JP2013243316A - Led module and manufacturing method thereof, luminaire and straight-tube led lamp - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an LED module easy-to-handle capable of increasing light out performance while reducing the cost and a manufacturing method thereof, a luminaire, and a straight-tube LED lamp.SOLUTION: The LED module includes: a lead frame base plate 3 having plural packaging parts 32 disposed in line in a first direction; a resin part 4 in which a part of the lead frame base plate 3 is embedded and each of the packaging parts 32 is exposed; LED chips 2 each mounted on the respective packaging parts 32; and a long insulation substrate 5 supporting the resin part 4. The lead frame base plate 3 has: a circuit pattern section 31 having the packaging parts 32 and electrically connecting the neighboring packaging parts 32 in the first direction; sash portions 33 disposed at both sides of the circuit pattern section 31 in a second direction perpendicular to a thickness direction of the resin part 4 and perpendicular to the first direction; and a connection part 34 connecting the packaging parts 32 and the sash portions 33 respectively in each packaging part 32.

Description

  The present invention relates to an LED module, a manufacturing method thereof, a lighting fixture, and a straight tube LED lamp.

  As an LED module, for example, an LED (Light Emitting Diode) light source formed using a frame 203 as shown in FIG. 24 is known (Patent Document 1). The frame 203 is made of copper as a base material, and the surface thereof is silver-plated.

  The frame 203 has a plurality of product areas 203A and a tie bar 203B disposed between the plurality of product areas 203A. The product region 203A includes a die bond area 203a, a first suspension lead 203c that connects the die bond area 203a and the first lead 203b, a wire bond area 203d that faces the die bond area 203a, a wire bond area 203d, and a second lead 203e. The second suspension lead 203f that connects the two. Therefore, the frame 203 includes a plurality of die bond areas 203a arranged along the first direction at a predetermined interval, and a plurality of wire bond areas 203d arranged along the first direction so as to face the die bond area 203a. It has. The frame 203 includes a first lead 203b connected to the die bond area 203a and extending in the first direction, and a second lead 203e connected to the wire bond area 203d and extending in the first direction. In the LED light source, an LED chip 202c (see FIG. 25) is mechanically fixed to a die bond area 203a using a paste material, and an n-side electrode is electrically connected. The p-side electrode of the LED chip 202c is electrically connected to the wire bond area 203d through the bonding wire 206.

  In the LED light source described above, the LED chip 202c, the die bond area 203a, the bonding wire 206, and the wire bond area 203d are sealed with a resin 208 to form the LED 202. As shown in FIG. 25, the tie bar 203B is punched using a cutting machine 207a.

  Patent Document 1 describes a structure in which a reflector 209 is fitted between adjacent LEDs 202 as shown in FIG. In the structure of FIG. 26, a board 213 is installed on the back surface of the LED light source via an insulating film 212. Patent Document 1 describes that the board 213 is an aluminum plate and also functions as a heat sink.

International Publication No. 2007/034537

  In an LED module such as the above-described LED light source, by disposing a board 213 made of an aluminum plate through an insulating film 212 on the back surface of the LED light source, heat dissipation can be improved and light output can be increased. It becomes possible.

  However, in this case, the board 213 made of an aluminum plate is required, which increases the cost.

  Moreover, in the above-mentioned LED light source, when the board 213 is not provided, there is a concern that the LED light source is easily deformed and becomes difficult to handle as the total length of the LED light source in the first direction is increased.

  In addition, the inventors of the present application considered applying the LED light source described in Patent Document 1 as a light source of a lighting fixture, and in this case, thought that the fixture body needs to be made of metal to improve heat dissipation.

  However, in this case, it is necessary to secure an insulation distance between the charging portion of the light source required for the lighting fixture and the fixture main body, and insulation between the board 213 and the fixture main body is larger in plane size than the board 213. It is necessary to interpose a sheet. For this reason, in the lighting fixture, there is a concern that the thermal resistance between the LED light source and the fixture main body increases, and the increase in the light output is limited, and the occupied space of the LED light source in the fixture main body is LED It becomes larger than the planar size of the light source.

  Further, the inventors of the present application considered that the LED light source described in Patent Document 1 is applied to a straight tube LED lamp, and in this case also, it was considered necessary to improve heat dissipation.

  The present invention has been made in view of the above-mentioned reasons, and the object thereof is an LED module that is easy to handle and that can achieve low cost and high light output, and a method for manufacturing the same. The object is to provide a luminaire and a straight tube LED lamp.

  In the LED module of the present invention, a lead frame substrate in which a plurality of mounting portions for mounting LED chips are arranged in the first direction, a part of the lead frame substrate is embedded, and the mounting portions are exposed. A resin part, the LED chip mounted on each of the mounting parts, and a first surface side opposite to the mounting part side in the thickness direction of the resin part to support the resin part and the first A circuit that defines an electrical connection relationship between the mounting parts adjacent to each other in the first direction, the lead frame board including the mounting parts. A pattern portion, a crosspiece disposed on each side of the circuit pattern portion in a second direction orthogonal to the thickness direction and orthogonal to the first direction, and each mounting portion and each of each mounting portion. Characterized by comprising a connecting portion that connects the respective parts.

  In this LED module, each crosspiece is preferably embedded in the insulating substrate.

  In this LED module, the thermal conductivity of the insulating substrate is preferably equal to or higher than the thermal conductivity of the resin portion.

  In this LED module, each of the mounting portions includes a die pad on which the LED chip is mounted, and a first lead that is connected to the die pad and is electrically connected to the first electrode of the LED chip through a first wire. A second lead facing the die pad in the second direction and electrically connected to the second electrode of the LED chip via a second wire, and between the mounting parts adjacent in the first direction. The arrangement of the first lead, the die pad, and the second lead in the second direction is preferably reversed.

  In this LED module, it is preferable that the insulating substrate and the resin portion are separate bodies.

  In this LED module, the circuit pattern portion is formed with a cut groove having one end side in the second direction opened at a side edge of the electrical connection portion that connects the mounting portions adjacent in the first direction. It is preferable that

  In this LED module, it is preferable that the lead frame substrate and the resin portion also serve as a reflecting member that reflects light emitted from the LED chip.

  In this LED module, it is preferable that the circuit pattern portion is formed so that series circuits each having a desired number of LED chips connected in series can be connected in parallel.

  According to the LED module manufacturing method of the present invention, a lead frame substrate in which a plurality of mounting portions for mounting LED chips are arranged in the first direction, a part of the lead frame substrate is embedded, and the mounting portions are The exposed resin part, the LED chip mounted on each of the mounting parts, and the one side of the resin part opposite to the mounting part side in the thickness direction of the resin part to support the resin part An elongated insulating substrate having the first direction as a longitudinal direction, and the lead frame substrate includes the mounting portions and has an electrical connection relationship between the mounting portions adjacent in the first direction. A circuit pattern portion to be defined; a crosspiece portion disposed on each side of the circuit pattern portion in a second direction perpendicular to the thickness direction and perpendicular to the first direction; and each mounting portion for each mounting portion. And a connecting part that connects each of the crosspieces, and a first step of forming the lead frame substrate by stamping a metal hoop material with a press A second step of molding the resin part in which a part of the lead frame substrate is embedded by an insert molding method after the first step; and the LED on each mounting part after the second step. A third step of mounting a chip; and a fourth step of providing the insulating substrate so as to support the resin portion after the third step.

  According to the LED module manufacturing method of the present invention, a lead frame substrate in which a plurality of mounting portions for mounting LED chips are arranged in the first direction, a part of the lead frame substrate is embedded, and the mounting portions are The exposed resin part, the LED chip mounted on each of the mounting parts, and the one side of the resin part opposite to the mounting part side in the thickness direction of the resin part to support the resin part An elongated insulating substrate having the first direction as a longitudinal direction, and the lead frame substrate includes the mounting portions and has an electrical connection relationship between the mounting portions adjacent in the first direction. A circuit pattern portion to be defined; a crosspiece portion disposed on each side of the circuit pattern portion in a second direction perpendicular to the thickness direction and perpendicular to the first direction; and each mounting portion for each mounting portion. And a connecting part that connects each of the crosspieces, and a first step of forming the lead frame substrate by stamping a metal hoop material with a press And a second step of molding the resin portion in which part of the lead frame substrate is embedded by an insert molding method after the first step, and supporting the resin portion after the second step. A third step of providing the insulating substrate, and a fourth step of mounting the LED chip on the mounting portions after the third step.

  In the LED module manufacturing method, between the first step and the second step, a metal film having a higher reflectivity for light emitted from the LED chip than the metal hoop material is formed on the lead frame substrate. It is preferable to include a fifth step.

  The lighting fixture of this invention is equipped with the fixture main body and the light source hold | maintained at the said fixture main body, The said light source consists of the said LED module, It is characterized by the above-mentioned.

  The straight tube type LED lamp of the present invention includes a straight tubular tube body made of a translucent material, and a first cap and a second cap respectively provided at one end and the other end in the longitudinal direction of the tube body. The LED module is housed in the tube main body.

  In the LED module of the present invention, it is easy to handle due to the provision of the insulating substrate, and the lead frame substrate has a crosspiece, and each mounting portion and each crosspiece for each mounting portion. Since the heat generated in the LED chip can be dissipated through the connection part and the crosspiece part, the cost can be reduced and the light output can be reduced. High output can be achieved.

  In the LED module manufacturing method of the present invention, it is possible to provide an LED module that is easy to handle, and that can achieve low cost and high light output.

  In the lighting fixture of the present invention, it is possible to reduce the cost and increase the light output.

  In the straight tube type LED lamp of the present invention, it is possible to reduce the cost and increase the light output.

(A) is a principal part schematic perspective view of the LED module of Embodiment 1, (b) is a schematic sectional drawing of the LED module of Embodiment 1, (c) is a schematic cross section of the other structural example of the LED module of Embodiment 1. FIG. 3 is a schematic plan view of a lead frame substrate in the LED module of Embodiment 1. FIG. It is a principal part schematic perspective view of the metal hoop material used for the manufacturing method of the LED module of Embodiment 1. FIG. 3 is a schematic perspective view of a main part for describing the method for manufacturing the LED module according to the first embodiment. FIG. 3 is a schematic perspective view of a main part for describing the method for manufacturing the LED module according to the first embodiment. FIG. 3 is a schematic perspective view of a main part for describing the method for manufacturing the LED module according to the first embodiment. FIG. 3 is a schematic perspective view of a main part for describing the method for manufacturing the LED module according to the first embodiment. FIG. 3 is a schematic perspective view of a main part for describing the method for manufacturing the LED module according to the first embodiment. It is a principal part schematic perspective view for demonstrating the other manufacturing method of the LED module of Embodiment 1. FIG. 6 is a schematic plan view of another lead frame substrate in the LED module of Embodiment 1. FIG. FIG. 6 is an enlarged view of a main part of another lead frame substrate in the LED module of Embodiment 1. FIG. 10 is an enlarged view of a main part of still another lead frame substrate in the LED module of Embodiment 1. 6 is a schematic plan view of another lead frame substrate in the LED module of Embodiment 1. FIG. FIG. 3 is an enlarged view of a main part of another lead frame substrate in the LED module of Embodiment 1. It is a schematic sectional drawing of the LED module of Embodiment 2. It is a principal part schematic perspective view of the LED module of Embodiment 2. FIG. 6 is a schematic cross-sectional view of an LED module according to Embodiment 3. FIG. 6 is a schematic cross-sectional view of an LED module according to Embodiment 4. FIG. 6 is a schematic cross-sectional view of an LED module according to Embodiment 5. FIG. It is a schematic sectional drawing of the LED module of Embodiment 6. (A) is the schematic perspective view which fractured | ruptured partially the lighting fixture of Embodiment 7, (b) is the principal part enlarged view of (a). It is a principal part schematic side view of the lighting fixture of Embodiment 7. FIG. (A) is the schematic perspective view which fractured | ruptured partially the LED lamp of Embodiment 8, (b) is the principal part enlarged view of (a). (A) is a principal part top view of the flame | frame of 2 rows used for the LED light source of a prior art example, (b) is A-A 'sectional drawing of (a). It is principal part sectional drawing in the manufacturing process of the LED light source of a prior art example. It is principal part sectional drawing in the manufacturing process of the backlight of a prior art example.

(Embodiment 1)
Below, the LED module 1 of this embodiment is demonstrated based on FIG. 1 and FIG.

  The LED module 1 includes a lead frame substrate 3 in which a plurality of mounting portions 32 for mounting the LED chip 2 are arranged side by side in a first direction (the left-right direction in FIG. 2), and a part of the lead frame substrate 3 is embedded. The resin part 4 which exposed each mounting part 32 is provided. In addition, the LED module 1 supports the resin portion 4 by being disposed on one surface side opposite to the mounting portion 32 side in the thickness direction of the resin portion 4 and the LED chip 2 mounted on each mounting portion 32. And a long insulating substrate 5.

  The lead frame substrate 3 includes a circuit pattern portion 31 that includes each mounting portion 32 and defines an electrical connection relationship between the mounting portions 32 adjacent in the first direction. Furthermore, the lead frame substrate 3 includes crosspieces 33 disposed on both sides of the circuit pattern portion 31 in a second direction (vertical direction in FIG. 2) perpendicular to the thickness direction of the resin portion 4 and perpendicular to the first direction. Each mounting portion 32 includes a connecting portion 34 that connects each mounting portion 32 and each crosspiece 33. The insulating substrate 5 is arranged so that the longitudinal direction of the insulating substrate 5 coincides with the first direction.

  In the LED module 1 of this embodiment, since the insulating substrate 5 is provided, handling is easy. Further, in the LED module 1 of the present embodiment, the heat generated in the LED chip 2 can be dissipated through the connecting portion 34 and the crosspiece 33, thereby reducing the cost and increasing the light output. Can be achieved.

  Hereinafter, each component of the LED module 1 will be described in detail.

  The LED chip 2 is provided with a first electrode (not shown) as an anode electrode and a second electrode (not shown) as a cathode electrode on one surface side in the thickness direction of the LED chip 2.

  The LED chip 2 is a GaN-based blue LED chip that emits blue light and uses a sapphire substrate as a substrate. However, the substrate of the LED chip 2 is not limited to the sapphire substrate, and may be a GaN substrate, a SiC substrate, a Si substrate, or the like, for example. The structure of the LED chip 2 is not particularly limited.

  The chip size of the LED chip 2 is not particularly limited. As the LED chip 2, for example, one having a chip size of 0.3 mm □, 0.45 mm □, or 1 mm □ can be used.

  Moreover, the material and luminescent color of the light emitting layer of the LED chip 2 are not particularly limited. That is, the LED chip 2 is not limited to a blue LED chip, and for example, a violet light LED chip, an ultraviolet light LED chip, a red LED chip, a green LED chip, or the like may be used.

  The lead frame substrate 3 is a metal frame, and is formed from a strip-shaped metal hoop material 30 (see FIG. 3). As a material of the metal hoop material 30, for example, copper having a relatively high thermal conductivity among metal materials is preferable. The material of the metal hoop material 30 is not limited to copper, and may be phosphor bronze, a copper alloy (for example, 42 alloy), aluminum, an aluminum alloy, a nickel alloy, or the like. Moreover, it is preferable to set the thickness of the metal hoop material 30 in the range of about 100 μm to 1500 μm, for example.

  The lead frame substrate 3 may be appropriately provided with a surface treatment layer (not shown) having a higher reflectance with respect to light from the LED chip 2 than the metal hoop material 30 on the main surface side. The lead frame substrate 3 is not limited to the presence or absence of the surface treatment layer, and preferably also serves as a reflecting member that reflects light emitted from the LED chip 2 or the like. Thereby, the LED module 1 can improve the total luminous flux. However, the LED module 1 can further improve the light extraction efficiency when the surface treatment layer is provided on the lead frame substrate 3. As the surface treatment layer, for example, an Ag film, a laminated film of Ni film, Pd film and Au film, a laminated film of Ni film and Au film, a laminated film of Ag film, Pd film and AuAg alloy film are adopted. can do. The surface treatment layer is a laminate of a Ni film, a Pd film, and an Au film rather than an Ag film from the viewpoint of long-term reliability (for example, oxidation resistance, corrosion resistance, adhesion to the resin part 4). A film, a laminated film of an Ni film and an Au film, an Ag film, a Pd film, and an AuAg alloy film are more preferable. The surface treatment layer is preferably composed of a plating layer or the like. In short, the surface treatment layer is preferably formed by a plating method. In the LED module 1 of the present embodiment, the surface treatment layer constitutes a metal film having a higher reflectivity with respect to light emitted from the LED chip 2 than the metal hoop material 30. The LED module 1 is not limited to the main surface side of the lead frame substrate 3, and a surface treatment layer may be formed on the entire lead frame substrate 3. Further, the surface treatment layer on the main surface side of the lead frame substrate 3 may be partially formed by spot plating or the like.

As the metal hoop material 30, an aluminum film having a higher purity than that of the aluminum plate is laminated on one surface side of the aluminum plate as a base material, and two kinds of dielectric films having different refractive indexes are formed on the aluminum film. It is also possible to use a highly reflective substrate on which an increased reflection film is formed. Here, as the two types of dielectric films, for example, an SiO ₂ film and a TiO ₂ film are preferably employed. The LED module 1 can make the reflectance with respect to visible light 95% or more by using a highly reflective substrate as the metal hoop material 30. As this highly reflective substrate, for example, MIRO2 or MIRO (registered trademark) of alanod can be used. As the above-mentioned aluminum plate, an anodized surface may be used. When the above-described highly reflective substrate is used as the metal hoop material 30, a conductive film for electrical connection with each of the first wire 6b and the second wire 6c is formed by a plating method or the like, or enhanced reflection is performed. It is necessary to pattern the film.

  Each mounting portion 32 includes a die pad 32a on which the LED chip 2 is mounted, a first lead 32b continuous to the die pad 32a, and a second lead 32c facing the die pad 32a in the second direction. A first electrode (not shown) of the LED chip 2 is electrically connected to the first lead 32b via a first wire 6b. A second electrode (not shown) of the LED chip 2 is electrically connected to the second lead 32c via a second wire 6c.

  As shown in FIGS. 1A and 1B, the LED module 1 has the other side of the LED chip 2 in the thickness direction bonded to a die pad 32 a via a bonding portion 7. What is necessary is just to form the junction part 7 with a die-bonding material.

  As the die bond material, for example, a silicone die bond material, an epoxy die bond material, a silver paste, or the like can be used. The bonding portion 7 may be a material obtained by mixing a phosphor that emits light of a color different from the emission color of the LED chip 2 by being excited by light emitted from the LED chip 2 in the die bond material.

  As each wire 6b and 6c, a gold wire, an aluminum wire, etc. are employable, for example.

  The circuit pattern portion 31 includes an electrical connection portion 35 that connects the mounting portions 32 adjacent in the first direction. The electrical connection portion 35 has a strip shape with the first direction as the longitudinal direction. The shape of the electrical connection portion 35 is not particularly limited, and may be, for example, a meandering shape, a curved shape, or a shape in which a linear shape and a curved shape are combined.

  As shown in FIG. 2, in the lead frame substrate 3, the first leads 32b, the die pad 32a, and the second leads 32c in the second direction are preferably reversed in the mounting portions 32 adjacent in the first direction. . Thereby, the connection part 34 and the crosspiece part 33 in which the heat which generate | occur | produced with the LED chip 2 mounted in one of the mounting parts 32 adjacent in a 1st direction and the LED chip 2 mounted in the other is easy to transmit are 2nd. Since they are opposite to each other in the direction, the heat generated in each LED chip 2 of the LED module 1 can be dissipated more evenly. Therefore, the LED module 1 can increase the light emission efficiency of each LED chip 2, and can improve the total luminous flux. In this case, as shown in FIG. 2, in the circuit pattern portion 31, the second lead 32 c of one mounting portion 32 of the mounting portions 32 adjacent to each other and the first lead 32 b of the other mounting portion 32 are electrically connected to each other. It is preferable that they are connected via an electrical connection in series.

  In addition, as shown in FIG. 4, the circuit pattern portion 31 has a die pad 32 a on one end side in the first direction from the intermediate position and an end portion on the other end side instead of providing the electrical connection portion 35 in the intermediate position in the first direction. A connection switching unit 36 that connects and electrically connects the die pad 32a is provided. Thereby, the LED module 1 includes the first electrode of the LED chip 2 that is closest to the connection switching unit 36 among the series circuits of all the LED chips 2 on one end side in the first direction relative to the connection switching unit 36. It becomes possible to connect the first electrode of the LED chip 2 located closest to the connection switching unit 36 in the series circuit of all the LED chips 2 on the other end side. In short, the circuit pattern portion 31 is formed such that series circuits each having a desired number of LED chips 2 connected in series can be connected in parallel. Thereby, the LED module 1 can suppress an increase in drive voltage or drive current that needs to be supplied from the lighting device, and can increase the number of LED chips 2.

  The circuit pattern unit 31 may be a pattern in which all the LED chips 2 are connected in series without providing the connection switching unit 36. In this case, the LED module 1 is arranged between the first lead 32b on one end side in the first direction and the second lead 32c on the other end side in a state where one LED chip 2 is mounted for each mounting portion 32. It is possible to supply power to the series circuits of all LED chips 2 by supplying power to.

  The number of LED chips 2 mounted on each mounting part 32 is not limited to one, and a plurality of LED chips 2 may be used. In this case, the circuit pattern unit 31 includes a pattern in which a plurality of LED chips 2 are connected in parallel for each mounting unit 32, and a parallel circuit of the plurality of LED chips 2 is connected in series by the number of mounting units 32. It becomes possible to do. When a plurality of LED chips 2 are mounted for each mounting portion 32, the plurality of LED chips 2 may have the same emission color or different emission colors. Further, the LED module 1 is not limited to the configuration in which the same number of LED chips 2 are mounted on each mounting portion 32. The LED module 1 is not limited to the configuration in which the LED chip 2 is mounted on all the mounting portions 32.

  Further, the LED module 1 may have a configuration in which the LED chip 2 is mounted on the die pad 32a via the submount member 15 as in another configuration example illustrated in FIG.

  The submount member 15 preferably has a stress relieving function for relieving stress acting on the LED chip 2 due to a difference in linear expansion coefficient between the LED chip 2 and the lead frame substrate 3. As a result, the LED module 1 can relieve the stress acting on the LED chip 2 due to the difference in linear expansion coefficient between the LED chip 2 and the lead frame substrate 3.

  Moreover, it is preferable that the submount member 15 has a heat conduction function for transferring heat generated in the LED chip 2 to the die pad 32a. Moreover, it is preferable that the submount member 15 has a heat conduction function of transferring heat generated in the LED chip 2 to a range wider than the chip size of the LED chip 2 in the die pad 32a. For this reason, the submount member 15 is preferably formed in a rectangular plate shape having a planar size larger than the chip size of the LED chip 2. Thereby, the LED module 1 can efficiently dissipate the heat generated in the LED chip 2 through the submount member 15, the die pad 32 a, the connecting portion 34, and the crosspiece 33.

  As the submount member 15, for example, a material having translucency and light diffusibility may be employed. Thereby, the LED module 1 can improve the light extraction efficiency. As the material having translucency and diffusibility, for example, alumina or barium sulfate can be employed.

  Further, as the material of the submount member 15, aluminum nitride, composite SiC, Si, CuW, or the like can be adopted.

  In addition, the submount member 15 may be provided with a reflective film that reflects light emitted from the LED chip 2 on the surface to which the LED chip 2 is bonded. The reflective film can be composed of, for example, a laminated film of a Ni film and an Ag film. The material of the reflective film is not particularly limited, and may be appropriately selected according to the emission wavelength of the LED chip 2, for example.

  The lead frame substrate 3 is not limited to the example of FIG. 2, and the arrangement of the first leads 32b, the die pads 32a, and the second leads 32c in the second direction may be the same between the mounting portions 32 adjacent in the first direction. In this case, in the circuit pattern portion 31, it is preferable that the first leads 32b and the second leads 32c of the mounting portions 32 adjacent to each other are connected and electrically connected via the electrical connection portion 35, respectively. Thereby, the lead frame substrate 3 can make the circuit pattern part 31 into a pattern in which the LED chips 2 mounted one by one on each mounting part 32 are connected in parallel.

  In the lead frame substrate 3, the circuit pattern portion 31 is supported between a pair of crosspieces 33 via a plurality of connecting portions 34 that are continuous with each of the crosspieces 33. Each crosspiece 33 is formed in a belt shape having the first direction as a longitudinal direction. The dimension (width dimension) of each crosspiece 33 in the second direction is set to be larger than the dimension (width dimension) of the electrical connecting part 35 in the second direction. The dimension (width dimension) of each connection part 34 in the first direction is set to be larger than the dimension (width dimension) of the electrical connection part 35 in the second direction.

  As can be seen from the above description, the lead frame substrate 3 has a plurality of mounting portions 32 arranged in the first direction. In the lead frame substrate 3, a plurality of connecting portions 34 connected to each of the crosspieces 33 are arranged along the first direction.

  A part of the lead frame substrate 3 is embedded in the resin portion 4. Further, the resin portion 4 is formed with an opening 4 a that exposes each mounting portion 32 on the main surface side of the lead frame substrate 3. The opening shape of the opening 4a in plan view is a circular shape, but is not limited thereto, and may be an elliptical shape, a regular polygonal shape, or the like. Further, as shown in FIG. 1B, the opening area of the opening 4 a is substantially constant regardless of the distance from the mounting portion 32 in the thickness direction of the resin portion 4. However, it is preferable that the opening 4a has a shape that takes into account the draft of the mold when the resin part 4 is molded and the mold is released. As shown in FIG. 1C, the opening 4 a may have a shape in which the opening area gradually increases as the distance from the mounting portion 32 increases in the thickness direction of the resin portion 4.

  Examples of the material of the resin part 4 include thermoplastic resins such as liquid crystal polymer (LCP), polybutylene terephthalate (PBT), and polyamide (polyamid: PA), epoxy resins, and polyester resins. A thermosetting resin such as can be used. The resin part 4 is preferably a white resin having a high reflectance with respect to visible light in both cases of a thermoplastic resin and a thermosetting resin. In short, it is preferable that the resin portion 4 also serves as a reflecting member that reflects light. Thereby, the LED module 1 can improve the total luminous flux.

  The resin part 4 is formed in a long shape (here, an elongated rectangular plate shape), and the openings 4a are formed at substantially equal intervals in the first direction. The width dimension of the resin part 4 in the second direction is set to a value smaller than the dimension between the crosspieces 33, 33 in the second direction.

  The insulating substrate 5 is formed in a long shape (here, an elongated rectangular plate shape). The width dimension of the insulating substrate 5 in the second direction is set to a value larger than the width dimension of the lead frame substrate 3 in the second direction.

  As the material of the insulating substrate 5, for example, a thermoplastic resin such as liquid crystal polymer, polybutylene terephthalate or polyamide resin, a thermosetting resin such as epoxy resin or polyester resin, or a ceramic such as alumina or aluminum nitride is used. can do. The insulating substrate 5 is preferably a white resin having a high reflectance with respect to visible light in both cases of a thermoplastic resin and a thermosetting resin. In the LED module 1, the thermal conductivity of the insulating substrate 5 is preferably equal to or higher than the thermal conductivity of the resin portion 4. In such a case, the insulating substrate 5 may be made of the same material as that of the resin portion 4, or may be a resin in which a filler having a higher thermal conductivity than the resin is mixed, or ceramic. Examples of the filler that can be used include magnesium oxide, boron nitride, aluminum hydroxide, and glass fiber. The filling rate of the filler is preferably about 60 volume percent to 75 volume percent.

  By the way, it is preferable that the LED module 1 is provided with the sealing part 9 which sealed the LED chip 2 and each wire 6b, 6c in the other surface side of the resin part 4. FIG. As a material of the sealing part 9, a silicone resin which is a first light transmissive material is used. The first light transmissive material is not limited to a silicone resin, and for example, an epoxy resin, an acrylic resin, glass, or the like may be used.

  The sealing portion 9 may be mixed with a wavelength conversion material such as a phosphor that emits light of a color different from the emission color of the LED chip 2. Thereby, the LED module 1 can obtain mixed color light of the light emitted from the LED chip 2 and the light emitted from the phosphor. In addition, although the sealing part 9 is made into hemispherical shape, it is not restricted to hemispherical shape, For example, it is good also as hemispherical spherical shape.

  In addition, the LED module 1 may be provided with a color conversion unit including a wavelength conversion material and a second light transmissive material, for example, separately from the sealing unit 9.

  For example, if the LED module 1 employs a blue LED chip as the LED chip 2 and a yellow phosphor as the phosphor of the wavelength conversion material, white light can be obtained. That is, in the LED module 1, the blue light emitted from the LED chip 2 and the light emitted from the yellow phosphor are emitted through the surface of the sealing part 9 or the color conversion part, and white light can be obtained. It becomes possible. As the second light transmissive material, for example, a silicone resin can be employed. The second light-transmitting material is not limited to silicone resin, but may be, for example, an acrylic resin, glass, or an organic / inorganic hybrid material in which organic and inorganic components are mixed and bonded at the nm level or molecular level. Good.

  The phosphor that is the wavelength conversion material is not limited to the yellow phosphor, and for example, a yellow phosphor and a red phosphor, or a red phosphor and a green phosphor may be employed. Further, the phosphor as the wavelength conversion material is not limited to one type of yellow phosphor, and two types of yellow phosphors having different emission peak wavelengths may be employed. The LED module 1 can improve the color rendering properties by adopting a plurality of kinds of phosphors as the wavelength conversion material.

  When the LED module 1 can emit white light by the LED chip 2 alone, when the phosphor is mixed in the sealing portion 9, the light color desired to be obtained by the LED module 1 is the same as the emission color of the LED chip 2. In some cases, a structure that does not include a color conversion unit can be employed.

  In the LED module 1, when the phosphor that is the wavelength conversion material is mixed in the sealing portion 9, not only the heat generated in the LED chip 2 but also the heat generated in the phosphor that is the wavelength conversion material is connected to the connection portion 34. Further, it is possible to dissipate heat through the crosspiece 33, and it is possible to increase the light output.

  It is preferable that the color conversion part is arranged so that a gas layer (for example, an air layer) is formed between the resin part 4 and the sealing part 9 on the other surface side. Further, the LED module 1 may have a configuration in which the color conversion part is formed in a dome shape, and the LED chip 2 and the wires 6b and 6c are sealed by the color conversion part. Further, the LED module 1 may be configured such that the color conversion unit has a layered shape and the LED chip 2 and the wires 6b and 6c are sealed by the color conversion unit. Note that the color conversion portion can be formed by a molding method, a coating method using a dispenser, a screen printing method, or the like.

  In the LED module 1, each crosspiece 33 is embedded in the insulating substrate 5. Thereby, the LED module 1 can improve heat dissipation while ensuring insulation. Here, in the LED module 1, the thermal conductivity of the insulating substrate 5 is preferably equal to or higher than the thermal conductivity of the resin portion 4. Thereby, the LED module 1 can further improve heat dissipation. The external size of the insulating substrate 5 in plan view may be set as appropriate based on the external size of the lead frame substrate 3 in plan view.

  Hereinafter, the manufacturing method of the LED module 1 is demonstrated based on FIGS.

  In manufacturing the LED module 1, first, a metal hoop material 30 (see FIG. 3) serving as the basis of the lead frame substrate 3 is prepared.

  After that, the structure shown in FIG. 4 is obtained by performing a step (first step) of forming the lead frame substrate 3 by punching the metal hoop material 30 with a press.

  After that, the structure shown in FIG. 5 is obtained by performing a process (second process) of molding the resin portion 4 in which a part of the lead frame substrate 3 is embedded by an insert molding method.

  After that, the structure shown in FIG. 6 is obtained by appropriately performing a process for forming a desired circuit pattern portion 31 on the lead frame substrate 3 (a circuit forming blanking process). For example, when the lead frame substrate 3 is provided with the connection switching unit 36 described above, a part of each crosspiece 33 provided on both sides of the connection switching unit 36 in the second direction It is only necessary to perform a pressing process that pulls out over the entire length in the second direction. The circuit forming punching process is not limited to press working, but employs, for example, a laser processing method of cutting by irradiating a laser beam, a stamping method using a stamping die, or a cutting method using a blade (grinding stone). You can also When the desired circuit pattern portion 31 is formed on the lead frame substrate 3 formed in the first process, the circuit forming blanking process is not necessary.

  After that, the structure shown in FIG. 7 is obtained by performing the process (3rd process) which mounts LED chip 2 in each mounting part 32. FIG. When mounting the LED chip 2, the LED chip 2 is mounted on the die pad 32a, and then the first electrode of the LED chip 2 and the first lead 32b are electrically connected via the first wire 6b, and the LED chip 2 is mounted. Wire bonding is performed to electrically connect the second electrode of the chip 2 and the second lead 32c through the second wire 6c. When the LED chip 2 is mounted on the die pad 32 a, the LED chip 2 and the die pad 32 a are bonded via the bonding portion 7. When the LED module 1 includes the submount member 15 as shown in FIG. 1C, the LED chip 2 may be mounted on the die pad 32a via the submount member 15. In short, the submount member 15 and the die pad 32a may be joined, and the submount member 15 and the LED chip 2 may be joined.

  After the LED chip 2 is mounted on each mounting portion 32, the structure shown in FIG. 8 is obtained by performing the step of providing the insulating substrate 5 so as to support the resin portion 4 (fourth step). In the fourth step, the insulating substrate 5 is provided by a molding method. For this reason, the material of the insulating substrate 5 is preferably a material having good adhesion to the resin portion 4.

  Thereafter, the step of sealing the LED chip 2 and the wires 6b and 6c with the sealing portion 9 is performed to obtain the structure shown in FIG.

  In the manufacture of the LED module 1, a metal film having a higher reflectivity for light emitted from the LED chip 2 than the metal hoop material 30 is formed on the lead frame substrate 3 between the first step and the second step. Five steps may be performed. Thereby, in the manufacturing method of LED module 1, it becomes possible to manufacture LED module 1 with higher luminous efficiency.

  In manufacturing the LED module 1, not only the above-described example, but also by performing a step (third step) of providing the insulating substrate 5 so as to support the resin portion 4 after the second step, FIG. After obtaining the structure shown, the process shown in FIG. 8 may be obtained by performing a process (fourth process) of mounting the LED chip 2 on each mounting part 32.

  The shape of the circuit pattern portion 31 of the lead frame substrate 3 is not limited to the above-described example, and may be a shape as shown in FIGS. 10 and 11, for example. In the lead frame substrate 3, the first lead 32b, the die pad 32a, and the second lead 32c are arranged side by side in the first direction. The circuit pattern portion 31 of the lead frame 3 is formed so that series circuits in which a desired number of LED chips 2 are connected in series can be connected in parallel as in the above example.

  As shown in FIG. 12, the circuit pattern portion 31 of the lead frame substrate 3 has one end side in the second direction opened to the side edge of the electrical connection portion 35 that connects the mounting portions 32 adjacent in the first direction. It is good also as a structure in which the notch groove 38 was formed. Thereby, the LED module 1 can relieve the stress generated in the lead frame substrate 3 due to the difference in linear expansion coefficient between the lead frame substrate 3 and the resin portion 4, and can suppress the occurrence of warpage and deformation. It is possible to extend the service life.

  Further, the shape of the lead frame substrate 3 may be a shape as shown in FIGS. 13 and 14, for example. In this case, in manufacturing the LED module 1, the hatched portion in FIG. 14 is formed after the resin portion 4 in which a part of the lead frame substrate 3 is embedded is formed by an insert molding method (simultaneous molding method). Disconnect.

  The LED module 1 of the present embodiment described above is easy to handle because it includes the insulating substrate 5. Further, in the LED module 1 of the present embodiment, the heat generated in the LED chip 2 can be dissipated through the connecting portion 34 and the crosspiece 33, thereby reducing the cost and increasing the light output. Can be achieved.

(Embodiment 2)
Below, the LED module 1 of this embodiment is demonstrated based on FIG. 15 and FIG.

  The LED module 1 of this embodiment is different from the LED module 1 of Embodiment 1 in that the resin portion 4 and the insulating substrate 5 are separately formed, and the resin portion 4 and the insulating substrate 5 are joined. In addition, about the component similar to Embodiment 1, the same code | symbol is attached | subjected and description is abbreviate | omitted.

  Since the LED module 1 of this embodiment should just form the resin part 4 and the insulated substrate 5 separately at the time of manufacture, after joining the resin part 4 and the insulated substrate 5 with an adhesive etc., the resin part 4 and The degree of freedom of the shape and material of each insulating substrate 5 can be increased. Therefore, the LED module 1 of the present embodiment can easily customize the module size.

  Further, in the LED module 1 of the present embodiment, the connecting portion 34 and the crosspiece portion 33 protrude from each side surface of the resin portion 4 that intersects the second direction (the left-right direction in FIG. 15).

  In the LED module 1 of the present embodiment, it is possible to dissipate heat generated in the LED chip 2 into the gas through the connecting portion 34 and the crosspiece 33, so that the light output is further increased. Can be achieved.

(Embodiment 3)
Below, the LED module 1 of this embodiment is demonstrated based on FIG.

  In the LED module 1 of the present embodiment, a part of the resin part 4 is also formed on the die pad 32a, and the LED chip 2 is joined to the part of the resin part 4 via the joint part 7. This is different from the LED module 1 of the second embodiment. In addition, about the component similar to Embodiment 2, the same code | symbol is attached | subjected and description is abbreviate | omitted.

  In the LED module 1 of the present embodiment, the LED chip 2 is bonded onto the part of the resin portion 4 via the bonding portion 7, so that light emitted from the side surface of the LED chip 2 is more efficient. It can be taken out well, and the total luminous flux can be improved.

(Embodiment 4)
Below, the LED module 1 of this embodiment is demonstrated based on FIG.

  The LED module 1 of the present embodiment is different from the LED module 1 of the first embodiment in the shape of the insulating substrate 5. In addition, about the component similar to Embodiment 1, the same code | symbol is attached | subjected and description is abbreviate | omitted.

  In the LED module 1 of Embodiment 1, the insulating substrate 5 is formed in a shape that covers not only the one surface side of the resin portion 4 but also the side surface of the resin portion 4. On the other hand, in the LED module 1 of the present embodiment, the insulating substrate 5 is bonded only to the one surface of the resin portion 4. In the lead frame substrate 3, the connecting portion 34 is bent in an L shape, and a part of each connecting portion 34 and each crosspiece 33 are embedded in the insulating substrate 5.

  In the LED module 1 of the present embodiment, since the thickness dimension of the insulating substrate 5 can be reduced as compared with the LED module 1 of the first embodiment, it is possible to improve heat dissipation.

(Embodiment 5)
Below, the LED module 1 of this embodiment is demonstrated based on FIG.

  The LED module 1 of this embodiment is different from the LED module 1 of Embodiment 2 in that each connecting portion 34 and each crosspiece 33 of the lead frame substrate 3 are embedded in the resin portion 4. In addition, about the component similar to Embodiment 2, the same code | symbol is attached | subjected and description is abbreviate | omitted.

  Compared with the LED module 1 of the second embodiment, the LED module 1 of the present embodiment can improve insulation.

(Embodiment 6)
Below, the LED module 1 of this embodiment is demonstrated based on FIG.

  In the LED module 1 of the present embodiment, a part of the resin part 4 is also formed on the die pad 32a, and the LED chip 2 is joined to the part of the resin part 4 via the joint part 7. This is different from the LED module 1 of the fifth embodiment. In addition, about the component similar to Embodiment 5, the same code | symbol is attached | subjected and description is abbreviate | omitted.

  In the LED module 1 of the present embodiment, the LED chip 2 is bonded onto the part of the resin portion 4 via the bonding portion 7, so that light emitted from the side surface of the LED chip 2 is more efficient. It can be taken out well, and the total luminous flux can be improved.

(Embodiment 7)
Below, the lighting fixture 50 of this embodiment is demonstrated based on FIG. 21 and FIG.

  The lighting fixture 50 of this embodiment is an LED lighting fixture, and includes a fixture main body 51 and an LED module 1 that is a light source held by the fixture main body 51.

  The instrument body 51 is formed in a long shape (here, a rectangular plate shape) having a larger planar size than the LED module. In the appliance main body 51, the LED module 1 is disposed on one surface side in the thickness direction of the appliance main body 51. In the lighting fixture 50, a cover 52 that covers the LED module 1 and transmits light emitted from the LED module 1 is disposed on the one surface side of the fixture body 51.

  In addition, the lighting fixture 50 includes a lighting device 53 that supplies direct current power to the LED module 1 to light (emit) each LED chip 2. The lighting device 53 and the LED module 1 are electrically connected through an electric wire 54 such as a lead wire.

  Here, in the instrument body 51, a recess 51 a that houses the lighting device 53 is formed along the longitudinal direction of the instrument body 51 on the other surface side in the thickness direction of the instrument body 51. In addition, a through hole (not shown) through which the electric wire 54 is inserted is formed in the instrument body 51 through the thin portion between the one surface and the inner bottom surface of the recess 51a.

  In the LED module 1, both end portions in the first direction of the lead frame substrate 3 are exposed, and the electric wires 54 can be connected to the exposed portions. As the connection portion between the lead frame substrate 3 and the electric wire 54, for example, a connection portion made of a conductive bonding material such as solder, a connection portion made of a male connector and a female connector, or the like can be adopted.

  The lighting fixture 50 can supply the DC power from the lighting device 53 to the LED module 1 to light the LED module 1. Note that the lighting device 53 may have a configuration in which power is supplied from an AC power source such as a commercial power source, or may have a configuration in which power is supplied from a DC power source such as a solar battery or a storage battery.

  The lighting fixture 50 of the present embodiment employs the LED module 1 of the second embodiment as a light source. The light source is not limited to the LED module 1 of the second embodiment, and may be any one of the LED modules 1 of the first and third embodiments.

  As a material of the instrument main body 51, a material having a high thermal conductivity is preferable, and a material having a higher thermal conductivity than the insulating substrate 5 is more preferable. Here, as a material of the instrument main body 51, it is preferable to employ a metal having high thermal conductivity such as aluminum or copper.

  As a means for attaching the LED module 1 to the appliance main body 51, for example, an attachment such as a screw may be employed, or an epoxy resin layer of a thermosetting sheet adhesive is used as the appliance main body 51, the LED module 1, and the like. They may be joined by interposing them. B-stage epoxy resin layer (thermosetting resin) and plastic containing fillers such as silica and alumina as the sheet-like adhesive and having a property of lowering viscosity and increasing fluidity upon heating A sheet adhesive in which a film (PET film) is laminated can be used. An example of such a sheet-like adhesive is an adhesive sheet TSA manufactured by Toray Industries, Inc. As the filler, an electrically insulating material having higher thermal conductivity than the epoxy resin that is a thermosetting resin may be used. The thickness of the epoxy resin layer described above is set to 100 μm, but this value is merely an example, and is not particularly limited. For example, the thickness may be appropriately set in the range of about 50 μm to 150 μm. The thermal conductivity of the epoxy resin layer is preferably 4 W / m · K or more.

  The epoxy resin layer of the above-mentioned sheet-like adhesive has properties of being electrically insulating, having high thermal conductivity, high fluidity during heating, and high adhesion to the uneven surface. Therefore, the lighting fixture 50 can prevent a gap from being generated between the insulating layer formed from the above-described epoxy resin layer and the LED module 1 and the fixture main body 51, thereby improving the adhesion reliability. In addition, it is possible to suppress an increase in thermal resistance and variations due to insufficient adhesion. The insulating layer has electrical insulation and thermal conductivity, and has a function of thermally coupling the LED module 1 and the instrument body 51.

  Therefore, the lighting fixture 50 is compared with the case where a rubber sheet shape such as Sarcon (registered trademark) or a silicone gel-like heat dissipation sheet (heat conductive sheet) is sandwiched between the LED module 1 and the instrument body 51. In addition, it is possible to reduce the thermal resistance from each LED chip 2 to the instrument main body 51 and to reduce variations in thermal resistance. Thereby, since the luminaire 50 has improved heat dissipation and can suppress the temperature rise of the junction temperature of each LED chip 2, it becomes possible to increase the input power and increase the light output. Can be achieved. The thickness of the epoxy resin layer described above is set to 100 μm, but this value is merely an example, and is not particularly limited. For example, the thickness may be appropriately set in the range of about 50 μm to 150 μm. Note that the thermal conductivity of the epoxy resin layer is preferably 4 W / m · K or more.

  As a material of the cover 52, for example, an acrylic resin, a polycarbonate resin, a silicone resin, glass, or the like can be employed.

  The cover 52 is integrally provided with a lens portion (not shown) that controls the light distribution of the light emitted from the LED module 1. Compared to a configuration in which a lens separate from the cover 52 is attached to the cover 52, the cost can be reduced.

  In the lighting fixture 50 of the present embodiment described above, the above-described LED module 1 is provided as a light source, so that it is possible to reduce the cost and increase the light output.

  The lighting fixture 50 can improve heat dissipation by making the material of the fixture main body 51 a metal. In this case, the thickness dimension and the width dimension of the insulating substrate 5 are appropriately set so that the creepage distance between the lead frame substrate 3 of the LED module 1 and the instrument body 51 satisfies a prescribed creepage distance (for example, 5 mm or more). do it.

(Embodiment 8)
Below, the straight tube | pipe type LED lamp 60 of this embodiment is demonstrated based on FIG.

  The straight tube LED lamp 60 includes a straight tube (cylindrical) tube body 61 formed of a light-transmitting material, and a first base 62 provided at one end and the other end of the tube body 61 in the longitudinal direction. The second base 63 is provided, and the LED module 1 of Embodiment 2 is housed in the tube main body 61. The LED module 1 is not limited to the LED module 1 of the second embodiment, and may be any of the LED modules 1 of the other embodiments 1 and 3-6. As for straight tube LED lamps, for example, the Japan Light Bulb Industry Association has standardized “Straight tube LED lamp system with L-type pin cap GX16t-5 (for general lighting)” (JEL 801). Yes.

  As a material of the tube body 61, for example, transparent glass, milky white glass, transparent resin, milky white resin, or the like can be used.

  The first base 62 is provided with two power supply terminals (hereinafter referred to as power supply lamp pins) 64 and 64 that are electrically connected to the LED module 1. These two power supply lamp pins 64 and 64 can be electrically connected to each of the two power supply contacts of the power supply lamp socket held in the fixture body of the lighting fixture.

  The second base 63 is provided with one ground terminal (hereinafter referred to as a grounding lamp pin) 65 for grounding. The single grounding lamp pin 65 can be electrically connected to a grounding contact of a grounding lamp socket held in the instrument body.

  Each of the power supply lamp pins 64 is formed in an L shape, and protrudes along the longitudinal direction of the tube main body 61, and from the distal end portion of the pin main body 64 a to one radial direction of the tube main body 61. The key portion 64b extends along the key portion. The two key parts 64b are extended in directions away from each other. Each power supply lamp pin 64 is formed by bending an elongated metal plate.

  The grounding lamp pin 65 protrudes from the end surface (base reference surface) of the second base 63 to the side opposite to the tube body 61. The grounding lamp pin 65 is formed in a T shape. The LED lamp 60 satisfies the standard of “Straight-tube LED lamp system with L-type pin cap GX16t-5 (for general lighting)” (JEL 801) standardized by the Japan Light Bulb Industry Association. It is preferable to be configured.

  In the straight tube LED lamp 60 of the present embodiment described above, the above-described LED module 1 is provided in the tube main body 61, so that the cost can be reduced and the light output can be increased.

1 LED module (light source)
2 LED chip 3 Lead frame substrate 4 Resin portion 5 Insulating substrate 6b First wire 6c Second wire 9 Sealing portion 30 Metal hoop material 31 Circuit pattern portion 32 Mounting portion 32a Die pad 32b First lead 32c Second lead 33 Crosspiece 34 Connecting portion 35 Electrical connection portion 36 Connection switching portion 38 Cut groove 50 Lighting fixture 51 Appliance main body 60 Straight tube LED lamp 61 Tube main body 62 First cap 63 Second cap

Claims (13)

  A lead frame substrate in which a plurality of mounting portions for mounting LED chips are arranged in the first direction, a resin portion in which a part of the lead frame substrate is embedded and the mounting portions are exposed, and the mountings The LED chip mounted on each of the parts, and a length that is disposed on one surface side opposite to the mounting part side in the thickness direction of the resin part to support the resin part and have the first direction as a longitudinal direction A circuit pattern portion that includes the mounting portions and defines an electrical connection relationship between the mounting portions adjacent in the first direction, and the thickness direction. And the crosspieces arranged on both sides of the circuit pattern portion in the second direction orthogonal to the first direction and the mounting portions and the crosspieces for each mounting portion. Concatenation LED module characterized in that it comprises and.   The LED module according to claim 1, wherein each of the crosspieces is embedded in the insulating substrate.   The LED module according to claim 1, wherein a thermal conductivity of the insulating substrate is equal to or higher than a thermal conductivity of the resin portion.   Each mounting part includes a die pad on which the LED chip is mounted, a first lead that is continuous with the die pad and electrically connected to the first electrode of the LED chip via a first wire, and the second direction. And the second lead of the LED chip facing the die pad and electrically connected via a second wire, and in the mounting direction adjacent to each other in the first direction, the second direction 4. The LED module according to claim 1, wherein the first lead, the die pad, and the second lead are arranged in reverse order. 5.   The LED module according to claim 1, wherein the insulating substrate and the resin portion are separate bodies.   The circuit pattern portion is formed by forming a notch groove having one end in the second direction open at a side edge of the electrical connection portion that connects the mounting portions adjacent in the first direction. The LED module according to any one of claims 1 to 5.   The LED module according to claim 1, wherein the lead frame substrate and the resin portion also serve as a reflecting member that reflects light emitted from the LED chip.   8. The LED module according to claim 1, wherein the circuit pattern portion is formed so that a series circuit in which a desired number of the LED chips are connected in series can be connected in parallel.   A lead frame substrate in which a plurality of mounting portions for mounting LED chips are arranged in the first direction, a resin portion in which a part of the lead frame substrate is embedded and the mounting portions are exposed, and the mountings The LED chip mounted on each of the parts, and a length that is disposed on one surface side opposite to the mounting part side in the thickness direction of the resin part to support the resin part and have the first direction as a longitudinal direction A circuit pattern portion that includes the mounting portions and defines an electrical connection relationship between the mounting portions adjacent in the first direction, and the thickness direction. And the crosspieces arranged on both sides of the circuit pattern portion in the second direction orthogonal to the first direction and the mounting portions and the crosspieces for each mounting portion. Concatenation A first step of forming the lead frame substrate by stamping a metal hoop material with a press, and an insert molding method after the first step, A second step of molding the resin part in which a part of the lead frame substrate is embedded; a third step of mounting the LED chip on each mounting part after the second step; and a third step of And a fourth step of providing the insulating substrate so as to support the resin portion later.   A lead frame substrate in which a plurality of mounting portions for mounting LED chips are arranged in the first direction, a resin portion in which a part of the lead frame substrate is embedded and the mounting portions are exposed, and the mountings The LED chip mounted on each of the parts, and a length that is disposed on one surface side opposite to the mounting part side in the thickness direction of the resin part to support the resin part and have the first direction as a longitudinal direction A circuit pattern portion that includes the mounting portions and defines an electrical connection relationship between the mounting portions adjacent in the first direction, and the thickness direction. And the crosspieces arranged on both sides of the circuit pattern portion in the second direction orthogonal to the first direction and the mounting portions and the crosspieces for each mounting portion. Concatenation A first step of forming the lead frame substrate by stamping a metal hoop material with a press, and an insert molding method after the first step, A second step of molding the resin portion in which a part of the lead frame substrate is embedded; a third step of providing the insulating substrate so as to support the resin portion after the second step; And a fourth step of mounting the LED chip on each mounting portion after the step.   Between the first step and the second step, a fifth step is provided in which a metal film having a higher reflectivity with respect to light emitted from the LED chip than the metal hoop material is formed on the lead frame substrate. The manufacturing method of the LED module of Claim 9 or 10 characterized by the above-mentioned.   A lighting fixture comprising: a fixture main body; and a light source held by the fixture main body, wherein the light source comprises the LED module according to any one of claims 1 to 8.   A straight tubular tube main body formed of a translucent material, and a first base and a second base respectively provided at one end and the other end in the longitudinal direction of the tube main body. Item 9. A straight tube LED lamp comprising the LED module according to any one of items 1 to 8.

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