KR20130014262A

KR20130014262A - Light emitting device and light unit having thereof

Info

Publication number: KR20130014262A
Application number: KR1020110076269A
Authority: KR
Inventors: 김재욱
Original assignee: 엘지이노텍 주식회사
Priority date: 2011-07-29
Filing date: 2011-07-29
Publication date: 2013-02-07

Abstract

The light emitting device according to the embodiment, the body; A plurality of lead frames on the body; A light emitting chip on at least one of the plurality of lead frames; And a molding member covering the light emitting chip, wherein the upper surface of the molding member includes a first concave-convex pattern in which recesses and convex portions are arranged to form a surface tension of moisture.

Description

LIGHT EMITTING DEVICE AND LIGHT UNIT HAVING THEREOF

The present invention relates to a light emitting device and a light unit having the same.

A light emitting device, such as a light emitting device, is a kind of semiconductor device that converts electrical energy into light, and has been spotlighted as a next-generation light source by replacing a conventional fluorescent lamp and an incandescent lamp.

Since the light emitting diode generates light by using a semiconductor element, the light emitting diode consumes very low power as compared with an incandescent lamp that generates light by heating tungsten, or a fluorescent lamp that generates ultraviolet light by impinging ultraviolet rays generated through high-pressure discharge on a phosphor .

In addition, since the light emitting diode generates light using the potential gap of the semiconductor device, it has a longer lifetime, faster response characteristics, and an environment-friendly characteristic as compared with the conventional light source.

Accordingly, much research has been conducted to replace an existing light source with a light emitting diode, and a light emitting diode is increasingly used as a light source for various lamps used for indoor and outdoor use, lighting devices such as a liquid crystal display, an electric signboard, and a streetlight.

The embodiment provides a light emitting device having a concave-convex pattern for preventing moisture from penetrating the surface of the molding member covering the light emitting chip.

The embodiment provides a light emitting device for preventing the penetration of moisture through the surface of the molding member by forming a size of the uneven pattern formed on the surface of the molding member to a micrometer or less.

The embodiment provides a light emitting device for preventing the penetration of moisture through the surface of the lens by forming a concave-convex pattern on the surface of the lens to a size of less than the micrometer (μm) or nanometer (nm).

The light emitting device according to the embodiment, the body; A plurality of lead frames on the body; A light emitting chip on at least one of the plurality of lead frames; A molding member covering the light emitting chip; And a first concave-convex pattern on which the concave portion and the convex portion are arranged such that a surface tension of water may be formed on the upper surface of at least one of the molding member and the lens.

According to the embodiment, the hydrophobicity is increased by the uneven pattern of the surface of the molding member disposed in the light emitting region of the light emitting chip, thereby preventing the penetration of moisture or foreign matter.

According to the embodiment, the hydrophobicity is increased by the concave-convex pattern on the surface of the lens disposed in the light emitting region of the light emitting chip, thereby preventing the penetration of moisture or foreign matter.

The embodiment provides a light emitting device resistant to moisture.

The embodiment can improve the reliability of the light emitting chip.

The embodiment can improve the reliability of the light emitting device and the light unit having the same.

1 is a side cross-sectional view of a light emitting device according to the first embodiment.
FIG. 2 is a diagram illustrating an example of preventing water penetration from the surface of the molding member of FIG. 1.
3 is a side cross-sectional view of a light emitting device according to a second embodiment.
4 is a side cross-sectional view of a light emitting device according to a third embodiment.
FIG. 5 is a diagram illustrating an example of preventing water penetration from a surface of a molding member of the light emitting device of FIG. 4.
6 is a side sectional view of the light emitting device according to the fourth embodiment.
7 is a side sectional view of the light emitting device according to the fifth embodiment.
8 is a plan view illustrating another example of the light emitting device of FIG. 1.
9 is a perspective view illustrating a display device including the light emitting device of FIG. 1.
10 is a side cross-sectional view illustrating another example of the display device including the light emitting device of FIG. 1.
FIG. 11 is a perspective view illustrating a lighting device including the light emitting device of FIG. 1.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other features and advantages of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. In the description of the embodiments, it is to be understood that each layer (film), region, pattern or structure is formed "on" or "under" a substrate, each layer The terms " on "and " under " encompass both being formed" directly "or" indirectly " In addition, the criteria for above or below each layer will be described with reference to the drawings.

In the drawings, sizes are exaggerated, omitted, or schematically illustrated for convenience and clarity of description. Also, the size of each component does not entirely reflect the actual size. Like reference numerals denote like elements throughout the description of the drawings. Hereinafter, a light emitting device according to an embodiment will be described with reference to the accompanying drawings.

1 is a side cross-sectional view of a light emitting device according to the first embodiment.

Referring to FIG. 1, the light emitting device 11 may include a body 31, a cavity 35 having an upper portion of the body 31 open, a plurality of lead frames 21 and 23 disposed in the cavity 35, The light emitting chip 41 disposed on any one of the plurality of lead frames 21 and 23, the molding member 51 on the cavity 35, and the first uneven pattern 55 on the upper surface of the molding member 51. It includes.

The body 31 is made of a resin material such as polyphthalamide (PPA), silicon (Si), epoxy, metal, photo sensitive glass (PSG), sapphire (Al ₂ O ₃ ), printed circuit board (PCB) It may be formed of at least one of.

The body 31 may be formed of a conductive material. When the body 31 is made of an electrically conductive material, an insulating film (not shown) may be formed on the surface of the body 31, and the insulating film is electrically connected to the body 31 and the lead frames 21 and 23. Shorting can be prevented. The circumferential shape of the body 31 as viewed from above may have various shapes such as triangle, square, polygon, and circle depending on the use and design of the light emitting device 11.

The cavity 35 has an upper portion of the body 31 open, and the upper portion of the open cavity 35 is an area where light is emitted.

The cavity 35 has a cup shape or a recess shape that is concave in the center area of the upper surface of the body 31. The first lead frame 21 and the second lead frame 23 are disposed to be spaced apart from each other at the bottom of the cavity 35, and a reflective layer may be further formed at the side portion 33 for reflection efficiency. The side part 33 of the cavity 35 may be inclined or perpendicular to the bottom surface of the body 31.

The plurality of lead frames 21 and 23 may include two or more metal frames that are physically separated, for example, a first lead frame 21 and a second lead frame 23. The first lead frame 21 may be disposed below one side surface of the cavity 35 and the body 31, and the second lead frame 23 may be disposed in the cavity 35 and the body 31. May be placed underneath the other side. Lower surfaces of the first and second lead frames 21 and 23 disposed on the bottom of the cavity 35 may be disposed on the same plane as the lower surface of the body 31 or may be disposed from the lower surface of the body 31. It may be spaced apart. The thicknesses of the first and second lead frames 21 and 23 may be formed to have the same thickness, but are not limited thereto.

Between the first lead frame 21 and the second lead frame 23 is separated by a separator 32, the separator 32 is the same material as the body 31, or may be formed of an insulating material Can be.

The light emitting chip 41 may selectively emit light in the wavelength range of the ultraviolet band to the visible light band. The light emitting device 41 may include at least one of an LED chip using a group III-V compound semiconductor, for example, a UV (Ultraviolet) LED chip, a blue LED chip, a green LED chip, a white LED chip, and a red LED chip. .

The light emitting chip 41 may be mounted on the first lead frame 21 and may be connected to the second lead frame 23 by a wire 42. As another example, the light emitting chip 41 may be die bonded on the first lead frame 21 or flip bonded on the first and second lead frames 21 and 23, but is not limited thereto. .

A molding member 51 is disposed in the cavity 35, and the molding member 51 includes a light transmissive resin material such as silicon or epoxy. The molding member 51 may be formed in a single layer or multiple layers in the cavity 35.

The molding member 51 may include a phosphor for changing a wavelength of light emitted from the light emitting chip 41, and the phosphor excites a part of the light emitted from the light emitting devices 41 to generate a different wavelength. It will emit light. The phosphor may be selectively formed from YAG, TAG, Silicate, Nitride, and Oxy-nitride based materials. The phosphor may include at least one of a red phosphor, a yellow phosphor, and a green phosphor, but the present invention is not limited thereto.

The molding member 51 may contact the top surfaces of the lead frames 21 and 23 disposed on the bottom of the cavity 35 and may contact the side surface 33 of the cavity 35. The upper surface of the molding member 51 may be a light exit surface. The upper surface of the molding member 51 may be flat, but a central portion thereof may be concave in the direction of the light emitting chip 41 or may be convex with respect to the light emitting chip 41, but is not limited thereto.

The light emitting device 11 may further include a protection device, and the protection device may electrically protect the light emitting chip 41 and selectively include a zener diode, a thyristor, or a transient voltage suppression (TVS) diode. Can be.

The molding member 51 includes first uneven patterns 55: 52 and 53 on an upper surface thereof. The first uneven pattern 55 may include a convex portion 52 and a concave portion 53, and the convex portion 52 and the concave portion 53 may be alternately formed. The convex portion 52 may be defined as a convex portion or a protrusion, and the recessed portion 53 may be defined as a concave portion or a groove portion. The recessed portion 53 of the first uneven pattern 55 has a concave structure in the direction of the light emitting chip 41, and the convex portion 52 is convex in a direction opposite to the direction of the light emitting chip 41. The convex portions 52 of the first concave-convex pattern 55 are disposed between the concave portions 53. In the upper region of the molding member 35, the convex portions 52 may be arranged in a matrix or lattice shape, or conversely, the recesses 53 may be arranged in a matrix or lattice shape.

The method of manufacturing the first uneven pattern 55 may be formed by an etching method or a compression method, for example, photolithography, plasma etching, chemical wet etching, pulsed laser treatment, and thermal annealing. It may be formed by at least one of annealing and compression molding.

The first uneven pattern 55 may be formed to a size of a micrometer (㎛). The convex portion 52 of the first concave-convex pattern 55 is formed with a width W1 of 1 μm to 100 μm, and the width of the concave portion 53 ranges from 0.1 times to 10 times the width of the convex portion 52. It may be formed as, for example, may be in the range of 0.1㎛ ~ 1000㎛, may be formed as 0.1㎛ ~ 100㎛ as another example. The period T1 of the convex portions 52 of the first uneven pattern 55 may be formed in a range of 1 μm to 1000 μm, and the period may be constant or irregular, but is not limited thereto.

The depth of the recess 53 of the first uneven pattern 55 may be constant or random, but is not limited thereto.

1 and 2, the convex portion 53 of the first concave-convex pattern 55 is formed to a size of a micrometer, thereby further increasing the hydrophobicity of the molding member 51. As shown in FIG. 2, the permeation of moisture 5 and various contaminants can be prevented. The moisture 5 may be formed in a circle by the surface tension with the first uneven pattern 55, but is not limited thereto.

In addition, the convex portion 52 and the concave portion 53 of the first concave-convex pattern 55 may have the same width W1 or different widths. Here, the convex portion 52 width W1 may be formed to a size smaller than or equal to the concave portion 53 width, and in this case, water 5, pollutants accompanying water, or fluids other than water. Contaminants can be prevented from being transmitted by the spacing of the iron portions.

The surface tension of the moisture is, for example, about 0.07275 N / m (Newton per meter) at 20 ° C., and the surface tension value decreases with increasing temperature. The moisture has a surface energy that is proportional to the surface area, and the action of minimizing this energy appears as surface tension. Since N / m, which is a unit of the surface tension, is a value divided by a length rather than a force, the surface tension of water in the first uneven pattern 55 is a phenomenon generated when energy exists due to a change in contact surface. It can be produced by the action of lowesting surface energy per unit area. Accordingly, the first concave-convex pattern 55 of the molding member 51 provides a contact surface to minimize the surface energy of the moisture, thereby effectively inhibiting the penetration of moisture from the upper surface of the molding member 51. There is.

The convex portion 52 may have a polyhedron shape or a hemispherical shape, and may include a polygonal or circular shape when viewed from above.

The first concave-convex pattern 55 formed on the upper surface of the molding member 51 according to the embodiment has a size for enhancing hydrophobicity or a surface tension of moisture, and on the upper surface of the first concave-convex pattern 55, moisture ( By lowering affinity and bonding strength with 5), it is possible to effectively prevent water penetration. By preventing the moisture penetrating through the molding member 51, the problem that the discoloration of the molding member 51 and the extraction efficiency of light due to foreign matters can be reduced, and the reflectivity of the lead frames 21 and 23 is reduced. Can be prevented, a portion of the light emitting chip 41 can be prevented from being deteriorated, and a degradation of the performance of the phosphor can be prevented. Accordingly, the reliability of the light emitting element 11 can be improved.

3 is a second embodiment, and the same components as in the first embodiment will be denoted by the same reference numerals and redundant description thereof will be omitted.

Referring to FIG. 3, the molding member 61 of the light emitting device 12 includes a second uneven pattern 65 having a nanometer size on an upper surface thereof. The second concave-convex pattern 65 of the molding member 61 is formed with convex portions 62 having a size smaller than the size of the micrometer (μm), thereby effectively preventing the penetration of moisture through the surface of the molding member 61. have.

The convex portion 62 of the second concave-convex pattern 65 has a width W2 of 10 nm to 400 nm, and the interval between the convex portions 62, that is, the width of the concave portion 63, is the convex portion 62 width W2. It can be formed about 1 to 10 times. The recess 63 may have a width of 10 nm to 4000 nm, and as another example, 10 nm to 1000 nm. The convex portion 62 of the second concave-convex pattern 65 may be formed in a matrix or lattice shape in the region of the concave portion 63, and conversely, the convex portion 63 may be matrixed in the region of the convex portion 62. Or it may be formed in a grid shape. The period of the convex portions 62 of the second concave-convex pattern 65 may range from 1 nm to 1000 nm, and may be constant or irregular. The depth of the second uneven pattern 65 may be constant or random.

As the surface tension of the moisture is changed on the upper surface of the molding member 61 by the second uneven pattern 65, penetration of moisture through the upper surface of the molding member 61 may be suppressed. In addition, the second uneven pattern 65 having a size less than or equal to nanometers may block contaminants that penetrate, such as moisture, thereby improving reliability of the light emitting device 65. Here, the manufacturing method of the second uneven pattern 65 of the molding member 61 may selectively use the manufacturing method of the first embodiment, but is not limited thereto.

4 is a third embodiment.

Referring to FIG. 4, the molding member 71 of the light emitting device 13 includes a first uneven pattern 75 and a second uneven pattern 78 at the convex portion 72 of the first uneven pattern 75. . The first uneven pattern 75 includes a convex portion 72 having a size of a micrometer (μm), and the second uneven pattern 78 has a smaller size than the convex portion 72 of the first uneven pattern 78. For example, it includes a convex portion 76 having a size of nanometer (nm).

The convex portion 72 of the first concave-convex pattern 75 is formed to have a width of 1 μm to 100 μm, and the width of the concave portion 73 is 0.1 to the width of the convex portion 72 of the first concave-convex pattern 75. It may be formed to a size of 10 times to 10 times, for example, it may be in the range of 0.1㎛ ~ 1000㎛, may be formed in another example 0.1㎛ ~ 100㎛.

The width of the convex portion 76 of the second concave-convex pattern 78 is 10 to 400 nm, and the interval between the convex portions 76 of the second concave-convex pattern 78, that is, the width of the concave portion 77 is the convex portion 76. ) Can be formed about 1 to 10 times the width. The width of the recess 77 may be formed as 10 ~ 4000nm, as another example may be formed in 10 ~ 1000nm.

In the first uneven pattern 75, the convex portion 72 may be formed in a matrix or lattice shape in the region of the concave portion 73, and conversely, the concave portion 73 may be matrixed in the region of the concave portion 72. Or it may be formed in a grid shape.

Periods of the convex portions 72 of the first uneven pattern 55 may be formed in a range of 1 to 1000 μm, and the period may be constant or irregular, but is not limited thereto.

The periods of the convex portions 76 of the second uneven pattern 78 may be formed in a range of 1 nm to 1000 nm, and the period may be constant or irregular, but is not limited thereto.

The convex portions 76 of the second concave-convex pattern 78 may be formed in a dot matrix shape or a stripe shape in the convex portion 72 of the first concave-convex pattern 75. At least two convex portions 76 of the second concave-convex pattern 78 may be disposed on each convex portion 72 of the first concave-convex pattern 75.

As shown in FIG. 5, the surface tension of the water is changed and the hydrophobicity is further increased by the first uneven pattern 75 and the second uneven pattern 78 disposed on the upper surface of the molding member 71, so that the first or second Infiltration of moisture 5 can be further suppressed compared to the embodiment.

The light emitting chip 41A may be connected to the first lead frame 21 and the second lead frame 23 by wires 42, respectively.

6 is a third embodiment.

Referring to FIG. 6, the light emitting device 14 further includes a lens 91 on the molding member 81. The lens 91 may be formed in a convex hemispherical shape, or may have a hemispherical shape having a concave portion in which a region corresponding to the light emitting chip 41 is concave. The lens 91 includes a third uneven pattern 95 on the surface thereof.

The lens 91 may be a resin material such as silicon or epoxy, or may be a glass material, but is not limited thereto.

The lower surface 81A of the lens 91 may be disposed to have a larger area than the upper surface area of the molding member 81, and may contact the upper surface of the body 31.

The third uneven pattern 95 may have a size of a micrometer. The convex portion 92 of the third concave-convex pattern 95 is formed to have a width of, for example, 1 μm to 100 μm, and the width of the concave portion 93 is 0.1 to 10 times the size of the width of the convex portion 92. It may be formed as, for example, may be in the range of 0.1㎛ ~ 1000㎛, may be formed as 0.1㎛ ~ 100㎛ as another example.

As another example, the third concave-convex pattern 95 may have a size of nanometers. The convex portion 92 of the third concave-convex pattern 95 has a width of 10 nm to 400 nm, and an interval between the convex portions 92, that is, the width of the concave portion 93 is 1 to 10 times the width of the convex portion 92. Can be formed to a degree. The recess 93 may have a width of 10 nm to 4000 nm, and as another example, 10 to 1000 nm.

By forming the third uneven pattern 95 on the surface of the lens 91, which is the surface of the light emitting element 14, surface tension of the moisture is generated by the third uneven pattern 95, thereby preventing the penetration of moisture. Can be.

As another example, the same concave-convex pattern as the first to third embodiments may be further disposed on the upper surface of the molding member, but is not limited thereto.

7 is a side sectional view showing a light emitting device according to the fourth embodiment.

Referring to FIG. 7, the light emitting device has cup structures 22A and 24A formed on a plurality of lead frames 22 and 24, and light emitting chips 45 and 46 are mounted in the cup structures 22A and 24A. to be. The plurality of lead frames 22 and 24 include cup structures 22A and 24A having concave shapes, and light emitting chips 45 and 46 are mounted on the cup structures 22A and 24A, respectively.

Lower surfaces of the lead frames 22 and 24 may be disposed on substantially the same plane as the lower surface of the body 31 and may be solder bonded surfaces. The plurality of lead frames 22 and 24 may be exposed to the lower portion to effectively dissipate heat transferred from the light emitting chips 45 and 46.

The cavity 35 of the body 31 and the cup structures 22A and 24A of the lead frames 22 and 24 are connected to each other, and a molding member 101 is formed therein. Here, the cavity 25 includes a stepped structure on the body 31, but is not limited thereto. A fourth uneven pattern 105 may be formed on the surface of the molding member 101. The fourth concave-convex pattern 105 may include the micrometer-sized convex portion 102 or the nanometer-sized convex portion 102 disclosed in the above embodiment, and the concave portions 103 may be interposed between the convex portions 102. Can be arranged.

8 is a plan view of a light emitting device according to a fifth embodiment.

Referring to FIG. 8, the light emitting device includes a fifth uneven pattern 115 in the second area A2 of the upper surface area of the molding member 111. An upper surface area of the molding member 111 may have a polygonal shape or a shape having a predetermined curvature when viewed from above, but is not limited thereto.

An upper surface area of the molding member 111 includes a first area A1 and a second area A2, and the first area A1 is an inner area of the second area A2, and the second area A2. The area A2 is an area between the first area A1 and the body 31 and is closer to the upper surface of the body 31 than the first area A1. The fifth uneven pattern 115 is formed in the second area A2, and the surface tension of the moisture is generated by the fifth uneven pattern 115, and thus, the molding member is formed along the upper surface of the body 31. Infiltration of moisture introduced through the upper surface of 111) can be suppressed.

The second area A2 is formed along the circumference of the body 31 and may include a loop shape, a frame shape, or a ring shape, but is not limited thereto.

In the fifth uneven pattern 115 of the second region A2, a plurality of convex portions 112 are arranged in a lattice shape in the region of the concave portion 113. The size of the convex portion 112 of the fifth uneven pattern 115 may be the size of the micrometer disclosed in the above embodiment or the size of the nanometer.

The light emitting device forms a fifth uneven pattern 115 in a region vulnerable to moisture infiltration in the upper region of the molding member 111, and thus, the moisture is penetrated due to the surface tension of the moisture by the fifth uneven pattern 115. It can be suppressed.

In addition, in the upper region of the molding member 111, a central portion of the first region A1 may be disposed higher or lower than the second region A2 based on the light emitting chip 41.

Although the embodiments have been described as having a structure in which the molding member is disposed in the cavity, an uneven pattern may be formed on the surface of the molding member covering the light emitting chip on the substrate without the cavity, and the structure of the molding member is not limited thereto.

The light emitting device according to the embodiment may be applied to a lighting system. The lighting system includes a structure in which a plurality of light emitting elements are arranged, and includes a display device as shown in FIGS. 9 and 10 and a lighting device as shown in FIG. 11, and includes a lighting lamp, a traffic light, a vehicle headlight, an electronic signage lamp, and an indicator lamp. Can be applied to the unit.

9 is an exploded perspective view of a display device according to an exemplary embodiment.

Referring to FIG. 9, the display device 1000 includes a light guide plate 1041, a light emitting module 1031 providing light to the light guide plate 1041, a reflective member 1022 under the light guide plate 1041, and the light guide plate 1041. A bottom cover 1011 that houses an optical sheet 1051 on the light guide plate 1041, a display panel 1061 on the optical sheet 1051, the light guide plate 1041, a light emitting module 1031, and a reflective member 1022. ), But is not limited thereto.

The bottom cover 1011, the reflective sheet 1022, the light guide plate 1041, and the optical sheet 1051 can be defined as a light unit 1050.

The light guide plate 1041 serves to diffuse the light provided from the light emitting module 1031 to make a surface light source. The light guide plate 1041 is made of a transparent material, for example, acrylic resin-based such as polymethyl metaacrylate (PMMA), polyethylene terephthlate (PET), polycarbonate (PC), cycloolefin copolymer (COC), and polyethylene naphthalate (PEN). It may include one of the resins.

The light emitting module 1031 is disposed on at least one side of the light guide plate 1041 to provide light to at least one side of the light guide plate 1041, and ultimately serves as a light source of the display device.

The light emitting module 1031 may include at least one, and may provide light directly or indirectly at one side of the light guide plate 1041. The light emitting module 1031 includes a substrate 1033 and a light emitting element 11 according to any one of the embodiments disclosed above, wherein the light emitting element 11 is arranged on the substrate 1033 at predetermined intervals. Can be. The substrate may be a printed circuit board, but is not limited thereto. In addition, the substrate 1033 may include a metal core PCB (MCPCB, Metal Core PCB), flexible PCB (FPCB, Flexible PCB) and the like, but is not limited thereto. When the light emitting device 11 is mounted on the side surface of the bottom cover 1011 or the heat dissipation plate, the substrate 1033 may be removed. A part of the heat radiation plate may be in contact with the upper surface of the bottom cover 1011. Therefore, heat generated in the light emitting element 11 may be discharged to the bottom cover 1011 via the heat dissipation plate.

The plurality of light emitting devices 11 may be mounted on the substrate 1033 such that an emission surface on which light is emitted is spaced apart from the light guide plate 1041 by a predetermined distance, but is not limited thereto. The light emitting element 11 may directly or indirectly provide light to a light incident portion, which is one side of the light guide plate 1041, but is not limited thereto.

The reflective member 1022 may be disposed under the light guide plate 1041. The reflective member 1022 reflects the light incident on the lower surface of the light guide plate 1041 and supplies the reflected light to the display panel 1061 to improve the brightness of the display panel 1061. The reflective member 1022 may be formed of, for example, PET, PC, or PVC resin, but is not limited thereto. The reflective member 1022 may be an upper surface of the bottom cover 1011, but is not limited thereto.

The bottom cover 1011 may house the light guide plate 1041, the light emitting module 1031, the reflective member 1022, and the like. To this end, the bottom cover 1011 may be provided with a housing portion 1012 having a box-like shape with an opened upper surface, but the present invention is not limited thereto. The bottom cover 1011 may be coupled to a top cover (not shown), but is not limited thereto.

The bottom cover 1011 may be formed of a metal material or a resin material, and may be manufactured using a process such as press molding or extrusion molding. In addition, the bottom cover 1011 may include a metal or a non-metal material having good thermal conductivity, but the present invention is not limited thereto.

The display panel 1061 is, for example, an LCD panel, and includes a first and second substrates of transparent materials facing each other, and a liquid crystal layer interposed between the first and second substrates. A polarizing plate may be attached to at least one surface of the display panel 1061, but the present invention is not limited thereto. The display panel 1061 displays information by transmitting or blocking light provided from the light emitting module 1031. The display device 1000 can be applied to video display devices such as portable terminals, monitors of notebook computers, monitors of laptop computers, and televisions.

The optical sheet 1051 is disposed between the display panel 1061 and the light guide plate 1041 and includes at least one light-transmitting sheet. The optical sheet 1051 may include at least one of a sheet such as a diffusion sheet, a horizontal / vertical prism sheet, a brightness enhanced sheet, and the like. The diffusion sheet diffuses incident light, and the horizontal and / or vertical prism sheet concentrates incident light on the display panel 1061. The brightness enhancing sheet reuses the lost light to improve the brightness I will. A protective sheet may be disposed on the display panel 1061, but the present invention is not limited thereto.

The light guide plate 1041 and the optical sheet 1051 may be included as an optical member on the optical path of the light emitting module 1031, but are not limited thereto.

10 is a view showing a display device having a light emitting device according to an embodiment.

Referring to FIG. 10, the display device 1100 includes a bottom cover 1152, a substrate 1120 on which the light emitting device 11 disclosed above is arranged, an optical member 1154, and a display panel 1155.

The substrate 1120 and the light emitting element 11 may be defined as a light emitting module 1060. The bottom cover 1152, at least one light emitting module 1060, and the optical member 1154 may be defined as a light unit (not shown).

The bottom cover 1152 may include an accommodating part 1153, but is not limited thereto.

The optical member 1154 may include at least one of a lens, a light guide plate, a diffusion sheet, a horizontal and vertical prism sheet, and a brightness enhancement sheet. The light guide plate may be made of a PC material or a poly methy methacrylate (PMMA) material, and the light guide plate may be removed. The diffusion sheet diffuses the incident light, and the horizontal and vertical prism sheets condense the incident light onto the display panel 1155. The brightness enhancing sheet reuses the lost light to improve the brightness .

The optical member 1154 is disposed on the light emitting module 1060, and performs surface light source, diffusion, condensing, etc. of the light emitted from the light emitting module 1060.

11 is a perspective view of a lighting apparatus according to an embodiment.

Referring to FIG. 11, the lighting device 1500 includes a case 1510, a light emitting module 1530 installed in the case 1510, and a connection terminal installed in the case 1510 and receiving power from an external power source. 1520).

The case 1510 may be formed of a material having good heat dissipation, for example, may be formed of a metal material or a resin material.

The light emitting module 1530 may include a substrate 1532 and a light emitting device 11 according to any one of embodiments mounted on the substrate 1532. The plurality of light emitting devices 11 may be arranged in a matrix form or spaced apart at predetermined intervals.

The substrate 1532 may be a circuit pattern printed on an insulator. For example, a general printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, FR-4 substrates and the like.

In addition, the substrate 1532 may be formed of a material that reflects light efficiently, or a surface may be coated with a color, for example, white or silver, in which the light is efficiently reflected.

At least one light emitting device 11 may be mounted on the substrate 1532. Each of the light emitting devices 11 may include at least one light emitting diode (LED) chip. The LED chip may include a light emitting diode in a visible light band such as red, green, blue, or white, or a UV light emitting diode emitting ultraviolet (UV) light.

The light emitting module 1530 may be arranged to have a combination of various light emitting elements 11 to obtain color and luminance. For example, a white light emitting diode, a red light emitting diode, and a green light emitting diode may be combined to secure high color rendering (CRI).

The connection terminal 1520 may be electrically connected to the light emitting module 1530 to supply power. The connection terminal 1520 is inserted into and coupled to an external power source in a socket manner, but is not limited thereto. For example, the connection terminal 1520 may be formed in a pin shape and inserted into an external power source, or may be connected to the external power source by a wire.

Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in each embodiment may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of illustration, It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

11, 12, 13, 14: light emitting element 21, 23: lead frame
31: Body 35: Cavity
51, 61, 71, 81: molding member 91: lens
55,65,75,78,95: Uneven pattern 41,41A: Light emitting chip

Claims

Body;
A plurality of lead frames on the body;
A light emitting chip on at least one of the plurality of lead frames; And
A molding member covering the light emitting chip;
The upper surface of the molding member includes a light emitting device including a first concave-convex pattern arranged in the recess and the convex portion so that the surface tension of moisture can be formed.

The method of claim 1,
A light emitting device comprising a second uneven pattern on at least one upper surface of the convex portions of the first uneven pattern.

Body;
A plurality of lead frames on the body;
A light emitting chip on at least one of the plurality of lead frames;
A molding member covering the light emitting chip; And
At least partially convex on the molding member;
An upper surface of at least one of the molding member and the lens comprises a first concave-convex pattern is arranged in the concave portion and the convex portion to form a surface tension of moisture.

The light emitting device of claim 1, wherein the convex portions of the first concave-convex pattern comprise a size of a micrometer.

The light emitting device of claim 1, wherein the convex portions of the first uneven pattern have a width of about 1 μm to about 100 μm.

The light emitting device of claim 4, wherein the widths of the concave portions of the first concave-convex pattern include a range of 0.1 to 10 times the width of the convex portions of the first concave-convex pattern.

The light emitting device of claim 6, wherein a period of the convex portions of the first uneven pattern includes a range of about 1 μm to about 1000 μm.

The light emitting device of claim 2 or 4, wherein the convex portions of the second concave-convex pattern comprise a size of nanometers (nm).

The light emitting device of claim 8, wherein each of the convex portions of the second uneven pattern includes a width of about 10 nm to about 400 nm.

The light emitting device of claim 8, wherein the width of the concave portion of the second concave-convex pattern is formed between 1 and 10 times the width of the convex portion of the second concave-convex pattern.

The light emitting device of any one of claims 1 to 3, wherein the convex portions of the first concave-convex pattern are arranged in a matrix shape or a lattice shape in the regions of the concave portions.

The light emitting device of claim 3, wherein the first uneven pattern is formed on an upper surface of the molding member, and the convex portions of the first uneven pattern include a size of nanometers (nm).

The convex portion of the first concave-convex pattern includes a width of 10 nm to 400 nm, and the width of the concave portion of the first concave-convex pattern is between 1 and 10 times the width of the convex portion of the first concave-convex pattern. Light emitting device comprising.

The light emitting device of claim 3, wherein the first uneven pattern is formed on a surface of the lens, and the convex portions of the first uneven pattern have a size of micrometer or nanometer.

The method of claim 1, wherein the upper portion of the body comprises an open cavity,
The light emitting device in which the molding member is disposed in the cavity.

The light emitting device of claim 15, wherein the center of the upper surface of the molding member is concave or convex in the direction of the light emitting chip.

4. The light emitting device of claim 3, wherein the first uneven pattern is disposed in a region closer to the upper surface of the body than a central portion of the upper surface of the molding member in the upper region of the molding member.

The light emitting device of claim 15, wherein at least one of the plurality of lead frames includes a cup structure connected to a cavity of the body.