KR101028243B1 - Lighting module - Google Patents

Lighting module Download PDF

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Publication number
KR101028243B1
KR101028243B1 KR1020100030016A KR20100030016A KR101028243B1 KR 101028243 B1 KR101028243 B1 KR 101028243B1 KR 1020100030016 A KR1020100030016 A KR 1020100030016A KR 20100030016 A KR20100030016 A KR 20100030016A KR 101028243 B1 KR101028243 B1 KR 101028243B1
Authority
KR
South Korea
Prior art keywords
light emitting
electrode
heat dissipation
light
electrically connected
Prior art date
Application number
KR1020100030016A
Other languages
Korean (ko)
Inventor
김등관
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020100030016A priority Critical patent/KR101028243B1/en
Priority to EP11150403.1A priority patent/EP2346100B1/en
Priority to JP2011004106A priority patent/JP2011146709A/en
Priority to US13/005,182 priority patent/US20110175119A1/en
Priority to CN201110022482.7A priority patent/CN102185089B/en
Application granted granted Critical
Publication of KR101028243B1 publication Critical patent/KR101028243B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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  • Led Device Packages (AREA)

Abstract

PURPOSE: A light emitting module is provided to improve heat dissipation efficiency by directly discharging heat from a light emitting device to a support member. CONSTITUTION: A substrate(60) has a plurality of grooves(55). A first circuit pattern(61) and a second circuit pattern(62) are electrically connected to a light emitting device(1). A first electrode(31), a second electrode(32), and a thermal conductive member(35) are installed on a body(10). A light emitting chip(20) is electrically connected to the first electrode and the second electrode. A heat radiation pad(50) is formed on the body and the lower side of the thermal conductive member.

Description

Light emitting module {LIGHTING MODULE}

Embodiments relate to a light emitting module.

Light emitting diodes (LEDs) are a type of semiconductor device that converts electrical energy into light. Light emitting diodes have the advantages of low power consumption, semi-permanent life, fast response speed, safety and environmental friendliness compared to conventional light sources such as fluorescent and incandescent lamps. Accordingly, many researches are being conducted to replace existing light sources with light emitting diodes, and the use of light emitting diodes is increasing as a light source for lighting devices such as various lamps, liquid crystal displays, electronic displays, and street lamps that are used indoors and outdoors.

The embodiment provides a light emitting module having a new structure.

The embodiment provides a light emitting module having good heat dissipation efficiency.

The light emitting module according to the embodiment includes a body, a first electrode and a second electrode installed on the body, a light emitting chip formed on the first electrode and electrically connected to the first electrode and the second electrode, and the light emitting chip A plurality of light emitting devices each including a molding member for sealing the heat dissipation pad, and a heat dissipation pad formed on the bottom surface of the body and the first electrode; A substrate including a plurality of grooves into which the plurality of light emitting elements are inserted; And a first circuit pattern and a second circuit pattern formed around the groove of the substrate and electrically connected to the first electrode and the second electrode, respectively.

In another embodiment, a light emitting module includes a body, a first electrode, a second electrode, and a thermally conductive member disposed on the body, and a light emitting chip formed on the thermally conductive member and electrically connected to the first electrode and the second electrode. And a plurality of light emitting devices each including a molding member for sealing the light emitting chip, and a heat dissipation pad formed on the bottom surface of the body and the heat conductive member. A substrate including a plurality of grooves into which the plurality of light emitting elements are inserted; And a first circuit pattern and a second circuit pattern formed around the groove of the substrate and electrically connected to the first electrode and the second electrode, respectively.

The embodiment can provide a light emitting module having a new structure and a light unit using the same.

The embodiment can provide a light emitting module having a good heat dissipation efficiency and a light unit using the same.

1 is a side cross-sectional view of a light emitting module and a light unit using the same according to an embodiment
2 is an exploded perspective view of the light unit of FIG.
3 is a perspective view of the light unit of FIG.
4 is a perspective view of an edge type light unit
5 is a perspective view of a direct light unit
6 is a view illustrating a light emitting module and a light unit using the same according to another embodiment;
7 is a view illustrating a light emitting module and a light unit using the same according to another embodiment;

In the description of the embodiments, it is to be understood that each layer (film), region, pattern or structure is formed "on" or "under" a substrate, each layer The terms " on "and " under " encompass both being formed" directly "or" indirectly " In addition, the criteria for the top or bottom of each layer will be described with reference to the drawings.

In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. In addition, the size of each component does not necessarily reflect the actual size.

Hereinafter, a light emitting module and a light unit using the same according to an embodiment will be described with reference to the accompanying drawings.

1 is a side cross-sectional view of a light emitting module and a light unit using the same according to an embodiment, FIG. 2 is an exploded perspective view of the light unit of FIG. 1, and FIG. 3 is a perspective view of the light unit of FIG. 1.

1 to 3, a light emitting module according to an embodiment includes a substrate 60 including a plurality of light emitting devices 1 and a plurality of grooves 55 into which the light emitting devices 1 are inserted. And a first circuit pattern 61 and a second circuit pattern 62 formed around the plurality of grooves 55 of the substrate 60 and electrically connected to the light emitting device 1. .

In addition, the light unit according to the embodiment may include the light emitting module and the support member 80 for receiving the light emitting module.

The light emitting module according to the embodiment has a structure in which the plurality of light emitting devices 1 are inserted into the plurality of grooves 55, so that the plurality of light emitting devices 1 may contact the support member 80. Can be. Therefore, the heat generated by the plurality of light emitting devices 1 can be directly discharged to the support member 80, the heat radiation efficiency of the light emitting module according to the embodiment can be improved.

This improvement in heat dissipation efficiency minimizes damage, discoloration, etc. of the plurality of light emitting devices 1, and consequently improves the reliability of the light emitting module according to the embodiment.

Hereinafter, the light emitting module and the light unit using the same according to the embodiment will be described in detail with reference to each component.

The light emitting device 1 includes a body 10, a first electrode 31, a second electrode 32, and a thermally conductive member 35 installed on the body 10, and on the thermally conductive member 35. A light emitting chip 20 installed in the first electrode 31 and the second electrode 32 and electrically connected to the first electrode 31, a molding member 40 sealing the light emitting chip 20, and the body 10. And a heat dissipation pad 50 formed on the bottom surface of the thermal conductive member 35.

The body 10 is made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), AlOx, photosensitive glass (PSG), polyamide 9T (PA9T), neogeotactic polystyrene (SPS), a metal material, sapphire (Al 2 O 3 ), beryllium oxide (BeO), may be formed of at least one of a printed circuit board (PCB, Printed Circuit Board). The body 10 may be formed by injection molding, an etching process, but is not limited thereto.

When the body 10 is formed of a material having electrical conductivity, an insulating film (not shown) is further formed on the surface of the body 10 so that the body 10 is formed with the first and second electrodes 31 and 32. The electrical short can be prevented.

The shape of the upper surface of the body 10 may have a variety of shapes, such as rectangular, polygonal, circular, depending on the use and design of the light emitting device (1).

A first cavity 15 may be formed in the body 10 to open the upper portion thereof. The first cavity 15 may be formed in a cup shape, a concave container shape, or the like, and an inner side surface of the first cavity 15 may be a side perpendicular to the bottom or an inclined side. In addition, the shape of the first cavity 15 viewed from above may be circular, rectangular, polygonal, elliptical, or the like.

The first electrode 31 and the second electrode 32 may be spaced apart from each other to be electrically separated from each other, and may be installed in the body 10. The first electrode 31 and the second electrode 32 may be electrically connected to the light emitting chip 20 to supply power to the light emitting chip 20.

The first and second electrodes 31 and 32 are electrically conductive metal materials, for example, titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), and tantalum. (Ta), platinum (Pt), tin (Sn), silver (Ag), phosphorus (P), aluminum (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium It may include one or more materials or alloys from among (Ge), hafnium (Hf), ruthenium (Ru), and iron (Fe). In addition, the first and second electrodes 31 and 32 may be formed to have a single layer or a multilayer structure, but are not limited thereto.

The first and second electrodes 31 and 32 may be formed to protrude from the outer surface of the body 10. The protruding first and second electrodes 31 and 32 are electrically connected to the first and second circuit patterns 61 and 62 of the substrate 60, respectively, to provide power to the light emitting chip 20. can do.

Soldering the first and second electrodes 31 and 32 to the first and second circuit patterns 61 and 62 so as to fix the first and second electrodes 31 and 32 to the first and second circuit patterns 61 and 62. The light emitting device 1 may be installed on the substrate 60.

The thermally conductive member 35 may be installed on the body 10, and may form part of the bottom surface of the light emitting device 1.

The thermally conductive member 35 may be formed of a material having high thermal conductivity, for example, a metal material, a carbon-containing material, various resin materials, but is not limited thereto.

The thermally conductive member 35 may be formed to have a second cavity 17, as shown in FIG. 1. That is, the second cavity 17 may have a recessed shape with respect to the bottom surface of the first cavity 15, so that the first cavity 15 and the second cavity 17 have a stepped structure. Can be achieved.

This stepped structure is excellent in airtightness such that moisture, dirt, and the like do not penetrate the light emitting element 1. In addition, the stepped structure allows the thermally conductive member 35 to be exposed to the lower surface of the light emitting device 1, thereby improving heat dissipation efficiency of the light emitting device 1.

The light emitting chip 20 may be installed on the thermally conductive member 35. The light emitting chip 20 may include, for example, at least one light emitting diode (LED), and the light emitting diode may be a colored light emitting diode or white light emitting red, green, or blue light. It may include, but is not limited to, at least one of a white light emitting diode emitting UV light or an ultra violet light emitting diode emitting ultraviolet light.

As illustrated, the light emitting chip 20 is electrically connected to the first and second electrodes 31 and 32 by a wire bonding method, but the light emitting chip 20 may be a flip chip method or a chip bonding method. It may be electrically connected to the first and second electrodes 31 and 32, but is not limited thereto.

The molding member 40 may be formed in the body 10 to seal the light emitting chip 20. That is, the molding member 40 may be filled in the first and second cavities 15 and 17.

The molding member 40 may be formed of a silicone or resin material having transparency. In addition, the molding member 40 may include a phosphor, and the phosphor may be excited by the first light emitted from the light emitting chip 20 to generate a second light. For example, when the light emitting chip 20 is a blue light emitting diode and the phosphor is a yellow phosphor, the yellow phosphor may be excited by blue light to emit yellow light, and the blue light and yellow light are mixed. Accordingly, the light emitting device 1 may provide white light. However, this is not limitative.

On the other hand, a lens (not shown) is further formed on the molding member 40 to adjust the light distribution of the light emitted from the light emitting element 1. In addition, a zener diode may be further installed on the body 10 of the light emitting device 1 to improve the breakdown voltage.

The heat dissipation pad 50 may be formed on the bottom surface of the body 10 and the thermal conductive member 35. Since the heat dissipation pad 50 is in contact with the support member 80, heat generated by the light emitting device 1 may be effectively transferred to the support member 80.

For example, the heat dissipation pad 50 is a heat dissipation tape such as a heat conductive tape or a UV tape (tape adhered when ultraviolet rays are irradiated), and is simply attached to the bottom surface of the body 10 and the heat conductive member 35. It can be formed by.

Alternatively, the heat dissipation pad 50 may be formed by spray coating, depositing, or plating a material having high thermal conductivity such as a metal material, a carbon-containing material, and various resin materials.

Although not limited to the thickness of the heat radiation pad 50, preferably may have a thickness of 0.01mm to 1mm. This is because the heat transmitted from the heat radiating pad 50 to the support member 80 may increase when the heat dissipation pad 50 is maintained at an appropriate level not too thick.

In addition, the bottom surface of the heat radiation pad 50 and the bottom surface of the substrate 60 may be disposed on the same plane, or the bottom surface of the heat radiation pad 50 may protrude more than the bottom surface of the substrate 60. Accordingly, the heat radiation pad 50 may easily bond the light emitting device 1 to the support member 80.

The substrate 60 is formed on the insulating layer 65, the first circuit pattern 61 and the second circuit pattern 62 formed on the insulating layer 65, and the insulating layer 65. The device 1 may include a groove 55 into which the device 1 is inserted.

In addition, although not shown, the substrate 60 may further include a connector for receiving power from an external power source.

The substrate 60 may be at least one of a general printed circuit board (PCB), a metal core PCB, and a flexible PCB, but is not limited thereto.

The groove 55 may be formed to penetrate the upper and lower surfaces of the substrate 60, and may have a width corresponding to the plurality of light emitting devices 1.

The first circuit pattern 61 and the second circuit pattern 62 may be formed around the plurality of grooves 55 in the insulating layer 65.

The first circuit pattern 61 and the second circuit pattern 62 may be electrically connected to the connector to provide power to the light emitting device 1. In this case, the first circuit pattern 61 and the second circuit pattern 62 may be bonded and electrically connected to the first and second electrodes 31 and 32 of the light emitting device 1 by soldering.

When the light emitting device 1 is inserted into the groove 55, the upper region of the light emitting device 1 is based on the first and second electrodes 31 and 32 protruding to the outer surface of the light emitting device 1. ) Is protruded onto the lower portion, and the lower region is inserted into the groove 55. That is, at least a part of the body 10 of the light emitting device 1 may be inserted into the groove 55. However, this may be modified according to the design of the light emitting module according to the embodiment, but is not limited thereto.

The support member 80 may be formed of a material having high thermal conductivity, and may accommodate the light emitting module.

On the other hand, the type of the support member 80 may be variously selected according to the use of the light unit. For example, when the light unit is a backlight unit (BLU) serving as a light source of the display device, the support member 80 may be a cover bottom for receiving the light emitting module. The cover bottom may have a box shape in which an upper portion of the cover bottom is opened to accommodate the light emitting module.

4 is a perspective view of an edge type light unit, and FIG. 5 is a perspective view of a direct type light unit.

4 and 5, the backlight unit includes a light guide member (not shown) for diffusing light into a surface light source, which is incident to the light guide member (not shown) in a lateral direction. An edge type light unit of 4 is a direct light unit of FIG. 5 that injects light under the light guide member (not shown).

In the edge type light unit of FIG. 4, the light emitting module may be installed on at least one inner side surface of the support member 80. In addition, in the case of the direct light unit of FIG. 5, the light emitting module may be installed on the bottom surface of the support member 80.

6 is a view illustrating a light emitting module and a light unit using the same according to another embodiment.

Referring to FIG. 6, the light emitting module is the same except for the structure of the light emitting module and light emitting device 1A of FIG. 1.

The light emitting device 1A includes a body 10, a first electrode 31a and a second electrode 32 provided on the body 10, and are disposed on the first electrode 31a and the first electrode. The light emitting chip 20 electrically connected to the second electrode 32 and the second electrode 32, the molding member 40 sealing the light emitting chip 20, the body 10 and the first electrode 31a. It may include a heat dissipation pad 50 formed on the bottom surface.

A second cavity 17 may be formed in the first electrode 31a, and the light emitting chip 20 may be installed in the second cavity 17.

Since the first electrode 31a has the second cavity 17, the first and second cavities 15 and 17 may form a stepped structure, thereby improving the airtightness of the light emitting device 1A. have.

In addition, since the first electrode 31a includes the second cavity 17, the heat dissipation part 35a below the first electrode 31a may be bent to contact the heat dissipation pad 50. have. That is, the heat dissipation part 35a of the first electrode 31a may be in contact with the heat dissipation pad 50 to perform a heat dissipation function.

7 is a view illustrating a light emitting module and a light unit using the same according to another embodiment.

Referring to FIG. 7, the light emitting module is the same except for the structures of the light emitting module and the light emitting device 1B of FIG. 6.

The light emitting device 1B includes a body 10, a first electrode 31b and a second electrode 32 provided on the body 10, and are disposed on the first electrode 31b and the first electrode. 31b and the light emitting chip 20 electrically connected to the second electrode 32, a molding member 40 for sealing the light emitting chip 20, the body 10 and the first electrode 31b. It may include a heat dissipation pad 50 formed on the bottom surface.

Although no cavity is formed in the first electrode 31b of the light emitting device 1B, the lower surface of the first electrode 31b may protrude downward and be exposed to the lower surface of the body 10. In this case, the first electrode 31b may include an area having a different thickness so that the lower surface thereof may protrude. That is, an area where the lower surface of the first electrode 31b protrudes may be thicker than other areas, and this area may increase the heat dissipation area.

In addition, the lower surface of the exposed first electrode 31b may contact the heat dissipation pad 50.

Accordingly, heat generated by the light emitting chip 20 may be easily transferred to the support member 80 along the first electrode 31b and the heat dissipation pad 50.

A lens may be disposed on the light emitting device package according to the embodiment, and the lens may selectively include a concave lens, a convex lens, a Fresnel lens, or a lens having a selective combination of concave and convex. The light emitting device package and the lens may be integrally contacted or spaced apart from each other, but are not limited thereto.

By arranging a plurality of light emitting device packages according to the embodiment (s), it can be used as a light source such as an indicator device (traffic light, etc.), a lighting device (headlights, fluorescent lights, street lights, etc.), display devices (light plate, LCD panel, etc.). . In addition, each embodiment is not limited to each embodiment, it can be selectively applied to other embodiments disclosed above, but is not limited to each embodiment. Although the package of the embodiment is illustrated and described in the form of a top view, it is implemented in a side view to improve the heat dissipation characteristics as described above.

Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

In addition, the above description has been made with reference to the embodiment, which is merely an example, and is not intended to limit the present invention. Those skilled in the art to which the present invention pertains will be illustrated as above without departing from the essential characteristics of the present embodiment. It will be appreciated that various modifications and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

1: light emitting element 10: body
15: first cavity 17: second cavity
20: light emitting chip 31, 32: first and second electrode
35: thermally conductive member 40: molding member
50: heat dissipation pad 55: groove
60 substrate 80 support member

Claims (12)

A body, a first electrode and a second electrode provided on the body, a light emitting chip formed on the first electrode and electrically connected to the first electrode and the second electrode, a molding member sealing the light emitting chip; A plurality of light emitting devices each comprising a heat dissipation pad formed on the bottom surface of the body and the first electrode;
A substrate including a plurality of grooves into which the plurality of light emitting elements are inserted; And
And a first circuit pattern and a second circuit pattern formed around the groove of the substrate and electrically connected to the first electrode and the second electrode, respectively. The method of claim 1,
At least a portion of the body of the light emitting element is inserted into the groove. The method of claim 1,
The heat dissipation pad is a light emitting module formed of a thermally conductive tape or UV tape. The method of claim 1,
The heat dissipation pad may include at least one of a metal material, a carbon-containing material, and a resin material. The method of claim 1,
The heat dissipation pad has a thickness of 0.01mm to 1mm. The method of claim 1,
The light emitting module includes a first cavity formed in the body of the light emitting device such that an upper portion thereof is opened, and a second cavity formed on a lower surface of the first cavity. The method of claim 1,
The first electrode and the second electrode is a light emitting module protruding on the outer surface of the body. A body, a first electrode, a second electrode and a thermally conductive member disposed on the body, a light emitting chip formed on the thermally conductive member and electrically connected to the first electrode and the second electrode, and sealing the light emitting chip. A plurality of light emitting devices each including a molding member and a heat dissipation pad formed on a lower surface of the body and the thermal conductive member;
A substrate including a plurality of grooves into which the plurality of light emitting elements are inserted; And
And a first circuit pattern and a second circuit pattern formed around the groove of the substrate and electrically connected to the first electrode and the second electrode, respectively. The method of claim 8,
The thermally conductive member includes at least one of a metal material, a carbon-containing material, and a resin material. The method of claim 8,
The thermally conductive member includes a cavity. The method of claim 8,
The heat dissipation pad may include at least one of a metal material, a carbon-containing material, and a resin material. The method according to claim 1 or 8,
And a support member for receiving the light emitting module, wherein the support member is in contact with the heat radiation pad.




KR1020100030016A 2010-01-15 2010-04-01 Lighting module KR101028243B1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020100030016A KR101028243B1 (en) 2010-04-01 2010-04-01 Lighting module
EP11150403.1A EP2346100B1 (en) 2010-01-15 2011-01-07 Light emitting apparatus and lighting system
JP2011004106A JP2011146709A (en) 2010-01-15 2011-01-12 Light-emitting device and illumination system
US13/005,182 US20110175119A1 (en) 2010-01-15 2011-01-12 Light emitting apparatus and lighting system
CN201110022482.7A CN102185089B (en) 2010-01-15 2011-01-17 Light-emitting device and illuminator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100030016A KR101028243B1 (en) 2010-04-01 2010-04-01 Lighting module

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KR101028243B1 true KR101028243B1 (en) 2011-04-11

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101342030B1 (en) 2012-06-11 2013-12-16 (주)태양기술개발 Illuminator using light emitting diode
KR101873558B1 (en) * 2011-05-31 2018-07-02 엘지이노텍 주식회사 Light emitting device array

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006303396A (en) * 2005-04-25 2006-11-02 Matsushita Electric Works Ltd Surface-mounting light-emitting device
KR20070084980A (en) * 2006-02-22 2007-08-27 삼성전기주식회사 Cob package and its manufacturing method
KR100863612B1 (en) * 2005-09-28 2008-10-15 인더스트리얼 테크놀로지 리서치 인스티튜트 Light emitting device
KR20090068399A (en) * 2007-12-24 2009-06-29 (주)루미브라이트 A light-emitting diode module with a lead frame comprising packages

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006303396A (en) * 2005-04-25 2006-11-02 Matsushita Electric Works Ltd Surface-mounting light-emitting device
KR100863612B1 (en) * 2005-09-28 2008-10-15 인더스트리얼 테크놀로지 리서치 인스티튜트 Light emitting device
KR20070084980A (en) * 2006-02-22 2007-08-27 삼성전기주식회사 Cob package and its manufacturing method
KR20090068399A (en) * 2007-12-24 2009-06-29 (주)루미브라이트 A light-emitting diode module with a lead frame comprising packages

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101873558B1 (en) * 2011-05-31 2018-07-02 엘지이노텍 주식회사 Light emitting device array
KR101342030B1 (en) 2012-06-11 2013-12-16 (주)태양기술개발 Illuminator using light emitting diode

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