KR20110107637A - Printed circuit board and menufacturing the same, light emitting device package, light emitting appratus, and lighting system - Google Patents

Printed circuit board and menufacturing the same, light emitting device package, light emitting appratus, and lighting system Download PDF

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Publication number
KR20110107637A
KR20110107637A KR1020100026884A KR20100026884A KR20110107637A KR 20110107637 A KR20110107637 A KR 20110107637A KR 1020100026884 A KR1020100026884 A KR 1020100026884A KR 20100026884 A KR20100026884 A KR 20100026884A KR 20110107637 A KR20110107637 A KR 20110107637A
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KR
South Korea
Prior art keywords
lead frame
light emitting
conductive layer
base
emitting device
Prior art date
Application number
KR1020100026884A
Other languages
Korean (ko)
Inventor
김기범
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020100026884A priority Critical patent/KR20110107637A/en
Publication of KR20110107637A publication Critical patent/KR20110107637A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body

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  • Led Device Packages (AREA)

Abstract

The light emitting device according to the embodiment includes a printed circuit board; And a light emitting device package installed on the printed circuit board, wherein the printed circuit board includes a base, an insulating member partially formed on the base such that the base is partially exposed, and the base and the insulating member are partially exposed. And a conductive layer formed partially on the insulating member, wherein the conductive layer includes a first conductive layer and a second conductive layer electrically separated from each other, and the light emitting device package is installed on the body and the body. A first lead frame, a second lead frame, a third lead frame electrically separated from each other, and a light emitting element on the third lead frame, and electrically connecting the light emitting element to the first lead frame and the second lead frame The first lead frame is electrically connected to the first conductive layer, and the second lead frame is formed of the first lead frame. The third lead frame is electrically connected to the second conductive layer, and the third lead frame is electrically separated from the first lead frame and the second lead frame, and the third lead frame is closer to the base than the lower surface of the body.

Description

Printed circuit board and its manufacturing method, light emitting device package, light emitting device and lighting system {PRINTED CIRCUIT BOARD AND MENUFACTURING THE SAME, LIGHT EMITTING DEVICE PACKAGE, LIGHT EMITTING APPRATUS, AND LIGHTING SYSTEM}

Embodiments relate to a printed circuit board, a method of manufacturing the same, a light emitting device package, a light emitting device, and an illumination system.

Among printed circuit boards, substrates based on metals such as MCPCB (Metal Core Printed Circuit Board) are substrates having advantages in high thermal conductivity, easy processability, magnetic shielding, impact resistance, etc., compared to conventional resin substrates or ceramic substrates.

Metal-based printed circuit boards can guarantee rigidity even in slim structures and enable high-density circuit designs. In addition, metal is not only inexpensive, but also easy to process and excellent in thermal reliability, so that it is used in a wide range of fields.

In the case of manufacturing a substrate using a metal, an insulation treatment must be performed due to the characteristics of the material, and such insulation treatment is generally performed by forming an insulation layer on a metal layer.

However, since the insulating layer has a low thermal conductivity, there is a problem that the heat dissipation efficiency is lowered due to the insulating layer interposed between the mounted component and the metal layer. In addition, since the insulating layer cannot be removed by a method such as exposure, it is difficult to mount the component to be directly connected to the metal layer.

The embodiment provides a printed circuit board having a novel structure, a method of manufacturing the same, a light emitting device package, a light emitting device, and a lighting system.

The embodiment provides a printed circuit board having improved heat dissipation efficiency, a method of manufacturing the same, a light emitting device package, a light emitting device, and an illumination system.

The printed circuit board according to the embodiment includes a base; An insulating member partially formed on the base to partially expose the base; And a conductive layer partially formed on the insulating member to partially expose the base and the insulating member, wherein the conductive layer includes a first conductive layer and a second conductive layer electrically separated from each other.

The light emitting device package according to the embodiment includes a body; A first lead frame, a second lead frame, and a third lead frame installed on the body and electrically separated from each other; A light emitting element on the third lead frame; And a wire electrically connecting the light emitting element to the first lead frame and the second lead frame, wherein the third lead frame protrudes downward from the lower surface of the body.

The light emitting device according to the embodiment includes a printed circuit board; And a light emitting device package installed on the printed circuit board, wherein the printed circuit board includes a base, an insulating member partially formed on the base such that the base is partially exposed, and the base and the insulating member are partially exposed. And a conductive layer formed partially on the insulating member, wherein the conductive layer includes a first conductive layer and a second conductive layer electrically separated from each other, and the light emitting device package is installed on the body and the body. A first lead frame, a second lead frame, a third lead frame electrically separated from each other, and a light emitting element on the third lead frame, and electrically connecting the light emitting element to the first lead frame and the second lead frame The first lead frame is electrically connected to the first conductive layer, and the second lead frame is formed of the first lead frame. The third lead frame is electrically connected to the second conductive layer, and the third lead frame is electrically separated from the first lead frame and the second lead frame, and the third lead frame is closer to the base than the lower surface of the body.

An illumination system according to an embodiment includes an illumination system using a light emitting element as a light source, wherein the illumination system comprises the light emitting device according to any one of claims 8 to 15.

The method of manufacturing a printed circuit board according to the embodiment may include preparing a base; Preparing an insulating member having an opening formed therein; Preparing a conductive layer; Coupling the base, the insulating member, and the conductive layer with the insulating member interposed therebetween; And selectively removing the conductive layer to separate the conductive layer into at least a first conductive layer and a second conductive layer, wherein the portion corresponding to the opening is removed to expose the base.

The embodiment can provide a printed circuit board having a new structure, a method of manufacturing the same, a light emitting device package, a light emitting device, and a lighting system.

The embodiment can provide a printed circuit board having improved heat dissipation efficiency, a method of manufacturing the same, a light emitting device package, a light emitting device, and a lighting system.

1 illustrates a light emitting device according to an embodiment;
2 to 5 illustrate a printed circuit board and a method of manufacturing the same according to the embodiment.
6 and 7 are a perspective view and a side view of a light emitting device package according to the embodiment.
8 illustrates a backlight unit using a light emitting device package or a light emitting device according to an embodiment.
9 is a perspective view of a lighting unit using a light emitting device including a light emitting device package and a printed circuit board according to the embodiment.

Hereinafter, a printed circuit board and a manufacturing method thereof according to an embodiment will be described in detail with reference to the accompanying drawings. In the description of an embodiment, each layer (film), region, pattern, or structure is formed “on” or “under” a substrate, each layer (film), region, pad, or pattern. In the case where it is described as "to", "on" and "under" include both "directly" or "indirectly" formed. Also, the criteria for top, bottom, or bottom of each layer will be described with reference to the drawings. In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. In addition, the size of each component does not necessarily reflect the actual size.

1 is a view illustrating a light emitting device according to an embodiment.

Referring to FIG. 1, the light emitting device 300 includes a printed circuit board 100 and a light emitting device package 200 installed on the printed circuit board 100.

The printed circuit board 100 includes a base 10, an insulating member 20 on the base 10, and a conductive layer 30 on the insulating member 20.

The base 10 is formed of a metal material, and thus has excellent heat dissipation and is easy to process. For example, the base 10 may be formed of a metal or an alloy including copper or aluminum, but is not limited thereto.

The insulating member 20 may be formed of a resin material and may include an inorganic filler having high thermal conductivity. For example, the insulating member 20 may include at least one of a polyester resin, an epoxy resin, a diaryl phthalate resin, a phenol resin, and a melamine resin, but is not limited thereto.

The conductive layer 30 may be formed of a metal material having excellent electrical conductivity. For example, the conductive layer 30 may be formed of a copper foil layer including copper.

In the embodiment, the insulating member 20 and the conductive layer 30 are selectively removed so that the base 10 is exposed upward.

The light emitting device package 200 is installed on the substrate 100.

6 and 7 are a perspective view and a side view of a light emitting device package according to the embodiment.

1, 6, and 7, the light emitting device package 200 may include a body 50, a first lead frame 81, a second lead frame 82 installed on the body 50, and And a third lead frame 83.

The body 50 may include a cavity 51, and the body 50 may be formed of a resin material such as PPA.

The first lead frame 81 and the second lead frame 82 are formed through the body 50, and one side of the first lead frame 81 and the second lead frame 82 is formed in the cavity ( 51, and the other side of the first lead frame 81 and the second lead frame 82 is disposed outside the body 50. In addition, one side of the third lead frame 83 may be disposed in the cavity 51, and the other side of the third lead frame 82 may be disposed outside the body 50.

The first lead frame 81 and the second lead frame 82 may be disposed at both sides of the third lead frame 83. The first lead frame 81, the second lead frame 82, and the third lead frame 83 are electrically separated from each other.

For example, positive power is applied to the first lead frame 81, negative power is applied to the second lead frame 82, and power is applied to the third lead frame 83. It may not be. That is, the first lead frame 81 and the second lead frame 82 are electrically connected to the conductive layer 30, and the third lead frame 83 is spaced apart from the conductive layer 30 to be electrically connected. Separated by.

The third lead frame 83 is in contact with the base 10 of the printed circuit board 100. The lower surface of the third lead frame 83 is disposed below the lower surface of the body 50. That is, the lower surface of the third lead frame 83 is disposed closer to the base 10 than the lower surface of the body 50. Since the third lead frame 83 protrudes from the body 10 in the direction in which the base 10 is disposed, the third lead frame 83 may be more effectively thermally connected to the base 10. have. Of course, a solder material for adhesion may be formed between the third lead frame 83 and the base 10, and the solder material has better thermal conductivity than the insulating member 20, so that the third Heat from the lead frame 83 can be quickly transferred to the base 10.

In addition, since no power is applied to the third lead frame 83, an electrical short circuit does not occur even when the third lead frame 83 contacts the base 10.

The light emitting device 60 is installed on the third lead frame 83. At least one light emitting device 60 may be provided. For example, the light emitting device 60 may be a light emitting diode emitting at least one of red light, green light, blue light, white light, and UV light. .

The light emitting device 60 generates heat together with light as power is applied from the first lead frame 81 and the second lead frame 82, and the heat generated from the light emitting device 60 is generated by the light source. 3 is transmitted to the base 10 through a lead frame 83. That is, since the third lead frame 83 is thermally connected to the base 10, heat emitted from the light emitting device 60 may be more effectively discharged.

The light emitting device 60 may be electrically connected to the first lead frame 81 and the second lead frame 82 through the first wire 71 and the second wire 72. Portions of the first lead frame 81 and the second lead frame 82 to which the first and second wires 71 and 72 are bonded are the third lead frame 83 to which the light emitting device 60 is installed. The first and second wires 71 and 72 are easily connected because they are disposed at a position higher than that of the first and second wires 71 and 72.

An encapsulation layer 90 surrounding the light emitting device 60 may be formed on the body 50. The encapsulation layer 90 may be formed of a silicone resin or an epoxy resin, or may include a phosphor. The encapsulation layer 90 serves to protect the light emitting device 60 and the first and second wires 71 and 72, and phosphors included in the encapsulation layer 90 are emitted from the light emitting device 60. Convert the wavelength of light.

2 to 5 illustrate a printed circuit board and a method of manufacturing the same according to an embodiment.

2 and 3, the base 10, the insulating member 20, and the conductive layer 30 are prepared. Openings 20a and 30a are formed in the insulating member 20 and the conductive layer 30 in the region where the light emitting device 60 is installed.

As shown in FIG. 4, heat and pressure are applied to the base 10, the insulating member 20, and the conductive layer 30. That is, the base 10, the insulating member 20, and the conductive layer 30 may be combined by being impregnated at high temperature and high pressure.

As shown in FIG. 5, the conductive layer 30 is selectively removed to be separated into the first conductive layer 31 and the second conductive layer 32. The first conductive layer 31 and the second conductive layer 32 serve as circuit patterns on the insulating member 20. In the exemplary embodiment, the conductive layer 30 is electrically separated into the first conductive layer 31 and the second conductive layer 32, but the conductive layer 30 may be formed of three or more conductive layers. It is also possible to separate.

In the printed circuit board according to the embodiment, the insulating member 20 may be selectively formed on the base 10, and the conductive layer 30 may be selectively formed on the insulating member 20. That is, at least a portion of the base 10 may be exposed upward, and at least a portion of the conductive layer 30 may be exposed upward.

In the embodiment, the conductive layer 30 is illustrated that the opening (30a) is formed before the coupling with the insulating member 20, the conductive layer 30 is coupled to the insulating member 20 and then the opening ( 30a may be formed, and the opening 30a may be formed in a process of separating the conductive layer 30 into the first conductive layer 31 and the second conductive layer 32.

In addition, the insulating member 20 may be formed in a film form by printing a liquid insulating material on the base (10).

The conductive layer 30 is formed of a metal material and can be easily removed by etching, but the insulating member 20 is not easily removed by etching. Therefore, in the embodiment, the insulating member 20 has an opening 20a so that the base 10 can be exposed even if only the conductive layer 30 is removed.

The printed circuit board 100 and the method of manufacturing the same according to an embodiment may include the insulating member so that the base 10 may be in direct contact with a component installed on the printed circuit board 100 to improve heat dissipation efficiency. 20) is removed. Since the insulating member 20 has a low thermal conductivity, the heat dissipation efficiency may be increased than when the insulating member 20 is removed and the base 10 is exposed.

As described above, the printed circuit board 100 according to the embodiment may be formed on the insulating member 20 so that the third lead frame 83 of the light emitting device package 200 may contact the base 10. The opening 20a is provided.

In addition, in the light emitting device 300 according to the embodiment, a plurality of light emitting device packages 200 may be arrayed on the printed circuit board 100, and the optical light emitting device 300 may be provided on an optical path emitted from the light emitting device package 200. A light guide plate, a prism sheet, a diffusion sheet, a fluorescent sheet, and the like, which are members, may be disposed. The light emitting device package 200, the printed circuit board 100, and the optical member may function as a backlight unit. Another embodiment may be implemented as a lighting unit including the light emitting device package 200 described in the above-described embodiment, for example, the lighting unit may include a display device, an indicator device, a lamp, a street lamp.

8 illustrates a backlight unit using the light emitting device package 200 or the light emitting device 300 according to an exemplary embodiment. However, the backlight unit 1100 of FIG. 8 is an example of a lighting system, but is not limited thereto.

Referring to FIG. 8, the backlight unit 1100 may include a bottom cover 1140, an optical guide member 1120 disposed in the bottom cover 1140, and at least one side or bottom surface of the optical guide member 1120. It may include a light emitting module 1110 disposed in. In addition, a reflective sheet 1130 may be disposed under the light guide member 1120.

The bottom cover 1140 may be formed by forming a box having an upper surface open to accommodate the light guide member 1120, the light emitting module 1110, and the reflective sheet 1130. Or it may be formed of a resin material but is not limited thereto.

The light emitting module 1110 may include a printed circuit board 100 according to an embodiment and a light emitting device package 200 according to an embodiment mounted on the printed circuit board 100. The light emitting device package 200 may provide light to the light guide member 1120.

As shown, the light emitting module 1110 may be disposed on at least one of the inner side surfaces of the bottom cover 1140, thereby providing light toward at least one side of the light guide member 1120. have.

However, the light emitting module 1110 may be disposed under the bottom cover 1140 to provide light toward the bottom surface of the light guide member 1120, which is according to the design of the backlight unit 1100. Since various modifications are possible, the present invention is not limited thereto.

The light guide member 1120 may be disposed in the bottom cover 1140. The light guide member 1120 may guide the light provided from the light emitting module 1110 to a display panel by surface light source.

The light guide member 1120 may be, for example, a light guide panel (LGP). The light guide plate may be formed of, for example, one of an acrylic resin series such as polymethyl metaacrylate (PMMA), polyethylene terephthlate (PET), polycarbonate (PC), COC, and polyethylene naphthalate (PEN) resin.

The optical sheet 1150 may be disposed above the light guide member 1120.

The optical sheet 1150 may include at least one of, for example, a diffusion sheet, a light collecting sheet, a luminance rising sheet, and a fluorescent sheet. For example, the optical sheet 1150 may be formed by stacking the diffusion sheet, the light collecting sheet, the luminance increasing sheet, and the fluorescent sheet. In this case, the diffusion sheet 1150 may evenly diffuse the light emitted from the light emitting module 1110, and the diffused light may be focused onto a display panel (not shown) by the light collecting sheet. In this case, the light emitted from the light collecting sheet is randomly polarized light, and the luminance increasing sheet may increase the degree of polarization of the light emitted from the light collecting sheet. The light collecting sheet may be, for example, a horizontal or / and vertical prism sheet. In addition, the luminance increase sheet may be, for example, a roughness enhancement film. In addition, the fluorescent sheet may be a translucent plate or film containing a phosphor.

The reflective sheet 1130 may be disposed below the light guide member 1120. The reflective sheet 1130 may reflect light emitted through the bottom surface of the light guide member 1120 toward the exit surface of the light guide member 1120.

The reflective sheet 1130 may be formed of a resin material having good reflectance, for example, PET, PC, PVC resin, etc., but is not limited thereto.

9 is a perspective view of an illumination unit 1200 using a light emitting device 300 including a light emitting device package 200 and a printed circuit board 100 according to an embodiment. However, the lighting unit 1200 of FIG. 9 is an example of a lighting system, but is not limited thereto.

Referring to FIG. 9, the lighting unit 1200 is installed in the case body 1210, the light emitting device 300 installed in the case body 1210, and the case body 1210, and provides power from an external power source. It may include a receiving connection terminal 1220.

The case body 1210 is preferably formed of a material having good heat dissipation characteristics, for example, may be formed of a metal material or a resin material.

The light emitting device 300 may include a printed circuit board 100 and a bar light emitting device package 200 mounted on the printed circuit board 100.

In addition, the printed circuit board 100 may be formed of a material that reflects light efficiently, or the surface may be formed of a color that reflects light efficiently, for example, white, silver, or the like.

The light emitting device 300 may be arranged to have a combination of various light emitting devices to obtain color and luminance. For example, a white light emitting diode, a red light emitting diode, and a green light emitting diode may be combined to secure high color rendering (CRI). In addition, a fluorescent sheet may be further disposed on a path of the light emitted from the light emitting device 300, and the fluorescent sheet changes the wavelength of light emitted from the light emitting device 300. For example, when the light emitted from the light emitting device 300 has a blue wavelength band, the fluorescent sheet may include a yellow phosphor, and the light emitted from the light emitting device 300 finally passes white light through the fluorescent sheet. Will be shown.

The connection terminal 1220 may be electrically connected to the light emitting device 300 to supply power. According to FIG. 9, the connection terminal 1220 is inserted into and coupled to an external power source in a socket manner, but is not limited thereto. For example, the connection terminal 1220 may be formed in a pin shape and inserted into an external power source, or may be connected to the external power source by a wire.

Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in each embodiment may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

In addition, the above description has been made with reference to the embodiment, which is merely an example, and is not intended to limit the present invention. Those skilled in the art to which the present invention pertains will be illustrated as above without departing from the essential characteristics of the present embodiment. It will be appreciated that various modifications and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

10: base, 20: insulating member, 30: conductive layer, 31: first conductive layer, 32: second conductive layer, 50: body, 51: cavity, 60: light emitting element, 71: first wire, 72: first 2 wire, 81: first lead frame, 82: second lead frame, 83: third lead frame, 90: encapsulation layer, 100: printed circuit board, 200: light emitting device package, 300: light emitting device, 1100: backlight unit 1110: light emitting module, 1120: optical guide member, 1130: reflective sheet, 1140: bottom cover, 1150: optical sheet, 1200: lighting unit, 1210: case body, 1220: connection terminal

Claims (20)

Base;
An insulating member partially formed on the base to partially expose the base; And
A conductive layer partially formed on the insulating member to partially expose the base and the insulating member,
The conductive layer includes a first conductive layer and a second conductive layer electrically separated from each other. The method of claim 1,
The base is a printed circuit board containing a metal material. The method of claim 1,
The base is a printed circuit board containing copper or aluminum. Body;
A first lead frame, a second lead frame, and a third lead frame installed on the body and electrically separated from each other;
A light emitting element on the third lead frame; And
A wire electrically connecting the light emitting element to the first lead frame and the second lead frame;
The third lead frame is a light emitting device package protruding downward from the lower surface of the body. The method of claim 4, wherein
The light emitting device package further comprises an encapsulation layer surrounding the light emitting device on the body. 6. The method of claim 5,
The encapsulation layer is a light emitting device package comprising a phosphor. The method of claim 4, wherein
The body includes a cavity, one side of the first lead frame and the second lead frame is disposed in the cavity and the other side of the first lead frame and the second lead frame is disposed on the outside of the body. Printed circuit board; And
A light emitting device package installed on the printed circuit board;
The printed circuit board includes a base, an insulating member partially formed on the base to partially expose the base, and a conductive layer partially formed on the insulating member to partially expose the base and the insulating member. The conductive layer includes a first conductive layer and a second conductive layer electrically separated from each other,
The light emitting device package includes a body, a first lead frame, a second lead frame, a third lead frame installed on the body and electrically separated from each other, a light emitting device on the third lead frame, the light emitting device, and the A wire electrically connecting the first lead frame and the second lead frame,
The first lead frame is electrically connected to the first conductive layer, the second lead frame is electrically connected to the second conductive layer, and the third lead frame is the first lead frame and the second lead frame. Electrically isolated from
The third lead frame is closer to the base than the lower surface of the body. The method of claim 8,
The base is a light emitting device comprising a metal material. The method of claim 8,
And the base comprises copper or aluminum. The method of claim 8,
And a sealing layer surrounding the light emitting element on the body. 12. The method of claim 11,
The encapsulation layer includes a phosphor. The method of claim 8,
The body includes a cavity, one side of the first lead frame and the second lead frame is disposed in the cavity and electrically connected to the light emitting element, the other side of the first lead frame and the second lead frame is the body The light emitting device disposed outside of the light emitting diode is electrically connected to the first conductive layer and the second conductive layer. The method of claim 8,
And the third lead frame is in contact with the base. The method of claim 8,
And the third lead frame is bonded to the base by soldering. In a lighting system using a light emitting element as a light source,
The lighting system comprises a light emitting device according to any one of claims 8 to 15. 17. The method of claim 16,
And at least one of a diffusion sheet, a light collecting sheet, a luminance rising sheet, and a fluorescent sheet is disposed on a path of light emitted from the light emitting device. Preparing a base;
Preparing an insulating member having an opening formed therein;
Preparing a conductive layer;
Coupling the base, the insulating member, and the conductive layer with the insulating member interposed therebetween; And
Selectively removing the conductive layer to separate at least a first conductive layer and a second conductive layer,
The conductive layer is a method of manufacturing a printed circuit board to remove the portion corresponding to the opening to expose the base. 19. The method of claim 18,
The base, the insulating member, and the conductive layer is impregnated bonded to the printed circuit board manufacturing method. 19. The method of claim 18,
The conductive layer is coupled to the insulating member and the base in a state in which an opening corresponding to the opening of the insulating member is formed.
KR1020100026884A 2010-03-25 2010-03-25 Printed circuit board and menufacturing the same, light emitting device package, light emitting appratus, and lighting system KR20110107637A (en)

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Application Number Priority Date Filing Date Title
KR1020100026884A KR20110107637A (en) 2010-03-25 2010-03-25 Printed circuit board and menufacturing the same, light emitting device package, light emitting appratus, and lighting system

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Application Number Priority Date Filing Date Title
KR1020100026884A KR20110107637A (en) 2010-03-25 2010-03-25 Printed circuit board and menufacturing the same, light emitting device package, light emitting appratus, and lighting system

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101338567B1 (en) * 2011-12-30 2013-12-06 루미마이크로 주식회사 Light emitting diode package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101338567B1 (en) * 2011-12-30 2013-12-06 루미마이크로 주식회사 Light emitting diode package

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