KR101034142B1 - Light emitting device and method for fabricating thereof - Google Patents

Abstract

PURPOSE: A light emitting device and manufacturing method thereof are provided to increase the surface sizes of first and second electrodes, thereby increasing the heat emitting efficiency of the light emitting device. CONSTITUTION: One side of a body(20) is rough. A cathode mark(22) is formed on the body. A first electrode(31) and a second electrode(32) penetrates the bottom of the body. The ends of the first and second electrodes are branched into first sub electrodes(31a) and second sub electrodes(31b). A light emitting chip(10) is electrically connected to the first and second electrodes to emit light.

Description

LIGHT EMITTING DEVICE AND METHOD FOR FABRICATING THEREOF

The embodiment relates to a light emitting device and a method of manufacturing the same.

Light emitting diodes (LEDs) are a type of semiconductor device that converts electrical energy into light. Light emitting diodes have the advantages of low power consumption, semi-permanent life, fast response speed, safety and environmental friendliness compared to conventional light sources such as fluorescent and incandescent lamps. Accordingly, many researches are being conducted to replace existing light sources with light emitting diodes, and the use of light emitting diodes is increasing as a light source for lighting devices such as various lamps, liquid crystal displays, electronic displays, and street lamps that are used indoors and outdoors.

The embodiment provides a light emitting device having a new structure.

The embodiment provides a light emitting device having improved reliability.

The light emitting device according to the embodiment includes a body including a cavity so that the top is opened; A first electrode and a second electrode penetrating a bottom of the body and having end portions exposed to the outside of the body; And a light emitting chip formed on any one of the first electrode and the second electrode, the light emitting chip being electrically connected to the first electrode and the second electrode, wherein the first electrode and the second electrode have a lower width at an upper side thereof. At least part of the area is larger than its width.

The embodiment can provide a light emitting device having a new structure.

The embodiment can provide a light emitting device having improved reliability.

In the description of the embodiments, it is to be understood that each layer (film), region, pattern or structure is formed "on" or "under" a substrate, each layer The terms " on "and " under " encompass both being formed" directly "or" indirectly " In addition, the criteria for the top or bottom of each layer will be described with reference to the drawings.

In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. In addition, the size of each component does not necessarily reflect the actual size.

Hereinafter, a light emitting device and a method of manufacturing the same according to embodiments will be described with reference to the accompanying drawings.

FIG. 1 is a perspective view of the light emitting device 1 according to the embodiment from above, FIG. 2 is a perspective view of the light emitting device 1 from below, and FIG. 3 is a top view of the light emitting device 1, and FIG. 4 is a cross-sectional view of the light emitting element 1.

1 to 4, the light emitting device 1 according to the embodiment includes a body 20 having roughness 25 formed on at least one side thereof, a first electrode 31 installed on the body 20, and It is installed on any one of the second electrode 32, the first electrode 31 and the second electrode 32, and electrically connected to the first electrode 31 and the second electrode 32 to emit light. The light emitting chip 10 may include a light emitting chip 10 and a protective cap 27 protruding between the first electrode 31 and the second electrode 32.

The body 20 may include at least one of a resin material such as polyphthalamide (PPA), silicon (Si), a metal material, photo sensitive glass (PSG), sapphire (Al ₂ O ₃ ), and a printed circuit board (PCB). It can be formed as one.

When the body 20 is formed of a material having electrical conductivity, an insulating film (not shown) is further formed on the surface of the body 20 so that the body 20 is formed with the first and second electrodes 31 and 32. The electrical short can be prevented.

The shape of the upper surface of the body 20 may have a variety of shapes, such as rectangular, polygonal, circular, depending on the use and design of the light emitting device (1). For example, a rectangular light emitting element 1 as shown may be used in an edge type backlight unit (BLU).

A cavity 15 may be formed in the body 20 such that an upper portion thereof is opened. The cavity 15 may be formed in a cup shape, a concave container shape, or the like, and the inner surface of the cavity 15 may be a side perpendicular to the floor or an inclined side.

The shape of the cavity 15 viewed from above may be a shape of a circle, a rectangle, a polygon, an oval, or the like. Alternatively, as shown in FIGS. 1 and 3, the shape of the cavity 15 viewed from above may be a shape in which a corner of a quadrangle is curved.

The roughness 25 may be formed on at least one side of the body 20. The roughness 25 is formed by a process of manufacturing the light emitting device 1 according to the embodiment, specifically, a cutting process of separating a plurality of light emitting devices into individual device units, which will be described later in detail.

In addition, a cathode mark 22 may be formed on an upper side of the body 20. The cathode mark 22 distinguishes the first electrode 31 and the second electrode 32 of the light emitting device 1, and thus the cathode mark 22 is confused about the direction of the polarity of the first and second electrodes 31 and 32. Can be prevented.

The first electrode 31 and the second electrode 32 are spaced apart from each other so as to be electrically separated from each other and installed in the body 20. The first electrode 31 and the second electrode 32 may be electrically connected to the light emitting chip 20 to supply power to the light emitting chip 20.

The first and second electrodes 31 and 32 may be formed of a metal material, for example, titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), It may include at least one of platinum (Pt), tin (Sn), silver (Ag), phosphorus (P). In addition, the first and second electrodes 31 and 32 may be formed to have a single layer or a multilayer structure, but are not limited thereto.

The first electrode 31 and the second electrode 32 are formed to penetrate the bottom of the body 20 to form the bottom of the light emitting device 1, the first electrode 31 and the second electrode ( 32 may be exposed to the outside of the body 20.

Since the first electrode 31 and the second electrode 32 are formed to penetrate the body 20, the light emitting chip mounted on one of the first electrode 31 and the second electrode 32. Heat generated from 10 may be efficiently discharged through the first and second electrodes 31 and 32.

In addition, soldering or the like is performed at ends of the first electrode 31 and the second electrode 32 exposed to protrude to the outside of the body 20, so that the light emitting device 1 may be formed on a substrate or the like. It can be easily mounted on an external mounting member.

Hereinafter, the first electrode 31 and the second electrode 32 will be described in more detail.

5 is a perspective view of the first electrode 31 and the second electrode 32 viewed from above, and FIG. 6 is a perspective view of the first electrode 31 and the second electrode 32 viewed from below.

5 and 6, ends of the first electrode 31 and the second electrode 32 exposed to the outside of the body 20 are a plurality of sub-electrodes 31a, 31b, 32a, and 32b, respectively. It can be divided into. For example, as illustrated, ends of the first electrode 31 are branched into two first sub-electrodes 31a and 31b, and ends of the second electrode 32 are two second sub-electrodes ( 32a, 32b).

In addition, an upper side and a lower side of the side surface 35a between the two first sub electrodes 31a and 31b and the side 35b between the two second sub electrodes 32a and 32b may be formed to be stepped. The lower side may be formed to have a curved surface.

In addition, protrusions 33a, 33b, and 33c may be formed on at least one side surface of the first electrode 31 and the second electrode 32. Since the protrusions 33a, 33b, and 33c form a step with the lower side of the first and second electrodes 31 and 32, the first and second electrodes 31 and 32 are formed by the protrusions 33a, 33b and 33c. An area in which the width of the upper side of the upper side) is larger than the width of the lower side may be formed, and the cross section of this region may have, for example, a T-shaped cross section.

In addition, an inclination or a step may be formed on side surfaces 34a and 34b where the first and second electrodes 31 and 32 face each other.

By the structure of the first electrode 31 and the second electrode 32 as described above, the body 20 and the first and second electrodes 31 and 32 can be firmly coupled, the first 2, the electrodes 31 and 32 may be prevented from being separated from the body 20. In addition, since the surface area of the first electrode 31 and the second electrode 32 is increased by the structure, the heat dissipation efficiency of the light emitting device 1 may be improved.

The thickness of the first electrode 31 and the second electrode 32 is different depending on the region, but sufficient thickness in that the first and second electrodes 31 and 32 constitute the bottom of the light emitting element 1. It is desirable to secure. To this end, the thickness of the first electrode 31 and the second electrode 32 may have a range of, for example, 0.1mm to 0.5mm. However, this is not limitative.

Referring back to FIGS. 1 to 4, the protective cap 27 may be formed to protrude between the first electrode 31 and the second electrode 32. The protective cap 27 covers the gap between the first electrode 31 and the second electrode 32 and the body 20 to prevent penetration of moisture or air, and in the long term, the gap opens. By preventing it, the reliability of the light emitting element 10 can be improved.

The protective cap 27 indicates a structure in which the body 20 protrudes between the first electrode 31 and the second electrode 32. Therefore, the protective cap 27 may be integrally formed with the body 20 in the manufacturing process of the light emitting device 1, and may be formed of the same material as the body 20.

However, the protective cap 27 may be formed separately from the body 20, in which case the material of the protective cap 27 may be different from the material of the body 20.

The protective cap 27 protrudes between the first and second electrodes 31 and 32 to effectively cover the gap between the first and second electrodes 31 and 32 and the body 20. It may be formed to surround at least a portion and the side of the upper surface of the two electrodes (31, 32).

For example, as shown in FIG. 4, when the first electrode 31 and the second electrode 32 are spaced apart from the first distance c, the width a of the protective cap 27 is determined by the first distance c. It may be 0.02 to 0.5 mm greater than one distance c to cover a portion and side surfaces of the first and second electrodes 31 and 32, but is not limited thereto.

In addition, the thickness (b) of the protective cap 27 may be formed, for example, 0.01 to 0.1mm, this thickness (b) is the reliability and processability of the light emitting device (1) the protective cap 27 It can be modified as appropriate to secure.

The light emitting chip 10 may be installed on any one of the first electrode 31 and the second electrode 32, and is electrically connected to the first and second electrodes 31 and 32 to receive power. Can generate light. Since the light emitting chip 10 is installed on one of the first and second electrodes 31 and 32, heat generated from the light emitting chip 10 is effectively transferred to the first and second electrodes 31 and 32. Can be released to the outside.

The light emitting chip 10 may include, for example, at least one light emitting diode (LED), wherein the light emitting diode is a colored light emitting diode that emits light such as red, green, blue, white, or the like. It may be a UV (Ultra Violet) light emitting diode that emits ultraviolet light, but is not limited thereto.

The light emitting chip 10 may be electrically connected to the first and second electrodes 31 and 32 by wire bonding, as shown, or may be flip chip or die bonding. The first and second electrodes 31 and 32 may be electrically connected to each other in a manner.

An encapsulant 40 may be formed in the cavity 15 of the body 20 to seal and protect the light emitting chip 10, and the encapsulant 40 may include a phosphor. have.

The encapsulant 40 may be formed of silicon or a resin material. The encapsulant 40 may be formed by filling the cavity 15 with the silicon or resin material and then curing the encapsulant 40. However, the encapsulant 40 is not limited thereto.

The phosphor may be added to the encapsulant 40 and may be excited by the first light emitted from the light emitting chip 10 to generate a second light. For example, when the light emitting chip 10 is a blue light emitting diode and the phosphor is a yellow phosphor, the yellow phosphor may be excited by blue light to emit yellow light, and the blue light and yellow light are mixed. Accordingly, the light emitting device 1 may provide white light. However, this is not limitative.

On the other hand, a lens (not shown) is further formed on the encapsulant 40 to adjust light distribution of light emitted from the light emitting device 1. In addition, a zener diode may be further installed on the body 20 of the light emitting device 1 to improve the breakdown voltage.

Hereinafter, a method of manufacturing the light emitting device 1 according to the embodiment will be described in detail.

7 to 10 are views illustrating a method of manufacturing the light emitting device 1 according to the embodiment, and FIG. 11 is a flowchart illustrating a method of manufacturing the light emitting device 1 according to the embodiment.

First, referring to FIG. 7, an electrode frame 30 in which a plurality of first electrodes 31 and second electrodes 32 are formed is prepared (S101 of FIG. 11).

By forming the electrode frame 30, a plurality of light emitting devices 1 may be manufactured at the same time. The electrode frame 30 may be formed by, for example, a photolithography process, a plating process, a deposition process, and the like, but is not limited thereto.

Secondly, referring to FIG. 8, the prepared electrode frame 30 is disposed in a mold in which shapes of the plurality of bodies 20 are formed, and the body 20 is formed through an injection hole formed in the mold. By injection of the plurality of the body 20 can be formed (S102 in Fig. 11).

9 is a view showing a process of forming the body 20, with reference to Figure 9 will be described in more detail with respect to the manufacturing method of the body 20.

First, referring to FIG. 9A, the electrode frame 30 is disposed in the molds 100 and 200. The frame 100 and 200 may include a first frame 200 corresponding to the shape of the lower portion of the body 20 and a second frame 100 corresponding to the shape of the upper portion of the body 20. .

At least one of the first mold 200 and the second mold 100 may include an injection hole 110 for injecting a material forming the body 20. In this case, the injection hole 110 may be formed between the shapes of the plurality of bodies 20.

For example, as shown, the injection hole 110 may be formed between at least two body shapes, and the position of the injection hole 110 may simultaneously form the at least two bodies 20 integrally. To make it possible.

Next, referring to FIG. 9B, a material forming the body 20 may be injected through the injection hole 110. The material forming the body 20 may be, for example, a resin material such as PPA, but is not limited thereto.

Next, referring to FIG. 9C, after curing the material forming the injected body 20, the plurality of bodies are separated by separating the first frame 200 and the second frame 100. 20 may be provided.

In this case, as shown in (c) of FIG. 8 and 9, a connection portion 28 may be formed between the at least two bodies 20 formed integrally at the same time, the central portion of the connection portion 28 Traces 29 by the injection hole 110 may be formed.

As described above, in the method of manufacturing the light emitting device 1 according to the embodiment, since at least two bodies 20 are formed simultaneously by one injection hole 110, the efficiency of the manufacturing process may be improved.

Third, referring to FIGS. 8 and 10, the light emitting chip 10 is disposed on any one of the first electrode 31 and the second electrode 32 (S103 of FIG. 11), and the light emitting chip ( 10 may be electrically connected to the first and second electrodes 31 and 32 by, for example, wire bonding (S104 of FIG. 11).

Fourth, the encapsulant may be formed to seal and protect the light emitting chip 10 in the cavity 15 of the body 20 (S105 of FIG. 11).

Fifth, the plurality of light emitting devices 1 may be separated into individual device units by a cutting process (S106 of FIG. 11).

That is, by the cutting process, at least two light emitting devices integrally formed in the above process may be separated into individual device units.

Specifically, the cutting process is a process of cutting and separating the first and second electrodes 31 and 32 from the electrode frame 30, and cutting by separating between the at least two bodies 20 formed integrally It may include a process to.

In particular, in the process of separating the at least two body 20 formed integrally, as shown in FIG. 10, the roughness 25 may be formed on at least one side of the body 20. That is, the roughness 25 refers to a rough surface formed by removing the connection portion 128 by performing the cutting process.

The cutting process may be performed by, for example, applying a physical force by using a cutter or the like, but is not limited thereto.

On the other hand, the above-described manufacturing process of the light emitting device 1 may be carried out in reverse order, it is not limited to the order. For example, the cutting process may be performed first, and then a process of installing a light emitting chip may be performed.

Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

In addition, the above description has been made with reference to the embodiment, which is merely an example, and is not intended to limit the present invention. Those skilled in the art to which the present invention pertains will be illustrated as above without departing from the essential characteristics of the present embodiment. It will be appreciated that various modifications and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

1 is a perspective view from above of a light emitting device according to an embodiment;

FIG. 2 is a perspective view of the light emitting device of FIG. 1 viewed from below. FIG.

3 is a top view of the light emitting device of FIG. 1;

4 is a cross-sectional view of the light emitting device of FIG.

5 is a perspective view from above of a first electrode and a second electrode of a light emitting device according to an embodiment;

FIG. 6 is a perspective view of the first electrode and the second electrode of FIG. 5 as viewed from below.

7 to 10 illustrate a method of manufacturing a light emitting device according to an embodiment.

11 is a flowchart illustrating a method of manufacturing a light emitting device according to the embodiment.

Claims (15)

A body including a cavity to open at an upper portion thereof; A first electrode and a second electrode penetrating a bottom of the body and having end portions exposed to the outside of the body; And A light emitting chip formed on one of the first electrode and the second electrode and electrically connected to the first electrode and the second electrode; The first electrode and the second electrode includes at least a portion of the width of the upper side than the width of the lower side, The terminals of the first electrode and the second electrode are branched into a plurality of first sub-electrodes and a plurality of second sub-electrodes, respectively, and a part of each of the sub-electrodes is filled with the body. The method of claim 1, A cross-section of a region where the width of the upper side of the first electrode and the second electrode is larger than the width of the lower side is a T-shape. delete The method of claim 1, The first electrode and the second electrode are titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn) , A light emitting device formed of a metallic material containing at least one of silver (Ag) or phosphorus (P). The method of claim 1, The thickness of the first electrode and the second electrode is 0.1mm to 0.5mm light emitting device. The method of claim 1, Light emitting devices protrude outwardly from ends of the first electrode and the second electrode. The method of claim 1, And a top side and a bottom side of the plurality of first sub-electrodes and between the plurality of second sub-electrodes. The method of claim 7, wherein The lower side between the plurality of first sub-electrodes and the plurality of second sub-electrodes is a curved surface. The method of claim 1, The light emitting device comprising a slope or a step on the side of the first electrode and the second electrode facing each other. The method of claim 1, A light emitting device in which protrusions are formed on at least one side of the first electrode and the second electrode. The method of claim 1, The light emitting device includes at least one light emitting diode. The method of claim 1, And a sealing material formed in the cavity to seal the light emitting chip. The method of claim 1, The body has a cathode mark (cathode mark) formed on the body to distinguish the polarity of the first electrode and the second electrode. The method of claim 1, A light emitting device in which the zener diode is further installed on the body. The method of claim 1, A light emitting device comprising a protective cap protruding between the first electrode and the second electrode.

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