KR101655462B1 - Light emitting device and lighting device using the same - Google Patents
Light emitting device and lighting device using the same Download PDFInfo
- Publication number
- KR101655462B1 KR101655462B1 KR1020100020756A KR20100020756A KR101655462B1 KR 101655462 B1 KR101655462 B1 KR 101655462B1 KR 1020100020756 A KR1020100020756 A KR 1020100020756A KR 20100020756 A KR20100020756 A KR 20100020756A KR 101655462 B1 KR101655462 B1 KR 101655462B1
- Authority
- KR
- South Korea
- Prior art keywords
- light emitting
- electrode
- protruding
- coupling portion
- emitting device
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Abstract
The light emitting device includes: a body having a cavity; A first electrode and a second electrode provided on the body and protruding from a first side and a second side of the body facing each other; At least one light emitting chip installed in the cavity of the body and electrically connected to the first electrode and the second electrode; And a first engaging portion formed on the first side surface of the body and a second engaging portion formed on the second side surface and engaged with the first engaging portion.
Description
The embodiments relate to a light emitting device and a lighting device using the same.
Light emitting diodes (LEDs) are a type of semiconductor devices that convert electrical energy into light. The light emitting diode has advantages of low power consumption, semi-permanent lifetime, fast response speed, safety, and environmental friendliness compared with conventional light sources such as fluorescent lamps and incandescent lamps. Accordingly, much research has been conducted to replace an existing light source with a light emitting diode, and a light emitting diode has been increasingly used as a light source for various lamps used in indoor / outdoor, a liquid crystal display, a display board, and a streetlight.
Embodiments provide a light emitting device having a novel structure and a lighting device using the same.
Embodiments provide a light emitting device and a lighting apparatus using the same that can be easily replaced and combined.
The light emitting device includes: a body having a cavity; A first electrode and a second electrode provided on the body and protruding from a first side and a second side of the body facing each other; At least one light emitting chip installed in the cavity of the body and electrically connected to the first electrode and the second electrode; And a first engaging portion formed on the first side surface of the body and a second engaging portion formed on the second side surface and engaged with the first engaging portion.
The lighting apparatus according to an embodiment of the present invention includes a body having a cavity formed therein, a first electrode and a second electrode provided on the body and projecting from the first side and the second side of the body facing each other, At least one light emitting chip electrically connected to the first electrode and the second electrode, a first coupling portion formed on the first side surface of the body, and a second coupling portion formed on the second side surface, At least one light emitting element including two coupling portions; And the at least one light emitting element is disposed on at least one side surface or a lower surface, and the light provided from the at least one light emitting element can be diffused.
Embodiments can provide a light emitting device having a new structure and a lighting device according to an embodiment using the same.
Embodiments can provide a light emitting device that can be easily replaced and combined and a lighting device using the same.
1 is a perspective view of a light emitting device according to an embodiment;
Fig. 2 is a top view of the light emitting device of Fig. 1
3 is a cross-sectional view of the light emitting device of FIG. 1 taken along the line AA '
4 is a view of a connector coupled to a light emitting device according to an embodiment;
5 (a) is a top view of a state in which the light emitting devices according to the adjacent embodiments are coupled to each other
5 (b) is a plan view of a state in which the light emitting devices according to the adjacent embodiments are coupled to each other
6 is a perspective view of a lighting device provided with a plurality of light emitting devices according to an embodiment.
Fig. 7 is an exploded perspective view of the illumination device of Fig.
8 is a cross-sectional view of a light emitting device according to another embodiment
9 is a top view of a light emitting device according to another embodiment
10 is a cross-sectional view of the light emitting device of FIG. 9 taken along the line CC ';
In the description of the embodiments, it is to be understood that each layer (film), region, pattern or structure is formed "on" or "under" a substrate, each layer The terms " on "and " under " encompass both being formed" directly "or" indirectly " In addition, the criteria for above or below each layer will be described with reference to the drawings.
The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size of each component does not entirely reflect the actual size.
Hereinafter, a light emitting device according to an embodiment and a lighting apparatus using the same will be described with reference to the accompanying drawings.
FIG. 1 is a perspective view of a
1 to 3, a light emitting device according to an embodiment of the present invention includes a
The
When the
The shape of the upper surface of the
The
The first
The
The first
A plurality of
In addition, when one
The
The first and
One end of each of the first and
The first and
The first and
The plurality of
Each of the plurality of
Although the plurality of
The
The
On the other hand, a lens (not shown) is further formed on the
4 is a view showing a
Referring to FIG. 4, the
The
Since the
In addition, the
5A is a top view of a state in which the
5 (a), the first engaging
5 (b), the first and
As described above, a plurality of light emitting
In addition, when one
The illumination device is not limited as long as it is a device used for providing light, and may be, for example, an illumination device for providing light to a display device.
FIG. 6 is a perspective view of an illumination device provided with the plurality of light emitting
6 and 7, the illumination device includes a
The
The
The plurality of light emitting
The
The
Hereinafter, the
8 is a cross-sectional view of a
Referring to FIG. 8, the
The
The
However, the
The
Hereinafter, the
FIG. 9 is a top view of a
9 and 10, the
Since the
The
The
The features, structures, effects and the like described in the embodiments are included in at least one embodiment of the present invention and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects and the like illustrated in the embodiments can be combined and modified by other persons skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of illustration, It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
1: light emitting element 10: body
15: Cavity 20: Light emitting chip
31, 32: first and second electrodes 40: molding member
51, 52: first and second coupling parts 60:
Claims (14)
A first electrode and a second electrode provided on the body and protruding from a first side and a second side of the body facing each other;
At least one light emitting chip installed in the cavity of the body and electrically connected to the first electrode and the second electrode; And
A first engaging portion formed on the first side surface of the body and a second engaging portion formed on the second side surface and engaged with the first engaging portion,
Wherein the first coupling portion is disposed on the first and second electrodes protruding from the first side, and the second coupling portion is disposed on the first and second electrodes protruding from the second side.
Wherein the first coupling portion is protruded outwardly from one end of the first electrode and the second electrode protruding from the first side and the second coupling portion is protruded outwardly from one end of the first electrode and the second electrode protruding from the second side, And protruding outwardly from the other end of the electrode.
Wherein the first electrode and the second electrode pass through a bottom surface of the body.
And a protrusion protruding between the first electrode and the second electrode.
Wherein the first coupler has a protrusion structure and the second coupler has a groove structure in which the protrusion structure of the first coupler is inserted.
And a support member extending from the body between the at least one light emitting chips.
And a molding member formed to seal the at least one light emitting chip in the cavity.
Wherein the at least one light emitting element is disposed on at least one side surface or a lower surface thereof and includes a light guide member for diffusing light provided from the at least one light emitting element,
Wherein the first coupling portion is disposed on the first and second electrodes protruding from the first side, and the second coupling portion is disposed on the first and second electrodes protruding from the second side.
Wherein the first coupling portion is protruded outwardly from one end of the first electrode and the second electrode protruding from the first side and the second coupling portion is protruded outwardly from one end of the first electrode and the second electrode protruding from the second side, And protruding outwardly from the other end of the electrode.
And protrusions protruding between the first electrode and the second electrode.
And a support member extending from the body between the at least one light emitting chips.
A connector is coupled to one end of the at least one light emitting device, and the connector transmits power from an external power source.
Wherein the connector includes a third coupling portion corresponding to the first coupling portion or the second coupling portion of the light emitting device, and a connection terminal electrically connected to the external power source.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100020756A KR101655462B1 (en) | 2010-03-09 | 2010-03-09 | Light emitting device and lighting device using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100020756A KR101655462B1 (en) | 2010-03-09 | 2010-03-09 | Light emitting device and lighting device using the same |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20110101618A KR20110101618A (en) | 2011-09-16 |
KR101655462B1 true KR101655462B1 (en) | 2016-09-08 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020100020756A KR101655462B1 (en) | 2010-03-09 | 2010-03-09 | Light emitting device and lighting device using the same |
Country Status (1)
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KR (1) | KR101655462B1 (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100604408B1 (en) | 2005-08-26 | 2006-07-25 | 삼성전기주식회사 | Light emitting diode package |
KR100735432B1 (en) * | 2006-05-18 | 2007-07-04 | 삼성전기주식회사 | Light emitting device package and light emitting device package array |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100844757B1 (en) * | 2006-08-24 | 2008-07-07 | 엘지이노텍 주식회사 | Lighting device and display apparatus using its |
KR20080077827A (en) * | 2007-02-21 | 2008-08-26 | 삼성전자주식회사 | Light emitting diode block and backlight unit and liquid crystal display having the same |
-
2010
- 2010-03-09 KR KR1020100020756A patent/KR101655462B1/en active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100604408B1 (en) | 2005-08-26 | 2006-07-25 | 삼성전기주식회사 | Light emitting diode package |
KR100735432B1 (en) * | 2006-05-18 | 2007-07-04 | 삼성전기주식회사 | Light emitting device package and light emitting device package array |
Also Published As
Publication number | Publication date |
---|---|
KR20110101618A (en) | 2011-09-16 |
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