CN209389063U - LED support, LED light emitting device and light emitting device - Google Patents

Abstract

The utility model provides a kind of LED support LED light emitting device and light emitting device, the LED support includes: that the lead being dielectrically separated from takes shape in lead to upper Base body to by unsaturated polyester resin, and lead, which forms the part of the lateral surface exposing in Base body, exposes leading part.LED support in the utility model is formed by unsaturated polyester resin, burr generation can be effectively suppressed when molding, it is higher to deteriorate patience, requirement to forming temperature and pressure is lower, it can effectively ensure that product quality and production efficiency, while lead forms the part exposed in the side of Base body and exposes leading part, can realize the connection with LED by exposing leading part in electrical connection, the mode for enriching LED electrical connection improves the flexibility of LED application.

Description

LED support, LED light emitting device and light emitting device

Technical field

The utility model relates to LED (Light Emitting Diode, light emitting diode) technical fields more particularly to one Kind LED support and preparation method thereof, LED light emitting device and light emitting device.

Background technique

In recent years, LED is by superiority such as its unique low price, low consumption, high brightness, long-lives always in mobile terminal Display field plays important role, and there are also sizable development spaces within quite long one period from now on.It is existing In some LED production technologies, when carrying out the injection molding of LED support, used thermoplastic resin viscosity is high, mobility is low And water absorption rate is high, to the more demanding of forming temperature, pressure etc., and more importantly, shining for a long time in LED chip When, thermoplastic resin is easy to deteriorate discoloration because of the ultraviolet light in light when carrying out the reflection of light, and causes under reflectivity Drop.

Utility model content

LED support, LED light emitting device and light emitting device provided by the embodiment of the utility model, the technology mainly solved are asked Topic is: thermoplastic resin used by existing LED support forms to forming temperature, pressure requirements are higher, deterioration patience is poor, The problem that caused production efficiency is limited, product quality is poor.

In order to solve the above technical problems, the utility model embodiment provides a kind of LED support, comprising: lead pair, setting In the lead to the insulating isolation belt between included positive wire and negative wire, and the lead is set to upper Base body, the material of the Base body is unsaturated polyester resin, and the Base body has in the lead to upper The reflection cavity being enclosed on surface, the reflection cavity is for placing LED chip；The positive wire and cathode of the lead pair draw Line has the part for exposing the Base body lateral surface, to form exposing leading part.

Optionally, filler and/or titanium dioxide are added in the unsaturated polyester resin, the filler includes glass fibers Peacekeeping silica.

Optionally, in the unsaturated polyester resin be added with the filler and the titanium dioxide, the glass fibre, Ingredient ratio respectively B, C, D of silica, titanium dioxide, wherein 3%≤B≤20%, 15%≤C≤32%, 20%≤D ≤ 40%.

Optionally, the glass fibre, silica, titanium dioxide ingredient than be respectively 5%≤B≤15%, 20% ≤ C≤30%, 25%≤D≤35%；

Or,

The glass fibre, silica, titanium dioxide ingredient than be respectively 5%≤B≤15%, 20%≤C≤ 30%, 30%≤D≤40%.

Optionally, additive is also added in the unsaturated polyester resin, the ingredient ratio E of the additive is 1%≤E ≤ 3%.

Optionally, the additive includes at least one of the following:

Maleic anhydride, fumaric acid, styrene, packing material, reinforcing agent, curing agent, release agent, pigment.

Optionally, the upper surface and/or lower surface of the lead pair are equipped with metal layer；

And/or

It is described to expose the exposed portion of ontology that leading part is the positive wire and/or negative wire.

Optionally, the exposing leading part overall distribution is on two adjacent sides of the Base body.

To solve the above-mentioned problems, the utility model additionally provides a kind of LED light emitting device, including described in any one as above LED support and at least LED chip that is packaged in the Base body of the LED support.

To solve the above-mentioned problems, the utility model additionally provides a kind of light emitting device, including LED as described above shines Device, the light emitting device are lighting device, optical signal instruction device, light compensating apparatus or back lighting device.

The beneficial effects of the utility model are:

According to LED support provided by the embodiment of the utility model, LED light emitting device and light emitting device, the LED support packet Include: the lead being dielectrically separated from takes shape in lead to upper Base body to by unsaturated polyester resin, and lead is in pedestal The part that the lateral surface of main body exposes, which is formed, exposes leading part.LED support in the utility model passes through unsaturated polyester resin Burr generation can be effectively suppressed in molding, when molding, and deterioration patience is higher, and the requirement to forming temperature and pressure is lower, can be effective Guarantee product quality and production efficiency；Lead, which forms the part of the lateral surface exposing in Base body, simultaneously exposes leading part, The connection with LED can be realized by exposing leading part in electrical connection, the mode of LED electrical connection is enriched, improves LED application Flexibility.

Detailed description of the invention

Fig. 1 is a kind of structural schematic diagram for LED support that the utility model embodiment one provides；

Fig. 2 is structural schematic diagram of the LED support that provides of the utility model embodiment one before singualtion；

Fig. 3 is a kind of structural schematic diagram for lead frame that the utility model embodiment one provides；

Fig. 4 is the structural schematic diagram for another lead frame that the utility model embodiment one provides；

Fig. 5 is the structural schematic diagram for another LED support that the utility model embodiment one provides；

Fig. 6 is the structural schematic diagram for another LED support that the utility model embodiment one provides；

Fig. 7 is the structural schematic diagram for the LED light emitting device that the utility model embodiment one provides；

Fig. 8 is the flow chart for the LED support production method that the utility model embodiment one provides.

Specific embodiment

In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below by specific embodiment party Formula combination attached drawing is described in further detail the utility model embodiment.It should be appreciated that specific embodiment described herein It is only used to explain the utility model, is not used to limit the utility model.

Embodiment one:

Be directed in the prior art, LED support form used by thermoplastic resin to forming temperature, pressure requirements compared with Height, deterioration patience are poor, and the problem that caused production efficiency is limited, product quality is poor, the utility model provides one kind LED support.Specifically referring to Figure 1, shown in figure 1 is a kind of structural schematic diagram of LED support provided in this embodiment, should LED support, which includes: the lead that is dielectrically separated from, takes shape in lead to the pedestal master on 111 to 111 and by unsaturated polyester resin Body 12, lead form exposing lead in the part that the lateral surface of Base body 12 exposes to 111 positive wire and negative wire Portion 112.The positive wire and negative wire that lead includes to 111 are isolated by being set to insulating isolation belt between the two.

A kind of example refers to Fig. 2 and Fig. 3, wherein illustrated in fig. 2 is LED support provided in this embodiment in monolithic Structural schematic diagram before change, illustrated in fig. 3 is a kind of structural schematic diagram of lead frame provided in this embodiment.In reality In, before LED support singualtion, multiple Base bodies usually is formed on a lead frame, are then reprocessed Multiple LED supports out.As a kind of preferable example of the present embodiment, lead frame 11 includes at least one set of lead being dielectrically separated from To 111, Base body 12 is taken shape on lead frame 11 by unsaturated polyester resin, and the exposing of 12 lateral surface of Base body is drawn Line portion 112 is arranged in lead and carries out cutting it to the position of the notch 113 of 111 peripheries by corresponding in Base body 12 Afterwards, by lead to 111 be connected in lead frame main body, between notch 113 cutting portion 114 be cut off and formed, it is excellent Choosing, the lateral surface for exposing leading part 112 and Base body 12 can be generally in same plane.

It should be understood that LED support includes that lead frame 11 and clamping are being drawn in a mold referring again to Fig. 2 The Base body 12 of injection molding on wire frame 11, the Base body 12 on LED support after molding are formed with as LED chip Packaging area groove 121, from the upper surface of LED support groove 121 can for circle, ellipse, quadrangle etc. no Similar shape, it is preferred that the periphery of groove 121 is gradually increased from bottom to top.It include wherein just provided by lead frame 11 The lead of pole lead and negative wire is at least partly exposed to the bottom surface of groove 121 to 111, thus the mounting as LED chip Region, lead separate specific interval to 111 and are arranged, be dielectrically separated from after potting resin therebetween, in addition, this implementation Lead in example exposes to 111 in the lateral surface of LED support and lower surface, to need to be placed in by lead subsequent LED chip and when turned on outside, lead comes and outside 111 lower surface and lateral surface as welding section in the present embodiment Electrical connection.In practical applications, LED chip can be positioned on positive wire, and LED chip is then passed through metal wire and anode Then LED chip is connect by metal wire with negative wire, certainly, in practical applications, if by LED by lead electrical connection again Flip-chip, then can be without the metal wire of aforementioned connection LED chip and lead.Top opening from groove 121 to Base body 12, So as to the encapsulation from opening to material is sealed inside groove 121.

Referring to Fig. 3, in some examples of the present embodiment, lead frame 11 can use flat conductive gold Belong to plate to be made, the upper and lower surface of so-called tabular namely conductive metal sheet is plane, in the present embodiment can using punching or The mode of etching is processed flat conductive metal sheet, thus on a metal plate it is horizontal and vertical it is upper formed it is linear Notch 113, notch 113 are the cutting position when lead frame 11 after injection molding to be cut into LED support monomer, and also Through processing area of isolation on conductive metal sheet, to be formed, be dielectrically separated from includes drawing for positive wire and negative wire Line is to 111.Wherein, in order to enable being formed by lead frame 11 after processing is able to maintain overall stability, in the present embodiment There is cutting portion 114 between longitudinal cut and transverse incision, draw so that lead can be cut off portion 114 and be connected to 111 On wire frame frame body, and it is unlikely to lead and falls off from lead frame 11 to 111.Due to being filled with resin in notch, So the bonded area of lead frame and resin becomes larger, so that the Base body of LED support after molding and lead pair Joint Properties effectively improve.

It should be understood that when being processed to conductive metal sheet and forming notch, it is in one embodiment, right Conductive metal sheet carries out forming the thickness notch equal with metal plate through processing, in another embodiment, to leading Electric metal plate carries out non-through processing and forms the notch that thickness is less than metal plate.In addition, it should also be noted that in one kind In preferred embodiment, the length of the notch of lead frame is 1/2 or more of the length of Base body respective side, thus The part that can make lead frame more lightweight, advantageously reduce production cost, also, be cut off on lead frame becomes It is few, so that area of the resin in conjunction with lead frame is relatively large, it can further promote the zygosity of Base body Yu lead pair Energy.

Referring to Fig. 1, the notch in the present embodiment is through lead frame, thus the notch after being molded It is full by resin filling, and since the notch portion of being cut off is isolated, wherein it is edge to the cutting mode of notch in the present embodiment Central axis on notch length direction is cut, then, in Base body 12 correspond to notch position into After row cutting, cutting portion is cut off and exposes in the lateral surface of Base body, namely is formed in the lateral surface of Base body 12 Have and is in conplane exposing leading part 112 with resin portion.It should be noted that each exposing leading part in the present embodiment 112 it is whole be distributed on the adjacent two sides of Base body 12, namely along adjacent two sides intersection respectively to two sides Interior extension exposes leading part, as shown in fig. 1, the LED support in the present embodiment so that having on the angle of Base body 12 Four angles on all have expose leading part 112.Certainly, in further embodiments, individually exposing leading part can also only divide Be distributed on the single side of Base body, can the setting position to notch could be adjusted to realize.

It should be understood that lead in the present embodiment be to can be various metal or metal alloy materials, including but not It is limited to copper, aluminium, iron, silver, naturally it is also possible to be the mixing material comprising conductive material, such as conductive rubber etc., in the present embodiment Lead pair is preferably made using copper or copper alloy, it is ensured that good electric conductivity and thermal diffusivity.

In addition, in practical applications, in order to improve the LED chip institute loaded to lead to functional areas composed by upper surface The reflectivity of the light of sending, and improve lead to the welding performance of lower surface, can also upper surface to lead and/or following table Face carries out the setting of metal layer, and metal layer here can be silver, aluminium, copper, gold etc., and the set-up mode of metal layer preferably can be with Using plating, it should be noted that metal layer setting processing here can be before carrying out LED support molding to lead frame Frame is integrally handled, and is also possible to after completing LED support molding, only for loading locating for the functional areas of LED chip Lead portion or be exposed to LED support bottom surface lead pair lower surface carry out metal layer setting processing.

It should be noted that exposing leading part is positive wire and negative wire in a kind of example of the present embodiment Metal layer is not provided on the surface of the exposed portion of ontology namely the part.It is to cut lead frame due to exposing leading part It is just formed, was originally in inside lead frame to expose leading part afterwards, therefore on the exposing leading part in the present embodiment usually Not set metal layer.

In one embodiment, expose on leading part and be with the orthographic projection in the plane locating for the lower surface of lead pair The curved face part of arcuation.

Specifically, as shown in figure 4, also existing other than being provided with notch 113 on lead frame 11 in the present embodiment Hole portion 115 is provided in cutting portion 114 between notch 113, wherein curved face part conforms to the hole being arranged in cutting portion 114 Portion 115, the hole conveniently of circular shape of the hole portion 115 in further embodiments can also be using ellipse, quadrangle etc.. In addition, position set by the hole portion 115 of lead frame 11 is preferably the extended line institute phase in transverse incision portion and longitudinal cut portion The position of friendship.It should be noted that hole portion 115 can be the through-hole being disposed through in cutting portion 114, or non-through The blind hole being set in cutting portion 114.

As shown in figure 5, the lead for the structural schematic diagram of another LED support provided in this embodiment, in the present embodiment Hole portion in the cutting portion of frame is the circular through hole through setting, after to lead frame injection molding, in circular through hole not Resin filling is carried out, thus the exposing leading part 112 after cutting forms LED support, on the lateral surface of Base body 12 On be formed with curved face part 1121 corresponding to circular through hole inner wall, being formed by curved face part relative to plane has bigger face Product, and in some examples in the present embodiment, it can be arranged in curved face part 1121 (including but not limited to by plating, change Learn the setting of the techniques such as plating or coating) metal layer, and expose other lateral parts that leading part 112 removes except curved face part and do not set then Metal layer is set, weld strength can be increased from there through curved face part 1121.In addition, the upper table of the Base body 12 in the present embodiment The corner in face can also be preferable to provide as curved face part 122, curved face part 122 in Base body and the curved face part for exposing leading part Scale is provided between 1121 and is not at same plane, to also have platform 116 between two curved face parts, further may be used To increase weld strength.

In addition, in some embodiments, exposing and being formed with height between the downside of leading part and the lower surface of lead frame It is poor to spend.

Specifically, as shown in fig. 6, being the structural schematic diagram of another LED support provided in this embodiment, in the present embodiment Lead frame on be provided with the groove of downward surface opening, the preferred groove with a thickness of the one of lead frame integral thickness Half, to after lead frame is cut, expose leading part 112 under wherein one side after injection molding LED support Side a and lead are to having certain difference in height between 111 lower surface b, so that it is formed with stage portion between the two, so as to In welding, increase the contact area between lead and tin cream, and metal layer can be provided in stage portion, it is easier to weld It connects, and due to being provided with groove on lead frame, so that the part that lead frame is cut is reduced, it is easier to it cuts, And effectively shorten clipping time.It should be noted that the length of the groove of lead frame is equal to Base body 12 in the present embodiment Width, in further embodiments, draw certainly to be formed by the side that step part is distributed in entire Base body 12 The length of the groove of wire frame can be less than the width of Base body, so that being formed by stage portion is only distributed in Base body A part on side.

In addition, resin employed in the present embodiment is unsaturated polyester resin, unsaturated polyester resin is as heat cure Resin has excellent reflectivity and the deterioration patience to ultraviolet light etc., thus the situation luminous for a long time in LED light emitting device Under, the deterioration of reflecting plate or resin can be effectively suppressed, and maintain high reflectance and light efficiency；Also, unsaturated polyester resin is not With hydroxyl (- OH group) isoreactivity functional group, chemical bond is not formed with metal, so raw tree of relatively having difficult labour in forming process Rouge burr is easy to be removed producing resin burr；Furthermore the fusing point of unsaturated polyester resin is 50 DEG C -90 DEG C Left and right is able to suppress added organic matter in resin when to carrying out injection molding to unsaturated polyester (UP) and is carbonized, can be effective Inhibit forming defect；In addition, unsaturated polyester resin wants high relative to the mobility of thermoplastic resin, thus carrying out resin note It is fashionable, it can be infused resin into lower injection pressure, a possibility that such lead frame deforms is lowered, and is being molded into It during type, then does not need to keep lead frame, mold can be simplified.

In practical applications, it can further be added in unsaturated polyester resin by the longer glass fibre of fiber and spherical The filler that constitutes of silica to improve the intensity of resin.

Optionally, of course, titanium dioxide can also be added, in unsaturated polyester (UP) to improve resin to the reflectivity of light.

Optionally, in application scenes, it can be also properly added additive, and the additive in this example includes but not It is limited at least one of substance: maleic anhydride, fumaric acid, styrene, packing material, reinforcing agent, curing agent, demoulding Agent, pigment.

In a preferred embodiment, terephthalic acid (TPA) unsaturated-resin can be used in unsaturated polyester resin, at this time It includes glass fibre, silica, titanium dioxide, and the ingredient ratio of glass fibre, silica, titanium dioxide may respectively be B, C, D, wherein 3%≤B≤20%, 15%≤C≤32%, 20%≤D≤40%.

For example, in a kind of example, glass fibre, silica, titanium dioxide ingredient ratio may respectively be 5%≤B≤ 15%, 20%≤C≤30%, 25%≤D≤35%, for example, B can be 5%, 8%, 10%, 12%, 15% etc., C can be 20%, 22%, 25%, 27%, 30% etc., D can be 25%, 28%, 30%, 32%, 35% etc..

In another example in a kind of example, glass fibre, silica, titanium dioxide ingredient ratio may respectively be 5%≤B ≤ 15%, 20%≤C≤30%, 30%≤D≤40%, for example, B can be 5%, 9%, 11%, 13%, 15% etc., C can be 20%, 23%, 26%, 28%, 30% etc., D can be 25%, 27%, 29%, 32%, 35% etc..

In a kind of example, when being also added with additive in unsaturated polyester resin, the ingredient ratio E of the additive can be 1%≤E≤3%, for example, B can be 1%, 1.5%, 2%, 2.5%, 3% etc..

And it should be understood that setting can be adjusted flexibly in the ingredient ratio of above-mentioned each substance according to concrete application demand.

For example, being arranged in unsaturated polyester resin in a kind of application scenarios and being added with filler, titanium dioxide and addition When agent, unsaturated polyester resin, glass fibre, silica, titanium dioxide and additive ingredient than be respectively A, B, C, D and E, wherein 15%≤A≤25%, 5%≤B≤20%, 20%≤C≤30%, 30%≤D≤40%, 1%≤E≤3%, A+B + C+D+E=100% can effectively inhibit the feelings such as unsaturated polyester resin cracking, discoloration using the material mixture ratio in this example Condition.

As shown in fig. 7, the present embodiment additionally provides LED light emitting device made of a kind of above-mentioned LED support of utilization comprising Above-mentioned LED support and at least LED chip 20 being packaged in the Base body 12 of LED support.

The color that the illumination of LED light emitting device provided in this embodiment shoots out, is presented to the user, can be according to practical need Application scenarios of summing carry out flexible setting.The illumination of LED light emitting device shoots out, which kind of color show is, can pass through But be not limited to following factor flexibly to control: whether color, the LED light emitting device for the light that LED chip itself issues are arranged illuminating rotary Change the type of layer, the luminescent conversion layer set when luminescent conversion layer is arranged in LED light emitting device.

In a kind of example of the present embodiment, LED light emitting device, which may also include, is set to LED chip (on LED chip When being provided with luminescent conversion glue-line, be then set on luminescent conversion glue-line) on lens glue-line or diffusion glue-line；Certainly, In some instances, it may also set up substratum transparent on LED chip.

It should be understood that luminescent conversion glue-line can be the fluorescent adhesive layer comprising fluorescent powder in a kind of example, it can also To be the colloid comprising the photic material of quantum dot or other can realize the luminescent conversion glue or film of luminescent conversion, and according to need It also may include spread powder or silicon powder etc.；Luminescent conversion glue-line, lens glue-line or expansion are formed in the present embodiment in LED chip The mode for dissipating glue-line includes but is not limited to dispensing, molding, spraying, stickup etc..

For example, luminescent conversion glue-line may include fluorescent powder glue-line, fluorescent film or quantum dot QD film；Fluorescent powder glue-line, fluorescence Inorganic fluorescent powder production can be used in film, can be the inorganic fluorescent powder for being doped with rare earth element, wherein inorganic fluorescent powder includes At least one of but be not limited to silicate, aluminate, phosphate, nitride, fluorination matter fluorescent powder.

In another example the production of quantum dot fluorescence powder can be used in quantum dot QD film；Quantum dot fluorescence powder include but is not limited to BaS, AgInS2、NaCl、Fe2O3、In2O3、InAs、InN、InP、CdS、CdSe、CdTe、ZnS、ZnSe、ZnTe、GaAs、GaN、 GaS、GaSe、InGaAs、MgSe、MgS、MgTe、PbS、PbSe、PbTe、Cd(SxSe1-x)、BaTiO3、PbZrO3、 At least one of CsPbCl3, CsPbBr3, CsPbI3.

In the present embodiment, the type for the light that LED chip itself issues can be macroscopic visible light, be also possible to Visually sightless ultraviolet light, infrared light；When the type for the light that LED chip itself issues is the sightless ultraviolet light of naked eyes, red When outer smooth, luminescent conversion layer can be set on LED chip, naked eyes black light is converted into naked eyes visible light, so that LED It is the visible light of user that luminescent device, which irradiates the light come,.For example, when the light that LED chip itself issues is ultraviolet light, if thinking The visible white light of LED light emitting device presentation user, then luminescent conversion layer can be red, green, blue fluorescent powder is mixed after make It is made.

LED support provided by the embodiment of the utility model include: the lead that is dielectrically separated to by unsaturated polyester (UP) tree Rouge takes shape in lead to upper Base body, and lead, which forms the part of the lateral surface exposing in Base body, exposes leading part. LED support in the utility model is formed by unsaturated polyester resin, and burr generation can be effectively suppressed in when molding, deteriorates patience Higher, the requirement to forming temperature and pressure is lower, can effectively ensure that product quality and production efficiency.Further, this is practical LED support in novel not only touches with the upper surface of leading part, but also touches with the portions of lateral side of leading part, to increase The big contact area of Base body and lead pair, increases the contiguity intensity of Base body Yu lead pair, can effectively avoid base Seat main body is from lead to upper disengaging.

Embodiment two:

The utility model, production of the present embodiment to LED support provided by the utility model are understood for the ease of comprehensive Process is illustrated.

Fig. 8 is referred to, Fig. 8 is the flow chart of LED support production method provided in this embodiment, when making LED support, It implements step

S801 prepares lead frame；Lead frame is provided at least one set of lead pair being dielectrically separated from, and setting is being drawn Line is dielectrically separated from the notch of periphery, lead between included positive wire and negative wire, and lead is to passing through notch Cutting portion between portion is connected to lead frame main body.

It in the present embodiment, can be by the way of punching or etching come to flat conductive metal sheet in the present embodiment Processing, thus on a metal plate it is horizontal and vertical it is upper form linear notch, notch is the lead frame after being molded Frame is cut into cutting position when LED support monomer, and through area of isolation is processed also on conductive metal sheet, thus shape At the positive wire and negative wire being dielectrically separated from.Wherein, in order to enable processing after be formed by lead frame be able to maintain it is whole Body stability has cutting portion between the longitudinal cut and transverse incision in the present embodiment, so that lead is to can be cut Disconnected portion is connected on lead frame main body, and is unlikely to lead and is fallen off to from lead frame.Also, cutting in the present embodiment Oral area can be the notch through lead frame, or non-through is set to the notch of lead frame.

S802, at least one Base body is formed by unsaturated polyester resin on the lead frames, and Base body has In lead to the reflection cavity being enclosed on upper surface, reflection cavity is for placing LED chip.

For example, notch is filled completely by resin after being molded, and the area of isolation between lead pair is also by resin It fills and realizes the insulation between negative leads.It in practical applications, further can be in the unsaturated polyester (UP) of the present embodiment Filler and/or titanium dioxide are added in resin, filler includes glass fibre and silica, wherein tree can be improved in addition filler The intensity of rouge, and add titanium dioxide then and resin can be improved to the reflectivity of light.Also, in filler or titanium dioxide or In the rwo, also appropriately combined following substance: maleic anhydride, fumaric acid, styrene, packing material, reinforcing agent, solidification can be added The others additive such as agent, release agent, pigment.

In a preferred embodiment, terephthalic acid (TPA) unsaturated-resin can be used in unsaturated polyester resin, at this time It includes glass fibre, silica, titanium dioxide, and the ingredient ratio of glass fibre, silica, titanium dioxide may respectively be B, C, D, wherein 3%≤B≤20%, 15%≤C≤32%, 20%≤D≤40%.

For example, in a kind of example, glass fibre, silica, titanium dioxide ingredient ratio may respectively be 5%≤B≤ 15%, 20%≤C≤30%, 25%≤D≤35%.In another example in a kind of example, glass fibre, silica, titanium dioxide The ingredient ratio of titanium may respectively be 5%≤B≤15%, 20%≤C≤30%, 30%≤D≤40%.In a kind of example, when not When being also added with additive in saturated polyester resin, the ingredient ratio E of the additive can be 1%≤E≤3%.

For example, being added with filler, titanium dioxide and additive in unsaturated polyester resin in a kind of application scenarios When, unsaturated polyester resin, glass fibre, silica, titanium dioxide and additive ingredient than being respectively A, B, C, D and E, Wherein, 15%≤A≤25%, 5%≤B≤20%, 20%≤C≤30%, 30%≤D≤40%, 1%≤E≤3%, A+B+C + D+E=100% can effectively inhibit the feelings such as unsaturated polyester resin cracking, discoloration using the material mixture ratio in the present embodiment Condition.

S803, the position in Base body corresponding to notch are cut, by cutting portion cutting in Base body Side formed expose leading part.

In this step, after cutting portion being cut off, part which does not connect with positive wire and negative wire respectively (can the part entirety, can also be only the side of the part) expose the side of the Base body, to be formed just The exposing leading part of pole lead and negative wire.Because the notch on lead frame is cut off portion's isolation, wherein the present embodiment In to the cutting mode of notch be that the central axis on notch length direction is cut, then, along Base body After the upper position corresponding to notch is cut, cutting portion is cut off and exposes in the side of Base body, namely in base The side of seat main body, which is formed with, is in conplane exposing leading part with resin portion.It should be noted that in the present embodiment Each leading part that exposes integrally is distributed on the adjacent two sides of Base body, namely along adjacent two sides intersection respectively to Extend in two sides, exposes leading part so that having on the angle of Base body.Certainly, in further embodiments, individually Expose leading part can also only be distributed on the single side of Base body, can the setting position to notch could be adjusted to reality It is existing.

In practical applications, it is issued to improve the LED chip loaded to lead to functional areas composed by upper surface Light reflectivity, and improve lead to the welding performance of lower surface, can also upper surface to lead and/or lower surface into The setting of row metal layer, metal layer here can be silver, aluminium, copper, gold etc., and the set-up mode of metal layer can preferably use Plating, it should be noted that metal layer setting processing here can be whole to lead frame before carrying out LED support molding Body is handled, and is also possible to after completing LED support molding, is only drawn locating for the functional areas for loading LED chip Line part or be exposed to LED support bottom surface lead pair lower surface carry out metal layer setting processing.

It should be noted that exposing leading part in a kind of example of the present embodiment and not having the metal layer being set to. It due to exposing leading part is just formed after being cut lead frame, was originally in lead frame to expose leading part Portion, therefore usual not set metal layer on the exposing leading part in the present embodiment.

It should be noted that in some examples of the present embodiment, on lead frame other than being provided with notch, also Hole portion, preferably circular through hole are provided in cutting portion between notch, it is round after to lead frame injection molding Resin filling is not carried out in through-hole, thus the exposing leading part after cutting forms LED support, on the side of Base body On be formed with curved face part corresponding to circular through hole inner wall, being formed by curved face part relative to plane has bigger area, and And in some examples in the present embodiment, metal layer setting processing can be carried out in curved face part, and expose leading part and remove song Other lateral parts except face do not carry out metal layer setting processing then, can increase weld strength from there through curved face part. In addition, the corner of the upper surface of the Base body in the present embodiment can also be preferable to provide as curved face part, in Base body It is provided with scale between curved face part and the curved face part for exposing leading part and is not at same plane, thus between two curved face parts also With platform, it can further increase weld strength.

In addition, the groove of downward surface opening is provided on lead frame in other examples of the present embodiment, thus After injection molding LED support, after lead frame is cut, expose downside and lead frame of the leading part in wherein one side There is certain difference in height, to be formed with stage portion, between the two so as to increase in welding between the lower surface of frame Contact area between lead and tin cream, and metal layer can be provided in stage portion, it is easier to it welds, and due to drawing Groove is provided on wire frame, so that the part cut of lead frame is reduced, it is easier to cut, and effectively shorten cutting Time.

LED support production method provided by the embodiment of the utility model, by preparing lead frame；Lead frame is provided with The lead pair that at least one set is dielectrically separated from, and lead is set to the notch of periphery, lead is to by between notch Cutting portion is connected to lead frame main body；Form at least one Base body on the lead frames by unsaturated polyester resin； Position in Base body corresponding to notch is cut, and cutting portion is cut off and is formed and is exposed in the side of Base body Leading part.LED support in the utility model is formed by unsaturated polyester resin, and burr generation can be effectively suppressed in when molding, Deterioration patience is higher, and the requirement to forming temperature and pressure is lower, can effectively ensure that product quality and production efficiency.Further , the utility model is when forming LED support, filled with resin in the notch that is arranged on the lead frames, to increase The contact area of resin and lead frame can effectively avoid resin and be detached from from lead frame.

Embodiment three:

A kind of light emitting device is present embodiments provided, which includes exemplified by above-described embodiment one or embodiment two LED light emitting device.Light emitting device in the present embodiment can be lighting device, optical signal instruction device, light compensating apparatus or backlight Device etc..When for lighting device, it is specifically as follows the lighting device applied to various fields, such as desk lamp in daily life, Fluorescent lamp, ceiling lamp, downlight, street lamp, projecting lamp etc., in another example high beam, dipped headlight, atmosphere lamp etc. in automobile, and example As in medical operating lamp, low electromagnetism headlamp, various medical apparatus headlamp, in another example answer furnishing fields illuminate in it is each Kind color lamp, landscape spotlight, advertising lamp etc.；When for optical signal instruction device, it is specifically as follows the light applied to various fields Signal indicating device, such as the signal lamp of field of traffic, the various signal conditions instruction in the communications field on communication equipment Lamp；It can be the light compensating lamp of photography, such as flash lamp, light compensating lamp, or agriculture field is to plant when for light compensating apparatus The light supplementing lamp for plants etc. of object light filling；It can be the backlight module applied to various field of backlights, such as can answer when for back lighting device For equipment such as the mobile terminals such as display, television set, mobile phone, advertisement machines.

It should be understood that above-mentioned application is only several applications exemplified by the present embodiment, it should be appreciated that LED hair Application several fields that it is not limited to the above example of optical device.

The above content is combining specific embodiment to be further described to made by the utility model embodiment, no It can assert that the specific implementation of the utility model is only limited to these instructions.For the common skill of the utility model technical field For art personnel, without departing from the concept of the premise utility, a number of simple deductions or replacements can also be made, all should It is considered as belonging to the protection scope of the utility model.

Claims (7)

1. a kind of LED support characterized by comprising lead pair is set to the lead to included positive wire and bears Insulating isolation belt between the lead of pole, and the lead is set to upper Base body, the material of the Base body is Unsaturated polyester resin, the Base body have in the lead to the reflection cavity being enclosed on upper surface, the reflection Chamber is for placing LED chip；The positive wire and negative wire of the lead pair, which have, exposes the Base body lateral surface Part, to form exposing leading part.

2. LED support as described in claim 1, which is characterized in that in the unsaturated polyester resin added with filler and/or Titanium dioxide, the filler include glass fibre and silica.

3. LED support as described in claim 1, which is characterized in that additive is also added in the unsaturated polyester resin, The additive includes at least one of the following:

Maleic anhydride, fumaric acid, styrene, packing material, reinforcing agent, curing agent, release agent, pigment.

4. LED support as described in any one of claims 1-3, which is characterized in that the upper surface of the lead pair and/or following table Face is equipped with metal layer；

And/or

It is described to expose the exposed portion of ontology that leading part is the positive wire and negative wire.

5. LED support as described in any one of claims 1-3, which is characterized in that the exposing leading part overall distribution is in institute It states on two adjacent sides of Base body.

6. a kind of LED light emitting device, which is characterized in that including the LED support and envelope as described in any one of claims 1 to 5 An at least LED chip in Base body loaded on the LED support.

7. a kind of light emitting device, which is characterized in that including LED light emitting device as claimed in claim 6, the light emitting device is Lighting device, optical signal instruction device, light compensating apparatus or back lighting device.