WO2011043441A1 - Dispositif électroluminescent - Google Patents

Dispositif électroluminescent Download PDF

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Publication number
WO2011043441A1
WO2011043441A1 PCT/JP2010/067689 JP2010067689W WO2011043441A1 WO 2011043441 A1 WO2011043441 A1 WO 2011043441A1 JP 2010067689 W JP2010067689 W JP 2010067689W WO 2011043441 A1 WO2011043441 A1 WO 2011043441A1
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WO
WIPO (PCT)
Prior art keywords
light emitting
emitting device
circuit board
lamp
heat
Prior art date
Application number
PCT/JP2010/067689
Other languages
English (en)
Japanese (ja)
Inventor
智也 田淵
杉本　努
三宅　徹
朋哉 今
Original Assignee
京セラ株式会社
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Filing date
Publication date
Application filed by 京セラ株式会社 filed Critical 京セラ株式会社
Publication of WO2011043441A1 publication Critical patent/WO2011043441A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements

Definitions

  • the present invention relates to a light emitting device including a light emitting element such as a light emitting diode.
  • a light emitting device having a light emitting element is expected from the viewpoint of low power consumption.
  • further improvements in light emission intensity are required.
  • the calorific value of the light emitting device tends to increase as the light emission intensity is improved.
  • the increase in the amount of heat generated may affect the light emission efficiency of the light emitting device.
  • the luminous efficiency affects the luminous intensity of the light emitting device. Therefore, in the future, in the development of light emitting devices, it is necessary to further improve the heat dissipation characteristics in order to improve the light emission intensity. JP 2007-1116075 A
  • a light-emitting device includes a circuit board having a through-hole, a base, a light-emitting element that is provided on the upper surface of the base and is located in the through-hole when viewed in plan, and a light-emitting element.
  • the lamp includes a terminal that is electrically connected and has a terminal bonded to the lower surface of the circuit board, and a heat dissipation member that is in contact with the lower surface of the lamp.
  • FIG. 2 shows a longitudinal sectional view of the light emitting device shown in FIG. 1.
  • the top view of the light-emitting device shown by FIG. 1 is shown.
  • FIG. 5 is a longitudinal sectional view showing a modification of the light emitting device shown in FIG. 1.
  • FIG. 2 shows a longitudinal sectional view of the lamp shown in FIG. 1.
  • FIG. 3 is an operation diagram showing a heat conduction path in the light emitting device shown in FIG. 2.
  • FIG. 4 is an operation diagram illustrating a heat conduction path in the light emitting device illustrated in FIG. 3.
  • the disassembled perspective view of the light-emitting device in 2nd Embodiment is shown.
  • FIG. 9 is a longitudinal sectional view of the light emitting device shown in FIG. 8.
  • the disassembled perspective view of the light-emitting device in 3rd Embodiment is shown.
  • FIG. 11 shows a longitudinal sectional view of the light emitting device shown in FIG. 10.
  • the disassembled perspective view of the light-emitting device in 4th Embodiment is shown.
  • FIG. 13 is a longitudinal sectional view of the light emitting device shown in FIG. 12.
  • the light emitting device according to each embodiment will be described in detail with reference to the drawings.
  • the drawings referred to below for convenience of explanation, among the constituent members of the embodiment, only the main members necessary for explaining the present invention are shown in a simplified manner. Therefore, the light-emitting device according to the present invention can include arbitrary constituent members that are not shown in the drawings referred to in this specification.
  • the dimension of the member in each figure does not represent the dimension of an actual structural member, the dimension ratio of each member, etc. faithfully.
  • the light-emitting device of the first embodiment includes a circuit board 1 having a through-hole 10 and a light-emitting element 21 positioned in the through-hole 10 when viewed in plan. And a heat dissipating member 3 in contact with the lower surface of the lamp 2.
  • the lamp 2 is provided on the upper surface of the base 22 and the light emitting element 21 positioned in the through-hole 10 when viewed in plan, and is electrically connected to the light emitting element 21 and is connected to the circuit board 1. And a terminal 23 bonded to the lower surface.
  • the light emitting device is provided in a virtual xyz space.
  • the upward direction means the positive direction of the virtual z axis.
  • the heat radiating member 3 is in contact with the lower surface of the lamp 2. Therefore, the heat generated in the lamp 2 is not necessarily transmitted to the heat radiating member 3 via the circuit board 1 but can be transferred from the lamp 2 to the heat radiating member 3 without going through the circuit board 1. As a result, since heat can be efficiently transferred from the lamp 2 to the heat radiating member 3, the heat radiating characteristics of the light emitting device can be improved.
  • the heat radiating member 3 since the heat radiating member 3 is in contact with the lamp 2, the heat radiation characteristics are improved, so that the light emission intensity of the light emitting device is improved.
  • the heat generated by the lamp 2 is conducted to the heat radiating member 3 in contact with the lamp 2 and is dissipated from the heat radiating member 3 to, for example, the atmosphere.
  • heat conduction is indicated by solid arrows and heat dissipation is indicated by dashed arrows.
  • heat can be efficiently transmitted from the lamp 2 to the heat radiating member 3, so that the amount of heat transmitted from the lamp 2 to the circuit board 1 can be reduced. Therefore, the influence on the circuit board 1 can be reduced. Specifically, for example, it is possible to suppress a large change in the resistivity of the electric circuit included in the circuit board 1.
  • the main heat generated from the lamp 2 is heat generated when the light emitting element 21 constituting the lamp 2 emits light.
  • the heat generated from the light emitting element 21 is transmitted from the light emitting element 21 to the base 22 constituting the lamp 2.
  • the circuit board 1 is positioned on the upper surface side of the base 22 constituting the lamp 2, and the heat radiating member 3 is in contact with the lower surface of the base 22.
  • the circuit board 1 and the heat dissipation member 3 are positioned so as to be opposite to each other when viewed from the base body 22.
  • the circuit board 1 is positioned on the opposite side of the heat flow (lower direction in FIG. 2) transmitted from the base 22 to the heat radiating member 3. Therefore, in the light emitting device of this embodiment, the amount of heat transferred from the lamp 2 to the circuit board 1 can be reduced.
  • the circuit board 1 in the light emitting device of this embodiment includes an insulating substrate 11, a first conductor pattern 12 provided on the lower surface of the insulating substrate 11, and a second conductor provided on the upper surface of the insulating substrate 11. Pattern 13 is provided. Further, the circuit board 1 has via conductors 14 embedded so as to be drawn out on the upper surface and the lower surface of the insulating substrate 11, respectively. The via conductor 14 is joined to the first conductor pattern 12 and the second conductor pattern 13. The second conductor pattern 13 is electrically connected to the first conductor pattern 12 via the via conductor 14.
  • the first conductor pattern 12 and the second conductor pattern 13 in the circuit board 1 shown in FIG. 2 are electrically connected via the via conductor 14.
  • the electrical connection between the first conductor pattern 12 and the second conductor pattern 13 is not limited to the configuration via the via conductor 14.
  • the third conductor pattern 15 is disposed on the side surface of the insulating substrate 11, and the first conductor pattern 12 and the second conductor pattern are interposed via the third conductor pattern 15. 13 may be electrically connected.
  • the light emitting device of the present embodiment includes the second conductor pattern 13
  • the heat generated by the lamp 2 and conducted to the circuit board 1 is easily dissipated from the second conductor pattern 13 into the atmosphere, for example. It has become. Therefore, the light emitting device of the present embodiment is improved with respect to heat dissipation characteristics and further improved with respect to light emission intensity.
  • the heat conduction from the lamp 2 to the circuit board 1 will be described in more detail. Heat generated by the light emitting element 21 of the lamp 2 is conducted to the first conductor pattern 12 of the circuit board 1 through the terminal 23. Heat is conducted from the first conductor pattern 12 to the via conductor 14.
  • the light emitting device of this embodiment is improved with respect to thermal control by having such a heat conduction path.
  • the circuit board 1 has a through hole 10 that opens to the upper surface and the lower surface.
  • the through hole 10 is formed in the central portion when the circuit board 1 is viewed in plan.
  • the light emitting element 21 constituting the lamp 2 is located inside the through hole 10. Therefore, the light emitted from the light emitting element 21 passes through the through hole 10 and is emitted above the circuit board 1.
  • the insulating substrate 11 a material having good insulating properties can be used.
  • the insulating substrate 11 is substantially made of a resin material, for example.
  • the insulating substrate 11 may be substantially made of a ceramic material.
  • the thickness of the insulating substrate 11 can be set to 1 mm to 5 mm, for example.
  • the first conductor pattern 12, the second conductor pattern 13, and the via conductor 14 a material having good conductivity can be used.
  • examples of the material for these conductors include tungsten, molybdenum, manganese, and copper.
  • the lamp 2 in the light emitting device of the present embodiment is provided in the upper surface of the base 22 and the through-hole 10 of the circuit board 1 when viewed in plan.
  • the light-emitting element 21 has a plurality of terminals 23 that are electrically connected to the light-emitting element 21 and bonded to the lower surface of the circuit board 1.
  • the plurality of terminals 23 are electrically connected to the light emitting element 21 and the first conductor pattern 12, respectively.
  • the lamp 2 further includes a frame member 24 provided on the upper surface of the base 22 so as to surround the light emitting element 21, and a wavelength conversion member 25 that covers the light emitting element 21 and is fixed to the frame member 24. .
  • the light emitting element 21 and the frame member 24 constituting the lamp 2 are inserted into the through hole 10 of the circuit board 1.
  • the base 22 and the terminals 23 constituting the lamp 2 are located on the lower surface side of the circuit board 1. Further, the terminal 23 is electrically connected to the first conductor pattern 12. In this way, the lamp 2 is mounted on the circuit board 1.
  • a material having good insulating properties can be used as the substrate 22 .
  • a material having good thermal conductivity As the substrate 22, a material having good insulating properties can be used.
  • the material of the base 22 include a ceramic material typified by alumina and mullite, or a glass ceramic material.
  • the thickness (length in the z direction) of the base 22 can be set to 1 mm to 3 mm, for example.
  • the light emitting element 21 is, for example, a light emitting diode (LED).
  • the light emitting element 21 emits primary light according to the driving power.
  • the plurality of terminals 23 are disposed on the upper surface of the base 22 and are joined to the base 22.
  • the plurality of terminals 23 are electrically connected to the light emitting element 21 and the first conductor pattern 12, respectively.
  • the material of the terminal 23 it is preferable to use a material having good conductivity. Examples of the material of the terminal 23 include tungsten, molybdenum, manganese, and copper.
  • the frame member 24 is provided on the upper surface of the base body 22 so as to surround the light emitting element 21.
  • the base 22 and the frame member 24 are joined.
  • the shape of the inner wall surface surrounding the light emitting element 21 in the frame member 24 is circular in plan view, the light emitted from the light emitting element 21 can be uniformly reflected in all directions and emitted to the outside very uniformly. .
  • the entire frame member 24 is inserted into the through hole 10, but the present invention is not particularly limited thereto. A part of the frame member 24 may be inserted into the through hole 10.
  • the upper surface of the lamp 2 is located above the upper surface of the circuit board 1.
  • the frame member 24 constituting the lamp 2 is located above the upper surface of the circuit board 1. This is because when the lamp 2 is positioned as described above, the light emitted from the light emitting element 21 is easily emitted to the outside without being reflected by the inner peripheral surface of the through hole 10.
  • the light emission intensity of the light emitting device can be improved. Moreover, since it is not necessary to process the inner peripheral surface of the through-hole 10 so that the light radiated
  • the lamp 2 is preferably separated from the inner peripheral surface of the through hole 10.
  • the frame member 24 constituting the lamp 2 is separated from the circuit board 1. Therefore, heat transfer from the frame member 24 to the circuit board 1 is suppressed. Therefore, heat transfer from the lamp 2 to the circuit board 1 is suppressed. Thereby, the heat generated by the lamp 2 is more easily conducted to the heat radiating member 3 than the circuit board 1. Therefore, the light emitting device of this embodiment is improved with respect to thermal control.
  • the frame member 24 can be made of a material having good insulation.
  • Examples of the material of the frame member 24 include ceramic materials such as alumina, mullite, titanium oxide, zirconium oxide, and yttrium oxide, or glass ceramic materials.
  • the main component of the material constituting the frame member 24 is the same as the main component of the material constituting the base body 22. This is because the difference between the thermal expansion coefficient of the base 22 and the thermal expansion coefficient of the frame member 24 can be reduced.
  • a main component means the component with the largest mass ratio among the materials which comprise a member here.
  • the wavelength conversion member 25 is supported on the frame member 24 and is provided on the light emitting element 21 so as to face the light emitting element 21 with a gap.
  • a translucent resin member is disposed between the light emitting element 21 and the wavelength conversion member 25. In order to prevent heat from being transmitted from the resin to the wavelength conversion member 25, it is preferable that the resin member and the wavelength conversion member 25 are separated from each other.
  • the wavelength conversion member 25 includes a plurality of phosphors. When the primary light emitted from the light emitting element 21 is incident on the wavelength conversion member 25, the phosphor contained therein is excited to emit secondary light. The wavelength conversion member 25 emits white light, for example.
  • the wavelength converting member 25 is made of, for example, a silicone resin, an acrylic resin, or an epoxy resin, and the resin contains a phosphor.
  • the phosphor include a blue phosphor emitting fluorescence of 430 nm to 490 nm, a green phosphor emitting fluorescence of 500 nm to 560 nm, a yellow phosphor emitting fluorescence of 540 nm to 600 nm, and a fluorescence of 590 nm to 700 nm. And a red phosphor that emits light.
  • One of the phosphors is selected according to the wavelength of the primary light emitted from the light emitting element 21.
  • the heat radiating member 3 is in contact with the lower surface of the base 22 constituting the lamp 2.
  • contact in the present embodiment does not only indicate a state in which two specific members are in contact but also includes a state in which the two specific members are directly or indirectly joined. It is a concept.
  • Directly joined means a state where the members are joined without using a member for joining two specific members. Moreover, being indirectly joined shows the state joined using the member (for example, adhesive agent) for joining two specific members.
  • the lamp 2 and the heat radiating member 3 are indirectly bonded using an adhesive
  • the adhesive for example, a heat dissipating grease can be used.
  • the thickness of the adhesive in the vertical direction is preferably smaller than the thickness in the vertical direction of the base 22 and the heat radiating member 3. This is because heat transmitted from the lamp 2 to the adhesive can be suppressed from accumulating in the adhesive.
  • the heat dissipating member 3 is located below the base body 22.
  • the heat radiating member 3 has a flat plate-shaped portion 31 that is in contact with the lower surface of the base 22 and a plurality of fins 32 positioned on the lower surface side of this portion. After the plate-shaped portion 31 and the plurality of fins 32 are separately manufactured, the fins 32 may be joined to the lower surface of the plate-shaped portion 31.
  • the flat plate-shaped portion 31 and the plurality of fins 32 may be integrally formed.
  • the thickness (length in the z direction) of the plate-shaped portion 31 can be set to 1 mm to 5 mm, for example. Further, the length of the plurality of fins 32 in the z direction can be set to 3 mm to 50 mm, for example.
  • the heat radiating member 3 is a member for radiating the heat generated in the lamp 2 to the outside. Therefore, it is preferable to use a material with good thermal conductivity as the heat radiating member 3.
  • a metal material can be used as the heat radiating member 3.
  • the width in the horizontal direction (xy direction) of the heat radiating member 3 is larger than the width in the horizontal direction of the base body 22.
  • a part of the upper surface of the heat radiating member 3 faces a part of the lower surface of the circuit board 1 without interposing the base 22 therebetween.
  • the heat radiating member 3 can be enlarged.
  • more fins 32 can be provided.
  • the heat dissipating member 3 is separated from the circuit board 1. This is because heat transmitted from the lamp 2 to the heat radiating member 3 can be prevented from being transmitted from the heat radiating member 3 to the circuit board 1. Therefore, it is possible to further suppress the heat generated in the lamp 2 from being transmitted to the circuit board 1, and to efficiently radiate heat in the heat radiating member 3.
  • the light-emitting device of this embodiment further includes a plurality of metal members 4 that connect the heat dissipation member 3 and the circuit board 1.
  • the plurality of metal members 4 are indicated by dotted lines in a state of being transmitted through the circuit board 1 and the heat dissipation member 3.
  • An example of the metal member 4 is a screw. Screw holes are formed in the four corners of the flat circuit board 1 and the flat plate portion 31 of the heat radiating member 3, respectively. The metal member 4 (screw) is fixed to these screw holes.
  • the metal member 4 integrally fixes the circuit board 1, the lamp 2, and the heat radiating member 3 in a state where the lamp 2 is sandwiched between the circuit board 1 and the heat radiating member 3.
  • the heat radiating member 3 is fixed to the circuit board 1 by connecting the heat radiating member 3 to the circuit board 1 using the metal member 4. Therefore, even when a part of the heat generated by the lamp 2 is conducted to the circuit board 1, the heat is easily conducted to the heat radiating member 3 through the metal member 4. Therefore, the light emitting device of the present embodiment is improved with respect to heat dissipation characteristics and further improved with respect to light emission intensity.
  • the heat generated by the lamp 2 is mainly conducted through two paths.
  • One path is a path indicated by reference numeral 201 in FIG. 6 and is a path that travels in the horizontal direction through the heat radiating member 3 after being transmitted from the lamp 2 to the heat radiating member 3.
  • the horizontal direction is the virtual x-axis direction in FIG.
  • the other path is a path indicated by reference numeral 202 in FIG. 6 and is a path that travels in the horizontal direction in the circuit board 1 after being transmitted from the lamp 2 to the circuit board 1.
  • the heat that has traveled in the horizontal direction on the circuit board 1 is conducted to the heat radiating member 3 through the metal member 4.
  • the light-emitting device of the present embodiment mainly has two heat conduction paths 201 and 202, so that heat control can be efficiently performed in the xy plane direction of the virtual xyz space.
  • the light emitting device of this embodiment includes a heat conduction path 201 that travels in the plane direction through the heat dissipation member 3 and a heat conduction path 202 that travels in the plane direction through the circuit board 1.
  • heat conduction can be performed by effectively using the entire region in plan view, and heat dissipation can be improved.
  • the heat conduction path 201 in the heat radiating member 3 is schematically indicated by a dotted line
  • the heat conduction path 202 in the circuit board 1 is schematically indicated by a solid line.
  • the light emitting device of the second embodiment is similar to the light emitting device of the first embodiment in that a part of the upper surface of the heat radiating member 3 is a circuit without interposing the base 22 therebetween. It faces a part of the lower surface of the substrate 1. And the insulating member 5 is arrange
  • the insulating member 5 is preferably separated from either the circuit board 1 or the heat radiating member 3. As described above, when the insulating member 5 is separated from either the circuit board 1 or the heat radiating member 3, it is possible to suppress heat from being transferred from the heat radiating member 3 to the circuit board 1 through the insulating member 5. .
  • the insulating member 5 is joined to the heat radiating member 3 and separated from the circuit board 1, but the insulating member 5 is joined to the circuit board 1 and separated from the heat radiating member 3. Good.
  • the insulating member 5 examples include ceramic materials such as alumina, mullite, titanium oxide, zirconium oxide, and yttrium oxide, glass ceramic materials, insulating resins, and rubbers. At this time, it is preferable to use an insulating resin or rubber as the insulating member 5.
  • the circuit board 1 and the heat radiating member 3 are expanded or thermally deformed so that the circuit board 1 and the heat radiating member 3 are in contact with the insulating member 5 and insulated. There is a possibility that a pressing force is applied to the member 5. At this time, when an insulating resin or rubber is used as the insulating member 5, the insulating member 5 is easily deformed, and thus the pressing force can be relaxed by the insulating member 5. Therefore, durability of the circuit board 1 and the heat radiating member 3 can be improved.
  • the light emitting device of the third embodiment is similar to the light emitting device of the first embodiment in that a part of the upper surface of the heat dissipation member 3 is a circuit without interposing the base 22. It faces a part of the lower surface of the substrate 1. And when the heat radiating member 3 has the groove part 33 in an upper surface and the heat radiating member 3 is planarly viewed, the groove part 33 is located in the side rather than the area
  • the portion of the flat plate portion 31 constituting the heat radiating member 3 where the groove 33 is formed has a smaller thickness than the other portions of the flat plate portion 31. Therefore, the part in which the groove part 33 was formed becomes easy to deform
  • the heat radiating member 3 may expand or deform, and stress may be applied to the heat radiating member 3.
  • the stress can be relieved by deforming the portion where the groove 33 is formed. Therefore, the durability of the heat radiating member 3 can be improved.
  • the groove 33 When the groove 33 is located on the side of the region where the lamp 2 is in contact, it is possible to prevent the contact area between the lamp 2 and the heat radiating member 3 from being reduced. It can also be suppressed that the heat transfer to the member 3 is reduced. Even when the heat radiating member 3 expands or deforms, the portion where the groove 33 is formed is easily deformed, so that the heat radiating member 3 can be prevented from being separated from the lamp 2.
  • the region of the heat radiating member 3 on which the lamp 2 is in contact is preferably surrounded by the groove 33.
  • the width (length in the x direction) of the groove 33 in FIG. 11 can be set to 0.1 mm to 10 mm, for example.
  • the depth of the groove 33 (the length in the z direction) can be set to 0.1 mm to 1.5 mm, for example.
  • the heat dissipating member 3 is in contact with the lower surface of the lamp 2 in the same manner as the light emitting device of the first embodiment.
  • the upper surface of the flat portion 31 of the heat radiating member 3 is flat, and the upper surface of the portion 31 is in contact with the lower surface of the lamp 2.
  • the heat dissipating member 3 has a recess 34 on the upper surface.
  • the base 22 is located in the recess 34 and the lower surface of the base 22 is in contact with the bottom surface of the recess 34.
  • the base 22 can be easily positioned.
  • the width in the lateral direction (x direction) of the recess 34 is larger than the width in the lateral direction (x direction) of the lamp 2 as shown in FIG. preferable.
  • a part of the upper surface of the heat radiating member 3 faces a part of the lower surface of the circuit board 1 without the base 22 interposed therebetween. is doing. And in the area

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
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  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)

Abstract

La présente invention a trait à un dispositif électroluminescent dont les caractéristiques de dissipation thermique sont améliorées afin d'augmenter l'intensité lumineuse du dispositif électroluminescent. Plus particulièrement, la présente invention a trait à un dispositif électroluminescent qui comprend une carte de circuit imprimé (1) qui est pourvue d'un trou traversant (10), une lampe (2) qui est pourvue d'un élément électroluminescent (21) qui est disposé à un emplacement qui se trouve à l'intérieur du trou traversant (10) lorsqu'il est vu en plan, et un élément de dissipation thermique (3) qui est en contact avec la surface inférieure de la lampe (2). La lampe (2) comprend : une base (22) ; l'élément électroluminescent (21), qui est disposé sur la surface supérieure de la base (22) de manière à être à l'intérieur du trou traversant (10) lorsqu'il est vu en plan ; et une borne (23) qui est électriquement connectée à l'élément électroluminescent (21) et liée à la surface inférieure de la carte de circuit imprimé (1).
PCT/JP2010/067689 2009-10-07 2010-10-07 Dispositif électroluminescent WO2011043441A1 (fr)

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JP2009233164 2009-10-07
JP2009-233164 2009-10-07

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WO2011043441A1 true WO2011043441A1 (fr) 2011-04-14

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013128896A1 (fr) * 2012-02-29 2013-09-06 パナソニック株式会社 Luminaire à del
WO2014079784A1 (fr) * 2012-11-20 2014-05-30 Osram Gmbh Sous-ensemble optoélectronique et procédé de fabrication d'un sous-ensemble optoélectronique
EP2792943A1 (fr) * 2013-04-16 2014-10-22 Bender & Wirth Gmbh & Co. Support de LED
GB2564566A (en) * 2017-06-28 2019-01-16 Conservation Tech Of Illinois Llc Powering and fastening a light emitting diode or chip-on-board component to a heatsink
CN112577018A (zh) * 2019-09-27 2021-03-30 株式会社小糸制作所 光源单元以及车辆用灯具

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WO2004084319A1 (fr) * 2003-03-18 2004-09-30 Sumitomo Electric Industries Ltd. Element de montage pour un element electroluminescent, et dispositif a semi-conducteur utilisant celui-ci
JP2006066868A (ja) * 2004-03-23 2006-03-09 Toyoda Gosei Co Ltd 固体素子および固体素子デバイス
JP2007281146A (ja) * 2006-04-05 2007-10-25 Sharp Corp 半導体発光装置
JP2008034622A (ja) * 2006-07-28 2008-02-14 Sharp Corp 半導体発光素子アセンブリ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004084319A1 (fr) * 2003-03-18 2004-09-30 Sumitomo Electric Industries Ltd. Element de montage pour un element electroluminescent, et dispositif a semi-conducteur utilisant celui-ci
JP2006066868A (ja) * 2004-03-23 2006-03-09 Toyoda Gosei Co Ltd 固体素子および固体素子デバイス
JP2007281146A (ja) * 2006-04-05 2007-10-25 Sharp Corp 半導体発光装置
JP2008034622A (ja) * 2006-07-28 2008-02-14 Sharp Corp 半導体発光素子アセンブリ

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013128896A1 (fr) * 2012-02-29 2013-09-06 パナソニック株式会社 Luminaire à del
WO2014079784A1 (fr) * 2012-11-20 2014-05-30 Osram Gmbh Sous-ensemble optoélectronique et procédé de fabrication d'un sous-ensemble optoélectronique
US9961781B2 (en) 2012-11-20 2018-05-01 Osram Gmbh Optoelectronic assembly and method for producing an optoelectronic assembly
EP2792943A1 (fr) * 2013-04-16 2014-10-22 Bender & Wirth Gmbh & Co. Support de LED
GB2564566A (en) * 2017-06-28 2019-01-16 Conservation Tech Of Illinois Llc Powering and fastening a light emitting diode or chip-on-board component to a heatsink
US10203096B2 (en) 2017-06-28 2019-02-12 Conservation Technology of Illinois LLC Powering and fastening a light emitting diode or chip-on-board component to a heatsink
GB2564566B (en) * 2017-06-28 2020-07-29 Conservation Tech Of Illinois Llc Powering and fastening a light emitting diode or chip-on-board component to a heatsink
CN112577018A (zh) * 2019-09-27 2021-03-30 株式会社小糸制作所 光源单元以及车辆用灯具
CN112577018B (zh) * 2019-09-27 2024-03-01 株式会社小糸制作所 光源单元以及车辆用灯具

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