while allow driving each pixel, makes it can send different colors, and described different color is the combination from the light of LED.

In other embodiments, this encapsulation can comprise can send single pixel of planting the light of color, and these are encapsulated in different application scenarios and use, for example, and illumination or backlight.In some embodiments in these embodiments, pixel can be sent white light, and can comprise that at least one has the blue led of one or more phosphors, and this LED sends the white light combination of blue light and phosphorescence.Different embodiments in these embodiments can allow to control each LED in each pixel, and in other embodiments, available identical drive LED.In some embodiments, pixel can comprise one or more LED that emit white light, and itself and the LED combination glowed are luminous to realize desired pixel, for example, and required colour temperature.In other embodiments, can control like this luminous of LED in pixel, make pixel send different colour temperatures in the scope of cold Wen Zhire temperature.

Can there are multiple different shape and size according to encapsulation of the present utility model, and can be arranged to the pixel with multiple varying number.In some embodiments, this encapsulation can be foursquare, and can have the pixel of 2 * 2,4 * 4,8 * 8 etc. form.In other embodiments, this encapsulation can be rectangular shape, and pixel can have the form that a pixel on direction is fewer than the pixel on other direction.For example, this encapsulation can have 2 * 3,2 * 4,2 * 5,2 * 6 etc., 3 * 4,3 * 5,3 * 6,3 * 7 etc. or 4 * 5,4 * 6,4 * 7,4 * 8 etc. pixel form.In other embodiment, pixel can form the pixel linear array, and the length of this linear array is 2,3,4,5 etc.These be only the encapsulation shape a part, other be triangle, circle or irregularly shaped.

Provide according to LED encapsulation of the present utility model the special advantage that is better than the single pixel encapsulation of prior art.This LED encapsulation can for example,, by reducing material cost (, lead frame material), make the cost of every pixel lower.When keeping lambert's beam profile, also can reduce the spacing between neighbor.By reducing the spacing between pixel, can manufacture more high-resolution display.Also can, by reducing processing cost and picking up the cost with placing modules, reduce the display manufacturing cost.Also can reduce the complicacy of pixel interconnection, thereby reduce material cost and display manufacturing level.This also can reduce the possible interconnection that there will be fault along with the serviceable life of display.

The utility model can relate to multiple different encapsulated type, and some following embodiments are surface mount devices.Should be understood that the utility model also can be used for other encapsulated types, for example, there is the encapsulation for the pin of through hole mounting process.

In LED sign and display, can use according to LED encapsulation of the present utility model, it should be understood that, it can be used in multiple different application scenario.This LED encapsulation can be deferred to different industry standards, so that it is suitable in LED-based sign, channel letter illumination or common backlight and illumination application.Some embodiments also can comprise and make its compatibility with the flat-top surface of emission with light pipe coupling.These are only according to the several application in the multiple different application occasion of LED encapsulation of the present utility model and oneself.

Single LED chip or many LED chips can be comprised according to LED encapsulation embodiments more of the present utility model, and the reflector that surrounds this list LED chip or many LED chips can be comprised.The upper surface of the housing around each reflector can comprise the material contrary with the material of the light sent by LED chip.The part and/or the reflecting surface in cup that are exposed to the housing in cup also can comprise that reflection comes from the material of the light of LED chip.In some embodiments in these embodiments, the light sent from LED chip can be the light of white light or the conversion of other wavelength, and the reflecting surface of the surface of the base station in reflector and cup can be white, or the light of reflected white-light or wavelength conversion otherwise.(contrasting, relative) upper surface of the contrast of reflector can be multiple different color, and still, in some embodiments, it can be deceived.

This paper describes the utility model with reference to some embodiment, however, it should be understood that, the utility model can multiple different form be implemented, and, it should be interpreted as being limited to the embodiment of setting forth here.Especially, except those above-mentioned embodiment, can provide multiple different LED chip, reflector and lead frame to arrange, and sealant can provide further feature to improve reliability and the characteristics of luminescence that LED encapsulated and used the light-emitting diode display of this LED encapsulation.Although the different embodiments of LED encapsulation discussed here are used for light-emitting diode display,, can in multiple different illuminations application, use the LED encapsulation.

Should also be understood that and be called as while being positioned on another element when the element such as layer, zone or substrate, it can be located immediately on this another element, or also may have insertion element.In addition, may use here such as the relational terms of " in ... top " and " in ... below " and similarly term a layer or another regional relation are described.Should be understood that these terms are intended to comprise the different directions except the direction shown in figure of device.

Although can various elements, parts, zone, layer and/or part be described by first, second grade of term here,, these elements, parts, zone, layer and/or part should not be limited to these terms.These terms only are used for an element, parts, zone, layer or part and another zone, layer or part are distinguished.Therefore, under the prerequisite that does not deviate from instruction of the present utility model, the first element discussed below, parts, zone, layer or part also can be called the second element, parts, zone, layer or part.

, with reference to cross-sectional illustration, described embodiment of the present utility model here, this diagram is the schematic diagram of embodiment of the present utility model.Similarly, the actual (real) thickness of these layers can be different, and estimates for example different from illustrated shape due to the result of manufacturing technology and/or tolerance.Embodiment of the present utility model should be interpreted as being limited to the special shape in shown here zone, but should comprise for example by manufacturing the form variations produced.Due to normal manufacturing tolerance, the zone that illustrates or be described as square or rectangle will typically have fillet or bending features.Therefore, the zone shown in figure is schematically in essence, and its shape is not intended to illustrate the accurate shape in the zone of device, nor is intended to limit scope of the present utility model.

Fig. 4 to Fig. 7 shows the embodiment according to many pixels emitter package 50 of the present utility model, and wherein illustrate in greater detail can be at the pixel transmitter according to using in embodiments more of the present utility model for Fig. 7.This encapsulation comprises four pixel 52a-d that are arranged as 2 * 2 forms or layout, encapsulates 50 and has common foursquare floor area.Encapsulation 50 features that can comprise for different installation methods, wherein illustrated embodiment has the feature that allows surface to install.That is to say, encapsulate 50 and comprise surface mount device (SMD), it has pin and lead frame structure, and wherein the pin efferent is arranged such that to utilize surface mounting technique that encapsulation is mounted to structure (for example, printed circuit board (PCB) (PCB)).As mentioned above, should be understood that except SMD, the utility model also can be applicable to other emitter package types, and for example, pin is installed emitter package.Encapsulation 50 comprises housing or base station 54, and this housing or base station carry whole lead frame 56.Lead frame 56 comprises a plurality of conductive connection parts, and the plurality of conductive connection part is used for the optical transmitting set to encapsulation by electrical signal conduction, and with the heat of helping to disperse by the transmitter generation.

Housing or base station (housing) 54 can be by being combined to form of multiple different material or material, and, can there is different materials in different parts.A kind of acceptable case material is electrical isolation, for example, and dielectric material.Housing 54 can comprise pottery at least in part, for example aluminium oxide, aluminium nitride, silit or polymeric material (for example polyimide and polyester).In some embodiments, housing 54 can comprise the dielectric material with relatively high temperature conductivity, for example, and aluminium nitride and aluminium oxide.In other embodiments, base station 54 can comprise printed circuit board (PCB) (PCB), sapphire or silicon or any other suitable material, and for example, the heat insulation backing material of plating T, can obtain from the Bergquist company of Minnesota State Chanhassen.For the PCB embodiment, can use different PCB types, for example, the printed circuit board (PCB) of the FR-4PCB of standard, metal-cored PCB or any other type.

Can multiple different mode arrange lead frame 56, and, in different encapsulation embodiments, can use the part of varying number.Pixel can have identical one or more transmitters, LED for example, and in some embodiments, different pixels can have the LED of varying number.As illustrated best in Fig. 7, each pixel encapsulated in 50 all can comprise three LED 58a-c, and in illustrated embodiment, lead frame 56 is arranged as LED 58a-c is applied to electric signal.Lead frame 56 comprises conductive pieces, with for will from the encapsulation installed surface (for example PCB) electrical signal conduction to LED58a-c.Lead frame also can comprise such feature, that is, this feature can be included and stability is installed and is provided for dispersing the extra hot path from the heat of transmitter so that LED is provided.Lead frame also can comprise physical features, for example, hole, otch etc., to increase stability and the reliability of encapsulation, and, in some embodiments, help the waterproof sealing between holding member.U.S. Patent application the 13/192nd in " encapsulation of Water Resistant Surface Mount Device Package(water-proof surface installing device) " by name of authorizing the people such as Chan, described these different features in No. 293, the full content of this U.S. Patent application is incorporated herein by reference.

Can by punching press, injection moulding, cutting, etching, bending or by other, known method and/or the combination of these methods realize desired structure, thus realize the manufacture of lead frame 56.For example, conductive pieces can by metal stamping partly (for example,, simultaneously from the punching press of monolithic associated materials), suitably crooked and separate fully or a part that forms housing or all after separation fully.

Lead frame 56 can for example, be made by conducting metal or metal alloy (, copper, aldary) and/or the combination of other suitable low resistances, resistant material or these materials.As mentioned above, the temperature conductivity of lead-in wire may help to conduct away heat from LED 58a-c to a certain extent.

Housing 54 can have multiple different shape and size, and in the embodiment shown, and normally square or rectangle, have upper surface 60 and lower surface 62(illustrates best in Fig. 5 and Fig. 6) and the first and second side surfaces 64 and 66.The top of housing further comprises groove or cavity 72, described groove or cavity from upper surface 60 stretches into the body of housing 54, arrive lead frame 56.The LED 58a-c of each pixel is arranged on the lead frame 56 in a corresponding cavity 72, makes the light from LED send from encapsulating 50 by cavity 72.Each cavity 72 can have angled side surface, and described angled side surface forms reflector around LED 58a-c, with help, the light of transmitter is reflexed to outside encapsulation 50.In some embodiments, can be along at least a portion location fixation reflex embolus or the ring (not shown) of the side surface 74 of cavity 72.Can be by cavity 72 being tapered increase the reflection efficiency of ring and the emission angle of encapsulation, and, in cavity towards the inside carrier bar in the inside of housing.By example, the reflection angle of about 50 degree provides suitable reflectivity and visual angle.

In some embodiments, available packing material (or sealant) is filled chamber 72 at least in part, and this packing material can be protected lead frame 56 and LED 58a-c, and makes lead frame and LED stable in position.In some embodiments, packing material may cover the part that cavity 72 exposes of passing through of transmitter and lead frame 56.Packing material can be chosen as and have predetermined optical characteristics, to strengthen from the light of LED projection, and in some embodiments, packing material is transparent basically for the light of the emission of the transmitter by encapsulation.Packing material can also be flat, make its with upper surface 60 on approximately identical plane, or, can make its form with lens be shaped, for example, semisphere or bullet shaped.Replacedly, packing material can completely or partially be recessed in one or more cavitys 72.Packing material may be by resin, epoxy resin, thermoplastic condensed polymer, glass, and/or being combined to form of other suitable materials or these materials.In some embodiments, can increase material to packing material, to strengthen towards LED and/or to come from emission, absorption and/or the diffusion of the light of LED.

Housing 54 can be made by the material of preferably electrical isolation and heat conduction.This material is well-known in the art, can include but not limited to some pottery, resin, epoxy resin, thermoplastics, condensed polymer (for example, polyphthalamide (PPA)) and glass.Encapsulation 50 and housing 54 thereof may form and/or assemble by any in several different methods as known in the art.For example, can around lead frame, form or molded shell 54, for example, by injection moulding.Replacedly, can for example, in some parts (top and bottom), form housing, wherein conductive pieces is formed on bottom.Then, can utilize known method and material (for example,, by epoxy resin, bonding agent or other suitable grafting materials) that top and bottom are combined.

Can use multiple different transmitter according to encapsulation of the present utility model, wherein encapsulate 50 use LED 58a-c.Different embodiments can have the different LED chip of the light that sends different colours, and, in illustrated embodiment, encapsulation each pixel in 50 comprise glow, the LED chip of green light and blue light-emitting, these LED chips can produce luminous (the comprising white light) of the combined colors of multiple different wave length.

LED chip structure, feature, with and manufacture and operation is usually known in the art, only discuss briefly here.LED chip can have the multiple different semiconductor layer of arranging by different way, and can send different colors.Available known method is manufactured these layers of LED chip, and a kind of suitable method is to use Organometallic Chemistry vapor deposition (MOCVD) manufacture.These of LED chip layer generally include the active layer/zone between the epitaxial loayer that is interposed in the first and second phase contra-dopings, and all these active layer/zones are formed on growth substrates or wafer continuously.Being formed at LED chip on wafer can be by individualized (singulated separates), and can be used for different application scenarios, for example, is arranged in encapsulation.Should be understood that grown substrate/wafer can keep the part as finally individualized LED chip, or the substrate of growing can completely or partially be removed.

Should also be understood that and also can comprise extra layer and element in LED chip, described extra layer and element include but not limited to cushion, nucleating layer, contact layer and current distribution layer and light-extraction layer and element.Active region can comprise single quantum well (SQW), Multiple Quantum Well (MQW), double-heterostructure or superstructure.

Active region and doped layer may be made by different material systems, and a this system is based on the material system of III group-III nitride.The III group-III nitride refers to the semiconducting compound formed between those family of III at nitrogen and periodic table elements (normally aluminium (Al), gallium (Ga) and indium (In)).This term also refers to ternary and quaternary compound, for example, and aluminium gallium nitride alloy (AlGaN) and aluminum indium nitride gallium (AlInGaN).In a preferred implementation, doped layer is gallium nitride (GaN), and active region is InGaN.In alternate embodiments, doped layer can be AlGaN, aluminum gallium arsenide (AlGaAs) or phosphatization aluminum gallium arsenide indium (AlGaInAsP) or AlGaInP (AlInGaP) or zinc paste (ZnO).

The substrate/wafer of growing can be made of a variety of materials, for example, silicon, glass, sapphire, silit, aluminium nitride (AlN), gallium nitride (GaN), wherein suitable substrate is the 4H polytype of silit, although also can use other silit polytypes, comprise 3C, 6H and 15R polytype.Silit has some advantages, for example, with sapphire, compares, and the lattice more mated with the III group-III nitride, and produce and there is higher-quality III group-III nitride film.Silit also has very high temperature conductivity, makes the gross output of the III nitride devices on silit can't help the heat dissipation restriction (identical as the situation that is formed at some devices on sapphire) of substrate.The SiC substrate can obtain from the Cree Research Inc. of North Carolina state Durham, and, in scientific literature and at United States Patent (USP) Re 34,861; 4,946,547 and 5,200, set forth its manufacture method in No. 022.LED also can comprise extra feature, for example, conductive current distributed architecture and current distribution layer, all these can be made by the known materials by the known method deposition.

LED 58a-c can be mounted to lead frame 56, and for example, be electrically coupled with lead frame 56 by the bond material (, scolder, bonding agent, coating, film, sealant, slurry, lubricating oil and/or other suitable materials) of conductive and heat-conductive.In a preferred implementation, can be with the weld pad on the LED bottom by the LED electric coupling and be fixed to its corresponding liner, make from top and cannot see scolder.Can be included in shown in the wire joint portion 74(Fig. 7 extended between LED 58a-c and lead frame 56).

Different embodiment of the present utility model can have different pin efferents and arrange, this layout can be depending on different factors, for example, the separation on each LED in the interconnection of the quantity of LED, LED and each pixel and/or pixel and the independent level of controlling.Fig. 7 shows the encapsulation 50 that has 8 pins 76 in its pin efferent structure, and Fig. 8 shows the embodiment according to interconnection structure 80 of the present utility model, and it can utilize the pin efferent of 8 pins.Interconnection structure 80 shows four pixel 52a-d, and each pixel comprises three LED 58a-c, and the electrical connection between LED 58a-c can provide by the wire joint portion 74 shown in lead frame 56 and/or Fig. 7.The power that electric signal V1 on pin and V2 provide driving LED, wherein V1 drives the first and the 3rd pixel 52a, 52c, and V2 drives another two pixel 52b, 52d.Electric signal R1, G1 on pin and B1 control the luminous of LED 58a-c in the first two pixel 52a, 52b, and signal R2, G2 and B2 control the luminous of LED 58a-c in latter two pixel 52c, 52d.This layout allows dynamically to control pixel 52a-d, and each pixel is controlled by the respective combination of driving and control signal.In illustrated embodiment, V1, R1, G1 and B1 control the luminous of the first pixel 52a, and V1, R2, G2 and B2 control the luminous of the 3rd pixel 52c.Similarly, V2, R1, G1 and B1 control the luminous of the second pixel 52b, and V2, R2, G2 and B2 control the luminous of the 4th pixel 52d.

It should be understood that the different pins that can have varying number in its pin efferent structure that is encapsulated in, and pixel and LED can multiple different mode interconnect, this different mode is different lead frame structure and wire joint portion.Fig. 9 shows another embodiment according to LED encapsulation 100 of the present utility model, and it also has four pixel 102a-d of 2 * 2 layouts.This encapsulation further comprises housing 104 and lead frame 106, the available method same as described above of each in housing and lead frame and material manufacture.Each pixel 102a-d also can comprise one or more LED, described embodiment comprise three to above-mentioned similar LED 108a-c.Encapsulation 100 also can comprise wire joint portion 110, between the LED 108a-c in lead frame 106 and pixel 102a-d, to provide electrical connection.

Encapsulation 100 also comprises the pin efferent structure with 16 pin ones 12, and Figure 10 shows the embodiment according to interconnection structure 120 of the present utility model, this embodiment can be used the structure with 16 pin ones 12 and four pixels, as in the embodiment of Fig. 9.Interconnection structure 120 is provided by lead frame 106 and wire joint portion 110, and allows the independent control of pixel 102a-d.That is to say, each pixel 102a-d has its oneself pin, so that corresponding power signal to be provided, and has one group of pin, with the LED 108a-c in its pixel luminous, provides control.For pixel 102a, can on pin V11, provide power signal, this signal controlling is arranged at the luminous of LED 108a-c on pin R11, G11 and B11.For pixel 102b, power is provided on V12, and on pin R12, G12 and B12, provides LED to control.Similarly, by V22, R22, G22 and B22, to pixel 102c, provide power and control, and provide power and control by V21, R21, G21 and B21 to pixel 102d.With above-mentioned encapsulation 50, compare, this arranges needs more pin one 12, but allows correspondingly to control the luminous of each pixel 102a-d.These are only can be in the multiple different pin efferents that provide according to encapsulation of the present utility model and interconnection structure two kinds.

As discussed above, except encapsulating 2 * 2 layouts shown in 50 and 100, according to encapsulation of the present utility model, can be provided with multiple different matrix layout.Figure 11 shows the encapsulation 130 of another embodiment, and it has six pixel 132a-f that arrange with 2 * 3 matrix layout.Figure 12 shows the encapsulation 140 of another embodiment, and it has eight pixel 142a-h that arrange with 2 * 4 matrix layout.Each encapsulation 130,140 comprises housing, and its lead frame, pin and wire joint portion, with above-described those are similar, still are arranged to the pixel of the larger quantity of adaptation.Each pixel also can comprise the LED of varying number, as mentioned above, shown in pixel there are three LED.

Can also array or linear placement provide according to LED encapsulation of the present utility model.Figure 13 shows the LED encapsulation 150 according to another embodiment of the present utility model, and it has two pixel 152a-b that are arranged to 2 * 1 linear forms.Figure 14 shows the LED encapsulation 160 according to another embodiment of the present utility model, and it has four pixel 162a-d that are arranged to 4 * 1 linear forms.Each encapsulation also comprises housing as above, lead frame, pin and wire joint portion, and each pixel can comprise LED as above.

Can be by a plurality of being installed together in above-mentioned LED encapsulation, to form display, the display of different size has the encapsulation of varying number.Figure 15 shows the part of display 170, and it has the LED encapsulation 50 of 16 above-mentioned 2 * 2 that is surface-mounted to display board 172.Encapsulation 50 has eight pins 76, and panel 172 can comprise interconnection, to allow dynamically to drive the pixel 52a-d in each encapsulation 50, as mentioned above.Panel can comprise the multiple different structure of arranging with multitude of different ways, and one of them embodiment comprises the printed circuit board (PCB) (PCB) with conductive trace at least in part, and encapsulation is installed as with trace and electrically contacts by surface.Should be understood that typical display will have more kinds of encapsulation, to form display, the some of them display has enough encapsulation provides hundreds thousand of pixels.

Similarly, can in display, provide other above-mentioned encapsulation.Figure 16 shows another part of display 180, and it has the LED encapsulation 100 of 16 above-mentioned 2 * 2 that is surface-mounted to display board 182.These encapsulation have 16 pins, and panel 182 can comprise interconnection, to allow driving individually pixel 102a-d, as mentioned above.Panel 182 can comprise the PCB with conductive trace at least in part, and full screen monitor (full display) also can have more encapsulation 100.

By arrange a plurality of pixels on single package, can be more close (that is, nearer spacing) each other by pixel arrangement, this can produce more high-resolution light-emitting diode display., with using single pixel LED encapsulation, compare, many pixel encapsulation allow to reduce the complicacy of light-emitting diode display simultaneously.In some embodiments, LED encapsulation can have scope in 0.5 to 3.0mm spacing, and in other embodiments, spacing can be in 1.0 to 2.0mm scope.In other embodiment, the spacing between pixel is approximately 1.5mm.

This encapsulation also can have the floor area of different size according to the quantity of the pixel in encapsulation.For above-mentioned 2 * 2 LED encapsulation 50,100, floor area can be square or rectangle, and the side of the floor area of some of them embodiment is in 2 to 6mm scope.In other embodiments, side can be in 3 to 5mm scope.At some substantially in foursquare embodiment, side can be in 3 to 4mm scope, and in the embodiment of some general rectangular, and side can be in 3 to 4mm scope, and another side can be in 4 to 5mm scope.Should be understood that these are only some examples according to the size of LED of the present utility model encapsulation, and these sizes can with encapsulation in the increase of quantity of pixel increase pro rata.

Also can comprise the square matrices layout larger than above-mentioned 2 * 2 matrix layout according to the different embodiments of LED of the present utility model encapsulation, comprise 4 * 4,5 * 5,6 * 6 etc.Figure 17 to Figure 22 shows the LED encapsulation 200 according to another embodiment of the present utility model, and it comprises 16 pixels 202 of arranging with 4 * 4 matrix layout.Encapsulation 200 can comprise shown in housing 204, lead frame 206 and wire joint portion 208(Figure 19), housing, lead frame and wire joint portion are made by the material identical with above-mentioned material by the method identical with said method.Each pixel also can comprise one or more LED, and similar to above-mentioned those pixels, illustrated embodiment has the pixel that comprises three LED 208a-c.

The different embodiments of encapsulation 200 can have the lead frame with the pin of varying number, and lead frame and wire joint portion interconnect LED in a different manner.In illustrated embodiment, lead frame 206 comprises the pin efferent structure with 20 pin twos 10, as illustrated best in Figure 21 and Figure 22.Pin two 10 extends from the side surface of encapsulation, and crooked below housing 204, with the surface of providing convenience, installs, and for example, surface is installed on display board.The bottom surface of encapsulation 200 also can comprise polarity indicator, can use described polarity indicator in order to encapsulation is arranged in suitable orientation by picking up with place machine.With reference now to Figure 21,, the polarity indicator 212 of "+" shape is set in the corner of encapsulation 200, however, it should be understood that, polarity indicator can adopt multiple different shape, and can be in multiple different position.For example, Figure 22 arranges leg-of-mutton polarity indicator 214 in the different corners of encapsulation 200.

With reference now to Figure 23,, 20 pin twos 10 have been labeled digital 1-20 around the periphery encapsulated.The function of being carried out by the electric signal provided on different pin twos 10 is provided Figure 24.Mean pin one-4 with R1P, R2P, R3P and R4P, each pin provides power to the red LED in four pixels.Mean pin one 2-15 with GB1P, GB2P, GB3P and GB4P, each pin provides power to green and the blue led in four pixels.Mean pin 5-8 with R1, R2, R3 and R4, each pin is controlled the luminous of red LED in four pixels.Similarly, with G1, G2, G3 and G4, mean pin 9-11 and 16, each pin is controlled the luminous of green LED in four pixels.Finally, with B1, B2, B3 and B4, mean pin one 7-20, each pin is controlled the luminous of blue led in four pixels.

Figure 25 shows an embodiment of the interconnection 240 between the LED in the different pixels when the pin efferent mark used shown in Figure 24.Each is applied to pin one-4(R1P-R4P) electric signal the red LED 208a in corresponding one-row pixels 202 is applied to power, simultaneously, be applied to the luminous of red LED 208a in the signal controlling one row pixel 202 of pin 5-8.The layout of this row and column allows to control the luminous of each red LED.For example, the luminous of the red LED R8 in the second row and secondary series can be by putting on pin two (R2P) and pin 6(R2) electric signal control.

Can control by similar method the illumination of green and blue led 208b, 208c.Each is applied to pin one 2-15(GB1P-GB4P) electric signal the green in corresponding one-row pixels 202 and blue led 208b, 208c are applied to power.Be applied to pin 9-11 and 16(G1-G4) the corresponding row pixel 202 of signal controlling in green LED 208b luminous, and, be applied to pin one 7-20(B1-B4) the corresponding row pixel 202 of signal controlling in blue led 208c luminous.The layout of this row and column allows to control the luminous of each green and blueness.For example, can be by being applied to pin one 4(GB2P) and pin one 0(G2) electric signal control the luminous of green LED G8 in the pixel in the second row and secondary series.Can be by also being applied to pin one 4(GB2P) and pin one 8(B2) electric signal control the luminous of blue led B8 in the pixel in the second row and secondary series.This interconnect arrangements be only can be in the multiple layout according to using in embodiment of the present utility model a kind of.

Identical with above-mentioned encapsulation, a plurality of 4 * 4 LED encapsulation can be installed together to form display, the display of different size has the encapsulation of varying number.Figure 26 shows an embodiment of the part of display or display 300, and it has the encapsulation 200 of 60 4 * 4, and these encapsulation are installed on display board 302 with 6 * 10 layout.Panel 302 can comprise the interconnection with the pin efferent structure of encapsulation 20 pins of 200, to allow to drive pixel 202.Panel 302 can comprise the multiple different structure of arranging with multitude of different ways, and one of them embodiment comprises the printed circuit board (PCB) (PCB) with conductive trace at least in part, and encapsulation is installed as with trace and electrically contacts by surface.

Figure 27 shows another embodiment of display 350, and it has the LED encapsulation of 70 4 * 4, and these encapsulation are arranged on display board 352 with 6 * 12 layouts.Panel 352 can comprise the interconnection with the pin efferent structure of encapsulation 20 pins of 200, to allow to drive pixel 202.Should be understood that typical display will have more encapsulation, to form display, the some of them display has enough encapsulation so that hundreds thousand of pixels to be provided.

Refer again to Figure 17, encapsulate 200 can be arranged so that housing 204 upper surface color with from the color that encapsulates 200 light that send by groove/cavity 211, compare.In most cases, the light sent from cavity 211 can comprise the combination of the light sent by LED 208a-c.In some embodiments, LED can send white light, and the upper surface of housing can comprise the color compared with white light.Can use multiple different color, for example, blue, brown, grey, redness, green, purple etc., illustrated embodiment has black on surface thereon.Available multiple different known method applies black colorant.It can apply in the molding process of housing 204, or can in the process of manufacturing and encapsulation, in a rear step, with diverse ways, apply, for example, and serigraphy, ink jet printing, japanning etc.U.S. Patent application the 12/875th " LED Packagae With Contrasting Face(has the LED encapsulation to specific surface) " by name of authorizing the people such as Chan, described the LED encapsulation had specific surface in No. 873, the full content of this U.S. Patent application is incorporated herein by reference.

Although with reference to some preferred structure of the present utility model, describe the utility model in detail,, also can carry out other modification.This encapsulation can have multiple different shape and size, can multiple different mode arrange, and can be made by multiple different material.Can multiple different mode laying out pixel cavity, and it can be arranged to multiple different pattern.Can use multiple different feature and make the pixel interconnection by multiple interconnection structure.Therefore, spirit and scope of the present utility model should not be limited to above-mentioned modification.

Claims

1. a light-emitting diode display, is characterized in that, comprising:

A plurality of LED encapsulation, install related to each other to produce message or image, at least some LED encapsulation in described LED encapsulation comprise a plurality of pixels, each pixel all has at least one LED and reverberator, and wherein, each in described encapsulation all can receive at least the first pixel for controlling described pixel and the luminous electric signal of the second pixel.

2. light-emitting diode display according to claim 1, is characterized in that, described at least some encapsulation of described encapsulation are arranged at least the first pixel of receiving for controlling independently described pixel and the luminous electric signal of the second pixel.

3. light-emitting diode display according to claim 1, is characterized in that, at least some encapsulation in described encapsulation comprise surface mount device.

4. light-emitting diode display according to claim 1, is characterized in that, described the first pixel and described the second pixel comprise lead frame structure and the pin for the luminous electric signal of the described pixel of transfer control.

5. light-emitting diode display according to claim 1, is characterized in that, described at least one LED comprises redness, green and blue led.

6. light-emitting diode display according to claim 1, is characterized in that, described pixel is in matrix layout or linear placement.