CN110233193A - A kind of luminescent device and preparation method thereof, lead frame, bracket, light emitting device - Google Patents
A kind of luminescent device and preparation method thereof, lead frame, bracket, light emitting device Download PDFInfo
- Publication number
- CN110233193A CN110233193A CN201811006330.6A CN201811006330A CN110233193A CN 110233193 A CN110233193 A CN 110233193A CN 201811006330 A CN201811006330 A CN 201811006330A CN 110233193 A CN110233193 A CN 110233193A
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- Prior art keywords
- lateral surface
- bayonet
- base body
- support portion
- lead frame
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The present invention provides a kind of luminescent devices and preparation method thereof, lead frame, bracket, light emitting device, the lead frame includes at least one Openworks shape for forming pedestal main body rack forming area, there is the support portion and leading part extended from lead frame main body in rack forming region, support portion includes the first/second support portion being oppositely arranged, support portion from the opposite first side of Base body and second side and is bordered by within the intersection insertion Base body of the third side of the two respectively, support portion is when third lateral surface receives the power perpendicular to the direction of third lateral surface, it is detached from inside from Base body and makes to form bayonet in Base body；Five freedom degrees of LED product are fixed in support portion on lead frame of the invention, to which support portion be detached from the remaining one degree of freedom of LED product in blanking procedure, it can avoid LED product to damage in blanking process because of stress, improve the yields of LED product.
Description
Technical field
The present invention relates to LED (Light Emitting Diode, light emitting diode) technical field more particularly to a kind of hairs
Optical device and preparation method thereof, lead frame, bracket, light emitting device.
Background technique
In recent years, LED is by superiority such as its unique low price, low consumption, high brightness, long-lives always in mobile terminal
Display field plays important role, and there are also sizable development spaces within quite long one period from now on.It is existing
In some LED production technologies, the molding of LED support and the encapsulation of LED light emitting device are carried out on the lead frames, and lead frame is
LED product provides lead and provides its molding, the support in encapsulation process, and existing lead frame by being relatively arranged on
Two support portions take shape in two opposite sides of LED product and support, and by by support portion from LED
Luminescent device is detached to carry out the blanking of LED light emitting device in the bayonet that two opposite sides are open, in this case
It needs that support portion is made to generate deformation, such support portion then can apply active force to LED product, so that LED shines in blanking process
Device is easy to damage because of stress.
Summary of the invention
Luminescent device provided in an embodiment of the present invention and preparation method thereof, lead frame, bracket, light emitting device, it is main to solve
Certainly the technical issues of, is: existing by the way that the support portion of lead frame is open from LED light emitting device in two opposite sides
Bayonet in be detached to carry out the blanking of LED light emitting device, LED light emitting device is easy due to stress in caused blanking process
The problem of damage.
In order to solve the above technical problems, the embodiment of the present invention provides a kind of lead frame, including at least one Openworks shape
Rack forming region has the support portion and leading part extended from lead frame main body in the rack forming region, described
Support portion includes the first support portion and the second support portion being oppositely arranged, and the rack forming region is for passing through unsaturated polyester (UP)
Resin in upper forming pedestal main body, the support portion be respectively used to from the first lateral surface of the molding Base body and the
The intersection of the intersection of three lateral surfaces and the second lateral surface and third lateral surface is embedded within the Base body；It is described
First lateral surface and second lateral surface are oppositely arranged, first lateral surface and second lateral surface with the third
Lateral surface is adjacent, and the support portion receives the power on the direction perpendicular to the third lateral surface in the third lateral surface
When, from the Base body inside be detached from and make to form bayonet in the Base body, the bayonet includes the first bayonet and the
Two bayonets, first bayonet are opened to first lateral surface and the third lateral surface simultaneously from inside the Base body
Mouthful, second bayonet is open to second lateral surface and the third lateral surface simultaneously from inside the Base body.
Preferably, the surface of the leading part is covered with reflecting layer.
Preferably, the leading part and the support portion are in the same plane.
Preferably, the leading part is equal with the thickness of the support portion.
In order to solve the above technical problems, the embodiment of the present invention also provides a kind of LED support, including above-mentioned lead frame
Leading part and the Base body on the rack forming region of the lead frame is taken shape in by unsaturated polyester resin, it is described
Base body has bayonet and the groove for packaging LED chips, and the bayonet includes the first bayonet and the second bayonet, described
First bayonet is open inside the Base body simultaneously to the first lateral surface and third lateral surface, and second bayonet is from Base body
Internal to be open simultaneously to the second lateral surface and third lateral surface, first lateral surface and second lateral surface are oppositely arranged,
First lateral surface and second lateral surface are adjacent with the third lateral surface, and the bayonet is by the rack forming area
The support portion that extends in domain from lead frame main body is received in the third lateral surface perpendicular to the third lateral surface
When power on direction, from be detached from be detached from inside the Base body after formed.
Preferably, filler and/or titanium oxide are added in the unsaturated polyester resin, the filler includes glass fibre
And silica.
Preferably, when being added with the filler and the titanium oxide in the unsaturated polyester resin, the unsaturation
Also added with default additive in polyester resin；The unsaturated polyester resin, glass fibre, silica, titanium oxide and pre-
If the ingredient of additive is than being respectively A, B, C, D and E, wherein 15% < A < 25%, 5% < B < 20%, 20% < C <
30%, 30% < D < 40%, 1% < E < 3%, A+B+C+D+E=100%.
Preferably, the bayonet also the Base body the 4th lateral surface be open, the 4th lateral surface with it is described
Third lateral surface is oppositely arranged.
In order to solve the above technical problems, the embodiment of the present invention also provides a kind of LED light emitting device, comprising: above-mentioned LED branch
Frame and at least LED chip being packaged in the Base body of the LED support.
In order to solve the above technical problems, the embodiment of the present invention also provides a kind of light emitting device, comprising: above-mentioned photophore
Part, the light emitting device are lighting device, optical signal instruction device, light compensating apparatus or back lighting device.
In order to solve the above technical problems, the embodiment of the present invention also provides a kind of LED light emitting device production method, LED hair
Optical device production method includes:
Prepare lead frame；Prepared lead frame has the rack forming region of at least one Openworks shape, the branch
There is the support portion and leading part extended from lead frame main body, the support portion includes being oppositely arranged in frame forming area
First support portion and the second support portion；
By unsaturated polyester resin in the rack forming region forming pedestal main body；The Base body, which has, to be used
In the groove of packaging LED chips, the support portion respectively from the first lateral surface of the molding Base body of institute with outside third
The intersection of the intersection of side and the second lateral surface and third lateral surface is embedded within the Base body；Described first
Lateral surface and second lateral surface are oppositely arranged, and first lateral surface and second lateral surface are and on the outside of the third
Face is adjacent；
Apply on the third lateral surface of the Base body after LED chip encapsulates perpendicular to the third
Power on the direction of lateral surface is detached from the support portion from the Base body after LED chip encapsulates, and
Bayonet is formed in the Base body after the decoupling, the bayonet includes the first bayonet and the second bayonet, first bayonet
It is open simultaneously to first lateral surface and the third lateral surface from inside the Base body, second bayonet is described in
It is open simultaneously to second lateral surface and the third lateral surface inside Base body.
Preferably, it after forming pedestal main body, is also wrapped in the rack forming region by unsaturated polyester resin
It includes:
The leading part is separated from the lead frame main body.
Preferably, after being separated the leading part from the lead frame main body, further includes:
By on the leading part in the vertical direction of the third lateral surface outwardly projecting part, be bent to and be attached at
The surface of the Base body.
Preferably, the leading part and the bayonet are respectively positioned on same plane.
Preferably, the thickness of the leading part is equal with the width of the bayonet.
It is preferably, described that by unsaturated polyester resin, forming pedestal main body includes: in the rack forming region
By the unsaturated polyester resin added with filler and/or titanium oxide in the rack forming region forming pedestal
Main body, the filler include glass fibre and silica.
Preferably, in the unsaturated polyester resin by being added with filler and/or titanium oxide in the rack forming region
When interior forming pedestal main body, also added with default additive in the unsaturated polyester resin；
The unsaturated polyester resin, glass fibre, silica, titanium oxide and default additive ingredient ratio be respectively
A, B, C, D and E, wherein 15% < A < 25%, 5% < B < 20%, 20% < C < 30%, 30% < D < 40%, 1% < E
< 3%, A+B+C+D+E=100%.
Preferably, the 4th lateral surface of first bayonet and second bayonet also respectively in the Base body is opened
Mouthful, the 4th lateral surface is oppositely arranged with the third lateral surface.
The beneficial effects of the present invention are:
The present invention provides a kind of luminescent device and preparation method thereof, lead frame, bracket, light emitting device, the lead frames
Frame includes the rack forming region of at least one Openworks shape, has the branch extended from lead frame main body in rack forming region
Support part and leading part, support portion include the first support portion and the second support portion being oppositely arranged, and rack forming region is for passing through
Unsaturated polyester resin in upper forming pedestal main body, support portion be respectively used to from institute the first lateral surface of molding Base body and
Within the intersection of the intersection of third lateral surface and the second lateral surface and third lateral surface insertion Base body；Outside first
Side and the second lateral surface are oppositely arranged, and the first lateral surface and the second lateral surface are adjacent with third lateral surface, and support portion is the
When three lateral surfaces receive the power on the direction perpendicular to third lateral surface, it is detached from and makes in Base body from Base body inside
Form bayonet, bayonet includes the first bayonet and the second bayonet, the first bayonet inside the Base body simultaneously to the first lateral surface and
Third lateral surface opening, the second bayonet are open to the second lateral surface and third lateral surface simultaneously from inside Base body.The present invention
Lead frame on support portion five freedom degrees of LED product are fixed, thus in blanking procedure by support portion from
It is detached in the remaining one degree of freedom of LED product, without making support portion stress, deformation occurs and takes off from LED product
From, it is possible to prevente effectively from LED product in blanking process because stress damage, improve the yields of LED product.
Further, burr can be effectively suppressed by unsaturated polyester resin molding, when molding in the LED support in the present invention
It generates, deterioration patience is higher, and the requirement to forming temperature and pressure is lower, can effectively ensure that product quality and production efficiency.
Detailed description of the invention
Fig. 1 is the shaping schematic view for the LED support that the embodiment of the present invention one provides；
Fig. 2 is the structural schematic diagram for the lead frame that the embodiment of the present invention one provides；
Fig. 3 is the side schematic view for the LED support that the embodiment of the present invention one provides；
Fig. 4 is the side schematic view for another LED support that the embodiment of the present invention one provides；
Fig. 5 is the structural schematic diagram for the LED light emitting device that the embodiment of the present invention one provides；
Fig. 6 is the flow chart of LED light emitting device production method provided by Embodiment 2 of the present invention；
Fig. 7 a is punched out the schematic diagram before separation to leading part to be provided by Embodiment 2 of the present invention；
Fig. 7 b is punched out the schematic diagram after separation to leading part to be provided by Embodiment 2 of the present invention；
Fig. 8 a is leading part provided by Embodiment 2 of the present invention from Base body side vertical schematic diagram outstanding outward；
Fig. 8 b is the schematic diagram that leading part provided by Embodiment 2 of the present invention bending is attached at Base body surface；
Fig. 9 a is that LED light emitting device provided by Embodiment 2 of the present invention is fixed on the schematic diagram on support portion；
Fig. 9 b is schematic diagram when LED light emitting device stress provided by Embodiment 2 of the present invention removes.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, below by specific embodiment knot
Attached drawing is closed to be described in further detail the embodiment of the present invention.It should be appreciated that specific embodiment described herein is only to solve
The present invention is released, is not intended to limit the present invention.
Embodiment one:
Be directed in the prior art, by by the support portion of lead frame from LED light emitting device in two opposite sides
Be detached from the bayonet of opening to carry out the blanking of LED light emitting device, in caused blanking process LED light emitting device be easy because by
Power and the problem of damage, the present invention provides a kind of lead frames 10, and specifically referring to Figure 1, which includes at least
The rack forming region 11 of one Openworks shape, rack forming region 11 is interior to have the support portion extended from 10 main body of lead frame
12 and leading part 13, support portion 12 includes the first support portion and the second support portion being oppositely arranged, and rack forming region 11 is used for
By unsaturated polyester resin in upper forming pedestal main body 20, support portion 12 be respectively used to from molding Base body 20 the
One lateral surface 21 is embedded in base with the intersection of third lateral surface 23 and the intersection of the second lateral surface 22 and third lateral surface 23
Within seat main body；First lateral surface 21 and the second lateral surface 22 are oppositely arranged, the first lateral surface 21 and the second lateral surface 22 with
Third lateral surface 23 is adjacent；Support portion 12 receives the power on the direction perpendicular to third lateral surface 23 in third lateral surface 23
When, it being detached from inside support portion 12 and makes to be formed bayonet 24 in Base body 20, bayonet 24 includes the first bayonet and the second bayonet,
First bayonet is open to the first lateral surface 21 and third lateral surface 23 simultaneously from the inside of Base body 20, and the second bayonet is from pedestal master
20 inside of body is open to the second lateral surface 22 and third lateral surface 23 simultaneously.
In the present embodiment, Fig. 2 is referred to, lead frame 10 can add using punching press is carried out to flat electrically-conductive backing plate
Work or etching and processing and formed, to form the rack forming region 11 of at least one Openworks shape on lead frame 10, thus
Part remaining after the material to hollowed out area is removed is formed with leading part 13 and support portion 12 on lead frame 10,
And support portion 12 and leading part 13 extend from 10 ontology of lead frame to hollowed out area, the support portion 12 in the present embodiment and draw
Line portion 13 extends from 10 ontology of lead frame to hollowed out area respectively；And in further embodiments, support portion and leading part are also
It can be used as that an entirety extends from lead frame ontology to hollowed out area namely leading part by support portion is connected to lead frame
On frame ontology.Wherein there is on leading part 13 crystal bonding area for loading LED chip, the LED for being installed on to the later period
Chip is connected, and support portion 12 on lead frame 10 then for carrying out the encapsulation of LED support molding and LED light emitting device
When, it is formed in inside LED product and LED product is supported.Support portion 12 in the present embodiment is oppositely arranged, and should be illustrated
, it can also be by multiple monomer support portion institutes group respectively that the first support portion and the second support portion, which can be monomer support portion,
It is whole made of conjunction.
It should be understood that the lead frame in the present embodiment can be constituted for the substrate of various conductive materials, such as can
Think various metal or metal alloy substrates, including but not limited to copper base, aluminum substrate, iron substrate, silver-based plate, naturally it is also possible to
For the mixing material substrate comprising conductive material, such as conductive rubber etc. is preferably made in the present embodiment of copper alloy
Lead frame, it is ensured that good electric conductivity and thermal diffusivity.In addition, lead frame in the present embodiment can be it is lamellar,
To be easy to later period bending machining, can make it easier to be shaped to defined shape.Also, lead frame is not limited only to single layer knot
Structure can also be the lamination layer structure as composed by multilayer conductive material in some embodiments.
In addition, in the present embodiment, it, can also be to leading part in order to improve the reflectivity of the light issued to LED chip
Surface carries out the coating in reflecting layer, and reflecting layer here can be silver, aluminium, copper, gold etc., and the coating method in reflecting layer preferably may be used
Using plating, it should be noted that reflecting layer coating processing here can be before carrying out LED support molding to lead
Frame entirety is handled, and is also possible to after completing LED support molding, only in the crystal bonding area institute for loading LED chip
The leading part at place carries out reflecting layer coating processing.In order to further increase the reflectivity on leading part surface, can preferably make to draw
Line portion forms smooth surface.
It should be noted that referring again to Fig. 2, implementation as one preferred, the leading part in the present embodiment
13 extend from 10 ontology of lead frame to hollowed out area and are formed in the space between support portion 12, and the anode of leading part 13
Leading part and negative wire portion separated and formed and be dielectrically separated from area, and to all have one open for the support portion 12 being oppositely arranged
End, and its open end and leading part 13 are separately positioned, open end here refer to do not form company with other components at one end
It connects.Certainly, in further embodiments, support portion can also be not provided with open end namely support portion and prolong from lead frame ontology
Leading part is extended to after stretching and is connected with leading part, then needs to guarantee in this case in actual production final
Leading part meeting and support section from.
Preferably, the leading part 13 in the present embodiment and support portion 12 are in the same plane, also, further, draw
Line portion 13 is equal with the thickness of support portion 12, so that the technique in actual production is more easily implemented, and can improve technique
Controllability.
In order to guarantee that the support portion in the present embodiment can be from LED light emitting device when carrying out LED light emitting device blanking
Withdraw, referring to Fig. 1 and Fig. 3, the LED support in the present embodiment include the leading part 13 of above-mentioned lead frame 10 with
And Base body 20 on the rack forming region 11 of above-mentioned lead frame 10, pedestal master are taken shape in by unsaturated polyester resin
Body 20 has bayonet 24 and the groove for packaging LED chips, and bayonet 24 includes the first bayonet and the second bayonet, the first bayonet
It is open simultaneously to the first lateral surface 21 and third lateral surface 23 from 20 inside of Base body, the second bayonet is from inside Base body 20
It being open simultaneously to the second lateral surface 22 and third lateral surface 23, the first lateral surface 21 and the second lateral surface 22 are oppositely arranged, and first
Lateral surface 21 and the second lateral surface 22 are adjacent with third lateral surface 23, bayonet 24 by rack forming region 11 from lead frame
Support portion 12 that 10 main bodys are extended, when third lateral surface 23 receives the power on the direction perpendicular to third lateral surface 23,
It is formed after being detached from inside Base body 20.
In the present embodiment, which is clamped by lead frame in a mold in the rack forming region of lead frame
Upper injection molding is formed with the groove of the packaging area as LED chip in the Base body of LED support after molding, wherein
The leading part of lead frame is at least partly exposed to the bottom surface of groove, thus the mounting region as LED chip.In practical application
In, LED chip can be positioned in positive wire portion, be then electrically connected LED chip with positive wire portion by metal wire, so
LED chip is connect by metal wire with negative wire portion again afterwards, certainly, in practical applications, if by LED chip upside-down mounting,
It can be without the metal wire of aforementioned connection LED chip and leading part.Top opening from groove to Base body, so as to from opening
Place is sealed the encapsulation of material to inside grooves.
Specifically, forming the bayonet 24 of oriented side opening, single bayonet in Base body 20 referring to Fig. 3
24 be open on two adjacent sides namely the present embodiment in each bayonet 24 opened to two sides, and it is each
The wherein one side of the opening of bayonet 24 is on ipsilateral altogether, such as a wherein opening for two bayonets 24 is located at relatively
On the first lateral surface 21 and the second lateral surface 22 being arranged, and another opening of two bayonets 24 is then respectively positioned on and the first lateral surface
21, on the adjacent third lateral surface 23 of the second lateral surface 22.It should be noted that opening here is formed only in the one of side
Partial region, and side is not subjected to whole run through.
As an alternative embodiment, bayonet 24 is also open in the 4th lateral surface 25 of Base body 20, outside the 4th
Side 25 and third lateral surface 23 be oppositely arranged namely the present embodiment in each bayonet 24 opened to three faces.Such as Fig. 4 institute
Show, the opening of each bayonet 24 in the present embodiment is distributed on three adjacent sides, wherein each bayonet 24 one wherein
Opening on side runs through entire side, and extends on other two opposite side and be open.Such as two bayonets 24
A wherein opening extend through on the first lateral surface 21 and the second lateral surface 22 being oppositely arranged, and two bayonets 24 is another
One opening is then respectively positioned on the third lateral surface 23 adjacent with the first lateral surface 21, the second lateral surface 22, and there are one openings then
It is respectively positioned on the 4th lateral surface 25 opposite with third lateral surface 23, the opening in third lateral surface 23 and the 4th lateral surface 25
It is only located at a part of region of this two sides, and this two sides is not subjected to whole run through.
It should be noted that the support referring to Fig. 1, after guaranteeing LED support molding, on lead frame 10
Portion 12 has the freedom degree exited from Base body 20, and the width of the support portion 12 in the present embodiment is greater than or equal to bayonet 24
Width namely support portion 12 extend be exposed to except bayonet 24 in the direction of the width, width direction here refers in lead
From the direction that 10 ontology of lead frame is extended in 10 plane of frame, perpendicular to support portion 12, to avoid in forming process
Support portion taken shape in inside Base body completely and Base body is fixed from six-freedom degree, without exit from
By spending.
Resin employed in the present embodiment is unsaturated polyester resin, and unsaturated polyester resin has as heat reactive resin
There are excellent reflectivity and the deterioration patience to ultraviolet light etc., to can have in the case where LED light emitting device shines for a long time
Effect inhibits the deterioration of reflecting plate or resin, and maintains high reflectance and light efficiency；In addition, unsaturated polyester resin does not have hydroxyl
(- OH group) isoreactivity functional group, does not form chemical bond with metal, so the relatively difficult labour green resin burr in forming process,
It is easy to be removed producing resin burr；Furthermore the fusing point of unsaturated polyester resin is 50 DEG C -90 DEG C or so, from
And be able to suppress added organic matter in resin when carrying out injection molding to unsaturated polyester (UP) and be carbonized, molding can be effectively suppressed
Defect；In addition, unsaturated polyester resin wants high relative to the mobility of thermoplastic resin, thus when carrying out resin injection, energy
Enough to be infused resin into lower injection pressure, a possibility that such lead frame deforms, is lowered, in injection molding process
In, then it does not need to keep lead frame, mold can be simplified.
In practical applications, it can further be added in unsaturated polyester resin by the longer glass fibre of fiber and spherical
The filler that constitutes of silica to improve the intensity of resin.
It is, of course, also possible to add titanium oxide, in unsaturated polyester (UP) to improve resin to the reflectivity of light.
In filler or titanium oxide or the rwo, following substance: maleic anhydride, rich horse appropriately combined can be also added
The others additive such as acid, styrene, packing material, reinforcing agent, curing agent, release agent, pigment.
In a preferred embodiment, when in unsaturated polyester resin added with filler, titanium oxide and additive,
Unsaturated polyester resin, glass fibre, silica, titanium oxide and additive ingredient than being respectively A, B, C, D and E, wherein
15% < A < 25%, 5% < B < 20%, 20% < C < 30%, 30% < D < 40%, 1% < E < 3%, A+B+C+D+E
=100%, using the material mixture ratio in the present embodiment, situations such as can effectively inhibiting unsaturated polyester resin cracking, change colour.
As shown in figure 5, the present embodiment additionally provides LED light emitting device 100 made of a kind of above-mentioned LED support of utilization,
Including above-mentioned LED support and at least LED chip 30 being packaged in the Base body 20 of LED support.
The color that the illumination of LED light emitting device provided in this embodiment shoots out, is presented to the user, can be according to practical need
Application scenarios of summing carry out flexible setting.The illumination of LED light emitting device shoots out, which kind of color show is, can pass through
But be not limited to following factor flexibly to control: whether color, the LED light emitting device for the light that LED chip itself issues are arranged illuminating rotary
Change the type of layer, the luminescent conversion layer set when luminescent conversion layer is arranged in LED light emitting device.
In a kind of example of the present embodiment, LED light emitting device, which may also include, is set to LED chip (on LED chip
When being provided with luminescent conversion glue-line, be then set on luminescent conversion glue-line) on lens glue-line or diffusion glue-line；Certainly,
In some instances, it may also set up substratum transparent on LED chip.
It should be understood that luminescent conversion glue-line can be the fluorescent adhesive layer comprising fluorescent powder in a kind of example, it can also
To be the colloid comprising the photic material of quantum dot or other can realize the luminescent conversion glue or film of luminescent conversion, and according to need
It also may include spread powder or silicon powder etc.；Luminescent conversion glue-line, lens glue-line or expansion are formed in the present embodiment in LED chip
The mode for dissipating glue-line includes but is not limited to dispensing, molding, spraying, stickup etc..
For example, luminescent conversion glue-line may include fluorescent powder glue-line, fluorescent film or quantum dot QD film；Fluorescent powder glue-line, fluorescence
Inorganic fluorescent powder production can be used in film, can be the inorganic fluorescent powder for being doped with rare earth element, wherein inorganic fluorescent powder includes
At least one of but be not limited to silicate, aluminate, phosphate, nitride, fluorination matter fluorescent powder.
In another example the production of quantum dot fluorescence powder can be used in quantum dot QD film；Quantum dot fluorescence powder include but is not limited to BaS,
AgInS2、NaCl、Fe2O3、In2O3、InAs、InN、InP、CdS、CdSe、CdTe、ZnS、ZnSe、ZnTe、GaAs、GaN、
GaS、GaSe、InGaAs、MgSe、MgS、MgTe、PbS、PbSe、PbTe、Cd(SxSe1-x)、BaTiO3、PbZrO3、
At least one of CsPbCl3, CsPbBr3, CsPbI3.
In the present embodiment, the type for the light that LED chip itself issues can be macroscopic visible light, be also possible to
Visually sightless ultraviolet light, infrared light；When the type for the light that LED chip itself issues is the sightless ultraviolet light of naked eyes, red
When outer smooth, luminescent conversion layer can be set on LED chip, naked eyes black light is converted into naked eyes visible light, so that LED
It is the visible light of user that luminescent device, which irradiates the light come,.For example, when the light that LED chip itself issues is ultraviolet light, if thinking
The visible white light of LED light emitting device presentation user, then luminescent conversion layer can be red, green, blue fluorescent powder is mixed after make
It is made.
Five freedom degrees of LED product are fixed in support portion on lead frame provided in an embodiment of the present invention, from
And detach support portion from the remaining one degree of freedom of LED light emitting device in blanking procedure, it is supported without making
Deformation occurs and is detached from from LED light emitting device for portion's stress, it is possible to prevente effectively from LED light emitting device is in blanking process because of stress
And damage, improve the yields of LED light emitting device.Further, the LED light emitting device in the present invention passes through unsaturated polyester (UP)
Burr generation can be effectively suppressed in resin forming, when molding, and deterioration patience is higher, and the requirement to forming temperature and pressure is lower, can
Product quality and production efficiency is effectively ensured.
Embodiment two:
For the ease of the comprehensive understanding present invention, manufacturing process of the present embodiment to LED light emitting device provided by the invention
It is illustrated.
Fig. 6 is referred to, Fig. 6 is the flow chart of LED light emitting device production method provided in this embodiment, in production LED hair
When optical device, specific implementation step includes:
S601 prepares lead frame；Prepared lead frame has the rack forming region of at least one Openworks shape, branch
There is the support portion and leading part extended from lead frame main body, support portion includes first be oppositely arranged in frame forming area
Support portion and the second support portion.
In the present embodiment, lead frame removal of selectivity and to electrically-conductive backing plate progress punching press or etching and processing is pre-
If being formed after the material in region, it is formed by lead frame and is formed with rack forming region, for is molded in a mold
Molding forms the region of the Base body of LED support.Support portion on lead frame is oppositely arranged, on to taking shape in
LED support carry out stablizing support.It should be noted that in a preferred embodiment, support portion and leading part draw certainly respectively
Wire frame ontology extends to hollowed out area, after leading part and support portion extend out from lead frame ontology, leading part and support
The one end of portion far from lead frame ontology is open end, is connected without being formed with other components.Certainly, in other embodiment party
In formula, support portion and leading part are also used as an entirety and extend from lead frame ontology to hollowed out area namely leading part
It is connected on lead frame ontology by support portion.
S602, by unsaturated polyester resin in rack forming region forming pedestal main body；Base body, which has, to be used for
The groove of packaging LED chips, support portion respectively from institute molding Base body the first lateral surface and third lateral surface boundary
Within the intersection of place and the second lateral surface and third lateral surface insertion Base body；First lateral surface and the second lateral surface
It is oppositely arranged, the first lateral surface and the second lateral surface are adjacent with third lateral surface.
In this step, the unsaturated polyester resin of filler and/or titanium oxide is added in rack forming region
Injection molding carry out forming pedestal main body, filler includes glass fibre and silica.Wherein the strong of resin can be improved in addition filler
Degree, and add titanium oxide then and resin can be improved to the reflectivity of light.Also, in filler or titanium oxide or the rwo,
Also appropriately combined it can add following substance: maleic anhydride, fumaric acid, styrene, packing material, reinforcing agent, curing agent, demoulding
The others additive such as agent, pigment.
In a preferred embodiment, when in unsaturated polyester resin added with filler, titanium oxide and additive,
Unsaturated polyester resin, glass fibre, silica, titanium oxide and additive ingredient than being respectively A, B, C, D and E, wherein
15% < A < 25%, 5% < B < 20%, 20% < C < 30%, 30% < D < 40%, 1% < E < 3%, A+B+C+D+E
=100%, using the material mixture ratio in the present embodiment, situations such as can effectively inhibiting unsaturated polyester resin cracking, change colour.
After the completion of injection molding, heating the stipulated time to mold makes hardening of resin, at this time support portion on lead frame and
Leading part is embedded in Base body, and wherein support portion is embedded in Base body from two opposite sides of Base body respectively
It is interior, and support portion also exposes from the same side adjacent with the two sides to outside the side namely support portion is exposed
The side come can just be flushed with the side, can also be extended to beyond plane where the side.
In the present embodiment, it after forming pedestal main body, is being gone back in rack forming region by unsaturated polyester resin
It include: to separate leading part from lead frame main body.
Specifically, in leading part 13 and support portion 12 respectively from 10 ontology of lead frame to the hollow out in rack forming region 11
In the embodiment that region extends, leading part 13 is taken shape in after Base body 20, then needs leading part 13 and lead frame
10 ontologies are separated, to guarantee to separate from lead frame 10 in later period LED product, and leading part after isolation
13 can be maintained in LED product.As shown in Figure 7a to be punched out the schematic diagram before separation to leading part, as shown in Figure 7b
To be punched out the schematic diagram after separation to leading part.
Further, in the present embodiment, after leading part is separated from lead frame main body, further includes: will
On leading part in the vertical direction of third lateral surface outwardly projecting part, be bent to the surface for being attached at Base body.
Specifically, in some embodiments, as shown in Figure 8 a, when Base body 20 is completed in injection molding on lead frame 10
Afterwards, 13 a portion of leading part takes shape in the (figure of inner lead portion 13 inside Base body 20 as the functional areas of LED chip
It is not shown in 8a), some is then the outside lead portion 131 protruded vertically outward from 20 side of Base body, and outside is drawn
Line portion 131 is used to be electrically connected with outside, such as is welded on pcb board, therefore, in order to make it easier to carry out with external
131 applied force of outside lead portion separated with 10 ontology of lead frame, as shown in Figure 8 b, is allowed to by electrical connection in the present embodiment
It is attached to the surface of Base body 20.
S603 applies on the third lateral surface of the Base body after LED chip encapsulates perpendicular to third lateral surface
Direction on power, be detached from support portion from the Base body after LED chip encapsulates, and Base body after the decoupling
Upper formation bayonet, bayonet include the first bayonet and the second bayonet, and the first bayonet is from inside Base body simultaneously to the first lateral surface
It is open with third lateral surface, the second bayonet is open to the second lateral surface and third lateral surface simultaneously from inside Base body.
Preferably, the leading part in the present embodiment and bayonet are respectively positioned on same plane, also, further, leading part
Thickness it is equal with the width of bayonet so that the technique in actual production is more easily implemented, and the controllable of technique can be improved
Property.
As illustrated in fig. 9, it is fixed on the schematic diagram on support portion for LED light emitting device, is then sent out as shown in figure 9b for LED
Schematic diagram after the removal of optical device, in the removing step to LED light emitting device, on third lateral surface 23 apply perpendicular to
Power on the direction of third lateral surface 23, so that LED light emitting device is on the direction that third lateral surface 23 extends to its opposite side
It is mobile, until support portion 12 is exited by the opening of the third lateral surface 23 of LED light emitting device from open interior completely, and make
LED light emitting device is detached from from lead frame 10 and completes blanking.Support portion 12 in the present embodiment is from Base body 20
It is exited on one side, therefore in resin molding process, support portion 12 should be exposed to except the side and guarantee the side
In the respective side of support portion 12 will not being closed in, thus the support portion 12 made exited from the side it is achievable.It is corresponding to prop up
After support part 12 is detached from from Base body 20, the space that support portion 12 is vacateed in Base body 20 forms bayonet 24, by
It is embedded in support portion 12 from one of side of Base body 20, and is also leaked out from another adjacent side, corresponding institute's shape
At each bayonet 24 be then to be open in two adjacent sides, namely in the first lateral surface 21 and the second lateral surface 22
After forming bayonet 24 afterwards, bayonet 24 extends to third lateral surface 23 and gets through third lateral surface 23, to be formed in outside first
The first bayonet 241 that side 21 and third lateral surface 23 are open, and be open in the second lateral surface 22 and third lateral surface 23
Second bayonet 242.It should be noted that opening here is formed only in a part of region of side, and not side is carried out
Entirety runs through.
It should be noted that in a preferred embodiment, the first bayonet and the second bayonet are also respectively in Base body
The 4th lateral surface opening, the 4th lateral surface is oppositely arranged with third lateral surface.Namely the opening of each bayonet is distributed in phase
On three adjacent sides, wherein opening of each bayonet on a wherein side and run through entire side, and extend to other two
It is open on a opposite side.In this embodiment, support portion be then to four freedom degrees of LED light emitting device into
Row is fixed, and in the removing step of LED light emitting device, then can arbitrarily select LED light emitting device in two opposite directions
Removal direction.
LED light emitting device production method provided in an embodiment of the present invention, by unsaturated polyester resin in lead frame
Rack forming region carries out the molding of Base body, and the first support portion and the second support portion by being oppositely arranged on lead frame
Five freedom degrees of LED light emitting device are fixed, by support portion remaining one from LED light emitting device in blanking procedure
It is detached in freedom degree, and forms bayonet in the corresponding position of LED light emitting device, without making support portion stress that shape occur
Become to be detached from from LED light emitting device, it is possible to prevente effectively from LED light emitting device is damaged in blanking process because of stress, improves
The yields of LED light emitting device.Further, the LED light emitting device in the present invention is formed by unsaturated polyester resin, at
Burr generation can be effectively suppressed when type, deterioration patience is higher, and the requirement to forming temperature and pressure is lower, can effectively ensure that product
Quality and production efficiency.
Embodiment three:
A kind of light emitting device is present embodiments provided, which includes exemplified by above-described embodiment one or embodiment two
LED light emitting device.Light emitting device in the present embodiment can be lighting device, optical signal instruction device, light compensating apparatus or backlight
Device etc..When for lighting device, it is specifically as follows the lighting device applied to various fields, such as desk lamp in daily life,
Fluorescent lamp, ceiling lamp, downlight, street lamp, projecting lamp etc., in another example high beam, dipped headlight, atmosphere lamp etc. in automobile, and example
As in medical operating lamp, low electromagnetism headlamp, various medical apparatus headlamp, in another example answer furnishing fields illuminate in it is each
Kind color lamp, landscape spotlight, advertising lamp etc.；When for optical signal instruction device, it is specifically as follows the light applied to various fields
Signal indicating device, such as the signal lamp of field of traffic, the various signal conditions instruction in the communications field on communication equipment
Lamp；It can be the light compensating lamp of photography, such as flash lamp, light compensating lamp, or agriculture field is to plant when for light compensating apparatus
The light supplementing lamp for plants etc. of object light filling；It can be the backlight module applied to various field of backlights, such as can answer when for back lighting device
For equipment such as the mobile terminals such as display, television set, mobile phone, advertisement machines.
It should be understood that above-mentioned application is only several applications exemplified by the present embodiment, it should be appreciated that LED hair
Application several fields that it is not limited to the above example of optical device.
The above content is combining specific embodiment to be further described to made by the embodiment of the present invention, cannot recognize
Fixed specific implementation of the invention is only limited to these instructions.For those of ordinary skill in the art to which the present invention belongs,
Without departing from the inventive concept of the premise, a number of simple deductions or replacements can also be made, all shall be regarded as belonging to the present invention
Protection scope.
Claims (18)
1. a kind of lead frame, which is characterized in that the rack forming region including at least one Openworks shape, the rack forming area
There is the support portion and leading part extended from lead frame main body, the support portion includes the first support being oppositely arranged in domain
Portion and the second support portion, the rack forming region are used for through unsaturated polyester resin in upper forming pedestal main body, the branch
Support part is respectively used to from outside institute the first lateral surface of the molding Base body and the intersection and second of third lateral surface
The intersection of side and third lateral surface is embedded within the Base body；First lateral surface and the second lateral surface phase
To setting, first lateral surface and second lateral surface are adjacent with the third lateral surface, and the support portion is described
When third lateral surface receives the power on the direction perpendicular to the third lateral surface, it is detached from and makes inside the Base body
Form bayonet in the Base body, the bayonet includes the first bayonet and the second bayonet, and first bayonet is from the pedestal
Body interior is open to first lateral surface and the third lateral surface simultaneously, and second bayonet is from the Base body
Portion is open to second lateral surface and the third lateral surface simultaneously.
2. lead frame as described in claim 1, which is characterized in that the surface of the leading part is covered with reflecting layer.
3. lead frame as claimed in claim 1 or 2, which is characterized in that the leading part is with the support zone in same
In plane.
4. lead frame as claimed in claim 1 or 2, which is characterized in that the thickness phase of the leading part and the support portion
Deng.
5. a kind of LED support, which is characterized in that the leading part including lead frame according to any one of claims 1 to 4
And the Base body on the rack forming region of the lead frame, the pedestal master are taken shape in by unsaturated polyester resin
Body has bayonet and the groove for packaging LED chips, and the bayonet includes the first bayonet and the second bayonet, first card
It mouthful is open simultaneously to the first lateral surface and third lateral surface inside the Base body, second bayonet is same from inside Base body
When be open to the second lateral surface and third lateral surface, first lateral surface and second lateral surface are oppositely arranged, described the
One lateral surface and second lateral surface are adjacent with the third lateral surface, the bayonet by the rack forming region from
Support portion that lead frame main body is extended receives on the direction perpendicular to the third lateral surface in the third lateral surface
Power when, from the Base body inside be detached from after formed.
6. LED support as claimed in claim 5, which is characterized in that in the unsaturated polyester resin added with filler and/or
Titanium oxide, the filler include glass fibre and silica.
7. LED support as claimed in claim 6, which is characterized in that filled out in the unsaturated polyester resin added with described
When material and the titanium oxide, also added with default additive in the unsaturated polyester resin；The unsaturated polyester resin, glass
Glass fiber, silica, titanium oxide and default additive ingredient than being respectively A, B, C, D and E, wherein 15% < A <
25%, 5% < B < 20%, 20% < C < 30%, 30% < D < 40%, 1% < E < 3%, A+B+C+D+E=100%.
8. the LED support as described in any one of claim 5 to 7, which is characterized in that the bayonet is also in the Base body
The 4th lateral surface opening, the 4th lateral surface is oppositely arranged with the third lateral surface.
9. a kind of LED light emitting device, which is characterized in that including the LED support and envelope as described in any one of claim 5 to 8
An at least LED chip in Base body loaded on the LED support.
10. a kind of light emitting device, which is characterized in that including LED light emitting device as claimed in claim 9, the light emitting device
For lighting device, optical signal instruction device, light compensating apparatus or back lighting device.
11. a kind of LED light emitting device production method, which comprises the following steps:
Prepare lead frame；Prepared lead frame has the rack forming region of at least one Openworks shape, and the branch is put up
There is the support portion and leading part extended from lead frame main body, the support portion includes first be oppositely arranged in type region
Support portion and the second support portion；
By unsaturated polyester resin in the rack forming region forming pedestal main body；The Base body has for sealing
Fill LED chip groove, the support portion respectively from institute the molding Base body the first lateral surface and third lateral surface
Intersection and the intersection of the second lateral surface and third lateral surface be embedded within the Base body；First outside
Face and second lateral surface are oppositely arranged, and first lateral surface and second lateral surface are adjacent with the third lateral surface
It connects；
Apply on the outside of perpendicular to the third on the third lateral surface of the Base body after LED chip encapsulates
Power on the direction in face is detached from the support portion from the Base body after LED chip encapsulates, and de-
Form bayonet in the Base body from after, the bayonet includes the first bayonet and the second bayonet, and first bayonet is from institute
It states and is open simultaneously to first lateral surface and the third lateral surface inside Base body, second bayonet is from the pedestal
Body interior is open to second lateral surface and the third lateral surface simultaneously.
12. LED light emitting device production method as claimed in claim 11, which is characterized in that passing through unsaturated polyester resin
In the rack forming region after forming pedestal main body, further includes:
The leading part is separated from the lead frame main body.
13. LED light emitting device production method as claimed in claim 12, which is characterized in that by the leading part from described
After being separated in lead frame main body, further includes:
By on the leading part in the vertical direction of the third lateral surface outwardly projecting part, be bent to be attached at it is described
The surface of Base body.
14. LED light emitting device production method as claimed in claim 11, which is characterized in that the leading part and the bayonet
It is respectively positioned on same plane.
15. LED light emitting device production method as claimed in claim 11, which is characterized in that the thickness of the leading part and institute
The width for stating bayonet is equal.
16. the LED light emitting device production method as described in any one of claim 11 to 15, described to pass through unsaturated polyester (UP) tree
Rouge forming pedestal main body in the rack forming region includes:
By the unsaturated polyester resin added with filler and/or titanium oxide in the rack forming region forming pedestal master
Body, the filler include glass fibre and silica.
17. LED light emitting device production method as claimed in claim 16, which is characterized in that by added with filler and/or
The unsaturated polyester resin of titanium oxide is in the rack forming region when forming pedestal main body, in the unsaturated polyester resin
Also added with default additive；
The unsaturated polyester resin, glass fibre, silica, titanium oxide and default additive ingredient than be respectively A, B,
C, D and E, wherein 15% < A < 25%, 5% < B < 20%, 20% < C < 30%, 30% < D < 40%, 1% < E <
3%, A+B+C+D+E=100%.
18. the LED light emitting device production method as described in any one of claim 11 to 15, first bayonet and described
Also the 4th lateral surface in the Base body is open two bayonets respectively, the 4th lateral surface and the third lateral surface phase
To setting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811006330.6A CN110233193A (en) | 2018-08-30 | 2018-08-30 | A kind of luminescent device and preparation method thereof, lead frame, bracket, light emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811006330.6A CN110233193A (en) | 2018-08-30 | 2018-08-30 | A kind of luminescent device and preparation method thereof, lead frame, bracket, light emitting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110233193A true CN110233193A (en) | 2019-09-13 |
Family
ID=67861843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811006330.6A Pending CN110233193A (en) | 2018-08-30 | 2018-08-30 | A kind of luminescent device and preparation method thereof, lead frame, bracket, light emitting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110233193A (en) |
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2018
- 2018-08-30 CN CN201811006330.6A patent/CN110233193A/en active Pending
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