JPH0715045A - Surface light emission illuminating equipment - Google Patents
Surface light emission illuminating equipmentInfo
- Publication number
- JPH0715045A JPH0715045A JP4144770A JP14477092A JPH0715045A JP H0715045 A JPH0715045 A JP H0715045A JP 4144770 A JP4144770 A JP 4144770A JP 14477092 A JP14477092 A JP 14477092A JP H0715045 A JPH0715045 A JP H0715045A
- Authority
- JP
- Japan
- Prior art keywords
- led
- frames
- light emission
- frame
- shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、計測機器の数値表示、
カーラジオの周波数表示、カメラのガイド表示等の表示
に幅広く用いられる面発光照明装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention
The present invention relates to a surface emitting lighting device that is widely used for frequency display of car radios, guide display of cameras, and the like.
【0002】[0002]
【従来の技術】最近の計測機器、カーラジオ、カメラ等
の各種機器は、小型化や薄型化の傾向に有り、組込まれ
る表示装置としても薄型であることが要求される。一
方、省電力化の要望から表示装置にはLCDが多用され
るが、このLCDは反射光では視認性があまり良くない
ので、バックライトを併用することが多い。2. Description of the Related Art Recently, various devices such as measuring devices, car radios, cameras, etc. have tended to be miniaturized and thinned, and it is required that a display device to be incorporated be thin. On the other hand, although an LCD is often used for a display device in order to save power, the LCD is not so good in visibility with reflected light, so a backlight is often used together.
【0003】この種のバックライトとしては、拡散板の
側面にLEDを配置した構成が薄型化に適している。こ
のように拡散板の側面にLEDを配置した面発光照明装
置は、特開平1−287656号公報に開示されてい
る。For this type of backlight, a structure in which LEDs are arranged on the side surface of a diffusion plate is suitable for thinning. Such a surface emitting lighting device in which LEDs are arranged on the side surface of the diffusion plate is disclosed in Japanese Patent Application Laid-Open No. 1-287656.
【0004】[0004]
【発明が解決しようとする課題】しかしながら、従来公
知の拡散板の側面にLEDを配置した面発光照明装置で
は、拡散板とLEDを離して組立て配置しているため
に、組立て作業に熟練を要し、かつLEDから照射され
る光が洩れるために、同じLEDであっても暗い面発光
照明装置しか得られないという問題点がある。However, in the surface emitting lighting device in which the LED is arranged on the side surface of the conventionally known diffuser plate, the diffuser plate and the LED are separated and assembled, so that a skill is required for the assembling work. In addition, since the light emitted from the LEDs leaks, only the dark surface emitting lighting device can be obtained even with the same LED.
【0005】また、1度組立てた後は分解ができず、従
って発光色を変更することはできないという問題点があ
る。Further, there is a problem in that once assembled, it cannot be disassembled and therefore the emission color cannot be changed.
【0006】本発明は、上記の問題点に鑑みてなされた
もので、組立て作業が容易であり、かつ光が洩れること
がないために明るく、しかも分解再組立てができるので
発光色を変更することができる面発光照明装置を得るこ
とを目的とする。The present invention has been made in view of the above-mentioned problems, and is easy to assemble, is bright because light does not leak, and can be disassembled and reassembled, so that the emission color can be changed. It is an object of the present invention to provide a surface-emitting lighting device capable of
【0007】[0007]
【課題を解決するための手段】この目的を達成するため
に、本発明の面発光照明装置は、LEDと、LEDに電
力を供給するための2以上のフレームと、フレームをモ
ールドによって1体となるように固定する断面がコ字状
またはU字状のモールド部材と、モールド部材に挿嵌さ
れる透明または半透明の表示板を具備するように構成さ
れる。In order to achieve this object, the surface emitting lighting device of the present invention comprises an LED, two or more frames for supplying electric power to the LED, and one frame formed by molding. It is configured so as to include a mold member having a U-shaped cross section to be fixed so as to be transparent, and a transparent or translucent display plate inserted into the mold member.
【0008】また、好ましくは、凸部が形成された2つ
のフレームと、フレームのそれぞれに形成された凸部を
有し、凸部を交互に対向させてフレームを平行に配置す
ると共に、フレームの一方の凸部にLEDを載置し、フ
レームの他方の凸部とLEDの最上層とを結線するよう
に構成される。Further, it is preferable that the frame has two frames having convex portions and convex portions formed on each of the frames, the convex portions are alternately opposed to each other, and the frames are arranged in parallel. The LED is mounted on one of the convex portions, and the other convex portion of the frame is connected to the uppermost layer of the LED.
【0009】[0009]
【作用】上記構成の面発光照明装置においては、断面コ
字状のモールド部材でフレームが1体となるように固定
されるので、組立て作業が素手で容易にできる。また、
この断面コ字状のモールド部材がLEDから発光された
光の洩れを防止するので発光面が明るい。更に、接着剤
等は使用せずに断面コ字状部に挿嵌しているだけなの
で、組立て後に分解再組立てができ、これにより発光色
(LED)を変更することができる。In the surface emitting illuminator having the above-described structure, the frame is fixed by the mold member having a U-shaped cross section so that the frame can be integrated into one body, so that the assembling work can be easily performed with bare hands. Also,
The light emitting surface is bright because the mold member having a U-shaped cross section prevents the light emitted from the LED from leaking. Further, since no adhesive or the like is used and only it is inserted into the U-shaped section, it can be disassembled and reassembled after the assembly, whereby the emission color (LED) can be changed.
【0010】[0010]
【実施例】以下、本発明の実施例を図面に基づいて説明
する。Embodiments of the present invention will be described below with reference to the drawings.
【0011】図1は、本発明による面発光照明装置の一
実施例を示す斜視図である。FIG. 1 is a perspective view showing an embodiment of a surface emitting lighting device according to the present invention.
【0012】図1において、銅等の導電材を素材とする
2つのフレーム1および2が、それぞれに形成されてい
る凸部1aおよび2aを交互に対向させて平行に配置さ
れている。フレーム1の凸部1aにはLED3が載置さ
れており、LED3の最下層は銀エポキシ等の導電性接
着剤によって凸部1aに接続されている。また、LED
3の最上層はボンディングワイヤー4によってフレーム
2の凸部2aに接続されている。In FIG. 1, two frames 1 and 2 made of a conductive material such as copper are arranged in parallel so that the convex portions 1a and 2a formed on them are alternately opposed to each other. The LED 3 is mounted on the convex portion 1a of the frame 1, and the lowermost layer of the LED 3 is connected to the convex portion 1a by a conductive adhesive such as silver epoxy. Also LED
The uppermost layer of 3 is connected to the convex portion 2 a of the frame 2 by the bonding wire 4.
【0013】フレーム1および2は平行を保ったまま、
図2に示すように、横断面がコ字状の底部に位置するよ
うに、モールド部材5によってモールドされる。モール
ドした後は、フレーム1および2が1体となるように固
定されるので、フレーム1および2を1部品として取り
扱うことができる。なお、モールド部材5は、LED3
が発光した光を表示板6側に反射する役割と光の洩れを
防止する役割があるので、白色等の光の反射率の大きい
色で弾性の有る素材が好ましい。While the frames 1 and 2 remain parallel,
As shown in FIG. 2, it is molded by the molding member 5 so that the cross section is located at the bottom of the U-shape. After molding, the frames 1 and 2 are fixed so as to be one body, so that the frames 1 and 2 can be handled as one part. The mold member 5 is the LED 3
Since it has a role of reflecting the light emitted by the side toward the display plate 6 and a role of preventing the leakage of the light, it is preferable to use a material having a color having a large light reflectance such as white and having elasticity.
【0014】その後に、モールド部材5の横断面がコ字
状の部分は、図3に示すように、表示板6に挿嵌されて
組立て作業が行われる。表示板6は、透明または半透明
のアクリル板である。モールド部材5に表示板6を挿嵌
する組立て作業は、素手で行うことができ、また、接着
剤等は使用せずに挿嵌しているだけなので、組立て後に
分解して再度組立て直すことも可能である。After that, as shown in FIG. 3, the portion of the mold member 5 having a U-shaped cross section is inserted into the display plate 6 for assembly work. The display plate 6 is a transparent or translucent acrylic plate. The assembling work for inserting the display plate 6 into the mold member 5 can be performed with bare hands, and since it is simply inserted without using an adhesive or the like, it may be disassembled and then reassembled again after assembly. It is possible.
【0015】図3は、表示板6に上下に2個のモールド
部材5が挿嵌された状態を示している。なお、モールド
部材5は表示板6の上下ではなく、左右の2箇所に挿嵌
することも可能であり、また、上下左右の1〜4箇所に
挿嵌することも可能である。また、複数のモールド部材
5を横方向に並べて、隣接するフレーム1および2を相
互に結線することで、表示板6がモールド部材5よりも
遥かに長い場合にも対応できる。FIG. 3 shows a state in which two mold members 5 are inserted in the upper and lower parts of the display plate 6. It should be noted that the mold member 5 can be inserted into the left and right positions of the display plate 6 instead of the upper and lower positions thereof, or can be inserted into the upper, lower, left and right 1 to 4 positions. Further, by arranging the plurality of molding members 5 in the lateral direction and connecting the adjacent frames 1 and 2 to each other, it is possible to cope with the case where the display plate 6 is much longer than the molding member 5.
【0016】この状態で、フレーム1とフレーム2との
間に、フレーム2が正極となるようにして直流電圧が印
加される。直流電圧が印加されるとLED3の最上層部
が発光し、その光は表示板6に向かって照射され、表示
板6の面全体が発光した状態となる。In this state, a DC voltage is applied between the frame 1 and the frame 2 so that the frame 2 has a positive polarity. When a DC voltage is applied, the uppermost layer of the LED 3 emits light, and the light is emitted toward the display plate 6, and the entire surface of the display plate 6 emits light.
【0017】以上、本発明を実施例により説明したが、
本発明の技術的思想によれば、種々の変形が可能であ
る。例えば、上述した実施例においては、それぞれに形
成されている凸部1aおよび2aを交互に対向させて、
2つのフレーム1および2を平行に配置し、フレーム1
の凸部1aにLED3を載置し、フレーム2の凸部2a
とLED3の最上層とを結線した場合ついて説明した
が、本発明の技術的思想によれば、凸部の無い直線状の
フレームの一方にLEDを載置し、他方のフレームとL
EDの最上層とを結線するようにすることも可能であ
る。The present invention has been described above with reference to the embodiments.
Various modifications are possible according to the technical idea of the present invention. For example, in the above-described embodiment, the convex portions 1a and 2a formed respectively are alternately opposed to each other,
Two frames 1 and 2 are arranged in parallel and frame 1
LED3 is mounted on the convex portion 1a of the
The case where the LED and the uppermost layer of the LED 3 are connected has been described, but according to the technical idea of the present invention, the LED is mounted on one of the linear frames having no convex portion and the other frame is connected to the L frame.
It is also possible to connect to the uppermost layer of the ED.
【0018】また、本発明の技術的思想によれば、モー
ルド部材5の横断面をU字状することも可能である。Further, according to the technical idea of the present invention, it is also possible to make the cross section of the mold member 5 U-shaped.
【0019】[0019]
【発明の効果】以上のように、本発明の面発光照明装置
によれば、断面コ字状のモールド部材でフレームが1体
となるように固定されるので、組立て作業が素手で容易
にできる。また、この断面コ字状のモールド部材がLE
Dから発光された光の洩れを防止するので発光面が明る
い。更に、接着剤等は使用せずに断面コ字状部に挿嵌し
ているだけなので、組立て後に分解再組立てができ、こ
れにより発光色(LED)を変更することが可能とな
る。As described above, according to the surface emitting lighting device of the present invention, the frame is fixed by the mold member having a U-shaped cross section so that the frame can be integrated into one body, and the assembling work can be easily performed with bare hands. . Also, this mold member having a U-shaped cross section is LE
Since the light emitted from D is prevented from leaking, the light emitting surface is bright. Furthermore, since the adhesive or the like is not used and is simply fitted into the U-shaped section, it can be disassembled and reassembled after the assembly, whereby the emission color (LED) can be changed.
【図1】本発明による面発光照明装置の一実施例を示す
斜視図である。FIG. 1 is a perspective view showing an embodiment of a surface emitting lighting device according to the present invention.
【図2】本発明による面発光照明装置の一実施例を示す
斜視図である。FIG. 2 is a perspective view showing an embodiment of a surface emitting lighting device according to the present invention.
【図3】本発明による面発光照明装置の一実施例を示す
斜視図である。FIG. 3 is a perspective view showing an embodiment of a surface emitting lighting device according to the present invention.
1 フレーム 1a 凸部 2 フレーム 2a 凸部 3 LED 4 ボンディングワイヤー 5 モールド部材 6 表示板 1 frame 1a convex part 2 frame 2a convex part 3 LED 4 bonding wire 5 mold member 6 display board
Claims (2)
ための2以上のフレームと、前記フレームをモールドに
よって1体となるように固定する断面がコ字状またはU
字状のモールド部材と、前記モールド部材に挿嵌される
透明または半透明の表示板を具備することを特徴とする
面発光照明装置。1. An LED, two or more frames for supplying electric power to the LEDs, and a U-shaped or U-shaped cross section for fixing the frames by molding to form one body.
A surface-emitting lighting device comprising a character-shaped mold member and a transparent or translucent display plate inserted into the mold member.
フレームのそれぞれに形成された凸部を有し、該凸部を
交互に対向させて前記フレームを平行に配置すると共
に、前記フレームの一方の凸部に前記LEDを載置し、
前記フレームの他方の凸部と前記LEDの最上層とを結
線することを特徴とする請求項1記載の面発光照明装
置。2. A frame comprising two frames having convex portions and convex portions formed on each of the frames, the convex portions being alternately opposed to each other, and the frames being arranged in parallel with each other. Place the LED on one of the convex parts,
The surface emitting lighting device according to claim 1, wherein the other convex portion of the frame is connected to the uppermost layer of the LED.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4144770A JPH0715045A (en) | 1992-05-11 | 1992-05-11 | Surface light emission illuminating equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4144770A JPH0715045A (en) | 1992-05-11 | 1992-05-11 | Surface light emission illuminating equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0715045A true JPH0715045A (en) | 1995-01-17 |
Family
ID=15370019
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4144770A Pending JPH0715045A (en) | 1992-05-11 | 1992-05-11 | Surface light emission illuminating equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0715045A (en) |
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002089222A1 (en) * | 2001-04-26 | 2002-11-07 | Moriyama Sangyo Kabushiki Kaisha | Light source coupler, illuminant device, patterned conductor, and method for manufcturing light source coupler |
KR100469141B1 (en) * | 1996-03-29 | 2005-06-08 | 로무 가부시키가이샤 | LED light emitting device and surface emitting light using it |
JP2006186196A (en) * | 2004-12-28 | 2006-07-13 | Stanley Electric Co Ltd | Light emitting device |
KR100726158B1 (en) * | 2005-11-18 | 2007-06-13 | 서울반도체 주식회사 | Luminous element for backlight unit |
JP2008004558A (en) * | 1996-07-12 | 2008-01-10 | Allied Signal Inc | Lighting device |
WO2008031249A1 (en) * | 2006-08-14 | 2008-03-20 | Topson Optoelectronics Semi-Conductor Co., Ltd | Backlight module with oval lenses |
US7380961B2 (en) | 2002-04-24 | 2008-06-03 | Moriyama Sangyo Kabushiki Kaisha | Light source coupler, illuminant device, patterned conductor, and method for manufacturing light source coupler |
EP1981082A1 (en) * | 2007-04-13 | 2008-10-15 | NEC Lighting, Ltd. | Light-emitting device with power supply structure |
US7784990B2 (en) | 2006-12-05 | 2010-08-31 | Samsung Electronics Co., Ltd. | Light source unit, light emitting device, and display device having same |
JP2011166099A (en) * | 2010-02-08 | 2011-08-25 | Paragon Semiconductor Lighting Technology Co Ltd | Light-mixing type light-emitting diode package structure improving color rendering property |
CN102214771A (en) * | 2010-04-02 | 2011-10-12 | 菱生精密工业股份有限公司 | Lead-frame-type multi-chip bearing module for precast mold molding |
JP2011238928A (en) * | 2010-05-07 | 2011-11-24 | Samsung Led Co Ltd | Lead frame for chip package, chip package, package module, and lighting system employing chip package module |
JP2012169326A (en) * | 2011-02-10 | 2012-09-06 | Rohm Co Ltd | Led module |
JP2013026572A (en) * | 2011-07-25 | 2013-02-04 | Kyocera Connector Products Corp | Module for attaching semiconductor light emitting element, semiconductor light emitting element module, manufacturing method of module for attaching semiconductor light emitting element, and manufacturing method of semiconductor light emitting element module |
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JP2014027305A (en) * | 2013-10-28 | 2014-02-06 | Kyocera Connector Products Corp | Module for attaching semiconductor light emitting element, and semiconductor light emitting element module |
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JPWO2017115862A1 (en) * | 2015-12-28 | 2018-06-28 | アイリスオーヤマ株式会社 | LED lighting device |
-
1992
- 1992-05-11 JP JP4144770A patent/JPH0715045A/en active Pending
Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100469141B1 (en) * | 1996-03-29 | 2005-06-08 | 로무 가부시키가이샤 | LED light emitting device and surface emitting light using it |
JP2008004558A (en) * | 1996-07-12 | 2008-01-10 | Allied Signal Inc | Lighting device |
WO2002089222A1 (en) * | 2001-04-26 | 2002-11-07 | Moriyama Sangyo Kabushiki Kaisha | Light source coupler, illuminant device, patterned conductor, and method for manufcturing light source coupler |
US7380961B2 (en) | 2002-04-24 | 2008-06-03 | Moriyama Sangyo Kabushiki Kaisha | Light source coupler, illuminant device, patterned conductor, and method for manufacturing light source coupler |
JP4665158B2 (en) * | 2004-12-28 | 2011-04-06 | スタンレー電気株式会社 | Light emitting device |
JP2006186196A (en) * | 2004-12-28 | 2006-07-13 | Stanley Electric Co Ltd | Light emitting device |
KR100726158B1 (en) * | 2005-11-18 | 2007-06-13 | 서울반도체 주식회사 | Luminous element for backlight unit |
US8337046B2 (en) | 2005-11-18 | 2012-12-25 | Seoul Semiconductor Co., Ltd. | Luminous element for backlight unit |
WO2008031249A1 (en) * | 2006-08-14 | 2008-03-20 | Topson Optoelectronics Semi-Conductor Co., Ltd | Backlight module with oval lenses |
US8303156B2 (en) | 2006-12-05 | 2012-11-06 | Samsung Display Co., Ltd. | Light source unit, light emitting device, and display device having same |
US7784990B2 (en) | 2006-12-05 | 2010-08-31 | Samsung Electronics Co., Ltd. | Light source unit, light emitting device, and display device having same |
EP1981082A1 (en) * | 2007-04-13 | 2008-10-15 | NEC Lighting, Ltd. | Light-emitting device with power supply structure |
JP2011166099A (en) * | 2010-02-08 | 2011-08-25 | Paragon Semiconductor Lighting Technology Co Ltd | Light-mixing type light-emitting diode package structure improving color rendering property |
CN102214771A (en) * | 2010-04-02 | 2011-10-12 | 菱生精密工业股份有限公司 | Lead-frame-type multi-chip bearing module for precast mold molding |
JP2011238928A (en) * | 2010-05-07 | 2011-11-24 | Samsung Led Co Ltd | Lead frame for chip package, chip package, package module, and lighting system employing chip package module |
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