JP2011091344A - Light emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting device that has good adhesion in a mounting region in a narrow range even as a lateral light emission type light emitting device and can be mounted without tilting. <P>SOLUTION: The light emitting device 30 has a bottom surface as a mounting surface and emits light emitted by a light emitting element 5 from its front. A substrate 20 to be mounted with the light emitting element includes lead electrodes 31a, 31b on a support 10, having a recess 13 for mounting the light emitting element 5 formed having an opening in the front, in the inner front 13a inside a recess 13. The support 10 has groove parts 12a, 12b formed leaving a region on the bottom surface nearby the width-directional center by cutting parts of both sides of the bottom surface opposed each other in the width direction, the groove parts 12a, 12b being formed from the back of the support 10 to the position of the inner front 13a of the recess 13 in a depth direction and not reaching the front. The light emitting device 30 has a T-shaped flat region on the bottom surface of the support 10 serving as a grounding surface during the mounting, and can be stably mounted. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a surface-mounted light-emitting device on which a semiconductor light-emitting element is mounted, and more particularly to a side-light-emitting (side-view) light-emitting device.

  Semiconductor light-emitting elements such as light-emitting diodes (LEDs) and laser diodes (LDs) are small, power efficient and emit light in vivid colors, and because they are semiconductor elements, there is no fear of running out of spheres, and initial drive characteristics are further improved. It has the characteristics that it is excellent and strong against vibration and repeated on / off lighting. Because of such excellent characteristics, light emitting devices using semiconductor light emitting elements are generally used for lighting equipment, large screen televisions, personal computers (PCs), backlights for liquid crystal displays (LCDs) such as mobile phones, and moving images. It is used as a lighting auxiliary light source and other general consumer light sources. In particular, surface-mounted light-emitting devices are small and thin, and can be mounted on a printed circuit board or the like by a reflow process in the same manner as a general semiconductor element package. Thus, various types of light-emitting devices have been developed and manufactured. Furthermore, the surface mount type light emitting device includes an upper light emitting type (surface emitting, top view) type that emits light in a direction perpendicular to the mounting surface (on the surface of the printed circuit board), and a side surface that emits light in one direction horizontal to the mounting surface. There is a luminous (side view) type. For example, a side-emitting light emitting device may be used for a backlight of a liquid crystal display.

  A surface-mounted light-emitting device includes a semiconductor light-emitting element (hereinafter referred to as a light-emitting element) mounted on a light-emitting element mounting substrate (hereinafter referred to as an appropriate substrate) for the surface-mounted light-emitting device, and the electrode of the light-emitting element is mounted on the substrate by wire bonding or the like. The lead electrode (inner lead) is electrically connected and sealed with a translucent resin so as to cover the light emitting element and the like. As an example, a substrate for a surface-mounted light-emitting device includes a support made of an insulating material on which a light-emitting element is placed and a recess that surrounds the periphery of the light-emitting element, and a pair of lead electrodes ( An inner lead) and a pair of lead electrodes (outer leads) provided on the mounting surface on the outer surface of the support so as to be electrically connected to each of the pair of lead electrodes. The upper light-emitting light emitting device is mounted with the bottom surface (lower surface) as the mounting surface, and the outer leads are mounted by soldering with the wiring pattern on the printed circuit board. The side light-emitting light emitting device is mounted with one side as the mounting surface. To do.

  A substrate for such a surface-mount light-emitting device is formed of an unfired ceramic sheet (green sheet) in a predetermined shape, similarly to a ceramic package (see, for example, Patent Document 1), which is an aspect of a general semiconductor element package. And can be baked and manufactured. Ceramic packages are manufactured in a state where a plurality of ceramic packages are connected in a matrix on a plane (plane) parallel to the mounting surface of the light emitting elements, and are separated into pieces after mounting the light emitting elements, that is, separated and cut into pieces (dicing). Or, a surface mounted light emitting device is obtained. As in the ceramic package described in Patent Document 1, in order to form a recess (cavity) for storing a semiconductor element (light emitting element), at least for forming a bottom surface and a side wall (frame body) of the recess. Two green sheets are laminated. That is, the green sheet for constituting the frame of the recess is formed by punching through holes (cavity holes). Each green sheet is coated with a conductor paste in a desired shape by screen printing or the like, and a conductor layer (metal film) such as a lead electrode (inner lead, outer lead) is provided. After laminating and fixing these green sheets, the surface conductor layer is subjected to nickel plating or the like to obtain a ceramic package (before cutting). Note that a light emitting element may be mounted as a ceramic package having a single layer structure without forming a recess, and sealed in a dome shape with a translucent resin after wire bonding (for example, Patent Document 2).

  In addition, in a ceramic package before cutting, a through hole (through hole) such as a small-diameter circle is often formed at each intersection of cutting lines. Thereby, generation | occurrence | production of the chip | tip, a burr | flash, etc. in cutting is prevented. Such a ceramic package has a shape in which, after being singulated, four corners of a rectangle in plan view are cut out by a quarter arc. The through hole is formed by punching each green sheet before lamination, like the cavity hole. In addition, when a conductor layer is provided on each of two or more surfaces such as the front and back surfaces of the green sheet, or the interface when laminated, the conductor paste is filled inside the through-hole or covered on the inner peripheral surface. Thus, the conductor layers provided on each surface of the green sheet are connected to each other. The through hole for providing such a conductor layer is formed on the cutting line other than the intersection of the cutting lines, that is, on the cutting line that is not the intersection or outside the cutting line.

  Here, when the outer lead is provided on the bottom surface of the package as in the upper light emitting type light emitting device, as in the case of the inner lead, a metal film is coated on the front surface (back surface) of the green sheet in a desired shape by printing. Can be a lead. In order to make the inner lead and the outer lead conductive, as described above, a through hole is formed in the green sheet so that the surfaces on which the respective leads are provided, that is, through the bottom surface of the package to the bottom surface of the recess, are formed in the green sheet. A conductor layer may be provided inside.

  On the other hand, in the case of a side light emitting type light emitting device, it is necessary to provide an outer lead on one side surface. However, since the side surface of the ceramic package is a cut surface, the conductor is manufactured at the time of manufacturing the package, that is, before the light emitting device is separated and cut. A layer cannot be provided. For example, as in Patent Document 2, it is possible to form a side surface (end surface) provided with a conductor layer in a ceramic package connected in only one direction (one row) before cutting. Productivity is inferior because it is manufactured in parallel with a space. Therefore, for example, Patent Document 3 discloses a semiconductor device (light emitting device) in which a through hole is formed at each intersection of cutting lines of a package before cutting connected in a matrix, and a conductor layer is provided on the inner peripheral surface of the through hole. Is disclosed. In such a light-emitting device, the conductor layer provided on the inner peripheral surface of the notch (four-divided through-holes) after the singulation of the package is used as an outer lead, and solder is embedded in the notch. Can be implemented.

  In addition, in order to mount with sufficient adhesiveness in both mechanical connection and electrical connection between the light emitting device and a printed circuit board (hereinafter referred to as a mounting board), it is preferable that the soldering area is wide. In addition, because the ceramic package of the light emitting device and the mounting substrate are different in expansion coefficient, cracks may occur in the solder due to thermal fluctuations. However, if the soldering area is not sufficient, Since the ratio is large, there is a risk of connection failure and the reliability is problematic. Therefore, in the light emitting device described in Patent Document 3, the wiring pattern of the mounting substrate is widely provided from the notch position toward the outside of the light emitting device so that the solder spreads from the notch of the light emitting device to the wiring pattern. To be implemented.

  Here, in order to expand the soldering area on the light emitting device side, that is, the outer lead, a through hole is formed elongated along the cutting line to form a notch that extends long inside, and accordingly, a cut surface on the mounting surface. That is, the area of the flat surface that is not cut is reduced. The cut surface that becomes the side surface of the ceramic package is difficult to be as smooth as the bottom surface composed of the green sheet surface (back surface), and such a surface with poor smoothness is mounted as a grounding surface to the mounting board. In this case, if there is no area, it is difficult to mount with high accuracy in terms of inclination (levelness) with respect to the mounting substrate. When the light emitting device is mounted with an inclination, the light emission direction (optical axis) is inclined, and the characteristics of the light source are not stable. Therefore, in Patent Document 4, as a package outer shape that protrudes long to the outside with respect to the recess for storing the light emitting element, an elongated lead hole is formed along the protruding portion on the cutting line, and a conductor layer is provided to provide an outer lead. A light emitting device is disclosed. With such a configuration, the light emitting device is provided with a wide soldering area while ensuring a grounding area to the mounting substrate.

Japanese Patent Publication No.55-22021 JP 2000-196000 A JP 2005-159111 A JP 2008-147605 A

  However, since the light-emitting device described in Patent Document 4 has a package outer shape that is long on both outer sides with respect to the recess for storing the light-emitting element, the light-emitting device is enlarged. In addition, as described above, the light emitting device described in Patent Document 3 does not have a sufficient soldering area on the light emitting device side, and emits light from a soldering region on the mounting substrate in order to improve adhesion to the mounting substrate. Since it is necessary to extend the outside of the device, a mounting area on the mounting substrate must be provided widely for the light emitting device. Therefore, when mounting a plurality of light emitting devices described in Patent Document 3 or other semiconductor devices together, it is necessary to leave a sufficient interval.

  The present invention has been made in view of the above problems, and does not increase the size of the device itself, and can be mounted as a side-emitting light emitting device with good adhesion even when mounted in a narrow area on a mounting substrate. An object of the present invention is to provide a light-emitting device that can be mounted with high accuracy without any inclination.

  That is, the light-emitting device according to the present invention includes a support made of an insulating material having a recess opened in the front, a pair of lead electrodes made of a metal film formed in the inner front of the recess, and the recess. A semiconductor light-emitting element mounted thereon and a sealing member that seals the recess, and the pair of electrodes of the semiconductor light-emitting element are electrically connected to the pair of lead electrodes, respectively, It is for mounting as a mounting surface. The support body has two groove portions formed so as to leave a region near the center in the width direction on the bottom surface by cutting out a part of each of the opposite sides in the width direction on the bottom surface. It is formed so as not to reach the front surface of the support in the direction. The light emitting device further includes a metal film electrically connected to each of the pair of lead electrodes on at least a part of the inner surface of each of the two groove portions of the support. Further, the support preferably has two cutout portions formed along both sides of the bottom surface facing each other in the width direction so that the front view has a shape in which a rectangular corner is cut out. These notches are formed in a region where the groove is not formed in the depth direction.

  As described above, the light emitting device is formed with a groove portion extending from the end in the width direction to the vicinity of the center on the bottom surface of the support as the mounting surface, and a pair of lead electrodes ( By extending the metal film, the metal film in the groove is mounted as an outer lead. Since the inner surface of such a groove is sufficiently large in area, it can be mounted with good adhesion by soldering, and the soldering area on the mounting board can be prevented from spreading from directly under the light emitting device to the outside. . On the other hand, since the groove is formed so as not to reach the front surface of the support, the front side region of the bottom surface of the support can be secured as a ground surface to the mounting substrate over the entire width, and the light exit surface It is possible to prevent the solder from wrapping around the front.

  Further, the light emitting device according to the present invention may include one or two heat radiating portions made of a metal film on the back surface of the support, and one of the pair of lead electrodes may be electrically connected to one of the heat radiating portions. Good. With such a configuration, heat generated from the semiconductor light emitting element is conducted from the lead electrode to the heat radiating portion on the back surface, so that heat dissipation is improved. Further, the light emitting device may include two heat radiating portions (metal films) on the back surface of the support body, each of which is electrically connected to each of the pair of lead electrodes, and the back surface of the support body may be mounted as a mounting surface. It is good also as a structure which can be performed.

  In such a light emitting device, the support is laminated in the depth direction with at least two layers of a first support on the back side and a second support on the front side, with the inner front side of the recess as a boundary surface. Can be configured. That is, the front surface of the first support body constitutes the inner front surface of the recess, and the second support body has a through hole, and the inner peripheral surface of the through hole is the inner peripheral surface of the recess. Configure. At this time, the groove is formed on at least the first support. Alternatively, the support may be configured by laminating a third support having a through-hole formed on the front side of the second support in the same manner as the second support. 2 The groove may be formed on the support. By adopting such a configuration, the light emitting device can be manufactured with high productivity as in the case of the current ceramic package.

  According to the light emitting device of the present invention, as a side light emitting type light emitting device, it can be mounted in a narrow area with high accuracy and adhesion, and can be manufactured in the same manner as a light emitting device using a current ceramic package, and the productivity is high. Good.

BRIEF DESCRIPTION OF THE DRAWINGS It is an external view of the light-emitting device which concerns on 1st Embodiment of this invention, (a) is an elevation view from the front and the downward direction, (b) is a perspective view from the back explaining the mounted state. It is a fragmentary sectional perspective view of the light emitting element mounting substrate concerning a 1st embodiment of the present invention. It is a disassembled perspective view explaining the manufacturing method of the light emitting element mounting substrate which concerns on 1st Embodiment of this invention. It is a perspective view from the back of the light emitting element mounting substrate which concerns on the modification of 1st Embodiment of this invention. It is an external view of the light-emitting device and the board | substrate for light emitting element mounting which concern on the modification of 1st Embodiment of this invention, (a) is a perspective view from the front, (b) is a partial cross-sectional perspective view from below (upward view) Figure). It is a fragmentary sectional perspective view of the light emitting element mounting substrate concerning a 2nd embodiment of the present invention. It is a fragmentary sectional perspective view of the light emitting element mounting substrate concerning a 3rd embodiment of the present invention. It is an external view of the light emitting element mounting substrate which concerns on 4th Embodiment of this invention, and its modification, (a) is a fragmentary sectional perspective view of 4th Embodiment, (b) is a perspective view from the back of a modification. It is. It is an external view of the light-emitting device and light-emitting element mounting substrate according to the fifth embodiment of the present invention, (a) is a top view from the front and below, and (b) is a partial cross-sectional perspective view from below (top-down). Figure).

Hereinafter, a light emitting device according to the present invention will be described with reference to the drawings.
[Light emitting device]
As shown in FIG. 1A, the light emitting device 30 according to the first embodiment of the present invention has a light emitting element (semiconductor light emitting element) 5 mounted in a recess (cavity) 13 opened on the front surface thereof. Light is emitted in the (z direction). Specifically, in the light emitting device 30, the light emitting element 5 is placed in the vicinity of the center of a surface (rear front) 13 a facing the front inside the recess 13 formed in the support 10, and electrodes of the light emitting element 5 are formed by wire bonding. Are electrically connected to lead electrodes (inner leads) 31a and 31b provided on the back front surface 13a of the recess 13, and the inside of the recess 13 is sealed with a sealing member (not shown) such as a translucent resin. It becomes.

  The light-emitting device 30 according to the present invention uses a known semiconductor light-emitting element such as a light-emitting diode (LED) or a laser diode (LD) made of a nitride semiconductor as a light-emitting element, depending on the form provided to the user as a product. 5 may be mounted. The number of light emitting elements 5 is not limited to one, and two or more light emitting elements 5 may be mounted and connected to the lead electrodes 31a and 31b in parallel or in series (see FIG. 5A). In addition, the mounting method of the semiconductor light emitting element in the light emitting device is not limited to wire bonding, and may be in accordance with the specifications of the semiconductor light emitting element. For example, flip chip mounting may be applied. The shape of the lead electrode (inner lead) may be designed. Moreover, a well-known thing can be applied also for the sealing method and the sealing member, for example, you may add a fluorescent substance to a sealing member. In the present specification, the state before the light emitting element is mounted in the light emitting device, that is, the light emitting device 30 shown in FIG. 1A excluding the light emitting element 5, the wire, and the sealing member is used. 20 Hereinafter, an embodiment of a light emitting device according to the present invention will be described as appropriate in an embodiment of a light emitting element mounting substrate.

[First Embodiment]
A detailed structure of the light emitting element mounting substrate 20 according to the first embodiment used in the light emitting device 30 shown in FIG. 1 will be described. The light emitting element mounting substrate 20 according to the first embodiment includes a support 10 made of an insulating material and metal films 31a, 31b, 32a, and 32b that are conductor layers provided in a predetermined region such as the surface thereof (see FIG. 2). The light emitting element mounting substrate according to each embodiment of the present invention has a left-right (x direction) symmetrical structure except for the shape of the metal films (lead electrodes) 31a and 31b in front view.

  As shown in FIG. 1 and FIG. 2, the support 10 of the light emitting element mounting substrate 20 is a rectangular parallelepiped whose outline is long in the width direction (x direction) when viewed from the front, and the recess 13 is open to the front. Is formed. Grooves 12a and 12b are formed in the lower surface (bottom surface) of the support body 10 so as to cut out both ends (both sides) in the width direction (x direction) to the vicinity of the center. The grooves 12a and 12b are formed apart from each other in the width direction so that a flat surface region remains in the vicinity of the center in the width direction on the lower surface of the support 10. Furthermore, the support body 10 has a cutout portion 11a, 11b, 11c, 11c from the front along the depth direction (z direction) so as to have a shape in which four corners of a rectangle are cut out by a quarter arc in front view. Is formed. On the other hand, although the groove parts 12a and 12b are formed along the depth direction from the back surface of the support body 10 to the front surface, they are formed so as not to reach the front surface. Therefore, the notch portions 11a and 11b on the lower surface side are formed so as to avoid the region where the groove portions 12a and 12b are formed in the depth direction, but apparently the same as the notch portions 11c and 11c on the upper surface side. And a part thereof is cut out toward the center in the width direction by the grooves 12a and 12b. With such a configuration, the flat surface area where the notches 11a and 11b and the grooves 12a and 12b are not formed on the lower surface of the support 10 (light emitting element mounting substrate 20) is T-shaped, and its width direction The (x direction) length is the width direction length of the support 10 excluding the notches 11a and 11b, and the depth direction (z direction) length is the total length of the support 10 in the depth direction.

  The light emitting device 30 including the light emitting element mounting substrate 20 having such a shape is mounted on a mounting substrate such as a printed circuit board as shown in FIG. That is, the groove portions 12a and 12b are made to face a pair of wiring patterns (wiring) provided in advance on the mounting substrate, and the groove portions 12a and 12b provide a space between the bottom surface of the light emitting device 30 and the mounting substrate (wiring pattern). It is mounted by filling the gaps that occur with solder. Such an implementation is for example by a reflow process. The light emitting device 30 is a mounting substrate with a T-shaped flat surface on the lower surface of the light emitting element mounting substrate 20, that is, a grounding surface having a sufficient length in both the width direction and the depth direction (x, z direction). Supported on the surface.

(Support)
The support 10 is made of an insulating material such as ceramic in the same manner as a known ceramic package of a semiconductor element. Specifically, as will be described later, an unfired ceramic sheet (green sheet) is processed to form a plurality of depths. Stacked in the direction (z direction) and fired. The green sheet is made of a known material and method, and is obtained by mixing a powder of a ceramic material such as alumina, aluminum nitride, mullite or the like with a binder and extending the sheet with a roller and drying it. Further, since the support 10 constitutes a reflection surface for light emitted (radiated) by the light emitting element 5 as will be described later, it is preferable that the support 10 be formed of white ceramic so as to increase the light reflectivity. As described above, the shape of the support 10 is such that the outer shape of a rectangular parallelepiped as viewed from the front (shown upward in FIG. 2), the recess 13 opened to the front, and the notches 11a having four corners cut out roundly, 11b, 11c, 11c and groove portions 12a, 12b are formed by cutting a part of the notches 11a, 11b along the lower surface of the support 10.

  The concave portion 13 is an oval shape that is long in the width direction in the same manner as the support 10 in a front view, and opens to open to the front. A surface (a so-called concave bottom surface, hereinafter referred to as a back front surface) 13a facing the front surface inside the concave portion 13 is a mounting surface of the light emitting element 5, and the metal films 31a and 31b serve as lead electrodes in a predetermined shape (for example, FIG. 1A). See). Since the recessed portion 13 is a storage portion of the light emitting element 5 and an electrode connecting portion, the recessed portion 13 has a required volume including the bonding region. Moreover, the shape of the recessed part 13 is not restricted to this embodiment, It forms in a required shape according to the form etc. which are provided to a user as a form of the light emitting element 5, and the light emitting device 30. For example, the shape of the recess 13 may be a rounded quadrangle (see FIG. 5A), a square, a circle, an ellipse, or the like when viewed from the front. Alternatively, it may be perpendicular to the back front surface 13a, that is, parallel to the z direction, or may be formed with a step so that the opening side becomes wider (see FIG. 8A). However, since the inner surface (the back front surface 13a and the peripheral surface) of the recess 13 is a reflecting surface for light emitted (emitted) by the light-emitting element 5, the shape that efficiently reflects the emitted light to the outside, that is, the front surface. It is preferable that As will be described later, the recess 13 having such a shape is formed by separating the support 10 into at least two layers each including the back front surface 13a and the peripheral surface in the depth direction.

  The groove portions 12a and 12b are grooves that are elongated in the width direction in a front view (rear view), and as shown in FIG. 2, are recessed portions 13 along the depth direction (z direction, vertical direction in FIG. 2) from the back surface of the support 10. It is formed up to the position of the back front surface 13a. The notches 11a, 11b, 11c, and 11c are formed by dividing a through hole (through hole) that is circular when viewed from the front when the light emitting element mounting substrate 20 is manufactured into four parts. One arc. In the light emitting device according to the present invention, the notches 11a, 11b, 11c, and 11c are not necessarily formed. In particular, the notches 11a and 11b that are continuous with the grooves 12a and 12b are described later. In view of the manufacturing process of the light emitting element mounting substrate 20, it is preferably formed as a through hole. Further, the diameter (through-hole radius) of the notches 11a, 11b, 11c, and 11c when viewed from the front is not particularly defined, and the shape is not limited to a quarter arc, and the manufacturing process of the light emitting element mounting substrate 20 is not limited. It is designed according to the specifications and the form provided to the user as a product of the light emitting device 30. On the other hand, the width (length in the x direction) of the grooves 12a and 12b is longer than the notches 11a and 11b within the range in which the flat surface area of the lower surface of the support 10 remains between the grooves 12a and 12b as described above. It is formed. Further, the width (length in the x direction) and the depth (length in the y direction) of the grooves 12a and 12b constitute a gap in which solder is embedded during mounting, and are designed according to mounting conditions and the like. In this embodiment, since the depth from the lower surface of the groove parts 12a and 12b is smaller than the diameter of the notch parts 11a and 11b, a part of the notch parts 11a and 11b is the end part of the groove parts 12a and 12b (corner of the support 10). However, the present invention is not limited to this.

(Metal film)
The metal films 31a and 31b covering the back front surface 13a of the recess 13 are a pair of lead electrodes (inner leads) for connecting to the light emitting element 5, and are provided apart from each other on the surface. The shape (pattern) is formed into a required shape according to the form of the light emitting element 5, the form provided to the user as a product of the light emitting device 30, and the like. These metal films 31a and 31b are formed so as to extend on the surfaces and pass through the support 10 (the peripheral surface of the recess 13) so that the end surfaces are exposed on the outer surface on the bottom surface side. Since the position of the back front surface 13a of the recess 13 in the depth direction (z direction) of the support 10 is the start position of the groove portions 12a and 12b, the end surfaces of the metal films 31a and 31b are exposed on the inner surfaces of the groove portions 12a and 12b. To do. Further, since the inner surfaces of the groove portions 12a and 12b are covered with the metal films 32a and 32b, the metal films 31a and 32a are electrically connected (continuous) between the metal films 31b and 32b. The metal films 31a and 31b are extended on the inner surfaces of the grooves 12a and 12b. Accordingly, the positions of the groove portions 12a and 12b are soldered to conduct from the outside (mounting substrate) of the light emitting element mounting substrate 20 to the metal films (lead electrodes) 31a and 31b in the recess 13. In the present embodiment, the entire inner surfaces of the groove portions 12a and 12b are covered with the metal films 32a and 32b. However, at least a part of the end surfaces of the metal films 31a and 31b is exposed. What is necessary is just to coat | cover. However, it is preferable to cover the metal films 32a and 32b in a sufficient area, and the metal films 32a and 32b improve the adhesiveness of the solder inside the groove portions 12a and 12b. Further, as in a modification example described later (see FIGS. 4 and 5), when the grooves 12a and 12b are formed on the upper surface of the support 10 and the inner surfaces thereof are covered with the metal films 32a and 32b, heat dissipation Can be improved.

  These metal films 31a, 31b, 32a and 32b are composed of two layers of metal films (not shown). The details of the two-layer metal film will be described later, but when manufacturing the light-emitting element mounting substrate 20, the inner periphery of the through-hole formed as a surface and through-holes in the green sheet state before lamination and firing A printed layer made of a conductive paste whose surface is coated by screen printing or the like, and a plated layer formed by electroplating or the like on the printed layer after firing. In such a two-layer metal film configuration, the print layer is formed continuously from the back front surface 13a of the recess 13 to at least a part of the inner surfaces of the groove portions 12a and 12b. And since formation of a plating layer is limited to the area | region exposed to the surface of the support body 10 after lamination | stacking of a green sheet, the area | region which penetrates the support body 10 of metal film 31a, 31b is comprised only by a printing layer. . Further, as in this embodiment, when the metal films 32a and 32b are formed so as to cover the entire inner surfaces of the groove portions 12a and 12b, the print layer is formed on the entire inner surface of the groove portions 12a and 12b, and is plated. The layer may be formed so as to wrap around from the inner surface (on the print layer) of the grooves 12a and 12b to the periphery of the grooves 12a and 12b on the back surface of the support 10 (see FIG. 1B). For both the printed layer and the plated layer, a metal material applied to a general ceramic package of a semiconductor element can be applied. The printed layer includes high melting point metals that do not melt during ceramic firing, specifically tungsten, chromium, titanium, cobalt, molybdenum, and alloys thereof, and conductors in which particles of such metal materials are mixed into a resin paste. Used as a paste. As for the plating layer, particularly in a semiconductor light emitting device, a metal material having a high light reflectance is used to efficiently extract emitted light to the outside, and the inner surface of the recess 13 in which the light emitting device 5 is stored, that is, a metal film ( A light reflecting function is imparted to the lead electrodes 31a and 31b. Specific examples of such a metal material include gold, silver, platinum, copper, aluminum, nickel, palladium, and alloys thereof, and a plated multilayer film of two or more kinds of metal materials may be used. Moreover, it may replace with a plating layer and the metal film by vapor deposition or the metal film which combined plating and vapor deposition may be sufficient. If it is a vapor deposition film, it can coat | cover not only on a printed layer but the support body 10 surface directly.

(Production method)
The light-emitting element mounting substrate 20 according to the first embodiment and the light-emitting device 30 on which the light-emitting element 5 is mounted can be manufactured by the same method as the known ceramic package of semiconductor elements as described above. As shown in FIG. 3, the support 10 includes a first support 1 (bottom layer) constituting the back side (lower side of the laminated structure in FIG. 3) and a second support 2 (top) constituting the front side. Layer), at least two layers are laminated. The first support body 1 and the second support body 2 are each formed by processing an unfired ceramic sheet (green sheet), and on the mounting surface of the light emitting element 5 (the back front surface 13a, xy surface of the recess 13). The light emitting device mounting substrate 20 and the light emitting device 30 are further manufactured by being processed in a matrix connected along the light emitting element mounting substrate 20. In FIG. 3, a state in which a total of six, two in the x direction and three in the y direction, are shown is shown. As shown in FIG. 3, each of the first support 1 and the second support 2 is formed by punching (punching) a predetermined position and shape of a through hole. A conductor paste is coated on the inner peripheral surface by screen printing or the like. Specifically, circular through holes 11 and 21 are formed at the intersections of the respective cutting lines of the first support 1 and the second support 2 and are elongated along the x-direction cutting line of the first support 1. An oblong slit hole 12 is formed in the center of the second support 2 (the center of the support 10 after being singulated), and a cavity hole (through hole) 23 that forms the peripheral surface of the recess 13 is formed. In the first support 1, a part (half) of the through hole 11 is included in the slit hole 12. And the pattern of the metal films 31a and 31b used as a lead electrode (inner lead) is formed in the surface (front surface) of the 1st support body 1 by screen printing etc. with a conductor paste. At this time, the metal films 31 a and 31 b have a shape that reaches the slit hole 12. In addition, a conductor paste is coated on the inner peripheral surface of the slit hole 12 by printing or the like to form the metal film 32 to be the lead electrodes (outer leads) 32a and 32b. Note that the punching process and the printing of the conductor paste are not limited in the process order, and may be alternately performed a plurality of times depending on the form.

  The first support body 1 and the second support body 2 are stacked and fixed so as to overlap each other through the through holes 11 and 21, and the stacked first and second support bodies 1 and 2 are fired at a predetermined temperature. Thus, the support 10 in a connected state is obtained as a ceramic. Finally, a plated layer of nickel, silver or the like is formed on the surfaces of the metal films 31a and 31b (area exposed on the surface) and the metal film 32 formed of a conductive paste by electroplating or the like, and the light emitting element mounting substrate 20 As described above, the light emitting device 30 is separated into individual light emitting devices 30 after the light emitting element 5 is mounted. When cut / separated (diced or broken) along the cutting line, the through holes 11 and 21 become notches 11a, 11b, 11c, and 11c, the slit holes 12 become grooves 12a and 12b, and the metal film 32 is made of metal. The films 32a and 32b are formed. The light emitting element mounting substrates 20 and 20 connected in the y direction are manufactured by being connected symmetrically in the y direction as shown in FIG. 3 because the slit holes 12 therebetween become the groove portions 12a and 12b. In this way, the support 10 is composed of two or more layers, and each layer is processed and then laminated, so that the cutout portion 11a (11b) and the groove portion 12a (12b) are overlapped at the same position in front view. Thus, a notched structure having a different shape (with a step) in the stacking direction, that is, the depth direction (z direction) can be obtained.

  Note that, as described above, the front-view shape of the notches 11a, 11b, 11c, and 11c is not limited to a quarter arc, so the shape of the through holes 11 and 21 is not limited to a circle, for example, an oval or an oval , It may be a rounded rectangle. Similarly, the shape of the slit hole 12 is not limited to an oval shape, and is determined according to the shape when the groove portions 12a and 12b are divided into four. Further, in the light emitting device according to the present invention, the notches 11a, 11b, 11c, and 11c are not necessarily formed, but the through holes 21 (notches 11a and 11b) that are continuous with the slit hole 12 are formed. Is preferred. Thereby, a through-hole is formed in the coupled support 10 and a plating bath is circulated at the time of plating, whereby a plating layer is formed on the entire surface of the metal film 32 on the inner peripheral surface of the slit hole 12. On the other hand, the through-hole 11 to be the notches 11c and 11c and the through-hole 21 continuous therewith are not formed unless manufacturing problems such as chipping at the time of cutting occur, and the fifth embodiment described later (FIG. 9), a structure without a notch on the upper surface side of the support may be used.

(Modification of the first embodiment)
As in the modification of the first embodiment shown in FIG. 4, the metal film may be provided on the back surface of the light emitting element mounting substrate 20A (support 10A) (33a, 33b). As described above, by providing the metal films 33a and 33b on the back surface, the heat of the light emitting element 5 is transferred from the metal film (inner lead) 31a (31b) in the recess 13 to the metal film 32a (32b) in the groove 12a (12b). Is conducted to the metal film (heat radiating part) 33a (33b) on the back surface which is opened to the outside through the heat radiation, and the heat radiation performance is improved. Further, in mounting, the solder crawls up from the inside of the groove portions 12a and 12b along the metal films 33a and 33b on the back surface, so that mounting property, particularly mechanical adhesion is improved. Alternatively, an upper light-emitting light-emitting device having the back surface as a mounting surface can be formed by using the back metal films 33a and 33b as lead electrodes (outer leads). Note that there may be only one metal film serving as a heat dissipation portion on the back surface of the light emitting element mounting substrate. In this case, this metal film is a metal film (inner lead) 31a on which the light emitting element 5 is placed (FIG. 1 ( a) (see FIG. 5B).

  Further, the light emitting element mounting substrate 20A according to the modification of the first embodiment includes the groove portions 12a and 12b and the metal films 32a and 32b on the inner surface on the upper surface, and has a vertically and symmetrically (y direction) structure. With such a configuration, the upper and lower surfaces can be used as mounting surfaces, and the positive and negative electrodes of the wiring on the mounting substrate can be switched. Furthermore, since the metal films 32a and 32b on the side of the upper and lower surfaces that are not the mounting surface function as a heat radiating portion, the heat dissipation is improved. Such a vertically symmetrical structure can also be applied to the light emitting element mounting substrate 20 (see FIGS. 1 and 2) that does not include the metal films 33a and 33b on the back surface.

  In the manufacture of the light emitting element mounting substrate 20A according to this modification, the slit holes 12 are formed at the intersections of all the cutting lines of the first support 1 shown in FIG. The first support 1 is covered with metal films 33a and 33b on the back surface (back surface). Alternatively, the first support 1 may be composed of two more green sheets. In this case, the metal film 31a, 31b is provided on the front surface and the metal film 31a, 31b is provided on the front surface (back surface). 33a and 33b are formed, and the two slit holes 12 are formed, and the inner peripheral surface thereof is covered with the metal film 32. As described above, each of the first support 1 and the second support 2 may be composed of two or more green sheets. At this time, the support having a structure having a different shape for each green sheet. (Light emitting element mounting substrate). Further, when the first support 1 is composed of two or more green sheets, the inner surfaces of the grooves 12a and 12b are different from each other as in another modified example (see FIG. 5) of the first embodiment described below. It is also possible not to cover the metal film 32a, 32b in the region of the part.

  In the light emitting element mounting substrate, by laminating a large number of green sheets, not only the outer shape such as the notch portion but also the shape of the concave portion for mounting the light emitting element can be various. Further, the depth of the concave portion (length in the depth direction), the position of the groove portion in the depth direction (z direction), and the like can be changed depending on the thickness of the green sheet applied to each laminated portion. A light emitting element mounting substrate 20B of a light emitting device 30B according to another modification of the first embodiment shown in FIG. 5 includes at least two second supports 2 of the support 10B, and the peripheral surface of the recess 13B. Is an inclination that spreads from the bottom surface 13a toward the opening and a two-step inclination angle that is vertical (see FIG. 5B). Alternatively, a metal film may be provided on the peripheral surface of the recess 13B (not shown) on one front surface (other than the rearmost one) of the second support 2 that does not contact the lead electrodes 31a and 31b. . Since the metal film on the inner surface of the recess becomes a reflective film, the light extraction efficiency of the light emitting element 5 is improved.

  As shown in FIG. 5A, the light emitting device 30B includes a protective element 6 in addition to the two light emitting elements 5B and 5B, and these three elements are connected in parallel to the lead electrodes 31a and 31b. . The protective element 6 is a Zener diode, a capacitor, or the like, and is intended to prevent the light emitting elements 5B and 5B from being destroyed by an overvoltage. In this modification, the protective element 6 has one electrode provided on the back surface thereof directly connected to the lead electrode 31b and the other electrode provided on the front surface connected to the lead electrode 31a by wire bonding. Further, the protection element 6 is placed in a small concave portion (small cavity) 14 having a circular shape when viewed from the front, which is formed in a region where the lead electrode 31b is formed on the back front surface 13a of the concave portion 13B. As described above, when the components other than the light emitting element such as the protective element 6 are mounted together, the small concave portion 14 is provided in the further back of the front surface 13a of the concave portion 13B, and the protective element 6 is placed there. The light emitted from the light emitting elements 5B and 5B is not blocked by the protective element 6 and its wires, and the light emitting device 30B can extract light with high efficiency. The small concave portion 14 is composed of at least two first support bodies 1 of the support body 10B, and a circular through hole constituting the side wall (circumferential surface) of the small concave portion 14 is formed on one frontmost surface. In addition, a metal film is also formed on the inner peripheral surface thereof to form part of the lead electrode 31b.

  Further, as shown in FIG. 5B, the light emitting element mounting substrate 20B is provided with only one metal film 33a as a heat radiating portion on the back surface thereof. As described above, the metal film 33a is formed so as to be electrically connected to the lead electrode (metal film) 31a on which the light emitting elements 5B and 5B are placed. In this modification, a through hole is formed in a part of the region of the support 10B where the metal film 31a is provided, specifically, near the center of the front surface 13a of the recess 13B, and the metal is filled with a conductive paste or the like. Thus, the metal films 31a-33a are electrically connected. Thus, the conduction between the back surface of the support and the inner surface of the recess is not limited to that via the outer surface of the support, such as the inner surfaces of the grooves 12a and 12b. And also in the case where two metal films 33a and 33b are provided on the back surface as in the light emitting element mounting substrate 20A (see FIG. 4) according to the modification, the metal films 31a and 31b on the back front surface 13a of the recess are A through hole may be formed in each of the formed regions, and the metal may be filled in the through hole.

  As with the light emitting element mounting substrate 20A according to the modified example, the light emitting element mounting substrate 20B according to the present modified example has notches 11a and 11b at four corners when viewed from the front, and groove portions on the upper and lower surfaces. 12a and 12b are formed. However, in this modification, the diameters of the notches 11a and 11b and the depths (length in the y direction) of the grooves 12a and 12b are substantially matched so that the notches 11a and 11b are not blocked in the depth direction (z direction). Configured. Further, as shown in FIG. 5B, the metal film 32a (32b) is provided on the inner surface of the groove 12a (12b). However, the metal film 32a (32b) is not covered with the entire surface as in the first embodiment. And the area near the back is not covered. In such a light emitting element mounting substrate 20B, as described above, the first support 1 is composed of two or more green sheets, and a metal on the inner peripheral surface of the slit hole 12 is formed on the backmost one. It is manufactured by not covering the film 32. With such a configuration, in the light emitting device 30B, in the mounting, the solder embedded in the groove portions 12a and 12b does not easily flow out to the back side, and is dragged by the molten solder and tilted to the back side. Can be prevented. In this modification, the first support 1 is composed of at least three green sheets, and in the stacking direction (z direction), as shown in FIG. 5B, the metal film in the groove 12a (12b). The position of the end of 32a (32b) and the position of the surface (bottom surface) facing the front of the inner side of the small recess 14 are different. Specifically, the first green sheet from the back side (the lower side of the laminated structure in FIG. 3) only forms the slit holes 12. The second green sheet forms the slit hole 12 and covers a metal film (a part of the metal film 32 and a part of the metal film 31 b) on the inner peripheral surface and a region which becomes the bottom surface of the small concave portion 14 on the surface. The third green sheet forms through holes that constitute the peripheral surfaces of the slit holes 12 and the small concave portions 14, and covers the inner peripheral surfaces and the metal films 31a and 31b on the surface with the metal films. . Further, when the metal film 33a is provided on the back surface as a heat radiating portion, the first green sheet from the back side covers the metal film 33a on the back (back) metal film 33a, and all three green sheets are A through-hole for filling a metal that conducts between the metal films 31a-33a is formed at the same position as viewed.

[Second Embodiment]
The light emitting element mounting substrate 20C according to the second embodiment shown in FIG. 6 is also obtained by dividing the first support 1 into at least two layers (two green sheets) for the support 10C. In the present embodiment, not only the light-emitting element mounting substrate 20B (see FIG. 5) according to the modification of the first embodiment is provided on the backmost side, but the metal films 32a and 32b are not provided. The grooves 12a and 12b are not formed. That is, the notches 11a and 11b (11a ₂ and 11b ₂ ) are formed in the layer constituting the back surface of the support 10C. Therefore, at the time of manufacture, a slit hole 12 is formed at each intersection of the cutting lines in the green sheet on the front side of the first support 1 in the same manner as the first support 1 shown in FIG. 31a, 31b, and 32 are provided. In the green sheet on the back side, only through holes 11 are formed at each intersection of cutting lines. Notches 11a and 11b (11a ₁ , 11a ₂ , 11b ₁ , 11b ₂ ) and grooves 12a and 12b are formed on the lower surface, that is, the mounting surface of the light emitting element mounting substrate 20C (support 10C) having such a structure. Areas with no flat surface are H-shaped. Therefore, a grounding surface having a sufficient length in the width direction (x direction) can be obtained not only on the front side but also on the back side, so that it is more stably supported on the mounting substrate surface.

Note that the front-side cutout portion 11a ₁ (11b ₁ ) and the back-side cutout portion 11a ₂ (11b ₂ ) do not necessarily have the same shape in front view. That is, the shape (diameter) of the through holes 11 and 21 at the time of manufacture may not be the same, and may not be formed on one side. Further, when providing the metal films 33a and 33b (see FIG. 4) as the heat radiating portions on the back side, the metal films 32a and 32b are also provided inside the notches 11a ₂ and 11b ₂ , and the metal in the grooves 12a and 12b is provided. Conductive with the films 32a and 32b. Or as shown in FIG.5 (b), the hole which penetrates the 2nd 1st support body 1 is formed, a metal is filled with a conductor paste etc. inside, and the metal film 31a (31b) and the metal film 33a ( 33b) may be directly conducted.

[Third Embodiment]
In the first embodiment, the modification thereof, and the second embodiment, the groove portions 12a and 12b are formed on the first support body 1, but the groove portions 12a and 12b are formed on the second support body 2. Also good. The light emitting element mounting substrate 20D according to the third embodiment shown in FIG. 7 is manufactured by dividing the second support 2 constituting the peripheral surface (frame) of the recess 13D into two layers for the support 10D. can get. Of these two layers, grooves 12a and 12b are formed in the back layer (lower side in FIG. 7), and notches 11a ₁ and 11b ₁ are formed in the front layer (third support). On the other hand, the grooves 12a and 12b are not formed in the first support 1, but only the notches 11a ₂ and 11b ₂ are formed. Similarly to the first embodiment, the metal films (lead electrodes) 31a and 31b are connected to the metal films 32a and 32b covering the inner surfaces of the grooves 12a and 12b. It is extended to. With this configuration, the flat surface area where the notches 11a and 11b and the grooves 12a and 12b are not formed on the lower surface of the support 10D is H-shaped as in the second embodiment (see FIG. 6). Thus, the same effects as those of the second embodiment can be obtained in the mounting. In the case of such a structure, both the cavity hole 23 (see FIG. 3) constituting the recess 13D and the slit holes constituting the grooves 12a and 12b are formed in the back side layer of the second support 2. Therefore, it is designed so that the strength can be maintained by securing the length in the y direction. The same applies to the fourth and fifth embodiments described later.

[Fourth Embodiment]
The light emitting element mounting substrate 20E according to the fourth embodiment shown in FIG. 8A is manufactured by dividing the second support 2 constituting the peripheral surface (frame) of the recess 13E into two layers for the support 10E. It is obtained by doing. By forming the groove 12a (12a ₂ ) on the back side (the lower side in FIG. 8A) of the two layers, the groove 12a is combined with the groove 12a (12a ₁ ) of the first support 1. By widening in the depth direction (z direction), the area of soldering can be expanded to further improve the adhesion in mounting. Although not shown in FIG. 8A, the groove portion 12b has a structure in which the groove portions 12b ₁ and 12b ₂ (see FIG. 8B) are combined in the same manner as the groove portion 12a. Moreover, the light emitting element mounting substrate 20E according to the present embodiment can form a step on the peripheral surface of the recess 13E by dividing the second support 2 into two layers. Alternatively, as in the light emitting element mounting substrate 20B according to the modification of the first embodiment (see FIG. 5B), the inclination angle of the peripheral surface of the recess 13E is changed, or the front side region on the peripheral surface is made of metal. A membrane can also be coated.

As for the groove 12a (12b), the shape of the front view does not necessarily have to coincide between the back side 12a ₁ (12b ₁ ) and the front side 12a ₂ (12b ₂ ). Furthermore, the groove portions 12a and 12b may not be grooves having a uniform depth along the lower surface. The light emitting element mounting substrate 20F according to the modification of the fourth embodiment shown in FIG. 8B is divided into two layers for the support 10F in the same manner as in the fourth embodiment. Grooves 12a ₂ and 12b ₂ are formed on the back side of the plate. The groove 12a, the front side in 12b, the second support 2 groove 12a ₂ formed of 12b ₂ shape is along the lower surface (upper surface) as in the fourth embodiment. On the other hand, the grooves 12a ₁ and 12b ₁ formed in the first support 1 on the back side rise upward (y direction) at the ends (left and right) in the width direction (x direction), and extend over the side surface of the support 10F. This is an L-shaped shape when viewed from the back, forming the groove portion. Further, the support 10F also includes the first support 1 in two layers, and on the inner surface of the grooves 12a and 12b (12a ₁ and 12b ₁ ) as in the modification of the first embodiment (see FIG. 5). Regions not covering the metal films 32a and 32b were provided. Due to the groove portions 12a and 12b having such a shape, the solder forms fillets along the groove portions 12a ₁ and 12b ₁ on both side surfaces of the light emitting element mounting substrate 20F in mounting, thereby improving mountability, particularly mechanical adhesion. Moreover, since the surface area of the solder is increased by this fillet, heat dissipation is improved. On the other hand, since the metal films 32a and 32b are not covered in the regions near the back surface of the inner surfaces of the grooves 12a and 12b, the solder hardly flows out to the back surface side of the light emitting element mounting substrate 20F and is inclined to the back surface side. Can be prevented. That is, in this modification, it is possible to expand the soldering area as in the fourth embodiment while suppressing the spread of the solder to the back side. In addition, the groove parts 12a ₁ and 12b ₁ having such a shape are formed by crossing the slit holes 12 (see FIG. 3) on the intersections of the cutting lines of the first support 1 along the cutting lines in the x and y directions. It is obtained by forming into a mold.

In this modification, the groove portions 12a and 12b face the inner surface with the depth (y-direction length) matched between the front side 12a ₂ and 12b ₂ except for the rising portions of the rear side 12a ₁ and 12b _1. However, there may be a step between the first support 1 and the second support 2, that is, a step between the grooves 12a ₁ and 12a ₂ (between 12b ₁ and 12b ₂ ). Furthermore, the metal film 32a (32b) provided on each inner surface may be divided by this step. This is because the metal film 32a (32b) divided by the solder conducts during mounting.

  Thus, in the fourth embodiment, the groove portions 12a and 12b, which are soldering regions in mounting, are expanded to the front side, and the modified example is a combination of the modified example of the first embodiment and the rear surface. The soldering area is expanded while suppressing the spread of solder to the side. Further, the second embodiment (see FIG. 6) may be combined with the fourth embodiment to prevent the grooves 12a and 12b from reaching the back surface (not shown). With such a configuration, it is possible to expand the soldering area while ensuring a long grounding surface in the width direction on the back side of the mounting surface.

[Fifth Embodiment]
As shown in FIG. 9A, the light emitting device 30G according to the fifth embodiment has a vertically asymmetric structure in which the concave portion 13G is formed above the center in the vertical direction (y direction) in the support 10G. About this recessed part 13G, it can form similarly to each said embodiment except the positions in the support body 10G differing. In addition to the light emitting element 5B, the protective element 6 is also mounted in the same manner as the light emitting device 30B according to the modification of the first embodiment (see FIG. 5). Furthermore, although the metal film 33a is provided as a heat radiating part on the back surface (lower side in FIG. 9B) of the support 10G, it is disposed on the upper side (right rear side in FIG. 9B) in accordance with the recess 13G. Has been. The configuration and manufacturing method of the metal film 33a and the small recess 14 on which the protection element 6 in the recess 13G is placed are also the same as those of the light emitting device 30B, and thus the description thereof is omitted. Further, as shown in FIG. 9B, the light emitting element mounting substrate 20G of the light emitting device 30G is similar to the light emitting element mounting substrate 20E according to the fourth embodiment (see FIG. 8A). The second support 2 is composed of two layers for 10G, and the grooves 12a and 12b are widened in the depth direction (z direction). And the recessed part 13G of the support body 10G is also provided with the step in the surrounding surface similarly to the recessed part 13E of the support body 10E. Further, the support 10G also divides the first support 1 into two layers and does not cover the metal films 32a and 32b on the inner surfaces of the grooves 12a and 12b, as in the modification of the first embodiment (see FIG. 5). An area is provided.

In the light emitting element mounting substrate 20G of the light emitting device 30G according to the present embodiment, the end portions on the lower surface side of the inner surfaces of the grooves 12a and 12b formed on the lower surface of the support 10G are further arcuated in front view (back view). In the notched shape, the inner surfaces of the notched regions 12a ₃ and 12b ₃ (the region 12b ₃ is not shown in FIG. 9A) are not covered with the metal films 32a and 32b. Therefore, the end surfaces of the metal films 32a and 32b are not exposed on the lower surface of the support 10G that becomes the grounding surface to the mounting substrate. With such a configuration, the end surfaces of the metal films 32a and 32b do not protrude as burrs on the lower surface of the support 10G due to separation / cutting of the light emitting device 30G, and the light emitting device 30G is inclined during mounting. It is possible to prevent floating from the mounting substrate.

In the manufacture of the light emitting element mounting substrate 20G having such a shape, an elongated oval shape is formed on the back side layers of the first support 1 and the second support 2 as in the first embodiment (see FIG. 3). After forming the slit hole 12 and covering the inner peripheral surface thereof with the metal film 32 (print layer), the slit hole 12 is further overlapped with the slit hole 12 and is longer (width direction (x direction) length and depth direction (y A second slit hole having a direction (long and small) and an oval shape is formed. A region near the cutting line in the x direction on the inner peripheral surface of the slit hole 12 is cut out together with the metal film 32 by the second slit hole. As with the slit hole 12, the shape of the second slit hole is not limited to an oval shape, and the metal film 32 may be prevented from being formed near the cutting line in the x direction that constitutes the lower surface of the support 10G. That is, the shape of the regions 12a ₃ and 12b ₃ after singulation is not limited to a circular shape in the front view (rear view), and the end portions on the lower surface side of the inner surfaces of the grooves 12a and 12b are notched by the regions 12a ₃ and 12b ₃ . It only has to be. In this way, the first support 1 and the like are punched twice at the same location, and the cavity on the back side of the second support 2 is also formed with a cavity hole for forming the recess 13G. The support 10G is configured to widen this region (region that is not punched out) to increase the strength. That is, the support 10G increases the length in the y direction on the lower surface side of the recess 13G. Further, in order to shorten the length in the y direction on the upper surface side of the concave portion 13G, the support 10G is not formed with a notch on the upper surface. Accordingly, the light emitting element mounting substrate 20G has a vertically asymmetric structure in which the concave portion 13G is provided on the support 10G.

  As mentioned above, although the form for implementing this invention was demonstrated about the light-emitting device which concerns on this invention, and its light emitting element mounting substrate, this invention is not limited to the said embodiment, Based on these description Needless to say, various changes and modifications are also included in the spirit of the present invention.

  The light-emitting device according to the present invention is used as a light source such as a backlight of a liquid crystal display such as a large-screen television, and can increase the amount of light by mounting a large number of pieces, and can reduce the deviation of the mounting position, etc. Can be improved.

10, 10A-10G Support 1 First Support 2 Second Support 11, 21 Through Hole 11a, 11b, 11c Notch 12 Slit Hole 12a, 12b Groove 13, 13B-13E, 13G Concave 13a Front of Concave 14 Small recess 23 Cavity hole (through hole)
20, 20A to 20G Light-emitting element mounting substrate 30, 30B, 30G Light-emitting device 31a, 31b Metal film (lead electrode, inner lead)
32 Metal film 32a, 32b Metal film (lead electrode, outer lead)
33a, 33b Metal film (heat dissipation part)
5,5B Light emitting device (semiconductor light emitting device)
6 Protection elements

Claims (6)

A support made of an insulating material formed with a recess opening in the front, a pair of lead electrodes made of a metal film formed on the inner front side of the recess, and a semiconductor light emitting element placed in the recess; And a sealing member that seals the recess, wherein the pair of electrodes of the semiconductor light emitting element are electrically connected to the pair of lead electrodes, respectively, and the bottom surface of the support is mounted as a mounting surface. ,
The support body has two groove portions formed so as to leave a region near the center in the width direction on the bottom surface by cutting out a part of each of the opposite sides in the width direction on the bottom surface,
The groove is formed so as not to reach the front surface of the support in the depth direction.
The light emitting device, further comprising: a metal film electrically connected to each of the pair of lead electrodes on at least a part of an inner surface of each of the two groove portions of the support. The support has two cutout portions formed along both sides of the bottom surface facing each other in the width direction so that the front view has a shape with a rectangular corner cut out.
The light-emitting device according to claim 1, wherein the notch is formed in a region where the groove is not formed in the depth direction. One or two heat dissipating parts made of a metal film are provided on the back surface of the support,
The light-emitting device according to claim 1, wherein one of the pair of lead electrodes is electrically connected to one of the heat radiating portions. Two metal films that are electrically connected to each of the pair of lead electrodes are provided on the back surface of the support,
The light-emitting device according to claim 1, wherein the back surface of the support body can be mounted as a mounting surface. The support is formed by laminating at least two layers of a first support on the back side and a second support on the front side in the depth direction, with the inner front of the recess as a boundary surface,
The front surface of the first support body constitutes the inner front surface of the recess,
A through hole is formed in the second support, and an inner peripheral surface of the through hole constitutes an inner peripheral surface of the recess,
The light emitting device according to claim 1, wherein the groove is formed at least in the first support. The support is formed by laminating a first support on the back side and a second support on the front side in the depth direction, with the inner front of the recess as a boundary surface, and further on the front side of the second support. It consists of at least three layers laminated with a third support,
The front surface of the first support body constitutes the inner front surface of the recess,
A through hole is formed in the second support body and the third support body, and an inner peripheral surface of the through hole constitutes an inner peripheral surface of the recess,
The light emitting device according to claim 1, wherein the groove is formed at least in the second support.

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