JP2012209366A - Double sided light emitting unit and lighting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a double sided light emitting unit and a lighting device which improve the heat radiation performance and achieve the high optical output.SOLUTION: A double sided light emitting unit 1 includes: a pair of heat transmission plates 21 and 24 disposed so as to be spaced away from each other in the thickness direction; and solid state light emitting elements 3 and 3 mounted on one surface sides of the respective heat transmission plates 21 and 24 which are opposite to facing surfaces of the heat transmission plates 21 and 24. The double sided light emitting unit 1 further includes a wiring pattern 22 disposed between both the heat transmission plates 21 and 24 and electrically connecting with the respective solid state light emitting elements 3 and 3; and a pair of insulation layers 23 and 25 respectively disposed between the heat transmission plate 21 and the wiring pattern 22 and between the heat transmission plate 24 and the wiring pattern 22. The respective heat transmission plates 21 and 24 are formed by a first metal plates and the wiring pattern 22 is formed by a second metal plate.

Description

  The present invention relates to a double-sided light emitting unit and a lighting device.

  Conventionally, as a surface light source using a visible light emitting diode chip (visible light LED chip), a light source device configured as shown in FIG. 15 has been proposed (Patent Document 1).

  The light source device includes a first visible light LED chip 103, a first transparent substrate 161 on which the first visible light LED chip 103 is mounted, and a first visible light LED chip provided on the first transparent substrate 161. 103 is provided with a first transparent electrode 171 for supplying power to the power supply 103. The light source device includes a second visible light LED chip 104, a second transparent substrate 162 on which the second visible light LED chip 104 is mounted so as to face the mounting surface side of the first transparent substrate 161, And a second transparent electrode 172 that is provided on the second transparent substrate 162 and supplies power to the second visible light LED chip 104.

  In the light source device described above, the light from the first visible light LED chip 103 can be extracted to the outside through the second transparent electrode 172 and the second transparent substrate 162, and from the second visible light LED chip 104. Can be extracted to the outside through the first transparent electrode 171 and the first transparent substrate 161.

  Conventionally, as shown in FIG. 16, an illuminating device 200 having a built-in LED light emitter 203 has been proposed (Patent Document 2).

  The light emitting unit main body 202 of the lighting device 200 includes a pair of mounting substrates 204 and 204 and a spacer 211 that connects and fixes the mounting substrates 204 and 204 together to form a gap 210 between the mounting substrates 204 and 204. Yes. The light emitting unit main body 202 is attached to the surface side of the mounting substrates 208 and 208, and the plastic wiring substrates 208 and 208 for the LED light emitters 203 attached to and integrally attached to the surfaces of the mounting substrates 204 and 204. Translucent covers 205, 205. Note that the mounting substrate 204 has a long and thin strip shape, and an aluminum extrusion mold is used. Further, as shown in FIGS. 16 and 17, the wiring board 208 has a plurality of LED light emitters 203 arranged at predetermined intervals.

JP-A-11-162233 JP 2009-266432 A

  In the light source device having the configuration of FIG. 15, the heat generated in the first visible light LED chip 103 is radiated mainly through the first transparent electrode 171 and the first transparent substrate 161, and the second visible light LED chip. The heat generated in 104 is considered to be dissipated mainly through the second transparent electrode 172 and the second transparent substrate 162. Therefore, in this light source device, for example, when the light output of the entire light source device is increased by increasing the light output of the first visible light LED chip 103 and the second visible light LED chip 104, There is a concern that the temperature rise of the first visible light LED chip 103 and the second visible light LED chip 104 cannot be sufficiently suppressed. For this reason, in the above-described light source device, there is a possibility that the increase in the light output is limited.

  Further, in the light emitting unit main body 202 and the lighting device 200 configured as shown in FIG. 16, it is considered that the heat generated by the LED light emitter 203 is radiated mainly through the wiring board 208 and the mounting plate 204. For this reason, in the light emitting unit main body 202 and the lighting device 200, when the light output of the entire light emitting unit main body 202 and the entire lighting device 200 is increased by increasing the light output of the LED light emitting body 203, the LED light emitting body. There is a concern that the temperature rise of 203 cannot be sufficiently suppressed. For this reason, in the above-mentioned light emission part main body 202 and the illuminating device 200, the high output of a light output may be restrict | limited.

  The present invention has been made in view of the above-described reasons, and an object of the present invention is to provide a double-sided light emitting unit and an illuminating device that can improve heat dissipation and can achieve high output of light. It is to provide.

  The double-sided light emitting unit of the present invention includes a pair of heat transfer plates that are formed of a first metal plate and are spaced apart from each other in the thickness direction, and one surface side opposite to each other of the heat transfer plates. A mounted solid light emitting element; a wiring pattern formed by a second metal plate; and disposed between the two heat transfer plates and electrically connected to the solid light emitting elements; the heat transfer plates and the wiring pattern; And a pair of insulating layers interposed between the two.

  In the double-sided light emitting unit, the solid state light emitting device is preferably an LED chip.

  In this double-sided light emitting unit, in the heat transfer plate, the first metal plate is an aluminum plate, and an aluminum film having a higher purity than the aluminum plate is laminated on the side opposite to the insulating layer side in the aluminum plate, The aluminum film is preferably formed by laminating an increased reflection film made of two types of dielectric films having different refractive indexes.

  The double-sided light emitting unit includes a color conversion unit including a phosphor and a translucent material that is excited by light emitted from the LED chip and emits light having a color different from that of the LED chip. The conversion unit is preferably in contact with the heat transfer plate.

  In this double-sided light emitting unit, each LED chip is provided with a first electrode and a second electrode on one surface side in the thickness direction, and each of the first electrode and the second electrode is connected via a wire. It is preferable that the heat transfer plate is formed with a through hole through which each of the wires passes.

  The illuminating device of this invention is equipped with the said double-sided light emission unit, It is characterized by the above-mentioned.

  In the light emitting unit of the present invention, it is possible to improve heat dissipation and increase the light output.

  In the illuminating device of this invention, it is possible to improve heat dissipation and to increase the light output.

(A) is a principal part schematic perspective view of the double-sided light emission unit of Embodiment 1, (b) is a principal part perspective view in which the double-sided light emission unit of Embodiment 1 was partially fractured. 2 is a schematic perspective view of a double-sided light emitting unit of Embodiment 1. FIG. 3 is a schematic exploded perspective view of a mounting board in the double-sided light emitting unit of Embodiment 1. FIG. 2 is a schematic cross-sectional view of a double-sided light emitting unit of Embodiment 1. FIG. 3 is a perspective view of a main part of a mounting substrate in the double-sided light emitting unit of Embodiment 1. FIG. It is explanatory drawing of the manufacturing method of the mounting substrate in the double-sided light emission unit of Embodiment 1. FIG. It is explanatory drawing of the manufacturing method of the mounting substrate in the double-sided light emission unit of Embodiment 1. FIG. 6 is a schematic cross-sectional view of another configuration example of the double-sided light emitting unit of Embodiment 1. FIG. 6 is a schematic cross-sectional view of still another configuration example of the double-sided light emitting unit of Embodiment 1. FIG. 4 is a schematic cross-sectional view of another configuration example of the double-sided light emitting unit of Embodiment 1. FIG. FIG. 6 is a partially broken perspective view of still another structural example of the double-sided light emitting unit of Embodiment 1. It is a schematic perspective view of the illuminating device of Embodiment 1. FIG. It is a schematic perspective view of the double-sided light emitting unit of Embodiment 2. It is a schematic exploded perspective view of the illuminating device of Embodiment 2. It is a schematic block diagram of the light source device of a prior art example. It is principal part sectional drawing of the illuminating device of a prior art example. It is the top view which a part of mounting substrate in the light emission part main body of the prior art example cut away.

(Embodiment 1)
Hereinafter, the double-sided light emitting unit 1 of this embodiment is demonstrated based on FIGS.

  The double-sided light emitting unit 1 includes a pair of heat transfer plates 21 and 24 that are arranged apart from each other in the thickness direction, and a solid state light emitting device that is mounted on one side of the heat transfer plates 21 and 24 opposite to the opposing surface. 3 and 3. In addition, the double-sided light emitting unit 1 is arranged between the heat transfer plates 21 and 24, the wiring pattern 22 that is electrically connected to the solid light emitting elements 3 and 3, and the heat transfer plates 21 and 24 and the wiring pattern 22. And a pair of insulating layers 23 and 25 interposed between the two. Here, each of the heat transfer plates 21 and 24 is formed of a first metal plate, and the wiring pattern 22 is formed of a second metal plate. In the present embodiment, the pair of heat transfer plates 21 and 24, the pair of insulating layers 23 and 25, and the wiring pattern 22 constitute the mounting substrate 2 on which all the solid state light emitting devices 3 are mounted.

  Hereinafter, each component of the double-sided light emitting unit 1 will be described in detail.

  Each of the heat transfer plates 21 and 24 is formed in a long shape (here, an elongated rectangular plate shape). In addition, each of the heat transfer plates 21 and 24 has a plurality of solid light emitting elements 3 arranged along the longitudinal direction of the heat transfer plates 21 and 24 on the one surface side.

  As the material of the first metal plate that is the basis of the heat transfer plates 21 and 24, a metal having high thermal conductivity such as aluminum and copper is preferable. However, the material of the first metal plate is not limited to these, and may be stainless steel or steel, for example.

Moreover, it is preferable that each heat-transfer plate 21 and 24 has a function as a reflecting plate, and it is more preferable to employ | adopt aluminum as a material of a 1st metal plate. In each of the heat transfer plates 21 and 24, the first metal plate is an aluminum plate, and an aluminum film having a purity higher than that of the aluminum plate is laminated on the side opposite to the insulating layers 23 and 25 side of the aluminum plate. Further, it is preferable that a reflection increasing film made of two types of dielectric films having different refractive indexes is laminated. Here, as the two types of dielectric films, for example, an SiO ₂ film and a TiO ₂ film are preferably employed. By using such heat transfer plates 21 and 24, the reflectance with respect to visible light can be 95% or more. As such heat transfer plates 21 and 24, for example, MIRO2 or MIRO (registered trademark) manufactured by alanod can be used. As the above-mentioned aluminum plate, an anodized surface may be used. In addition, what is necessary is just to set the thickness of each heat exchanger plates 21 and 24 suitably in the range of about 0.2-3 mm, for example.

  Although the LED chip is used as the solid state light emitting device 3, the present invention is not limited to this, and for example, an LED chip may be housed in a package. Moreover, as the solid light emitting element 3, for example, a laser diode (semiconductor laser), an organic EL element, or the like may be used.

  As shown in FIG. 4, the solid light emitting element 3 mounted on each heat transfer plate 21, 24 is provided with a first electrode (anode electrode) 31 and a second electrode (cathode electrode) 32 on one surface side in the thickness direction. The other surface side in the thickness direction is joined to the heat transfer plates 21 and 24 via the joint portion 35. In the solid state light emitting device 3, each of the first electrode 31 and the second electrode 32 is electrically connected to the wiring pattern 22 via a wire (bonding wire) 26. Here, the heat transfer plates 21 and 24 are formed with through holes 21b and 24b through which the respective wires 26 pass. The through holes 21 b and 24 b are formed on both sides of the mounting region of the solid state light emitting device 3 in the width direction of the heat transfer plates 21 and 24. The through holes 21b and 24b have a circular opening shape. The inner diameters of the through holes 21b and 24b are set to 0.5 mm, but this value is an example and is not particularly limited. The shape of the through holes 21b and 24b is not limited to a circular shape, and may be, for example, a rectangular shape or an elliptical shape. In the case where the solid light emitting element 3 is an LED chip, the bonding portion 35 may be formed of a die bond material.

  The LED chip is a GaN-based blue LED chip that emits blue light, and uses a sapphire substrate as a substrate. However, the substrate of the LED chip is not limited to the sapphire substrate, and may be a GaN substrate, a SiC substrate, a Si substrate, or the like. The structure of the LED chip is not particularly limited.

  The chip size of the LED chip is not particularly limited, and for example, those having a chip size of 0.3 mm □, 0.45 mm □, or 1 mm □ can be used.

  Moreover, the material and luminescent color of the light emitting layer of the LED chip are not particularly limited. That is, the LED chip is not limited to the blue LED chip, and for example, a violet light LED chip, an ultraviolet light LED chip, a red LED chip, a green LED chip, or the like may be used.

  As the die bond material, for example, a silicone die bond material, an epoxy die bond material, a silver paste, or the like can be used.

  Moreover, as the wire 26, a gold wire, an aluminum wire, etc. can be used, for example.

  When the LED chip is used as the solid light emitting element 3, the double-sided light emitting unit 1 seals the solid light emitting element 3 and the wires 26 on the one surface side of the heat transfer plates 21 and 24, for example, as shown in FIG. It is preferable to provide the sealed part 36. In FIG. 4, a silicone resin that is a first light transmissive material is used as the material of the sealing portion 36. The first light transmissive material is not limited to a silicone resin, and for example, an epoxy resin, an acrylic resin, glass, or the like may be used.

  In addition, when the double-sided light emitting unit 1 uses an LED chip as the solid state light emitting element 3, in order to obtain high-output white light, a wavelength conversion material that emits light of a color different from the emission color of the LED chip is used. It is preferable that the color conversion unit 37 is provided. As such a color conversion unit 37, for example, a phosphor that is excited by light emitted from the LED chip and emits light of a color different from the emission color of the LED chip is used as the wavelength conversion material. Those containing two light-transmitting materials are preferred.

  If the double-sided light emitting unit 1 uses, for example, a blue LED chip as the LED chip and a yellow phosphor as the phosphor of the color conversion unit 37, white light can be obtained. That is, the double-sided light emitting unit 1 can obtain white light by emitting the blue light emitted from the LED chip and the light emitted from the yellow phosphor through the surface of the color conversion unit 37. Silicone resin is used as the second translucent material used as the material of the color conversion unit 37, but is not limited to this. For example, acrylic resin, glass, organic component and inorganic component are mixed at the nm level or the molecular level. Alternatively, a combined organic / inorganic hybrid material may be employed. Further, the phosphor used as the material of the color conversion unit 37 is not limited to the yellow phosphor. For example, the color rendering can be achieved by using a yellow phosphor and a red phosphor, or using a red phosphor and a green phosphor. It becomes possible to raise. The phosphor used as the material of the color conversion unit 37 is not limited to one type of yellow phosphor, and two types of yellow phosphors having different emission peak wavelengths may be used.

  Further, when the LED chip can emit white light alone, when the phosphor is dispersed in the sealing portion 36, or when the light color desired to be obtained by the double-sided light emitting unit 1 is the same as the emission color of the LED chip A structure that does not include the color conversion unit 37 can be employed.

  In the double-sided light emitting unit 1, the color conversion unit 37 is preferably in contact with the heat transfer plates 21 and 24. As a result, the double-sided light emitting unit 1 can dissipate not only the heat generated in the LED chip but also the heat generated in the color conversion section 37 through the heat transfer plates 21 and 24, thereby increasing the light output. It becomes possible. In the example shown in FIG. 4, the color conversion unit 37 is formed in a semi-cylindrical shape, and the LED chip and the sealing are provided between the heat transfer plates 21 and 24 on the one surface side of the heat transfer plates 21 and 24. It arrange | positions in the form surrounding the stop part 36 grade | etc.,. More specifically, the color conversion unit 37 is disposed such that a gas layer (for example, an air layer) 38 is formed between the heat transfer plate 21 and the sealing unit 36 on the one surface side. In the double-sided light emitting unit 1, as shown in FIG. 8, the color conversion unit 37 may have a hemispherical shape, and the LED chip and the wire 26 that are the solid light emitting elements 3 may be sealed by the color conversion unit 37. Further, as shown in FIG. 9, the double-sided light emitting unit 1 is configured so that the color conversion unit 37 has a dome shape and the color conversion unit 37 seals the LED chip and the wire 26 that are the solid light emitting elements 3. Also good. Further, as shown in FIG. 10, the double-sided light emitting unit 1 is configured so that the color conversion unit 37 has a layered shape, and the LED chip and the wire 26 that are the solid light emitting elements 3 are sealed by the color conversion unit 37. Also good. The color conversion unit 37 as shown in FIG. 4 or FIG. 9 uses a molded one, and the edge (periphery of the opening) on the heat transfer plates 21 and 24 side with respect to the heat transfer plates 21 and 24, for example, What is necessary is just to adhere using adhesives (for example, silicone resin, an epoxy resin, etc.). Moreover, the color conversion part 37 as shown in FIG. 8 can be formed by a shaping | molding method, for example. Further, the color conversion unit 37 as shown in FIG. 10 can be formed by, for example, a coating method using a dispenser, a screen printing method, or the like.

  As described above, the wiring pattern 22 is formed of the second metal plate having a linear expansion coefficient different from that of the heat transfer plates 21 and 24. Here, the second metal plate uses a lead frame 120 (see FIG. 7C) formed by stamping a metal hoop material with a press.

  The material of the second metal plate is preferably copper having a relatively high thermal conductivity among metals (the thermal conductivity of copper is about 398 W / m · K), but is not limited to copper, for example, phosphor bronze, etc. Alternatively, a copper alloy (for example, 42 alloy) may be used. Moreover, it is preferable to set the thickness of a 2nd metal plate in the range of about 100 micrometers-1500 micrometers, for example.

  In the lead frame 120, the wiring pattern 22 is supported on the inner side of the outer frame portion 121 via a support piece 122 (see FIG. 7D).

  In the wiring pattern 22, a first pattern 22 a to which the first electrode 31 of the solid light emitting element 3 is connected and a second pattern 22 b to which the second electrode 32 is connected are arranged in the width direction of the heat transfer plates 21 and 24. Has been placed. In addition, the wiring pattern 22 includes a predetermined number (for example, 16) of the first pattern 22a and the second pattern 22b, respectively, and the first pattern 22a and the second pattern 22b respectively include the heat transfer plates 21 and 24. Are arranged side by side in the longitudinal direction (see FIG. 5). The first pattern 22a and the second pattern 22b are formed in a rectangular shape, and are arranged so that the longitudinal directions thereof coincide with the heat transfer plates 21 and 24. In the wiring pattern 22, the first patterns 22a arranged in the longitudinal direction of the heat transfer plates 21 and 24 are divided into two sets, and the first patterns 22a forming the set are connected by the connecting piece 22c. Yes. In addition, the wiring pattern 22 includes a predetermined number (for example, 16) of second patterns 22b arranged in the longitudinal direction of the heat transfer plates 21 and 24. The second patterns 22b are divided into groups each having two sets. The two are connected and electrically connected by a connecting piece 22d. The connecting pieces 22c and 22d are linear first portions 22ca and 22da arranged along the width direction of the heat transfer plates 21 and 24, and heat transfer plates from both longitudinal ends of the first portions 22ca and 22da. 21 comprises a second part 22cb, 22db and a third part 22cc, 22dc extending in opposite directions in the longitudinal direction. The connecting piece 22c is formed narrower than the first pattern 22a, and the connecting piece 22d is formed narrower than the second pattern 22b. Here, the wiring pattern 22 includes two first patterns 22a forming a set, a connecting piece 22c connecting the two first patterns 22a, two second patterns 22b forming a set, One unit pattern 22u is constituted by the connecting piece 22d obtained by connecting the second patterns 22b. In the lead frame 120 described above, a plurality of unit units 22 u are arranged along the length direction of the outer frame portion 121. Further, in the wiring pattern 22, in the unit patterns 22u adjacent to each other in the longitudinal direction of the heat transfer plates 21, 24, the first pattern 22a of one unit pattern 22u and the second pattern 22b of the other unit pattern 22u are connected pieces. 22e is connected and electrically connected. The connecting piece 22e is formed narrower than the first pattern 22a and the second pattern 22b.

  The wiring pattern 22 is configured so that a parallel circuit can be configured by connecting in parallel a predetermined number (for example, six) of solid-state light emitting elements 3 arranged in the longitudinal direction of the heat transfer plates 21 and 24 for each unit pattern 22u. Thus, parallel circuits formed for each adjacent unit pattern 22u can be connected in series. Therefore, by supplying power between the first pattern 22a at one end in the longitudinal direction of the heat transfer plates 21 and 24 and the second pattern 22b at the other end, power can be supplied to all the solid state light emitting devices 3. it can.

  Further, the insulating layers 23 and 25 contain a filler made of a filler such as silica or alumina and have a property of lowering viscosity and increasing fluidity upon heating, and a B-stage epoxy resin layer (thermosetting resin). It is formed by thermosetting an epoxy resin layer of a thermosetting sheet adhesive (for example, an adhesive sheet TSA manufactured by Toray Industries, Inc.) in which a plastic film (PET film) is laminated. As the filler, an insulating material having higher thermal conductivity than the epoxy resin that is a thermosetting resin may be used. Here, the epoxy resin layer of the sheet-like adhesive has properties of being electrically insulating and having high thermal conductivity, high fluidity during heating, and high adhesion to the uneven surface. Therefore, it is possible to prevent the generation of voids between the insulating layers 23 and 25 and the heat transfer plates 21 and 24 and the wiring pattern 22, thereby improving the adhesion reliability and increasing the thermal resistance due to insufficient adhesion. It becomes possible to suppress the occurrence of variation. Therefore, compared with the case where a rubber sheet-like heat radiation sheet such as Sarcon (registered trademark) is sandwiched between the heat transfer plates 21, 24 and the wiring pattern 22, each solid light emitting element 3 to the wiring pattern 22. The thermal resistance can be reduced, the variation in thermal resistance can be reduced, the heat dissipation is improved, and the temperature rise of the junction temperature of each solid state light emitting device 3 can be suppressed, so that the input power can be increased and the light output is increased. Can be achieved. The thickness of the epoxy resin layer described above is set to 100 μm, but this value is merely an example, and is not particularly limited. For example, the thickness may be appropriately set in the range of about 50 μm to 150 μm. Note that the thermal conductivity of the epoxy resin layer is preferably 4 W / m · K or more. Further, the plastic film of the sheet adhesive is peeled from the epoxy resin layer before the wiring pattern 22 and the heat transfer plates 21 and 24 are overlapped. In short, after fixing one surface of the epoxy resin layer opposite to the plastic film side to the object, the plastic film is peeled off.

  Here, when forming the insulating layers 23 and 25, the heat transfer plates 21 and 24, the epoxy resin layer, and the lead frame 120 having the wiring pattern 22 may be appropriately pressed.

  The outer size of the insulating layers 23 and 25 may be set as appropriate based on the outer size of the lead frame 120. Here, the insulating layers 23 and 25 have electrical insulation and thermal conductivity, and have a function of electrically insulating and thermally coupling the heat transfer plates 21 and 24 and the wiring pattern 22.

  The insulating layers 23 and 25 are formed with through holes 23b and 25b communicating with the through holes 21b and 24b of the heat transfer plates 21 and 24, respectively. Therefore, when manufacturing the double-sided light emitting unit 1, the wire 26 can be bonded to the wiring pattern 22 through the through holes 21 b and 24 b of the heat transfer plates 21 and 24 and the through holes 23 b and 25 b of the insulating layers 23 and 25. Here, at the time of manufacturing the double-sided light emitting unit 1, the first electrode 31 and the second electrode 32 of the solid state light emitting device 3 are respectively connected to the first pattern 22 a and the second pattern 22 b through the wire 26, and then, for example, a dispenser By filling the through holes 21b and 24b and the through holes 23b and 25b with the material of the sealing portion 36 (see FIG. 4) to prevent the wire 26 from contacting the first metal plate, the sealing portion 36 is then What is necessary is just to form.

  By the way, the wiring pattern 22 is made of a metal material having higher oxidation resistance and corrosion resistance than the second metal plate, and a surface treatment layer (not shown) having high adhesion to the insulating layers 23 and 25 is formed. Preferably it is. When the material of the second metal plate is Cu, as the surface treatment layer, for example, a Ni film, a laminated film of Ni film and Au film, a laminated film of Ni film, Pd film and Au film, or the like may be formed. preferable. The surface treatment layer may be formed by, for example, a plating method.

  By the way, depending on the heat capacity of the heat transfer plates 21 and 24, if the heating temperature of the epoxy resin layer is raised to about 170 ° C. and cured, the fixing performance between the heat transfer plates 21 and 24 and the wiring pattern 22 may be increased. If the heating temperature is lowered to about 150 ° C. and cured, the electrical insulation between the heat transfer plates 21 and 24 and the wiring pattern 22 may be lowered. That is, there is a trade-off relationship between fixing performance and electrical insulation. Therefore, in the present embodiment, as described later, the epoxy resin layers 123a and 133a (see FIGS. 6C and 7C) of the sheet-like adhesives 123 and 133 (see FIGS. 6B and 7A) are used. b) see) are overlapped, one epoxy resin layer 123a is cured at 170 ° C. to ensure electrical insulation and thermal conductivity, and the other epoxy resin layer 133a is fixed by curing at 150 ° C. Performance and heat conductivity are ensured. More specifically, after one epoxy resin layer 123a is fixed to the heat transfer plate 21 as an object at 170 ° C., the other epoxy resin layer 133a and the lead frame 120 are overlapped to overlap the other epoxy resin layer 133a. May be cured at 150 ° C. Thereby, in the manufacture of the double-sided light emitting unit 1 of the present embodiment, it is possible to satisfy both the requirements of the fixing performance and the electrical insulation regardless of the heat capacity of the heat transfer plates 21 and 24.

  Hereinafter, a method for joining the heat transfer plate 21 and the wiring pattern 22 will be briefly described with reference to FIGS. 6 and 7.

  First, the structure shown in FIG. 6A is obtained by forming the through holes 21b and the like in the heat transfer plate 21.

  Thereafter, as shown in FIG. 6B, the sheet-like adhesive 123 is overlapped on the other surface side of the heat transfer plate 21 so that the epoxy resin layer 123 a is in contact with the heat transfer plate 21, and the cylindrical rubber roller 140 is used. The sheet-like adhesive 123 is heated at a first specified temperature (eg, 110 ° C. to 120 ° C.) lower than the curing temperature of the epoxy resin layer 123a while being pressurized at a predetermined pressure (eg, 0.5 MPa). Temporarily adhere to. Subsequently, the sheet adhesive 123 is cut to an appropriate length.

  Thereafter, the heat transfer plate 21 to which the sheet-like adhesive 123 is temporarily fixed is naturally cooled. Subsequently, as shown in FIG. 6C, the plastic film 123b is peeled off from the epoxy resin layer 123a.

  Thereafter, the heat transfer plate 21 on which the epoxy resin layer 123a is temporarily fixed is put into a drying furnace (not shown), and the epoxy resin layer 123a is heated and cured at a temperature equal to or higher than the curing temperature (for example, 170 ° C.). As a result, the epoxy resin layer 123a is permanently fixed to the heat transfer plate 21.

  Thereafter, the sheet-like adhesive 133 is stacked on the epoxy resin layer 123a so that the epoxy resin layer 133a is in contact with the epoxy resin layer 123a, and is pressurized with a predetermined pressure (for example, 0.5 MPa) by the cylindrical rubber roller 140 and the epoxy resin. The sheet adhesive 133 is temporarily fixed to the epoxy resin layer 123a by heating at a first specified temperature (for example, 110 ° C. to 120 ° C.) lower than the curing temperature of the layer 133a. Subsequently, the sheet adhesive 133 is cut to an appropriate length.

  Thereafter, in the laminated structure of the epoxy resin layer 123a and the epoxy resin layer 133a, in each region corresponding to the through hole 23b of the insulating layer 23, as shown in FIG. Form. The means for forming the through hole 134 is not limited to the laser device 150, and for example, a drill or the like may be used.

  Then, as shown in FIG.7 (b), the plastic film 133b is peeled from the epoxy resin layer 133a.

  Thereafter, as shown in FIG. 7C, after the lead frame 120 is placed on the epoxy resin layer 133a and an appropriate load is applied, the epoxy resin layer 133a is cured in a drying furnace (not shown). The lead frame 120 and the epoxy resin layer 133a are permanently fixed by curing at a temperature higher than the temperature (for example, 150 ° C.). Thereby, the insulating layer 23 is formed.

  Thereafter, the wiring pattern 22 is cut from the support piece 122 of the lead frame 120, and the portions other than the wiring pattern 22 in the lead frame 120 are removed as shown in FIG.

  Thereafter, the mounting substrate 2 is bonded by bonding the heat transfer plate 24 and the wiring pattern 22 via the insulating layer 25 in the same manner as the heat transfer plate 21 and the wiring pattern 22 are bonded via the insulating layer 23. Can be obtained.

  In manufacturing the double-sided light emitting unit 1, the solid light emitting element 3 is joined to the one surface side of the heat transfer plates 21 and 24, and then the first electrode 31 and the second electrode 32 of each solid light emitting element 3 and the first pattern are combined. What is necessary is just to electrically connect 22a and the 2nd pattern 22b via the wire 26. FIG. Then, the sealing part 36 and the color conversion part 37 should just be provided in the said one surface side of the heat exchanger plates 21 and 24 as needed.

  As described above, the double-sided light emitting unit 1 of the present embodiment includes a pair of heat transfer plates 21 and 24 formed of the first metal plate and spaced apart in the thickness direction, and the heat transfer plates 21 and 24. The solid light-emitting elements 3 and 3 mounted on the one surface side opposite to each other's facing surface and the second metal plate are disposed between the two heat transfer plates 21 and 24, and each solid light-emitting element 3 Are electrically connected to each other, and a pair of insulating layers 23 and 25 interposed between each of the heat transfer plates 21 and 24 and the wiring pattern 22. Thereby, the double-sided light emitting unit 1 of the present embodiment can efficiently dissipate the heat generated in each solid light emitting element 3 by efficiently transferring the heat in the lateral direction by the heat transfer plates 21 and 24. Therefore, in the double-sided light emitting unit 1 of the present embodiment, it is possible to improve heat dissipation, suppress the temperature rise of each solid state light emitting element 3, and increase the light output.

  Further, in the double-sided light emitting unit 1 of the present embodiment, by using the solid light emitting element 3 as an LED chip, the heat generated in the LED chip is transferred in the lateral direction by the heat transfer plates 21 and 24 and efficiently dissipated. Is possible.

  Moreover, in the double-sided light emitting unit 1 of this embodiment, the 1st metal plate used as the foundation of the heat exchanger plate 21 is an aluminum plate, and the purity is higher than an aluminum plate on the opposite side to the 1st insulating layer 23 side in an aluminum plate. The aluminum film is laminated, and the aluminum film is laminated with the reflection-increasing film made of two kinds of dielectric films having different refractive indexes. Therefore, the light emitted from the LED chip and incident on the one surface of the heat transfer plates 21 and 24 Can be efficiently reflected. In short, the double-sided light emitting unit 1 can reduce the light loss in the heat transfer plates 21 and 24 by using the heat transfer plates 21 and 24 having a function as a reflection plate, thereby reducing the light output. High output can be achieved. In particular, the double-sided light emitting unit 1 can efficiently dissipate the heat generated in the LED chip when the LED chip is used as the solid state light emitting element 3, and the light output can be increased. It becomes possible to improve the utilization efficiency of the light emitted from the LED chip. Further, when the double-sided light emitting unit 1 includes the color conversion unit 37 (see FIG. 4 and the like), the light emitted from the phosphor that is the wavelength conversion material of the color conversion unit 37 to the heat transfer plates 21 and 24 side, Since it is possible to reflect the light emitted from the LED chip and scattered by the phosphors toward the heat transfer plates 21 and 24, it is possible to improve the light utilization efficiency.

  Moreover, the double-sided light emitting unit 1 of this embodiment is provided with the heat transfer plates 21 and 24 and the wiring pattern 22 formed using the lead frame 120, so that the solid state light emitting device 3 is printed on two metal base prints. Compared with the case where it is mounted on a wiring board, it is possible to increase the optical output at a lower cost.

  Further, in the double-sided light emitting unit 1 of the present embodiment, the solid light emitting element 3 is an LED chip, and the first electrode 31 and the second electrode 32 are provided on one surface side in the thickness direction. Each of the two electrodes 32 is electrically connected to the wiring pattern 22 through the wire 26, and the heat transfer plates 21 and 24 are formed with through holes 21b and 24b through which the respective wires 26 pass. The LED chip can be die-bonded to the heat transfer plates 21 and 24, and the heat generated by the LED chip is easily transferred in the lateral direction of the heat transfer plates 21 and 24, so that the heat dissipation can be improved.

  When an LED chip is used as the solid light-emitting element 3, the light is transmitted through a submount member that relieves stress acting on the LED chip due to the difference in linear expansion coefficient between the solid light-emitting element 3 and the heat transfer plates 21 and 24. You may make it die-bond to the hot plates 21 and 24. FIG. Here, it is preferable to use the submount member formed in a planar size larger than the chip size of the LED chip. When the LED chip is a GaN-based blue LED chip and the first metal plate is an aluminum plate, for example, AlN, composite SiC, Si, CuW, or the like can be used as the material of the submount member. In addition, the submount member is formed with a reflective film that reflects light emitted from the LED chip around the bonding portion with the LED chip on the surface to which the LED chip is bonded (that is, the portion overlapping the LED chip). It is preferable that In addition, when an LED chip having electrodes provided on both sides in the thickness direction is used, the first electrode 31 or the second electrode 32 disposed on the submount member side of the LED chip is electrically connected to the submount member. It is only necessary to provide a conductor pattern to be connected to, and to electrically connect the conductor pattern and the first pattern 22a or the second pattern 22b via the wire 26.

  Further, in the above-described double-sided light emitting unit 1, the through holes 21 b are formed on both sides of the solid light emitting element 3 mounting region in the width direction of the heat transfer plate 21. In other words, the solid state light emitting device 3 is mounted at a portion between the two through holes 21 b arranged in the width direction of the heat transfer plate 21. However, without being limited thereto, for example, as shown in FIG. 11, between two sets arranged in the longitudinal direction of the heat transfer plate 21 among the sets of two through holes 21 b arranged in the width direction of the heat transfer plate 21, You may make it arrange | position the solid light emitting element 3. FIG. Note that the solid-state light emitting element 3 mounted on the heat transfer plate 24 may be arranged in the same manner as in FIG.

  The double-sided light emitting unit 1 of the present embodiment can be used as a light source for various lighting devices. For example, a straight tube LED lamp 300 as shown in FIG. 12 can be configured as an example of a lighting device including the double-sided light emitting unit 1 of the present embodiment. As for a general straight tube LED lamp, for example, the Japan Light Bulb Industry Association has established a standard of “Straight tube LED lamp system with L-type pin cap GX16t-5 (for general illumination)” (JEL 801). The straight tube LED lamp 300 of FIG. 12 is designed to satisfy the JEL 801 standard.

  The straight tube LED lamp 300 of FIG. 12 is provided in a straight tubular tube main body 302 formed of a light-transmitting material (for example, glass) and one end and the other end of the tube main body 302 in the longitudinal direction. The above-described double-sided light emitting unit 1 (see FIG. 1 and the like) is housed in the tube main body 302.

  A base 303 provided at one end of the tube main body 302 in the longitudinal direction is held by the first lamp socket of the first lamp socket and the second lamp socket of the lighting fixture, and the double-sided light emitting unit 1 in the tube main body 302. Two first lamp pins (terminals) 314 for supplying power to are provided. The base 304 at the other end in the longitudinal direction of the tube main body 302 is provided with a single second lamp pin (terminal) 315 for grounding that is held by the second lamp socket.

  The two first lamp pins 314 protrude from the end surface (first base reference surface) of the base 303 to the side opposite to the tube main body 302 side. Here, the first lamp pin 314 is electrically connected to the wiring pattern 22 of the double-sided light emitting unit 1 housed in the tube main body 302.

  Each of the first lamp pins 314 has an L-shaped portion protruding from the end face of the base 303, a pin body 314 a protruding along the longitudinal direction of the tube body 302, and the tube body 302 from the tip of the pin body 314 a. And a key portion 314b extending along one radial direction. Here, the two key portions 314b are extended in directions away from each other. The first lamp pin 314 is formed by bending an elongated conductive plate.

  The second lamp pin 315 protrudes from the end surface (second base reference surface) of the base 304 to the side opposite to the tube main body 302 side. Here, the second lamp pin 315 has a T-shaped portion protruding from the end face of the base 304, and is provided at the pin body 315a protruding along the longitudinal direction of the tube body 302 and the tip of the pin body 315a. And a terminal portion 315b having an oblong shape when viewed from the front.

  In the straight tube LED lamp 300 of the present embodiment, it is possible to improve heat dissipation and increase the light output as compared with the conventional straight tube LED lamp and the lighting device shown in FIG. Can be achieved.

  The lighting device including the double-sided light emitting unit 1 of the present embodiment is not limited to the straight tube LED lamp 300 described above, and may be, for example, a lighting fixture including a fixture body that houses the double-sided light emitting unit 1. Here, in the double-sided light emitting unit 1, semicircular cutouts 21 c and 24 c are substantially spaced apart in the longitudinal direction of the heat transfer plates 21 and 24 at both side edges in the width direction of the heat transfer plates 21 and 24. It is formed at equal intervals. Therefore, the notches 21c and 24c in the heat transfer plates 21 and 24 of the double-sided light emitting unit 1 should be semicircular with a radius smaller than the circular head of the screw for attaching the double-sided light emitting unit 1 to the instrument body. The double-sided light emitting unit 1 can be held between the screw head and the instrument body. In this illuminating device, the stress applied to each solid-state light emitting element 3 and each joint 35 can be reduced.

  In the illuminating device of this embodiment demonstrated above, by providing the above-mentioned double-sided light emission unit 1, it is possible to improve heat dissipation and to increase the light output.

  In addition, arrangement | positioning of the double-sided light emission unit 1 in an illuminating device is not specifically limited. For example, in the lighting device, a plurality of double-sided light emitting units 1 may be arranged in a straight line. In this case, the wiring patterns 22 of the adjacent double-sided light emitting units 1 are connected to, for example, a wire for feeding wiring (not shown). ) Or a connector (not shown) or the like. Thereby, in the illuminating device including the plurality of double-sided light emitting units 1, power is supplied from one power supply unit to the series circuit of the double-sided light emitting units 1, and all the solid state light emitting elements 3 of each double-sided light emitting unit 1 Can be emitted.

(Embodiment 2)
Hereinafter, the double-sided light emitting unit 1 of this embodiment is demonstrated based on FIG.

  The basic configuration of the light emitting unit 1 of the present embodiment is substantially the same as that of the first embodiment, and the shape of the mounting substrate 2 is different. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted.

  In the double-sided light emitting unit 1 of the present embodiment, the shape of the heat transfer plates 21 and 24 in plan view is an octagonal shape, and each of the heat transfer plates 21 and 24 has a plurality of (12 in the illustrated example). × 6) solid state light emitting devices 3 are arranged in a two-dimensional array. Here, the shape of the heat transfer plates 21 and 24 is not limited to the octagonal shape, and may be other polygonal shapes, circular shapes, elliptical shapes, or the like.

  The wiring pattern 22 in the double-sided light emitting unit 1 of the present embodiment is also formed using a lead frame (not shown). The double-sided light emitting unit 1 supplies power from the power supply unit by connecting the electric wires 63 and 63 (see FIG. 14) to the first terminal pattern 22f and the second terminal pattern 22g of the wiring pattern 22 by soldering or the like. it can.

  In the double-sided light emitting unit 1 of the present embodiment, as with the double-sided light emitting unit 1 of the first embodiment, it is possible to improve heat dissipation and to increase the light output.

  Here, as an example of a lighting device including the above-described planar light emitting unit 1, a lighting fixture 40 having a configuration illustrated in FIG. 14 is illustrated.

  The lighting fixture 40 having the configuration shown in FIG. 14 includes a flat first cover member 50 in which a housing recess 51 for housing the double-sided light emitting unit 1 is formed on one surface in the thickness direction, and a housing recess for the first cover member 50. The instrument main body is constituted by the second cover member 60 accommodated in 51 so as to cover the double-sided light emitting unit 1. A spacer (not shown) is provided between each of the double-sided light emitting unit 1 and the first cover member 50 and the second cover member 60. Further, the first cover member 50 is formed with a notch 54 through which the electric wires 63 and 63 for feeding power to the double-sided light emitting unit 1 are inserted. Here, in each electric wire 63, 63, a power supply unit (not shown) provided separately is provided on the side opposite to one end connected to the first terminal pattern 22f and the second terminal pattern 22g of the double-sided light emitting unit 1. A second connector 70 is provided that is detachably connected to a first output connector (not shown).

  For example, the first cover member 50 and the second cover member 60 may be entirely formed of a translucent material, or only a portion for extracting light emitted from the double-sided light emitting unit 1 is formed of the translucent material. May be. Moreover, the lighting fixture which comprises an illuminating device does not specifically limit the shape and structure of a fixture main body. Further, the lighting device is not limited to the lighting fixture 40, and may be a display device, for example.

  In the illuminating device of this embodiment demonstrated above, by providing the above-mentioned double-sided light emission unit 1, it is possible to improve heat dissipation and to increase the light output.

1 Double-sided light emitting unit 3 Solid state light emitting device (LED chip)
21 Heat Transfer Plate 21b Through Hole 22 Wiring Pattern 23 Insulating Layer 24 Heat Transfer Plate 24b Through Hole 25 Insulating Layer 26 Wire 31 First Electrode 32 Second Electrode 37 Color Conversion Unit 40 Lighting Fixture (Lighting Device)
300 Straight tube LED lamp (lighting device)

Claims (6)

  A pair of heat transfer plates formed by the first metal plate and spaced apart from each other in the thickness direction, and a solid state light emitting device mounted on one surface side opposite to the opposing surfaces of each heat transfer plate, A wiring pattern formed by a second metal plate and disposed between the two heat transfer plates and electrically connected to the solid state light emitting elements, and interposed between each of the heat transfer plates and the wiring pattern. A double-sided light emitting unit comprising a pair of insulating layers.   The double-sided light emitting unit according to claim 1, wherein the solid state light emitting device is an LED chip.   In the heat transfer plate, the first metal plate is an aluminum plate, an aluminum film having a purity higher than that of the aluminum plate is laminated on a side opposite to the insulating layer side of the aluminum plate, and a refractive index is provided on the aluminum film. 3. The double-sided light emitting unit according to claim 2, wherein the reflection-increasing films made of two different types of dielectric films are laminated.   A color conversion unit including a phosphor and a translucent material that is excited by light emitted from the LED chip and emits light of a color different from the emission color of the LED chip; and The double-sided light emitting unit according to claim 2 or 3, wherein the double-sided light emitting unit is in contact with a heat plate.   Each LED chip is provided with a first electrode and a second electrode on one surface side in the thickness direction, and each of the first electrode and the second electrode is electrically connected to the wiring pattern via a wire. The double-sided light emitting unit according to any one of claims 2 to 4, wherein the heat transfer plate is formed with a through hole through which each of the wires passes.   An illuminating device comprising the double-sided light emitting unit according to any one of claims 1 to 5.

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