KR101797755B1 - Light emitting device package and method for manufacutring body of light emitting device pacakge - Google Patents

Light emitting device package and method for manufacutring body of light emitting device pacakge Download PDF

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Publication number
KR101797755B1
KR101797755B1 KR1020100076469A KR20100076469A KR101797755B1 KR 101797755 B1 KR101797755 B1 KR 101797755B1 KR 1020100076469 A KR1020100076469 A KR 1020100076469A KR 20100076469 A KR20100076469 A KR 20100076469A KR 101797755 B1 KR101797755 B1 KR 101797755B1
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KR
South Korea
Prior art keywords
light emitting
emitting device
metal structure
device package
light
Prior art date
Application number
KR1020100076469A
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Korean (ko)
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KR20120014420A (en
Inventor
이은선
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엘지이노텍 주식회사
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Priority to KR1020100076469A priority Critical patent/KR101797755B1/en
Publication of KR20120014420A publication Critical patent/KR20120014420A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

A light emitting device package according to an embodiment includes a body including a metal structure and an insulating material and having an electrode layer; And a light emitting device located on the body and electrically connected to the electrode layer. The metal structure has a net shape, and the insulating material fills the net of the metal structure.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device package and a method of manufacturing a body for a light emitting device package,

Embodiments relate to a light emitting device package and a method of manufacturing a body for a light emitting device package.

Light emitting diodes (LEDs) are a type of semiconductor devices that convert electrical energy into light. The light emitting diode has advantages of low power consumption, semi-permanent lifetime, fast response speed, safety, and environmental friendliness compared with conventional light sources such as fluorescent lamps and incandescent lamps.

Accordingly, much research has been conducted to replace an existing light source with a light emitting diode, and there is an increasing tendency to use a light emitting diode as a light source of various lamps, liquid crystal display devices, electric sign boards, to be.

Embodiments provide a light emitting device package capable of improving heat dissipation characteristics and a method of manufacturing a body for a light emitting device package.

A light emitting device package according to an embodiment includes a body including a metal structure and an insulating material and having an electrode layer; And a light emitting device located on the body and electrically connected to the electrode layer. The metal structure has a net shape, and the insulating material fills the net of the metal structure.
In the light emitting device package according to the embodiment, the electrode layer may be positioned on the first portion, and the molding member may be in contact with the first portion.

A method of manufacturing a body for a light emitting device package according to an embodiment of the present invention includes: positioning a metal structure having a cavity in a mold; And filling the mold with an insulating material.

The light emitting device package according to the embodiment includes a body having excellent heat dissipation characteristics, so that the temperature rise during use can be minimized.

A method of manufacturing a body for a light emitting device package according to an embodiment can manufacture a body having excellent heat dissipation characteristics by a simple method.

1 is a cross-sectional view of a light emitting device package according to a first embodiment.
2 is a perspective view illustrating the light emitting device package according to the first embodiment except for the lens.
3A to 3F are cross-sectional views illustrating processes of a method of manufacturing a light emitting device package according to the first embodiment.
4 is a cross-sectional view of a light emitting device package according to a second embodiment.
5 is a cross-sectional view of a light emitting device package according to a third embodiment.
6 is a cross-sectional view of a light emitting device package according to a fourth embodiment.
7 is a view illustrating a backlight unit including a light emitting device package according to an embodiment.
8 is a view for explaining a lighting unit including the light emitting device package according to the embodiment.

In the description of the embodiments, it is to be understood that each layer (film), area, pattern or structure may be referred to as being "on" or "under / under" Quot; includes all that is formed directly or through another layer. The criteria for top / bottom or bottom / bottom of each layer are described with reference to the drawings.

The thickness or the size of each layer (film), region, pattern or structure in the drawings may be modified for clarity and convenience of explanation, and thus does not entirely reflect the actual size.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a cross-sectional view of a light emitting device package according to a first embodiment, and FIG. 2 is a perspective view illustrating a light emitting device package according to a first embodiment except for a lens.

1 and 2, a light emitting device package 100 according to an embodiment of the present invention includes a metal structure 12 and an insulating material 14 and includes first and second electrode layers 41 and 42 A light emitting device 50 disposed on the body 10 and electrically connected to the first and second electrode layers 41 and 42 and a molding member 60 for molding the light emitting device 50 ).

This will be described in more detail as follows.

The body 10 is formed to include a metal structure 12 and an insulating material 14. The metal structure 12 may have a structure having a hollow structure, for example, a net shape in which fine metal lines are intertwined with each other. And the insulating material 14 may be formed filling the hollow of the metal structure 12 and the space between the first metal structure 12a and the second metal structure 12b.

The body 10 thus has a first portion A in which the metal structure 12 and the insulating material 14 are formed together and an insulating material 14 between the metal structure 12a and the second metal structure 12b (B) in which only the first portion (B) is located.

The metal structure 12 may be formed of a metal having excellent heat dissipation characteristics such as aluminum (Al), iron (Fe), copper (Cu), nickel (Ni), zinc (Zn) And may include at least any one of them. And the insulating material 14 may be a resin or ceramic that is cured or sintered at a lower temperature than the metal structure 12. [ As the resin, polyphthalamide (PPA), liquid crystal polymer (LCP), polyamide 9T (PA9T), epoxy, acryl, and the like can be used.

Since the body 10 includes the metal structure 12 formed of a metal having excellent heat dissipation characteristics, the heat emitted from the light emitting element 50 and the first and second electrode layers 41 and 42 is absorbed by the body 10 The metal structure 12 can be smoothly discharged. Accordingly, the body 10 of the embodiment can have excellent heat dissipation characteristics as compared with a conventional body having low thermal conductivity using only ceramic or insulating material. Accordingly, characteristics of the light emitting device package 100 including the body 10 can be improved.

Since the metal structure 12 is formed in a net shape and the insulating material 14 fills the inside of the metal structure 12, the heat generated from the light emitting element 50 and the first and second electrode layers 41 and 42 is emitted The voltage applied to the first and second electrode layers 41 and 42 and the like can be minimized through the metal structure 12.

A contact hole 16 penetrating the body 10 is formed in the first portion A so that electrical connection with other components (for example, a printed circuit board or the like) (not shown) . Alternatively, the heat generated from the light emitting element 50 or the first and second electrode layers 41 and 42 may be transmitted more smoothly through the contact hole 16, thereby further improving the heat radiation characteristics.

2 shows an example in which a part of the light emitting element 50 is formed on the first portion A and the contact hole 16 is located in this portion and the heat generated in the light emitting element 50 is efficiently emitted. Respectively. However, the embodiment is not limited thereto, and the contact hole 16 may be formed between the light emitting element 50 and the first and second electrode layers 41 and 42, or between the light emitting element 50 and the first and second electrode layers 41 and 42, And may be formed at various positions such as below the electrode layers 41 and 42.

The contact holes 16 may be formed of the same material as the first and second electrode layers 41 and 42 in the process of forming the first and second electrode layers 41 and 42. However, the present invention is not limited thereto, and the electrode layers 41 and 42 may be formed of a material different from the electrode layers 41 and 42.

The metal structure 12 includes a first metal structure 12a located on one side of the body 10 and a second metal structure 12b located on the other side of the body 10 apart from the first metal structure 12a can do. The first electrode layer 41 may be formed on the first metal structure 12a and the second electrode layer 42 may be formed on the second metal structure 12b. Since the metal structure 12 includes the first and second metal structures 12a and 12b which are separated from each other by the insulating material 14 in the present embodiment, The first and second electrode layers 41 and 42 connected to each other can be prevented from being electrically short-circuited.

The first and second electrode layers 41 and 42 may be formed of a metal having excellent conductivity. Examples of such metals include titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin . The first and second electrode layers 41 and 42 may be formed by plating or the like. However, the embodiment is not limited thereto, and the first and second electrode layers 41 and 42 may be formed of a metal plate having a predetermined thickness.

And the light emitting device 50 is positioned on the body 10 while being electrically connected to the first and second electrode layers 41 and 42.

Two electrode layers (not shown) of the light emitting element 50 may be connected to the first electrode layer 41 and the second electrode layer 42 using wires 52a and 52b, respectively. However, the embodiment is not limited thereto. That is, the light emitting device 50 and the first and second electrode layers 41 and 42 may be electrically connected by die bonding or a flip chip method in addition to wire bonding.

The light emitting device 50 may include a light emitting diode (LED), which may be a colored LED, such as a red LED, a blue LED, a green LED, or an ultraviolet (UV) LED. The embodiments are not limited to the types and the numbers of LEDs. A protective element (for example, a zener diode, a varistor) (not shown) for protecting the LED may be mounted on the body 10.

The molding member 60 is formed while surrounding the light emitting element 50 and the wires 52a and 52b. The molding member 60 may be made of a light-transmitting material such as silicone or epoxy. The molding member 60 may include a fluorescent material that absorbs light emitted from the light emitting device 50 and emits another wavelength. At this time, the molding member 60 may have a hemispherical shape and function as a lens for improving light extraction efficiency.

The light emitting device package 100 may include a body 10 including a metal structure 12 and an insulating material 14 to improve heat radiation characteristics.

Hereinafter, a method of manufacturing a body for a light emitting device package according to a first embodiment and a method of manufacturing a light emitting device package using the same will be described in detail with reference to FIGS. 3A to 3F. For the sake of brevity and clarity, the detailed description of the foregoing description is omitted.

3A to 3F are cross-sectional views illustrating processes of a method of manufacturing a light emitting device package according to the first embodiment.

First, as shown in FIG. 3A, first and second metal structures 12a and 12b are separated from each other by a frame 110 having an opening having a shape corresponding to a body (reference numeral 10 in FIG. 3F, . At this time, the first metal structure 12a is placed close to one side (left side of the drawing) of the frame 110 and the second metal structure 12b is placed to the other side (right side of the drawing) of the frame 110. [

Subsequently, as shown in FIG. 3B, an insulating material 14 made of resin or ceramic is filled in the mold 110 and cured or sintered to form a hollow interior of the first and second metal structures 12a and 12b, An insulating material 14 is filled between the first metal structure 12a and the second metal structure 12b. Thus, the first and second metal structures 12a and 12b and the insulating material 14 are integrated with each other to form the body 10. At this time, the insulating material 14 may use a material whose curing temperature or sintering temperature is lower than the melting temperature of the first and second metal structures 12a and 12b. Accordingly, it is possible to prevent the first and second metal structures 12a and 12b from being melted or damaged in the course of curing the insulating material 14. [

Next, as shown in FIG. 3C, a hole 16a can be formed in the body 10. The holes 16a may be formed by various methods, for example, etching, perforation, and the like, and the embodiments are not limited thereto.

3D, the metal layer 44 is formed on the body 10, and the metal layer 44 is patterned to form the first and second electrode layers 41 and 42, A contact hole 16 filled with a metal can be formed in the hole (reference numeral 16a in Fig. 3C). Here, the metal layer 44 can be formed by various methods such as plating and sputtering, and the metal layer 44 can be patterned by a photoresist process or dry or wet etching using a mask.

In this embodiment, the metal layer 44 is patterned to form the contact holes 16 at the same time as the first and second electrode layers 41 and 42, but the embodiment is not limited thereto. Therefore, the contact hole 16 may be filled with a metal material before or after the first and second electrode layers 41 and 42 are formed. The first and second electrode layers 41 and 42 may be formed by attaching a plate having a predetermined thickness without forming the metal layer 44 by plating or the like.

3F, the light emitting element 50 is placed on the body 10 and then the light emitting element 50 and the first and second electrode layers 41 and 42 are formed by using the wires 52a and 52b, 42 are electrically connected to each other and then molded with the molding member 60 to form the light emitting device package 100.

In this embodiment, the body 10 having the metal structure 12 and the insulating material 14 and improving the heat radiation characteristics can be formed by a simple process and the light emitting device package 100 using the body 10 can be formed.

Hereinafter, the light emitting device package according to the second to fourth embodiments and the manufacturing method thereof will be described with reference to FIGS. 4 to 6. FIG. For the sake of clarity and simplicity, the detailed description of the light emitting device package and the manufacturing method thereof according to the first embodiment will be omitted, and different portions will be described in detail.

4 is a cross-sectional view of a light emitting device package according to a second embodiment.

Referring to FIG. 4, the light emitting device package 102 according to the present embodiment is a first portion A in which a central portion of the body 10a is formed with a metal structure 122 and an insulating material 142, Both sides of the body 10a are the second portion B where only the insulating material 142 is located. At this time, the light emitting element 50 is located in the first portion A, and the first and second electrode layers 41 and 42 are located in the second portion B.

Thus, the heat generated by the light emitting element 50 can be quickly dissipated by the metal structure 122. At this time, the contact hole 162 is located in the first portion A, so that the heat generated in the light emitting device 50 can be more smoothly emitted. However, the embodiment is not limited thereto, and the contact hole 162 may be located under the first and second electrode layers 41 and 42 to assist the electrical connection with other parts.

The first and second electrode layers 41 and 42 are located in a portion made of only the insulating material 142 so that the voltage applied to the first and second electrode layers 41 and 42 can be prevented from flowing to other portions have.

A method of manufacturing the body 10a according to the present embodiment is as follows. The metal structure 122 is positioned at the central portion of the frame 110 when the metal structure 122 is positioned in the frame 110 of FIG. 3A, and then the insulating material 124 is filled and sintered and cured So that the body 10a can be manufactured. The method of forming the contact hole 162, the first and second electrode layers 41 and 42, the light emitting element 50 and the like is the same as in FIGS. 3B to 3F, and thus a detailed description thereof will be omitted.

5 is a cross-sectional view of a light emitting device package according to a third embodiment.

Referring to FIG. 5, the light emitting device package 104 according to the present embodiment includes a cavity 20 in which an upper portion is opened in a body 10b, and a light emitting device 50 is located in the cavity 20 .

The side surface of the cavity (20) may be perpendicular or inclined to the bottom surface of the cavity (20). When the cavity 20 has an inclined side surface, the angle formed between the side surface and the bottom surface of the cavity 20 may be 100 degrees to 170 degrees. At this time, the light emitted from the light emitting element 50 can be well reflected by setting the angle to 120 degrees or more.

In this embodiment, the cavity 20 is provided to reflect light emitted from the light emitting device 50, thereby improving light efficiency.

Although the first and second electrode layers 41 and 42 are disposed on the upper surface of the body 10 in the drawing, the first and second electrode layers 41 and 42 penetrate through the body 10, It is also possible to place it on the floor. In the drawings, the planar shape of the cavity 20 is shown as a circle, but the present invention is not limited thereto. Accordingly, the cavity 20 may have a planar shape of a polygonal shape including a quadrangle.

The body 10b according to the present embodiment can be manufactured by forming the cavity 20 in the body 10b before placing the light emitting element 50 in the body 10b. The cavity 20 may be formed by various methods, for example, etching or the like.

6 is a cross-sectional view of a light emitting device package according to a fourth embodiment.

Referring to FIG. 6, in the light emitting device package 106 according to the present embodiment, the light emitting device 50a may be a vertical chip. One electrode (not shown) of the light emitting device 50a located on the body 10c directly contacts and is electrically connected to the second electrode layer 42, and another electrode (not shown) The first electrode layer 41 and the second electrode layer 41 are electrically connected to each other.

In this case, since the second electrode layer 42 is located below the light emitting element 50a, the first metal structure 126a of the metal structure 126 is relatively small and the second metal structure 126b is relatively large .

Thus, in this embodiment, the light emitting device 50a and the second metal structure 126b are disposed on the entire lower part of the first and second electrode layers 41 and 42 to form the light emitting device 50a and the first and second The heat generated in the electrode layers 41 and 42 can be rapidly dissipated.

In this embodiment, a plurality of second portions B made of only the insulating material 146 are provided. Although two second portions B are shown in the drawing, the embodiments are not limited thereto.

The light emitting device package according to the above-described embodiments may function as an illumination system such as a backlight unit, a pointing device, a lamp, and a streetlight. This will be described with reference to FIGS. 7 and 8. FIG.

7 is a view illustrating a backlight unit including a light emitting device package according to an embodiment. However, the backlight unit 1100 of Fig. 7 is an example of the illumination system, and is not limited thereto.

7, the backlight unit 1100 includes a bottom cover 1140, a light guide member 1120 disposed in the bottom cover 1140, a light guide member 1120 disposed on at least one side or bottom surface of the light guide member 1120 A light emitting module 1110 may be included. Further, a reflective sheet 1130 may be disposed below the light guide member 1120.

The bottom cover 1140 may be formed in a box shape having an opened upper surface to accommodate the light guide member 1120, the light emitting module 1100 and the reflective sheet 1130, . However, the present invention is not limited thereto.

The light emitting module 1110 may include a plurality of light emitting device packages 600 mounted on the substrate 700. A plurality of light emitting device packages (600) provide light to the light guide member (1120).

As shown, the light emitting module 1110 may be disposed on at least one of the inner surfaces of the bottom cover 1140, thereby providing light toward at least one side of the light guide member 1120 .

The light emitting module 1110 may be disposed under the light guide member 1120 in the bottom cover 1140 to provide light toward the bottom surface of the light guide member 1120. It can be variously modified according to the design of the backlight unit 1100.

The light guide member 1120 may be disposed in the bottom cover 1140. The light guide member 1120 can guide the light provided from the light emitting module 1110 to a display panel (not shown) by converting the light into a surface light source.

Such a light guide member 1120 may be, for example, a light guide panel (LGP). The light guiding plate may be made of, for example, acrylic resin such as polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), cyclic olefin copolymer (COC), polycarbonate (PC) , And polyethylene naphthalate resin.

The optical sheet 1150 can be disposed on the upper side of the light guide member 1120.

This optical sheet 1150 may include at least one of, for example, a diffusion sheet, a light condensing sheet, a brightness increasing sheet, and a fluorescent sheet. For example, the optical sheet 1150 may be formed by laminating a diffusion sheet, a light condensing sheet, a brightness increasing sheet, and a fluorescent sheet. In this case, the diffusion sheet 1150 spreads the light emitted from the light emitting module 1110 evenly, and the diffused light can be condensed by the condensing sheet into a display panel (not shown). At this time, the light emitted from the light condensing sheet is randomly polarized light. The brightness increasing sheet can increase the degree of polarization of the light emitted from the light condensing sheet. The light collecting sheet may be, for example, a horizontal or / and a vertical prism sheet. The brightness enhancement sheet may be, for example, a dual brightness enhancement film. Further, the fluorescent sheet may be a translucent plate or film in which the phosphor is spun.

A reflective sheet 1130 may be disposed below the light guide member 1120. The reflective sheet 1130 can reflect light emitted through the lower surface of the light guide member 1120 toward the exit surface of the light guide member 1120. The reflective sheet 1130 may be formed of a resin having high reflectance, for example, PET, PC, poly vinyl chloride, resin, or the like, but is not limited thereto.

8 is a view for explaining a lighting unit including the light emitting device package according to the embodiment. However, the illumination unit 1200 of Fig. 8 is an example of the illumination system, and is not limited thereto.

8, the lighting unit 1200 includes a case body 1210, a light emitting module 1230 installed in the case body 1210, a connection terminal 1220 installed in the case body 1210, (1220).

The case body 1210 is preferably formed of a material having a good heat dissipation property, and may be formed of, for example, a metal or a resin.

The light emitting module 1230 may include a substrate 700 and at least one light emitting device package 600 mounted on the substrate 700.

The substrate 700 may be a circuit pattern printed on an insulator. For example, the substrate 700 may be a general printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB . ≪ / RTI >

Further, the substrate 700 may be formed of a material that efficiently reflects light, or may be formed of a color whose surface is efficiently reflected, for example, white, silver, or the like.

At least one light emitting device package 600 may be mounted on the substrate 700.

The light emitting device package 600 may include at least one light emitting diode (LED). The light emitting device may include a colored light emitting device that emits red, green, blue, or white colored light, and a UV light emitting device that emits ultraviolet (UV) light.

The light emitting module 1230 may be arranged to have various combinations of light emitting elements to obtain color and brightness. For example, a white light emitting element, a red light emitting element, and a green light emitting element may be disposed in combination in order to secure a high color rendering index (CRI). Further, a fluorescent sheet may be further disposed on the path of the light emitted from the light emitting module 1230, and the fluorescent sheet changes the wavelength of the light emitted from the light emitting module 1230. For example, when the light emitted from the light emitting module 1230 has a blue wavelength band, the fluorescent sheet may include a yellow phosphor, and the light emitted from the light emitting module 1230 may be seen through the fluorescent sheet as white light do.

The connection terminal 1220 may be electrically connected to the light emitting module 1230 to supply power. 8, the connection terminal 1220 is connected to the external power supply by being inserted into the socket, but the present invention is not limited thereto. For example, the connection terminal 1220 may be formed in a pin shape and inserted into an external power source or may be connected to an external power source by wiring.

In the above-described illumination system, at least one of a light guide member, a diffusion sheet, a light condensing sheet, a brightness increasing sheet, and a fluorescent sheet is disposed on the path of light emitted from the light emitting module to obtain a desired optical effect.

INDUSTRIAL APPLICABILITY As described above, the illumination system according to the embodiment includes the light emitting device package with improved heat dissipation characteristics, thereby improving the reliability.

The features, structures, effects and the like described in the foregoing embodiments are included in at least one embodiment of the present invention and are not necessarily limited to one embodiment. Further, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified in other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be construed as limiting the scope of the present invention. It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiments may be modified and implemented. It is to be understood that the present invention may be embodied in many other specific forms without departing from the spirit or essential characteristics thereof.

Claims (11)

A body including a net-shaped metal structure and an insulating material filling the net in the metal structure;
An electrode layer disposed on the body; And
And a light emitting element electrically connected to the electrode layer on the body,
The body,
A first portion in which the metal structure and the insulating material co-exist; And
And a second portion in which only the insulating material is located. The method according to claim 1,
Wherein the first portion is provided with a contact hole penetrating the body,
And at least a part of the light emitting element is located on the first part. The method according to claim 1,
Wherein the electrode layer is located on the first portion,
And the molding member is in contact with the first portion. The method of claim 3,
Wherein the electrode layer includes a first electrode layer and a second electrode layer,
Wherein the metal structure includes a first metal structure and a second metal structure that are insulated by the insulating material,
Wherein the first electrode layer is located on the first metal structure and the second electrode layer is located on the second metal structure. delete 3. The method of claim 2,
Wherein the whole of the light emitting element is located on the first portion, and the electrode layer is located on the second portion. 3. The method of claim 2,
The contact hole is made of the same material as the electrode layer,
The body includes a cavity with an open top,
Wherein the light emitting element is disposed in the cavity,
And the second portion is provided in plurality. delete A lighting system comprising the light emitting device package according to any one of claims 1 to 4, 6, and 7. delete delete
KR1020100076469A 2010-08-09 2010-08-09 Light emitting device package and method for manufacutring body of light emitting device pacakge KR101797755B1 (en)

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KR102005235B1 (en) 2013-03-06 2019-07-30 삼성전자주식회사 Light Emitting diode package having flip-chip bonding structure
CN107731757B (en) * 2017-09-27 2019-11-08 开发晶照明（厦门）有限公司 Electrooptical device and its substrate
KR102593358B1 (en) * 2018-08-14 2023-10-25 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 Light emitting device package and light source unit

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JP2003197972A (en) 2001-09-27 2003-07-11 Kokuren Koden Kagi Kofun Yugenkoshi High-luminance light emitting diode

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