KR101250381B1 - Optical package and manufacturing method of the same - Google Patents

Abstract

The present invention relates to an optical package and a method for manufacturing the same, in particular, the manufacturing process includes the steps of forming a functional hole region in the insulating film; Forming a metal layer on the insulating film and implementing a circuit pattern; Mounting an optical device on a circuit pattern corresponding to the functional hole region; And forming a resin part to bury the optical device.
According to the present invention, a functional hole region formed in the insulating film is realized, and a chip mounting region is implemented on the functional hole so as to directly dissipate heat emitted from the optical device to the lower side, and white on the circuit pattern surface. By forming a resin dam made of solder resist, it is possible to maximize the light efficiency by simultaneously performing a function of receiving a portion for package molding and reflecting a light source.

Description

Optical package and its manufacturing method {OPTICAL PACKAGE AND MANUFACTURING METHOD OF THE SAME}

The present invention relates to an optical package for improving the light efficiency and a manufacturing method thereof.

LEDs are applied to a variety of applications, such as not only general display devices but also lighting devices and backlight devices of LCD displays. In particular, the LED can be driven at a relatively low voltage, but has the advantage of low heat generation and long life due to high energy efficiency, and the development of a technology capable of providing white light with high brightness, which was difficult to implement in the past, has been developed. It is expected to replace the device.

1A shows a cross-sectional view of an LED package according to one embodiment of the prior art. Referring to FIG. 1A, the LED package is configured to conduct conductive wires through bonding a gold wire 102 to a light emitting GaN chemical chip and to form heat sinks 10 at a lower portion thereof to allow heat emission. In addition, the external support and the LED package portion of the metal lead 20 through the wire bonding to the electricity and the structure that can shine. This structure forms a package for each individual chip 60.

1B shows a cross-sectional view of an LED package according to another embodiment of the prior art. Referring to FIG. 1B, a plastic lens 25 is used to increase linearity and light efficiency to light after applying a phosphor and a resin composite in an encapsulation process to protect the bonding of the wire 102. This acts as a cause of the limitation of the miniaturization of the LED package described above, and causes a cost problem in the process.

In addition, such a conventional LED package forms a lead frame type package. However, the lead frame type has a high package utilization area, making it difficult to integrate LED chips, and the package size is relatively large compared to the chip size. In addition, there is also a problem in that the heat sink is required to separate the heat generated from the LED chip to increase the thickness and volume by that amount.

The present invention has been made to solve the above-described problem, an object of the present invention is to implement a functional hole region formed in the insulating film, and to implement a chip mounting region on the upper functional hole directly to direct the heat emitted from the optical device The resin dam, which is made of white solder resist, is formed on the upper surface of the circuit pattern surface to maximize the light efficiency by acting as an accommodating part for package molding and reflecting the light source. To provide a tape type optical package that can be.

As a means for solving the above problems, the present invention comprises the steps of forming a functional hole region in the insulating film; Forming a metal layer on the insulating film and implementing a circuit pattern; Mounting an optical device on a circuit pattern corresponding to the functional hole region; It provides a method of manufacturing an optical package comprising; four steps of forming a resin portion to embed the optical device.

In addition, the first step may be implemented by forming a first hole region corresponding to the mounting position of the optical device on the insulating film by mechanical processing. In this case, the first step may include forming at least one second hole area in addition to the first hole area.

In addition, the step 2 may be implemented by implementing the circuit pattern to include a chip mounting area for mounting an optical device and a connection area for electrically connecting the optical device and the circuit pattern. In this case, at least one of the connection regions separated from the chip mounting region may be implemented.

Particularly, in the process according to the present invention, the method may further include forming a resin dam on the circuit pattern before the second step and after the third step. Specifically, the step of forming the resin dam may include: a1) Performing plating on the circuit pattern; a2) forming a resin dam by applying a solder resist to a region other than the chip mounting region and the connection region.

In addition, the third step may be implemented as a process of mounting an optical element in the resin dam inner region, and the fourth step may be implemented as a process of forming a resin portion for embedding the resin dam inner region including the optical element. have.

In addition, the step 3 may be configured to mount the optical device in a chip mounting area and perform electrical connection with the connection area, wherein the resin part is convex with a material including a phosphor and a transparent resin. It can be implemented in a lens shape.

The optical package by the above-described manufacturing process may be configured as follows.

Specifically, the insulating film having a functional hole area of the opening structure; A metal layer laminated on the insulating film and having a circuit pattern; An optical element mounted on the metal layer at a position corresponding to the functional hole region; It may be configured to include; a resin portion for embedding the optical device.

In addition, the functional hole region may be implemented to include a first hole region formed at a position corresponding to a mounting position of the optical device, or in addition to the insulating film, at least one or more second hole regions for heat dissipation. Can be configured.

In addition, the circuit pattern may include a chip mounting region for mounting an optical element formed on the first hole region and a connection region for electrically connecting the optical element with a circuit pattern. In this case, the connection area may be implemented to have at least one connection area separated from the chip mounting area.

In particular, the optical package of the above-described structure can be implemented to further include a resin dam formed in the metal layer on which the optical device is mounted, in this case, the resin dam, the structure protruding in the region other than the chip mounting region and the connection region It can be formed as.

In addition, the resin part may be formed in a structure in which the optical element is embedded in the resin dam inner layer region, and in particular, the resin part may be embodied in a convex lens shape formed of a material including a phosphor and a transparent resin. Can be.

In addition, a plating layer formed of at least one of silver (Ag), nickel (Ni), copper (Cu), platinum (Pt), palladium (Pd), and gold (Au) may be further formed on the circuit pattern surface. Can be.

In addition, the insulating film of the optical package according to the present invention may use a polyimide film.

According to the present invention, a functional hole region formed in the insulating film is realized, and a chip mounting region is implemented on the functional hole so as to directly dissipate heat emitted from the optical device to the lower side, and white on the circuit pattern surface. By forming a resin dam made of solder resist, it is possible to maximize the light efficiency by simultaneously performing a function of receiving a portion for package molding and reflecting a light source.

1A shows a cross-sectional view of an LED package according to one embodiment of the prior art.
1B shows a cross-sectional view of an LED package according to another embodiment of the prior art.
2A and 2B illustrate a manufacturing flowchart and a manufacturing process diagram of an optical package according to the present invention.
3A to 3D are diagrams illustrating various embodiments of a structure of an optical package according to the present invention.
4 conceptually illustrates a plan view and a rear view of the optical package of FIGS. 3A to 3D viewed from the top.

Hereinafter, with reference to the accompanying drawings will be described in detail the configuration and operation according to the present invention. In the description with reference to the accompanying drawings, the same components are given the same reference numerals regardless of the reference numerals, and duplicate description thereof will be omitted. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

The present invention constitutes a tape type optical package, but has a heat transfer functional hole that can directly transfer heat emitted from an optical device such as an LED to a metal core PCB, and implements a resin dam on a circuit surface for package molding. An object of the present invention is to provide an optical package that implements an optical efficiency enhancing effect through the role of a receiving unit and light source reflection.

2A and 2B illustrate a manufacturing flowchart and a manufacturing process diagram of an optical package according to the present invention.

Referring to the drawings, the manufacturing process of the optical package according to the present invention comprises the first step of forming a functional hole region on the insulating film and the second step of forming a metal layer on the insulating film and implementing a circuit pattern, the functional hole region The method may include three steps of mounting an optical device on a circuit pattern corresponding to and four steps of forming a resin part to bury the optical device.

Referring to the detailed process diagram attached to the detailed step of each step, first, the first step is to form the functional hole regions (111, 112) through the mechanical processing on the insulating film 110 (S 1). The insulating film 110 may be an insulating film base, and more specifically, a polyimide film may be used. In addition, the functional hole region has a concept including a first hole region 111, which is a device hole, which will be a chip mounting region, and a second hole region 112, which will be implemented as a heat dissipation hole. In particular, the functional hole region may be implemented as a structure including at least one or more second hole regions for heat dissipation, in addition to disposing a first hole region formed at a position corresponding to the mounting position of the optical device.

Thereafter, as a second step, the metal layer 120 is laminated on the insulating film 110, and a circuit pattern is formed (S 2). In this case, the circuit pattern may be implemented to include the chip mounting region 121 and the connection region 122. In particular, the connection region 122 may be implemented such that at least one region separated from the chip mounting region is formed (see FIGS. 3A and 3B). Subsequently, the optical package can be completed through a three-step process of mounting an optical device on a circuit pattern corresponding to the functional hole region and a four-step process of forming a resin part to bury the optical device. In particular, the bonding process with the connection region may be performed for electrical connection after mounting of the optical device, which may be implemented by a wire bonding method or a flip chip method. In the embodiment of the present invention will be described with an example implemented by a wire bonding method.

According to the above-described process, through the structure in which the optical element is mounted on the circuit pattern corresponding to the functional hole region, the advantage that the heat emitted from the optical element can be effectively released through the circuit layer-> functional hole region to be realized. do.

2B illustrates a process including forming a resin dam according to the present invention, in addition to the general process implemented by the formation of the functional hole region, the mounting of an optical device, and the formation of a resin. Based on this, the detailed process is as follows.

S 1 to S two steps are the same as described above, and the step of forming a resin dam after the formation of the circuit pattern is added to add a step.

That is, the process of forming the resin dam 130 on the metal layer 120 is performed, as shown in the process diagram shown in step S3. In this process, a process of forming a resin dam 130 by applying a solder resist to a region other than the chip mounting region 121 and the connection region may be further performed. The process of plating the circuit pattern may be further added. The material forming the resin dam 130 is preferably coated with a white solder resist in order to enhance light efficiency.

Thereafter, a process of mounting the optical device 140 in the inner region of the resin dam 130 and performing wire bonding 150 is performed (step S4), and then includes the optical device 140. A process of forming the resin part 160 filling the resin dam inner region is performed (step S5).

The process of forming the resin part is a process of filling a chip mounting region including the optical device at a boundary of a solder resist, and over-condensing a phosphor and a transparent resin prepared for a white LED to form a convex lens part ( 160) to complete the LED package. In the case where the phosphor and the transparent resin are over-coated, the convex lens-shaped resin portion 160 is formed as shown due to the surface tension. As a result, an existing encapsulation and a plastic lens can be simultaneously formed. The transparent resin is preferably silicon (Si).

In the above-described manufacturing process, an optical device is directly mounted on an upper portion of the chip mounting region 121, which is a circuit pattern, and a first hole region 111 is formed in an open structure in the lower insulating film corresponding thereto. It is possible to improve the heat dissipation efficiency by allowing the heat to be immediately dissipated to the outside.

In addition, the resin dam 130 is formed to facilitate the process of forming the resin portion, it is possible to maximize the light efficiency due to the reflection effect due to the material properties of the resin dam using the white solder resist.

3A to 3D, the optical package manufactured according to the above-described manufacturing process may be implemented in the following structure.

Referring to FIG. 3A, the optical package according to the present invention includes an insulating film 110 having functional hole regions 111 and 112 having an open structure, and is stacked on top of the insulating film 110 and has a circuit pattern. The metal layer 120 having the 121 and 122, the resin dam 130 formed on the metal layer, the optical device 140 mounted inside the resin dam, and the resin part 160 filling the resin dam inner region. It may be implemented in a structure including).

The functional hole region implemented in the insulating film 110 may include a first hole region 111 corresponding to a mounting position of the optical device and at least one second hole region 112 for heat dissipation. have. In this case, the insulating film may use a polyimide film.

In addition, the circuit pattern implemented on the metal layer may include a chip mounting region 121 and a connection region 122 for mounting an optical element formed on the first hole region. In this case, a plating layer formed of at least one of silver (Ag), nickel (Ni), copper (Cu), platinum (Pt), palladium (Pd), and gold (Au) may be further formed on the circuit pattern surface. It is preferable to implement the structure.

As described in the above-described manufacturing process, the resin dam 130 may be implemented as a solder resist pattern formed in a protruding structure in an area excluding the chip mounting area and the connection area, and in particular, white solder resist in consideration of light efficiency. Can be used.

The resin part 160 filling the optical device 140 and the wire 150 bonding part of the optical package according to the present invention may use a phosphor and a transparent resin.

FIG. 3B illustrates an embodiment different from that of FIG. 3A. The difference is that when the circuit pattern is formed to form the connection area with the chip mounting area 121, the connection area 122 is formed as a single structure. It is. For example, the + terminal part serves as the circuit pattern of the chip mounting area, thereby simultaneously acting as a die part and the '+' terminal part, thereby acting as a heat dissipation and a circuit. Can be implemented to do that. Of course, it is possible to implement and implement the structure (Fig. 3a) on the opposite side in the structure of the structure and the reverse shown.

FIG. 3C illustrates a structure in which only one heat dissipation hole 112 is formed as a structure different from that of FIG. 3A, and FIG. 3D illustrates an example in which only the first hole region 111 is formed and no heat dissipation hole is formed. will be. That is, heat dissipation holes other than the first hole area formed in the lower portion of the optical device according to the present invention may be formed in a plurality or no structure as necessary. Of course, it is also possible to implement a structure in which the structure of the circuit pattern in FIGS. 3A and 3B is combined with the formation of the functional holes in FIGS. 3C and 3D.

4 conceptually illustrates a plan view of the optical package of FIGS. 3A to 3D viewed from the top. (A) is the top plan view, and (b) is the bottom plan view.

As shown, the resin dam 130 is formed on the insulating film 110 to have a predetermined pattern to accommodate the resin portion 160, and the optical element 140 inside the resin portion 160. ) And a wire 150 are arranged. Therefore, the light emitted from the optical device 140 emits to the outside by forming a specific color through the phosphor in the resin portion, the resin dam 130 to support the resin portion to ensure a stable structure, When the resin dam is implemented with white solder resist, the reflection effect can be realized to maximize the light efficiency. In particular, as shown in (b), the lower surface of the insulating film 110 is provided with functional hole regions (110, 112), it can be realized at the same time to be able to immediately discharge the heat generated from the optical device to the outside It becomes possible.

In the foregoing detailed description of the present invention, specific examples have been described. However, various modifications are possible within the scope of the present invention. The technical idea of the present invention should not be limited to the embodiments of the present invention but should be determined by the equivalents of the claims and the claims.

110: insulating film
111, 112: functional hole area
120: metal layer
121: chip mounting area
122: connection area
130: Resin Dam
140: optical element
150: wire
160: resin

Claims (22)

Forming a functional hole region in the insulating film;
Forming a metal layer on the insulating film and implementing a circuit pattern;
Mounting an optical device on a circuit pattern corresponding to the functional hole region;
Forming a resin part to bury the optical device;
Optical package manufacturing method comprising a.
The method according to claim 1,
In the first step,
And forming a first hole region corresponding to the mounting position of the optical device on the insulating film by mechanical processing.
The method according to claim 2,
In the first step,
And forming at least one second hole region in addition to the first hole region.
The method according to claim 2,
In the second step,
And implementing the circuit pattern to include a chip mounting area for mounting an optical device and a connection area for electrically connecting the optical device and the circuit pattern.
The method of claim 4,
In the second step,
The optical package manufacturing method of the step of implementing the at least one connection area separated from the chip mounting area.
The method of claim 4,
After step 2 and before step 3,
Forming a resin dam on the circuit pattern further comprising the optical package manufacturing method.
The method of claim 6,
Forming the resin dam,
a1) plating the circuit pattern;
a2) an optical package manufacturing method of forming a resin dam by applying a solder resist to a region other than the chip mounting region and the connection region;
The method of claim 7,
The third step,
The optical package manufacturing method implemented by the process of mounting the optical element in the resin dam inner region.
The method according to claim 8,
In the fourth step,
The optical package manufacturing method implemented by the step of forming a resin portion to fill the resin dam inner region including the optical device.
The method according to claim 8,
The third step,
And mounting the optical device in a chip mounting area and performing electrical connection with the connection area by wire bonding or flip chip bonding.
The method according to claim 8,
The resin unit optical package manufacturing method to implement a convex lens shape of a material containing a phosphor and a transparent resin (Resin).
An insulating film having a functional hole region having an open structure;
A metal layer laminated on the insulating film and having a circuit pattern;
An optical element mounted on the metal layer at a position corresponding to the functional hole region;
Resin portion for embedding the optical element;
Optical package comprising a.
The method of claim 12,
The functional hole area is,
And a first hole area formed at a position corresponding to a mounting position of the optical device.
The method according to claim 13,
The functional hole area is,
And at least one second hole area for heat dissipation in the insulating film.
The method according to claim 13,
The circuit pattern,
And a chip mounting region for mounting an optical element formed on the first hole region, and a connection region for electrically connecting the optical element with a circuit pattern.
The method according to claim 15,
And an at least one connection region separated from the chip mounting region.
The method according to claim 15 or 16,
An optical package further comprising a resin dam formed on a metal layer on which the optical device is mounted.
18. The method of claim 17,
The resin dam,
And a solder resist pattern protruding in a region excluding the chip mounting region and the connection region.
18. The method of claim 17,
The resin portion,
An optical package having a structure for embedding the optical element in the resin dam inner layer region.
The method of claim 19,
The resin portion,
An optical package having a convex lens shape formed of a material including a phosphor and a transparent resin.
The method of claim 20,
An optical package further comprising a plating layer formed of at least one of silver (Ag), nickel (Ni), copper (Cu), platinum (Pt), palladium (Pd), and gold (Au) on the circuit pattern.
The method of claim 20,
The insulating film is a polyimide film (polyimide film) optical package.

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