KR20130050147A - Light emitting device package - Google Patents

Light emitting device package Download PDF

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Publication number
KR20130050147A
KR20130050147A KR1020110115344A KR20110115344A KR20130050147A KR 20130050147 A KR20130050147 A KR 20130050147A KR 1020110115344 A KR1020110115344 A KR 1020110115344A KR 20110115344 A KR20110115344 A KR 20110115344A KR 20130050147 A KR20130050147 A KR 20130050147A
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KR
South Korea
Prior art keywords
light emitting
emitting device
region
device package
light
Prior art date
Application number
KR1020110115344A
Other languages
Korean (ko)
Other versions
KR101894933B1 (en
Inventor
안상현
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Priority to KR1020110115344A priority Critical patent/KR101894933B1/en
Publication of KR20130050147A publication Critical patent/KR20130050147A/en
Application granted granted Critical
Publication of KR101894933B1 publication Critical patent/KR101894933B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

The light emitting device package according to the embodiment includes a body in which a cavity is formed, first and second lead frames mounted on the body and having at least one region exposed to the outside of the body and having holes formed in at least one region; The light emitting device may be electrically connected to the first and second lead frames, and the hole may include a first region overlapping the body in a vertical direction, and a second region extending outside of the body.

Description

Light Emitting Device Package

An embodiment relates to a light emitting device package.

Light Emitting Diode (LED) is a device that converts an electric signal into a light form using the characteristics of a compound semiconductor, and is used for home appliances, remote controllers, electronic displays, indicators, and various automation devices. There is a trend.

On the other hand, when mounting the light emitting device package on a predetermined substrate, it is necessary to ensure the reliability of the coupling between the light emitting device package and the substrate.

Application No. 10-2000-0072321 (hereinafter referred to as Prior Art 1) discloses a light emitting device package including a lead frame having a solder attachment groove formed therein. However, it may be difficult for the solder to be filled in the grooves and it may be difficult to secure the reliability improvement effect of mounting the light emitting device package.

The embodiment provides a light emitting device package in which a hole is formed in at least one region of the lead frame.

The light emitting device package according to the embodiment includes a body in which a cavity is formed, first and second lead frames mounted on the body and having at least one region exposed to the outside of the body and having holes formed in at least one region; The light emitting device may be electrically connected to the first and second lead frames, and the hole may include a first region overlapping the body in a vertical direction, and a second region extending outside of the body.

The light emitting device package according to the embodiment includes a lead frame having a hole formed in at least one region, wherein the at least one region overlaps the body in a vertical direction and at least one region is exposed to the outside of the body, thereby between the body and the lead frame. And mounting of the light emitting device package can be formed reliably.

1 is a perspective view showing a light emitting device package according to an embodiment
2 is a cross-sectional view showing a light emitting device package according to the embodiment;
3 is a partial perspective view showing a region A shown in FIG. 1;
4 is a partial perspective view showing a region A according to another embodiment;
5 is a sectional view showing a light emitting device package according to another embodiment;
6A is a perspective view of a lighting device including a light emitting device package according to an embodiment;
6B is a cross-sectional view of a lighting apparatus including a light emitting device package according to an embodiment;
7 is an exploded perspective view showing a liquid crystal display device including a light emitting device package according to the embodiment;
8 is an exploded perspective view illustrating a liquid crystal display including a light emitting device package according to an embodiment.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout.

The terms spatially relative, "below", "beneath", "lower", "above", "upper" May be used to readily describe a device or a relationship of components to other devices or components. Spatially relative terms should be understood to include, in addition to the orientation shown in the drawings, terms that include different orientations of the device during use or operation. For example, when flipping a device shown in the figure, a device described as "below" or "beneath" of another device may be placed "above" of another device. Thus, the exemplary term "below" can include both downward and upward directions. The device can also be oriented in other directions, so that spatially relative terms can be interpreted according to orientation.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. It is noted that the terms "comprises" and / or "comprising" used in the specification are intended to be inclusive in a manner similar to the components, steps, operations, and / Or additions.

Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used in a sense that can be commonly understood by those skilled in the art. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size and area of each component do not entirely reflect actual size or area.

Further, the angle and direction mentioned in the description of the structure of the light emitting device in the embodiment are based on those shown in the drawings. In the description of the structure of the light emitting device in the specification, reference points and positional relationship with respect to angles are not explicitly referred to, refer to the related drawings.

Hereinafter, embodiments will be described in detail with reference to the drawings.

1 is a perspective view showing a light emitting device package according to the embodiment, Figure 2 is a cross-sectional view showing a light emitting device package according to the embodiment, Figure 3 is a partial perspective view showing a region A shown in FIG.

Hereinafter, in order to describe the shape of the light emitting device package 100 according to the embodiment in more detail, the longitudinal direction (Z) of the light emitting device package 100, the horizontal direction (Y) perpendicular to the longitudinal direction (Z), The height direction X perpendicular to the longitudinal direction Z and the horizontal direction Y will be described.

1 to 3, a light emitting device package 100 according to an embodiment includes a body 110 having a cavity 120, a first body mounted on the body 110, and having a hole 170 formed in at least one region. And a light emitting device 130 electrically connected to the second lead frames 140 and 150 and the first and second lead frames 140 and 150, wherein the hole 170 is perpendicular to the body 110. The first region 172 overlaps with each other, and the second region 174 exposed to the outside of the body 110.

The body 110 is made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), photosensitive glass (PSG), polyamide 9T (PA9T) ), Neo geotactic polystyrene (SPS), a metal material, sapphire (Al 2 O 3 ), beryllium oxide (BeO), may be formed of at least one of a printed circuit board (PCB, Printed Circuit Board). The body 110 may be formed by injection molding, etching, or the like, but is not limited thereto.

In addition, the body 110 may include a predetermined photocatalyst. The photocatalyst may form, for example, light generated by the light source unit 130 as white light, and may be, for example, a predetermined pigment such as TiO 2 .

The body 120 may be formed with a cavity 120, and an inner surface of the cavity 120 may have an inclined surface. The angle of reflection of the light emitted from the light emitting device 130 may vary according to the angle of the inclined surface, thereby adjusting the directivity of the light emitted to the outside.

As the directivity of the light decreases, the concentration of light emitted from the light emitting device 130 to the outside increases. On the contrary, the greater the directivity of the light, the less the concentration of light emitted from the light emitting device 130 to the outside.

On the other hand, the shape of the cavity 120 formed on the body 110 as viewed from above may be circular, rectangular, polygonal, elliptical, or the like, and may have a curved shape, but is not limited thereto.

The light emitting device 130 is electrically connected to the first and second lead frames 140 and 150, and the light emitting device 130 may be, for example, a light emitting diode.

The light emitting diode may be, for example, a colored light emitting diode that emits light such as red, green, blue, or white, or a UV (Ultra Violet) light emitting diode that emits ultraviolet light. In addition, one or more light emitting diodes may be mounted.

In addition, the light emitting diode is applicable to both a horizontal type in which the electrical terminals are formed on the upper surface, or to a vertical type or flip chip formed on the upper and lower surfaces. .

The resin layer 160 may be filled in the cavity 120 to cover the light emitting device 130.

The resin layer 160 may be formed of silicon, epoxy, and other resin materials, and may be formed by filling a predetermined resin material in the cavity 120 and then UV or heat curing the resin.

In addition, the resin layer 160 may include a phosphor (not shown), and the phosphor (not shown) may be selected to a wavelength of light emitted from the light emitting device 130 so that the light emitting device package 100 may realize white light. can do.

The phosphor (not shown) may be a blue light emitting phosphor, a cyan light emitting phosphor, a green light emitting phosphor, a yellow green light emitting phosphor, a yellow light emitting phosphor, a yellow red light emitting phosphor, an orange light emitting phosphor, and a red light according to the wavelength of light emitted from the light emitting element 130. One of the luminescent phosphors may be applied.

That is, the phosphor (not shown) may be excited by the light having the first light emitted from the light emitting device 130 to generate the second light. For example, when the light emitting element 130 is a blue light emitting diode and the phosphor is a yellow phosphor, the yellow phosphor may be excited by blue light to emit yellow light, and the blue light and blue light generated by the blue light emitting diode As the generated yellow light is mixed, the light emitting device package 100 may provide white light.

Similarly, when the light emitting device 130 is a green light emitting diode, a magenta phosphor or a mixture of blue and red phosphors is mixed. When the light emitting device 130 is a red light emitting diode, a cyan phosphor or a blue and green phosphor is mixed. For example,

Such phosphors (not shown) may be known phosphors such as YAG, TAG, sulfide, silicate, aluminate, nitride, carbide, nitridosilicate, borate, fluoride, phosphate, etc. .

The first and second lead frames 140 and 150 may be formed of a metal material, for example, titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), and tantalum (Ta). , Platinum (Pt), tin (Sn), silver (Ag), phosphorus (P), aluminum (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge) It may include one or more materials or alloys of hafnium (Hf), ruthenium (Ru), iron (Fe). In addition, the first and second lead frames 140 and 150 may be formed to have a single layer or a multilayer structure, but the embodiment is not limited thereto.

The first second lead frames 140 and 150 are spaced apart from each other and electrically separated from each other. The light emitting device 130 may be mounted on the first lead frame 140, and the first lead frame 140 may be in direct contact with the light emitting device 130 or may be electrically connected through a conductive material (not shown). . In addition, the second lead frame 150 may be electrically connected to the light emitting device 130 by a wire 134, but is not limited thereto. Therefore, when power is connected to the first and second lead frames 140 and 150, power may be applied to the light emitting device 130. On the other hand, several lead frames (not shown) may be mounted in the body 110 and each lead frame (not shown) may be electrically connected to a light emitting device (not shown), but is not limited thereto.

Meanwhile, the first and second lead frames 140 and 150 may include exposed regions in which at least one region extends out of the body in the longitudinal direction.

In some embodiments, the first and second lead frames 140 and 150 may include holes 170 in at least one region.

The hole 170 may be formed in at least one region of at least one of the first and second lead frames 140 and 150.

For example, the hole 170 may be formed by removing at least one region of the first and second lead frames 140 and 150, but is not limited thereto. On the other hand, the shape of the hole 170 may be a circle, a shape having a curvature, or any polygonal shape in addition to the square, but is not limited thereto. In addition, the number of holes may also be plural, but is not limited thereto.

The hole 170 may include first and second regions 172 and 174.

The first region 172 may be formed to overlap the body 110 in a vertical direction. That is, at least one region of the hole 170 may be filled with a material forming the body 110.

A hole 170 is formed in at least one region of at least one of the first and second lead frames 140 and 150, and the hole 170 includes a first region 172 and a first region 172. ) Is filled with a material forming the body 110 may increase the contact area between the body 110 and the first and second lead frames (140, 150). Therefore, the coupling between the first and second lead frames 140 and 150 and the body 110 may be more reliably formed.

In addition, the second region 172 may be exposed to the outside of the body 110. That is, at least one region of the hole 170 may be formed outside the body 110 and exposed.

Since at least one region of the hole 170 is exposed to the outside of the body 110, for example, in order to mount the light emitting device package 100 on a substrate (not shown), the solder and the first and second lead frames ( The contact area between 140 and 150 may increase.

That is, for example, when soldering the light emitting device package 110 onto a substrate (not shown), the molten soldering member may be filled in the holes 170 formed in the first and second lead frames 140 and 150. Therefore, the contact area between the soldering member and the first and second lead frames 140 and 150 may increase.

Therefore, the coupling between the soldering member and the first and second lead frames 140 and 150 can be more reliably formed. In addition, the coupling between the light emitting device package 100 and the substrate (not shown) may also be formed more reliably.

On the other hand, the soldering member can be easily filled in the hole 170, the reliability improvement effect of the light emitting device package 100 can be more easily secured.

On the other hand, if the second region 174 is too large, it may be difficult to form the light emitting device package 100 on the substrate (not shown) densely. If the second region 174 is too small, the light emitting device package ( The reliability improvement effect of the mounting of 100) can be reduced. Accordingly, the length L1 of the second region 174 may be 0.1 mm to 0.2 mm, and the length L2 of the second region 174 may be 0.8 mm to 1 mm.

Meanwhile, the ratio of the longitudinal length L1 of the second region 174 and the longitudinal length M1 of the exposed regions of the first and second lead frames 140 and 150 may be 1: 2 to 3. In addition, the ratio of the horizontal length L2 of the second region 174 and the horizontal length M2 of the exposed regions of the first and second lead frames 140 and 150 may be 0.8: 1 to 1.5.

4 is a partial perspective view showing a region A according to another embodiment. Referring to FIG. 4, the light emitting device package of the embodiment is different from that of two holes 170 in comparison with the embodiment of FIG. 1.

Here, although two holes 170 are illustrated, a plurality of holes 170 may be formed to enlarge a contact area between the solder and the lead frame 140. Therefore, the lifespan of the light emitting device package can be extended and reliability can be improved.

5 is a cross-sectional view showing a light emitting device package according to another embodiment.

Referring to FIG. 5, there is a difference in the light emitting device package 200 of the exemplary embodiment from that in which the lead frame 240 further includes a horizontal hole 280.

Here, the horizontal hole 280 may be formed horizontally in the longitudinal direction. The shape of the horizontal hole 280 may have various shapes such as, for example, a circle, a rectangle, and a triangle, but is not limited thereto. The horizontal hole 280 may further enlarge the contact area between the solder and the lead frame 240.

In addition, the horizontal hole 280 may be formed to communicate with the hole 270. When the horizontal hole 280 communicates with the hole 270, the molten solder flows more easily toward the hole 270, thereby improving adhesion between the lead frame 240 and the substrate (not shown). Therefore, lifespan and reliability of the light emitting device package 200 may be improved.

6A is a perspective view illustrating a lighting apparatus including a light emitting device package according to an embodiment, and FIG. 6B is a cross-sectional view illustrating a C-C 'cross section of the lighting apparatus of FIG. 6A.

That is, FIG. 6B is a cross-sectional view of the lighting apparatus 400 of FIG. 6A cut in the plane of the longitudinal direction Z and the height direction X, and viewed in the horizontal direction Y. FIG.

6A and 6B, the lighting device 400 may include a body 410, a cover 430 fastened to the body 410, and a closing cap 450 positioned at both ends of the body 410. have.

The lower surface of the body 410 is fastened to the light emitting device module 440, the body 410 is conductive and so that the heat generated from the light emitting device package 444 can be discharged to the outside through the upper surface of the body 410 The heat dissipation effect may be formed of an excellent metal material, but is not limited thereto.

The light emitting device package 444 may be mounted on the substrate 442 in multiple colors and in multiple rows to form a module. The light emitting device package 444 may be mounted at the same interval or may be mounted at various separation distances as necessary to adjust brightness. As the substrate 442, a metal core PCB (MCPCB) or a PCB made of FR4 may be used.

The cover 430 may be formed in a circular shape to surround the lower surface of the body 410, but is not limited thereto.

The cover 430 protects the light emitting device module 440 from the outside and the like. In addition, the cover 430 may include diffusing particles to prevent glare of the light generated from the light emitting device package 444 and to uniformly emit light to the outside, and may also include at least one of an inner surface and an outer surface of the cover 430. A prism pattern or the like may be formed on either side. In addition, a phosphor may be applied to at least one of an inner surface and an outer surface of the cover 430.

On the other hand, since the light generated from the light emitting device package 444 is emitted to the outside through the cover 430, the cover 430 should be excellent in the light transmittance, sufficient to withstand the heat generated in the light emitting device package 444 The cover 430 should be provided with heat resistance, and the cover 430 may include polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), or the like. It is preferably formed of a material.

Closing cap 450 is located at both ends of the body 410 may be used for sealing the power supply (not shown). In addition, the closing cap 450 is a power pin 452 is formed, the lighting device 400 according to the embodiment can be used immediately without a separate device to the terminal from which the existing fluorescent lamps are removed.

7 is an exploded perspective view of a liquid crystal display device including the optical sheet according to the embodiment.

FIG. 7 illustrates an edge-light method, and the liquid crystal display 500 may include a liquid crystal display panel 510 and a backlight unit 570 for providing light to the liquid crystal display panel 510.

The liquid crystal display panel 510 may display an image by using light provided from the backlight unit 570. The liquid crystal display panel 510 may include a color filter substrate 512 and a thin film transistor substrate 514 facing each other with a liquid crystal interposed therebetween.

The color filter substrate 512 may implement colors of an image displayed through the liquid crystal display panel 510.

The thin film transistor substrate 514 is electrically connected to the printed circuit board 518 on which a plurality of circuit components are mounted through the driving film 517. The thin film transistor substrate 514 may apply a driving voltage provided from the printed circuit board 518 to the liquid crystal in response to a driving signal provided from the printed circuit board 518.

The thin film transistor substrate 514 may include a thin film transistor and a pixel electrode formed of a thin film on another substrate of a transparent material such as glass or plastic.

The backlight unit 570 may convert the light provided from the light emitting device module 520, the light emitting device module 520 into a surface light source, and provide the light guide plate 530 to the liquid crystal display panel 510. Reflective sheet for reflecting the light emitted from the rear of the light guide plate 530 and the plurality of films 550, 566, 564 to uniform the luminance distribution of the light provided from the 530 and improve the vertical incidence ( 540.

The light emitting device module 520 may include a PCB substrate 522 so that a plurality of light emitting device packages 524 and a plurality of light emitting device packages 524 may be mounted to form a module.

Meanwhile, the backlight unit 570 includes a diffusion film 566 for diffusing light incident from the light guide plate 530 toward the liquid crystal display panel 510, and a prism film 550 for condensing the diffused light to improve vertical incidence. ), And may include a protective film 564 to protect the prism film 550.

8 is an exploded perspective view of a liquid crystal display device including the optical sheet according to the embodiment. However, the parts shown and described in Fig. 7 are not repeatedly described in detail.

8 is a direct view, the liquid crystal display 600 may include a liquid crystal display panel 610 and a backlight unit 670 for providing light to the liquid crystal display panel 610.

Since the liquid crystal display panel 610 is the same as that described with reference to FIG. 7, a detailed description thereof will be omitted.

The backlight unit 670 may include a plurality of light emitting device modules 623, a reflective sheet 624, a lower chassis 630 in which the light emitting device modules 623 and the reflective sheet 624 are accommodated, and an upper portion of the light emitting device module 623. It may include a diffusion plate 640 and a plurality of optical film 660 disposed in the.

LED Module 623 A plurality of light emitting device packages 622 and a plurality of light emitting device packages 622 may be mounted to include a PCB substrate 621 to form a module.

The reflective sheet 624 reflects the light generated from the light emitting device package 622 in the direction in which the liquid crystal display panel 610 is positioned to improve light utilization efficiency.

On the other hand, the light generated from the light emitting device module 623 is incident on the diffusion plate 640, the optical film 660 is disposed on the diffusion plate 640. The optical film 660 includes a diffusion film 666, a prism film 650, and a protective film 664.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It should be understood that various modifications may be made by those skilled in the art without departing from the spirit and scope of the present invention.

110: body 120: cavity
130: light source unit 140: first lead frame
150: second lead frame 170: hole
172: first region 174: second region

Claims (8)

A body formed with a cavity;
First and second lead frames mounted on the body and having at least one region including an exposed region extending out of the body and having holes formed in at least one region; And
A light emitting device electrically connected to the first and second lead frames; Including;
The hole includes a first region overlapping the body in the vertical direction, and a second region extending to the outside of the body package. The method of claim 1,
Wherein the first region comprises:
The light emitting device package is filled with a material forming the body. The method of claim 1,
The second region is a light emitting device package having a longitudinal length of 0.1mm to 0.2mm. The method of claim 1,
The second region is a light emitting device package having a horizontal length of 0.8mm to 1mm. The method of claim 1,
The ratio between the longitudinal length of the second region and the longitudinal length of the exposed regions of the first and second lead frames is
1: 2 to 3 light emitting device package. The method of claim 1,
The ratio of the horizontal length of the second area and the horizontal length of the exposed area of the first and second lead frames is
0.8: 1 to 1.5 light emitting device package. The method of claim 1,
The lead frame,
A light emitting device package further comprising a horizontal hole formed horizontally in the longitudinal direction. The method of claim 7, wherein
The horizontal hole is a light emitting device package communicating with the hole.
KR1020110115344A 2011-11-07 2011-11-07 Light Emitting Device Package KR101894933B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020110115344A KR101894933B1 (en) 2011-11-07 2011-11-07 Light Emitting Device Package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110115344A KR101894933B1 (en) 2011-11-07 2011-11-07 Light Emitting Device Package

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KR20130050147A true KR20130050147A (en) 2013-05-15
KR101894933B1 KR101894933B1 (en) 2018-09-04

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3311914B2 (en) * 1995-12-27 2002-08-05 株式会社シチズン電子 Chip type light emitting diode
JP2006156643A (en) * 2004-11-29 2006-06-15 Citizen Electronics Co Ltd Surface-mounted light-emitting diode

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3311914B2 (en) * 1995-12-27 2002-08-05 株式会社シチズン電子 Chip type light emitting diode
JP2006156643A (en) * 2004-11-29 2006-06-15 Citizen Electronics Co Ltd Surface-mounted light-emitting diode

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