WO2011043441A1 - Light-emitting device - Google Patents

Light-emitting device Download PDF

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Publication number
WO2011043441A1
WO2011043441A1 PCT/JP2010/067689 JP2010067689W WO2011043441A1 WO 2011043441 A1 WO2011043441 A1 WO 2011043441A1 JP 2010067689 W JP2010067689 W JP 2010067689W WO 2011043441 A1 WO2011043441 A1 WO 2011043441A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
emitting device
circuit board
lamp
heat
Prior art date
Application number
PCT/JP2010/067689
Other languages
French (fr)
Japanese (ja)
Inventor
智也 田淵
杉本　努
三宅　徹
朋哉 今
Original Assignee
京セラ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京セラ株式会社 filed Critical 京セラ株式会社
Publication of WO2011043441A1 publication Critical patent/WO2011043441A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements

Definitions

  • the present invention relates to a light emitting device including a light emitting element such as a light emitting diode.
  • a light emitting device having a light emitting element is expected from the viewpoint of low power consumption.
  • further improvements in light emission intensity are required.
  • the calorific value of the light emitting device tends to increase as the light emission intensity is improved.
  • the increase in the amount of heat generated may affect the light emission efficiency of the light emitting device.
  • the luminous efficiency affects the luminous intensity of the light emitting device. Therefore, in the future, in the development of light emitting devices, it is necessary to further improve the heat dissipation characteristics in order to improve the light emission intensity. JP 2007-1116075 A
  • a light-emitting device includes a circuit board having a through-hole, a base, a light-emitting element that is provided on the upper surface of the base and is located in the through-hole when viewed in plan, and a light-emitting element.
  • the lamp includes a terminal that is electrically connected and has a terminal bonded to the lower surface of the circuit board, and a heat dissipation member that is in contact with the lower surface of the lamp.
  • FIG. 2 shows a longitudinal sectional view of the light emitting device shown in FIG. 1.
  • the top view of the light-emitting device shown by FIG. 1 is shown.
  • FIG. 5 is a longitudinal sectional view showing a modification of the light emitting device shown in FIG. 1.
  • FIG. 2 shows a longitudinal sectional view of the lamp shown in FIG. 1.
  • FIG. 3 is an operation diagram showing a heat conduction path in the light emitting device shown in FIG. 2.
  • FIG. 4 is an operation diagram illustrating a heat conduction path in the light emitting device illustrated in FIG. 3.
  • the disassembled perspective view of the light-emitting device in 2nd Embodiment is shown.
  • FIG. 9 is a longitudinal sectional view of the light emitting device shown in FIG. 8.
  • the disassembled perspective view of the light-emitting device in 3rd Embodiment is shown.
  • FIG. 11 shows a longitudinal sectional view of the light emitting device shown in FIG. 10.
  • the disassembled perspective view of the light-emitting device in 4th Embodiment is shown.
  • FIG. 13 is a longitudinal sectional view of the light emitting device shown in FIG. 12.
  • the light emitting device according to each embodiment will be described in detail with reference to the drawings.
  • the drawings referred to below for convenience of explanation, among the constituent members of the embodiment, only the main members necessary for explaining the present invention are shown in a simplified manner. Therefore, the light-emitting device according to the present invention can include arbitrary constituent members that are not shown in the drawings referred to in this specification.
  • the dimension of the member in each figure does not represent the dimension of an actual structural member, the dimension ratio of each member, etc. faithfully.
  • the light-emitting device of the first embodiment includes a circuit board 1 having a through-hole 10 and a light-emitting element 21 positioned in the through-hole 10 when viewed in plan. And a heat dissipating member 3 in contact with the lower surface of the lamp 2.
  • the lamp 2 is provided on the upper surface of the base 22 and the light emitting element 21 positioned in the through-hole 10 when viewed in plan, and is electrically connected to the light emitting element 21 and is connected to the circuit board 1. And a terminal 23 bonded to the lower surface.
  • the light emitting device is provided in a virtual xyz space.
  • the upward direction means the positive direction of the virtual z axis.
  • the heat radiating member 3 is in contact with the lower surface of the lamp 2. Therefore, the heat generated in the lamp 2 is not necessarily transmitted to the heat radiating member 3 via the circuit board 1 but can be transferred from the lamp 2 to the heat radiating member 3 without going through the circuit board 1. As a result, since heat can be efficiently transferred from the lamp 2 to the heat radiating member 3, the heat radiating characteristics of the light emitting device can be improved.
  • the heat radiating member 3 since the heat radiating member 3 is in contact with the lamp 2, the heat radiation characteristics are improved, so that the light emission intensity of the light emitting device is improved.
  • the heat generated by the lamp 2 is conducted to the heat radiating member 3 in contact with the lamp 2 and is dissipated from the heat radiating member 3 to, for example, the atmosphere.
  • heat conduction is indicated by solid arrows and heat dissipation is indicated by dashed arrows.
  • heat can be efficiently transmitted from the lamp 2 to the heat radiating member 3, so that the amount of heat transmitted from the lamp 2 to the circuit board 1 can be reduced. Therefore, the influence on the circuit board 1 can be reduced. Specifically, for example, it is possible to suppress a large change in the resistivity of the electric circuit included in the circuit board 1.
  • the main heat generated from the lamp 2 is heat generated when the light emitting element 21 constituting the lamp 2 emits light.
  • the heat generated from the light emitting element 21 is transmitted from the light emitting element 21 to the base 22 constituting the lamp 2.
  • the circuit board 1 is positioned on the upper surface side of the base 22 constituting the lamp 2, and the heat radiating member 3 is in contact with the lower surface of the base 22.
  • the circuit board 1 and the heat dissipation member 3 are positioned so as to be opposite to each other when viewed from the base body 22.
  • the circuit board 1 is positioned on the opposite side of the heat flow (lower direction in FIG. 2) transmitted from the base 22 to the heat radiating member 3. Therefore, in the light emitting device of this embodiment, the amount of heat transferred from the lamp 2 to the circuit board 1 can be reduced.
  • the circuit board 1 in the light emitting device of this embodiment includes an insulating substrate 11, a first conductor pattern 12 provided on the lower surface of the insulating substrate 11, and a second conductor provided on the upper surface of the insulating substrate 11. Pattern 13 is provided. Further, the circuit board 1 has via conductors 14 embedded so as to be drawn out on the upper surface and the lower surface of the insulating substrate 11, respectively. The via conductor 14 is joined to the first conductor pattern 12 and the second conductor pattern 13. The second conductor pattern 13 is electrically connected to the first conductor pattern 12 via the via conductor 14.
  • the first conductor pattern 12 and the second conductor pattern 13 in the circuit board 1 shown in FIG. 2 are electrically connected via the via conductor 14.
  • the electrical connection between the first conductor pattern 12 and the second conductor pattern 13 is not limited to the configuration via the via conductor 14.
  • the third conductor pattern 15 is disposed on the side surface of the insulating substrate 11, and the first conductor pattern 12 and the second conductor pattern are interposed via the third conductor pattern 15. 13 may be electrically connected.
  • the light emitting device of the present embodiment includes the second conductor pattern 13
  • the heat generated by the lamp 2 and conducted to the circuit board 1 is easily dissipated from the second conductor pattern 13 into the atmosphere, for example. It has become. Therefore, the light emitting device of the present embodiment is improved with respect to heat dissipation characteristics and further improved with respect to light emission intensity.
  • the heat conduction from the lamp 2 to the circuit board 1 will be described in more detail. Heat generated by the light emitting element 21 of the lamp 2 is conducted to the first conductor pattern 12 of the circuit board 1 through the terminal 23. Heat is conducted from the first conductor pattern 12 to the via conductor 14.
  • the light emitting device of this embodiment is improved with respect to thermal control by having such a heat conduction path.
  • the circuit board 1 has a through hole 10 that opens to the upper surface and the lower surface.
  • the through hole 10 is formed in the central portion when the circuit board 1 is viewed in plan.
  • the light emitting element 21 constituting the lamp 2 is located inside the through hole 10. Therefore, the light emitted from the light emitting element 21 passes through the through hole 10 and is emitted above the circuit board 1.
  • the insulating substrate 11 a material having good insulating properties can be used.
  • the insulating substrate 11 is substantially made of a resin material, for example.
  • the insulating substrate 11 may be substantially made of a ceramic material.
  • the thickness of the insulating substrate 11 can be set to 1 mm to 5 mm, for example.
  • the first conductor pattern 12, the second conductor pattern 13, and the via conductor 14 a material having good conductivity can be used.
  • examples of the material for these conductors include tungsten, molybdenum, manganese, and copper.
  • the lamp 2 in the light emitting device of the present embodiment is provided in the upper surface of the base 22 and the through-hole 10 of the circuit board 1 when viewed in plan.
  • the light-emitting element 21 has a plurality of terminals 23 that are electrically connected to the light-emitting element 21 and bonded to the lower surface of the circuit board 1.
  • the plurality of terminals 23 are electrically connected to the light emitting element 21 and the first conductor pattern 12, respectively.
  • the lamp 2 further includes a frame member 24 provided on the upper surface of the base 22 so as to surround the light emitting element 21, and a wavelength conversion member 25 that covers the light emitting element 21 and is fixed to the frame member 24. .
  • the light emitting element 21 and the frame member 24 constituting the lamp 2 are inserted into the through hole 10 of the circuit board 1.
  • the base 22 and the terminals 23 constituting the lamp 2 are located on the lower surface side of the circuit board 1. Further, the terminal 23 is electrically connected to the first conductor pattern 12. In this way, the lamp 2 is mounted on the circuit board 1.
  • a material having good insulating properties can be used as the substrate 22 .
  • a material having good thermal conductivity As the substrate 22, a material having good insulating properties can be used.
  • the material of the base 22 include a ceramic material typified by alumina and mullite, or a glass ceramic material.
  • the thickness (length in the z direction) of the base 22 can be set to 1 mm to 3 mm, for example.
  • the light emitting element 21 is, for example, a light emitting diode (LED).
  • the light emitting element 21 emits primary light according to the driving power.
  • the plurality of terminals 23 are disposed on the upper surface of the base 22 and are joined to the base 22.
  • the plurality of terminals 23 are electrically connected to the light emitting element 21 and the first conductor pattern 12, respectively.
  • the material of the terminal 23 it is preferable to use a material having good conductivity. Examples of the material of the terminal 23 include tungsten, molybdenum, manganese, and copper.
  • the frame member 24 is provided on the upper surface of the base body 22 so as to surround the light emitting element 21.
  • the base 22 and the frame member 24 are joined.
  • the shape of the inner wall surface surrounding the light emitting element 21 in the frame member 24 is circular in plan view, the light emitted from the light emitting element 21 can be uniformly reflected in all directions and emitted to the outside very uniformly. .
  • the entire frame member 24 is inserted into the through hole 10, but the present invention is not particularly limited thereto. A part of the frame member 24 may be inserted into the through hole 10.
  • the upper surface of the lamp 2 is located above the upper surface of the circuit board 1.
  • the frame member 24 constituting the lamp 2 is located above the upper surface of the circuit board 1. This is because when the lamp 2 is positioned as described above, the light emitted from the light emitting element 21 is easily emitted to the outside without being reflected by the inner peripheral surface of the through hole 10.
  • the light emission intensity of the light emitting device can be improved. Moreover, since it is not necessary to process the inner peripheral surface of the through-hole 10 so that the light radiated
  • the lamp 2 is preferably separated from the inner peripheral surface of the through hole 10.
  • the frame member 24 constituting the lamp 2 is separated from the circuit board 1. Therefore, heat transfer from the frame member 24 to the circuit board 1 is suppressed. Therefore, heat transfer from the lamp 2 to the circuit board 1 is suppressed. Thereby, the heat generated by the lamp 2 is more easily conducted to the heat radiating member 3 than the circuit board 1. Therefore, the light emitting device of this embodiment is improved with respect to thermal control.
  • the frame member 24 can be made of a material having good insulation.
  • Examples of the material of the frame member 24 include ceramic materials such as alumina, mullite, titanium oxide, zirconium oxide, and yttrium oxide, or glass ceramic materials.
  • the main component of the material constituting the frame member 24 is the same as the main component of the material constituting the base body 22. This is because the difference between the thermal expansion coefficient of the base 22 and the thermal expansion coefficient of the frame member 24 can be reduced.
  • a main component means the component with the largest mass ratio among the materials which comprise a member here.
  • the wavelength conversion member 25 is supported on the frame member 24 and is provided on the light emitting element 21 so as to face the light emitting element 21 with a gap.
  • a translucent resin member is disposed between the light emitting element 21 and the wavelength conversion member 25. In order to prevent heat from being transmitted from the resin to the wavelength conversion member 25, it is preferable that the resin member and the wavelength conversion member 25 are separated from each other.
  • the wavelength conversion member 25 includes a plurality of phosphors. When the primary light emitted from the light emitting element 21 is incident on the wavelength conversion member 25, the phosphor contained therein is excited to emit secondary light. The wavelength conversion member 25 emits white light, for example.
  • the wavelength converting member 25 is made of, for example, a silicone resin, an acrylic resin, or an epoxy resin, and the resin contains a phosphor.
  • the phosphor include a blue phosphor emitting fluorescence of 430 nm to 490 nm, a green phosphor emitting fluorescence of 500 nm to 560 nm, a yellow phosphor emitting fluorescence of 540 nm to 600 nm, and a fluorescence of 590 nm to 700 nm. And a red phosphor that emits light.
  • One of the phosphors is selected according to the wavelength of the primary light emitted from the light emitting element 21.
  • the heat radiating member 3 is in contact with the lower surface of the base 22 constituting the lamp 2.
  • contact in the present embodiment does not only indicate a state in which two specific members are in contact but also includes a state in which the two specific members are directly or indirectly joined. It is a concept.
  • Directly joined means a state where the members are joined without using a member for joining two specific members. Moreover, being indirectly joined shows the state joined using the member (for example, adhesive agent) for joining two specific members.
  • the lamp 2 and the heat radiating member 3 are indirectly bonded using an adhesive
  • the adhesive for example, a heat dissipating grease can be used.
  • the thickness of the adhesive in the vertical direction is preferably smaller than the thickness in the vertical direction of the base 22 and the heat radiating member 3. This is because heat transmitted from the lamp 2 to the adhesive can be suppressed from accumulating in the adhesive.
  • the heat dissipating member 3 is located below the base body 22.
  • the heat radiating member 3 has a flat plate-shaped portion 31 that is in contact with the lower surface of the base 22 and a plurality of fins 32 positioned on the lower surface side of this portion. After the plate-shaped portion 31 and the plurality of fins 32 are separately manufactured, the fins 32 may be joined to the lower surface of the plate-shaped portion 31.
  • the flat plate-shaped portion 31 and the plurality of fins 32 may be integrally formed.
  • the thickness (length in the z direction) of the plate-shaped portion 31 can be set to 1 mm to 5 mm, for example. Further, the length of the plurality of fins 32 in the z direction can be set to 3 mm to 50 mm, for example.
  • the heat radiating member 3 is a member for radiating the heat generated in the lamp 2 to the outside. Therefore, it is preferable to use a material with good thermal conductivity as the heat radiating member 3.
  • a metal material can be used as the heat radiating member 3.
  • the width in the horizontal direction (xy direction) of the heat radiating member 3 is larger than the width in the horizontal direction of the base body 22.
  • a part of the upper surface of the heat radiating member 3 faces a part of the lower surface of the circuit board 1 without interposing the base 22 therebetween.
  • the heat radiating member 3 can be enlarged.
  • more fins 32 can be provided.
  • the heat dissipating member 3 is separated from the circuit board 1. This is because heat transmitted from the lamp 2 to the heat radiating member 3 can be prevented from being transmitted from the heat radiating member 3 to the circuit board 1. Therefore, it is possible to further suppress the heat generated in the lamp 2 from being transmitted to the circuit board 1, and to efficiently radiate heat in the heat radiating member 3.
  • the light-emitting device of this embodiment further includes a plurality of metal members 4 that connect the heat dissipation member 3 and the circuit board 1.
  • the plurality of metal members 4 are indicated by dotted lines in a state of being transmitted through the circuit board 1 and the heat dissipation member 3.
  • An example of the metal member 4 is a screw. Screw holes are formed in the four corners of the flat circuit board 1 and the flat plate portion 31 of the heat radiating member 3, respectively. The metal member 4 (screw) is fixed to these screw holes.
  • the metal member 4 integrally fixes the circuit board 1, the lamp 2, and the heat radiating member 3 in a state where the lamp 2 is sandwiched between the circuit board 1 and the heat radiating member 3.
  • the heat radiating member 3 is fixed to the circuit board 1 by connecting the heat radiating member 3 to the circuit board 1 using the metal member 4. Therefore, even when a part of the heat generated by the lamp 2 is conducted to the circuit board 1, the heat is easily conducted to the heat radiating member 3 through the metal member 4. Therefore, the light emitting device of the present embodiment is improved with respect to heat dissipation characteristics and further improved with respect to light emission intensity.
  • the heat generated by the lamp 2 is mainly conducted through two paths.
  • One path is a path indicated by reference numeral 201 in FIG. 6 and is a path that travels in the horizontal direction through the heat radiating member 3 after being transmitted from the lamp 2 to the heat radiating member 3.
  • the horizontal direction is the virtual x-axis direction in FIG.
  • the other path is a path indicated by reference numeral 202 in FIG. 6 and is a path that travels in the horizontal direction in the circuit board 1 after being transmitted from the lamp 2 to the circuit board 1.
  • the heat that has traveled in the horizontal direction on the circuit board 1 is conducted to the heat radiating member 3 through the metal member 4.
  • the light-emitting device of the present embodiment mainly has two heat conduction paths 201 and 202, so that heat control can be efficiently performed in the xy plane direction of the virtual xyz space.
  • the light emitting device of this embodiment includes a heat conduction path 201 that travels in the plane direction through the heat dissipation member 3 and a heat conduction path 202 that travels in the plane direction through the circuit board 1.
  • heat conduction can be performed by effectively using the entire region in plan view, and heat dissipation can be improved.
  • the heat conduction path 201 in the heat radiating member 3 is schematically indicated by a dotted line
  • the heat conduction path 202 in the circuit board 1 is schematically indicated by a solid line.
  • the light emitting device of the second embodiment is similar to the light emitting device of the first embodiment in that a part of the upper surface of the heat radiating member 3 is a circuit without interposing the base 22 therebetween. It faces a part of the lower surface of the substrate 1. And the insulating member 5 is arrange
  • the insulating member 5 is preferably separated from either the circuit board 1 or the heat radiating member 3. As described above, when the insulating member 5 is separated from either the circuit board 1 or the heat radiating member 3, it is possible to suppress heat from being transferred from the heat radiating member 3 to the circuit board 1 through the insulating member 5. .
  • the insulating member 5 is joined to the heat radiating member 3 and separated from the circuit board 1, but the insulating member 5 is joined to the circuit board 1 and separated from the heat radiating member 3. Good.
  • the insulating member 5 examples include ceramic materials such as alumina, mullite, titanium oxide, zirconium oxide, and yttrium oxide, glass ceramic materials, insulating resins, and rubbers. At this time, it is preferable to use an insulating resin or rubber as the insulating member 5.
  • the circuit board 1 and the heat radiating member 3 are expanded or thermally deformed so that the circuit board 1 and the heat radiating member 3 are in contact with the insulating member 5 and insulated. There is a possibility that a pressing force is applied to the member 5. At this time, when an insulating resin or rubber is used as the insulating member 5, the insulating member 5 is easily deformed, and thus the pressing force can be relaxed by the insulating member 5. Therefore, durability of the circuit board 1 and the heat radiating member 3 can be improved.
  • the light emitting device of the third embodiment is similar to the light emitting device of the first embodiment in that a part of the upper surface of the heat dissipation member 3 is a circuit without interposing the base 22. It faces a part of the lower surface of the substrate 1. And when the heat radiating member 3 has the groove part 33 in an upper surface and the heat radiating member 3 is planarly viewed, the groove part 33 is located in the side rather than the area
  • the portion of the flat plate portion 31 constituting the heat radiating member 3 where the groove 33 is formed has a smaller thickness than the other portions of the flat plate portion 31. Therefore, the part in which the groove part 33 was formed becomes easy to deform
  • the heat radiating member 3 may expand or deform, and stress may be applied to the heat radiating member 3.
  • the stress can be relieved by deforming the portion where the groove 33 is formed. Therefore, the durability of the heat radiating member 3 can be improved.
  • the groove 33 When the groove 33 is located on the side of the region where the lamp 2 is in contact, it is possible to prevent the contact area between the lamp 2 and the heat radiating member 3 from being reduced. It can also be suppressed that the heat transfer to the member 3 is reduced. Even when the heat radiating member 3 expands or deforms, the portion where the groove 33 is formed is easily deformed, so that the heat radiating member 3 can be prevented from being separated from the lamp 2.
  • the region of the heat radiating member 3 on which the lamp 2 is in contact is preferably surrounded by the groove 33.
  • the width (length in the x direction) of the groove 33 in FIG. 11 can be set to 0.1 mm to 10 mm, for example.
  • the depth of the groove 33 (the length in the z direction) can be set to 0.1 mm to 1.5 mm, for example.
  • the heat dissipating member 3 is in contact with the lower surface of the lamp 2 in the same manner as the light emitting device of the first embodiment.
  • the upper surface of the flat portion 31 of the heat radiating member 3 is flat, and the upper surface of the portion 31 is in contact with the lower surface of the lamp 2.
  • the heat dissipating member 3 has a recess 34 on the upper surface.
  • the base 22 is located in the recess 34 and the lower surface of the base 22 is in contact with the bottom surface of the recess 34.
  • the base 22 can be easily positioned.
  • the width in the lateral direction (x direction) of the recess 34 is larger than the width in the lateral direction (x direction) of the lamp 2 as shown in FIG. preferable.
  • a part of the upper surface of the heat radiating member 3 faces a part of the lower surface of the circuit board 1 without the base 22 interposed therebetween. is doing. And in the area

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  • General Engineering & Computer Science (AREA)
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  • Optics & Photonics (AREA)
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Abstract

Disclosed is a light-emitting device wherein heat dissipation characteristics are improved for the purpose of increasing the luminous intensity of the light-emitting device. Specifically disclosed is a light-emitting device which comprises a circuit board (1) that has a through hole (10), a lamp (2) that has a light-emitting element (21) which is arranged at a position that is within the through hole (10) when viewed in plan, and a heat dissipation member (3) that is in contact with the lower surface of the lamp (2). The lamp (2) comprises: a base (22); the light-emitting element (21), which is arranged on the upper surface of the base (22) so as to be within the through hole (10) when viewed in plan; and a terminal (23) that is electrically connected to the light-emitting element (21) and bonded to the lower surface of the circuit board (1).

Description

発光装置Light emitting device
　本発明は、例えば発光ダイオードなどの発光素子を含む発光装置に関するものである。 The present invention relates to a light emitting device including a light emitting element such as a light emitting diode.
　近年、例えば照明分野などにおいて、発光素子を有する発光装置の開発が進められている。発光素子を有する発光装置は、低消費電力の観点などにおいて期待されている。発光装置の開発においては、さらなる発光強度の向上が求められている。 In recent years, for example, in the lighting field, development of light emitting devices having light emitting elements has been promoted. A light emitting device having a light emitting element is expected from the viewpoint of low power consumption. In the development of light emitting devices, further improvements in light emission intensity are required.
　発光装置の発熱量は、発光強度を向上させることに伴って増大する傾向にある。一方で、上記の発熱量が増大することによって、発光装置の発光効率に影響が及ぶことがある。発光効率は、発光装置の発光強度に影響を与える。従って、今後、発光装置の開発においては、発光強度を向上させるために、放熱特性に関してさらに改善する必要がある。
特開２００７－１１６０７５号公報 The calorific value of the light emitting device tends to increase as the light emission intensity is improved. On the other hand, the increase in the amount of heat generated may affect the light emission efficiency of the light emitting device. The luminous efficiency affects the luminous intensity of the light emitting device. Therefore, in the future, in the development of light emitting devices, it is necessary to further improve the heat dissipation characteristics in order to improve the light emission intensity.
JP 2007-1116075 A
　本発明の一つの態様によれば、発光装置は、貫通孔を有する回路基板と、基体、基体の上面に設けられるとともに平面視した場合に貫通孔の内に位置する発光素子、および発光素子と電気的に接続されるとともに回路基板の下面に接合された端子を有したランプと、ランプの下面に当接された放熱部材とを備えている。 According to one aspect of the present invention, a light-emitting device includes a circuit board having a through-hole, a base, a light-emitting element that is provided on the upper surface of the base and is located in the through-hole when viewed in plan, and a light-emitting element. The lamp includes a terminal that is electrically connected and has a terminal bonded to the lower surface of the circuit board, and a heat dissipation member that is in contact with the lower surface of the lamp.
第１の実施形態における発光装置の分解斜視図を示している。The disassembled perspective view of the light-emitting device in 1st Embodiment is shown. 図１に示された発光装置の縦断面図を示している。FIG. 2 shows a longitudinal sectional view of the light emitting device shown in FIG. 1. 図１に示された発光装置の平面図を示している。The top view of the light-emitting device shown by FIG. 1 is shown. 図１に示された発光装置の変形例を示す縦断面図を示している。FIG. 5 is a longitudinal sectional view showing a modification of the light emitting device shown in FIG. 1. 図１に示されたランプの縦断面図を示している。FIG. 2 shows a longitudinal sectional view of the lamp shown in FIG. 1. 図２に示された発光装置における熱伝導経路を示す作用図である。FIG. 3 is an operation diagram showing a heat conduction path in the light emitting device shown in FIG. 2. 図３に示された発光装置における熱伝導経路を示す作用図である。FIG. 4 is an operation diagram illustrating a heat conduction path in the light emitting device illustrated in FIG. 3. 第２の実施形態における発光装置の分解斜視図を示している。The disassembled perspective view of the light-emitting device in 2nd Embodiment is shown. 図８に示された発光装置の縦断面図を示している。FIG. 9 is a longitudinal sectional view of the light emitting device shown in FIG. 8. 第３の実施形態における発光装置の分解斜視図を示している。The disassembled perspective view of the light-emitting device in 3rd Embodiment is shown. 図１０に示された発光装置の縦断面図を示している。FIG. 11 shows a longitudinal sectional view of the light emitting device shown in FIG. 10. 第４の実施形態における発光装置の分解斜視図を示している。The disassembled perspective view of the light-emitting device in 4th Embodiment is shown. 図１２に示された発光装置の縦断面図を示している。FIG. 13 is a longitudinal sectional view of the light emitting device shown in FIG. 12.
　以下、各実施形態にかかる発光装置について、図面を用いて詳細に説明する。但し、以下で参照する各図は、説明の便宜上、実施形態の構成部材のうち、本発明を説明するために必要な主要部材のみを簡略化して示したものである。したがって、本発明に係る発光装置は、本明細書が参照する各図に示されていない任意の構成部材を備え得る。また、各図中の部材の寸法は、実際の構成部材の寸法および各部材の寸法比率等を忠実に表したものではない。 Hereinafter, the light emitting device according to each embodiment will be described in detail with reference to the drawings. However, in the drawings referred to below, for convenience of explanation, among the constituent members of the embodiment, only the main members necessary for explaining the present invention are shown in a simplified manner. Therefore, the light-emitting device according to the present invention can include arbitrary constituent members that are not shown in the drawings referred to in this specification. Moreover, the dimension of the member in each figure does not represent the dimension of an actual structural member, the dimension ratio of each member, etc. faithfully.
　図１から図３までに示されているように、第１の実施形態の発光装置は、貫通孔１０を有する回路基板１と、平面視した場合に貫通孔１０の内に位置する発光素子２１を有するランプ２と、ランプ２の下面に当接された放熱部材３とを備えている。ランプ２は、基体２２と、この基体２２の上面に設けられるとともに平面視した場合に貫通孔１０の内に位置する発光素子２１と、発光素子２１と電気的に接続されるとともに回路基板１の下面に接合された端子２３とを有する。 As shown in FIGS. 1 to 3, the light-emitting device of the first embodiment includes a circuit board 1 having a through-hole 10 and a light-emitting element 21 positioned in the through-hole 10 when viewed in plan. And a heat dissipating member 3 in contact with the lower surface of the lamp 2. The lamp 2 is provided on the upper surface of the base 22 and the light emitting element 21 positioned in the through-hole 10 when viewed in plan, and is electrically connected to the light emitting element 21 and is connected to the circuit board 1. And a terminal 23 bonded to the lower surface.
　なお、図１において、発光装置は、仮想のｘｙｚ空間に設けられている。図１において、上方向とは仮想のｚ軸の正方向のことをいう。 In FIG. 1, the light emitting device is provided in a virtual xyz space. In FIG. 1, the upward direction means the positive direction of the virtual z axis.
　このように、本実施形態の発光装置においては、放熱部材３がランプ２の下面に当接されている。そのため、ランプ２で発生した熱が必ずしも回路基板１を介して放熱部材３へ伝達するのではなく、回路基板１を介さずにランプ２から放熱部材３へ熱を伝達することが可能となる。結果、ランプ２から放熱部材３へ効率良く熱を伝達させることができるので、発光装置の放熱特性を向上させることができる。 Thus, in the light emitting device of the present embodiment, the heat radiating member 3 is in contact with the lower surface of the lamp 2. Therefore, the heat generated in the lamp 2 is not necessarily transmitted to the heat radiating member 3 via the circuit board 1 but can be transferred from the lamp 2 to the heat radiating member 3 without going through the circuit board 1. As a result, since heat can be efficiently transferred from the lamp 2 to the heat radiating member 3, the heat radiating characteristics of the light emitting device can be improved.
　本実施形態の発光装置において、放熱部材３がランプ２に当接されていることによって、放熱特性が向上されていることから、発光装置の発光強度が向上されている。図５に示すように、ランプ２によって発生された熱は、ランプ２に当接された放熱部材３へ伝導されて、放熱部材３から例えば大気中へ放散される。図５において、熱の伝導が、実線の矢印によって示されているとともに、熱の放散が、破線の矢印によって示されている。 In the light emitting device of the present embodiment, since the heat radiating member 3 is in contact with the lamp 2, the heat radiation characteristics are improved, so that the light emission intensity of the light emitting device is improved. As shown in FIG. 5, the heat generated by the lamp 2 is conducted to the heat radiating member 3 in contact with the lamp 2 and is dissipated from the heat radiating member 3 to, for example, the atmosphere. In FIG. 5, heat conduction is indicated by solid arrows and heat dissipation is indicated by dashed arrows.
　また、本実施形態の発光装置においては、ランプ２から放熱部材３へ効率良く熱を伝達させることができるので、ランプ２から回路基板１へ伝達する熱の量を少なくすることができる。そのため、回路基板１への影響を小さくできる。具体的には、例えば、回路基板１が有する電気回路の抵抗率が大きく変化することを抑制できる。 Further, in the light emitting device of the present embodiment, heat can be efficiently transmitted from the lamp 2 to the heat radiating member 3, so that the amount of heat transmitted from the lamp 2 to the circuit board 1 can be reduced. Therefore, the influence on the circuit board 1 can be reduced. Specifically, for example, it is possible to suppress a large change in the resistivity of the electric circuit included in the circuit board 1.
　ランプ２から発生する熱の主要なものは、ランプ２を構成する発光素子２１が発光する時に発生する熱である。この発光素子２１から発生した熱は、発光素子２１からランプ２を構成する基体２２へと伝達する。本実施形態の発光装置においては、回路基板１がランプ２を構成する基体２２の上面側に位置するとともに、放熱部材３が基体２２の下面に当接されている。言い換えれば、基体２２から見て回路基板１と放熱部材３とが互いに反対側となるように位置している。 The main heat generated from the lamp 2 is heat generated when the light emitting element 21 constituting the lamp 2 emits light. The heat generated from the light emitting element 21 is transmitted from the light emitting element 21 to the base 22 constituting the lamp 2. In the light emitting device of the present embodiment, the circuit board 1 is positioned on the upper surface side of the base 22 constituting the lamp 2, and the heat radiating member 3 is in contact with the lower surface of the base 22. In other words, the circuit board 1 and the heat dissipation member 3 are positioned so as to be opposite to each other when viewed from the base body 22.
　このように、基体２２から放熱部材３へと伝わる熱の流れ（図２における下側方向）に対して、回路基板１が反対側に位置している。そのため、本実施形態の発光装置においては、ランプ２から回路基板１へ伝達する熱の量を少なくすることができる。 Thus, the circuit board 1 is positioned on the opposite side of the heat flow (lower direction in FIG. 2) transmitted from the base 22 to the heat radiating member 3. Therefore, in the light emitting device of this embodiment, the amount of heat transferred from the lamp 2 to the circuit board 1 can be reduced.
　本実施形態の発光装置における回路基板１は、絶縁性基板１１と、絶縁性基板１１の下面に設けられた第１の導体パターン１２と、絶縁性基板１１の上面に設けられた第２の導体パターン１３とを備えている。また、回路基板１は、絶縁性基板１１の上面および下面にそれぞれ引き出されるように埋設されたビア導体１４を有している。ビア導体１４は、第１の導体パターン１２および第２の導体パターン１３に接合されている。第２の導体パターン１３は、ビア導体１４を介して第１の導体パターン１２に電気的に接続されている。 The circuit board 1 in the light emitting device of this embodiment includes an insulating substrate 11, a first conductor pattern 12 provided on the lower surface of the insulating substrate 11, and a second conductor provided on the upper surface of the insulating substrate 11. Pattern 13 is provided. Further, the circuit board 1 has via conductors 14 embedded so as to be drawn out on the upper surface and the lower surface of the insulating substrate 11, respectively. The via conductor 14 is joined to the first conductor pattern 12 and the second conductor pattern 13. The second conductor pattern 13 is electrically connected to the first conductor pattern 12 via the via conductor 14.
　図２に示す回路基板１における第１の導体パターン１２および第２の導体パターン１３は、ビア導体１４を介して電気的に接続されている。しかしながら、第１の導体パターン１２および第２の導体パターン１３の電気的な接続は、ビア導体１４を介する構成には限られない。例えば、図４に示すように、絶縁性基板１１の側面に第３の導体パターン１５を配設して、この第３の導体パターン１５を介して第１の導体パターン１２および第２の導体パターン１３を電気的に接続してもよい。 The first conductor pattern 12 and the second conductor pattern 13 in the circuit board 1 shown in FIG. 2 are electrically connected via the via conductor 14. However, the electrical connection between the first conductor pattern 12 and the second conductor pattern 13 is not limited to the configuration via the via conductor 14. For example, as shown in FIG. 4, the third conductor pattern 15 is disposed on the side surface of the insulating substrate 11, and the first conductor pattern 12 and the second conductor pattern are interposed via the third conductor pattern 15. 13 may be electrically connected.
　本実施形態の発光装置が第２の導体パターン１３を備えていることによって、ランプ２によって発生されて回路基板１に伝導された熱が、第２の導体パターン１３から例えば大気中に放散され易くなっている。従って、本実施形態の発光装置は、放熱特性に関して改善されており、発光強度に関してさらに向上されている。 Since the light emitting device of the present embodiment includes the second conductor pattern 13, the heat generated by the lamp 2 and conducted to the circuit board 1 is easily dissipated from the second conductor pattern 13 into the atmosphere, for example. It has become. Therefore, the light emitting device of the present embodiment is improved with respect to heat dissipation characteristics and further improved with respect to light emission intensity.
　ランプ２から回路基板１への熱伝導についてさらに詳細に説明する。ランプ２の発光素子２１によって発生された熱は、端子２３を介して回路基板１の第１の導体パターン１２に伝導される。熱は、第１の導体パターン１２からビア導体１４へ伝導される。本実施形態の発光装置は、このような熱伝導経路を有していることにより、熱制御に関して改善されている。 The heat conduction from the lamp 2 to the circuit board 1 will be described in more detail. Heat generated by the light emitting element 21 of the lamp 2 is conducted to the first conductor pattern 12 of the circuit board 1 through the terminal 23. Heat is conducted from the first conductor pattern 12 to the via conductor 14. The light emitting device of this embodiment is improved with respect to thermal control by having such a heat conduction path.
　また、回路基板１は、上面および下面に開口する貫通孔１０を有している。本実施形態の発光装置において、貫通孔１０は回路基板１を平面視した場合に、中央部分に形成されている。回路基板１を平面視した場合に、貫通孔１０の内側には、ランプ２を構成する発光素子２１が位置している。そのため、発光素子２１から放出された光は貫通孔１０の内を通って回路基板１の上方に放射される。 Moreover, the circuit board 1 has a through hole 10 that opens to the upper surface and the lower surface. In the light emitting device of the present embodiment, the through hole 10 is formed in the central portion when the circuit board 1 is viewed in plan. When the circuit board 1 is viewed in plan, the light emitting element 21 constituting the lamp 2 is located inside the through hole 10. Therefore, the light emitted from the light emitting element 21 passes through the through hole 10 and is emitted above the circuit board 1.
　絶縁性基板１１としては、絶縁性の良好な材料を用いることができる。具体的には、絶縁性基板１１は、例えば、実質的に樹脂材料からなる。また、絶縁性基板１１は、実質的にセラミックス材料からなっていてもよい。絶縁性基板１１の厚みとしては、例えば１ｍｍ～５ｍｍに設定することができる。 As the insulating substrate 11, a material having good insulating properties can be used. Specifically, the insulating substrate 11 is substantially made of a resin material, for example. The insulating substrate 11 may be substantially made of a ceramic material. The thickness of the insulating substrate 11 can be set to 1 mm to 5 mm, for example.
　第１の導体パターン１２、第２の導体パターン１３及びビア導体１４としては、導電性の良好な材料を用いることができる。具体的には、これらの導体の材料としては、例えば、タングステン、モリブデン、マンガンまたは銅が挙げられる。 As the first conductor pattern 12, the second conductor pattern 13, and the via conductor 14, a material having good conductivity can be used. Specifically, examples of the material for these conductors include tungsten, molybdenum, manganese, and copper.
　本実施形態の発光装置におけるランプ２は、図２，５に示すように、基体２２と、この基体２２の上面に設けられるとともに平面視した場合に回路基板１の貫通孔１０の内に位置する発光素子２１と、発光素子２１と電気的に接続されるとともに回路基板１の下面に接合された複数の端子２３を有する。複数の端子２３は、それぞれ発光素子２１および第１の導体パターン１２に電気的に接続されている。また、ランプ２は、発光素子２１を囲むように基体２２の上面に設けられたフレーム部材２４と、発光素子２１を覆うとともにフレーム部材２４に固定された波長変換部材２５と、をさらに備えている。 As shown in FIGS. 2 and 5, the lamp 2 in the light emitting device of the present embodiment is provided in the upper surface of the base 22 and the through-hole 10 of the circuit board 1 when viewed in plan. The light-emitting element 21 has a plurality of terminals 23 that are electrically connected to the light-emitting element 21 and bonded to the lower surface of the circuit board 1. The plurality of terminals 23 are electrically connected to the light emitting element 21 and the first conductor pattern 12, respectively. The lamp 2 further includes a frame member 24 provided on the upper surface of the base 22 so as to surround the light emitting element 21, and a wavelength conversion member 25 that covers the light emitting element 21 and is fixed to the frame member 24. .
　ランプ２を構成する発光素子２１およびフレーム部材２４は、回路基板１の貫通孔１０に挿入されている。ランプ２を構成する基体２２および端子２３は回路基板１の下面側に位置している。また、端子２３は第１の導体パターン１２に電気的に接続されている。このようにして、ランプ２は回路基板１に実装されている。 The light emitting element 21 and the frame member 24 constituting the lamp 2 are inserted into the through hole 10 of the circuit board 1. The base 22 and the terminals 23 constituting the lamp 2 are located on the lower surface side of the circuit board 1. Further, the terminal 23 is electrically connected to the first conductor pattern 12. In this way, the lamp 2 is mounted on the circuit board 1.
　基体２２としては、絶縁性の良好な材料を用いることができる。また、基体２２から、放熱部材３へ効率良く放熱するために、基体２２として熱伝導性が良好な材料を用いることが好ましい。基体２２の材料としては、例えば、アルミナおよびムライトに代表されるセラミック材料、或いはガラスセラミック材料が挙げられる。基体２２の厚み（ｚ方向の長さ）としては、例えば１ｍｍ～３ｍｍに設定することができる。 As the substrate 22, a material having good insulating properties can be used. In order to efficiently radiate heat from the base 22 to the heat radiating member 3, it is preferable to use a material having good thermal conductivity as the base 22. Examples of the material of the base 22 include a ceramic material typified by alumina and mullite, or a glass ceramic material. The thickness (length in the z direction) of the base 22 can be set to 1 mm to 3 mm, for example.
　発光素子２１は、例えば、発光ダイオード（ＬＥＤ）である。発光素子２１は、駆動電力に応じて第１次光を放射する。 The light emitting element 21 is, for example, a light emitting diode (LED). The light emitting element 21 emits primary light according to the driving power.
　複数の端子２３は、基体２２の上面に配設され、基体２２と接合している。複数の端子２３は、それぞれ発光素子２１および第１の導体パターン１２に電気的に接続されている。端子２３の材料としては、導電性の良好な材料を用いることが好ましい。端子２３の材料としては、例えば、タングステン、モリブデン、マンガンまたは銅が挙げられる。 The plurality of terminals 23 are disposed on the upper surface of the base 22 and are joined to the base 22. The plurality of terminals 23 are electrically connected to the light emitting element 21 and the first conductor pattern 12, respectively. As the material of the terminal 23, it is preferable to use a material having good conductivity. Examples of the material of the terminal 23 include tungsten, molybdenum, manganese, and copper.
　フレーム部材２４は、発光素子２１を囲むように基体２２の上面に設けられている。基体２２とフレーム部材２４とは、接合されている。なお、平面視して、フレーム部材２４における発光素子２１を囲む内壁面の形状を円形とすると、発光素子２１が発光する光を全方向に満遍なく反射させて外部に極めて均一に放出することができる。 The frame member 24 is provided on the upper surface of the base body 22 so as to surround the light emitting element 21. The base 22 and the frame member 24 are joined. When the shape of the inner wall surface surrounding the light emitting element 21 in the frame member 24 is circular in plan view, the light emitted from the light emitting element 21 can be uniformly reflected in all directions and emitted to the outside very uniformly. .
　本実施形態の発光装置においては、フレーム部材２４の全体が貫通孔１０の内に挿入されているが、特にこれに限定されるものではない。フレーム部材２４の一部が貫通孔１０の内に挿入されていてもよい。 In the light emitting device of the present embodiment, the entire frame member 24 is inserted into the through hole 10, but the present invention is not particularly limited thereto. A part of the frame member 24 may be inserted into the through hole 10.
　また、ランプ２の上面は、回路基板１の上面よりも上方に位置していることが好ましい。本実施形態の発光装置において、ランプ２を構成するフレーム部材２４が回路基板１の上面よりも上方に位置している。このようにランプ２が位置している場合には、発光素子２１から放射された光を、貫通孔１０の内周面で反射させることなく外部に放射しやすくなるからである。 Further, it is preferable that the upper surface of the lamp 2 is located above the upper surface of the circuit board 1. In the light emitting device of this embodiment, the frame member 24 constituting the lamp 2 is located above the upper surface of the circuit board 1. This is because when the lamp 2 is positioned as described above, the light emitted from the light emitting element 21 is easily emitted to the outside without being reflected by the inner peripheral surface of the through hole 10.
　発光素子２１から放射された光の貫通孔１０の内周面における反射によるロスを低減することができるので、発光装置の発光強度を向上させることができる。また、貫通孔１０の内周面を発光素子２１から放射された光が反射しやすいように加工する必要がないので、発光装置を安価に製造することができる。 Since loss due to reflection of light emitted from the light emitting element 21 on the inner peripheral surface of the through hole 10 can be reduced, the light emission intensity of the light emitting device can be improved. Moreover, since it is not necessary to process the inner peripheral surface of the through-hole 10 so that the light radiated | emitted from the light emitting element 21 may reflect easily, a light-emitting device can be manufactured cheaply.
　ランプ２は、貫通孔１０の内周面から離れていることが好ましい。本実施形態の発光装置において、ランプ２を構成するフレーム部材２４が回路基板１から離れている。そのため、フレーム部材２４から回路基板１への熱の伝達が抑制される。従って、ランプ２から回路基板１への熱の伝達が抑制されている。これにより、ランプ２によって発生された熱は、回路基板１よりも放熱部材３へ伝導され易くなっている。従って、本実施形態の発光装置は、熱制御に関して改善されている。 The lamp 2 is preferably separated from the inner peripheral surface of the through hole 10. In the light emitting device of this embodiment, the frame member 24 constituting the lamp 2 is separated from the circuit board 1. Therefore, heat transfer from the frame member 24 to the circuit board 1 is suppressed. Therefore, heat transfer from the lamp 2 to the circuit board 1 is suppressed. Thereby, the heat generated by the lamp 2 is more easily conducted to the heat radiating member 3 than the circuit board 1. Therefore, the light emitting device of this embodiment is improved with respect to thermal control.
　フレーム部材２４としては、絶縁性の良好な材料を用いることができる。フレーム部材２４の材料としては、例えば、アルミナ、ムライト、酸化チタン、酸化ジルコニウムまたは酸化イットリウムのようなセラミック材料、或いはガラスセラミック材料が挙げられる。 The frame member 24 can be made of a material having good insulation. Examples of the material of the frame member 24 include ceramic materials such as alumina, mullite, titanium oxide, zirconium oxide, and yttrium oxide, or glass ceramic materials.
　このとき、フレーム部材２４を構成する材料の少なくとも一部が、基体２２を構成する材料の少なくとも一部と同じであることが好ましい。基体２２とフレーム部材２４との接合性を向上させることができるからである。 At this time, it is preferable that at least a part of the material constituting the frame member 24 is the same as at least a part of the material constituting the base body 22. This is because the bondability between the base 22 and the frame member 24 can be improved.
　特に、フレーム部材２４を構成する材料の主成分が、基体２２を構成する材料の主成分と同じであることが好ましい。基体２２の熱膨張率とフレーム部材２４の熱膨張率の差を小さくすることができるからである。なお、ここで、主成分とは、部材を構成する材料のうち最も質量比の大きな成分を意味する。 In particular, it is preferable that the main component of the material constituting the frame member 24 is the same as the main component of the material constituting the base body 22. This is because the difference between the thermal expansion coefficient of the base 22 and the thermal expansion coefficient of the frame member 24 can be reduced. In addition, a main component means the component with the largest mass ratio among the materials which comprise a member here.
　波長変換部材２５は、フレーム部材２４に支持されるとともに、発光素子２１と間をあけて対向するように発光素子２１の上に設けられている。発光素子２１と波長変換部材２５との間には透光性の樹脂部材が配設されている。樹脂から波長変換部材２５へと熱が伝わることを抑制するために、樹脂部材と波長変換部材２５とが離れていることが好ましい。 The wavelength conversion member 25 is supported on the frame member 24 and is provided on the light emitting element 21 so as to face the light emitting element 21 with a gap. A translucent resin member is disposed between the light emitting element 21 and the wavelength conversion member 25. In order to prevent heat from being transmitted from the resin to the wavelength conversion member 25, it is preferable that the resin member and the wavelength conversion member 25 are separated from each other.
　波長変換部材２５は、複数の蛍光体を含んでいる。波長変換部材２５は、発光素子２１から放射された第１次光が内部に入射した場合に、内部に含まれた蛍光体が励起されて、第２次光を発するものである。波長変換部材２５は、例えば白色光を放射する。 The wavelength conversion member 25 includes a plurality of phosphors. When the primary light emitted from the light emitting element 21 is incident on the wavelength conversion member 25, the phosphor contained therein is excited to emit secondary light. The wavelength conversion member 25 emits white light, for example.
　波長変換部材２５には、例えばシリコーン樹脂、アクリル樹脂またはエポキシ樹脂から成り、その樹脂中に、蛍光体が含有されている。蛍光体としては、例えば、４３０ｎｍ以上４９０ｎｍ以下の蛍光を発する青色蛍光体、５００ｎｍ以上５６０ｎｍ以下の蛍光を発する緑色蛍光体、５４０ｎｍ以上６００ｎｍ以下の蛍光を発する黄色蛍光体、５９０ｎｍ以上７００ｎｍ以下の蛍光を発する赤色蛍光体が挙げられる。発光素子２１の発光する第１次光の波長に応じて上記の蛍光体のいずれかが選択される。 The wavelength converting member 25 is made of, for example, a silicone resin, an acrylic resin, or an epoxy resin, and the resin contains a phosphor. Examples of the phosphor include a blue phosphor emitting fluorescence of 430 nm to 490 nm, a green phosphor emitting fluorescence of 500 nm to 560 nm, a yellow phosphor emitting fluorescence of 540 nm to 600 nm, and a fluorescence of 590 nm to 700 nm. And a red phosphor that emits light. One of the phosphors is selected according to the wavelength of the primary light emitted from the light emitting element 21.
　図１～３に示すように、放熱部材３は、ランプ２を構成する基体２２の下面に当接されている。なお、本実施形態における「当接」とは、特定の二つの部材が単に接触している状態を示すだけでなく、特定の二つの部材が直接的あるいは間接的に接合されている状態も含む概念である。 As shown in FIGS. 1 to 3, the heat radiating member 3 is in contact with the lower surface of the base 22 constituting the lamp 2. In addition, “contact” in the present embodiment does not only indicate a state in which two specific members are in contact but also includes a state in which the two specific members are directly or indirectly joined. It is a concept.
　直接的に接合されているとは、特定の二つの部材を接合するための部材を用いることなく接合されている状態を示す。また、間接的に接合されているとは、特定の二つの部材を接合するための部材（例えば、接着剤）を用いて接合されている状態を示す。 “Directly joined” means a state where the members are joined without using a member for joining two specific members. Moreover, being indirectly joined shows the state joined using the member (for example, adhesive agent) for joining two specific members.
　接着剤を用いてランプ２と放熱部材３とが間接的に接合されている場合、接着材としては、ランプ２及び放熱部材３を良好に接合できるとともに、熱伝導性が良好であることが好ましい。ランプ２から放熱部材３へ良好に熱を伝達することができるからである。接着剤としては、例えば、放熱グリースが挙げられる。 When the lamp 2 and the heat radiating member 3 are indirectly bonded using an adhesive, it is preferable that the lamp 2 and the heat radiating member 3 can be bonded satisfactorily and the heat conductivity is good as the adhesive. . This is because heat can be transferred from the lamp 2 to the heat radiating member 3 satisfactorily. As the adhesive, for example, a heat dissipating grease can be used.
　また、ランプ２から放熱部材３へ良好に熱を伝達するため、接着材の上下方向の厚みが、基体２２及び放熱部材３の上下方向の厚みよりも小さいことが好ましい。ランプ２から接着剤へと伝わった熱が、接着剤に溜まることを抑制できるからである。 Also, in order to transfer heat from the lamp 2 to the heat radiating member 3, the thickness of the adhesive in the vertical direction is preferably smaller than the thickness in the vertical direction of the base 22 and the heat radiating member 3. This is because heat transmitted from the lamp 2 to the adhesive can be suppressed from accumulating in the adhesive.
　放熱部材３は、基体２２の下方に位置している。放熱部材３は、基体２２の下面に当接される平板の形状の部位３１と、この部位の下面側に位置する複数のフィン３２と、を有している。平板の形状の部位３１と複数のフィン３２とは、別々に作製した後で、平板の形状の部位３１の下面にフィン３２を接合してもよい。また、平板の形状の部位３１と複数のフィン３２とは、一体的に形成してもよい。平板の形状の部位３１の厚み（ｚ方向の長さ）としては、例えば、１ｍｍ～５ｍｍに設定できる。また、複数のフィン３２のｚ方向の長さとしては、例えば、３ｍｍ～５０ｍｍに設定できる。 The heat dissipating member 3 is located below the base body 22. The heat radiating member 3 has a flat plate-shaped portion 31 that is in contact with the lower surface of the base 22 and a plurality of fins 32 positioned on the lower surface side of this portion. After the plate-shaped portion 31 and the plurality of fins 32 are separately manufactured, the fins 32 may be joined to the lower surface of the plate-shaped portion 31. The flat plate-shaped portion 31 and the plurality of fins 32 may be integrally formed. The thickness (length in the z direction) of the plate-shaped portion 31 can be set to 1 mm to 5 mm, for example. Further, the length of the plurality of fins 32 in the z direction can be set to 3 mm to 50 mm, for example.
　放熱部材３は、ランプ２で発生した熱を外部に放熱するための部材である。そのため、放熱部材３としては熱伝導性の良好な材料を用いることが好ましい。放熱部材３としては、例えば、金属材料を用いることができる。 The heat radiating member 3 is a member for radiating the heat generated in the lamp 2 to the outside. Therefore, it is preferable to use a material with good thermal conductivity as the heat radiating member 3. As the heat radiating member 3, for example, a metal material can be used.
　放熱部材３の横方向（ｘｙ方向）の幅が、基体２２の横方向の幅よりも大きい。そして、放熱部材３の上面の一部が、基体２２を間に介することなく回路基板１の下面の一部と対向している。このように、放熱部材３の横方向の幅が、基体２２の横方向の幅よりも大きいことによって、放熱部材３を構成する平板３１の下面の面積を大きくすることができるので、放熱部材３が、より多くのフィン３２を備えることができる。 The width in the horizontal direction (xy direction) of the heat radiating member 3 is larger than the width in the horizontal direction of the base body 22. A part of the upper surface of the heat radiating member 3 faces a part of the lower surface of the circuit board 1 without interposing the base 22 therebetween. Thus, since the area of the lower surface of the flat plate 31 which comprises the heat radiating member 3 can be enlarged when the width | variety of the horizontal direction of the heat radiating member 3 is larger than the width | variety of the horizontal direction of the base | substrate 22, the heat radiating member 3 can be enlarged. However, more fins 32 can be provided.
　また、放熱部材３は、回路基板１から離れていることが好ましい。ランプ２から放熱部材３へと伝達された熱が、放熱部材３から回路基板１へと伝わることを抑制できるからである。そのため、ランプ２で生じた熱が回路基板１に伝わることをさらに抑制することができ、また、放熱部材３において効率良く放熱することができる。 Further, it is preferable that the heat dissipating member 3 is separated from the circuit board 1. This is because heat transmitted from the lamp 2 to the heat radiating member 3 can be prevented from being transmitted from the heat radiating member 3 to the circuit board 1. Therefore, it is possible to further suppress the heat generated in the lamp 2 from being transmitted to the circuit board 1, and to efficiently radiate heat in the heat radiating member 3.
　本実施形態の発光装置は、放熱部材３と回路基板１とを連結する複数の金属部材４をさらに備えている。なお、図２において、複数の金属部材４は、回路基板１および放熱部材３を透過した状態で、点線によって示されている。金属部材４の一例はネジである。平板形状の回路基板１および放熱部材３の平板形状の部位３１の四隅にそれぞれネジ穴が形成されている。これらのネジ穴に金属部材４（ネジ）を固定する。金属部材４は、ランプ２が回路基板１および放熱部材３によって挟まれる状態で、回路基板１、ランプ２及び放熱部材３を一体的に固定している。 The light-emitting device of this embodiment further includes a plurality of metal members 4 that connect the heat dissipation member 3 and the circuit board 1. In FIG. 2, the plurality of metal members 4 are indicated by dotted lines in a state of being transmitted through the circuit board 1 and the heat dissipation member 3. An example of the metal member 4 is a screw. Screw holes are formed in the four corners of the flat circuit board 1 and the flat plate portion 31 of the heat radiating member 3, respectively. The metal member 4 (screw) is fixed to these screw holes. The metal member 4 integrally fixes the circuit board 1, the lamp 2, and the heat radiating member 3 in a state where the lamp 2 is sandwiched between the circuit board 1 and the heat radiating member 3.
　本実施形態の発光装置において、金属部材４を用いて放熱部材３が回路基板１に連結されることによって、放熱部材３が回路基板１に固定されている。そのため、ランプ２によって発生された熱の一部が回路基板１に伝導された場合にも、その熱は金属部材４を介して放熱部材３へ伝導されやすい。従って、本実施形態の発光装置は、放熱特性に関して改善されており、発光強度に関してさらに向上されている。 In the light emitting device of the present embodiment, the heat radiating member 3 is fixed to the circuit board 1 by connecting the heat radiating member 3 to the circuit board 1 using the metal member 4. Therefore, even when a part of the heat generated by the lamp 2 is conducted to the circuit board 1, the heat is easily conducted to the heat radiating member 3 through the metal member 4. Therefore, the light emitting device of the present embodiment is improved with respect to heat dissipation characteristics and further improved with respect to light emission intensity.
　本実施形態の発光装置において、ランプ２によって発生された熱は、主に２つの経路によって伝導される。１つの経路は、図６において符号２０１によって示されている経路であり、ランプ２から放熱部材３に伝わった後に、放熱部材３を水平方向に進む経路である。水平方向とは、図６において、仮想のｘ軸の方向である。もう１つの経路は、図６において符号２０２によって示されている経路であり、ランプ２から回路基板１に伝わった後に、回路基板１を水平方向に進む経路である。回路基板１を水平方向に進んだ熱は、金属部材４を介して放熱部材３に伝導される。本実施形態の発光装置は、主に２つの熱の伝導経路２０１、２０２を有していることにより、仮想のｘｙｚ空間のｘｙ平面方向において効率的に熱制御を行うことができる。 In the light emitting device of the present embodiment, the heat generated by the lamp 2 is mainly conducted through two paths. One path is a path indicated by reference numeral 201 in FIG. 6 and is a path that travels in the horizontal direction through the heat radiating member 3 after being transmitted from the lamp 2 to the heat radiating member 3. The horizontal direction is the virtual x-axis direction in FIG. The other path is a path indicated by reference numeral 202 in FIG. 6 and is a path that travels in the horizontal direction in the circuit board 1 after being transmitted from the lamp 2 to the circuit board 1. The heat that has traveled in the horizontal direction on the circuit board 1 is conducted to the heat radiating member 3 through the metal member 4. The light-emitting device of the present embodiment mainly has two heat conduction paths 201 and 202, so that heat control can be efficiently performed in the xy plane direction of the virtual xyz space.
　図７に示されているように、本実施形態の発光装置は、放熱部材３を平面方向に進む熱伝導経路２０１と、回路基板１を平面方向に進む熱伝導経路２０２とを有していることにより、平面視における全領域を有効に利用して熱伝導を行うことができ、放熱性を向上させることができる。図６において、放熱部材３における熱伝導経路２０１が、模式的に点線によって示されており、回路基板１における熱伝導経路２０２が、模式的に実線によって示されている。 As shown in FIG. 7, the light emitting device of this embodiment includes a heat conduction path 201 that travels in the plane direction through the heat dissipation member 3 and a heat conduction path 202 that travels in the plane direction through the circuit board 1. Thus, heat conduction can be performed by effectively using the entire region in plan view, and heat dissipation can be improved. In FIG. 6, the heat conduction path 201 in the heat radiating member 3 is schematically indicated by a dotted line, and the heat conduction path 202 in the circuit board 1 is schematically indicated by a solid line.
　次に、第２の実施形態の発光装置について図面を用いて詳細に説明する。なお、本実施形態にかかる各構成において、第１の実施形態と同様の機能を有する構成については、同じ参照符号を付記し、その詳細な説明を省略する。 Next, the light emitting device of the second embodiment will be described in detail with reference to the drawings. In addition, in each structure concerning this embodiment, about the structure which has the same function as 1st Embodiment, the same referential mark is attached and the detailed description is abbreviate | omitted.
　図８，９に示すように、第２の実施形態の発光装置は、第１の実施形態の発光装置と同様に、放熱部材３の上面の一部が、基体２２を間に介することなく回路基板１の下面の一部と対向している。そして、基体２２を間に介することなく互いに対向する放熱部材３と回路基板１との間の領域に絶縁部材５が配設されている。 As shown in FIGS. 8 and 9, the light emitting device of the second embodiment is similar to the light emitting device of the first embodiment in that a part of the upper surface of the heat radiating member 3 is a circuit without interposing the base 22 therebetween. It faces a part of the lower surface of the substrate 1. And the insulating member 5 is arrange | positioned in the area | region between the thermal radiation member 3 and the circuit board 1 which mutually oppose without interposing the base | substrate 22 in between.
　放熱部材３として良好に放熱できる金属材料を用いた場合であっても、このような絶縁部材５を備えていることによって、放熱部材３と回路基板１との間で電気的な短絡が生じる可能性を低減することができる。 Even when a metal material that can radiate heat well is used as the heat radiating member 3, an electrical short circuit may occur between the heat radiating member 3 and the circuit board 1 by providing such an insulating member 5. Can be reduced.
　また、絶縁部材５は、回路基板１または放熱部材３のいずれか一方と離れていることが好ましい。このように絶縁部材５が回路基板１または放熱部材３のいずれか一方と離れていることによって、絶縁部材５を介して放熱部材３から回路基板１へと熱が伝わることを抑制することができる。 The insulating member 5 is preferably separated from either the circuit board 1 or the heat radiating member 3. As described above, when the insulating member 5 is separated from either the circuit board 1 or the heat radiating member 3, it is possible to suppress heat from being transferred from the heat radiating member 3 to the circuit board 1 through the insulating member 5. .
　なお、本実施形態の発光装置においては、絶縁部材５が放熱部材３と接合するとともに回路基板１から離れているが、絶縁部材５が回路基板１と接合するとともに放熱部材３から離れていてもよい。 In the light emitting device of this embodiment, the insulating member 5 is joined to the heat radiating member 3 and separated from the circuit board 1, but the insulating member 5 is joined to the circuit board 1 and separated from the heat radiating member 3. Good.
　絶縁部材５としては、例えば、アルミナ、ムライト、酸化チタン、酸化ジルコニウムまたは酸化イットリウムのようなセラミック材料、ガラスセラミック材料、絶縁性の樹脂またはゴムが挙げられる。このとき、絶縁部材５として、絶縁性の樹脂またはゴムを用いることが好ましい。 Examples of the insulating member 5 include ceramic materials such as alumina, mullite, titanium oxide, zirconium oxide, and yttrium oxide, glass ceramic materials, insulating resins, and rubbers. At this time, it is preferable to use an insulating resin or rubber as the insulating member 5.
　ランプ２で発生した熱が回路基板１及び放熱部材３へ伝わることによって、回路基板１及び放熱部材３が膨張あるいは熱変形して、回路基板１及び放熱部材３が絶縁部材５に当接するとともに絶縁部材５に押圧力が加わる可能性がある。このとき、絶縁部材５として絶縁性の樹脂またはゴムを用いた場合には、絶縁部材５が変形しやすいので、上記の押圧力を絶縁部材５で緩和することができる。そのため、回路基板１及び放熱部材３の耐久性を向上させることができる。 When the heat generated in the lamp 2 is transmitted to the circuit board 1 and the heat radiating member 3, the circuit board 1 and the heat radiating member 3 are expanded or thermally deformed so that the circuit board 1 and the heat radiating member 3 are in contact with the insulating member 5 and insulated. There is a possibility that a pressing force is applied to the member 5. At this time, when an insulating resin or rubber is used as the insulating member 5, the insulating member 5 is easily deformed, and thus the pressing force can be relaxed by the insulating member 5. Therefore, durability of the circuit board 1 and the heat radiating member 3 can be improved.
　次に、第３の実施形態の発光装置について図面を用いて詳細に説明する。なお、本実施形態にかかる各構成において、第１の実施形態と同様の機能を有する構成については、同じ参照符号を付記し、その詳細な説明を省略する。 Next, the light emitting device of the third embodiment will be described in detail with reference to the drawings. In addition, in each structure concerning this embodiment, about the structure which has the same function as 1st Embodiment, the same referential mark is attached and the detailed description is abbreviate | omitted.
　図１０，１１に示すように、第３の実施形態の発光装置は、第１の実施形態の発光装置と同様に、放熱部材３の上面の一部が、基体２２を間に介することなく回路基板１の下面の一部と対向している。そして、放熱部材３が上面に溝部３３を有し、放熱部材３を平面視した場合に、溝部３３は、ランプ２が当接された領域よりも側方に位置している。 As shown in FIGS. 10 and 11, the light emitting device of the third embodiment is similar to the light emitting device of the first embodiment in that a part of the upper surface of the heat dissipation member 3 is a circuit without interposing the base 22. It faces a part of the lower surface of the substrate 1. And when the heat radiating member 3 has the groove part 33 in an upper surface and the heat radiating member 3 is planarly viewed, the groove part 33 is located in the side rather than the area | region where the lamp | ramp 2 contact | abutted.
　放熱部材３を構成する平板形状の部位３１における溝部３３が形成された部分は、平板形状の部位３１におけるその他の部分と比較して厚みが小さくなる。そのため、溝部３３が形成された部分が変形しやすくなる。 The portion of the flat plate portion 31 constituting the heat radiating member 3 where the groove 33 is formed has a smaller thickness than the other portions of the flat plate portion 31. Therefore, the part in which the groove part 33 was formed becomes easy to deform | transform.
　ランプ２で発生した熱が放熱部材３へ伝わることによって、放熱部材３が膨張あるいは変形して放熱部材３に応力が加わる可能性がある。しかしながら、溝部３３が形成された部分が変形することによって、上記の応力を緩和することができる。そのため、放熱部材３の耐久性を向上させることができる。 When the heat generated in the lamp 2 is transmitted to the heat radiating member 3, the heat radiating member 3 may expand or deform, and stress may be applied to the heat radiating member 3. However, the stress can be relieved by deforming the portion where the groove 33 is formed. Therefore, the durability of the heat radiating member 3 can be improved.
　ランプ２が当接された領域よりも溝部３３が側方に位置している場合には、ランプ２と放熱部材３とが当接する面積が小さくなることを防ぐことができるので、ランプ２から放熱部材３への熱の伝達が低下することも抑制できる。また、放熱部材３が膨張あるいは変形する場合であっても、溝部３３が形成された部分が変形しやすいので放熱部材３がランプ２から離れることを抑制できる。 When the groove 33 is located on the side of the region where the lamp 2 is in contact, it is possible to prevent the contact area between the lamp 2 and the heat radiating member 3 from being reduced. It can also be suppressed that the heat transfer to the member 3 is reduced. Even when the heat radiating member 3 expands or deforms, the portion where the groove 33 is formed is easily deformed, so that the heat radiating member 3 can be prevented from being separated from the lamp 2.
　特に、放熱部材３を平面視した場合に、放熱部材３のランプ２が当接された領域は、溝部３３に囲まれていることが好ましい。このように溝部３３が形成されていることによって、放熱部材３の水平面（ｘｙ面）における様々な方向からの放熱部材３に加わる応力を緩和することができるからである。図１１における溝部３３の幅（ｘ方向の長さ）としては、例えば０．１ｍｍ～１０ｍｍに設定することができる。溝部３３の深さ（ｚ方向の長さ）としては、例えば０．１ｍｍ～１．５ｍｍに設定することができる。 In particular, when the heat radiating member 3 is viewed in plan, the region of the heat radiating member 3 on which the lamp 2 is in contact is preferably surrounded by the groove 33. This is because the grooves 33 are formed in this manner, so that stress applied to the heat radiation member 3 from various directions on the horizontal plane (xy plane) of the heat radiation member 3 can be relaxed. The width (length in the x direction) of the groove 33 in FIG. 11 can be set to 0.1 mm to 10 mm, for example. The depth of the groove 33 (the length in the z direction) can be set to 0.1 mm to 1.5 mm, for example.
　次に、第４の実施形態の発光装置について図面を用いて詳細に説明する。なお、本実施形態にかかる各構成において、第１の実施形態と同様の機能を有する構成については、同じ参照符号を付記し、その詳細な説明を省略する。 Next, the light emitting device of the fourth embodiment will be described in detail with reference to the drawings. In addition, in each structure concerning this embodiment, about the structure which has the same function as 1st Embodiment, the same referential mark is attached and the detailed description is abbreviate | omitted.
　図１２，１３に示すように、第４の実施形態の発光装置は、第１の実施形態の発光装置と同様に、放熱部材３がランプ２の下面に当接されている。第１の実施形態の発光装置においては、放熱部材３の平板の形状の部位３１の上面が平坦であって、この部位３１の上面がランプ２の下面に当接されている。しかしながら、本実施形態の発光装置においては、放熱部材３が上面に凹部３４を有している。そして、凹部３４の内に基体２２が位置するとともに基体２２の下面と凹部３４の底面とが当接している。 As shown in FIGS. 12 and 13, in the light emitting device of the fourth embodiment, the heat dissipating member 3 is in contact with the lower surface of the lamp 2 in the same manner as the light emitting device of the first embodiment. In the light emitting device of the first embodiment, the upper surface of the flat portion 31 of the heat radiating member 3 is flat, and the upper surface of the portion 31 is in contact with the lower surface of the lamp 2. However, in the light emitting device of the present embodiment, the heat dissipating member 3 has a recess 34 on the upper surface. The base 22 is located in the recess 34 and the lower surface of the base 22 is in contact with the bottom surface of the recess 34.
　このように、放熱部材３が上面に凹部３４を有して、この凹部３４の内に基体２２が位置している場合には、基体２２の位置決めを容易に図ることが可能となる。 Thus, when the heat radiation member 3 has the recess 34 on the upper surface and the base 22 is positioned in the recess 34, the base 22 can be easily positioned.
　また、凹部３４の内に基体２２が位置することから、図１３に示すように、凹部３４の横方向（ｘ方向）の幅がランプ２の横方向（ｘ方向）の幅よりも大きいことが好ましい。このように凹部３４が形成されることによって、放熱部材３として良好に放熱できる金属材料を用いた場合であっても、放熱部材３と端子２３との間で電気的な短絡が生じる可能性を低減することができる。 Further, since the base 22 is located in the recess 34, the width in the lateral direction (x direction) of the recess 34 is larger than the width in the lateral direction (x direction) of the lamp 2 as shown in FIG. preferable. By forming the recesses 34 in this way, even if a metal material that can radiate heat well is used as the heat radiating member 3, there is a possibility that an electrical short circuit occurs between the heat radiating member 3 and the terminal 23. Can be reduced.
　また、本実施形態の発光装置は、第１の実施形態の発光装置と同様に、放熱部材３の上面の一部が、基体２２を間に介することなく回路基板１の下面の一部と対向している。そして、放熱部材３と回路基板１とが基体２２を間に介することなく対向している領域において、放熱部材３と回路基板１とが接合されることによって、凹部３４が封止されていることが好ましい。これにより、凹部３４の内に位置する、回路基板１の第１の導体パターン１２及び基体２の端子２３における凹部３４に露出する部分が外気に触れて変性する可能性を低減できる。 Further, in the light emitting device of this embodiment, as in the light emitting device of the first embodiment, a part of the upper surface of the heat radiating member 3 faces a part of the lower surface of the circuit board 1 without the base 22 interposed therebetween. is doing. And in the area | region where the heat radiating member 3 and the circuit board 1 have opposed without interposing the base | substrate 22, the heat radiating member 3 and the circuit board 1 are joined, and the recessed part 34 is sealed. Is preferred. Thereby, the possibility that the portions of the first conductor pattern 12 of the circuit board 1 and the terminals 23 of the base 2 that are located in the recesses 34 and exposed to the recesses 34 are exposed to the outside air and denatured can be reduced.
　なお、本発明は、上記の実施形態に限定されるものではなく、本発明の要旨を逸脱しない範囲内で種々の変更を行うことは何ら差し支えない。 Note that the present invention is not limited to the above-described embodiment, and various modifications may be made without departing from the scope of the present invention.
１　回路基板
１０　貫通孔
１１　絶縁性基板
１２　第１の導体パターン
１３　第２の導体パターン
１４　ビア導体
１５　第３の導体パターン
２　ランプ
２１　発光素子
２２　基体
２３　端子
２４　フレーム部材
２５　波長変換部材
３　放熱部材
３２　フィン
３３　溝部
３４　凹部
４　金属部材
５　絶縁部材 DESCRIPTION OF SYMBOLS 1 Circuit board 10 Through-hole 11 Insulating board 12 1st conductor pattern 13 2nd conductor pattern 14 Via conductor 15 3rd conductor pattern 2 Lamp 21 Light emitting element 22 Base | substrate 23 Terminal 24 Frame member 25 Wavelength conversion member 3 Heat dissipation member 32 Fin 33 Groove 34 Recess 4 Metal member 5 Insulating member

Claims (10)

  1. 　貫通孔を有する回路基板と、
    　基体、該基体の上面に設けられるとともに平面視した場合に前記貫通孔の内に位置する発光素子、および該発光素子と電気的に接続されるとともに前記回路基板の下面に接合された端子を有するランプと、
    　該ランプの下面に当接された放熱部材とを備えた発光装置。     A circuit board having a through hole;
    A base, a light-emitting element that is provided on the upper surface of the base and is located in the through hole when viewed in plan, and a terminal that is electrically connected to the light-emitting element and joined to the lower surface of the circuit board A lamp,
    A light emitting device comprising: a heat radiating member in contact with a lower surface of the lamp.
  2. 　前記放熱部材と前記回路基板とを連結する金属部材をさらに備えたことを特徴とする請求項１に記載の発光装置。 The light emitting device according to claim 1, further comprising a metal member that connects the heat dissipation member and the circuit board.
  3. 　前記放熱部材は、前記回路基板から離れていることを特徴とする請求項１に記載の発光装置。 The light emitting device according to claim 1, wherein the heat dissipating member is separated from the circuit board.
  4. 　前記放熱部材および前記回路基板の間に位置する絶縁部材をさらに備えたことを特徴とする請求項３に記載の発光装置。 4. The light emitting device according to claim 3, further comprising an insulating member positioned between the heat dissipation member and the circuit board.
  5. 　前記絶縁部材は、絶縁性の樹脂またはゴムであることを特徴とする請求項４に記載の発光装置。 The light-emitting device according to claim 4, wherein the insulating member is an insulating resin or rubber.
  6. 　前記回路基板は、絶縁性基板、該絶縁性基板の下面に設けられるとともに前記端子と電気的に接続された第１の導体パターン、および前記絶縁性基板の上面に設けられるとともに前記第１の導体パターンと電気的に接続された第２の導体パターンを備えていることを特徴とする請求項１に記載の発光装置。 The circuit board is provided on an insulating substrate, a first conductor pattern provided on a lower surface of the insulating substrate and electrically connected to the terminal, and provided on an upper surface of the insulating substrate and the first conductor. The light emitting device according to claim 1, further comprising a second conductor pattern electrically connected to the pattern.
  7. 　前記放熱部材が上面に溝部を有し、前記放熱部材を平面視した場合に、前記溝部は、前記ランプが当接された領域よりも側方に位置していることを特徴とする請求項１に記載の発光装置。 2. The heat dissipation member has a groove on an upper surface, and the groove is positioned on a side of a region where the lamp is in contact when the heat dissipation member is viewed in plan. The light emitting device according to 1.
  8. 　前記放熱部材を平面視した場合に、前記放熱部材の前記ランプが当接された領域は、前記溝部に囲まれていることを特徴とする請求項７に記載の発光装置。 8. The light emitting device according to claim 7, wherein when the heat radiating member is viewed in plan, a region of the heat radiating member that is in contact with the lamp is surrounded by the groove.
  9. 　前記ランプは、前記貫通孔の内周面から離れていることを特徴とする請求項１に記載の発光装置。 2. The light emitting device according to claim 1, wherein the lamp is separated from an inner peripheral surface of the through hole.
  10. 　前記ランプの上面は、前記回路基板の上面よりも上方に位置していることを特徴とする請求項１に記載の発光装置。 2. The light emitting device according to claim 1, wherein the upper surface of the lamp is located above the upper surface of the circuit board.
PCT/JP2010/067689 2009-10-07 2010-10-07 Light-emitting device WO2011043441A1 (en)

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EP2792943A1 (en) * 2013-04-16 2014-10-22 Bender & Wirth Gmbh & Co. LED holder
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JP2006066868A (en) * 2004-03-23 2006-03-09 Toyoda Gosei Co Ltd Solid-state component and solid-state component device
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Publication number Priority date Publication date Assignee Title
WO2013128896A1 (en) * 2012-02-29 2013-09-06 パナソニック株式会社 Led lighting fixture
WO2014079784A1 (en) * 2012-11-20 2014-05-30 Osram Gmbh Optoelectronic assembly and method for producing an optoelectronic assembly
US9961781B2 (en) 2012-11-20 2018-05-01 Osram Gmbh Optoelectronic assembly and method for producing an optoelectronic assembly
EP2792943A1 (en) * 2013-04-16 2014-10-22 Bender & Wirth Gmbh & Co. LED holder
GB2564566A (en) * 2017-06-28 2019-01-16 Conservation Tech Of Illinois Llc Powering and fastening a light emitting diode or chip-on-board component to a heatsink
US10203096B2 (en) 2017-06-28 2019-02-12 Conservation Technology of Illinois LLC Powering and fastening a light emitting diode or chip-on-board component to a heatsink
GB2564566B (en) * 2017-06-28 2020-07-29 Conservation Tech Of Illinois Llc Powering and fastening a light emitting diode or chip-on-board component to a heatsink
CN112577018A (en) * 2019-09-27 2021-03-30 株式会社小糸制作所 Light source unit and vehicle lamp
CN112577018B (en) * 2019-09-27 2024-03-01 株式会社小糸制作所 Light source unit and vehicle lamp

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