EP2792943A1 - Support de LED - Google Patents

Support de LED Download PDF

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Publication number
EP2792943A1
EP2792943A1 EP14161527.8A EP14161527A EP2792943A1 EP 2792943 A1 EP2792943 A1 EP 2792943A1 EP 14161527 A EP14161527 A EP 14161527A EP 2792943 A1 EP2792943 A1 EP 2792943A1
Authority
EP
European Patent Office
Prior art keywords
led
carrier
led holder
holder according
contacts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP14161527.8A
Other languages
German (de)
English (en)
Other versions
EP2792943B1 (fr
Inventor
Oris Papini
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bender and Wirth GmbH and Co
Original Assignee
Bender and Wirth GmbH and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bender and Wirth GmbH and Co filed Critical Bender and Wirth GmbH and Co
Publication of EP2792943A1 publication Critical patent/EP2792943A1/fr
Application granted granted Critical
Publication of EP2792943B1 publication Critical patent/EP2792943B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a holder for light emitting diodes (LED), in short LED holder, according to the preamble of claim 1.
  • LED light emitting diodes
  • Light emitting diodes convert more than half of their absorbed energy into heat, but at the same time the high temperature reduces their lifetime. You therefore need a very good cooling.
  • the LED holder should therefore provide an LED with both energy and ensure a consistently high pressure of the LED against the heat sink.
  • LED holders are made of a variety of thermoplastic materials. Since these materials typically lose their mechanical stability as the temperature increases, the use of the LED holders in various ways presents the disadvantage that the reduced mechanical stability of the LED holders during operation of the LED no longer restricts the pressure of the LED against the heat sink can sufficiently ensure and the cooling effect decreases, with the result that the projected life of the LED is not achieved.
  • LED holders usually include cutting or plug-in terminals for a cable connection.
  • these terminals require a housing.
  • the required dimensions of such housings are often so great that they lead to a very flat radiating LED to shadow in the environment, because they extend beyond the flat LED too far.
  • the object of the invention is therefore to make an LED holder of the type mentioned so that it is structurally designed, designed flat and not even at high thermal stress its mechanical properties get lost. Finally, a reliable pressure of the LED should be ensured against the heat sink and the power supply to the LED safely be accomplished. In a further embodiment, the LED holder to ensure increased cooling of the LED.
  • the LED holder is a flat unit and plate-shaped, each plate is made of a thermally stable insulating material based on mica.
  • This insulating material contains predominantly mineral ingredients, namely a weight fraction of> 85% minerals in the insulating material.
  • the minerals are mica or artificial mica.
  • Artificial mica, such as Micanite is made from mica fragments and heat-resistant binders, e.g. Silicone binder, pressed into plates or molded parts. The proportion of binder is ⁇ 15%, preferably ⁇ 10%.
  • the LED to be held and cooled is provided on a carrier, which in turn can be fixed to the heat sink via the LED holder.
  • the plate-shaped LED holder is provided with a first mask, which is adapted for reliable positioning of the shape of the carrier.
  • a further, second mask is provided, which is smaller than the first mask and is adapted to the passage of light of the LED to the shape of the LED.
  • the insulating material is made of mica.
  • the body of the LED holder is composed of two or more plates. The thickness of the lower plate is chosen to be slightly thinner than the carrier itself for each LED used.
  • the lower plate is provided with a first mask, which is used for positioning the Carrier of the LED is adapted to the shape.
  • a second mask is provided in the upper plate, which is smaller than the first mask, but allows the light to pass through the LED.
  • a plurality of masks are provided to simultaneously connect a plurality of LEDs to the LED holder.
  • the LEDs can each be arranged on a carrier or on a common carrier and after connecting to the LED holder, this forms a housing for the LEDs.
  • the LED holder 1 is fastened by means of screws 5 on a heat sink 3, wherein he presses the LED 2 with its carrier 10 on the heat sink 3.
  • the attachment by means of screws 5 is used for secure, secure contact and pressure of the LED holder 1 to the heat sink.
  • the LED holder 1 is - as out Fig. 2 to see - made up of individual plates and that an upper plate 6 and a lower plate 7, which consist of a mica material.
  • the plate 6 and the plate 7 each have a mask 16, 17. Through these masks 16, 17, the LED 2 is led out.
  • the plate 6 and the plate 7 are fixed to each other by adhesive portions 18. Between the adhesive portions 18 carries the lower plate 7 electrically conductive contacts 8, which, as Fig. 4 shown, are provided with folds 13 and with a tongue 21 which leads to the carrier 10. Compared with these contacts 8 7 identically designed Antik Anlagenn 9 are shown on the opposite side of the plate. The plates 6 and 7 can then be exactly aligned with each other.
  • the current-conducting contacts 8 are provided with lines 4, the like by welding, gluing or the like. are definable.
  • the tongues 21 of the current-conducting contacts 8 engage contact surfaces 11 of the carrier 10.
  • This carrier 10 has the LED 2.
  • the mask 17 of the lower plate 7 is adapted to the shape of the various carriers 10 available on the market for an LED 2.
  • the carrier 10 of the LED 2 is inserted from the underside of the plate 7 in the mask 17, in which case through the mask 17, the plate 6 contacts the carrier 10. In this case, the carrier 10 engages from below with its contact surfaces 11 against the current-conducting contacts 8.
  • the thickness of the plate 7 is less than the thickness of the carrier 10, so that after assembly, the carrier 10 on the bottom of the LED holder 1 slightly protrudes.
  • the LED holder 1 is also provided with screws 5 through the apertures of the plates 6, 7 and the adhesive portions 18 of the LED holder. 1 are guided and with which the carrier 10 with the LED 2 on the heat sink 3 can be fixed.
  • the two plates 6, 7 are connected and are then fastened to the heat sink 3 via the screws 5 which engage through the rivets 12.
  • lines 4 are guided. As the Fig. 3b shows, the lines 4 are at the plate 6 in the guide recesses 15, so as to prevent protruding parts of the lines 4 are found on the top of the LED holder 1. In addition, the LED 2 protrudes through the mask 16 on the surface of the plate 6.
  • Plug-in recesses 14 of the lower plate 7 for the current-conducting contact 8 and 13 for the folds are particularly clearly defined.
  • FIG. 6 an LED holder 1 with a heat sink 3, wherein the LED holder 1 is shown with retaining recesses 20.
  • this retaining recesses 20 engage unspecified pin-like extensions of an optical element 19, so as to determine the optical element 19 to the LED holder 1 and the heat sink 3 can.
  • the mask 17 of the plate 7 is adapted to the shape of the carrier 10.
  • the thickness of this plate 7 is chosen so that it is slightly thinner than the carrier 10 of the LED 2 for each LED used 2, the second plate 6 has, as already stated, also a mask 16, but the carrier 10 of the LED 2 only covered, but not so far, that the luminous surface of the LED 2 would be covered. If now the superimposed plates 6 and 7 are pressed with the LED 2 and its carrier 10 by means of screws 5 on the heat sink 3, because of the small thickness of the lower plate 7 relative to the carrier 10, the pressure of the carrier 10 against the heat sink 3 is generated , The thermal stability of the mica material of the plates 6, 7 ensures that this pressure does not decrease over the entire life of the LED 2 at the temperatures generated by it.
  • the current-conducting contacts 8 inserted between the two plates 6 and 7 and positioned so that they press on the intended contact surfaces 11 of the carrier 10 and connect the LED 2 with it.
  • the current is brought by means of the lines 4 to the contacts 8.
  • the leads 4 are connected to the contacts 8, whether by welding, soldering, clamping or crimping.
  • the determination is made by welding, because thereby the smallest dimensions can be achieved.
  • the contacts 8 In order to reliably position the contacts 8 during production, they are provided with the bevels 13, which engage in specially provided recesses 14 of the lower plate 7 and thus ensure a practical orientation of the contacts 8.
  • the contacts 8 between the upper plate 6 and the lower plate 7 are clamped.
  • the pressure of the carrier 10 against the heat sink 3 is generated via the contacts 8. It is advantageous in this case if the mask 16 of the plate 6 is brought so close to the luminous surface of the LED 2 that covers the contacts 8 and thus an immediate transmission of the compressive force of the screwdrivers 5 on the upper plate 6 on the contacts 8 and thus the carrier 10 is reached.
  • the pressure of the carrier 10 against the heat sink 3 is made only on one side. It is advantageous if a similar pressure on the side offset by about 180 degrees side of the carrier 10 is gebacht. This can, as already mentioned, only happen when the contacts 8 similar or similar Antik Anlagenn 9 are arranged, which provide only for the symmetry of Antiks. These pressure aids 9 can physically have the same shape and design as the contacts 8. But you can also differ from that. The important thing is that they produce a similar pressure as the contacts 8.
  • carrier 10 with LED 2 and LED holder 1 it is advantageous to provide for a pre-assembly, so that the two plates 6 and 7, possibly with the contacts 8, possibly with lines 4 and the additional pressure aids 9 are connected to form a unit that is easy to handle. This can be achieved if the two plates 6 and 7 are connected to the inserted contacts 8 and pressure aids 9 by means of rivets 12.
  • the number of rivets 12 can be selected as needed and depends on the particular design or application. The use of such rivets usually allows the application of higher torques for the mounting screws 5 and thus higher pressures of the carrier 10 to the heat sink. 3
  • Anyak Anlagenn 9 can also be designed so that they provide an additional cooling effect. This Anyak Anlagenn 9 serve to achieve a uniform load of the LED holder 1 on the heat sink 3.
  • the folds 13 can also be designed so that they point in two directions, so that either the lower plate 7 and / or the upper plate 6 with the folds 13 in conjunction occur.
  • the two plates 6, 7 may be formed as a one-piece housing.
  • Such an embodiment would be useful if only the mechanical properties of the LED holder 1 are required. If at the same time the electrical connection take place, the contacts 8 would subsequently be inserted into the housing in this case. Even a direct incorporation into the one-piece housing would be conceivable.
  • the measures provided for holding the light-conducting optics could also be designed as pin-like continuations, which engage in recesses of the LED holder 1 and are fastened there by frictional engagement.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
EP14161527.8A 2013-04-16 2014-03-25 Arrangement de LED Active EP2792943B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102013103815.8A DE102013103815A1 (de) 2013-04-16 2013-04-16 LED-Halter

Publications (2)

Publication Number Publication Date
EP2792943A1 true EP2792943A1 (fr) 2014-10-22
EP2792943B1 EP2792943B1 (fr) 2021-05-19

Family

ID=50473029

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14161527.8A Active EP2792943B1 (fr) 2013-04-16 2014-03-25 Arrangement de LED

Country Status (3)

Country Link
EP (1) EP2792943B1 (fr)
DE (1) DE102013103815A1 (fr)
ES (1) ES2875777T3 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202018101230U1 (de) 2018-03-05 2018-03-12 Bjb Gmbh & Co. Kg LED-Anschlusselement zur Anbindung einer auf einer Platine angeordneten LED-Lichtquelle
DE102018105010A1 (de) 2018-03-05 2019-03-14 Bjb Gmbh & Co. Kg LED-Anschlusselement zur Anbindung einer auf einer Platine angeordneten LED-Lichtquelle

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0126606A2 (fr) * 1983-05-16 1984-11-28 Illinois Tool Works Inc. Ensembles de puits de chaleur et isolateurs électriques utilisés là dedans
DE102008000582A1 (de) * 2007-03-14 2008-09-18 Visteon Global Technologies, Inc., Van Buren Township LED-Verbindungsfederbügelbauteil
EP2218962A2 (fr) * 2009-02-16 2010-08-18 Koito Manufacturing Co., Ltd. Module de source d'éclairage et phare de véhicule
WO2011043441A1 (fr) * 2009-10-07 2011-04-14 京セラ株式会社 Dispositif électroluminescent
WO2012117310A1 (fr) * 2011-03-03 2012-09-07 Koninklijke Philips Electronics N.V. Dispositif électroluminescent doté d'un support de del à ressort

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4480060A (en) * 1983-01-27 1984-10-30 Corning Glass Works Mica-resin composite material
US4921748A (en) * 1988-11-28 1990-05-01 Armstrong World Industries, Inc. Fluorhectorite laminate printed circuit substrate
US8773007B2 (en) * 2010-02-12 2014-07-08 Cree, Inc. Lighting devices that comprise one or more solid state light emitters

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0126606A2 (fr) * 1983-05-16 1984-11-28 Illinois Tool Works Inc. Ensembles de puits de chaleur et isolateurs électriques utilisés là dedans
DE102008000582A1 (de) * 2007-03-14 2008-09-18 Visteon Global Technologies, Inc., Van Buren Township LED-Verbindungsfederbügelbauteil
EP2218962A2 (fr) * 2009-02-16 2010-08-18 Koito Manufacturing Co., Ltd. Module de source d'éclairage et phare de véhicule
WO2011043441A1 (fr) * 2009-10-07 2011-04-14 京セラ株式会社 Dispositif électroluminescent
WO2012117310A1 (fr) * 2011-03-03 2012-09-07 Koninklijke Philips Electronics N.V. Dispositif électroluminescent doté d'un support de del à ressort

Also Published As

Publication number Publication date
EP2792943B1 (fr) 2021-05-19
ES2875777T3 (es) 2021-11-11
DE102013103815A1 (de) 2014-10-16

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