WO2013175713A1 - Led module, manufacturing method for same, illuminating instrument, and straight tube led lamp - Google Patents

Led module, manufacturing method for same, illuminating instrument, and straight tube led lamp Download PDF

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Publication number
WO2013175713A1
WO2013175713A1 PCT/JP2013/002843 JP2013002843W WO2013175713A1 WO 2013175713 A1 WO2013175713 A1 WO 2013175713A1 JP 2013002843 W JP2013002843 W JP 2013002843W WO 2013175713 A1 WO2013175713 A1 WO 2013175713A1
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WO
WIPO (PCT)
Prior art keywords
led module
led
lead frame
mounting portions
led chip
Prior art date
Application number
PCT/JP2013/002843
Other languages
French (fr)
Japanese (ja)
Inventor
小林　健太郎
良治 今井
純 合田
暁史 中村
隼人 井岡
Original Assignee
パナソニック株式会社
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Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Publication of WO2013175713A1 publication Critical patent/WO2013175713A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body

Definitions

  • the present invention relates to an LED module and a method of manufacturing the same, a luminaire, and a straight tube type LED lamp.
  • an LED (Light Emitting Diode) light source formed using a frame 203 as shown in FIGS. 24A and 24B is known (International Publication Number WO 2007/034537 A1: Patent Document 1).
  • the frame 203 is made of copper as a base material, and its surface is plated with silver.
  • the frame 203 includes a plurality of product areas 203A and a tie bar 203B disposed between the plurality of product areas 203A.
  • the product area 203A includes a die bond area 203a, a first suspension lead 203c connecting the die bond area 203a and the first lead 203b, a wire bond area 203d facing the die bond area 203a, a wire bond area 203d and a second lead 203e.
  • a second suspension lead 203f for connecting the Therefore, the frame 203 has a plurality of die bond areas 203a arranged along the first direction with a predetermined spacing, and a plurality of wire bond areas 203d arranged along the first direction opposite the die bond areas 203a. And.
  • the frame 203 is provided with the above-mentioned first lead 203b connected to the die bonding area 203a and extending in the first direction, and the above-mentioned second lead 203e connecting to the wire bonding area 203d and extending in the first direction.
  • the LED chip 202c is mechanically fixed to the die bonding area 203a using a paste material, and the n-side electrode of the LED chip 202c is electrically connected.
  • the p-side electrode of the LED chip 202 c is electrically connected to the wire bonding area 203 d through the bonding wire 206.
  • the LED chip 202c, the die bonding area 203a, the bonding wire 206, and the wire bonding area 203d are sealed with a resin 208 to form the LED 202.
  • the tie bar 203B is punched out using a cutting machine 207a as shown in FIG.
  • Patent Document 1 describes a structure in which a reflecting plate 209 is fitted between adjacent LEDs 202.
  • the board 213 is installed on the back surface of the LED light source via the insulating film 212.
  • Patent Document 1 describes that the board 213 is an aluminum plate and also functions as a heat sink.
  • the LED module such as the above-mentioned LED light source
  • the board 213 made of an aluminum plate on the back surface of the LED light source via the insulating film 212, the heat dissipation is improved and the light output can be increased. It becomes possible.
  • the inventors of the present application considered applying the LED light source described in Patent Document 1 as a light source of a lighting fixture, and in this case, it was considered necessary to improve heat dissipation by making the fixture main body made of metal.
  • the inventors of the present application considered applying the LED light source described in Patent Document 1 to a straight tube type LED lamp, and also considered that it is necessary to improve the heat dissipation also in this case.
  • the present invention has been made in view of the above, and an object thereof is an LED module which is easy to handle and capable of achieving cost reduction and high light output, and a method of manufacturing the same. It is providing a lighting fixture and a straight tube
  • the resin portion is disposed on the side opposite to the plurality of mounting portions in the thickness direction of the resin portion, the LED chip mounted on each of the plurality of mounting portions, and the resin portion exposed.
  • a long insulating substrate supporting the first direction as a longitudinal direction, the lead frame substrate including the plurality of mounting portions and being adjacent in the first direction among the plurality of mounting portions
  • a circuit pattern portion defining an electrical connection relationship between mounting portions, and a plurality of compound pattern portions disposed on both sides of the circuit pattern portion in a second direction orthogonal to the thickness direction and orthogonal to the first direction.
  • the plurality of crosspieces are embedded in the insulating substrate.
  • the thermal conductivity of the insulating substrate is preferably equal to or higher than the thermal conductivity of the resin portion.
  • each of the plurality of mounting portions is connected to a die pad on which the LED chip is mounted, and the first electrode of the LED chip electrically connected to the die pad via a first wire.
  • the arrangement of the first lead, the die pad, and the second lead in the second direction is preferably reversed.
  • the insulating substrate and the resin portion are preferably separate.
  • the circuit pattern portion is formed with a cut groove in which one end side in the second direction is opened at the side edge of the electrical connection portion connecting between the mounting portions adjacent in the first direction. It is preferable that
  • the lead frame substrate and the resin portion also serve as a reflecting member that reflects the light emitted from the LED chip.
  • the circuit pattern portion is formed so that serial circuits in which a desired number of the LED chips are connected in series can be connected in parallel.
  • a lead frame substrate in which a plurality of mounting portions each mounting an LED chip are arranged side by side in a first direction, a part of the lead frame substrate is embedded and the plurality of The resin portion in which the mounting portion is exposed, the LED chip mounted on each of the plurality of mounting portions, and the resin portion are disposed on the side opposite to the plurality of mounting portions in the thickness direction of the resin portion.
  • a method of manufacturing an LED module comprising: a plurality of crosspieces, and a plurality of connecting parts connecting the plurality of mounting parts and one of the plurality of crosspieces, wherein A first step of forming the lead frame substrate by performing a punching process, and a second step of forming the resin portion in which a portion of the lead frame substrate is embedded by an insert molding method after the first step And after the second step, the LED chip is mounted on each of the plurality of mounting portions, and the insulating substrate is provided to support the resin portion.
  • the LED chip be mounted on each of the plurality of mounting portions, and then the insulating substrate be provided so as to support the resin portion.
  • the insulating substrate is provided to support the resin portion after the second step, and thereafter, the LED chip is provided to each of the plurality of mounting portions. It is preferable to implement.
  • a metal coating having a higher reflectance to light emitted from the LED chip than the metal hoop material is formed on the lead frame substrate between the first step and the second step. It is preferable to include the step of
  • the lighting fixture of the present invention comprises a fixture body and a light source held by the fixture body, and the light source is composed of the LED module.
  • the straight tube type LED lamp according to the present invention comprises a straight tube-shaped tube main body formed of a translucent material, and a first mouthpiece and a second mouthpiece respectively provided at one end and the other end in the longitudinal direction of the tube main body. And the LED module is accommodated in the tube body.
  • the LED module of the present invention is easy to handle by providing the insulating substrate, and the lead frame substrate includes the crosspieces, and each of the mounting parts and the crosspieces for each mounting part. And the connection portion connecting the two, it is possible to dissipate the heat generated in the LED chip through the connection portion and the crosspiece, so that cost reduction and light output can be achieved. It is possible to achieve high output.
  • the LED module manufacturing method of the present invention can provide an LED module that is easy to handle and that can achieve cost reduction and high light output.
  • the lighting fixture of the present invention it is possible to achieve cost reduction and high light output.
  • the straight tube type LED lamp of the present invention it is possible to achieve cost reduction and high light output.
  • FIG. 1A is a schematic perspective view of essential parts of the LED module of Embodiment 1.
  • FIG. 1B is a schematic cross-sectional view of the LED module of Embodiment 1.
  • FIG. 1C is a schematic cross-sectional view of a first modified example of the LED module of Embodiment 1.
  • FIG. FIG. 2 is a schematic plan view of a lead frame substrate in the LED module of the first embodiment.
  • FIG. 3 is a schematic perspective view of the main part of a metal hoop material used in the method of manufacturing the LED module of the first embodiment.
  • FIG. 4 is a main portion schematic perspective view for explaining the method for manufacturing the LED module of the first embodiment.
  • FIG. 5 is a main portion schematic perspective view for explaining the method for manufacturing the LED module of the first embodiment.
  • FIG. 1A is a schematic perspective view of essential parts of the LED module of Embodiment 1.
  • FIG. 1B is a schematic cross-sectional view of the LED module of Embodiment 1.
  • FIG. 1C
  • FIG. 6 is a schematic perspective view of relevant parts for explaining the method for manufacturing the LED module of the first embodiment.
  • FIG. 7 is a main portion schematic perspective view for explaining the method for manufacturing the LED module of the first embodiment.
  • FIG. 8 is a main portion schematic perspective view for explaining the method for manufacturing the LED module of the first embodiment.
  • FIG. 9 is a schematic perspective view of relevant parts for explaining another method of manufacturing the LED module of the first embodiment.
  • 10 is a schematic plan view of another lead frame substrate in the LED module of Embodiment 1.
  • FIG. FIG. 11 is an enlarged view of a main part of another lead frame substrate in the LED module of the first embodiment.
  • FIG. 12 is an enlarged view of a main part of still another lead frame substrate in the LED module of the first embodiment.
  • FIG. 13 is a schematic plan view of another lead frame substrate in the LED module of Embodiment 1.
  • FIG. 14 is an enlarged view of an essential part of another lead frame substrate in the LED module of the first embodiment.
  • FIG. 15 is a schematic cross-sectional view of a second modified example of the LED module of the first embodiment.
  • FIG. 16 is a schematic perspective view of main parts of a second modification of the LED module of the first embodiment.
  • FIG. 17 is a schematic cross-sectional view of a third modification of the LED module of the first embodiment.
  • FIG. 18 is a schematic cross-sectional view of a fourth modified example of the LED module of the first embodiment.
  • FIG. 19 is a schematic cross-sectional view of a fifth modified example of the LED module of the first embodiment.
  • FIG. 20 is a schematic cross-sectional view of a sixth modification of the LED module of the first embodiment.
  • FIG. 21A is a partially broken schematic perspective view of the lighting apparatus of Embodiment 2.
  • FIG. 21B is an enlarged view of an essential part of FIG. 21A.
  • FIG. 22 is a main part schematic side view of the lighting fixture of the second embodiment.
  • FIG. 23A is a partially broken schematic perspective view of the straight tube LED lamp according to the third embodiment.
  • FIG. 23B is an enlarged view of a main part of FIG. 23A.
  • FIG. 24A is a plan view of an essential part of a two-row frame used for a conventional LED light source.
  • FIG. 24B is a cross-sectional view taken along line XX of FIG. 24A.
  • FIG. 25 is a cross-sectional view of essential parts in a manufacturing process of a conventional LED light source.
  • FIG. 26 is a cross-sectional view of the essential part in the manufacturing process of the conventional backlight.
  • the LED module 1 has a lead frame substrate 3 on which a plurality of mounting portions 32 each mounting an LED chip 2 are arranged in a first direction (horizontal direction in FIG. 2), and a part of the lead frame substrate 3 is embedded. And the resin portion 4 in which the plurality of mounting portions 32 are exposed. Further, the LED module 1 is disposed on the LED chip 2 mounted on each of the plurality of mounting portions 32 and on the one surface 4 b opposite to the plurality of mounting portions 32 in the thickness direction of the resin portion 4. And a long insulating substrate 5 supporting the The insulating substrate 5 means an electrically insulating substrate (electrically insulating substrate). The insulating substrate 5 preferably has high thermal conductivity.
  • the lead frame substrate 3 includes a circuit pattern portion 31 including a plurality of mounting portions 32 and defining an electrical connection relationship between the mounting portions 32 adjacent in the first direction among the plurality of mounting portions 32. Furthermore, in the second direction (vertical direction in FIG. 2) perpendicular to the thickness direction of the resin portion 4 and in the second direction (vertical direction in FIG. 2), the lead frame substrate 3 And 33, and a plurality of connecting portions 34 connecting the plurality of mounting portions 32 and any of the plurality of rail portions 33.
  • the insulating substrate 5 is arranged such that the longitudinal direction of the insulating substrate 5 coincides with the first direction.
  • the LED module 1 of the present embodiment is easy to handle by including the insulating substrate 5. Further, in the LED module 1 of the present embodiment, the heat generated in the LED chip 2 can be dissipated through the connecting portion 34 and the crosspieces 33, so cost reduction and high output of light output can be achieved. It is possible to
  • the LED chip 2 is provided with a first electrode (not shown) as an anode electrode and a second electrode (not shown) as a cathode electrode on one side in the thickness direction of the LED chip 2 .
  • the LED chip 2 is a GaN-based blue LED chip that emits blue light, and uses a substrate provided with a sapphire substrate.
  • the substrate of the LED chip 2 is not limited to a sapphire substrate, and may be, for example, a GaN substrate, a SiC substrate, a Si substrate, or the like.
  • the structure of the LED chip 2 is not particularly limited.
  • the chip size of the LED chip 2 is not particularly limited.
  • the LED chip 2 for example, one having a chip size of 0.3 mm ⁇ (0.3 mm ⁇ 0.3 mm), 0.45 mm ⁇ (0.45 mm ⁇ 0.45 mm), 1 mm ⁇ (1 mm ⁇ 1 mm), etc. It can be used.
  • the planar shape of the LED chip 2 is not limited to the square shape, and may be, for example, a rectangular shape.
  • the material and luminescent color of the light emitting layer of LED chip 2 are not specifically limited. That is, the LED chip 2 is not limited to the blue LED chip, and for example, a violet light LED chip, an ultraviolet light LED chip, a red LED chip, a green LED chip, or the like may be used.
  • the lead frame substrate 3 is a metal frame, and is formed of a strip-shaped metal hoop material 30 (see FIG. 3).
  • a material of the metal hoop material 30 for example, copper having a relatively high thermal conductivity among metal materials is preferable.
  • the material of the metal hoop material 30 is not limited to copper, and may be, for example, phosphor bronze, a copper alloy (for example, 42 alloy or the like), aluminum, an aluminum alloy, a nickel alloy, or the like.
  • the thickness of the metal hoop material 30 is preferably set, for example, in the range of about 100 ⁇ m to 1500 ⁇ m.
  • the lead frame substrate 3 may appropriately be provided with a surface treatment layer (not shown) having a higher reflectance to light from the LED chip 2 than the metal hoop material 30 on the main surface side.
  • the lead frame substrate 3 is not limited to the presence or absence of the surface treatment layer, and preferably serves also as a reflecting member for reflecting light emitted from the LED chip 2 or the like. Thereby, the LED module 1 can improve the total luminous flux amount. However, in the LED module 1, in the configuration in which the surface treatment layer is provided on the lead frame substrate 3, the light extraction efficiency can be further improved.
  • the surface treatment layer for example, a laminated film of Ag film, Ni film, Pd film and Au film, a laminated film of Ni film and Au film, a laminated film of Ag film, Pd film and AuAg alloy film, etc. are adopted. can do.
  • the surface treatment layer is a lamination of a Ni film, a Pd film and an Au film rather than an Ag film from the viewpoint of long-term reliability (for example, oxidation resistance, corrosion resistance, adhesion to the resin part 4 etc.)
  • a film, a laminated film of Ni film and Au film, Ag film, Pd film and AuAg alloy film are preferable.
  • the surface treatment layer is preferably composed of a plating layer or the like. In short, the surface treatment layer is preferably formed by plating.
  • the surface treatment layer constitutes a metal film having a higher reflectance to light emitted from the LED chip 2 than the metal hoop material 30.
  • the LED module 1 is not limited to the main surface side of the lead frame substrate 3, and a surface treatment layer may be formed on the entire lead frame substrate 3.
  • the surface treatment layer on the main surface side of the lead frame substrate 3 may be partially formed by spot plating or the like.
  • the metal hoop material 30 an aluminum film having a purity higher than that of the aluminum plate is laminated on one surface side of the aluminum plate as a base material, and two kinds of dielectric films having different refractive indexes are laminated on this aluminum film. It is also possible to use a high reflection substrate on which a reflection enhancing film is laminated. Here, as the two types of dielectric films, for example, it is preferable to adopt an SiO 2 film and a TiO 2 film.
  • the LED module 1 can have a reflectance of 95% or more for visible light.
  • MIRO 2 and MIRO registered trademark of Alanod Co., Ltd. can be used.
  • a conductive film for electrical connection with each of the first wire 6b and the second wire 6c described later may be formed by plating or the like. It is necessary to pattern the reflection enhancing film.
  • Each of the plurality of mounting portions 32 includes a die pad 32a on which the LED chip 2 is mounted, a first lead 32b continuous to the die pad 32a, and a second lead 32c opposed to the die pad 32a in the second direction. .
  • the first electrode (not shown) of the LED chip 2 is electrically connected to the first lead 32 b via the first wire 6 b.
  • the second electrode (not shown) of the LED chip 2 is electrically connected to the second lead 32c via the second wire 6c.
  • the other surface side in the thickness direction of the LED chip 2 is bonded to the die pad 32 a via the bonding portion 7.
  • the bonding portion 7 may be formed of, for example, a die bonding material.
  • the bonding portion 7 may be a die bonding material mixed with a phosphor that is excited by light emitted from the LED chip 2 and emits light of a color different from the emission color of the LED chip 2.
  • a gold wire, an aluminum wire or the like can be employed as the first wire 6 b and the second wire 6 c.
  • the circuit pattern unit 31 includes an electrical connection unit 35 that connects the adjacent mounting units 32 in the first direction among the plurality of mounting units 32.
  • the electrical connection portion 35 has a strip shape whose longitudinal direction is the first direction.
  • the shape of the electrical connection portion 35 is not particularly limited, and may be, for example, a meandering shape, a curvilinear shape, or a shape in which a linear shape and a curvilinear shape are combined.
  • the lead frame substrate 3 is an array of the first leads 32 b, the die pads 32 a, and the second leads 32 c in the second direction between the mounting portions 32 adjacent to each other in the first direction among the plurality of mounting portions 32. It is preferable to reverse.
  • the connecting portion 34 and the rail portion to which the heat generated in the LED chip 2 mounted on one of the mounting portions 32 adjacent to each other in the first direction and the LED chip 2 mounted on the other are easily transmitted Since 33 is on the opposite side in the second direction, it is possible to more uniformly dissipate the heat generated in each LED chip 2. Therefore, the LED module 1 can increase the luminous efficiency of each LED chip 2 and can improve the total luminous flux.
  • the second lead 32c of one mounting portion 32 of the mounting portions 32 adjacent to each other and the first lead 32b of the other mounting portion 32 are electrically connected Preferably, they are connected via the portion 35 and electrically connected in series.
  • the circuit pattern portion 31 has, for example, the die pad 32a at one end side and the other end side in the first direction than the intermediate position as shown in FIG. It is preferable to have a connection switching portion 36 which connects and electrically connects with the die pad 32a of
  • the LED module 1 includes the first electrode of the LED chip 2 located closest to the connection switching unit 36 in the series circuit of all the LED chips 2 on one end side in the first direction than the connection switching unit 36, It becomes possible to connect the first electrode of the LED chip 2 located closest to the connection switching portion 36 among the series circuits of all the LED chips 2 on the other end side.
  • the circuit pattern portion 31 is formed so that serial circuits in which a desired number of LED chips 2 are connected in series can be connected in parallel.
  • the LED module 1 can suppress an increase in drive voltage or drive current that needs to be supplied from the lighting device, and the number of LED chips 2 can be increased.
  • the circuit pattern unit 31 may have a pattern in which all the LED chips 2 are connected in series without providing the connection switching unit 36. In this case, in a state where one LED chip 2 is mounted for each mounting portion 32, the LED module 1 is located between the first lead 32b at one end in the first direction and the second lead 32c at the other end. By feeding power to the series circuit of all the LED chips 2 can be fed.
  • the number of LED chips 2 mounted on each mounting portion 32 is not limited to one, and may be plural.
  • a plurality of LED chips 2 are connected in parallel for each mounting unit 32, and parallel circuits of the plurality of LED chips 2 are connected in series for the number of mounting units 32. It is possible to make a patterned conductor part.
  • the plurality of LED chips 2 may have the same emission color or may have different emission colors.
  • the LED module 1 is not limited to the configuration in which the same number of LED chips 2 are mounted on each mounting unit 32. Further, the LED module 1 is not limited to the configuration in which the LED chip 2 is mounted on all the mounting units 32.
  • the LED module 1 may be configured such that the LED chip 2 is mounted on the die pad 32 a via the submount member 15 as in the first modification shown in FIG. 1C.
  • the submount member 15 preferably has a stress relaxation function of relaxing the stress acting on the LED chip 2 due to the difference in linear expansion coefficient between the LED chip 2 and the lead frame substrate 3. Thereby, the LED module 1 can relieve the stress acting on the LED chip 2 due to the difference in the coefficient of linear expansion between the LED chip 2 and the lead frame substrate 3.
  • the submount member 15 preferably has a heat transfer function of transferring the heat generated by the LED chip 2 to the die pad 32a.
  • the submount member 15 preferably has a heat transfer function of transferring heat generated by the LED chip 2 to a range wider than the chip size of the LED chip 2 in the die pad 32 a. For this reason, it is preferable that the submount member 15 be formed in a plane size larger than the chip size of the LED chip 2.
  • the LED module 1 can efficiently dissipate the heat generated by the LED chip 2 through the submount member 15, the die pad 32 a, the connecting portion 34 and the crosspieces 33.
  • the submount member 15 preferably has, for example, a rectangular plate shape.
  • the submount member 15 may be made of a material having a light transmitting property and a light diffusing property. Thereby, the LED module 1 can improve the light extraction efficiency.
  • a material which has translucency and diffusivity alumina, barium sulfate, etc. are employable, for example.
  • the submount member 15 As a material of the submount member 15, aluminum nitride, composite SiC, Si, CuW or the like can be adopted.
  • the submount member 15 may be provided with a reflective film that reflects the light emitted from the LED chip 2 on the surface on which the LED chip 2 is bonded.
  • the reflective film can be formed of, for example, a laminated film of a Ni film and an Ag film.
  • the material of the reflective film is not particularly limited, and may be appropriately selected according to the emission wavelength of the LED chip 2, for example.
  • the lead frame substrate 3 is not limited to the example of FIG. 2, and among the plurality of mounting portions 32, the mounting portions 32 adjacent in the first direction may have the first lead 32 b, the die pad 32 a and the second lead 32 c in the second direction.
  • the arrangement may be the same.
  • the first leads 32b and the second leads 32c of the mounting portions 32 adjacent to each other are connected and electrically connected via the electrical connection portions 35, respectively.
  • the lead frame substrate 3 can make the circuit pattern portion 31 a conductor portion patterned so as to connect in parallel the LED chips 2 mounted one by one on each mounting portion 32.
  • the circuit pattern portion 31 is supported between a pair of crosspieces 33 via a plurality of connecting portions 34 continuous to each of the crosspieces 33.
  • Each crosspiece 33 is formed in a strip shape in which the first direction is the longitudinal direction.
  • the dimension (width dimension) of the crosspieces 33 in the second direction is set larger than the dimension (width dimension) of the electric connection portion 35 in the second direction.
  • the dimension (width dimension) in the first direction of each connecting portion 34 is set larger than the dimension (width dimension) in the second direction of the electrical connection portion 35.
  • a plurality of mounting portions 32 are arranged along the first direction. Further, in the lead frame substrate 3, a plurality of connecting portions 34 connected to each of the crosspieces 33 are arranged along the first direction.
  • the opening shape of the opening 4 a in a plan view is a circular shape, but the shape is not limited to this, and may be an oval shape, a regular polygon shape, or the like.
  • the opening 4 a has a shape in which the opening area is substantially constant regardless of the distance from the mounting portion 32 in the thickness direction of the resin portion 4.
  • the present invention is not limited thereto.
  • the shape may be such that the opening area gradually increases as the distance from.
  • it is preferable that the opening 4 a has a shape in consideration of the draft of the mold at the time of releasing the mold after molding the resin portion 4.
  • thermoplastic resins such as liquid crystal polymer (liquid crystal polymer: LCP), polybutylene terephthalate (PBT), polyamide (polyamide: PA), epoxy resin, polyester resin
  • thermosetting resins can be employed.
  • the resin portion 4 is preferably a resin which is white and has a high reflectance to visible light in any of the thermoplastic resin and the thermosetting resin. In short, it is preferable that the resin part 4 doubles as a reflecting member that reflects light. Thereby, the LED module 1 can improve the total luminous flux amount.
  • the resin portion 4 is formed in an elongated shape (here, an elongated rectangular plate shape), and the openings 4 a are formed at substantially equal intervals in the first direction.
  • the width dimension of the resin part 4 in the second direction is set to a value smaller than the dimension between the crosspieces 33 in the second direction.
  • the insulating substrate 5 is formed in a long shape (here, a long rectangular plate shape).
  • the width dimension of the insulating substrate 5 in the second direction is set to a value larger than the width dimension of the lead frame substrate 3 in the second direction.
  • the material of the insulating substrate 5 is, for example, a thermoplastic resin such as liquid crystal polymer, polybutylene terephthalate, or polyamide resin, a thermosetting resin such as epoxy resin or polyester resin, or a ceramic such as alumina or aluminum nitride. can do.
  • the insulating substrate 5 is preferably a resin which is white and has a high reflectance to visible light in both the thermoplastic resin and the thermosetting resin. It is preferable that the thermal conductivity of the insulating substrate 5 of the LED module 1 is equal to or higher than the thermal conductivity of the resin portion 4.
  • the insulating substrate 5 may be made of the same material as that of the resin portion 4, or may be a mixture of a resin and a filler having a thermal conductivity higher than that of the resin, or a ceramic.
  • a filler magnesium oxide, boron nitride, aluminum hydroxide, glass fiber etc. are employable, for example.
  • the filling rate of the filler is preferably about 60 volume percent to about 75 volume percent.
  • the LED module 1 includes a sealing portion 9 in which the LED chip 2, the first wire 6 b and the second wire 6 c are sealed on the other surface 4 c side in the thickness direction of the resin portion 4.
  • a silicone resin which is a first light transmitting material is used.
  • the first light transmissive material is not limited to silicone resin, and may be epoxy resin, acrylic resin, glass, etc., for example.
  • the distance between the lead frame substrate 3 and the one surface of the LED chip 2 is preferably longer than the distance between the lead frame substrate 3 and the plane including the other surface 4 c of the resin portion 4.
  • the LED module 1 emits light emitted from the LED chip 2 and incident on the other surface 4 c of the resin portion 4 and absorbed by the resin portion 4 or light reflected by the inner side surface of the opening 4 a in the resin portion 4 It is possible to further reduce the light output, and to further increase the light output.
  • the insulating substrate 5 is formed so as to cover not only the one surface 4 b side of the resin portion 4 but also the side surface 4 d of the resin portion 4 along the first direction.
  • the surface 5 c on the other surface 4 c side of the resin portion 4 in the insulating substrate 5 be substantially flush with the other surface 4 c of the resin portion 4.
  • the sealing portion 9 may be mixed with a wavelength conversion material such as a phosphor that emits light of a color different from the color of light emitted from the LED chip 2.
  • a wavelength conversion material such as a phosphor that emits light of a color different from the color of light emitted from the LED chip 2.
  • the LED module 1 can obtain mixed color light of the light emitted from the LED chip 2 and the light emitted from the phosphor.
  • the sealing part 9 is made into hemispherical shape, it is good also as not only hemispherical shape but a semi-elliptic spherical shape, for example.
  • the LED module 1 may be provided with a color conversion part as a wavelength conversion part containing a wavelength conversion material and a 2nd translucent material separately from the sealing part 9, for example.
  • the wavelength conversion unit means a functional unit having a wavelength conversion function of converting the wavelength of the electromagnetic wave (light) emitted from the LED chip 2 into electromagnetic waves (light) of different wavelengths.
  • a blue LED chip is adopted as the LED chip 2 and a yellow phosphor is adopted as the phosphor of the wavelength conversion material, it becomes possible to obtain white light. That is, in the LED module 1, the blue light emitted from the LED chip 2 and the light emitted from the yellow phosphor are emitted through the surface of the sealing portion 9 or the color conversion portion to obtain white light.
  • a silicone resin can be employed as the second light transmissive material.
  • the second light transmitting material is not limited to the silicone resin, but, for example, an acrylic resin, glass, or an organic / inorganic hybrid material in which an organic component and an inorganic component are mixed and combined at the nm level or molecular level Good.
  • the fluorescent substance which is a wavelength conversion material not only yellow fluorescent substance but yellow fluorescent substance and red fluorescent substance may be adopted or red fluorescent substance and green fluorescent substance may be adopted, for example.
  • the fluorescent substance which is a wavelength conversion material may employ
  • the LED module 1 can improve color rendering by adopting a plurality of types of phosphors as wavelength conversion materials.
  • the LED module 1 can emit white light with the LED chip 2 alone, when the phosphor is mixed in the sealing portion 9, the color of light desired to be obtained by the LED module 1 is the same as the color of the LED chip 2.
  • a structure without the color conversion unit can be employed.
  • the phosphor as the wavelength conversion material when the phosphor as the wavelength conversion material is mixed in the sealing portion 9, not only the heat generated in the LED chip 2 but also the heat generated in the phosphor as the wavelength conversion material is the coupling portion 34 Thus, the heat can be dissipated through the crosspieces 33, and the light output can be increased.
  • the color conversion portion is preferably disposed such that a gas layer (for example, an air layer or the like) is formed between the color conversion portion and the sealing portion 9 on the other surface 4 c side of the resin portion 4.
  • the LED module 1 may have a configuration in which the color conversion unit has a dome shape and the LED chip 2, the first wire 6b, and the second wire 6c are sealed by the color conversion unit.
  • the LED module 1 may have the color conversion portion in a layered shape, and the color conversion portion may seal the LED chip 2 and the wires 6 b and 6 c.
  • the layered color conversion portion can be formed by a molding method, a coating method using a dispenser, a screen printing method, or the like.
  • the LED module 1 a plurality of crosspieces 33 are embedded in the insulating substrate 5.
  • the thermal conductivity of the insulating substrate 5 is preferably equal to or higher than the thermal conductivity of the resin portion 4.
  • the outer size of the insulating substrate 5 in plan view may be appropriately set based on the outer size of the lead frame substrate 3 in plan view and the like.
  • a metal hoop material 30 (see FIG. 3) which is a basis of the lead frame substrate 3 is prepared.
  • the step shown in FIG. 4 is obtained by performing the step (first step) of forming the lead frame substrate 3 by punching the metal hoop material 30 with a press.
  • step (second step) of molding the resin portion 4 in which a part of the lead frame substrate 3 is embedded is performed by the insert molding method to obtain the structure shown in FIG.
  • a process shown in FIG. 6 is obtained by appropriately performing a process for forming a desired circuit pattern portion 31 on the lead frame substrate 3 (hereinafter, referred to as “extraction process”).
  • extraction process a process for forming a desired circuit pattern portion 31 on the lead frame substrate 3
  • the removal step is performed by using a part of each of the crosspieces 33 on both sides of the connection switching portion 36 in the second direction. It may be made to carry out press processing which pulls out over the full length of the direction.
  • the punching process is not limited to pressing, but may be, for example, laser processing using a laser beam for cutting, stamping using a stamping die, cutting using a blade (grindstone), or the like. it can.
  • the desired circuit pattern portion 31 is formed on the lead frame substrate 3 formed in the first step, the removal step is unnecessary.
  • the step (third step) of mounting the LED chip 2 on each of the plurality of mounting portions 32 is performed to obtain the structure shown in FIG.
  • the LED chip 2 is mounted on the die pad 32a, and then the first electrode of the LED chip 2 and the first lead 32b are electrically connected via the first wire 6b, and the LED Wire bonding is performed to electrically connect the second electrode of the chip 2 and the second lead 32c via the second wire 6c.
  • the LED chip 2 is mounted on the die pad 32 a
  • the LED chip 2 and the die pad 32 a are bonded via the bonding portion 7.
  • the LED module 1 includes the sub mount member 15 as shown in FIG. 1C
  • the LED chip 2 may be mounted on the die pad 32 a via the sub mount member 15.
  • the submount member 15 and the die pad 32a may be bonded, and the submount member 15 and the LED chip 2 may be bonded.
  • a step (fourth step) of providing the insulating substrate 5 to support the resin portion 4 is performed to obtain the structure shown in FIG.
  • the insulating substrate 5 is provided by a molding method. Therefore, the material of the insulating substrate 5 is preferably a material having good adhesion to the resin portion 4.
  • the LED chip 2, the first wire 6 b and the second wire 6 c are sealed by the sealing portion 9 to obtain the structure shown in FIG. 1B.
  • the LED chip 2 is mounted on each of the plurality of mounting portions 32, and then the insulating substrate 5 is provided to support the resin portion 4. The degree of freedom of the shape of 5 becomes high.
  • a step of forming a metal film having a higher reflectance to light emitted from the LED chip 2 than the metal hoop material 30 on the lead frame substrate 3 between the first step and the second step may be performed.
  • the process is not limited to the example described above, but by performing the step (third step) of providing the insulating substrate 5 so as to support the resin portion 4 after the second step.
  • the structure shown in FIG. 8 may be obtained by performing the step (fourth step) of mounting the LED chip 2 on each of the plurality of mounting parts 32.
  • the possibility of deformation of the lead frame substrate 3 before the step of mounting the LED chip 2 on each of the plurality of mounting portions 32 can be reduced.
  • the handling of the structure during manufacture becomes easier.
  • the fifth process may be performed between the first process and the second process.
  • the shape of the circuit pattern portion 31 of the lead frame substrate 3 may be, for example, as shown in FIGS.
  • the first leads 32b, the die pads 32a, and the second leads 32c are arranged side by side in the first direction.
  • the circuit pattern portion 31 of the lead frame 3 is formed such that serial circuits in which a desired number of LED chips 2 are connected in series can be connected in parallel, as in the above-described example.
  • the circuit pattern portion 31 of the lead frame substrate 3 is provided on the side edge of the electrical connection portion 35 connecting the mounting portions 32 adjacent in the first direction among the plurality of mounting portions 32. It is good also as composition formed in the incising slot 38 by which the end side of the 2nd direction was opened. Thereby, the LED module 1 can relieve the stress generated in the lead frame substrate 3 due to the difference in linear expansion coefficient between the lead frame substrate 3 and the resin portion 4 and can suppress the occurrence of warpage or deformation. It is possible to extend the life.
  • the shape of the lead frame substrate 3 may be, for example, as shown in FIGS.
  • the insert molding method Simultaneous molding method
  • the unnecessary portion 39 of the lead frame substrate 3 ( The hatched portion in FIG. 14 is cut off.
  • the LED module 1 of the present embodiment described above is easy to handle because the insulating substrate 5 is provided. Further, in the LED module 1 of the present embodiment, the heat generated in the LED chip 2 can be dissipated through the connecting portion 34 and the crosspieces 33, so cost reduction and high output of light output can be achieved. It is possible to
  • the LED module 1 of the second modification is different from the LED module 1 of the first embodiment in that the resin portion 4 and the insulating substrate 5 are separately formed, and the resin portion 4 and the insulating substrate 5 are joined. .
  • symbol is attached
  • the resin portion 4 and the insulating substrate 5 may be bonded with an adhesive or the like. And, it is possible to increase the freedom of the shape and material of each of the insulating substrates 5. Therefore, the LED module 1 of the present embodiment can be easily customized in module size.
  • the insulating substrate 5 is formed in a long flat plate shape, and is joined to the one surface 4 b opposite to the plurality of mounting portions 32 in the thickness direction of the resin portion 4 ing. Then, in the LED module 1 of the second modified example, the connecting portions 34 and the crosspieces 33 in the lead frame substrate 31 project from each of both side surfaces of the resin portion 4 intersecting in the second direction (the left and right direction in FIG. There is. Here, the connecting part 34 and the crosspieces 33 protrude from the middle part in the thickness direction of the resin part 4 on each of both side faces 4 d of the resin part 4.
  • the lead frame substrate 3 and the insulating substrate 5 are separated in the thickness direction of the insulating substrate 5 on the side of the resin portion 4. And an air gap 10 is formed therebetween. Therefore, in the LED module 1 of the second modification, it is possible to dissipate the heat generated in the LED chip 2 into the gas through the connecting portion 34 and the crosspieces 33, so that more light output can be achieved. It is possible to achieve high output.
  • the LED module 1 of the second modification may be configured to include the sub mount member 15 of the LED module 1 of the first modification. Further, the LED module 1 of the second modification does not particularly limit the planar shape of the lead frame substrate 3, and as the lead frame substrate 3, for example, the lead frame substrate 3 as shown in FIGS. A lead frame substrate 3 as shown in FIG. 13 and a lead frame substrate 3 as shown in FIGS. 13 and 14 may be applied.
  • a pedestal 4e formed of a part of the resin portion 4 is formed on the die pad 32a, and the LED chip 2 is formed on the pedestal 4e of the resin 4 via the bonding portion 7 Is different from the LED module 1 of the second modified example in that it is joined.
  • symbol is attached
  • the pedestal 4 e is formed in the opening 4 a of the resin portion 4 so as to be separated from the inner side surface of the opening 4 a.
  • the surface of the pedestal 4 e opposite to the mounting portion 32 be on a plane including the other surface 4 c of the resin portion 4.
  • the LED module 1 is irradiated with light emitted from the side surface of the LED chip 2 and incident on the other surface 4 c of the resin portion 4 and absorbed by the resin portion 4 or reflected by the inner side surface of the opening 4 a in the resin portion 4
  • the planar shape of the pedestal portion 4a is a rectangular shape, but is not limited thereto. For example, it may be a polygonal shape other than a rectangular shape, a circular shape, an elliptical shape, or the like.
  • the LED chip 2 is joined to the pedestal 4 e of the resin portion 4 via the joint portion 7 so that the light emitted from the side surface of the LED chip 2 is more efficient It becomes possible to take out well and to improve the total luminous flux amount.
  • the LED module 1 of the third modification does not particularly limit the planar shape of the lead frame substrate 3, and as the lead frame substrate 3, for example, the lead frame substrate 3 as shown in FIGS. A lead frame substrate 3 as shown in FIG. 13 and a lead frame substrate 3 as shown in FIGS. 13 and 14 may be applied.
  • the LED module 1 of the fourth modification differs from the LED module 1 of the first embodiment in the shape of the insulating substrate 5.
  • symbol is attached
  • the insulating substrate 5 is formed to cover not only the one surface 4 b of the resin portion 4 but also both side surfaces 4 d and 4 d of the resin portion 4 along the first direction.
  • the insulating substrate 5 is formed in the shape of a long flat plate, and is opposite to the plurality of mounting portions 32 in the thickness direction of the resin portion 4 It is joined only to one side 4b.
  • the lead frame substrate 3 is L-shaped in a cross section orthogonal to the first direction of the connecting portion 34, and a part of each connecting portion 34 and each rail 33 are embedded in the insulating substrate 5. .
  • the connecting portion 34 is a first portion 34 a disposed so as to straddle the resin portion 4 and the insulating substrate 5 along the thickness direction of the resin portion 4, and the width direction of the insulating substrate 5 (horizontal direction in FIG. And a second portion 34b embedded in the insulating substrate 5).
  • the second portion 34 b of the connecting portion 34 and the bar 33 are disposed at the middle in the thickness direction of the insulating substrate 5.
  • the cross-sectional shape of each of the first portion 34 a and the second portion of the connecting portion 34 is not limited to the linear shape.
  • the thickness dimension of the insulating substrate 5 can be made smaller than that of the LED module 1 of the first embodiment, so that the heat dissipation can be improved.
  • the LED module 1 of the fourth modification may be configured to include the sub mount member 15 of the LED module 1 of the first modification.
  • the LED module 1 according to the fifth modification is different from the LED module 1 according to the second modification in that the connection portions 34 and the crosspieces 33 of the lead frame substrate 3 are embedded in the resin portion 4.
  • symbol is attached
  • the LED module 1 of the fifth modification it is possible to improve the insulation (electrical insulation) as compared to the LED module 1 of the second modification.
  • the LED module 1 of the fifth modification may be configured to include the sub mount member 15 of the LED module 1 of the first modification. Further, the LED module 1 of the fifth modification does not particularly limit the planar shape of the lead frame substrate 3, and as the lead frame substrate 3, for example, the lead frame substrate 3 as shown in FIGS. A lead frame substrate 3 as shown in FIG. 13 and a lead frame substrate 3 as shown in FIGS. 13 and 14 may be applied.
  • a pedestal 4e formed of a part of the resin portion 4 is formed on the die pad 32a, and the LED chip 2 is formed on the pedestal 4e of the resin 4 via the bonding portion 7 Is different from the LED module 1 of the fifth modification in that
  • symbol is attached
  • a pedestal 4 e is formed in the opening 4 a of the resin portion 4 so as to be separated from the inner side surface of the opening 4 a.
  • the surface of the pedestal 4 e opposite to the mounting portion 32 be on a plane including the other surface 4 c of the resin portion 4.
  • the LED module 1 is irradiated with light emitted from the side surface of the LED chip 2 and incident on the other surface 4 c of the resin portion 4 and absorbed by the resin portion 4 or reflected by the inner side surface of the opening 4 a in the resin portion 4 It is possible to further reduce the amount of emitted light, and to achieve higher output of light.
  • the planar shape of the pedestal portion 4a is a rectangular shape, but is not limited thereto. For example, it may be a polygonal shape other than a rectangular shape, a circular shape, an elliptical shape, or the like.
  • the LED chip 2 is joined to the pedestal 4 e of the resin portion 4 via the joint portion 7, so that the light emitted from the side surface of the LED chip 2 is more efficient It becomes possible to take out well and to improve the total luminous flux amount.
  • the LED module 1 of the sixth modification does not particularly limit the planar shape of the lead frame substrate 3, and as the lead frame substrate 3, for example, the lead frame substrate 3 as shown in FIG. Such a lead frame substrate 3 and a lead frame substrate 3 as shown in FIGS. 13 and 14 may be applied.
  • the lighting fixture 50 of the present embodiment is an LED lighting fixture, and includes a fixture main body 51 and an LED module 1 which is a light source held by the fixture main body 51.
  • the fixture body 51 is formed in a long shape (here, a rectangular plate shape) larger in plane size than the LED module.
  • the LED module 1 is disposed on the surface 51 b of the device body 51 in the thickness direction of the device body 51.
  • the LED module 1 is disposed with respect to the instrument body 51 such that the longitudinal direction of the LED module 1 (the first direction of the lead frame substrate 31) and the longitudinal direction of the instrument body 51 are aligned.
  • the first direction of the lead frame substrate 31 is aligned with the longitudinal direction of the device body 51.
  • a cover 52 that covers the LED module 1 and transmits light emitted from the LED module 1 is disposed on the side of the one surface 51 b of the device body 51.
  • the lighting fixture 50 is equipped with the lighting device 53 which supplies DC power to the LED module 1 and lights (emits) each LED chip 2.
  • the lighting device 53 and the LED module 1 are electrically connected via a wire 54 such as a lead wire.
  • a recess 51 a for housing the lighting device 53 is formed along the longitudinal direction of the tool body 51 on the other surface 51 c side of the tool body 51 in the thickness direction of the tool body 51. Moreover, the through-hole (not shown) which penetrates the thin part between the one surface 51b and the inner bottom face of the recess 51a, and the electric wire 54 is penetrated is formed in the instrument main body 51. As shown in FIG.
  • both end portions of the lead frame substrate 3 in the first direction are exposed, and it is possible to connect the electric wires 54 at the exposed portion.
  • a connection portion made of a conductive bonding material such as solder, a connection portion made of a male connector and a female connector, or the like can be adopted as a connection portion between the lead frame substrate 3 and the electric wire 54.
  • the lighting fixture 50 can supply DC power from the lighting device 53 to the LED module 1 to light the LED module 1.
  • the lighting device 53 may be configured to be supplied with power from an AC power supply such as a commercial power supply, or may be configured to be supplied with power from a DC power supply such as a solar cell or a storage battery.
  • the lighting fixture 50 of the present embodiment employs a second modification of the LED module 1 of the first embodiment as a light source.
  • the light source is not limited to the second modification of the LED module 1 of the first embodiment, and the LED module 1 of the first embodiment and the first modification, the third modification, and the fourth modification of the LED module 1 of the first embodiment.
  • the LED module 1 according to any of the fifth and sixth modifications may be used.
  • a material having a high thermal conductivity is preferable, and a material having a thermal conductivity higher than that of the insulating substrate 5 is more preferable.
  • a material of the instrument main body 51 it is preferable to use a metal having a high thermal conductivity such as aluminum, copper or the like.
  • thermosetting sheet-like adhesive contains a filler made of a filler such as silica and alumina, and has a B-stage epoxy resin layer (thermosetting resin) and plastic that have a property of lowering viscosity and increasing flowability during heating
  • a sheet-like adhesive in which a film (PET film) is laminated can be used.
  • a sheet-like adhesive there is, for example, an adhesive sheet TSA manufactured by Toray Industries, Inc., and the like.
  • an electrically insulating material having a thermal conductivity higher than that of an epoxy resin which is a thermosetting resin may be used.
  • the thickness of the above-mentioned epoxy resin layer is set to 100 ⁇ m, but this value is an example and is not particularly limited. For example, it may be appropriately set in the range of about 50 ⁇ m to 150 ⁇ m.
  • the thermal conductivity of the above-mentioned epoxy resin layer is preferably 4 W / m ⁇ K or more.
  • the epoxy resin layer of the sheet-like adhesive described above has properties such as electrical insulation, high thermal conductivity, high fluidity at the time of heating, and high adhesion to an uneven surface. Therefore, the lighting fixture 50 can prevent the occurrence of a space between the insulating layer formed of the above-described epoxy resin layer and the LED module 1 and the fixture main body 51, thereby improving the adhesion reliability. It becomes possible, and it becomes possible to control increase of thermal resistance and the generation of variation by lack of adhesion.
  • the insulating layer has electrical insulation and thermal conductivity, and has a function of thermally coupling the LED module 1 and the fixture body 51.
  • the lighting fixture 50 can improve heat dissipation and can suppress the temperature rise of the junction temperature of each LED chip 2, the input power can be increased, and the light output can be increased.
  • the thickness of the above-mentioned epoxy resin layer is set to 100 ⁇ m, but this value is an example and is not particularly limited. For example, it may be appropriately set in the range of about 50 ⁇ m to 150 ⁇ m.
  • the heat conductivity of the above-mentioned epoxy resin layer is 4 W / m * K or more.
  • cover 52 for example, acrylic resin, polycarbonate resin, silicone resin, glass or the like can be adopted.
  • the cover 52 integrally includes a lens unit (not shown) that controls light distribution of light emitted from the LED module 1. Compared to the configuration in which the lens separate from the cover 52 is attached to the cover 52, cost reduction can be achieved.
  • the lighting fixture 50 of the present embodiment described above by including the above-described LED module 1 as a light source, it is possible to achieve cost reduction and high output of light output.
  • the luminaire 50 can improve heat dissipation by making the material of the luminaire main body 51 metal.
  • the thickness dimension and width dimension of the insulating substrate 5 are appropriately set such that the creeping distance between the lead frame substrate 3 of the LED module 1 and the fixture body 51 satisfies a prescribed creeping distance (for example, 5 mm or more) do it.
  • the straight tube type LED lamp 60 has a straight tube (cylindrical) tube main body 61 formed of a translucent material, and a first mouthpiece 62 provided at each of one end and the other end of the tube main body 61 in the longitudinal direction. , And a second base 63, and the LED module 1 of the second modified example of the LED module 1 of the first embodiment is housed in the tube main body 61.
  • the LED module 1 is not limited to the second modification of the LED module 1 of the first embodiment, and the LED module 1 of the first embodiment and the first modification, the third modification, and the fourth of the LED module 1 of the first embodiment.
  • the LED module 1 of any of the fifth modification and the sixth modification may be used.
  • the tube main body 61 As a material of the tube main body 61, for example, transparent glass, milky white glass, transparent resin, milky white resin or the like can be adopted.
  • the first cap 62 is provided with two feed terminals (hereinafter referred to as “first lamp pins”) 64 and 64 electrically connected to the LED module 1.
  • the two first lamp pins 64 are electrically connectable to the two power supply contacts of the lamp socket for power supply held by the fixture body of the lighting fixture.
  • the second base 63 is provided with a single ground terminal (hereinafter referred to as “second lamp pin”) 65 for grounding.
  • the one second lamp pin 65 can be electrically connected to the grounding contact of the grounding lamp socket held by the instrument body.
  • Each of the first lamp pins 64 is formed in an L shape, and extends in the radial direction of the tube main body 61 from the pin main body 64a projecting along the longitudinal direction of the tube main body 61 and the tip of the pin main body 64a. It comprises the key part 64b extended along. The two key portions 64 b extend away from each other. Each first lamp pin 64 is formed by bending an elongated metal plate.
  • the second lamp pin 65 protrudes from the end face (base reference surface) of the second base 63 to the opposite side to the tube main body 61.
  • the second lamp pin 65 is formed in a T-shape.
  • the straight tube type LED lamp 60 is, for example, a “straight tube type LED lamp system with L-shaped pin cap GX16t-5 (for general lighting)” standardized by the Japan Light Bulb Industry Association (JEL 801: 2010 It is preferable to be configured to satisfy the standard of.

Abstract

An LED module is provided with: a lead frame substrate on which are arranged in a first direction and disposed a plurality of mounting parts; a resin part in which part of the lead frame substrate is embedded and on which the plurality of mounting parts are exposed; LED chips mounted in each of the plurality of mounting parts; and an elongated shaped insulating substrate supporting the resin part. The lead frame substrate is provided with: a circuit pattern part that includes the plurality of mounting parts and prescribes the electrical connection relationship between adjacent mounting parts in the first direction out of the plurality of mounting parts; a plurality of crosspiece parts disposed respectively on both sides of the circuit pattern part in a second direction orthogonal to the direction of thickness of the resin part and to the first direction; and linking parts that link the plurality of mounting parts with any of the plurality of crosspiece parts. An illuminating instrument is provided with the LED module. A straight tube LED lamp accommodates the LED module inside a tube body.

Description

ＬＥＤモジュールおよびその製造方法、照明器具、直管形ＬＥＤランプLED module and method of manufacturing the same, lighting fixture, straight tube type LED lamp
　本発明は、ＬＥＤモジュールおよびその製造方法、照明器具、直管形ＬＥＤランプに関するものである。 The present invention relates to an LED module and a method of manufacturing the same, a luminaire, and a straight tube type LED lamp.
　ＬＥＤモジュールとしては、例えば、図２４Ａ、２４Ｂに示すようなフレーム２０３を利用して形成されたＬＥＤ（Light Emitting Diode）光源が知られている（国際公開番号ＷＯ２００７／０３４５３７　Ａ１：特許文献１）。なお、フレーム２０３は、銅を母材とし、その表面には銀メッキが施されている。 As an LED module, for example, an LED (Light Emitting Diode) light source formed using a frame 203 as shown in FIGS. 24A and 24B is known (International Publication Number WO 2007/034537 A1: Patent Document 1). The frame 203 is made of copper as a base material, and its surface is plated with silver.
　フレーム２０３は、複数の製品領域２０３Ａおよび複数の製品領域２０３Ａの間に配置されたタイバー２０３Ｂを有している。製品領域２０３Ａは、ダイボンドエリア２０３ａと、ダイボンドエリア２０３ａと第１リード２０３ｂとを繋ぐ第１吊りリード２０３ｃと、ダイボンドエリア２０３ａと対向するワイヤボンドエリア２０３ｄと、ワイヤボンドエリア２０３ｄと第２リード２０３ｅとを繋ぐ第２吊りリード２０３ｆと、からなる。したがって、フレーム２０３は、所定の間隔を有して第１の方向に沿って並ぶ複数のダイボンドエリア２０３ａと、ダイボンドエリア２０３ａと対向して第１の方向に沿って並ぶ複数のワイヤボンドエリア２０３ｄと、を備えている。また、フレーム２０３は、ダイボンドエリア２０３ａと繋がり第１の方向に延びる上述の第１リード２０３ｂと、ワイヤボンドエリア２０３ｄと繋がり第１の方向に延びる上述の第２リード２０３ｅと、を備えている。ＬＥＤ光源は、図２５に示すように、ダイボンドエリア２０３ａに対して、ＬＥＤチップ２０２ｃがペースト材を利用して機械的に固定され且つＬＥＤチップ２０２ｃのｎ側電極が電気的に接続されている。ＬＥＤチップ２０２ｃのｐ側電極は、ボンディングワイヤ２０６を介して、ワイヤボンドエリア２０３ｄと電気的に接続されている。 The frame 203 includes a plurality of product areas 203A and a tie bar 203B disposed between the plurality of product areas 203A. The product area 203A includes a die bond area 203a, a first suspension lead 203c connecting the die bond area 203a and the first lead 203b, a wire bond area 203d facing the die bond area 203a, a wire bond area 203d and a second lead 203e. And a second suspension lead 203f for connecting the Therefore, the frame 203 has a plurality of die bond areas 203a arranged along the first direction with a predetermined spacing, and a plurality of wire bond areas 203d arranged along the first direction opposite the die bond areas 203a. And. Further, the frame 203 is provided with the above-mentioned first lead 203b connected to the die bonding area 203a and extending in the first direction, and the above-mentioned second lead 203e connecting to the wire bonding area 203d and extending in the first direction. In the LED light source, as shown in FIG. 25, the LED chip 202c is mechanically fixed to the die bonding area 203a using a paste material, and the n-side electrode of the LED chip 202c is electrically connected. The p-side electrode of the LED chip 202 c is electrically connected to the wire bonding area 203 d through the bonding wire 206.
　上述のＬＥＤ光源は、ＬＥＤチップ２０２ｃ、ダイボンドエリア２０３ａ、ボンディングワイヤ２０６およびワイヤボンドエリア２０３ｄを樹脂２０８により封止してＬＥＤ２０２を形成してある。タイバー２０３Ｂは、図２５に示すように、切断機２０７ａを用いて打ち抜かれている。 In the LED light source described above, the LED chip 202c, the die bonding area 203a, the bonding wire 206, and the wire bonding area 203d are sealed with a resin 208 to form the LED 202. The tie bar 203B is punched out using a cutting machine 207a as shown in FIG.
　また、特許文献１には、図２６に示すように、隣接するＬＥＤ２０２の間に反射板２０９を嵌め込んだ構造が記載されている。この図２６の構造においては、ＬＥＤ光源の背面に絶縁フィルム２１２を介してボード２１３を設置してある。特許文献１には、ボード２１３がアルミニウム板であり、放熱板としても機能する旨が記載されている。 Further, as shown in FIG. 26, Patent Document 1 describes a structure in which a reflecting plate 209 is fitted between adjacent LEDs 202. In the structure of FIG. 26, the board 213 is installed on the back surface of the LED light source via the insulating film 212. Patent Document 1 describes that the board 213 is an aluminum plate and also functions as a heat sink.
　上述のＬＥＤ光源のようなＬＥＤモジュールでは、ＬＥＤ光源の背面に絶縁フィルム２１２を介してアルミニウム板からなるボード２１３を設置することにより、放熱性が向上し、光出力の高出力化を図ることが可能となる。 In the LED module such as the above-mentioned LED light source, by installing the board 213 made of an aluminum plate on the back surface of the LED light source via the insulating film 212, the heat dissipation is improved and the light output can be increased. It becomes possible.
　しかしながら、この場合には、アルミニウム板からなるボード２１３が必要となるので、コストが高くなってしまう。 However, in this case, since the board 213 made of an aluminum plate is required, the cost is increased.
　また、上述のＬＥＤ光源では、ボード２１３を備えていない場合、上述の第１の方向におけるＬＥＤ光源の全長が長くなるにつれてＬＥＤ光源が変形しやすくなって取り扱いにくくなる懸念がある。 Moreover, in the above-mentioned LED light source, when the board 213 is not provided, there is a concern that the LED light source is easily deformed as the total length of the LED light source in the first direction becomes longer and it becomes difficult to handle.
　また、本願発明者らは、特許文献１に記載されたＬＥＤ光源を照明器具の光源として適用することを考え、この場合、器具本体を金属製として放熱性を向上させる必要があると考えた。 Moreover, the inventors of the present application considered applying the LED light source described in Patent Document 1 as a light source of a lighting fixture, and in this case, it was considered necessary to improve heat dissipation by making the fixture main body made of metal.
　しかしながら、この場合には、照明器具において要求される光源の充電部と器具本体との絶縁距離を確保する必要があり、ボード２１３と器具本体との間に、ボード２１３よりも平面サイズの大きな絶縁シートなどを介在させる必要がある。このため、照明器具においては、ＬＥＤ光源と器具本体との間の熱抵抗が増大して光出力の高出力化が制限されてしまう懸念があり、また、器具本体におけるＬＥＤ光源の占有スペースがＬＥＤ光源の平面サイズよりも大きくなってしまう。 However, in this case, it is necessary to secure the insulation distance between the charging unit of the light source and the appliance body required in the lighting equipment, and the insulation between the board 213 and the appliance body is larger in planar size than the board 213 It is necessary to interpose a sheet or the like. For this reason, in the lighting fixture, there is a concern that the thermal resistance between the LED light source and the fixture body increases to limit the increase in light output, and the space occupied by the LED light source in the fixture body is the LED It will be larger than the planar size of the light source.
　また、本願発明者らは、特許文献１に記載されたＬＥＤ光源を直管形ＬＥＤランプに適用することを考え、この場合も放熱性を向上させる必要があると考えた。 Moreover, the inventors of the present application considered applying the LED light source described in Patent Document 1 to a straight tube type LED lamp, and also considered that it is necessary to improve the heat dissipation also in this case.
　本発明は上記事由に鑑みて為されたものであり、その目的は、取り扱いが容易であり、且つ、低コスト化および光出力の高出力化を図ることが可能なＬＥＤモジュールおよびその製造方法、照明器具、直管形ＬＥＤランプを提供することにある。 The present invention has been made in view of the above, and an object thereof is an LED module which is easy to handle and capable of achieving cost reduction and high light output, and a method of manufacturing the same. It is providing a lighting fixture and a straight tube | pipe type LED lamp.
　本発明のＬＥＤモジュールは、各々がＬＥＤチップを実装する複数の実装部が第１方向に並んで配置されたリードフレーム基板と、前記リードフレーム基板の一部が埋設され且つ前記複数の実装部を露出させた樹脂部と、前記複数の実装部の各々に実装された前記ＬＥＤチップと、前記樹脂部の厚み方向において前記複数の実装部側とは反対の一面側に配置されて前記樹脂部を支持し前記第１方向を長手方向とする長尺状の絶縁基板と、を備え、前記リードフレーム基板は、前記複数の実装部を含み且つ前記複数の実装部のうち前記第１方向において隣り合う実装部間の電気的な接続関係を規定する回路パターン部と、前記厚み方向に直交し且つ前記第１方向に直交する第２方向において前記回路パターン部の両側それぞれに配置された複数の桟部と、前記複数の実装部と前記複数の桟部のいずれかとを繋いでいる複数の連結部と、を備えてなることを特徴とする。 In the LED module of the present invention, a lead frame substrate on which a plurality of mounting parts each mounting an LED chip are arranged in the first direction, a part of the lead frame substrate is embedded, and the plurality of mounting parts are The resin portion is disposed on the side opposite to the plurality of mounting portions in the thickness direction of the resin portion, the LED chip mounted on each of the plurality of mounting portions, and the resin portion exposed. And a long insulating substrate supporting the first direction as a longitudinal direction, the lead frame substrate including the plurality of mounting portions and being adjacent in the first direction among the plurality of mounting portions A circuit pattern portion defining an electrical connection relationship between mounting portions, and a plurality of compound pattern portions disposed on both sides of the circuit pattern portion in a second direction orthogonal to the thickness direction and orthogonal to the first direction. And crosspiece of and characterized in that it comprises a plurality of connecting portions that connect and either said plurality of crosspieces and the plurality of mounting portions.
　このＬＥＤモジュールにおいて、前記複数の桟部は、前記絶縁基板に埋設されてなることが好ましい。 In the LED module, preferably, the plurality of crosspieces are embedded in the insulating substrate.
　このＬＥＤモジュールにおいて、前記絶縁基板の熱伝導率が、前記樹脂部の熱伝導率以上であることが好ましい。 In the LED module, the thermal conductivity of the insulating substrate is preferably equal to or higher than the thermal conductivity of the resin portion.
　このＬＥＤモジュールにおいて、前記複数の実装部の各々は、前記ＬＥＤチップが搭載されるダイパッドと、前記ダイパッドに連続し前記ＬＥＤチップの第１電極が第１ワイヤを介して電気的に接続される第１リードと、前記第２方向において前記ダイパッドに対向し前記ＬＥＤチップの第２電極が第２ワイヤを介して電気的に接続される第２リードと、を備え、前記複数の実装部のうち前記第１方向において隣り合う実装部同士では、前記第２方向における前記第１リード、前記ダイパッドおよび前記第２リードの並びが逆であることが好ましい。 In this LED module, each of the plurality of mounting portions is connected to a die pad on which the LED chip is mounted, and the first electrode of the LED chip electrically connected to the die pad via a first wire. One lead, and a second lead facing the die pad in the second direction, the second electrode of the LED chip being electrically connected via the second wire; In the mounting portions adjacent in the first direction, the arrangement of the first lead, the die pad, and the second lead in the second direction is preferably reversed.
　このＬＥＤモジュールにおいて、前記絶縁基板と前記樹脂部とは別体であることが好ましい。 In the LED module, the insulating substrate and the resin portion are preferably separate.
　このＬＥＤモジュールにおいて、前記回路パターン部は、前記第１方向において隣り合う前記実装部間を繋いでいる電気接続部の側縁に、前記第２方向の一端側が開放された切込溝が形成されてなることが好ましい。 In the LED module, the circuit pattern portion is formed with a cut groove in which one end side in the second direction is opened at the side edge of the electrical connection portion connecting between the mounting portions adjacent in the first direction. It is preferable that
　このＬＥＤモジュールにおいて、前記リードフレーム基板および前記樹脂部は、前記ＬＥＤチップから放射される光を反射する反射部材を兼ねることが好ましい。 In this LED module, it is preferable that the lead frame substrate and the resin portion also serve as a reflecting member that reflects the light emitted from the LED chip.
　このＬＥＤモジュールにおいて、前記回路パターン部は、それぞれ所望数の前記ＬＥＤチップを直列接続した直列回路同士を並列接続可能に形成されていることが好ましい。 In this LED module, it is preferable that the circuit pattern portion is formed so that serial circuits in which a desired number of the LED chips are connected in series can be connected in parallel.
　本発明のＬＥＤモジュールの製造方法は、各々がＬＥＤチップを実装する複数の実装部が第１方向に並んで配置されたリードフレーム基板と、前記リードフレーム基板の一部が埋設され且つ前記複数の実装部を露出させた樹脂部と、前記複数の実装部の各々に実装された前記ＬＥＤチップと、前記樹脂部の厚み方向において前記複数の実装部側とは反対の一面側に配置されて前記樹脂部を支持し前記第１方向を長手方向とする長尺状の絶縁基板と、を備え、前記リードフレーム基板は、前記複数の実装部を含み且つ前記複数の実装部のうち前記第１方向において隣り合う実装部間の電気的な接続関係を規定する回路パターン部と、前記厚み方向に直交し且つ前記第１方向に直交する第２方向において前記回路パターン部の両側それぞれに配置された複数の桟部と、前記複数の実装部と前記複数の桟部のいずれかとを繋いでいる複数の連結部と、を備えるＬＥＤモジュールの製造方法であって、金属フープ材に対してプレスによる打ち抜き加工を施すことにより前記リードフレーム基板を形成する第１工程と、前記第１工程の後でインサート成形法によって、前記リードフレーム基板の一部が埋設された前記樹脂部を成形する第２工程と、を備え、前記第２工程の後で、前記複数の実装部の各々に前記ＬＥＤチップを実装し、且つ、前記樹脂部を支持するように前記絶縁基板を設けることを特徴とする。 In the method for manufacturing an LED module according to the present invention, a lead frame substrate in which a plurality of mounting portions each mounting an LED chip are arranged side by side in a first direction, a part of the lead frame substrate is embedded and the plurality of The resin portion in which the mounting portion is exposed, the LED chip mounted on each of the plurality of mounting portions, and the resin portion are disposed on the side opposite to the plurality of mounting portions in the thickness direction of the resin portion. A long insulating substrate supporting the resin portion and having the first direction as a longitudinal direction, the lead frame substrate including the plurality of mounting portions and the first direction of the plurality of mounting portions And a circuit pattern portion defining an electrical connection between adjacent mounting portions, and disposed on both sides of the circuit pattern portion in a second direction orthogonal to the thickness direction and orthogonal to the first direction. A method of manufacturing an LED module comprising: a plurality of crosspieces, and a plurality of connecting parts connecting the plurality of mounting parts and one of the plurality of crosspieces, wherein A first step of forming the lead frame substrate by performing a punching process, and a second step of forming the resin portion in which a portion of the lead frame substrate is embedded by an insert molding method after the first step And after the second step, the LED chip is mounted on each of the plurality of mounting portions, and the insulating substrate is provided to support the resin portion.
　このＬＥＤモジュールの製造方法において、前記第２工程の後に、前記複数の実装部の各々に前記ＬＥＤチップを実装し、その後に前記樹脂部を支持するように前記絶縁基板を設けることが好ましい。 In the method for manufacturing an LED module, it is preferable that, after the second step, the LED chip be mounted on each of the plurality of mounting portions, and then the insulating substrate be provided so as to support the resin portion.
　このＬＥＤモジュールの製造方法において、前記第２工程の後に、前記第２工程の後に、前記樹脂部を支持するように前記絶縁基板を設け、その後に前記複数の実装部の各々に前記ＬＥＤチップを実装することが好ましい。 In the method for manufacturing an LED module, after the second step, the insulating substrate is provided to support the resin portion after the second step, and thereafter, the LED chip is provided to each of the plurality of mounting portions. It is preferable to implement.
　このＬＥＤモジュールの製造方法において、前記第１工程と前記第２工程との間に、前記リードフレーム基板に前記金属フープ材よりも前記ＬＥＤチップから放射される光に対する反射率の高い金属皮膜を形成する工程を備えることが好ましい。 In the method for manufacturing an LED module, a metal coating having a higher reflectance to light emitted from the LED chip than the metal hoop material is formed on the lead frame substrate between the first step and the second step. It is preferable to include the step of
　本発明の照明器具は、器具本体と、前記器具本体に保持された光源と、を備え、前記光源は、前記ＬＥＤモジュールからなることを特徴とする。 The lighting fixture of the present invention comprises a fixture body and a light source held by the fixture body, and the light source is composed of the LED module.
　本発明の直管形ＬＥＤランプは、透光性材料により形成された直管状の管本体と、前記管本体の長手方向の一端部および他端部それぞれに設けられた第１口金、第２口金と、を備え、前記管本体内に前記ＬＥＤモジュールが収納されてなることを特徴とする。 The straight tube type LED lamp according to the present invention comprises a straight tube-shaped tube main body formed of a translucent material, and a first mouthpiece and a second mouthpiece respectively provided at one end and the other end in the longitudinal direction of the tube main body. And the LED module is accommodated in the tube body.
　本発明のＬＥＤモジュールにおいては、絶縁基板を備えていることにより、取り扱いが容易であり、且つ、リードフレーム基板が、桟部と、各実装部ごとに前記各実装部と前記各桟部の各々とを繋いでいる連結部とを備えていることにより、前記ＬＥＤチップで発生する熱を前記連結部と前記桟部とを介して放熱させることが可能となるので、低コスト化および光出力の高出力化を図ることが可能となる。 The LED module of the present invention is easy to handle by providing the insulating substrate, and the lead frame substrate includes the crosspieces, and each of the mounting parts and the crosspieces for each mounting part. And the connection portion connecting the two, it is possible to dissipate the heat generated in the LED chip through the connection portion and the crosspiece, so that cost reduction and light output can be achieved. It is possible to achieve high output.
　本発明のＬＥＤモジュールの製造方法においては、取り扱いが容易であり、且つ、低コスト化および光出力の高出力化を図ることが可能なＬＥＤモジュールを提供することができる。 The LED module manufacturing method of the present invention can provide an LED module that is easy to handle and that can achieve cost reduction and high light output.
　本発明の照明器具においては、低コスト化および光出力の高出力化を図ることが可能となる。 In the lighting fixture of the present invention, it is possible to achieve cost reduction and high light output.
　本発明の直管形ＬＥＤランプにおいては、低コスト化および光出力の高出力化を図ることが可能となる。 In the straight tube type LED lamp of the present invention, it is possible to achieve cost reduction and high light output.
図１Ａは、実施形態１のＬＥＤモジュールの要部概略斜視図である。図１Ｂは、実施形態１のＬＥＤモジュールの概略断面図である。図１Ｃは、実施形態１のＬＥＤモジュールの第１変形例の概略断面図である。FIG. 1A is a schematic perspective view of essential parts of the LED module of Embodiment 1. FIG. 1B is a schematic cross-sectional view of the LED module of Embodiment 1. FIG. 1C is a schematic cross-sectional view of a first modified example of the LED module of Embodiment 1. FIG. 図２は、実施形態１のＬＥＤモジュールにおけるリードフレーム基板の概略平面図である。FIG. 2 is a schematic plan view of a lead frame substrate in the LED module of the first embodiment. 図３は、実施形態１のＬＥＤモジュールの製造方法に用いる金属フープ材の要部概略斜視図である。FIG. 3 is a schematic perspective view of the main part of a metal hoop material used in the method of manufacturing the LED module of the first embodiment. 図４は、実施形態１のＬＥＤモジュールの製造方法を説明するための要部概略斜視図である。FIG. 4 is a main portion schematic perspective view for explaining the method for manufacturing the LED module of the first embodiment. 図５は、実施形態１のＬＥＤモジュールの製造方法を説明するための要部概略斜視図である。FIG. 5 is a main portion schematic perspective view for explaining the method for manufacturing the LED module of the first embodiment. 図６は、実施形態１のＬＥＤモジュールの製造方法を説明するための要部概略斜視図である。FIG. 6 is a schematic perspective view of relevant parts for explaining the method for manufacturing the LED module of the first embodiment. 図７は、実施形態１のＬＥＤモジュールの製造方法を説明するための要部概略斜視図である。FIG. 7 is a main portion schematic perspective view for explaining the method for manufacturing the LED module of the first embodiment. 図８は、実施形態１のＬＥＤモジュールの製造方法を説明するための要部概略斜視図である。FIG. 8 is a main portion schematic perspective view for explaining the method for manufacturing the LED module of the first embodiment. 図９は、実施形態１のＬＥＤモジュールの他の製造方法を説明するための要部概略斜視図である。FIG. 9 is a schematic perspective view of relevant parts for explaining another method of manufacturing the LED module of the first embodiment. 図１０は、実施形態１のＬＥＤモジュールにおける他のリードフレーム基板の概略平面図である。10 is a schematic plan view of another lead frame substrate in the LED module of Embodiment 1. FIG. 図１１は、実施形態１のＬＥＤモジュールにおける他のリードフレーム基板の要部拡大図である。FIG. 11 is an enlarged view of a main part of another lead frame substrate in the LED module of the first embodiment. 図１２は、実施形態１のＬＥＤモジュールにおける更に他のリードフレーム基板の要部拡大図である。FIG. 12 is an enlarged view of a main part of still another lead frame substrate in the LED module of the first embodiment. 図１３は、実施形態１のＬＥＤモジュールにおける別のリードフレーム基板の概略平面図である。13 is a schematic plan view of another lead frame substrate in the LED module of Embodiment 1. FIG. 図１４は、実施形態１のＬＥＤモジュールにおける別のリードフレーム基板の要部拡大図である。FIG. 14 is an enlarged view of an essential part of another lead frame substrate in the LED module of the first embodiment. 図１５は、実施形態１のＬＥＤモジュールの第２変形例の概略断面図である。FIG. 15 is a schematic cross-sectional view of a second modified example of the LED module of the first embodiment. 図１６は、実施形態１のＬＥＤモジュールの第２変形例の要部概略斜視図である。FIG. 16 is a schematic perspective view of main parts of a second modification of the LED module of the first embodiment. 図１７は、実施形態１のＬＥＤモジュールの第３変形例の概略断面図である。FIG. 17 is a schematic cross-sectional view of a third modification of the LED module of the first embodiment. 図１８は、実施形態１のＬＥＤモジュールの第４変形例の概略断面図である。FIG. 18 is a schematic cross-sectional view of a fourth modified example of the LED module of the first embodiment. 図１９は、実施形態１のＬＥＤモジュールの第５変形例の概略断面図である。FIG. 19 is a schematic cross-sectional view of a fifth modified example of the LED module of the first embodiment. 図２０は、実施形態１のＬＥＤモジュールの第６変形例の概略断面図である。FIG. 20 is a schematic cross-sectional view of a sixth modification of the LED module of the first embodiment. 図２１Ａは、実施形態２の照明器具の一部破断した概略斜視図である。図２１Ｂは、図２１Ａの要部拡大図である。FIG. 21A is a partially broken schematic perspective view of the lighting apparatus of Embodiment 2. FIG. FIG. 21B is an enlarged view of an essential part of FIG. 21A. 図２２は、実施形態２の照明器具の要部概略側面図である。FIG. 22 is a main part schematic side view of the lighting fixture of the second embodiment. 図２３Ａは、実施形態３の直管形ＬＥＤランプの一部破断した概略斜視図である。図２３Ｂは、図２３Ａの要部拡大図である。FIG. 23A is a partially broken schematic perspective view of the straight tube LED lamp according to the third embodiment. FIG. 23B is an enlarged view of a main part of FIG. 23A. 図２４Ａは、従来例のＬＥＤ光源に用いる２列のフレームの要部平面図である。図２４Ｂは図２４ＡのＸ－Ｘ断面図である。FIG. 24A is a plan view of an essential part of a two-row frame used for a conventional LED light source. FIG. 24B is a cross-sectional view taken along line XX of FIG. 24A. 図２５は、従来例のＬＥＤ光源の製造工程における要部断面図である。FIG. 25 is a cross-sectional view of essential parts in a manufacturing process of a conventional LED light source. 図２６は、従来例のバックライトの製造工程における要部断面図である。FIG. 26 is a cross-sectional view of the essential part in the manufacturing process of the conventional backlight.
　（実施形態１）
　以下では、本実施形態のＬＥＤモジュール１について、図１Ａ、１Ｂおよび２に基いて説明する。 (Embodiment 1)
Below, the LED module 1 of this embodiment is demonstrated based on FIG. 1A, 1B, and 2. FIG.
　ＬＥＤモジュール１は、各々がＬＥＤチップ２を実装する複数の実装部３２が第１方向（図２の左右方向）に並んで配置されたリードフレーム基板３と、リードフレーム基板３の一部が埋設され且つ複数の実装部３２を露出させた樹脂部４と、を備えている。また、ＬＥＤモジュール１は、複数の実装部３２の各々に実装されたＬＥＤチップ２と、樹脂部４の厚み方向において複数の実装部３２側とは反対の一面４ｂ側に配置されて樹脂部４を支持した長尺状の絶縁基板５と、を備えている。絶縁基板５は、電気絶縁性の基板（電気絶縁性基板）を意味する。絶縁基板５は、熱伝導性が高いほうが好ましい。 The LED module 1 has a lead frame substrate 3 on which a plurality of mounting portions 32 each mounting an LED chip 2 are arranged in a first direction (horizontal direction in FIG. 2), and a part of the lead frame substrate 3 is embedded. And the resin portion 4 in which the plurality of mounting portions 32 are exposed. Further, the LED module 1 is disposed on the LED chip 2 mounted on each of the plurality of mounting portions 32 and on the one surface 4 b opposite to the plurality of mounting portions 32 in the thickness direction of the resin portion 4. And a long insulating substrate 5 supporting the The insulating substrate 5 means an electrically insulating substrate (electrically insulating substrate). The insulating substrate 5 preferably has high thermal conductivity.
　リードフレーム基板３は、複数の実装部３２を含み且つ複数の実装部３２のうち第１方向において隣り合う実装部３２間の電気的な接続関係を規定する回路パターン部３１を備えている。さらに、リードフレーム基板３は、樹脂部４の厚み方向に直交し且つ第１方向に直交する第２方向（図２の上下方向）において回路パターン部３１の両側それぞれに配置された複数の桟部３３と、複数の実装部３２と複数の桟部３３のいずれかとを繋いでいる複数の連結部３４と、を備えている。絶縁基板５は、この絶縁基板５の長手方向が第１方向に一致するように配置されている。 The lead frame substrate 3 includes a circuit pattern portion 31 including a plurality of mounting portions 32 and defining an electrical connection relationship between the mounting portions 32 adjacent in the first direction among the plurality of mounting portions 32. Furthermore, in the second direction (vertical direction in FIG. 2) perpendicular to the thickness direction of the resin portion 4 and in the second direction (vertical direction in FIG. 2), the lead frame substrate 3 And 33, and a plurality of connecting portions 34 connecting the plurality of mounting portions 32 and any of the plurality of rail portions 33. The insulating substrate 5 is arranged such that the longitudinal direction of the insulating substrate 5 coincides with the first direction.
　本実施形態のＬＥＤモジュール１においては、絶縁基板５を備えていることにより、取り扱いが容易である。また、本実施形態のＬＥＤモジュール１においては、ＬＥＤチップ２で発生する熱を連結部３４と桟部３３とを介して放熱させることが可能となるので、低コスト化および光出力の高出力化を図ることが可能となる。 The LED module 1 of the present embodiment is easy to handle by including the insulating substrate 5. Further, in the LED module 1 of the present embodiment, the heat generated in the LED chip 2 can be dissipated through the connecting portion 34 and the crosspieces 33, so cost reduction and high output of light output can be achieved. It is possible to
　ＬＥＤモジュール１の各構成要素については、以下に詳細に説明する。 Each component of the LED module 1 will be described in detail below.
　ＬＥＤチップ２は、このＬＥＤチップ２の厚み方向の一面側に、アノード電極である第１電極（図示せず）と、カソード電極である第２電極（図示せず）と、が設けられている。 The LED chip 2 is provided with a first electrode (not shown) as an anode electrode and a second electrode (not shown) as a cathode electrode on one side in the thickness direction of the LED chip 2 .
　ＬＥＤチップ２は、青色光を放射するＧａＮ系青色ＬＥＤチップであり、基板としてサファイア基板を備えたものを用いている。ＬＥＤチップ２の基板は、サファイア基板に限らず、例えば、ＧａＮ基板、ＳｉＣ基板、Ｓｉ基板などでもよい。なお、ＬＥＤチップ２の構造は特に限定するものではない。 The LED chip 2 is a GaN-based blue LED chip that emits blue light, and uses a substrate provided with a sapphire substrate. The substrate of the LED chip 2 is not limited to a sapphire substrate, and may be, for example, a GaN substrate, a SiC substrate, a Si substrate, or the like. The structure of the LED chip 2 is not particularly limited.
　ＬＥＤチップ２のチップサイズは、特に限定するものではない。ＬＥＤチップ２としては、例えば、チップサイズが０．３ｍｍ□（０．３ｍｍ×０．３ｍｍ）や０．４５ｍｍ□（０．４５ｍｍ×０．４５ｍｍ）や１ｍｍ□（１ｍｍ×１ｍｍ）のものなどを用いることができる。また、ＬＥＤチップ２の平面形状は、正方形状に限らず、例えば、長方形状などでもよい。 The chip size of the LED chip 2 is not particularly limited. As the LED chip 2, for example, one having a chip size of 0.3 mm □ (0.3 mm × 0.3 mm), 0.45 mm □ (0.45 mm × 0.45 mm), 1 mm □ (1 mm × 1 mm), etc. It can be used. Further, the planar shape of the LED chip 2 is not limited to the square shape, and may be, for example, a rectangular shape.
　また、ＬＥＤチップ２の発光層の材料や発光色は、特に限定するものではない。すなわち、ＬＥＤチップ２としては、青色ＬＥＤチップに限らず、例えば、紫色光ＬＥＤチップ、紫外光ＬＥＤチップ、赤色ＬＥＤチップ、緑色ＬＥＤチップなどを用いてもよい。 Moreover, the material and luminescent color of the light emitting layer of LED chip 2 are not specifically limited. That is, the LED chip 2 is not limited to the blue LED chip, and for example, a violet light LED chip, an ultraviolet light LED chip, a red LED chip, a green LED chip, or the like may be used.
　リードフレーム基板３は、金属フレームであり、帯状の金属フープ材３０（図３参照）から形成されている。金属フープ材３０の材質としては、例えば、金属材料の中で熱伝導率が比較的高い銅が好ましい。金属フープ材３０の材質は、銅に限らず、例えば、リン青銅、銅合金（例えば、４２アロイなど）、アルミニウム、アルミニウム合金、ニッケル合金などでもよい。金属フープ材３０の厚みは、例えば、１００μｍ～１５００μｍ程度の範囲で設定することが好ましい。 The lead frame substrate 3 is a metal frame, and is formed of a strip-shaped metal hoop material 30 (see FIG. 3). As a material of the metal hoop material 30, for example, copper having a relatively high thermal conductivity among metal materials is preferable. The material of the metal hoop material 30 is not limited to copper, and may be, for example, phosphor bronze, a copper alloy (for example, 42 alloy or the like), aluminum, an aluminum alloy, a nickel alloy, or the like. The thickness of the metal hoop material 30 is preferably set, for example, in the range of about 100 μm to 1500 μm.
　リードフレーム基板３は、主表面側に、金属フープ材３０に比べてＬＥＤチップ２からの光に対する反射率の高い表面処理層（図示せず）を適宜設けてもよい。リードフレーム基板３は、表面処理層の有無に限らず、ＬＥＤチップ２などから放射される光を反射する反射部材を兼ねることが好ましい。これにより、ＬＥＤモジュール１は、全光束量を向上させることが可能となる。ただし、ＬＥＤモジュール１は、リードフレーム基板３に表面処理層が設けられている構成のほうが、光取り出し効率のより一層の向上を図ることが可能となる。表面処理層としては、例えば、Ａｇ膜、Ｎｉ膜とＰｄ膜とＡｕ膜との積層膜、Ｎｉ膜とＡｕ膜との積層膜、Ａｇ膜とＰｄ膜とＡｕＡｇ合金膜との積層膜などを採用することができる。表面処理層は、長期的な信頼性（例えば、耐酸化性、耐腐食性、樹脂部４との密着性など）の観点から、Ａｇ膜よりも、Ｎｉ膜とＰｄ膜とＡｕ膜との積層膜、Ｎｉ膜とＡｕ膜との積層膜、Ａｇ膜とＰｄ膜とＡｕＡｇ合金膜などのほうが好ましい。表面処理層は、めっき層などにより構成することが好ましい。要するに、表面処理層は、めっき法により形成することが好ましい。本実施形態のＬＥＤモジュール１では、表面処理層が、金属フープ材３０よりもＬＥＤチップ２から放射される光に対する反射率の高い金属皮膜を構成している。ＬＥＤモジュール１は、リードフレーム基板３の主表面側に限らず、リードフレーム基板３の全体に表面処理層を形成してあってもよい。また、リードフレーム基板３の主表面側の表面処理層は、スポットめっき法などによって部分的に形成するようにしてもよい。 The lead frame substrate 3 may appropriately be provided with a surface treatment layer (not shown) having a higher reflectance to light from the LED chip 2 than the metal hoop material 30 on the main surface side. The lead frame substrate 3 is not limited to the presence or absence of the surface treatment layer, and preferably serves also as a reflecting member for reflecting light emitted from the LED chip 2 or the like. Thereby, the LED module 1 can improve the total luminous flux amount. However, in the LED module 1, in the configuration in which the surface treatment layer is provided on the lead frame substrate 3, the light extraction efficiency can be further improved. As the surface treatment layer, for example, a laminated film of Ag film, Ni film, Pd film and Au film, a laminated film of Ni film and Au film, a laminated film of Ag film, Pd film and AuAg alloy film, etc. are adopted. can do. The surface treatment layer is a lamination of a Ni film, a Pd film and an Au film rather than an Ag film from the viewpoint of long-term reliability (for example, oxidation resistance, corrosion resistance, adhesion to the resin part 4 etc.) A film, a laminated film of Ni film and Au film, Ag film, Pd film and AuAg alloy film are preferable. The surface treatment layer is preferably composed of a plating layer or the like. In short, the surface treatment layer is preferably formed by plating. In the LED module 1 of the present embodiment, the surface treatment layer constitutes a metal film having a higher reflectance to light emitted from the LED chip 2 than the metal hoop material 30. The LED module 1 is not limited to the main surface side of the lead frame substrate 3, and a surface treatment layer may be formed on the entire lead frame substrate 3. The surface treatment layer on the main surface side of the lead frame substrate 3 may be partially formed by spot plating or the like.
　なお、金属フープ材３０としては、母材であるアルミニウム板の一表面側にアルミニウム板よりも高純度のアルミニウム膜が積層され、このアルミニウム膜上に、屈折率の異なる２種類の誘電体膜からなる増反射膜が積層された高反射基板を用いることもできる。ここで、２種類の誘電体膜としては、例えば、ＳｉＯ2膜とＴｉＯ2膜とを採用することが好ましい。ＬＥＤモジュール１は、金属フープ材３０として高反射基板を用いることにより、可視光に対する反射率を９５％以上とすることが可能となる。この高反射基板としては、例えば、アラノッド（alanod）社のＭＩＲＯ２、ＭＩＲＯ（登録商標）を用いることができる。上述のアルミニウム板としては、表面が陽極酸化処理されたものを用いてもよい。金属フープ材３０として、上述のような高反射基板を用いる場合には、後述の第１ワイヤ６ｂおよび第２ワイヤ６ｃそれぞれとの電気的接続のための導電膜をめっき法などによって形成するか、増反射膜をパターニングする必要がある。 As the metal hoop material 30, an aluminum film having a purity higher than that of the aluminum plate is laminated on one surface side of the aluminum plate as a base material, and two kinds of dielectric films having different refractive indexes are laminated on this aluminum film. It is also possible to use a high reflection substrate on which a reflection enhancing film is laminated. Here, as the two types of dielectric films, for example, it is preferable to adopt an SiO 2 film and a TiO 2 film. By using a highly reflective substrate as the metal hoop material 30, the LED module 1 can have a reflectance of 95% or more for visible light. As this highly reflective substrate, for example, MIRO 2 and MIRO (registered trademark) of Alanod Co., Ltd. can be used. As the above-mentioned aluminum plate, you may use that by which the surface was anodized. When a high reflection substrate as described above is used as the metal hoop material 30, a conductive film for electrical connection with each of the first wire 6b and the second wire 6c described later may be formed by plating or the like. It is necessary to pattern the reflection enhancing film.
　複数の実装部３２の各々は、ＬＥＤチップ２が搭載されるダイパッド３２ａと、ダイパッド３２ａに連続した第１リード３２ｂと、第２方向においてダイパッド３２ａに対向した第２リード３２ｃと、を備えている。第１リード３２ｂには、ＬＥＤチップ２の第１電極（図示せず）が第１ワイヤ６ｂを介して電気的に接続される。第２リード３２ｃには、ＬＥＤチップ２の第２電極（図示せず）が第２ワイヤ６ｃを介して電気的に接続される。 Each of the plurality of mounting portions 32 includes a die pad 32a on which the LED chip 2 is mounted, a first lead 32b continuous to the die pad 32a, and a second lead 32c opposed to the die pad 32a in the second direction. . The first electrode (not shown) of the LED chip 2 is electrically connected to the first lead 32 b via the first wire 6 b. The second electrode (not shown) of the LED chip 2 is electrically connected to the second lead 32c via the second wire 6c.
　ＬＥＤモジュール１は、図１Ａ、１Ｂに示すように、ＬＥＤチップ２の厚み方向の他面側が接合部７を介してダイパッド３２ａに接合されている。接合部７は、例えば、ダイボンド材により形成すればよい。 As shown in FIGS. 1A and 1B, in the LED module 1, the other surface side in the thickness direction of the LED chip 2 is bonded to the die pad 32 a via the bonding portion 7. The bonding portion 7 may be formed of, for example, a die bonding material.
　ダイボンド材としては、例えば、シリコーン系のダイボンド材、エポキシ系のダイボンド材、銀ペーストなどを用いることができる。接合部７は、ダイボンド材に、ＬＥＤチップ２から放射される光によって励起されてＬＥＤチップ２の発光色とは異なる色の光を放射する蛍光体を混入させたものでもよい。 As the die bonding material, for example, a silicone-based die bonding material, an epoxy-based die bonding material, a silver paste, or the like can be used. The bonding portion 7 may be a die bonding material mixed with a phosphor that is excited by light emitted from the LED chip 2 and emits light of a color different from the emission color of the LED chip 2.
　第１ワイヤ６ｂおよび第２ワイヤ６ｃとしては、例えば、金ワイヤ、アルミニウムワイヤなどを採用することができる。 For example, a gold wire, an aluminum wire or the like can be employed as the first wire 6 b and the second wire 6 c.
　また、回路パターン部３１は、複数の実装部３２のうち第１方向において隣り合う実装部３２間を繋いでいる電気接続部３５を備えている。電気接続部３５は、第１方向を長手方向とする短冊状の形状としてある。電気接続部３５の形状は、特に限定するものではなく、例えば、蛇行した形状、曲線状の形状、直線状の形状と曲線状の形状とが組み合わされた形状などとしてもよい。 In addition, the circuit pattern unit 31 includes an electrical connection unit 35 that connects the adjacent mounting units 32 in the first direction among the plurality of mounting units 32. The electrical connection portion 35 has a strip shape whose longitudinal direction is the first direction. The shape of the electrical connection portion 35 is not particularly limited, and may be, for example, a meandering shape, a curvilinear shape, or a shape in which a linear shape and a curvilinear shape are combined.
　リードフレーム基板３は、図２に示すように、複数の実装部３２のうち第１方向において隣り合う実装部３２同士で、第２方向における第１リード３２ｂ、ダイパッド３２ａおよび第２リード３２ｃの並びを逆とすることが好ましい。これにより、ＬＥＤモジュール１では、第１方向において隣り合う実装部３２の一方に実装されたＬＥＤチップ２と他方に実装されたＬＥＤチップ２とで発生した熱が伝達されやすい連結部３４および桟部３３が、第２方向において互いに反対側となるから、各ＬＥＤチップ２で発生する熱をより均等に放熱させることが可能となる。よって、ＬＥＤモジュール１は、各ＬＥＤチップ２の発光効率を高めることが可能となり、全光束量を向上させることが可能となる。この場合、回路パターン部３１は、図２に示すように、互いに隣り合う実装部３２の一方の実装部３２の第２リード３２ｃと、他方の実装部３２の第１リード３２ｂと、が電気接続部３５を介して連結され電気的に直列接続してあることが好ましい。 As shown in FIG. 2, the lead frame substrate 3 is an array of the first leads 32 b, the die pads 32 a, and the second leads 32 c in the second direction between the mounting portions 32 adjacent to each other in the first direction among the plurality of mounting portions 32. It is preferable to reverse. Thereby, in the LED module 1, the connecting portion 34 and the rail portion to which the heat generated in the LED chip 2 mounted on one of the mounting portions 32 adjacent to each other in the first direction and the LED chip 2 mounted on the other are easily transmitted Since 33 is on the opposite side in the second direction, it is possible to more uniformly dissipate the heat generated in each LED chip 2. Therefore, the LED module 1 can increase the luminous efficiency of each LED chip 2 and can improve the total luminous flux. In this case, in the circuit pattern portion 31, as shown in FIG. 2, the second lead 32c of one mounting portion 32 of the mounting portions 32 adjacent to each other and the first lead 32b of the other mounting portion 32 are electrically connected Preferably, they are connected via the portion 35 and electrically connected in series.
　また、回路パターン部３１は、第１方向における中間位置に電気接続部３５を設ける代わりに、例えば、図４に示すように、中間位置よりも第１方向における一端側のダイパッド３２ａと他端側のダイパッド３２ａとを連結し電気的に接続する接続切替部３６を備えているのが好ましい。これにより、ＬＥＤモジュール１は、接続切替部３６よりも第１方向における一端側の全てのＬＥＤチップ２の直列回路のうち接続切替部３６に最も近い位置にあるＬＥＤチップ２の第１電極と、他端側の全てのＬＥＤチップ２の直列回路のうち接続切替部３６に最も近い位置にあるＬＥＤチップ２の第１電極と、を接続することが可能となる。要するに、回路パターン部３１は、それぞれ所望数のＬＥＤチップ２を直列接続した直列回路同士を並列接続可能に形成されている。これにより、ＬＥＤモジュール１は、点灯装置から供給する必要のある駆動電圧あるいは駆動電流の増加を抑制することが可能となり、ＬＥＤチップ２の個数を増やすことが可能となる。 Further, instead of providing the electrical connection portion 35 at the intermediate position in the first direction, the circuit pattern portion 31 has, for example, the die pad 32a at one end side and the other end side in the first direction than the intermediate position as shown in FIG. It is preferable to have a connection switching portion 36 which connects and electrically connects with the die pad 32a of Thus, the LED module 1 includes the first electrode of the LED chip 2 located closest to the connection switching unit 36 in the series circuit of all the LED chips 2 on one end side in the first direction than the connection switching unit 36, It becomes possible to connect the first electrode of the LED chip 2 located closest to the connection switching portion 36 among the series circuits of all the LED chips 2 on the other end side. In short, the circuit pattern portion 31 is formed so that serial circuits in which a desired number of LED chips 2 are connected in series can be connected in parallel. As a result, the LED module 1 can suppress an increase in drive voltage or drive current that needs to be supplied from the lighting device, and the number of LED chips 2 can be increased.
　回路パターン部３１は、接続切替部３６を設けずに、全てのＬＥＤチップ２が直列接続されるパターンとしてもよい。この場合、ＬＥＤモジュール１は、各実装部３２ごとに１個のＬＥＤチップ２が実装された状態において、第１方向の一端側の第１リード３２ｂと他端側の第２リード３２ｃとの間に給電することにより、全てのＬＥＤチップ２の直列回路に対して給電することができる。 The circuit pattern unit 31 may have a pattern in which all the LED chips 2 are connected in series without providing the connection switching unit 36. In this case, in a state where one LED chip 2 is mounted for each mounting portion 32, the LED module 1 is located between the first lead 32b at one end in the first direction and the second lead 32c at the other end. By feeding power to the series circuit of all the LED chips 2 can be fed.
　各実装部３２の各々に実装するＬＥＤチップ２の数は、１個に限らず、複数個でもよい。この場合、回路パターン部３１は、各実装部３２ごとに複数個のＬＥＤチップ２が並列接続され、これら複数個のＬＥＤチップ２の並列回路が、実装部３２の数だけ直列接続されるようにパターン化された導体部とすることが可能となる。各実装部３２ごとに複数個のＬＥＤチップ２を実装する場合、これら複数個のＬＥＤチップ２は、発光色が同じものでもよいし、発光色が異なるものでもよい。また、ＬＥＤモジュール１は、各実装部３２に同じ個数のＬＥＤチップ２を実装した構成に限らない。また、ＬＥＤモジュール１は、全ての実装部３２にＬＥＤチップ２を実装した構成に限らない。 The number of LED chips 2 mounted on each mounting portion 32 is not limited to one, and may be plural. In this case, in the circuit pattern unit 31, a plurality of LED chips 2 are connected in parallel for each mounting unit 32, and parallel circuits of the plurality of LED chips 2 are connected in series for the number of mounting units 32. It is possible to make a patterned conductor part. When a plurality of LED chips 2 are mounted for each mounting portion 32, the plurality of LED chips 2 may have the same emission color or may have different emission colors. Further, the LED module 1 is not limited to the configuration in which the same number of LED chips 2 are mounted on each mounting unit 32. Further, the LED module 1 is not limited to the configuration in which the LED chip 2 is mounted on all the mounting units 32.
　また、ＬＥＤモジュール１は、図１Ｃに示す第１変形例のように、ＬＥＤチップ２が、サブマウント部材１５を介してダイパッド３２ａに搭載された構成としてもよい。 The LED module 1 may be configured such that the LED chip 2 is mounted on the die pad 32 a via the submount member 15 as in the first modification shown in FIG. 1C.
　サブマウント部材１５は、ＬＥＤチップ２とリードフレーム基板３との線膨張率の差に起因してＬＥＤチップ２に働く応力を緩和する応力緩和機能を有することが好ましい。これにより、ＬＥＤモジュール１は、ＬＥＤチップ２とリードフレーム基板３との線膨張率の差に起因してＬＥＤチップ２に働く応力を緩和することが可能となる。 The submount member 15 preferably has a stress relaxation function of relaxing the stress acting on the LED chip 2 due to the difference in linear expansion coefficient between the LED chip 2 and the lead frame substrate 3. Thereby, the LED module 1 can relieve the stress acting on the LED chip 2 due to the difference in the coefficient of linear expansion between the LED chip 2 and the lead frame substrate 3.
　また、サブマウント部材１５は、ＬＥＤチップ２で発生した熱をダイパッド３２ａへ伝熱させる熱伝導機能を有していることが好ましい。また、サブマウント部材１５は、ＬＥＤチップ２で発生した熱をダイパッド３２ａにおいてＬＥＤチップ２のチップサイズよりも広い範囲に伝熱させる熱伝導機能を有していることが好ましい。このため、サブマウント部材１５は、ＬＥＤチップ２のチップサイズよりも大きな平面サイズに形成されていることが好ましい。これにより、ＬＥＤモジュール１は、ＬＥＤチップ２で発生した熱をサブマウント部材１５、ダイパッド３２ａ、連結部３４および桟部３３を介して効率良く放熱させることが可能となる。サブマウント部材１５は、例えば、矩形板状の形状とすることが好ましい。 The submount member 15 preferably has a heat transfer function of transferring the heat generated by the LED chip 2 to the die pad 32a. The submount member 15 preferably has a heat transfer function of transferring heat generated by the LED chip 2 to a range wider than the chip size of the LED chip 2 in the die pad 32 a. For this reason, it is preferable that the submount member 15 be formed in a plane size larger than the chip size of the LED chip 2. Thus, the LED module 1 can efficiently dissipate the heat generated by the LED chip 2 through the submount member 15, the die pad 32 a, the connecting portion 34 and the crosspieces 33. The submount member 15 preferably has, for example, a rectangular plate shape.
　サブマウント部材１５としては、例えば、透光性および光拡散性を有する材質のものを採用してもよい。これにより、ＬＥＤモジュール１は、光取り出し効率の向上を図ることが可能となる。透光性および拡散性を有する材質としては、例えば、アルミナや硫酸バリウムなどを採用することができる。 For example, the submount member 15 may be made of a material having a light transmitting property and a light diffusing property. Thereby, the LED module 1 can improve the light extraction efficiency. As a material which has translucency and diffusivity, alumina, barium sulfate, etc. are employable, for example.
　また、サブマウント部材１５の材質としては、窒化アルミニウム、複合ＳｉＣ、Ｓｉ、ＣｕＷなどを採用することもできる。 Also, as a material of the submount member 15, aluminum nitride, composite SiC, Si, CuW or the like can be adopted.
　また、サブマウント部材１５は、ＬＥＤチップ２が接合される側の表面に、ＬＥＤチップ２から放射された光を反射する反射膜を設けてもよい。反射膜は、例えば、Ｎｉ膜とＡｇ膜との積層膜により構成することができる。反射膜の材料は、特に限定するものではなく、例えば、ＬＥＤチップ２の発光波長に応じて適宜選択すればよい。 In addition, the submount member 15 may be provided with a reflective film that reflects the light emitted from the LED chip 2 on the surface on which the LED chip 2 is bonded. The reflective film can be formed of, for example, a laminated film of a Ni film and an Ag film. The material of the reflective film is not particularly limited, and may be appropriately selected according to the emission wavelength of the LED chip 2, for example.
　リードフレーム基板３は、図２の例に限らず、複数の実装部３２のうち第１方向において隣り合う実装部３２同士で、第２方向における第１リード３２ｂ、ダイパッド３２ａおよび第２リード３２ｃの並びを同じとしてもよい。この場合、回路パターン部３１は、互いに隣り合う実装部３２の第１リード３２ｂ同士、第２リード３２ｃ同士が、それぞれ電気接続部３５を介して連結され電気的に接続してあることが好ましい。これにより、リードフレーム基板３は、回路パターン部３１を、各実装部３２に１つずつ実装されたＬＥＤチップ２を並列接続するようにパターン化された導体部とすることができる。 The lead frame substrate 3 is not limited to the example of FIG. 2, and among the plurality of mounting portions 32, the mounting portions 32 adjacent in the first direction may have the first lead 32 b, the die pad 32 a and the second lead 32 c in the second direction. The arrangement may be the same. In this case, in the circuit pattern portion 31, it is preferable that the first leads 32b and the second leads 32c of the mounting portions 32 adjacent to each other are connected and electrically connected via the electrical connection portions 35, respectively. Thereby, the lead frame substrate 3 can make the circuit pattern portion 31 a conductor portion patterned so as to connect in parallel the LED chips 2 mounted one by one on each mounting portion 32.
　リードフレーム基板３は、一対の桟部３３の間に、各桟部３３の各々に連続した複数ずつの連結部３４を介して回路パターン部３１が支持されている。各桟部３３は、第１方向を長手方向とする帯状に形成されている。各桟部３３の第２方向の寸法（幅寸法）は、電気接続部３５の第２方向の寸法（幅寸法）よりも大きく設定してある。各連結部３４の第１方向の寸法（幅寸法）は、電気接続部３５の第２方向の寸法（幅寸法）よりも大きく設定してある。 In the lead frame substrate 3, the circuit pattern portion 31 is supported between a pair of crosspieces 33 via a plurality of connecting portions 34 continuous to each of the crosspieces 33. Each crosspiece 33 is formed in a strip shape in which the first direction is the longitudinal direction. The dimension (width dimension) of the crosspieces 33 in the second direction is set larger than the dimension (width dimension) of the electric connection portion 35 in the second direction. The dimension (width dimension) in the first direction of each connecting portion 34 is set larger than the dimension (width dimension) in the second direction of the electrical connection portion 35.
　上述の説明から分かるように、リードフレーム基板３は、複数の実装部３２が、第１方向に沿って配列されている。また、リードフレーム基板３は、各桟部３３の各々に接続された複数の連結部３４が、第１方向に沿って配列されている。 As understood from the above description, in the lead frame substrate 3, a plurality of mounting portions 32 are arranged along the first direction. Further, in the lead frame substrate 3, a plurality of connecting portions 34 connected to each of the crosspieces 33 are arranged along the first direction.
　樹脂部４は、リードフレーム基板３の一部が埋設されている。また、樹脂部４は、リードフレーム基板３の主表面側において各実装部３２を露出させる開口部４ａが形成されている。開口部４ａの平面視の開口形状は、円形状としてあるが、これに限らず、例えば、楕円形状や正多角形状などの形状としてもよい。また、開口部４ａは、樹脂部４の厚み方向において実装部３２からの距離によらず開口面積が略一定となる形状としてあるが、これに限らず、樹脂部４の厚み方向において実装部３２から離れるにつれて開口面積が徐々に大きくなる形状としてもよい。ただし、開口部４ａは、樹脂部４を成形してから金型を離型する際の金型の抜き勾配を考慮した形状とすることが好ましい。 In the resin portion 4, a part of the lead frame substrate 3 is embedded. Further, in the resin portion 4, an opening 4 a for exposing each mounting portion 32 is formed on the main surface side of the lead frame substrate 3. The opening shape of the opening 4 a in a plan view is a circular shape, but the shape is not limited to this, and may be an oval shape, a regular polygon shape, or the like. The opening 4 a has a shape in which the opening area is substantially constant regardless of the distance from the mounting portion 32 in the thickness direction of the resin portion 4. However, the present invention is not limited thereto. The shape may be such that the opening area gradually increases as the distance from. However, it is preferable that the opening 4 a has a shape in consideration of the draft of the mold at the time of releasing the mold after molding the resin portion 4.
　樹脂部４の材料としては、例えば、液晶ポリマー（liquid crystal polymer：ＬＣＰ）、ポリブチレンテレフタレート（polybutylene terephthalate：ＰＢＴ）、ポリアミド（polyamid：ＰＡ）などの熱可塑性樹脂や、エポキシ系樹脂、ポリエステル系樹脂などの熱硬化性樹脂を採用することができる。樹脂部４は、熱可塑性樹脂および熱硬化性樹脂のいずれの場合も、白色で、可視光に対する反射率の高い樹脂が好ましい。要するに、樹脂部４は、光を反射する反射部材を兼ねることが好ましい。これにより、ＬＥＤモジュール１は、全光束量を向上させることが可能となる。 Examples of the material of the resin portion 4 include thermoplastic resins such as liquid crystal polymer (liquid crystal polymer: LCP), polybutylene terephthalate (PBT), polyamide (polyamide: PA), epoxy resin, polyester resin For example, thermosetting resins can be employed. The resin portion 4 is preferably a resin which is white and has a high reflectance to visible light in any of the thermoplastic resin and the thermosetting resin. In short, it is preferable that the resin part 4 doubles as a reflecting member that reflects light. Thereby, the LED module 1 can improve the total luminous flux amount.
　樹脂部４は、長尺状（ここでは、細長の矩形板状）に形成されており、第１方向において略等間隔で開口部４ａが形成されている。第２方向における樹脂部４の幅寸法は、第２方向における桟部３３、３３間の寸法よりも小さな値に設定してある。 The resin portion 4 is formed in an elongated shape (here, an elongated rectangular plate shape), and the openings 4 a are formed at substantially equal intervals in the first direction. The width dimension of the resin part 4 in the second direction is set to a value smaller than the dimension between the crosspieces 33 in the second direction.
　絶縁基板５は、長尺状（ここでは、細長の矩形板状）に形成されている。第２方向における絶縁基板５の幅寸法は、第２方向におけるリードフレーム基板３の幅寸法よりも大きな値に設定してある。 The insulating substrate 5 is formed in a long shape (here, a long rectangular plate shape). The width dimension of the insulating substrate 5 in the second direction is set to a value larger than the width dimension of the lead frame substrate 3 in the second direction.
　絶縁基板５の材料としては、例えば、液晶ポリマー、ポリブチレンテレフタレート、ポリアミド樹脂などの熱可塑性樹脂や、エポキシ系樹脂、ポリエステル系樹脂などの熱硬化性樹脂や、アルミナ、窒化アルミニウムなどのセラミックを採用することができる。絶縁基板５は、熱可塑性樹脂および熱硬化性樹脂のいずれの場合も、白色で、可視光に対する反射率の高い樹脂が好ましい。ＬＥＤモジュール１は、絶縁基板５の熱伝導率が、樹脂部４の熱伝導率以上であることが好ましい。このような場合、絶縁基板５は、樹脂部４と同一の材料でもよいし、樹脂に当該樹脂よりも熱伝導率の高いフィラーを混合したものでもよいし、セラミックなどでもよい。フィラーとしては、例えば、酸化マグネシウム、窒化ホウ素、水酸化アルミニウム、ガラス繊維などを採用することができる。また、フィラーの充填率は、６０体積パーセント～７５体積パーセント程度が好ましい。 The material of the insulating substrate 5 is, for example, a thermoplastic resin such as liquid crystal polymer, polybutylene terephthalate, or polyamide resin, a thermosetting resin such as epoxy resin or polyester resin, or a ceramic such as alumina or aluminum nitride. can do. The insulating substrate 5 is preferably a resin which is white and has a high reflectance to visible light in both the thermoplastic resin and the thermosetting resin. It is preferable that the thermal conductivity of the insulating substrate 5 of the LED module 1 is equal to or higher than the thermal conductivity of the resin portion 4. In such a case, the insulating substrate 5 may be made of the same material as that of the resin portion 4, or may be a mixture of a resin and a filler having a thermal conductivity higher than that of the resin, or a ceramic. As a filler, magnesium oxide, boron nitride, aluminum hydroxide, glass fiber etc. are employable, for example. Also, the filling rate of the filler is preferably about 60 volume percent to about 75 volume percent.
　ところで、ＬＥＤモジュール１は、樹脂部４の厚み方向の他面４ｃ側においてＬＥＤチップ２、第１ワイヤ６ｂおよび第２ワイヤ６ｃを封止した封止部９を備えることが好ましい。封止部９の材料として、第１透光性材料であるシリコーン樹脂を用いている。第１透光性材料は、シリコーン樹脂に限らず、例えば、エポキシ樹脂、アクリル樹脂、ガラスなどを用いてもよい。ＬＥＤモジュール１は、リードフレーム基板３と樹脂部４の他面４ｃを含む平面との距離よりも、リードフレーム基板３とＬＥＤチップ２の上記一面との距離が長いほうが好ましい。これにより、ＬＥＤモジュール１は、ＬＥＤチップ２から放射されて樹脂部４の他面４ｃに入射し樹脂部４に吸収される光や、樹脂部４における開口部４ａの内側面で反射される光を、より低減することが可能となり、光出力のより一層の高出力化を図ることが可能となる。本実施形態のＬＥＤモジュール１では、絶縁基板５が樹脂部４の一面４ｂ側だけでなく、第１方向に沿った樹脂部４の側面４ｄも覆う形状に形成されている。ここで、ＬＥＤモジュール１は、絶縁基板５における樹脂部４の他面４ｃ側の表面５ｃが、樹脂部４の他面４ｃと略面一になっているのが好ましい。 By the way, it is preferable that the LED module 1 includes a sealing portion 9 in which the LED chip 2, the first wire 6 b and the second wire 6 c are sealed on the other surface 4 c side in the thickness direction of the resin portion 4. As a material of the sealing portion 9, a silicone resin which is a first light transmitting material is used. The first light transmissive material is not limited to silicone resin, and may be epoxy resin, acrylic resin, glass, etc., for example. The distance between the lead frame substrate 3 and the one surface of the LED chip 2 is preferably longer than the distance between the lead frame substrate 3 and the plane including the other surface 4 c of the resin portion 4. Thus, the LED module 1 emits light emitted from the LED chip 2 and incident on the other surface 4 c of the resin portion 4 and absorbed by the resin portion 4 or light reflected by the inner side surface of the opening 4 a in the resin portion 4 It is possible to further reduce the light output, and to further increase the light output. In the LED module 1 of the present embodiment, the insulating substrate 5 is formed so as to cover not only the one surface 4 b side of the resin portion 4 but also the side surface 4 d of the resin portion 4 along the first direction. Here, in the LED module 1, it is preferable that the surface 5 c on the other surface 4 c side of the resin portion 4 in the insulating substrate 5 be substantially flush with the other surface 4 c of the resin portion 4.
　封止部９には、ＬＥＤチップ２の発光色とは異なる色の光を放射する蛍光体などの波長変換材料を混入させてもよい。これにより、ＬＥＤモジュール１は、ＬＥＤチップ２から放射される光と蛍光体から放射される光との混色光を得ることが可能となる。なお、封止部９は、半球状の形状としてあるが、半球状に限らず、例えば、半楕円球状の形状としてもよい。 The sealing portion 9 may be mixed with a wavelength conversion material such as a phosphor that emits light of a color different from the color of light emitted from the LED chip 2. Thereby, the LED module 1 can obtain mixed color light of the light emitted from the LED chip 2 and the light emitted from the phosphor. In addition, although the sealing part 9 is made into hemispherical shape, it is good also as not only hemispherical shape but a semi-elliptic spherical shape, for example.
　また、ＬＥＤモジュール１は、封止部９とは別に、例えば、波長変換材料と第２透光性材料とを含む波長変換部として色変換部を設けてもよい。波長変換部とは、ＬＥＤチップ２から放射される電磁波（光）の波長を異なる波長の電磁波（光）に変換する波長変換機能を有する機能部を意味する。 Moreover, the LED module 1 may be provided with a color conversion part as a wavelength conversion part containing a wavelength conversion material and a 2nd translucent material separately from the sealing part 9, for example. The wavelength conversion unit means a functional unit having a wavelength conversion function of converting the wavelength of the electromagnetic wave (light) emitted from the LED chip 2 into electromagnetic waves (light) of different wavelengths.
　ＬＥＤモジュール１は、例えば、ＬＥＤチップ２として青色ＬＥＤチップを採用し、波長変換材料の蛍光体として黄色蛍光体を採用すれば、白色光を得ることが可能となる。すなわち、ＬＥＤモジュール１は、ＬＥＤチップ２から放射された青色光と黄色蛍光体から放射された光とが封止部９あるいは色変換部の表面を通して放射されることとなり、白色光を得ることが可能となる。第２透光性材料としては、例えば、シリコーン樹脂を採用することができる。第２透光性材料としては、シリコーン樹脂に限らず、例えば、アクリル樹脂、ガラス、有機成分と無機成分とがｎｍレベルもしくは分子レベルで混合、結合した有機・無機ハイブリッド材料などを採用してもよい。 For example, if a blue LED chip is adopted as the LED chip 2 and a yellow phosphor is adopted as the phosphor of the wavelength conversion material, it becomes possible to obtain white light. That is, in the LED module 1, the blue light emitted from the LED chip 2 and the light emitted from the yellow phosphor are emitted through the surface of the sealing portion 9 or the color conversion portion to obtain white light. It becomes possible. For example, a silicone resin can be employed as the second light transmissive material. The second light transmitting material is not limited to the silicone resin, but, for example, an acrylic resin, glass, or an organic / inorganic hybrid material in which an organic component and an inorganic component are mixed and combined at the nm level or molecular level Good.
　波長変換材料である蛍光体としては、黄色蛍光体だけに限らず、例えば、黄色蛍光体と赤色蛍光体とを採用したり、赤色蛍光体と緑色蛍光体とを採用してもよい。また、波長変換材料である蛍光体は、１種類の黄色蛍光体に限らず、発光ピーク波長の異なる２種類の黄色蛍光体を採用してもよい。ＬＥＤモジュール１は、波長変換材料として複数種の蛍光体を採用することにより、演色性を高めることが可能となる。 As a fluorescent substance which is a wavelength conversion material, not only yellow fluorescent substance but yellow fluorescent substance and red fluorescent substance may be adopted or red fluorescent substance and green fluorescent substance may be adopted, for example. Moreover, the fluorescent substance which is a wavelength conversion material may employ | adopt not only one type of yellow fluorescent substance but two types of yellow fluorescent substance from which the light emission peak wavelength differs. The LED module 1 can improve color rendering by adopting a plurality of types of phosphors as wavelength conversion materials.
　ＬＥＤモジュール１は、ＬＥＤチップ２単体で白色光を放射できる場合、封止部９に蛍光体を混入させてある場合、ＬＥＤモジュール１で得たい光の色がＬＥＤチップ２の発光色と同じである場合など、色変換部を備えていない構造を採用することができる。 In the case where the LED module 1 can emit white light with the LED chip 2 alone, when the phosphor is mixed in the sealing portion 9, the color of light desired to be obtained by the LED module 1 is the same as the color of the LED chip 2. For example, a structure without the color conversion unit can be employed.
　ＬＥＤモジュール１は、封止部９に波長変換材料である蛍光体が混入されている場合、ＬＥＤチップ２で発生した熱だけでなく、波長変換材料である蛍光体で発生した熱も連結部３４および桟部３３を通して放熱させることが可能となり、光出力の高出力化を図ることが可能となる。 In the LED module 1, when the phosphor as the wavelength conversion material is mixed in the sealing portion 9, not only the heat generated in the LED chip 2 but also the heat generated in the phosphor as the wavelength conversion material is the coupling portion 34 Thus, the heat can be dissipated through the crosspieces 33, and the light output can be increased.
　色変換部は、樹脂部４の他面４ｃ側において封止部９との間に気体層（例えば、空気層など）が形成されるように配設してあることが好ましい。また、ＬＥＤモジュール１は、色変換部をドーム状の形状として、色変換部により、ＬＥＤチップ２、第１ワイヤ６ｂおよび第２ワイヤ６ｃを封止した構成としてもよい。また、ＬＥＤモジュール１は、色変換部を、層状の形状として、色変換部により、ＬＥＤチップ２およびワイヤ６ｂ，６ｃを封止するようにしてもよい。なお、層状の色変換部は、成形法、ディスペンサを用いた塗布法、スクリーン印刷法などにより形成することが可能である。 The color conversion portion is preferably disposed such that a gas layer (for example, an air layer or the like) is formed between the color conversion portion and the sealing portion 9 on the other surface 4 c side of the resin portion 4. In addition, the LED module 1 may have a configuration in which the color conversion unit has a dome shape and the LED chip 2, the first wire 6b, and the second wire 6c are sealed by the color conversion unit. In addition, the LED module 1 may have the color conversion portion in a layered shape, and the color conversion portion may seal the LED chip 2 and the wires 6 b and 6 c. The layered color conversion portion can be formed by a molding method, a coating method using a dispenser, a screen printing method, or the like.
　ＬＥＤモジュール１は、複数の桟部３３が絶縁基板５に埋設されている。これにより、ＬＥＤモジュール１は、電気的な絶縁性を確保しつつ放熱性を向上させることが可能となる。ここで、ＬＥＤモジュール１は、絶縁基板５の熱伝導率が、樹脂部４の熱伝導率以上であることが好ましい。これにより、ＬＥＤモジュール１は、放熱性を、より向上させることが可能となる。絶縁基板５の平面視の外形サイズは、リードフレーム基板３の平面視の外形サイズなどに基づいて適宜設定すればよい。 In the LED module 1, a plurality of crosspieces 33 are embedded in the insulating substrate 5. Thus, the LED module 1 can improve the heat dissipation while securing the electrical insulation. Here, in the LED module 1, the thermal conductivity of the insulating substrate 5 is preferably equal to or higher than the thermal conductivity of the resin portion 4. Thereby, the LED module 1 can further improve the heat dissipation. The outer size of the insulating substrate 5 in plan view may be appropriately set based on the outer size of the lead frame substrate 3 in plan view and the like.
　以下では、ＬＥＤモジュール１の製造方法について図３～８に基いて説明する。 Hereinafter, a method of manufacturing the LED module 1 will be described with reference to FIGS.
　ＬＥＤモジュール１の製造にあたっては、まず、リードフレーム基板３の基礎となる金属フープ材３０（図３参照）を準備する。 In the manufacture of the LED module 1, first, a metal hoop material 30 (see FIG. 3) which is a basis of the lead frame substrate 3 is prepared.
　その後には、金属フープ材３０に対してプレスによる打ち抜き加工を施すことによりリードフレーム基板３を形成する工程（第１工程）を行うことで、図４に示す構造を得る。 Thereafter, the step shown in FIG. 4 is obtained by performing the step (first step) of forming the lead frame substrate 3 by punching the metal hoop material 30 with a press.
　その後には、インサート成形法によって、リードフレーム基板３の一部が埋設された樹脂部４を成形する工程（第２工程）を行うことで、図５に示す構造を得る。 Thereafter, a step (second step) of molding the resin portion 4 in which a part of the lead frame substrate 3 is embedded is performed by the insert molding method to obtain the structure shown in FIG.
　その後には、リードフレーム基板３に所望の回路パターン部３１を形成するための工程（以下、「抜き工程」という。）を適宜行うことで、図６に示す構造を得る。抜き工程は、例えば、リードフレーム基板３に上述の接続切替部３６が設けられている場合に、第２方向において接続切替部３６の両側にある各桟部３３の各々の一部を、第２方向の全長に亘って抜くプレス加工を行うようにすればよい。抜き工程は、プレス加工に限らず、例えば、レーザビームを照射して切断するレーザ加工法や、スタンピング金型を用いたスタンピング法や、ブレード（砥石）を用いた切断方法などを採用することもできる。なお、第１工程で形成するリードフレーム基板３に所望の回路パターン部３１が形成されている場合には、抜き工程は不要である。 Thereafter, a process shown in FIG. 6 is obtained by appropriately performing a process for forming a desired circuit pattern portion 31 on the lead frame substrate 3 (hereinafter, referred to as “extraction process”). For example, when the lead frame substrate 3 is provided with the above-described connection switching portion 36, the removal step is performed by using a part of each of the crosspieces 33 on both sides of the connection switching portion 36 in the second direction. It may be made to carry out press processing which pulls out over the full length of the direction. The punching process is not limited to pressing, but may be, for example, laser processing using a laser beam for cutting, stamping using a stamping die, cutting using a blade (grindstone), or the like. it can. When the desired circuit pattern portion 31 is formed on the lead frame substrate 3 formed in the first step, the removal step is unnecessary.
　樹脂部４および回路パターン部３１を形成した後には、複数の実装部３２の各々にＬＥＤチップ２を実装する工程（第３工程）を行うことで、図７に示す構造を得る。ＬＥＤチップ２の実装にあたっては、ＬＥＤチップ２をダイパッド３２ａに搭載し、その後、ＬＥＤチップ２の第１電極と第１リード３２ｂとを第１ワイヤ６ｂを介して電気的に接続し、且つ、ＬＥＤチップ２の第２電極と第２リード３２ｃとを第２ワイヤ６ｃを介して電気的に接続するワイヤボンディングを行う。なお、ＬＥＤチップ２をダイパッド３２ａに搭載するにあたっては、ＬＥＤチップ２とダイパッド３２ａとを接合部７を介して接合するようにしている。なお、ＬＥＤモジュール１が図１Ｃのようにサブマウント部材１５を備えている場合には、ＬＥＤチップ２を、サブマウント部材１５を介してダイパッド３２ａに搭載するようすればよい。要するに、サブマウント部材１５とダイパッド３２ａとを接合し、且つ、サブマウント部材１５とＬＥＤチップ２とを接合するようにすればよい。 After the resin portion 4 and the circuit pattern portion 31 are formed, the step (third step) of mounting the LED chip 2 on each of the plurality of mounting portions 32 is performed to obtain the structure shown in FIG. In mounting the LED chip 2, the LED chip 2 is mounted on the die pad 32a, and then the first electrode of the LED chip 2 and the first lead 32b are electrically connected via the first wire 6b, and the LED Wire bonding is performed to electrically connect the second electrode of the chip 2 and the second lead 32c via the second wire 6c. When the LED chip 2 is mounted on the die pad 32 a, the LED chip 2 and the die pad 32 a are bonded via the bonding portion 7. When the LED module 1 includes the sub mount member 15 as shown in FIG. 1C, the LED chip 2 may be mounted on the die pad 32 a via the sub mount member 15. In short, the submount member 15 and the die pad 32a may be bonded, and the submount member 15 and the LED chip 2 may be bonded.
　複数の実装部３２の各々にＬＥＤチップ２を実装した後には、樹脂部４を支持するように絶縁基板５を設ける工程（第４工程）を行うことで、図８に示す構造を得る。第４工程では、成形法によって絶縁基板５を設けるようにしている。このため、絶縁基板５の材料は、樹脂部４との密着性のよい材料が好ましい。 After the LED chip 2 is mounted on each of the plurality of mounting portions 32, a step (fourth step) of providing the insulating substrate 5 to support the resin portion 4 is performed to obtain the structure shown in FIG. In the fourth step, the insulating substrate 5 is provided by a molding method. Therefore, the material of the insulating substrate 5 is preferably a material having good adhesion to the resin portion 4.
　その後には、ＬＥＤチップ２、第１ワイヤ６ｂおよび第２ワイヤ６ｃを封止部９により封止する工程を行うことで、図１Ｂに示す構造を得る。 Thereafter, the LED chip 2, the first wire 6 b and the second wire 6 c are sealed by the sealing portion 9 to obtain the structure shown in FIG. 1B.
　以上説明したＬＥＤモジュール１の製造方法では、金属フープ材３０に対してプレスによる打ち抜き加工を施すことによりリードフレーム基板３１を形成する第１工程と、第１工程の後でインサート成形法によって、リードフレーム基板３１の一部が埋設された樹脂部４を成形する第２工程と、を備え、第２工程の後で、複数の実装部３２の各々にＬＥＤチップ２を実装し、且つ、樹脂部４を支持するように絶縁基板５を設ける。これにより、ＬＥＤモジュール１の製造方法では、取り扱いが容易であり、且つ、低コスト化および光出力の高出力化を図ることが可能なＬＥＤモジュール１を提供することが可能となる。また、ＬＥＤモジュール１の製造方法では、第２工程の後で、複数の実装部３２の各々にＬＥＤチップ２を実装した後、樹脂部４を支持するように絶縁基板５を設けるので、絶縁基板５の形状の自由度が高くなる。 In the method of manufacturing the LED module 1 described above, the first step of forming the lead frame substrate 31 by punching the metal hoop material 30 with a press, and the lead by the insert molding method after the first step And a second step of molding the resin portion 4 in which a part of the frame substrate 31 is embedded, and after the second step, the LED chip 2 is mounted on each of the plurality of mounting portions 32; An insulating substrate 5 is provided to support the four. As a result, in the method of manufacturing the LED module 1, it is possible to provide the LED module 1 that is easy to handle and that can achieve cost reduction and high output of light output. In the method of manufacturing the LED module 1, after the second step, the LED chip 2 is mounted on each of the plurality of mounting portions 32, and then the insulating substrate 5 is provided to support the resin portion 4. The degree of freedom of the shape of 5 becomes high.
　ＬＥＤモジュール１の製造にあたっては、第１工程と第２工程との間に、リードフレーム基板３に金属フープ材３０よりもＬＥＤチップ２から放射される光に対する反射率の高い金属皮膜を形成する工程（第５工程）を行うようにしてもよい。これにより、ＬＥＤモジュール１の製造方法では、発光効率のより高いＬＥＤモジュール１を製造することが可能となる。 In the process of manufacturing the LED module 1, a step of forming a metal film having a higher reflectance to light emitted from the LED chip 2 than the metal hoop material 30 on the lead frame substrate 3 between the first step and the second step (Fifth step) may be performed. Thereby, in the method of manufacturing the LED module 1, it is possible to manufacture the LED module 1 with higher luminous efficiency.
　また、ＬＥＤモジュール１の製造にあたっては、上述の例に限らず、第２工程の後で樹脂部４を支持するように絶縁基板５を設ける工程（第３工程）を行うことで、図９に示す構造を得てから、複数の実装部３２の各々にＬＥＤチップ２を実装する工程（第４工程）を行うことで図８に示す構造を得るようにしてもよい。このようなＬＥＤモジュール１の製造方法では、複数の実装部３２の各々にＬＥＤチップ２を実装する工程の前にリードフレーム基板３が変形してしまう可能性を低減でき、また、ＬＥＤモジュール１の製造途中における構造物の取り扱いが、より容易になる。この場合も、ＬＥＤモジュール１の製造にあたっては、第１工程と第２工程との間に第５工程を行うようにしてもよい。 In addition, when manufacturing the LED module 1, the process is not limited to the example described above, but by performing the step (third step) of providing the insulating substrate 5 so as to support the resin portion 4 after the second step. After obtaining the structure shown, the structure shown in FIG. 8 may be obtained by performing the step (fourth step) of mounting the LED chip 2 on each of the plurality of mounting parts 32. In such a method of manufacturing the LED module 1, the possibility of deformation of the lead frame substrate 3 before the step of mounting the LED chip 2 on each of the plurality of mounting portions 32 can be reduced. The handling of the structure during manufacture becomes easier. Also in this case, when manufacturing the LED module 1, the fifth process may be performed between the first process and the second process.
　リードフレーム基板３の回路パターン部３１の形状は、例えば、図１０、１１に示すような形状としてもよい。このリードフレーム基板３は、第１リード３２ｂ、ダイパッド３２ａおよび第２リード３２ｃが、第１方向に並んで配置されている。このリードフレーム３の回路パターン部３１は、上述の例と同様、それぞれ所望数のＬＥＤチップ２を直列接続した直列回路同士を並列接続可能に形成されている。 The shape of the circuit pattern portion 31 of the lead frame substrate 3 may be, for example, as shown in FIGS. In the lead frame substrate 3, the first leads 32b, the die pads 32a, and the second leads 32c are arranged side by side in the first direction. The circuit pattern portion 31 of the lead frame 3 is formed such that serial circuits in which a desired number of LED chips 2 are connected in series can be connected in parallel, as in the above-described example.
　リードフレーム基板３の回路パターン部３１は、例えば、図１２に示すように、複数の実装部３２のうち第１方向において隣り合う実装部３２間を繋いでいる電気接続部３５の側縁に、第２方向の一端側が開放された切込溝３８が形成された構成としてもよい。これにより、ＬＥＤモジュール１は、リードフレーム基板３と樹脂部４との線膨張率差に起因してリードフレーム基板３に発生する応力を緩和でき、反りや変形の発生を抑制することが可能となり、長寿命化を図ることが可能となる。 For example, as shown in FIG. 12, the circuit pattern portion 31 of the lead frame substrate 3 is provided on the side edge of the electrical connection portion 35 connecting the mounting portions 32 adjacent in the first direction among the plurality of mounting portions 32. It is good also as composition formed in the incising slot 38 by which the end side of the 2nd direction was opened. Thereby, the LED module 1 can relieve the stress generated in the lead frame substrate 3 due to the difference in linear expansion coefficient between the lead frame substrate 3 and the resin portion 4 and can suppress the occurrence of warpage or deformation. It is possible to extend the life.
　また、リードフレーム基板３の形状は、例えば、図１３、１４に示すような形状としてもよい。この場合、ＬＥＤモジュール１の製造にあたっては、インサート成形法（同時成形法）によって、このリードフレーム基板３の一部が埋設された樹脂部４を成形した後に、リードフレーム基板３の不要部分３９（図１４においてハッチングを施した部分）を切断する。 Further, the shape of the lead frame substrate 3 may be, for example, as shown in FIGS. In this case, in the manufacture of the LED module 1, after the resin portion 4 in which a part of the lead frame substrate 3 is embedded is formed by the insert molding method (simultaneous molding method), the unnecessary portion 39 of the lead frame substrate 3 ( The hatched portion in FIG. 14 is cut off.
　以上説明した本実施形態のＬＥＤモジュール１では、絶縁基板５を備えていることにより、取り扱いが容易である。また、本実施形態のＬＥＤモジュール１においては、ＬＥＤチップ２で発生する熱を連結部３４と桟部３３とを介して放熱させることが可能となるので、低コスト化および光出力の高出力化を図ることが可能となる。 The LED module 1 of the present embodiment described above is easy to handle because the insulating substrate 5 is provided. Further, in the LED module 1 of the present embodiment, the heat generated in the LED chip 2 can be dissipated through the connecting portion 34 and the crosspieces 33, so cost reduction and high output of light output can be achieved. It is possible to
　以下では、本実施形態のＬＥＤモジュール１の第２変形例について図１５、１６に基づいて説明する。 Below, the 2nd modification of the LED module 1 of this embodiment is demonstrated based on FIG.
　第２変形例のＬＥＤモジュール１は、樹脂部４と絶縁基板５とが別々に形成され、樹脂部４と絶縁基板５とが接合されている点などが実施形態１のＬＥＤモジュール１と相違する。なお、実施形態１と同様の構成要素については、同様の符号を付して説明を省略する。 The LED module 1 of the second modification is different from the LED module 1 of the first embodiment in that the resin portion 4 and the insulating substrate 5 are separately formed, and the resin portion 4 and the insulating substrate 5 are joined. . In addition, about the component similar to Embodiment 1, the same code | symbol is attached | subjected and description is abbreviate | omitted.
　第２変形例のＬＥＤモジュール１は、製造時に、樹脂部４と絶縁基板５とを別々に形成した後に、樹脂部４と絶縁基板５とを接着剤などによって接合すればよいから、樹脂部４および絶縁基板５それぞれの形状や材料の自由度を高めることが可能となる。したがって、本実施形態のＬＥＤモジュール１は、モジュールサイズを容易にカスタマイズすることが可能となる。 In the LED module 1 of the second modification, after the resin portion 4 and the insulating substrate 5 are separately formed in the manufacturing process, the resin portion 4 and the insulating substrate 5 may be bonded with an adhesive or the like. And, it is possible to increase the freedom of the shape and material of each of the insulating substrates 5. Therefore, the LED module 1 of the present embodiment can be easily customized in module size.
　第２変形例のＬＥＤモジュール１は、絶縁基板５が、長尺の平板状の形状に形成されており、樹脂部４の厚み方向において複数の実装部３２側とは反対の一面４ｂに接合されている。そして、第２変形例のＬＥＤモジュール１は、第２方向（図１５の左右方向）に交差する樹脂部４の両側面の各々から、リードフレーム基板３１における連結部３４および桟部３３が突出している。ここで、連結部３４および桟部３３は、樹脂部４の両側面４ｄ、４ｄの各々において、樹脂部４の厚み方向の中間部から突出している。これにより、第２変形例のＬＥＤモジュール１は、樹脂部４の側方において、リードフレーム基板３と絶縁基板５とが絶縁基板５の厚み方向で離れており、リードフレーム基板３と絶縁基板５との間に空隙１０が形成されている。よって、第２変形例のＬＥＤモジュール１においては、ＬＥＤチップ２で発生する熱を連結部３４と桟部３３とを介して気体中へ放熱させることが可能となるので、光出力のより一層の高出力化を図ることが可能となる。第２変形例のＬＥＤモジュール１は、第１変形例のＬＥＤモジュール１のサブマウント部材１５を備えた構成としてもよい。また、第２変形例のＬＥＤモジュール１は、リードフレーム基板３の平面形状を特に限定するものではなく、リードフレーム基板３として、例えば、図１０、１１に示すようなリードフレーム基板３、図１２に示すようなリードフレーム基板３、図１３、１４に示すようなリードフレーム基板３を適用してもよい。 In the LED module 1 of the second modification, the insulating substrate 5 is formed in a long flat plate shape, and is joined to the one surface 4 b opposite to the plurality of mounting portions 32 in the thickness direction of the resin portion 4 ing. Then, in the LED module 1 of the second modified example, the connecting portions 34 and the crosspieces 33 in the lead frame substrate 31 project from each of both side surfaces of the resin portion 4 intersecting in the second direction (the left and right direction in FIG. There is. Here, the connecting part 34 and the crosspieces 33 protrude from the middle part in the thickness direction of the resin part 4 on each of both side faces 4 d of the resin part 4. Thus, in the LED module 1 of the second modification, the lead frame substrate 3 and the insulating substrate 5 are separated in the thickness direction of the insulating substrate 5 on the side of the resin portion 4. And an air gap 10 is formed therebetween. Therefore, in the LED module 1 of the second modification, it is possible to dissipate the heat generated in the LED chip 2 into the gas through the connecting portion 34 and the crosspieces 33, so that more light output can be achieved. It is possible to achieve high output. The LED module 1 of the second modification may be configured to include the sub mount member 15 of the LED module 1 of the first modification. Further, the LED module 1 of the second modification does not particularly limit the planar shape of the lead frame substrate 3, and as the lead frame substrate 3, for example, the lead frame substrate 3 as shown in FIGS. A lead frame substrate 3 as shown in FIG. 13 and a lead frame substrate 3 as shown in FIGS. 13 and 14 may be applied.
　以下では、本実施形態のＬＥＤモジュール１の第３変形例について図１７に基づいて説明する。 Below, the 3rd modification of LED module 1 of this embodiment is demonstrated based on FIG.
　第３変形例のＬＥＤモジュール１は、樹脂部４の一部からなる台座部４ｅがダイパッド３２ａ上に形成されており、ＬＥＤチップ２が、樹脂部４の台座部４ｅ上に接合部７を介して接合されている点が第２変形例のＬＥＤモジュール１と相違する。なお、第２変形例と同様の構成要素については、同様の符号を付して説明を省略する。 In the LED module 1 according to the third modification, a pedestal 4e formed of a part of the resin portion 4 is formed on the die pad 32a, and the LED chip 2 is formed on the pedestal 4e of the resin 4 via the bonding portion 7 Is different from the LED module 1 of the second modified example in that it is joined. In addition, about the component similar to a 2nd modification, the same code | symbol is attached | subjected and description is abbreviate | omitted.
　第３変形例のＬＥＤモジュール１は、台座部４ｅが、樹脂部４の開口部４ａ内において、開口部４ａの内側面から離れて形成されている。第３変形例のＬＥＤモジュール１は、台座部４ｅにおける実装部３２側とは反対側の表面が、樹脂部４の他面４ｃを含む平面上にあるのが好ましい。これにより、ＬＥＤモジュール１は、ＬＥＤチップ２の側面から放射されて樹脂部４の他面４ｃに入射して樹脂部４に吸収される光や、樹脂部４における開口部４ａの内側面で反射される光を、より低減することが可能となり、光出力のより一層の高出力化を図ることが可能となる。台座部４ａの平面形状は、矩形状としてあるが、これに限らず、例えば、矩形以外の多角形状、円形状、楕円形状などでもよい。 In the LED module 1 of the third modification, the pedestal 4 e is formed in the opening 4 a of the resin portion 4 so as to be separated from the inner side surface of the opening 4 a. In the LED module 1 of the third modification, it is preferable that the surface of the pedestal 4 e opposite to the mounting portion 32 be on a plane including the other surface 4 c of the resin portion 4. Thereby, the LED module 1 is irradiated with light emitted from the side surface of the LED chip 2 and incident on the other surface 4 c of the resin portion 4 and absorbed by the resin portion 4 or reflected by the inner side surface of the opening 4 a in the resin portion 4 It is possible to further reduce the amount of emitted light, and to achieve higher output of light. The planar shape of the pedestal portion 4a is a rectangular shape, but is not limited thereto. For example, it may be a polygonal shape other than a rectangular shape, a circular shape, an elliptical shape, or the like.
　第３変形例のＬＥＤモジュール１では、ＬＥＤチップ２が、樹脂部４の台座部４ｅ上に接合部７を介して接合されていることにより、ＬＥＤチップ２の側面から放射される光をより効率よく取り出すことが可能となり、全光束量を向上させることが可能となる。また、第３変形例のＬＥＤモジュール１は、リードフレーム基板３の平面形状を特に限定するものではなく、リードフレーム基板３として、例えば、図１０、１１に示すようなリードフレーム基板３、図１２に示すようなリードフレーム基板３、図１３、１４に示すようなリードフレーム基板３を適用してもよい。 In the LED module 1 according to the third modification, the LED chip 2 is joined to the pedestal 4 e of the resin portion 4 via the joint portion 7 so that the light emitted from the side surface of the LED chip 2 is more efficient It becomes possible to take out well and to improve the total luminous flux amount. Further, the LED module 1 of the third modification does not particularly limit the planar shape of the lead frame substrate 3, and as the lead frame substrate 3, for example, the lead frame substrate 3 as shown in FIGS. A lead frame substrate 3 as shown in FIG. 13 and a lead frame substrate 3 as shown in FIGS. 13 and 14 may be applied.
　以下では、本実施形態のＬＥＤモジュール１の第４変形例について図１８に基づいて説明する。 Below, the 4th modification of the LED module 1 of this embodiment is demonstrated based on FIG.
　第４変形例のＬＥＤモジュール１は、絶縁基板５の形状が実施形態１のＬＥＤモジュール１と相違する。なお、実施形態１と同様の構成要素については、同様の符号を付して説明を省略する。 The LED module 1 of the fourth modification differs from the LED module 1 of the first embodiment in the shape of the insulating substrate 5. In addition, about the component similar to Embodiment 1, the same code | symbol is attached | subjected and description is abbreviate | omitted.
　実施形態１のＬＥＤモジュール１では、絶縁基板５が樹脂部４の一面４ｂ側だけでなく、第１方向に沿った樹脂部４の両側面４ｄ、４ｄも覆う形状に形成されている。これに対して、第４変形例のＬＥＤモジュール１では、絶縁基板５が、長尺の平板状の形状に形成されており、樹脂部４の厚み方向において複数の実装部３２側とは反対の一面４ｂにのみ接合されている。また、リードフレーム基板３は、連結部３４の第１方向に直交する断面での形状がＬ字状であり、各連結部３４の一部および各桟部３３が絶縁基板５に埋設されている。ここで、連結部３４は、樹脂部４の厚み方向に沿って樹脂部４と絶縁基板５とに跨るように配置される第１部分３４ａと、絶縁基板５の幅方向（図１８の左右方向）に沿って絶縁基板５に埋設されている第２部分３４ｂと、を備えている。連結部３４の第２部分３４ｂおよび桟部３３は、絶縁基板５の厚み方向の中間に配置されている。連結部３４の第１部分３４ａおよび第２部分それぞれの断面形状は、直線状の形状に限らない。 In the LED module 1 according to the first embodiment, the insulating substrate 5 is formed to cover not only the one surface 4 b of the resin portion 4 but also both side surfaces 4 d and 4 d of the resin portion 4 along the first direction. On the other hand, in the LED module 1 of the fourth modification, the insulating substrate 5 is formed in the shape of a long flat plate, and is opposite to the plurality of mounting portions 32 in the thickness direction of the resin portion 4 It is joined only to one side 4b. Further, the lead frame substrate 3 is L-shaped in a cross section orthogonal to the first direction of the connecting portion 34, and a part of each connecting portion 34 and each rail 33 are embedded in the insulating substrate 5. . Here, the connecting portion 34 is a first portion 34 a disposed so as to straddle the resin portion 4 and the insulating substrate 5 along the thickness direction of the resin portion 4, and the width direction of the insulating substrate 5 (horizontal direction in FIG. And a second portion 34b embedded in the insulating substrate 5). The second portion 34 b of the connecting portion 34 and the bar 33 are disposed at the middle in the thickness direction of the insulating substrate 5. The cross-sectional shape of each of the first portion 34 a and the second portion of the connecting portion 34 is not limited to the linear shape.
　第４変形例のＬＥＤモジュール１では、実施形態１のＬＥＤモジュール１に比べて、絶縁基板５の厚み寸法を小さくできるので、放熱性を向上させることが可能となる。第４変形例のＬＥＤモジュール１は、第１変形例のＬＥＤモジュール１のサブマウント部材１５を備えた構成としてもよい。 In the LED module 1 of the fourth modification, the thickness dimension of the insulating substrate 5 can be made smaller than that of the LED module 1 of the first embodiment, so that the heat dissipation can be improved. The LED module 1 of the fourth modification may be configured to include the sub mount member 15 of the LED module 1 of the first modification.
　以下では、本実施形態のＬＥＤモジュール１の第５変形例について図１９に基づいて説明する。 Below, the 5th modification of the LED module 1 of this embodiment is demonstrated based on FIG.
　第５変形例のＬＥＤモジュール１は、リードフレーム基板３の各連結部３４および各桟部３３が樹脂部４に埋設されている点が第２変形例のＬＥＤモジュール１と相違する。なお、第２変形例と同様の構成要素については、同様の符号を付して説明を省略する。 The LED module 1 according to the fifth modification is different from the LED module 1 according to the second modification in that the connection portions 34 and the crosspieces 33 of the lead frame substrate 3 are embedded in the resin portion 4. In addition, about the component similar to a 2nd modification, the same code | symbol is attached | subjected and description is abbreviate | omitted.
　第５変形例のＬＥＤモジュール１では、第２変形例のＬＥＤモジュール１に比べて、絶縁性（電気絶縁性）を向上させることが可能となる。第５変形例のＬＥＤモジュール１は、第１変形例のＬＥＤモジュール１のサブマウント部材１５を備えた構成としてもよい。また、第５変形例のＬＥＤモジュール１は、リードフレーム基板３の平面形状を特に限定するものではなく、リードフレーム基板３として、例えば、図１０、１１に示すようなリードフレーム基板３、図１２に示すようなリードフレーム基板３、図１３、１４に示すようなリードフレーム基板３を適用してもよい。 In the LED module 1 of the fifth modification, it is possible to improve the insulation (electrical insulation) as compared to the LED module 1 of the second modification. The LED module 1 of the fifth modification may be configured to include the sub mount member 15 of the LED module 1 of the first modification. Further, the LED module 1 of the fifth modification does not particularly limit the planar shape of the lead frame substrate 3, and as the lead frame substrate 3, for example, the lead frame substrate 3 as shown in FIGS. A lead frame substrate 3 as shown in FIG. 13 and a lead frame substrate 3 as shown in FIGS. 13 and 14 may be applied.
　以下では、本実施形態のＬＥＤモジュール１の第６変形例について図２０に基づいて説明する。 Below, the 6th modification of the LED module 1 of this embodiment is demonstrated based on FIG.
　第６変形例のＬＥＤモジュール１は、樹脂部４の一部からなる台座部４ｅがダイパッド３２ａ上に形成されており、ＬＥＤチップ２が、樹脂部４の台座部４ｅ上に接合部７を介して接合されている点が第５変形例のＬＥＤモジュール１と相違する。なお、第５変形例と同様の構成要素については、同様の符号を付して説明を省略する。 In the LED module 1 according to the sixth modification, a pedestal 4e formed of a part of the resin portion 4 is formed on the die pad 32a, and the LED chip 2 is formed on the pedestal 4e of the resin 4 via the bonding portion 7 Is different from the LED module 1 of the fifth modification in that In addition, about the component similar to a 5th modification, the same code | symbol is attached | subjected and description is abbreviate | omitted.
　第６変形例のＬＥＤモジュール１は、台座部４ｅが、樹脂部４の開口部４ａ内において、開口部４ａの内側面から離れて形成されている。第６変形例のＬＥＤモジュール１は、台座部４ｅにおける実装部３２側とは反対側の表面が、樹脂部４の他面４ｃを含む平面上にあるのが好ましい。これにより、ＬＥＤモジュール１は、ＬＥＤチップ２の側面から放射されて樹脂部４の他面４ｃに入射して樹脂部４に吸収される光や、樹脂部４における開口部４ａの内側面で反射される光を、より低減することが可能となり、光出力のより一層の高出力化を図ることが可能となる。台座部４ａの平面形状は、矩形状としてあるが、これに限らず、例えば、矩形以外の多角形状、円形状、楕円形状などでもよい。 In the LED module 1 of the sixth modification, a pedestal 4 e is formed in the opening 4 a of the resin portion 4 so as to be separated from the inner side surface of the opening 4 a. In the LED module 1 according to the sixth modification, it is preferable that the surface of the pedestal 4 e opposite to the mounting portion 32 be on a plane including the other surface 4 c of the resin portion 4. Thereby, the LED module 1 is irradiated with light emitted from the side surface of the LED chip 2 and incident on the other surface 4 c of the resin portion 4 and absorbed by the resin portion 4 or reflected by the inner side surface of the opening 4 a in the resin portion 4 It is possible to further reduce the amount of emitted light, and to achieve higher output of light. The planar shape of the pedestal portion 4a is a rectangular shape, but is not limited thereto. For example, it may be a polygonal shape other than a rectangular shape, a circular shape, an elliptical shape, or the like.
　第６変形例のＬＥＤモジュール１では、ＬＥＤチップ２が、樹脂部４の台座部４ｅ上に接合部７を介して接合されていることにより、ＬＥＤチップ２の側面から放射される光をより効率よく取り出すことが可能となり、全光束量を向上させることが可能となる。第６変形例のＬＥＤモジュール１は、リードフレーム基板３の平面形状を特に限定するものではなく、リードフレーム基板３として、例えば、図１０、１１に示すようなリードフレーム基板３、図１２に示すようなリードフレーム基板３、図１３、１４に示すようなリードフレーム基板３を適用してもよい。 In the LED module 1 of the sixth modification, the LED chip 2 is joined to the pedestal 4 e of the resin portion 4 via the joint portion 7, so that the light emitted from the side surface of the LED chip 2 is more efficient It becomes possible to take out well and to improve the total luminous flux amount. The LED module 1 of the sixth modification does not particularly limit the planar shape of the lead frame substrate 3, and as the lead frame substrate 3, for example, the lead frame substrate 3 as shown in FIG. Such a lead frame substrate 3 and a lead frame substrate 3 as shown in FIGS. 13 and 14 may be applied.
　（実施形態２）
　以下では、本実施形態の照明器具５０について図２１、２２に基づいて説明する。 Second Embodiment
Below, the lighting fixture 50 of this embodiment is demonstrated based on FIG.
　本実施形態の照明器具５０は、ＬＥＤ照明器具であり、器具本体５１と、器具本体５１に保持された光源であるＬＥＤモジュール１と、を備えている。 The lighting fixture 50 of the present embodiment is an LED lighting fixture, and includes a fixture main body 51 and an LED module 1 which is a light source held by the fixture main body 51.
　器具本体５１は、ＬＥＤモジュールよりも平面サイズの大きな長尺状（ここでは、矩形板状）に形成されている。器具本体５１は、この器具本体５１の厚み方向の一表面５１ｂ側にＬＥＤモジュール１が配置されている。照明器具５０は、ＬＥＤモジュール１の長手方向（リードフレーム基板３１の第１方向）と器具本体５１の長手方向とが揃うように、器具本体５１に対してＬＥＤモジュール１が配置されている。要するに、照明器具５０は、リードフレーム基板３１の第１方向が器具本体５１の長手方向と揃っている。また、照明器具５０は、器具本体５１の上記一表面５１ｂ側に、ＬＥＤモジュール１を覆いＬＥＤモジュール１から放射された光を透過させるカバー５２が配置されている。 The fixture body 51 is formed in a long shape (here, a rectangular plate shape) larger in plane size than the LED module. The LED module 1 is disposed on the surface 51 b of the device body 51 in the thickness direction of the device body 51. In the luminaire 50, the LED module 1 is disposed with respect to the instrument body 51 such that the longitudinal direction of the LED module 1 (the first direction of the lead frame substrate 31) and the longitudinal direction of the instrument body 51 are aligned. In short, in the lighting device 50, the first direction of the lead frame substrate 31 is aligned with the longitudinal direction of the device body 51. Further, in the lighting device 50, a cover 52 that covers the LED module 1 and transmits light emitted from the LED module 1 is disposed on the side of the one surface 51 b of the device body 51.
　また、照明器具５０は、ＬＥＤモジュール１へ直流電力を供給して各ＬＥＤチップ２を点灯（発光）させる点灯装置５３を備えている。照明器具５０は、点灯装置５３とＬＥＤモジュール１とが、リード線などの電線５４を介して電気的に接続されている。 Moreover, the lighting fixture 50 is equipped with the lighting device 53 which supplies DC power to the LED module 1 and lights (emits) each LED chip 2. In the lighting device 50, the lighting device 53 and the LED module 1 are electrically connected via a wire 54 such as a lead wire.
　器具本体５１は、この器具本体５１の厚み方向の他表面５１ｃ側に、点灯装置５３を収納する凹所５１ａが、器具本体５１の長手方向に沿って形成されている。また、器具本体５１には、一表面５１ｂと凹所５１ａの内底面との間の薄肉部を貫通し電線５４が挿通される貫通孔（図示せず）が形成されている。 A recess 51 a for housing the lighting device 53 is formed along the longitudinal direction of the tool body 51 on the other surface 51 c side of the tool body 51 in the thickness direction of the tool body 51. Moreover, the through-hole (not shown) which penetrates the thin part between the one surface 51b and the inner bottom face of the recess 51a, and the electric wire 54 is penetrated is formed in the instrument main body 51. As shown in FIG.
　ＬＥＤモジュール１は、リードフレーム基板３の第１方向の両端部が露出しており、この露出した部位において電線５４を接続することが可能となっている。リードフレーム基板３と電線５４との接続部は、例えば、半田などの導電性接合材からなる接続部や、雄型のコネクタと雌型のコネクタとからなる接続部などを採用することができる。 In the LED module 1, both end portions of the lead frame substrate 3 in the first direction are exposed, and it is possible to connect the electric wires 54 at the exposed portion. For example, a connection portion made of a conductive bonding material such as solder, a connection portion made of a male connector and a female connector, or the like can be adopted as a connection portion between the lead frame substrate 3 and the electric wire 54.
　照明器具５０は、点灯装置５３からＬＥＤモジュール１へ直流電力を供給してＬＥＤモジュール１を点灯させることができる。なお、点灯装置５３は、例えば、商用電源のような交流電源から電力供給される構成のものでもよいし、太陽電池や蓄電池などの直流電源から電力供給される構成のものでもよい。 The lighting fixture 50 can supply DC power from the lighting device 53 to the LED module 1 to light the LED module 1. For example, the lighting device 53 may be configured to be supplied with power from an AC power supply such as a commercial power supply, or may be configured to be supplied with power from a DC power supply such as a solar cell or a storage battery.
　本実施形態の照明器具５０は、光源として、実施形態１のＬＥＤモジュール１の第２変形例を採用している。光源は、実施形態１のＬＥＤモジュール１の第２変形例に限らず、実施形態１のＬＥＤモジュール１や、実施形態１のＬＥＤモジュール１の第１変形例、第３変形例、第４変形例、第５変形例および第６変形例のいずれかのＬＥＤモジュール１でもよい。 The lighting fixture 50 of the present embodiment employs a second modification of the LED module 1 of the first embodiment as a light source. The light source is not limited to the second modification of the LED module 1 of the first embodiment, and the LED module 1 of the first embodiment and the first modification, the third modification, and the fourth modification of the LED module 1 of the first embodiment. The LED module 1 according to any of the fifth and sixth modifications may be used.
　器具本体５１の材料としては、熱伝導率の高い材料が好ましく、絶縁基板５よりも熱伝導率の高い材料がより好ましい。ここで、器具本体５１の材料としては、アルミニウム、銅などの熱伝導率の高い金属を採用することが好ましい。 As a material of the instrument body 51, a material having a high thermal conductivity is preferable, and a material having a thermal conductivity higher than that of the insulating substrate 5 is more preferable. Here, as a material of the instrument main body 51, it is preferable to use a metal having a high thermal conductivity such as aluminum, copper or the like.
　器具本体５１へのＬＥＤモジュール１の取り付け手段としては、例えば、螺子などの取付具を採用してもよいし、熱硬化型のシート状接着剤のエポキシ樹脂層を器具本体５１とＬＥＤモジュール１との間に介在させて接合してもよい。シート状接着剤としては、シリカやアルミナなどのフィラーからなる充填材を含有し且つ加熱時に低粘度化するとともに流動性が高くなる性質を有するＢステージのエポキシ樹脂層（熱硬化性樹脂）とプラスチックフィルム（ＰＥＴフィルム）とが積層されたシート状接着剤を用いることができる。このようなシート状接着剤としては、例えば、東レ株式会社製の接着剤シートＴＳＡなどがある。フィラーとしては、熱硬化性樹脂であるエポキシ樹脂よりも熱伝導率の高い電気絶縁性材料を用いればよい。上述のエポキシ樹脂層の厚みは、１００μｍに設定してあるが、この値は一例であり、特に限定するものではなく、例えば、５０μｍ～１５０μｍ程度の範囲で適宜設定すればよい。上述のエポキシ樹脂層の熱伝導率は、４Ｗ／ｍ・Ｋ以上であることが好ましい。 As a means for attaching the LED module 1 to the instrument body 51, for example, a fixture such as a screw may be adopted, or an epoxy resin layer of a thermosetting sheet-like adhesive can be used together with the instrument body 51 and the LED module 1 May be interposed between the two. The sheet-like adhesive contains a filler made of a filler such as silica and alumina, and has a B-stage epoxy resin layer (thermosetting resin) and plastic that have a property of lowering viscosity and increasing flowability during heating A sheet-like adhesive in which a film (PET film) is laminated can be used. As such a sheet-like adhesive, there is, for example, an adhesive sheet TSA manufactured by Toray Industries, Inc., and the like. As the filler, an electrically insulating material having a thermal conductivity higher than that of an epoxy resin which is a thermosetting resin may be used. The thickness of the above-mentioned epoxy resin layer is set to 100 μm, but this value is an example and is not particularly limited. For example, it may be appropriately set in the range of about 50 μm to 150 μm. The thermal conductivity of the above-mentioned epoxy resin layer is preferably 4 W / m · K or more.
　上述のシート状接着剤のエポキシ樹脂層は、電気絶縁性を有するとともに熱伝導率が高く加熱時の流動性が高く凹凸面への密着性が高いという性質を有している。したがって、照明器具５０は、上述のエポキシ樹脂層から形成される絶縁層とＬＥＤモジュール１および器具本体５１との間に空隙が発生するのを防止することができて密着信頼性を向上させることが可能となり、また、密着不足による熱抵抗の増大やばらつきの発生を抑制することが可能となる。絶縁層は、電気絶縁性および熱伝導性を有し、ＬＥＤモジュール１と器具本体５１とを熱結合する機能を有している。 The epoxy resin layer of the sheet-like adhesive described above has properties such as electrical insulation, high thermal conductivity, high fluidity at the time of heating, and high adhesion to an uneven surface. Therefore, the lighting fixture 50 can prevent the occurrence of a space between the insulating layer formed of the above-described epoxy resin layer and the LED module 1 and the fixture main body 51, thereby improving the adhesion reliability. It becomes possible, and it becomes possible to control increase of thermal resistance and the generation of variation by lack of adhesion. The insulating layer has electrical insulation and thermal conductivity, and has a function of thermally coupling the LED module 1 and the fixture body 51.
　しかして、照明器具５０は、ＬＥＤモジュール１と器具本体５１との間に例えばサーコン（登録商標）のようなゴムシート状やシリコーンゲル状の放熱シート（熱伝導シート）などを挟む場合に比べて、各ＬＥＤチップ２から器具本体５１までの熱抵抗を低減することが可能となるとともに、熱抵抗のばらつきを低減することが可能となる。これにより、照明器具５０は、放熱性が向上し、各ＬＥＤチップ２のジャンクション温度の温度上昇を抑制することが可能となるから、入力電力を大きくすることが可能となり、光出力の高出力化を図ることが可能となる。上述のエポキシ樹脂層の厚みは、１００μｍに設定してあるが、この値は一例であり、特に限定するものではなく、例えば、５０μｍ～１５０μｍ程度の範囲で適宜設定すればよい。なお、上述のエポキシ樹脂層の熱伝導率は、４Ｗ／ｍ・Ｋ以上であることが好ましい。 Thus, compared to the case where a heat-radiating sheet (heat conductive sheet) such as a rubber sheet or silicone gel, such as, for example, a circuit board (trademark), is sandwiched between the LED module 1 and the instrument body 51. While being able to reduce the thermal resistance from each LED chip 2 to the instrument main body 51, it becomes possible to reduce the variation in thermal resistance. Thereby, since the lighting fixture 50 can improve heat dissipation and can suppress the temperature rise of the junction temperature of each LED chip 2, the input power can be increased, and the light output can be increased. It is possible to The thickness of the above-mentioned epoxy resin layer is set to 100 μm, but this value is an example and is not particularly limited. For example, it may be appropriately set in the range of about 50 μm to 150 μm. In addition, it is preferable that the heat conductivity of the above-mentioned epoxy resin layer is 4 W / m * K or more.
　カバー５２の材料としては、例えば、アクリル樹脂、ポリカーボネート樹脂、シリコーン樹脂、ガラスなどを採用することができる。 As a material of the cover 52, for example, acrylic resin, polycarbonate resin, silicone resin, glass or the like can be adopted.
　カバー５２は、ＬＥＤモジュール１から放射された光の配光を制御するレンズ部（図示せず）を一体に備えている。カバー５２と別体のレンズをカバー５２に取り付けた構成に比べて、低コスト化を図ることが可能となる。 The cover 52 integrally includes a lens unit (not shown) that controls light distribution of light emitted from the LED module 1. Compared to the configuration in which the lens separate from the cover 52 is attached to the cover 52, cost reduction can be achieved.
　以上説明した本実施形態の照明器具５０では、光源として上述のＬＥＤモジュール１を備えていることにより、低コスト化および光出力の高出力化を図ることが可能となる。 In the lighting fixture 50 of the present embodiment described above, by including the above-described LED module 1 as a light source, it is possible to achieve cost reduction and high output of light output.
　照明器具５０は、器具本体５１の材料を金属とすることにより、放熱性を向上させることが可能となる。この場合、絶縁基板５の厚み寸法および幅寸法は、ＬＥＤモジュール１のリードフレーム基板３と器具本体５１との間の沿面距離が規定の沿面距離（例えば、５ｍｍ以上）を満足するように適宜設定すればよい。 The luminaire 50 can improve heat dissipation by making the material of the luminaire main body 51 metal. In this case, the thickness dimension and width dimension of the insulating substrate 5 are appropriately set such that the creeping distance between the lead frame substrate 3 of the LED module 1 and the fixture body 51 satisfies a prescribed creeping distance (for example, 5 mm or more) do it.
　（実施形態３）
　以下では、本実施形態の直管形ＬＥＤランプ６０について図２３に基づいて説明する。 (Embodiment 3)
Below, the straight tube | pipe type LED lamp 60 of this embodiment is demonstrated based on FIG.
　直管形ＬＥＤランプ６０は、透光性材料により形成された直管状（円筒状）の管本体６１と、管本体６１の長手方向の一端部、他端部それぞれに設けられた第１口金６２、第２口金６３と、を備え、管本体６１内に実施形態１のＬＥＤモジュール１の第２変形例のＬＥＤモジュール１が収納されている。ＬＥＤモジュール１は、実施形態１のＬＥＤモジュール１の第２変形例に限らず、実施形態１のＬＥＤモジュール１や、実施形態１のＬＥＤモジュール１の第１変形例、第３変形例、第４変形例、第５変形例および第６変形例のいずれかのＬＥＤモジュール１でもよい。なお、一般的な直管形ＬＥＤランプについては、例えば、社団法人日本電球工業会により、「Ｌ型ピン口金ＧＸ１６ｔ－５付直管形ＬＥＤランプシステム（一般照明用）」（ＪＥＬ　８０１：２０１０）が規格化されている。 The straight tube type LED lamp 60 has a straight tube (cylindrical) tube main body 61 formed of a translucent material, and a first mouthpiece 62 provided at each of one end and the other end of the tube main body 61 in the longitudinal direction. , And a second base 63, and the LED module 1 of the second modified example of the LED module 1 of the first embodiment is housed in the tube main body 61. The LED module 1 is not limited to the second modification of the LED module 1 of the first embodiment, and the LED module 1 of the first embodiment and the first modification, the third modification, and the fourth of the LED module 1 of the first embodiment. The LED module 1 of any of the fifth modification and the sixth modification may be used. In addition, about a general straight tube | pipe type LED lamp, for example, "The straight tube | pipe type LED lamp system (for general lighting) with L-shaped pin cap GX16t-5" (for general lighting) by the Japan Light Bulb Industry Association (JEL 801: 2010) Is standardized.
　管本体６１の材料としては、例えば、透明なガラス、乳白色のガラス、透明な樹脂、乳白色の樹脂などを採用することができる。 As a material of the tube main body 61, for example, transparent glass, milky white glass, transparent resin, milky white resin or the like can be adopted.
　第１口金６２には、ＬＥＤモジュール１に電気的に接続された２本の給電端子（以下、「第１ランプピン」という。）６４，６４が設けられている。これら２本の第１ランプピン６４，６４は、照明器具の器具本体に保持された給電用のランプソケットの２つの給電用接触子それぞれに電気的に接続可能である。 The first cap 62 is provided with two feed terminals (hereinafter referred to as “first lamp pins”) 64 and 64 electrically connected to the LED module 1. The two first lamp pins 64 are electrically connectable to the two power supply contacts of the lamp socket for power supply held by the fixture body of the lighting fixture.
　第２口金６３には、アース用の１本の接地端子（以下、「第２ランプピン」という。）６５が設けられている。この１本の第２ランプピン６５は、器具本体に保持された接地用のランプソケットの接地用接触子に電気的に接続可能である。 The second base 63 is provided with a single ground terminal (hereinafter referred to as “second lamp pin”) 65 for grounding. The one second lamp pin 65 can be electrically connected to the grounding contact of the grounding lamp socket held by the instrument body.
　各第１ランプピン６４の各々は、Ｌ字状に形成されており、管本体６１の長手方向に沿って突出したピン本体６４ａと、ピン本体６４ａの先端部から管本体６１の１つの径方向に沿って延設された鍵部６４ｂとで構成されている。２つの鍵部６４ｂは、互いに離れる向きに延設されている。なお、各第１ランプピン６４は、細長の金属板を折曲することにより形成されている。 Each of the first lamp pins 64 is formed in an L shape, and extends in the radial direction of the tube main body 61 from the pin main body 64a projecting along the longitudinal direction of the tube main body 61 and the tip of the pin main body 64a. It comprises the key part 64b extended along. The two key portions 64 b extend away from each other. Each first lamp pin 64 is formed by bending an elongated metal plate.
　第２ランプピン６５は、第２口金６３の端面（口金基準面）から管本体６１とは反対側へ突出している。また、第２ランプピン６５は、Ｔ字状に形成されている。なお、直管形ＬＥＤランプ６０は、例えば、社団法人日本電球工業会により規格化されている「Ｌ型ピン口金ＧＸ１６ｔ－５付直管形ＬＥＤランプシステム（一般照明用）」（ＪＥＬ　８０１：２０１０）の規格などを満たすように構成されていることが好ましい。 The second lamp pin 65 protrudes from the end face (base reference surface) of the second base 63 to the opposite side to the tube main body 61. In addition, the second lamp pin 65 is formed in a T-shape. The straight tube type LED lamp 60 is, for example, a “straight tube type LED lamp system with L-shaped pin cap GX16t-5 (for general lighting)” standardized by the Japan Light Bulb Industry Association (JEL 801: 2010 It is preferable to be configured to satisfy the standard of.
　以上説明した本実施形態の直管形ＬＥＤランプ６０では、管本体６１内に上述のＬＥＤモジュール１を備えていることにより、低コスト化および光出力の高出力化を図ることが可能となる。 In the straight tube type LED lamp 60 of the present embodiment described above, by providing the above-described LED module 1 in the tube main body 61, it is possible to achieve cost reduction and high output of light output.

Claims (14)

  1. 　各々がＬＥＤチップを実装する複数の実装部が第１方向に並んで配置されたリードフレーム基板と、前記リードフレーム基板の一部が埋設され且つ前記複数の実装部を露出させた樹脂部と、前記複数の実装部の各々に実装された前記ＬＥＤチップと、前記樹脂部の厚み方向において前記複数の実装部側とは反対の一面側に配置されて前記樹脂部を支持し前記第１方向を長手方向とする長尺状の絶縁基板と、を備え、前記リードフレーム基板は、前記複数の実装部を含み且つ前記複数の実装部のうち前記第１方向において隣り合う実装部間の電気的な接続関係を規定する回路パターン部と、前記厚み方向に直交し且つ前記第１方向に直交する第２方向において前記回路パターン部の両側それぞれに配置された複数の桟部と、前記複数の実装部と前記複数の桟部のいずれかとを繋いでいる複数の連結部と、を備えてなることを特徴とするＬＥＤモジュール。 A lead frame substrate on which a plurality of mounting portions each mounting an LED chip are arranged in a first direction, and a resin portion in which a part of the lead frame substrate is embedded and the plurality of mounting portions are exposed; The LED chip mounted on each of the plurality of mounting portions, and the resin portion is disposed on one surface side opposite to the plurality of mounting portion sides in the thickness direction of the resin portion to support the resin portion and the first direction A long insulating substrate in a longitudinal direction, and the lead frame substrate includes the plurality of mounting portions and is electrically connected between the mounting portions adjacent in the first direction among the plurality of mounting portions. A circuit pattern portion defining a connection relationship, a plurality of cross portions disposed on both sides of the circuit pattern portion in a second direction orthogonal to the thickness direction and orthogonal to the first direction, and the plurality of mounting portions LED module characterized in that it comprises a plurality of connecting portions that connect and either said plurality of crosspieces.
  2. 　前記複数の桟部は、前記絶縁基板に埋設されてなることを特徴とする請求項１記載のＬＥＤモジュール。 The LED module according to claim 1, wherein the plurality of crosspieces are embedded in the insulating substrate.
  3. 　前記絶縁基板の熱伝導率が、前記樹脂部の熱伝導率以上であることを特徴とする請求項１又は２記載のＬＥＤモジュール。 The heat conductivity of the said insulated substrate is more than the heat conductivity of the said resin part, The LED module of Claim 1 or 2 characterized by the above-mentioned.
  4. 　前記複数の実装部の各々は、前記ＬＥＤチップが搭載されるダイパッドと、前記ダイパッドに連続し前記ＬＥＤチップの第１電極が第１ワイヤを介して電気的に接続される第１リードと、前記第２方向において前記ダイパッドに対向し前記ＬＥＤチップの第２電極が第２ワイヤを介して電気的に接続される第２リードと、を備え、前記複数の実装部のうち前記第１方向において隣り合う実装部同士では、前記第２方向における前記第１リード、前記ダイパッドおよび前記第２リードの並びが逆であることを特徴とする請求項１乃至３のいずれか１項に記載のＬＥＤモジュール。 Each of the plurality of mounting parts is a die pad on which the LED chip is mounted, a first lead which is continuous with the die pad, and in which a first electrode of the LED chip is electrically connected through a first wire; And a second lead facing the die pad in a second direction, the second electrode of the LED chip being electrically connected via a second wire, and the plurality of mounting portions are adjacent in the first direction. The LED module according to any one of claims 1 to 3, wherein the arrangement of the first lead, the die pad, and the second lead in the second direction is reversed in the mounting portions that match each other.
  5. 　前記絶縁基板と前記樹脂部とは別体であることを特徴とする請求項１乃至４のいずれか１項に記載のＬＥＤモジュール。 The said insulated substrate and the said resin part are separate bodies, The LED module of any one of the Claims 1 thru | or 4 characterized by the above-mentioned.
  6. 　前記回路パターン部は、前記第１方向において隣り合う前記実装部間を繋いでいる電気接続部の側縁に、前記第２方向の一端側が開放された切込溝が形成されてなることを特徴とする請求項１乃至５のいずれか１項に記載のＬＥＤモジュール。 The circuit pattern portion is characterized in that a cut groove having one end side in the second direction opened is formed at a side edge of an electrical connection portion connecting the mounting portions adjacent in the first direction. The LED module according to any one of claims 1 to 5, wherein
  7. 　前記リードフレーム基板および前記樹脂部は、前記ＬＥＤチップから放射される光を反射する反射部材を兼ねることを特徴とする請求項１乃至６のいずれか１項に記載のＬＥＤモジュール。 The LED module according to any one of claims 1 to 6, wherein the lead frame substrate and the resin portion also serve as a reflecting member that reflects the light emitted from the LED chip.
  8. 　前記回路パターン部は、それぞれ所望数の前記ＬＥＤチップを直列接続した直列回路同士を並列接続可能に形成されていることを特徴とする請求項１乃至７のいずれか１項に記載のＬＥＤモジュール。 The LED module according to any one of claims 1 to 7, wherein the circuit pattern portion is formed so that serial circuits in which a desired number of the LED chips are connected in series can be connected in parallel.
  9. 　各々がＬＥＤチップを実装する複数の実装部が第１方向に並んで配置されたリードフレーム基板と、前記リードフレーム基板の一部が埋設され且つ前記複数の実装部を露出させた樹脂部と、前記複数の実装部の各々に実装された前記ＬＥＤチップと、前記樹脂部の厚み方向において前記複数の実装部側とは反対の一面側に配置されて前記樹脂部を支持し前記第１方向を長手方向とする長尺状の絶縁基板と、を備え、前記リードフレーム基板は、前記複数の実装部を含み且つ前記複数の実装部のうち前記第１方向において隣り合う実装部間の電気的な接続関係を規定する回路パターン部と、前記厚み方向に直交し且つ前記第１方向に直交する第２方向において前記回路パターン部の両側それぞれに配置された複数の桟部と、前記複数の実装部と前記複数の桟部のいずれかとを繋いでいる複数の連結部と、を備えるＬＥＤモジュールの製造方法であって、金属フープ材に対してプレスによる打ち抜き加工を施すことにより前記リードフレーム基板を形成する第１工程と、前記第１工程の後でインサート成形法によって、前記リードフレーム基板の一部が埋設された前記樹脂部を成形する第２工程と、を備え、前記第２工程の後で、前記複数の実装部の各々に前記ＬＥＤチップを実装し、且つ、前記樹脂部を支持するように前記絶縁基板を設けることを特徴とするＬＥＤモジュールの製造方法。 A lead frame substrate on which a plurality of mounting portions each mounting an LED chip are arranged in a first direction, and a resin portion in which a part of the lead frame substrate is embedded and the plurality of mounting portions are exposed; The LED chip mounted on each of the plurality of mounting portions, and the resin portion is disposed on one surface side opposite to the plurality of mounting portion sides in the thickness direction of the resin portion to support the resin portion and the first direction A long insulating substrate in a longitudinal direction, and the lead frame substrate includes the plurality of mounting portions and is electrically connected between the mounting portions adjacent in the first direction among the plurality of mounting portions. A circuit pattern portion defining a connection relationship, a plurality of cross portions disposed on both sides of the circuit pattern portion in a second direction orthogonal to the thickness direction and orthogonal to the first direction, and the plurality of mounting portions It is a manufacturing method of a LED module provided with a plurality of connecting parts which connect with either of a plurality of crosspieces, and it forms the above-mentioned lead frame board by giving punching processing to a metal hoop material by a press. A first step; and a second step of forming the resin portion in which a portion of the lead frame substrate is embedded by an insert molding method after the first step, and after the second step, A method of manufacturing an LED module, comprising: mounting the LED chip on each of the plurality of mounting portions; and providing the insulating substrate to support the resin portion.
  10. 　前記第２工程の後に、前記複数の実装部の各々に前記ＬＥＤチップを実装し、その後に前記樹脂部を支持するように前記絶縁基板を設けることを特徴とする請求項９記載のＬＥＤモジュールの製造方法。 10. The LED module according to claim 9, wherein after the second step, the LED chip is mounted on each of the plurality of mounting portions, and then the insulating substrate is provided to support the resin portion. Production method.
  11. 　前記第２工程の後に、前記樹脂部を支持するように前記絶縁基板を設け、その後に前記複数の実装部の各々に前記ＬＥＤチップを実装することを特徴とする請求項９記載のＬＥＤモジュールの製造方法。 10. The LED module according to claim 9, wherein the insulating substrate is provided to support the resin portion after the second step, and then the LED chip is mounted on each of the plurality of mounting portions. Production method.
  12. 　前記第１工程と前記第２工程との間に、前記リードフレーム基板に前記金属フープ材よりも前記ＬＥＤチップから放射される光に対する反射率の高い金属皮膜を形成する工程を備えることを特徴とする請求項１０又は１１記載のＬＥＤモジュールの製造方法。 Between the first step and the second step, there is provided a step of forming on the lead frame substrate a metal film having a higher reflectance to light emitted from the LED chip than the metal hoop material. The manufacturing method of the LED module of Claim 10 or 11.
  13. 　器具本体と、前記器具本体に保持された光源と、を備え、前記光源は、請求項１乃至８のいずれか１項に記載のＬＥＤモジュールからなることを特徴とする照明器具。 A lighting fixture comprising: a fixture body; and a light source held by the fixture body, the light source comprising the LED module according to any one of claims 1 to 8.
  14. 　透光性材料により形成された直管状の管本体と、前記管本体の長手方向の一端部および他端部それぞれに設けられた第１口金、第２口金と、を備え、前記管本体内に請求項１乃至８のいずれか１項に記載のＬＥＤモジュールが収納されてなることを特徴とする直管形ＬＥＤランプ。 A straight tube-shaped tube main body formed of a translucent material, and a first mouthpiece and a second mouthpiece respectively provided at one end and the other end in the longitudinal direction of the tube main body, in the tube main body A straight tube type LED lamp comprising the LED module according to any one of claims 1 to 8 accommodated therein.
PCT/JP2013/002843 2012-05-22 2013-04-26 Led module, manufacturing method for same, illuminating instrument, and straight tube led lamp WO2013175713A1 (en)

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