CN208955014U - A kind of lead frame, LED support and LED light emitting device - Google Patents
A kind of lead frame, LED support and LED light emitting device Download PDFInfo
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- CN208955014U CN208955014U CN201821436173.8U CN201821436173U CN208955014U CN 208955014 U CN208955014 U CN 208955014U CN 201821436173 U CN201821436173 U CN 201821436173U CN 208955014 U CN208955014 U CN 208955014U
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- lead frame
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- base body
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Abstract
The utility model provides a kind of lead frame, LED support and LED light emitting device, the lead frame includes the rack forming region of at least one Openworks shape, there is the support portion and leading part extended from lead frame main body in rack forming region, support portion includes the first support portion and the second support portion being oppositely arranged, rack forming region is used for forming pedestal main body, support portion be respectively used to insertion within molding Base body opposite the first lateral surface and the second lateral surface, after support portion is detached from Base body, bayonet is formed in Base body, bayonet includes the first bayonet and the second bayonet being open respectively from inside Base body to the first lateral surface and the second lateral surface；Support portion on the lead frame of the utility model is respectively protruding into the bayonet of the opposing side openings of LED support, the six-freedom degree of LED support to be fixed, improves stability when LED support is fixed.
Description
Technical field
The utility model relates to LED (Light Emitting Diode, light emitting diode) technical fields more particularly to one
Kind lead frame, LED support and LED light emitting device.
Background technique
In recent years, LED is by superiority such as its unique low price, low consumption, high brightness, long-lives always in mobile terminal
Display field plays important role, and there are also sizable development spaces within quite long one period from now on.It is existing
In some LED production technologies, the molding of LED support and the encapsulation of LED light emitting device are carried out on the lead frames, and lead frame is
LED product provides lead and provides its molding, the support in encapsulation process, and existing lead frame by being relatively arranged on
Two support portions take shape in the bayonets of LED product two sides and support, and bayonet to side and be bordered by
The another side of two sides is open, to be then to be bordered by support portion in two sides from LED light emitting device in blanking procedure
Opening at the another side in face exits, to realize the blanking of LED light emitting device, the support portion of lead frame in this case
Five freedom degrees of LED product can only be fixed, the fixed performance of LED product on the lead frames is limited, adds in production
LED product may be made to fall off from lead frame in work industry.
Utility model content
Lead frame, LED support and LED light emitting device provided by the embodiment of the utility model, the technology mainly solved are asked
Topic is: five freedom degrees of LED product can only be fixed in the support portion on existing lead frame, and caused LED is produced
The fixed performance of product on the lead frames is limited, and LED product easily falls off from lead frame problem in production and processing operation.
In order to solve the above technical problems, the utility model embodiment provides a kind of lead frame, including at least one hollow out
The rack forming region of shape has the support portion and leading part extended from lead frame main body in the rack forming region,
The support portion includes the first support portion and the second support portion being oppositely arranged, and the rack forming region is for passing through unsaturation
Polyester resin in upper forming pedestal main body, the support portion be respectively used to insertion the molding Base body it is opposite first
Within lateral surface and the second lateral surface；The support portion is received in the Base body perpendicular to the lead frame main body institute
In the power on the direction of plane, it is detached from inside the Base body and makes to form bayonet in the Base body, the card
Mouthful include the first bayonet being open respectively from inside the Base body to first lateral surface and second lateral surface and
Second bayonet.
Preferably, the surface of the leading part is covered with reflecting layer.
Preferably, the leading part and the support portion are in the same plane.
Preferably, the leading part is equal with the thickness of the support portion.
Preferably, the leading part and the support portion are separately positioned, and one end of the support portion is open end.
Preferably, the end face of the open end is provided with protrusion；Or, surface of the support portion close to the open end
It is set as wedge shape.
In order to solve the above technical problems, the utility model embodiment also provides a kind of LED support, including above-mentioned lead frame
The leading part of frame and the Base body on the rack forming region of the lead frame is taken shape in by unsaturated polyester resin,
The Base body has the groove for packaging LED chips, has in the Base body respectively from the Base body
The bayonet that portion is open to the first opposite lateral surface of the Base body and the second lateral surface, the bayonet include the first bayonet and
Second bayonet, the bayonet and the leading part are in the same plane, and the bayonet by drawing certainly in the rack forming region
Support portion that wire frame frame body extends is received in the Base body perpendicular to plane where the lead frame main body
When power on direction, formed after being detached from inside the Base body.
Preferably, filler and/or titanium oxide are added in the unsaturated polyester resin, the filler includes glass fibre
And silica.
Preferably, the surface of the Base body is additionally provided with the vertical direction of the third lateral surface along the Base body
On protrude outward, and bend be attached at the Base body surface leading part.
In order to solve the above technical problems, the utility model embodiment also provides a kind of LED light emitting device, comprising: above-mentioned
LED support and at least LED chip being packaged in the Base body of the LED support.
The beneficial effects of the utility model are:
According to lead frame provided by the embodiment of the utility model, LED support and LED light emitting device, the lead frame packet
The rack forming region of at least one Openworks shape is included, there is the support portion extended from lead frame main body in rack forming region
And leading part, support portion include the first support portion and the second support portion being oppositely arranged, rack forming region is for passing through insatiable hunger
With polyester resin in upper forming pedestal main body, support portion be respectively used to insertion the first opposite lateral surface of molding Base body
Within the second lateral surface；Support portion is received in Base body perpendicular to the power where lead frame main body on the direction of plane
When, it is detached from from Base body inside and makes to form bayonet in Base body, bayonet includes respectively from inside Base body to first
The first bayonet and the second bayonet of lateral surface and the second lateral surface opening.Support portion difference on the lead frame of the utility model
It protrudes into the bayonet of LED support two opposite side openings, the six-freedom degree of LED support to be fixed, to LED
Stability when bracket is fixed is high, it is possible to prevente effectively from LED support falls off from lead frame in production and processing operation,
Improve the yields of LED support.
Further, the blanking of the LED light emitting device in the utility model is by the direction perpendicular to lead frame
Upper force, and make LED light emitting device blanking in the vertical direction, so as to shine simultaneously to multiple LED on lead frame
Device synchronizes blanking operation, improves the production efficiency of LED light emitting device, production cost can be effectively reduced.
Detailed description of the invention
Fig. 1 is the shaping schematic view for the LED support that the utility model embodiment one provides；
Fig. 2 is the structural schematic diagram for the lead frame that the utility model embodiment one provides；
Fig. 3 is the side schematic view for the LED support that the utility model embodiment one provides；
Fig. 4 is the structural schematic diagram for the support portion that the utility model embodiment one provides；
Fig. 5 is the structural schematic diagram for the LED light emitting device that the utility model embodiment one provides；
Fig. 6 is the flow chart for the LED light emitting device production method that the utility model embodiment two provides；
Fig. 7 a is punched out the schematic diagram before separation to leading part for what the utility model embodiment two provided；
Fig. 7 b is punched out the schematic diagram after separation to leading part for what the utility model embodiment two provided；
Fig. 8 a is the leading part that provides of the utility model embodiment two from the vertical signal outstanding outward of Base body side
Figure；
Fig. 8 b is the schematic diagram that the leading part bending that the utility model embodiment two provides is attached at Base body surface；
Fig. 9 a is the schematic diagram that the LED light emitting device that the utility model embodiment two provides is fixed on support portion；
Fig. 9 b is the schematic diagram when LED light emitting device stress that the utility model embodiment two provides removes.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below by specific embodiment party
Formula combination attached drawing is described in further detail the utility model embodiment.It should be appreciated that specific embodiment described herein
Only to explain the utility model, it is not used to limit the utility model.
Embodiment one:
Be directed in the prior art, by by the support portion of lead frame from LED light emitting device in two opposite sides
Be detached from the bayonet of opening to carry out the blanking of LED light emitting device, in caused blanking process LED light emitting device be easy because by
Power and the problem of damage, the utility model provides a kind of lead frame 10, and specifically referring to Figure 1, which includes
The rack forming region 11 of at least one Openworks shape, rack forming region 11 is interior to have the branch extended from 10 main body of lead frame
Support part 12 and leading part 13, support portion 12 include the first support portion and the second support portion being oppositely arranged, rack forming region 11
For by unsaturated polyester resin, in upper forming pedestal main body 20, support portion 12 to be respectively used to the molding Base body of insertion institute
Within 20 opposite the first lateral surfaces 21 and the second lateral surface 22；Support portion 12 is received in Base body 20 perpendicular to lead frame
When power where frame 10 main body on the direction of plane, it is detached from inside Base body 20 and makes to form bayonet in Base body 20
23, bayonet 23 includes the first bayonet being open respectively from inside Base body to the first lateral surface 21 and the second lateral surface 22 and the
Two bayonets.
In the present embodiment, Fig. 2 is referred to, lead frame 10 can add using punching press is carried out to flat electrically-conductive backing plate
Work or etching and processing and formed, to form the rack forming region 11 of at least one Openworks shape on lead frame 10, thus
Part remaining after the material to hollowed out area is removed is formed with leading part 13 and support portion 12 on lead frame 10,
And support portion 12 and leading part 13 extend from 10 ontology of lead frame to hollowed out area, the support portion 12 in the present embodiment and draw
Line portion 13 extends from 10 ontology of lead frame to hollowed out area respectively；And in further embodiments, support portion and leading part are also
It can be used as that an entirety extends from lead frame ontology to hollowed out area namely leading part by support portion is connected to lead frame
On frame ontology.Wherein there is on leading part 13 crystal bonding area for loading LED chip, the LED for being installed on to the later period
Chip is connected, and support portion 12 on lead frame 10 then for carrying out the encapsulation of LED support molding and LED light emitting device
When, it is formed in inside LED product and LED product is supported.Support portion 12 in the present embodiment is oppositely arranged, and should be illustrated
, it can also be by multiple monomer support portion institutes group respectively that the first support portion and the second support portion, which can be monomer support portion,
It is whole made of conjunction.
It should be understood that the lead frame in the present embodiment can be constituted for the substrate of various conductive materials, such as can
Think various metal or metal alloy substrates, including but not limited to copper base, aluminum substrate, iron substrate, silver-based plate, naturally it is also possible to
For the mixing material substrate comprising conductive material, such as conductive rubber etc. is preferably made in the present embodiment of copper alloy
Lead frame, it is ensured that good electric conductivity and thermal diffusivity.In addition, lead frame in the present embodiment can be it is lamellar,
To be easy to later period bending machining, can make it easier to be shaped to defined shape.Also, lead frame is not limited only to single layer knot
Structure can also be the lamination layer structure as composed by multilayer conductive material in some embodiments.
In addition, in the present embodiment, it, can also be to leading part in order to improve the reflectivity of the light issued to LED chip
Surface carries out the coating in reflecting layer, and reflecting layer here can be silver, aluminium, copper, gold etc., and the coating method in reflecting layer preferably may be used
Using plating, it should be noted that reflecting layer coating processing here can be before carrying out LED support molding to lead
Frame entirety is handled, and is also possible to after completing LED support molding, only in the crystal bonding area institute for loading LED chip
The leading part at place carries out reflecting layer coating processing.In addition, copper foil layer is additionally provided between reflecting layer and leading part, usual leading part
The flatness on surface is not high, and present leading part surface coats copper foil layer to improve surface smoothness, then again in copper foil layer surface
Reflecting layer is coated, smooth surface can be formed, further increase the reflectivity on leading part surface.
It should be noted that referring again to Fig. 2, implementation as one preferred, the leading part in the present embodiment
13 extend from 10 ontology of lead frame to hollowed out area and are formed in the space between support portion 12, and the anode of leading part 13
Leading part and negative wire portion separated and formed and be dielectrically separated from area, and to all have one open for the support portion 12 being oppositely arranged
End, and its open end and leading part 13 are separately positioned, open end here refer to do not form company with other components at one end
It connects.Certainly, in further embodiments, support portion can also be not provided with open end namely support portion and prolong from lead frame ontology
Leading part is extended to after stretching and is connected with leading part, then needs to guarantee in this case in actual production final
Leading part meeting and support section from.
Preferably, the leading part 13 in the present embodiment and support portion 12 are in the same plane, also, further, draw
Line portion 13 is equal with the thickness of support portion 12, so that the technique in actual production is more easily implemented, and can improve technique
Controllability.
In order to guarantee that the support portion in the present embodiment can be from LED light emitting device when carrying out LED light emitting device blanking
It detaches, the bayonet corresponding to support portion is formed in the Base body on LED support, single bayonet is only in Base body
One side upper opening, so that support portion exits inside bayonet.LED referring to Fig. 1 and Fig. 3, in the present embodiment
Bracket includes the leading part 13 of above-mentioned lead frame 10 and takes shape in above-mentioned lead frame 10 by unsaturated polyester resin
Base body 20 on rack forming region 11, Base body 20 has the groove for packaging LED chips, in Base body 20
With respectively from inside Base body 20 to opposite 22 upper opening of the first lateral surface 21 and the second lateral surface of Base body 20
Bayonet 23, bayonet 23 include the first bayonet and the second bayonet, and bayonet 23 and leading part 13 are in the same plane, and bayonet 23 is by propping up
The interior support portion 12 extended from 10 main body of lead frame of frame forming area 11 is received in Base body 20 perpendicular to lead frame
When power where frame 10 main body on the direction of plane, formed after being detached from inside Base body 20.
In the present embodiment, which is clamped by lead frame in a mold in the rack forming region of lead frame
Upper injection molding is formed with the groove of the packaging area as LED chip in the Base body of LED support after molding, wherein
The leading part of lead frame is at least partly exposed to the bottom surface of groove, thus the mounting region as LED chip.In practical application
In, LED chip can be positioned in positive wire portion, be then electrically connected LED chip with positive wire portion by metal wire, so
LED chip is connect by metal wire with negative wire portion again afterwards, certainly, in practical applications, if by LED chip upside-down mounting,
It can be without the metal wire of aforementioned connection LED chip and leading part.Top opening from groove to Base body, so as to from opening
Place is sealed the encapsulation of material to inside grooves.
Specifically, forming the bayonet 23 of oriented side opening, single bayonet in Base body 20 referring to Fig. 3
23 are only open on a side, such as two bayonets 23 is enterprising in the first lateral surface 21 and the second lateral surface 22 respectively
Row opening, when support zone is in bayonet, when deformation occurs for support portion, the front, back, left, right, up, down of Base body
Six-freedom degree can supported portion fix, stability is high.
Opposite two bayonet in the Base body of base in this present embodiment is only open on single side, and
If support portion will be exited respectively from opening and is detached from from bayonet, need to make support portion that deformation occurs and is detached from, in order to make
Support portion is more smooth in exiting for opening after in stress, deformation occurs, as shown in figure 4, in support portion 12 in the present embodiment
The end face of open end be provided with protrusion 123, when the open end of support portion 12 is close to opening, open end passes through protrusion 123
And be point contact with opening, it is contacted relative to conventional open end with the line of opening, when stress is easier to get detached contact.When
So, in further embodiments, the surface of support portion close to open end can also be set to wedge shape, it equally can be more light
Contact of the disengaging of pine with opening.
The molding of Base body is carried out in rack forming region using unsaturated polyester resin in the present embodiment, unsaturation is poly-
Ester resin has excellent reflectivity and to the deterioration patience of ultraviolet light etc. as heat reactive resin, thus in LED light emitting device
In the case where shining for a long time, the deterioration of reflecting plate or resin can be effectively suppressed, and maintain high reflectance and light efficiency；In addition,
Unsaturated polyester resin does not have hydroxyl (- OH group) isoreactivity functional group, chemical bond is not formed with metal, so forming
Relatively difficult labour green resin burr in the process, is easy to be removed producing resin burr；Furthermore unsaturated polyester resin
Fusing point is 50 DEG C -90 DEG C or so, is able to suppress when to carrying out injection molding to unsaturated polyester (UP) added organic in resin
Object is carbonized, and forming defect can be effectively suppressed；In addition, unsaturated polyester resin wants high relative to the mobility of thermoplastic resin,
To when carrying out resin injection, can be infused resin into lower injection pressure, possibility that such lead frame deforms
Property is lowered, and in injection molding process, then is not needed to keep lead frame, can be simplified mold.
In practical applications, it can further be added in unsaturated polyester resin by the longer glass fibre of fiber and spherical
The filler that constitutes of silica to improve the intensity of resin.It is, of course, also possible to add titanium oxide, in unsaturated polyester (UP) to mention
Reflectivity of the high resin to light.
In filler or titanium oxide or the rwo, following substance: maleic anhydride, rich horse appropriately combined can be also added
The others additive such as acid, styrene, packing material, reinforcing agent, curing agent, release agent, pigment.
In a preferred embodiment, when in unsaturated polyester resin added with filler, titanium oxide and additive,
Unsaturated polyester resin, glass fibre, silica, titanium oxide and additive ingredient than being respectively A, B, C, D and E, wherein
15% < A < 25%, 5% < B < 20%, 20% < C < 30%, 30% < D < 40%, 1% < E < 3%, A+B+C+D+E
=100%, using the material mixture ratio in the present embodiment, situations such as can effectively inhibiting unsaturated polyester resin cracking, change colour.
As shown in figure 5, the present embodiment additionally provides LED light emitting device 100 made of a kind of above-mentioned LED support of utilization,
Including above-mentioned LED support and at least LED chip 30 being packaged in the Base body 20 of LED support.
The color that the illumination of LED light emitting device provided in this embodiment shoots out, is presented to the user, can be according to practical need
Application scenarios of summing carry out flexible setting.The illumination of LED light emitting device shoots out, which kind of color show is, can pass through
But be not limited to following factor flexibly to control: whether color, the LED light emitting device for the light that LED chip itself issues are arranged illuminating rotary
Change the type of layer, the luminescent conversion layer set when luminescent conversion layer is arranged in LED light emitting device.
In a kind of example of the present embodiment, LED light emitting device, which may also include, is set to LED chip (on LED chip
When being provided with luminescent conversion glue-line, be then set on luminescent conversion glue-line) on lens glue-line or diffusion glue-line；Certainly,
In some instances, it may also set up substratum transparent on LED chip.
It should be understood that luminescent conversion glue-line can be the fluorescent adhesive layer comprising fluorescent powder in a kind of example, it can also
To be the colloid comprising the photic material of quantum dot or other can realize the luminescent conversion glue or film of luminescent conversion, and according to need
It also may include spread powder or silicon powder etc.；Luminescent conversion glue-line, lens glue-line or expansion are formed in the present embodiment in LED chip
The mode for dissipating glue-line includes but is not limited to dispensing, molding, spraying, stickup etc..
For example, luminescent conversion glue-line may include fluorescent powder glue-line, fluorescent film or quantum dot QD film；Fluorescent powder glue-line, fluorescence
Inorganic fluorescent powder production can be used in film, can be the inorganic fluorescent powder for being doped with rare earth element, wherein inorganic fluorescent powder includes
At least one of but be not limited to silicate, aluminate, phosphate, nitride, fluorination matter fluorescent powder.
In another example the production of quantum dot fluorescence powder can be used in quantum dot QD film；Quantum dot fluorescence powder include but is not limited to BaS,
AgInS2、NaCl、Fe2O3、In2O3、InAs、InN、InP、CdS、CdSe、CdTe、ZnS、ZnSe、ZnTe、GaAs、GaN、
GaS、GaSe、InGaAs、MgSe、MgS、MgTe、PbS、PbSe、PbTe、Cd(SxSe1-x)、BaTiO3、PbZrO3、
At least one of CsPbCl3, CsPbBr3, CsPbI3.
In the present embodiment, the type for the light that LED chip itself issues can be macroscopic visible light, be also possible to
Visually sightless ultraviolet light, infrared light；When the type for the light that LED chip itself issues is the sightless ultraviolet light of naked eyes, red
When outer smooth, luminescent conversion layer can be set on LED chip, naked eyes black light is converted into naked eyes visible light, so that LED
It is the visible light of user that luminescent device, which irradiates the light come,.For example, when the light that LED chip itself issues is ultraviolet light, if thinking
The visible white light of LED light emitting device presentation user, then luminescent conversion layer can be red, green, blue fluorescent powder is mixed after make
It is made.
Two support portions being oppositely arranged on lead frame provided by the embodiment of the utility model are respectively protruding into each leisure LED
In the bayonet for two sides opening that bracket is oppositely arranged, the six-freedom degree of LED support to be fixed, to LED support
Stability when being fixed is high, it is possible to prevente effectively from LED support falls off from lead frame in production and processing operation, improves
The yields of LED support.Further, the blanking of the LED light emitting device in the utility model is by perpendicular to lead
It exerts a force on the direction of frame, and makes LED light emitting device blanking in the vertical direction, so as to simultaneously to more on lead frame
A LED light emitting device synchronizes blanking operation, improves the production efficiency of LED light emitting device, can be effectively reduced and be produced into
This.
Embodiment two:
The utility model is understood for the ease of comprehensive, and the present embodiment is to LED light emitting device provided by the utility model
Manufacturing process is illustrated.
Fig. 6 is referred to, Fig. 6 is the flow chart of LED light emitting device production method provided in this embodiment, in production LED hair
When optical device, specific implementation step includes:
S601 prepares lead frame；Prepared lead frame has the rack forming region of at least one Openworks shape, branch
There is the support portion and leading part extended from lead frame main body, support portion includes first be oppositely arranged in frame forming area
Support portion and the second support portion.
In the present embodiment, lead frame removal of selectivity and to electrically-conductive backing plate progress punching press or etching and processing is pre-
If being formed after the material in region, it is formed by lead frame and is formed with rack forming region, for is molded in a mold
Molding forms the region of the Base body of LED support.Support portion on lead frame is oppositely arranged, on to taking shape in
LED support carry out stablizing support.It should be noted that in a preferred embodiment, support portion and leading part draw certainly respectively
Wire frame ontology extends to hollowed out area, after leading part and support portion extend out from lead frame ontology, leading part and support
The one end of portion far from lead frame ontology is open end, is connected without being formed with other components.Certainly, in other embodiment party
In formula, support portion and leading part are also used as an entirety and extend from lead frame ontology to hollowed out area namely leading part
It is connected on lead frame ontology by support portion.
S602, by unsaturated polyester resin in rack forming region forming pedestal main body；Base body, which has, to be used for
The groove of packaging LED chips, support portion be respectively embedded into molding Base body opposite the first lateral surface and the second lateral surface
Within.
In this step, the injection molding of Base body is carried out in rack forming region using unsaturated polyester resin.
In practical applications, can further add filler and/or titanium oxide in unsaturated polyester (UP), filler include glass fibre and
Silica wherein the intensity of resin can be improved in addition filler, and adds titanium oxide then and reflection of the resin to light can be improved
Rate.Also, in filler or titanium oxide or the rwo, following substance: maleic anhydride, rich horse appropriately combined can be also added
The others additive such as acid, styrene, packing material, reinforcing agent, curing agent, release agent, pigment.
In a preferred embodiment, when in unsaturated polyester resin added with filler, titanium oxide and additive,
Unsaturated polyester resin, glass fibre, silica, titanium oxide and additive ingredient than being respectively A, B, C, D and E, wherein
15% < A < 25%, 5% < B < 20%, 20% < C < 30%, 30% < D < 40%, 1% < E < 3%, A+B+C+D+E
=100%, using the material mixture ratio in the present embodiment, situations such as can effectively inhibiting unsaturated polyester resin cracking, change colour.
After the completion of injection molding, heating the stipulated time to mold makes hardening of resin, at this time support portion on lead frame and
Leading part is embedded in Base body, and wherein support portion is embedded in Base body from two opposite sides of Base body respectively
It is interior.
In the present embodiment, it after forming pedestal main body, is being gone back in rack forming region by unsaturated polyester resin
It include: to separate leading part from lead frame main body.
Specifically, in leading part 13 with support portion 12 respectively from 10 ontology of lead frame engraving to rack forming region 11
In the embodiment that empty region extends, leading part 13 is taken shape in after Base body 20, then needs leading part 13 and lead frame
10 ontology of frame is separated, to guarantee to separate from lead frame 10 in later period LED product, and lead after isolation
Portion 13 can be maintained in LED product.As shown in Figure 7a to be punched out the schematic diagram before separation to leading part, such as Fig. 7 b institute
It is shown as being punched out leading part in the schematic diagram after separation.
Further, in the present embodiment, after leading part is separated from lead frame main body, further includes: will
On leading part in the vertical direction of third lateral surface outwardly projecting part, be bent to the surface for being attached at Base body.
Specifically, in some embodiments, as shown in Figure 8 a, after Base body 20 are completed in injection molding on lead frame,
13 a portion of leading part takes shape in (Fig. 8 a of inner lead portion 13 inside Base body 20 as the functional areas of LED chip
In be not shown), some is then the outside lead portion 131 protruded vertically outward from 20 side of Base body, outside lead
Portion 131 is used to be electrically connected with outside, such as is welded on pcb board, therefore, in order to make it easier to carry out electricity with external
131 applied force of outside lead portion separated with 10 ontology of lead frame, as shown in b in Fig. 8, is allowed to by connection in the present embodiment
It is attached to the surface of Base body 20.
S603 applies the side perpendicular to plane where lead frame main body to the Base body after LED chip encapsulates
Upward power is detached from support portion inside the Base body after LED chip encapsulates, and in Base body after the decoupling
Form bayonet, bayonet includes the to be open respectively from inside Base body to the first lateral surface of Base body and the second lateral surface
One bayonet and the second bayonet.
Preferably, the leading part in the present embodiment and bayonet are respectively positioned on same plane, also, further, leading part
Thickness it is equal with the width of bayonet so that the technique in actual production is more easily implemented, and the controllable of technique can be improved
Property.
As illustrated in fig. 9, it is fixed on the schematic diagram on support portion for LED light emitting device, is then sent out as shown in figure 9b for LED
Optical device stress remove when schematic diagram, the present embodiment in the removing step to LED light emitting device, due to each bayonet only to
Be open on one side of Base body 20, thus Base body 20 to be detached from support portion 12 support, only so that
Support portion 12 is exited from side opening, and only by making support portion 12 by perpendicular to plane where lead frame main body
Power and so that support portion 12 is bent deformation, so that support portion 12 gradually moves back outward from its initial position in bayonet 23
Out.As shown in Figure 9 a, the first support portion 121 and the second support portion 122 are respectively clamped into the first lateral surface 21 and the second outside
The first bayonet 231 and the second bayonet 232 that face 22 is open respectively as shown in Figure 9 b can be on the bottom surfaces of Base body 20
Apply the power towards the direction of top surface, namely applies longitudinal power, so that support portion 12 is bent upwards and exits from opening, when
So, can also optionally apply on the top surface of Base body in the present embodiment makes support portion stress curved towards the power of bottom surface
It is bent.
It should be noted that setting position of the bayonet in Base body can be according to practical application scene in the present embodiment
Carry out flexible choice, it is only necessary to guarantee that each bayonet is only open on a side.
LED light emitting device production method provided by the embodiment of the utility model, the branch by resin in lead frame are put up
Type region carries out the molding of Base body, and two by being oppositely arranged on lead frame support portions are respectively protruding into each leisure LED
Luminescent device two be oppositely arranged side opening bayonet in, in blanking procedure to LED light emitting device apply perpendicular to
Power on the direction of plane where lead frame takes off support portion from LED light emitting device making support portion bend deformation
It separates out and, and form bayonet in the corresponding position of LED light emitting device；The utility model can be to six freedom of LED light emitting device
Degree is fixed, and stability when LED light emitting device is fixed is high, it is possible to prevente effectively from LED light emitting device adds in production
It falls off from lead frame in work industry, improves the yields of LED light emitting device.Further, the LED in the utility model
The blanking of luminescent device is and to make LED light emitting device in the vertical direction by exerting a force on the direction perpendicular to lead frame
Blanking improves LED and shines so as to synchronize blanking operation to multiple LED light emitting device on lead frame simultaneously
The production efficiency of device, can be effectively reduced production cost.
Embodiment three:
A kind of light emitting device is present embodiments provided, which includes exemplified by above-described embodiment one or embodiment two
LED light emitting device.Light emitting device in the present embodiment can be lighting device, optical signal instruction device, light compensating apparatus or backlight
Device etc..When for lighting device, it is specifically as follows the lighting device applied to various fields, such as desk lamp in daily life,
Fluorescent lamp, ceiling lamp, downlight, street lamp, projecting lamp etc., in another example high beam, dipped headlight, atmosphere lamp etc. in automobile, and example
As in medical operating lamp, low electromagnetism headlamp, various medical apparatus headlamp, in another example answer furnishing fields illuminate in it is each
Kind color lamp, landscape spotlight, advertising lamp etc.；When for optical signal instruction device, it is specifically as follows the light applied to various fields
Signal indicating device, such as the signal lamp of field of traffic, the various signal conditions instruction in the communications field on communication equipment
Lamp；It can be the light compensating lamp of photography, such as flash lamp, light compensating lamp, or agriculture field is to plant when for light compensating apparatus
The light supplementing lamp for plants etc. of object light filling；It can be the backlight module applied to various field of backlights, such as can answer when for back lighting device
For equipment such as the mobile terminals such as display, television set, mobile phone, advertisement machines.
It should be understood that above-mentioned application is only several applications exemplified by the present embodiment, it should be appreciated that LED hair
Application several fields that it is not limited to the above example of optical device.
The above content is combining specific embodiment to be further described to made by the utility model embodiment, no
It can assert that the specific implementation of the utility model is only limited to these instructions.For the common skill of the utility model technical field
For art personnel, without departing from the concept of the premise utility, a number of simple deductions or replacements can also be made, all should
It is considered as belonging to the protection scope of the utility model.
Claims (10)
1. a kind of lead frame, which is characterized in that the rack forming region including at least one Openworks shape, the rack forming area
There is the support portion and leading part extended from lead frame main body, the support portion includes the first support being oppositely arranged in domain
Portion and the second support portion, the rack forming region are used for through unsaturated polyester resin in upper forming pedestal main body, the branch
Support part be respectively used to insertion within the molding Base body opposite the first lateral surface and the second lateral surface；The support
Portion is when the Base body is received perpendicular to power where the lead frame main body on the direction of plane, from the pedestal
Body interior is detached from and makes to form bayonet in the Base body, and the bayonet includes respectively from inside the Base body to institute
State the first bayonet and the second bayonet of the first lateral surface and second lateral surface opening.
2. lead frame as described in claim 1, which is characterized in that the surface of the leading part is covered with reflecting layer.
3. lead frame as described in claim 1, which is characterized in that the leading part is generally aligned in the same plane with the support portion
On.
4. lead frame as described in claim 1, which is characterized in that the leading part is equal with the thickness of the support portion.
5. lead frame according to any one of claims 1 to 4, which is characterized in that the support portion and the leading part
Separately positioned, one end of the support portion is open end.
6. lead frame as claimed in claim 5, which is characterized in that the end face of the open end is provided with raised or sunken；
Or, the surface of the support portion close to the open end is set as wedge shape.
7. a kind of LED support, which is characterized in that the leading part including lead frame such as described in any one of claims 1 to 6
And the Base body on the rack forming region of the lead frame, the pedestal master are taken shape in by unsaturated polyester resin
Body has the groove for packaging LED chips, has respectively from inside the Base body to the base in the Base body
The bayonet of the first opposite lateral surface of seat main body and the second lateral surface opening, the bayonet include the first bayonet and the second bayonet,
The bayonet and the leading part are in the same plane, the bayonet by the rack forming region from lead frame main body
The support portion that extends is received in the Base body perpendicular to the power where the lead frame main body on the direction of plane
When, it is formed after being detached from inside the Base body.
8. LED support as claimed in claim 7, which is characterized in that in the unsaturated polyester resin added with filler and/or
Titanium oxide, the filler include glass fibre and silica.
9. LED support as claimed in claim 7 or 8, which is characterized in that the surface of the Base body is additionally provided with along described
It is protruded outward in the vertical direction of the third lateral surface of Base body, and bends the lead for being attached at the surface of the Base body
Portion.
10. a kind of LED light emitting device, which is characterized in that including the LED support and envelope as described in any one of claim 7 to 9
An at least LED chip in Base body loaded on the LED support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821436173.8U CN208955014U (en) | 2018-08-30 | 2018-08-30 | A kind of lead frame, LED support and LED light emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821436173.8U CN208955014U (en) | 2018-08-30 | 2018-08-30 | A kind of lead frame, LED support and LED light emitting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208955014U true CN208955014U (en) | 2019-06-07 |
Family
ID=66736741
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821436173.8U Active CN208955014U (en) | 2018-08-30 | 2018-08-30 | A kind of lead frame, LED support and LED light emitting device |
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| CN (1) | CN208955014U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110233192A (en) * | 2018-08-30 | 2019-09-13 | 深圳市聚飞光电股份有限公司 | A kind of luminescent device and preparation method thereof, lead frame, bracket, light emitting device |
-
2018
- 2018-08-30 CN CN201821436173.8U patent/CN208955014U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110233192A (en) * | 2018-08-30 | 2019-09-13 | 深圳市聚飞光电股份有限公司 | A kind of luminescent device and preparation method thereof, lead frame, bracket, light emitting device |
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