KR20110101618A - Light emitting device and light unit using the same - Google Patents

Light emitting device and light unit using the same Download PDF

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Publication number
KR20110101618A
KR20110101618A KR1020100020756A KR20100020756A KR20110101618A KR 20110101618 A KR20110101618 A KR 20110101618A KR 1020100020756 A KR1020100020756 A KR 1020100020756A KR 20100020756 A KR20100020756 A KR 20100020756A KR 20110101618 A KR20110101618 A KR 20110101618A
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KR
South Korea
Prior art keywords
light emitting
electrode
emitting device
coupling portion
light
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Application number
KR1020100020756A
Other languages
Korean (ko)
Other versions
KR101655462B1 (en
Inventor
박성호
Original Assignee
엘지이노텍 주식회사
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Priority to KR1020100020756A priority Critical patent/KR101655462B1/en
Publication of KR20110101618A publication Critical patent/KR20110101618A/en
Application granted granted Critical
Publication of KR101655462B1 publication Critical patent/KR101655462B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

The light emitting device according to the embodiment includes a body in which the cavity is formed; First and second electrodes installed on the body and protruding from the first and second side surfaces of the body facing each other; At least one light emitting chip installed in the cavity of the body and electrically connected to the first electrode and the second electrode; And a first coupling part formed on the first side of the body and a second coupling part formed on the second side and coupled to the first coupling part.

Description

LIGHT EMITTING DEVICE AND LIGHT UNIT USING THE SAME}

An embodiment relates to a light emitting device and a light unit using the same.

Light emitting diodes (LEDs) are a type of semiconductor device that converts electrical energy into light. Light emitting diodes have the advantages of low power consumption, semi-permanent life, fast response speed, safety and environmental friendliness compared to conventional light sources such as fluorescent and incandescent lamps. Accordingly, many researches are being conducted to replace existing light sources with light emitting diodes, and the use of light emitting diodes is increasing as a light source for lighting devices such as various lamps, liquid crystal displays, electronic displays, and street lamps that are used indoors and outdoors.

The embodiment provides a light emitting device having a new structure and a light unit using the same.

The embodiment provides a light emitting device and a light unit using the same that can be easily replaced and combined.

The light emitting device according to the embodiment includes a body in which the cavity is formed; First and second electrodes installed on the body and protruding from the first and second side surfaces of the body facing each other; At least one light emitting chip installed in the cavity of the body and electrically connected to the first electrode and the second electrode; And a first coupling part formed on the first side of the body and a second coupling part formed on the second side and coupled to the first coupling part.

The embodiment can provide a light emitting device having a new structure and a light unit using the same.

The embodiment can provide a light emitting device and a light unit using the same that can be easily replaced and combined.

1 is a perspective view of a light emitting device according to an embodiment
FIG. 2 is a top view of the light emitting device of FIG. 1. FIG.
3 is a cross-sectional view illustrating an AA ′ cross section of the light emitting device of FIG. 1.
4 is a view showing a connector coupled to the light emitting device according to the embodiment;
FIG. 5A is a view of the light emitting devices coupled to each other according to an exemplary embodiment as viewed from above
5B is a view of the light emitting devices coupled to each other according to an exemplary embodiment as viewed from below;
6 is a perspective view of a backlight unit provided with a plurality of light emitting devices according to an embodiment;
7 is an exploded perspective view of the backlight unit of FIG. 6;
8 is a cross-sectional view of a light emitting device according to another embodiment
9 is a top view of a light emitting device according to another embodiment;
10 is a cross-sectional view taken along line CC ′ of the light emitting device of FIG. 9.

In the description of the embodiments, it is to be understood that each layer (film), region, pattern or structure is formed "on" or "under" a substrate, each layer The terms " on "and " under " encompass both being formed" directly "or" indirectly " In addition, the criteria for the top or bottom of each layer will be described with reference to the drawings.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. In addition, the size of each component does not necessarily reflect the actual size.

Hereinafter, a light emitting device and a light unit using the same according to an embodiment will be described with reference to the accompanying drawings.

1 is a perspective view of a light emitting device 1 according to an embodiment, FIG. 2 is a top view of the light emitting device 1 of FIG. 1, and FIG. 3 is a cross-sectional view showing an AA ′ cross section of the light emitting device 1 of FIG. 1. to be.

1 to 3, the light emitting device according to the embodiment includes a cavity 15, a body 10 formed to extend in a first direction, and installed in the body 10, wherein the body ( The first electrode 31 and the second electrode 32 protruding from the first side 11 and the second side 12 facing each other of the 10 and the cavity 15 of the body 10 is installed At least one light emitting chip 20 electrically connected to the first electrode 31 and the second electrode 32, and a first coupling part 51 formed on the first side surface 11 of the body 10. And a second coupling part 52 formed on the second side surface 12 and coupled to the first coupling part 51 of the adjacent light emitting device.

The body 10 may include at least one of a resin material such as polyphthalamide (PPA), silicon (Si), a metal material, photo sensitive glass (PSG), sapphire (Al 2 O 3 ), and a printed circuit board (PCB). It can be formed as one. The body 10 may be formed by an extrusion process, an etching process or the like, but is not limited thereto.

When the body 10 is formed of a material having electrical conductivity, an insulating film (not shown) is further formed on the surface of the body 10 so that the body 10 is formed with the first and second electrodes 31 and 32. The electrical short can be prevented.

The shape of the upper surface of the body 10 may be formed to extend in the first direction, for example, may have a variety of shapes, such as square, polygon, oval.

The cavity 10 may be formed in the body 10 so that an upper portion thereof is opened. The cavity 15 may be formed in a cup shape, a concave container shape, or the like, and the inner surface of the cavity 15 may be a side perpendicular to the bottom surface or an inclined side surface. In addition, the shape of the cavity 15 viewed from above may be a shape of a rectangle, an ellipse, a polygon, an oval, and the like extending in the first direction.

The first coupling part 51 and the second coupling part 52 may be formed in each of the first side 11 and the second side 12 facing each other of the body 10.

The first coupling part 51 and the second coupling part 52 may be formed of the same material as the body 10 or may be formed of different materials.

The first coupling part 51 and the second coupling part 52 may be formed in a shape corresponding to each other. For example, as shown, the first coupling portion 51 may have a protrusion structure, and the second coupling portion 52 may have a groove structure into which the protrusion structure of the first coupling portion 51 is inserted. However, the present invention is not limited thereto.

A plurality of light emitting devices 1 according to the embodiment may be easily coupled and separated from each other by the first and second coupling parts 51 and 52. Therefore, according to the size, structure, etc. of the light unit in which the plurality of light emitting devices 1 are installed, there is an advantage that the plurality of light emitting devices 1 can be easily applied to the light unit by appropriately combining the plurality of light emitting devices 1.

In addition, when a failure or failure occurs in one light emitting device (1), there is an advantage that can be separated and replaced only the light emitting device (1).

The first electrode 31 and the second electrode 32 may be spaced apart from each other to be electrically separated from each other, and may be installed in the body 10. The first electrode 31 and the second electrode 32 may be electrically connected to the plurality of light emitting chips 20 to supply power to the plurality of light emitting chips 20.

The first and second electrodes 31 and 32 may extend in the first direction to protrude from the first side 11 and the second side 12 of the body 10. That is, one end of the first and second electrodes 31 and 32 protrudes from the first side surface 11, and the other end of the first and second electrodes 31 and 32 protrude from the second side surface 12. Can be.

In this case, one end of the first and second electrodes 31 and 32 protruding from the first side 11 may be disposed under the first coupling part 51 and the protruded from the second side 12. The other ends of the first and second electrodes 31 and 32 may be disposed below the second coupling part 52. However, according to the design of the light emitting device 1 according to the embodiment, such an arrangement may be modified but is not limited thereto.

In addition, the first and second electrodes 31 and 32 may be formed to penetrate the bottom surface of the body 10 to form the bottom surface of the light emitting device 1 according to the embodiment. Accordingly, heat generated by the plurality of light emitting chips 20 may be effectively discharged to the outside along the first and second electrodes 31 and 32.

The first and second electrodes 31 and 32 may be formed of a metal material, for example, titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), It may include at least one of platinum (Pt), tin (Sn), silver (Ag), phosphorus (P). In addition, the first and second electrodes 31 and 32 may be formed to have a single layer or a multilayer structure, but are not limited thereto.

The plurality of light emitting chips 20 may be installed in the cavity 15 of the body 10. As shown, the plurality of light emitting chips 20 may be arranged in rows in the first direction, but is not limited thereto.

Each of the plurality of light emitting chips 20 may include, for example, at least one light emitting diode (LED), wherein the light emitting diode is a colored light emitting diode emitting red, green, or blue light. For example, the light emitting diode may include at least one of a white light emitting diode emitting white light or an ultraviolet (Ultra Violet) light emitting diode emitting ultraviolet light, but is not limited thereto.

As shown, the plurality of light emitting chips 20 are electrically connected to the first and second electrodes 31 and 32 by wire bonding, but the plurality of light emitting chips 20 are flip chip type and chips. The bonding method may also be electrically connected to the first and second electrodes 31 and 32 but is not limited thereto.

The molding member 40 may be formed in the body 10 to seal the plurality of light emitting chips 20. That is, the molding member 40 may be filled in the cavity 15.

The molding member 40 may be formed of a silicone or resin material having transparency. In addition, the molding member 40 may include a phosphor, and the phosphor may be excited by the first light emitted from the light emitting chip 20 to generate a second light. For example, when the light emitting chip 20 is a blue light emitting diode and the phosphor is a yellow phosphor, the yellow phosphor may be excited by blue light to emit yellow light, and the blue light and yellow light are mixed. Accordingly, the light emitting device 1 may provide white light. However, this is not limitative.

On the other hand, a lens (not shown) is further formed on the molding member 40 to adjust the light distribution of the light emitted from the light emitting element 1. In addition, a zener diode may be further installed on the body 10 of the light emitting device 1 to improve the breakdown voltage.

4 is a view showing a connector 60 coupled to the light emitting element 1 according to the embodiment.

Referring to FIG. 4, the connector 60 may be coupled to one end of the plurality of light emitting devices 1 to transfer power provided from an external power source to the light emitting devices 1.

To this end, the connector 60 may include a third coupling portion 62 corresponding to the shape of the first coupling portion 51 or the second coupling portion 52 of the light emitting device 1. .

In addition, since the connector 60 is coupled to the light emitting device 1, the connector 60 must be electrically connected to the first and second electrodes 31 and 32 of the light emitting device 1, and thus, the third coupling part 62 is formed. It may include an electrode connecting portion 64 adjacent to). As shown, the electrode connecting portion 64 may be formed under the third coupling portion 62, but is not limited thereto.

In addition, the connector 60 may include a connection terminal 66 to be electrically connected to an external power source.

FIG. 5A is a view of the light emitting devices 1 coupled to each other as viewed from above, and FIG. 5B is a state in which the light emitting devices 1 according to the adjacent embodiments are coupled to each other. Is a view from below.

Referring to FIG. 5A, the first coupling portion 51 of one light emitting element 1 and the second coupling portion 52 of the light emitting element 1 adjacent to the light emitting element 1 are illustrated. By combining with each other, adjacent light emitting elements 1 can be combined with each other.

Referring to FIG. 5B, as the first and second coupling parts 51 and 52 are coupled to each other, the first electrodes 31 and the second electrodes 32 of adjacent light emitting devices 1 are electrically connected to each other. Can be connected.

As such, a plurality of light emitting devices 1 according to the embodiment may be easily coupled and separated from each other by the first and second coupling parts 51 and 52 to form a light emitting module. Therefore, according to the size, structure, and the like of the light unit in which the plurality of light emitting elements 1 are installed, there is an advantage that the plurality of light emitting elements 1 may be easily applied to the light unit by appropriately combining the plurality of light emitting elements 1.

In addition, when a failure or failure occurs in one light emitting device (1), there is an advantage that can be separated and replaced only the light emitting device (1).

The light unit is not limited as long as it is a device used to provide light, and may be, for example, a backlight unit that provides light to a display device.

6 is a perspective view of a backlight unit in which the plurality of light emitting devices 1 are installed, and FIG. 7 is an exploded perspective view of the backlight unit of FIG. 6.

6 and 7, the backlight unit includes a light guide member 120, a plurality of light emitting devices 1 according to an embodiment disposed on at least one side or a bottom surface of the light guide member 120, and A bottom cover 140 may be provided to accommodate the light guide member 120 and the plurality of light emitting devices 1.

The light guide member 120 may be, for example, a light guide panel (LGP), and the light guide plate may be, for example, an acrylic resin-based resin such as PMMA (polymethyl metaacrylate), PET (polyethylene terephthlate), or PC ( polycarbonate), COC and polyethylene naphthalate (PEN) resin.

The light guide member 120 may serve to make surface light by diffusing light provided from the plurality of light emitting devices 1. In addition, the light sourced by the light guide member 120 may be provided to a display panel (not shown) to be used to implement an image.

The plurality of light emitting devices 1 may be disposed on at least one side of the light guide member 120 to provide light to the light guide member 120. Alternatively, the plurality of light emitting devices 1 may be disposed on the bottom surface of the light guide member 120 in rows and columns, but is not limited thereto.

The bottom cover 140 may be formed in a box shape having an upper surface open to accommodate the light guide member 120 and the plurality of light emitting devices 1, but is not limited thereto.

The bottom cover 140 may be formed of a metal material or a resin material, and may be manufactured using a process such as press molding or extrusion molding.

Hereinafter, the light emitting device 1B according to another embodiment will be described in detail.

8 is a cross-sectional view of a light emitting device 1B according to another embodiment. The light emitting device 1B is the same as the light emitting device 1 of FIG. 1 except that a structure protruding between the first electrode and the second electrode is formed.

Referring to FIG. 8, the light emitting device 1B may include a body 10, a first electrode 31 and a second electrode 32 installed on the body 10, and installed on the body 10. A plurality of light emitting chips 20 electrically connected to the first electrode 31 and the second electrode 32, and a protective cap 14 protruding between the first electrode 31 and the second electrode 32. It may include.

The protective cap 14 covers the gap between the first electrode 31 and the second electrode 32 and the body 10 to prevent penetration of moisture or air, and in the long term, the gap opens. By preventing this, the reliability of the light emitting element 1 can be improved.

The protective cap 14 indicates a structure in which the body 10 protrudes between the first electrode 31 and the second electrode 32. Therefore, the protective cap 14 may be integrally formed with the body 10 in the manufacturing process of the light emitting device 1, and may be formed of the same material as the body 10.

However, the protective cap 14 may be formed separately from the body 10, in which case the material of the protective cap 14 may be different from the material of the body 10.

The protective cap 14 protrudes between the first and second electrodes 31 and 32 to effectively cover the gap between the first and second electrodes 31 and 32 and the body 10. It may be formed to surround at least a portion and the side of the upper surface of the two electrodes (31, 32).

Hereinafter, the light emitting device 1C according to another embodiment will be described in detail.

9 is a top view of the light emitting device 1C according to another embodiment, and FIG. 10 is a view showing a cross-sectional view taken along line C-C 'of the light emitting device 1C of FIG. The light emitting device 1C is the same as the light emitting device 1 of FIG. 1 except that a supporting member is formed between the plurality of light emitting chips.

9 and 10, the light emitting device 1C includes a cavity 15, is formed to extend in a first direction, and is installed on the body 10 and the body ( The first electrode 31 and the second electrode 32 protruding from the first side 11 and the second side 12 facing each other of the 10 and the cavity 15 of the body 10 is installed A plurality of light emitting chips 20 electrically connected to the first electrode 31 and the second electrode 32, a first coupling part 51 formed on the first side surface 11 of the body 10; A second coupling part 52 formed on the second side surface 12 and coupled to the first coupling part 51 of the adjacent light emitting device, and a support member 57 formed between the plurality of light emitting chips 20. ) May be included.

Since the light emitting device 1C has a shape extending in the first direction, the body 10 may be bent. Therefore, by forming the support member 57 in the light emitting element 1C, the phenomenon in which the body 10 is bent can be alleviated.

The support members 57 may be formed between the plurality of light emitting chips 20 on the first electrode 31. The support members 57 may extend from the body 10, and in this case, the support members 57 may be formed of the same material as the body 10.

The support members 57 may have a shape in which at least one portion is bent or curved as shown. As the support members 57 have such a shape, the action of supporting the body 10 may be greater.

Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

In addition, the above description has been made with reference to the embodiment, which is merely an example, and is not intended to limit the present invention. Those skilled in the art to which the present invention pertains will be illustrated as above without departing from the essential characteristics of the present embodiment. It will be appreciated that various modifications and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

1: light emitting element 10: body
15: cavity 20: light emitting chip
31,32: first and second electrode 40: molding member
51,52: first, second coupling part 60: connector

Claims (14)

A cavity formed body;
First and second electrodes installed on the body and protruding from the first and second side surfaces of the body facing each other;
At least one light emitting chip installed in the cavity of the body and electrically connected to the first electrode and the second electrode; And
A light emitting device comprising a first coupling portion formed on the first side of the body, and a second coupling portion formed on the second side and coupled to the first coupling portion. The method of claim 1,
One end of the first electrode and the second electrode protruding from the first side surface is disposed under the first coupling portion, and the other end of the first electrode and the second electrode protruding from the second side surface is formed of the first electrode. 2 A light emitting element disposed below the coupling portion. The method of claim 1,
The first electrode and the second electrode is a light emitting device formed to penetrate the bottom surface of the body. The method of claim 1,
A light emitting device comprising a protrusion protruding between the first electrode and the second electrode. The method of claim 1,
The first coupling part has a protrusion structure, and the second coupling part has a groove structure into which the protrusion structure of the first coupling part is inserted. The method of claim 1,
And a support member extending from the body between the plurality of light emitting chips. The method of claim 1,
And a molding member formed to seal the plurality of light emitting chips in the cavity. A body having a cavity formed therein, the first electrode and the second electrode protruding from the first side and the second side facing each other of the body, and the first electrode and the first electrode installed in the cavity of the body. At least one light emitting chip electrically connected to a second electrode, at least one including a first coupling portion formed on the first side of the body and a second coupling portion formed on the second side and coupled to the first coupling portion Light emitting element; And
The at least one light emitting device is disposed on at least one side or bottom surface, and includes a light guide member for diffusing light provided from the at least one light emitting device. The method of claim 8,
The light guide member is a light guide plate. The method of claim 8,
One end of the first electrode and the second electrode protruding from the first side surface is disposed under the first coupling portion, and the other end of the first electrode and the second electrode protruding from the second side surface is formed of the first electrode. 2 Backlight unit disposed below the engaging portion. The method of claim 8,
And a protrusion protruding between the first electrode and the second electrode. The method of claim 8,
And a support member extending from the body between the plurality of light emitting chips. The method of claim 8,
A connector is coupled to one end of the at least one light emitting element, and the connector transfers power from an external power source. The method of claim 13,
The connector includes a third coupling portion corresponding to the first coupling portion or the second coupling portion of the light emitting device, and a connection terminal electrically connected to the external power source.
KR1020100020756A 2010-03-09 2010-03-09 Light emitting device and lighting device using the same KR101655462B1 (en)

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Application Number Priority Date Filing Date Title
KR1020100020756A KR101655462B1 (en) 2010-03-09 2010-03-09 Light emitting device and lighting device using the same

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KR20110101618A true KR20110101618A (en) 2011-09-16
KR101655462B1 KR101655462B1 (en) 2016-09-08

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100604408B1 (en) * 2005-08-26 2006-07-25 삼성전기주식회사 Light emitting diode package
KR100735432B1 (en) * 2006-05-18 2007-07-04 삼성전기주식회사 Light emitting device package and light emitting device package array
KR20080018308A (en) * 2006-08-24 2008-02-28 엘지이노텍 주식회사 Lighting device and display apparatus using its
KR20080077827A (en) * 2007-02-21 2008-08-26 삼성전자주식회사 Light emitting diode block and backlight unit and liquid crystal display having the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100604408B1 (en) * 2005-08-26 2006-07-25 삼성전기주식회사 Light emitting diode package
KR100735432B1 (en) * 2006-05-18 2007-07-04 삼성전기주식회사 Light emitting device package and light emitting device package array
KR20080018308A (en) * 2006-08-24 2008-02-28 엘지이노텍 주식회사 Lighting device and display apparatus using its
KR20080077827A (en) * 2007-02-21 2008-08-26 삼성전자주식회사 Light emitting diode block and backlight unit and liquid crystal display having the same

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