JP2015191697A - Illumination lamp and illumination device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an illumination lamp in which warpage caused by occurrence of a temperature difference between an emission side and a fixture side of a cover hardly occurs.SOLUTION: An illumination lamp includes: a light source module 50 having a substrate 52 on which an LED element 51 is mounted and a heat sink 53 fixed on a surface on the opposite side from the side on which the LED element 51 of the substrate 52 is mounted; and a cylindrical cover 20 having light transmissivity and for accommodating the light source module 50 inside. The light source module 50 divides a cover inside space 60 into a first space 61 located on the solid light emitting element 51 side with the substrate 52 being a reference, and a second space 62 located on the heat sink 53 side. The first space 61 and the second space 62 are communicated.

Description

  The present invention relates to an illumination lamp and an illumination device.

  In recent years, in response to social demands for environmental considerations, a light-emitting diode (hereinafter referred to as “LED”), which is one of the solid-state light-emitting elements that has a longer life and lower power consumption than conventional incandescent bulbs and fluorescent lamps. The spread of the used illumination lamps and illumination devices is expanding.

  A part of the electric power supplied to the LED becomes heat, and this heat causes deterioration of the LED. Therefore, by disposing a substrate on which an LED is mounted as in Patent Document 1 on a heat sink (which corresponds to a heat dissipation member in Patent Document 1), heat generated from the LED is released to the heat sink. Moreover, in the illumination lamp using such LED, generally LED and a heat sink are accommodated in the cover (patent document 1 corresponds to a translucent cover) formed with the resin material. Therefore, the heat escaping to the heat sink is dissipated outside through the cover. That is, the heat generated from the LED is dissipated to the outside through the heat sink and the cover.

JP 2010-153761 PR

  However, in a configuration such as Patent Document 1, the space inside the cover that houses the substrate and the heat sink is a space that faces the heat sink by the substrate and the heat sink (a space where the heat dissipation member in FIG. 2 of Patent Document 1 faces). And a space that does not face the heat sink (a space where the translucent member of Patent Document 1 faces). At this time, the space facing the heat sink has a higher temperature because a larger amount of heat is radiated than the heat radiating member, compared to the space not facing the heat sink. For this reason, in the circumferential direction of the cover, there is a problem in that the amount of elongation due to thermal expansion differs between the portion facing the space facing the heat sink and the portion facing the space not facing the heat sink, and the cover is greatly warped.

  The present invention has been made in view of the above-described problems, and an object thereof is to provide an illumination lamp and an illumination device that are less likely to warp.

  An illumination lamp of the present invention includes a light source module having a substrate on which a solid light emitting element is mounted, and a heat sink fixed to a surface of the substrate opposite to the side on which the solid light emitting element is mounted, and a cylindrical shape A light-transmitting cover that houses the light source module therein, and the light source module is a first light source module positioned on a fixed light emitting element side with respect to the substrate. And the second space located on the heat sink side, and the first space and the second space communicate with each other.

  Further, the lighting device of the present invention includes a light source module including a substrate on which a light emitting element is mounted, and a heat sink fixed to a surface of the substrate opposite to the side on which the light emitting element is mounted, and a cylindrical shape A light-transmitting cover that houses the light source module therein, and the light source module includes a space inside the cover as a first space on a light emitting element side with respect to the substrate. The second space on the heat sink side is divided, and the first space and the second space are in communication with each other.

  In the illumination lamp and the illumination device according to the present invention, since the first space and the second space communicate with each other, heat can be transferred between the first space and the second space. A temperature difference generated between the space and the second space can be reduced, and an illumination lamp and an illumination device that are less likely to warp can be obtained.

It is a perspective view of the illuminating device which concerns on Embodiment 1-3. It is a perspective view of the illumination lamp which concerns on Embodiment 1-3. FIG. 3 is a cross-sectional perspective view taken along the line AA of FIG. 2 of the illumination lamp according to the first embodiment. It is AA sectional drawing of the illumination lamp which concerns on Embodiment 1 of FIG. FIG. 4 is a cross-sectional view of the illumination lamp according to Embodiment 1 taken along the line BB in FIGS. 2 and 3. 3 is a top view of the substrate according to Embodiment 1. FIG. 2 is a top view of a base material according to Embodiment 1. FIG. 7 is a top view of a substrate according to a modification of the first embodiment. FIG. It is an AA cross-section perspective view of FIG. 2 of an illumination lamp according to a modification of the first embodiment. It is AA sectional drawing of FIG. 2 of the illumination lamp which concerns on the modification of Embodiment 1. FIG. FIG. 6 is a top view of a base material in a modified example of the first embodiment. FIG. 3 is a cross-sectional perspective view of the illumination lamp according to Embodiment 2 taken along the line AA in FIG. 2. It is AA sectional drawing of the illumination lamp which concerns on Embodiment 2 of FIG. It is BB sectional drawing of FIG. 2 and FIG. 12 of the illumination lamp which concerns on Embodiment 2. FIG. It is an AA cross-sectional perspective view of the illumination lamp according to Embodiment 3 in FIG. It is AA sectional drawing of the illumination lamp which concerns on Embodiment 3 of FIG. It is BB sectional drawing of the illumination lamp which concerns on Embodiment 3 in FIG.2 and FIG.15. FIG. 6 is a cross-sectional view in which a cover is exploded in the AA cross-sectional view of FIG. It is a perspective view of the illuminating device which concerns on Embodiment 4. FIG. It is CC sectional drawing of FIG. 19 of the illuminating device which concerns on Embodiment 4. FIG. It is DD sectional drawing of FIG. 19 of the illuminating device which concerns on Embodiment 4. FIG. It is EE sectional drawing of the illuminating device which concerns on Embodiment 4 of FIG. It is FF sectional drawing of the illuminating device which concerns on Embodiment 4 of FIG.

Embodiment 1
FIG. 1 is a perspective view of a lighting device according to Embodiments 1 to 3. FIG. The illuminating device 10 has a long shape, and includes a detachable illumination lamp 11 and a luminaire 12 that supplies power to the illumination lamp 11 to light the illumination lamp 11. The illuminating device 10 is attached to a ceiling or a wall surface with the illumination lamp 11 facing the room, and illuminates the indoor space when the illumination lamp 11 is turned on.

  The lighting fixture 12 includes a power supply socket 13, a ground socket 14, and a fixture body 15. The power supply socket 13 and the earth socket 14 are provided in the instrument main body 15, respectively. The power supply socket 13 and the earth socket 14 can mechanically hold the illumination lamp 11. The power supply socket 13 and the earth socket 14 are electrically connected to the illumination lamp 11 by mechanically holding the illumination lamp 11. The earth socket 14 may be configured to mechanically hold the illumination lamp 11 and not electrically connected to the illumination lamp 11.

  The instrument body 15 is a housing that houses the power supply box 16 and has a fixture (not shown) such as a V-shaped spring or a joint. The lighting fixture 12 is attached to a ceiling or a wall surface by a fixture. The power supply box 16 is a housing that houses a switch (not shown) and a power supply device (not shown). The power supply device supplies power from an external power source to the power supply socket 13 when the switch is ON. In the state where is OFF, power supply is stopped. That is, the lighting device 10 can supply power to the lighting lamp 11 via the power supply socket 13. The power supply box 16 may be composed of only a switch and a power supply device.

  In addition, in order to dissipate heat generated from the power supply device in the power supply box 16, generally, the instrument body 15 and the power supply box 16 are made of a material having high thermal conductivity such as metal.

  FIG. 2 is a perspective view of the illumination lamp according to the first to third embodiments. The illumination lamp 11 includes a cover 20, a power supply base 30, a ground base 40, and a light source module 50. The cover 20 is a cylindrical member having openings at both ends and a cover inner space 60 inside, and houses the light source module 50 inside. A power supply cap 30 is attached to the opening at one end, and a ground cap 40 is attached to the opening at the other end. 2 shows a part of the configuration of the light source module 50 through a part of the cover 20.

  The cover 20 has translucency, and light emitted from the light source module 50 passes through the cover 20. The cover 20 is formed by extruding a resin material such as polycarbonate or acrylic. The resin material used for the cover 20 may be devised such as using a resin material mixed with a diffusing material according to specifications, and may have optical functions such as diffusion, reflection, and color rendering. Furthermore, it is sufficient that at least a part of the cover 20 has translucency. For example, only a part of the cover 20 is formed of a resin material having translucency, and the other part is a highly reflective resin. You may comprise with a material.

  The power supply cap 30 includes two conductive power supply terminals 31 and a power supply cap casing 32 in which the power supply terminals 31 are embedded by a manufacturing method such as insert molding and the like. The power supply cap 30 is attached so that the opening at one end of the cover 20 is covered with a power supply cap casing 32. The power supply terminal 31 can be mechanically connected to the power supply socket 13. The power supply terminal 31 is mechanically connected to the power supply socket 13 and at the same time is electrically connected to the power supply socket 13 so that power can be supplied from the power supply socket 13. When the ground base 40 and the illumination lamp 11 are not electrically connected, power is supplied from the power supply socket 13 from one of the two power supply terminals 31, and the other power supply terminal 31 is grounded. Play a role.

  The ground base 40 includes a ground terminal 41 having conductivity, and a ground base casing 42 in which the ground terminal 41 is embedded by a manufacturing method such as insert molding. The ground base 40 is attached so that the opening of the end portion of the cover 20 on the side where the power supply base 30 is not attached is covered with a ground base case 42. The ground terminal 41 is connectable to the ground socket 14 at least mechanically. In addition, when the earth socket 14 is electrically connected to the illumination lamp 11, the earth terminal 41 is mechanically connected to the earth socket 14 and is also electrically connected.

  3 is a cross-sectional perspective view taken along the line AA of FIG. 2 of the illumination lamp according to the first embodiment. 4 is a cross-sectional view of the illumination lamp according to the first embodiment, taken along line AA in FIG. 5 is a cross-sectional view of the illumination lamp according to Embodiment 1 taken along the line BB in FIGS. 2 and 3. For the sake of explanation, when the illumination lamp 11 is attached to the lighting fixture 12, the side facing the indoor space is referred to as the emission side, and the side facing the fixture body 15 is referred to as the fixture side. In FIG. 3, a part of the cover 20 is transmitted and the light source module 50 inside the cover 20 is shown.

  As shown in FIGS. 3, 4, and 5, the cover 20 has a substantially circular cross section. The cover 20 has two surfaces, an outer peripheral surface 21 facing the outer space of the cover 20 and an inner peripheral surface 22 facing the cover inner space 60. A pair of mounting projections 23 and fitting projections 24 projecting into the cover internal space 60 are formed over the entire length in the longitudinal direction of the cover 20 on the inner peripheral surface 22 at a position closer to the instrument side than the center axis of the cover 20. ing. In the first embodiment, the cover 20 has a substantially circular cross section. However, the cross section is not limited to this, and may be a rectangular shape or the like. The cover inner space 60 is formed, and the outer peripheral surface 21 and the inner peripheral surface 22 are formed. Any cylindrical cross-sectional shape may be used.

  The light source module 50 is inserted in the cover inner space 60 along the axial direction of the cover 20. The light source module 50 includes a plurality of LED light sources 51, a substrate 52 whose length in the longitudinal direction is substantially equal to the length of the cover 20 in the axial direction, and a length of the substrate 52 on which at least the substrate 52 can be installed. A heat sink 53 is provided. The light source module 50 is laminated and arranged in the order of the LED light source 51, the substrate 52, and the heat sink 53 from the emission side. For this reason, when the light source module 50 is used as a reference, the emission side can be referred to as the LED light source side, and the instrument side can be referred to as the heat sink side. The light source module 50 inserted into the cover inner space 60 is located closer to the instrument than the center axis of the cover 20. The light emitted from the LED light source 51 is diffused in the light emission direction. For this reason, the LED light source 51 is located closer to the instrument side than the central axis of the cover 20, so that the light emitted from the LED light source 51 is further diffused and can illuminate a wide area.

  The LED light source 51 is mounted on the substrate 52 in parallel with the long side of the substrate 52. Note that the LED light source 51 may be integrated with the substrate 52. In the first embodiment, the LED light source 51 is a pseudo white LED packaged with a phosphor that converts blue light into yellow light on an LED chip that emits blue light of 440 to 480 nm. However, since the number of the LED light sources 51 to be mounted on the substrate 52, the arrangement of the LED light sources 51, and the type of the LED light sources 51 are determined according to the use of the illumination lamp 11, the number, arrangement, and types of the LED light sources 51 are limited. Not. Furthermore, instead of the LED light source 51, a light emitting element such as a laser diode (LD) or an organic EL may be used. When these elements are used, instead of mounting a plurality of light emitting elements on the substrate 52, one long light emitting element having a length in the longitudinal direction substantially the same as the length in the longitudinal direction of the substrate 52 is mounted on the substrate 52. You may do it.

  On the surface of the substrate 52 on which the LED light source 51 is mounted, for example, an electronic component (not shown) such as a diode, a capacitor, a fuse, or a resistor, and each LED light source 51 and each electronic component so that the LED light source 51 is lit. A circuit pattern (not shown) for electrical connection is provided. The LED light source 51 mounted on the substrate 52 is electrically connected to the power supply terminal 31 through a circuit pattern. That is, the LED light source 51 is supplied with power from an external power source and can be turned on.

  FIG. 6 is a top view of the substrate according to the first embodiment. Substrate notches 52 a are provided intermittently in the longitudinal direction of the substrate 52 at both ends of the substrate 52 in the short direction. For the sake of explanation, the portion where the substrate notch 52a is formed and the width in the short direction is narrowed is referred to as the substrate width narrow portion 52b, and the substrate notch 52a is not formed and the width in the short direction is wide. This portion is referred to as a wide substrate portion 52c.

  As shown in FIG. 4, the width of the narrow substrate portion 52 b is formed to be shorter than the distance between the tips of the pair of mounting projections 23 formed on the inner peripheral surface 22 of the cover 20. Further, as shown in FIG. 5, the width of the wide substrate portion 52 c is formed to be longer than the distance between the tips of the pair of mounting projections 23.

  When the light source module 50 is inserted into the cover inner space 60, the wide substrate portion 52c is placed on the surface on the emission side of the placement projection 23, and the cover 20 and the light source module 50 are in contact with each other. When the wide substrate portion 52c is placed on the placement protrusion 23, the cover inner space 60 is divided into two spaces, the emission side and the instrument side, with the light source module 50 as a reference. Here, the in-cover space 60 on the emission side of the substrate 52, that is, the LED light source side is referred to as an emission side space 61 (corresponding to the first space of the present invention). Further, the cover inner space 60 closer to the instrument side than the substrate 52, that is, the heat sink side is referred to as an instrument side space 62 (corresponding to the second space of the present invention). In addition, when the light source module 50 is inserted into the cover inner space 60, the placement projection 23 may be placed on the emission side surface of the substrate wide portion 52c. Even in this case, the in-cover space 60 is divided into an emission side space 61 and an instrument side space 62.

  Further, since the light source module 50 is located on the instrument side with respect to the central axis of the cover 20, the volume of the instrument side space 62 is smaller than the volume of the emission side space 61.

  As a material of the substrate 52, a glass epoxy material, a paper phenol material, a composite material, or a metal material such as aluminum is selected in consideration of design matters such as material cost. The thickness of the substrate 52 is about 1 mm in the first embodiment, but is not limited to this thickness.

  The heat sink 53 is configured by integrating a substrate installation portion 53a and a heat sink fitting portion 53b. The heat sink 53 has a role of radiating heat generated from the LED light source 51 and a role of improving the rigidity of the illumination lamp 11. For this reason, the heat sink 53 is generally made of a material having good thermal conductivity and rigidity and a small linear expansion coefficient. In the first embodiment, aluminum is used. The heat sink 53 may be formed by extrusion molding.

  The board installation part 53a has a surface on the emission side and a surface on the instrument side. When the light source module 50 is inserted into the cover inner space 60, the substrate 52 is mounted on the substrate 52 so that the surface of the substrate 52 on which the LED light source 51 is not mounted faces the surface on the emission side of the substrate installation portion 53a. It is fixed to the installation part 53a. Examples of the fixing method include a method of bonding with an adhesive such as a silicone resin or an adhesive member such as a double-sided tape, and a method of providing a screw hole in the substrate installation portion 53a and the substrate 52 and screwing. In the case of installing using an adhesive or an adhesive member, it is desirable to select a material having good thermal conductivity for the adhesive or adhesive member in order to transmit heat generated from the LED light source 51 to the heat sink 53. The board 52 and the board installation part 53a may be integrated, that is, the board installation part 53a may be provided with the circuit pattern and the lighting circuit element of the board 52, and the LED light source 51 may be installed on the board installation part 53a. .

  The width of the substrate installation portion 53a in the short direction is shorter than the distance between the tips of the pair of mounting projections 23 formed on the inner peripheral surface 22 of the cover 20. Further, as described above, the substrate width narrow portion 52b of the substrate 52 is shorter than the distance between the tips of the pair of mounting projections 23. For this reason, when the light source module 50 is inserted into the cover inner space 60, as shown in FIG. 4, the substrate installation portion 53a and the substrate narrow portion 52b are not in contact with the mounting projection 23, and the emission side space 61 and the instrument A gap communicating with the side space 62 is formed between the light source module 50 and the inner peripheral surface 22 of the cover 20.

  In addition, a heat sink fitting portion 53 b protruding toward the instrument side is formed on the surface of the substrate installation portion 53 a so as to extend in the longitudinal direction of the heat sink 53. The heat sink fitting portion 53 b has a shape that fits with the fitting protrusion 24 of the cover 20, and fixes the heat sink 53 to the cover 20.

  As described above, the heat sink 53 has a role of radiating heat generated in the LED light source 51. The heat sink 53 does not face the emission side space 61 but faces only the instrument side space 62. For this reason, the illumination lamp 11 is configured such that a greater amount of heat generated in the LED light source 51 is radiated to the appliance side space 62 than to the emission side space 61. Further, as described above, since the instrument side space 62 has a smaller volume than the exit side space 61, the heat capacity of the instrument side space 62 is smaller than the heat capacity of the exit side space 61. For this reason, the temperature of the air in the instrument side space 62 is higher than the temperature of the air in the exit side space 61, and a temperature difference occurs between the exit side space 61 and the instrument side space 62. This temperature difference causes the cover 20 to warp.

  However, the illumination lamp 11 of the first embodiment has a gap that communicates the emission side space 61 and the instrument side space 62, and air and heat can move between the emission side space 61 and the instrument side space 62. It is. For this reason, the temperature difference between the emission side space 61 and the instrument side space 62 is reduced, and the warpage caused by the temperature difference is suppressed.

  Further, since the substrate cutout portion 52a of the substrate 53 is provided intermittently in the longitudinal direction of the substrate 52, the end portion of the substrate wide portion 52c where the substrate cutout portion 52a is not formed is the mounting protrusion of the cover 20 It is placed on the part 23. For this reason, the light source module 50 is supported by the mounting protrusion 23, and the cover 20 and the light source module 50 are more stably fixed.

  Next, a method for manufacturing the substrate 52 will be described. FIG. 7 is a top view of the base material according to Embodiment 1. FIG. In FIG. 7, the LED light source 51 is disposed on the base material 70. However, the present invention is not limited to this, and the LED light source 51 may not be disposed at the stage of manufacturing the substrate 52. A plurality of substrates 52 shown in FIG. 6 can be obtained from one rectangular base material 52 shown in FIG. 7. For convenience of explanation, when the substrate 52 is cut from the base material 70, the direction corresponding to the longitudinal direction of the substrate 52 is determined. The direction corresponding to the X direction and the short direction is defined as the Y direction.

  A base material through hole 71 is intermittently formed in the X direction and the Y direction in the base material 70 and has a lattice shape. In addition, base material notches 72 are intermittently formed on the four sides of the base material 70 in parallel with the base material through holes 71. Further, the base material 70 is configured to facilitate cutting such as perforations or V-cuts so as to connect the base material through holes 71 arranged in the X direction or between the base material through holes 71 and the base material notch 72. A cut-out processing portion 73 is formed.

  As a method for forming the base material through-hole 71, the base material notch portion 72, and the cut-out processing portion 73, a general processing method may be used. An example of the processing method is a method of forming using a punching machine such as a punching press.

  In order to divide the substrate 52 shown in FIG. 6 from the base material 70 shown in FIG. 7, it can be divided by cutting along the cut-out processing portion 73. In addition, since a part of the portion that needs to be separated when the substrate is divided is already penetrated by the base material through hole 71 and the base material notch portion 72, the work of dividing the base material 70 can be easily performed.

  When the substrate 52 is divided, the base material through hole 71 or the base material notch 72 becomes a portion corresponding to the substrate notch 52 a of the substrate 52. Further, the substrate 52 has a wide portion and a narrow portion in the Y direction, the narrow portion in the Y direction corresponds to the narrow substrate portion 52b, and the wide portion in the Y direction corresponds to the wide substrate portion 52c. To do. That is, the wide substrate 52c is integrated with the substrate 52 before being divided.

  As in the illumination lamp of the first embodiment, an illumination lamp that hardly warps can be obtained by forming a gap that communicates the emission side space and the instrument side space. In addition, by forming the gap by providing a notch in the substrate, it becomes easy to divide the base material when manufacturing a plurality of substrates from a single base material.

  In the first embodiment, the cover 20 and the light source module 50 are fixed by fitting the fitting protrusion 24 and the heat sink fitting part 53b. However, the present invention is not limited to this. The cover 20 and the light source module may be fixed by the wide substrate portion 52c. For example, the mounting protrusion 23 and the substrate wide portion 52c may be bonded by an adhesive or an adhesive member, or the mounting protrusion 23 and the substrate wide portion 52c may be screwed by providing a screw hole. A method of fixing the portion 23 and the wide substrate portion 52c can be mentioned. In this case, the heat sink fitting portion 53b and the fitting protrusion 24 are not necessary. For this reason, the heat sink 53 and the cover 20 have a simple shape.

  Further, without forming the wide substrate portion 52 c and the mounting projection 23, a gap that continuously communicates the emission side space 61 and the instrument side space 62 along the longitudinal direction of the illumination lamp 11 may be formed. In this case, the cover 20 and the substrate 52 have a simple shape. In particular, when manufacturing the substrate 52, it is not necessary to form the base material through hole 71 and the base material notch portion 72 in the base material 70, and the base material through hole 71 and the base material notch portion 72 are formed. This eliminates the waste of the part punched out. In addition, since a gap that communicates between the emission side space 61 and the appliance side space 62 is continuously formed in the longitudinal direction of the illumination lamp 11, the movement of air and heat between the emission side space 61 and the appliance side space 62 is further improved. Actively made.

Modified Example of First Embodiment Next, a modified example of the first embodiment will be described. FIG. 8 is a top view of a substrate according to a modification of the first embodiment. 9 is a cross-sectional perspective view taken along line AA of FIG. 2 of an illumination lamp according to a modification of the first embodiment. 10 is a cross-sectional view taken along line AA of FIG. 2 of an illumination lamp according to a modification of the first embodiment. Since the configuration excluding the shape of the substrate 52 of the modification of the first embodiment is the same as that of the first embodiment, the description of the same points is omitted. Further, the BB cross-sectional view in the modification of the first embodiment is omitted because it has the same shape as that of FIG. 5 of the first embodiment.

  As shown in FIG. 8, the substrate 52 according to the modification of the first embodiment has a substrate notch 52a, a substrate narrow portion 52b, and a substrate wide portion 52c as compared with the substrate 52 of the first embodiment. Instead, the substrate through holes 52d are formed intermittently in the longitudinal direction of the substrate 52. In addition, the substrate through hole 52d formed intermittently may be connected to form one substrate through hole 52d.

  The substrate 52 according to the modification of the first embodiment is formed such that the length of the short side is longer than the distance between the tips of the pair of mounting projections 23. For this reason, as shown in FIGS. 9 and 10, both ends of the short side of the substrate 52 are always placed on the placement projection 23. For this reason, the contact area of the board | substrate 52 and a cover is wider than the illumination lamp of Embodiment 1, and the light source module 50 can be mounted by the cover 20 stably.

  Further, the substrate through hole 52d is provided at a position that does not overlap the heat sink 53 and the mounting projection 23 when at least the light source module 50 is inserted into the cover inner space 60. That is, as shown in FIG. 10, the substrate through hole 52 d forms a gap that allows the emission side space 61 and the instrument side space 62 to communicate with each other.

  For this reason, the illumination lamp 11 according to the modification of the first embodiment also has a gap communicating with the emission side space 61 and the instrument side space 62, and air and heat are provided between the emission side space 61 and the instrument side space 62. Can be moved. As a result, as in the first embodiment, the temperature difference between the emission side space 61 and the instrument side space 62 is reduced, and warping due to the temperature difference is suppressed.

  FIG. 11 is a top view of a base material according to a modification of the first embodiment. A base material through hole 71 is intermittently formed in the base material 70 in the X direction and the Y direction. However, the space | interval in the Y direction of the base-material through-holes 71 in the modification of Embodiment 1 is wide when there is a location where the LED light source 51 is installed in the middle, and is narrow when there is no such location. Moreover, the base material notch part 72 is not formed, and the cut-out processing part 73 is formed so as to extend in the X direction between the portions where the distance between the base material through holes 71 in the Y direction is narrow. . The substrate 52 is manufactured by being divided from the base material 70.

  For this reason, since both ends in the longitudinal direction of the substrate 52 of the modification of the first embodiment are continuous, both ends in the longitudinal direction are interrupted by the substrate notch 52a as in the first embodiment. It has higher rigidity than the substrate 52. As a result, warpage and distortion of the substrate 52 can be suppressed. Moreover, since the outer peripheral shape of the board | substrate 52 of the modification of Embodiment 1 becomes a rectangular shape, the position alignment with the board | substrate 52 and the heat sink 53 in the manufacturing process of the light source module 50 becomes easy.

Embodiment 2
Next, the second embodiment will be described. 12 is a cross-sectional perspective view taken along line AA of FIG. 2 of the illumination lamp according to the second embodiment. 13 is a cross-sectional view of the illumination lamp according to the second embodiment, taken along line AA in FIG. 14 is a cross-sectional view of the illumination lamp according to the second embodiment taken along the line BB in FIGS. 2 and 11. In addition, since the structure except the board | substrate 52 and the heat sink 53 of the illumination lamp of Embodiment 2 is the same as that of the illumination lamp of Embodiment 1, description is abbreviate | omitted about the point which is the same.

  The substrate 52 of the second embodiment does not have the substrate cutout portion 52a. For this reason, the board | substrate narrow part 52b and the board | substrate wide part 52c are not formed in the board | substrate 52 of Embodiment 2. FIG. Further, the width of the substrate 52 in the short direction is always shorter than the distance between the tips of the pair of mounting projections 23.

  In the heat sink 53 of the second embodiment, heat sink notch portions 53 c are provided intermittently in the longitudinal direction of the heat sink 53 at both ends in the short direction of the substrate installation portion 53 a. For the sake of explanation, the portion where the heat sink notch 53c is formed and the width in the short direction is narrowed is referred to as a heat sink width narrow portion 53d. The heat sink notch 53c is not formed and the width in the short direction is wide. This portion is referred to as a heat sink wide portion 53e.

  As shown in FIG. 13, the width of the heat sink narrow portion 53 d is formed to be shorter than the distance between the tips of the pair of mounting projections 23 formed on the inner peripheral surface 22 of the cover 20. Further, as shown in FIG. 14, the width of the heat sink wide portion 53e is formed to be longer than the distance between the tips of the pair of mounting projections 23.

  For this reason, when the light source module 50 is inserted into the cover internal space 60, the heat sink wide portion 52e is placed on the surface on the emission side of the placement projection 23, and the cover 20 and the light source module 50 are fixed. Further, when the heat sink wide portion 52 e is placed on the placement projection 23, the cover inner space 60 can be divided into an emission side space 61 and an instrument side space 62 with the light source module 50 as a reference.

  The illumination lamp 11 of the second embodiment differs from the illumination lamp of the first embodiment in that the heat sink 53 also faces the emission side space 61. However, since the amount of heat dissipated from the heat sink 53 is proportional to the surface area facing the heat sink 53, the amount of heat dissipated to the instrument side space 62 facing the heat sink fitting portion 53 b is dissipated to the exit side space 61. More than the amount of heat generated. Furthermore, since the light source module 50 is located closer to the instrument side than the central axis of the cover 20 for the same reason as in the first embodiment, the heat capacity of the instrument side space 62 is smaller than the heat capacity of the emission side space 61. For this reason, a temperature difference occurs between the emission side space 61 and the instrument side space 62.

  However, the width of the substrate 52 in the short direction and the width of the heat sink narrow portion 53d are shorter than the distance between the tips of the pair of mounting projections 23 formed on the inner peripheral surface 22 of the cover 20. Is formed. For this reason, when the light source module 50 is inserted into the cover inner space 60, the substrate 52 and the heat sink narrow portion 53d do not contact the mounting projection 23 as shown in FIG. A gap communicating 62 is formed between the light source module 50 and the inner peripheral surface 22 of the cover 20.

  Like the illumination lamp of the first embodiment, the illumination lamp 11 of the second embodiment also has a gap that communicates the emission side space 61 and the instrument side space 62, and is between the emission side space 61 and the instrument side space 62. Air and heat transfer is possible. For this reason, also in the illumination lamp 11 of the second embodiment, the temperature difference between the emission side space 61 and the instrument side space 62 is reduced similarly to the illumination lamp of the first embodiment, and the warp caused by the temperature difference is suppressed.

  Like the illumination lamp of the second embodiment, by providing a notch in the heat sink to form a gap that communicates the emission side space and the instrument side space, an illumination lamp that is unlikely to warp can be obtained.

  As in the substrate through hole 52d of the substrate 52 according to the modification of the first embodiment, instead of the heat sink notch 53c, a through hole is provided at a location that does not overlap the heat sink substrate 52 and the mounting projection 23. A gap may be formed.

Embodiment 3
Next, Embodiment 3 will be described. 15 is a cross-sectional perspective view taken along line AA of FIG. 2 of the illumination lamp according to the third embodiment. 16 is a cross-sectional view of the illumination lamp according to the third embodiment, taken along line AA in FIG. 17 is a cross-sectional view of the illumination lamp according to the third embodiment, taken along the line BB in FIGS. 2 and 15. In addition, since the structure except the cover 20 and the board | substrate 52 of Embodiment 2 is the same as that of the illumination lamp of Embodiment 1, it abbreviate | omits description about the same point.

  In the cover 20 of the third embodiment, the mounting projection 23 is provided intermittently over the entire length of the cover 20 in the longitudinal direction.

  The substrate 52 of the third embodiment does not have the substrate cutout portion 52a. For this reason, the board | substrate narrow part 52b and the board | substrate wide part 52c are not formed in the board | substrate 52 of Embodiment 2. FIG. Further, the width of the substrate 52 in the short direction is always longer than the distance between the tips of the pair of mounting protrusions 23, and the end of the substrate 52 in the short direction excludes the mounting protrusion 23 of the cover 20. The length is such that it does not contact the peripheral surface 22.

  For this reason, when the light source module 50 is inserted into the cover inner space 60, the short-side end of the substrate 52 is placed on the surface on the emission side of the placement projection 23, and the cover 20 and the light source module 50 are fixed. The Further, when the substrate 52 is placed on the placement projection 23, the in-cover space 60 can be divided into an emission side space 61 and an instrument side space 62 with the light source module 50 as a reference.

  Similarly to the illumination lamp of the first embodiment, the illumination lamp 11 of the third embodiment faces the heat sink 53 only in the instrument side space 62, and the heat capacity of the instrument side space 62 is equal to the heat capacity of the emission side space 61. Smaller than that. For this reason, a temperature difference between the emission side space 61 and the instrument side space 62 occurs.

  However, since the mounting projections 23 are provided intermittently, there are places where the substrate 52 is mounted on the mounting projections 23 as shown in FIG. However, there is a place where the is not placed on the placement projection 23. Further, as described above, since the end in the short direction of the substrate 52 is long enough not to contact the inner peripheral surface 22 of the cover 20, the exit side space 61 and the instrument side space 62 are communicated with each other as shown in FIG. A gap is formed between the light source module 50 and the inner peripheral surface 22 of the cover 20.

  Like the illumination lamp of the first embodiment, the illumination lamp 11 of the third embodiment also has a gap that communicates the emission side space 61 and the instrument side space 62, and is located between the emission side space 61 and the instrument side space 62. Air and heat transfer is possible. For this reason, the temperature difference between the emission side space 61 and the instrument side space 62 is reduced, and the warpage caused by the temperature difference is suppressed.

  Like the illumination lamp of the third embodiment, the mounting projections 23 are intermittently provided in the longitudinal direction of the illumination lamp, and the end in the short direction of the substrate 52 is not in contact with the inner peripheral surface 22 of the cover 20. By forming a gap that communicates the exit side space and the instrument side space, an illumination lamp that is unlikely to warp can be obtained.

  The cover 20 is generally manufactured by injection molding. For this reason, when manufacturing a cover in which the mounting protrusions 23 are intermittently provided on the inner peripheral surface 22 as in the third embodiment, the cover 20 having the mounting protrusions 23 continuously in the longitudinal direction is injected. After creating by molding, it is necessary to perform a post-work after removing a part of the mounting projection 23. At that time, the post-operation for removing a part of the mounting projection 23 on the inner peripheral surface 22 is very difficult. Therefore, the cover 20 is not integrally formed, and, for example, as shown in the cross-sectional view of the cover in the AA cross-sectional view of FIG. 2 according to the third embodiment of FIG. The first cover component 20a and the second cover component 20b that are divided into two so as to be perpendicular to the protruding direction of the protruding portion 23 may be configured to be joined later. In this case, since the fitting protrusion 24, the first cover part 20a, and the second cover part 20b can be formed by bending press processing, the cover 20 can be easily manufactured without performing difficult post-work. can do.

  Further, in the third embodiment, the width in the short direction of the substrate 52 is always longer than the distance between the respective tips of the pair of mounting projections 23, and the end thereof excludes the mounting projections 23 of the cover 20. The length is such that it does not contact the inner peripheral surface 22, but is not limited thereto. For example, the width of the heat sink 53 in the short-side direction of the substrate placement portion 53a is always longer than the distance between the tips of the pair of placement projections 23, and the ends thereof exclude the placement projections 23 of the cover 20. The length may not be in contact with the inner peripheral surface 22.

  Further, like the substrate through hole 52d of the substrate 52 of the modified example of the first embodiment, the mounting protrusion 23 is continuously provided, and the through hole is provided at a place where the mounting protrusion 23, the heat sink 53 and the substrate 52 do not overlap. A gap may be formed by providing

Embodiment 4
Next, the fourth embodiment will be described. FIG. 19 is a perspective view of a lighting apparatus according to Embodiment 4. 20 is a cross-sectional view taken along the line CC of FIG. 19 of the illumination device according to the fourth embodiment. FIG. 21 is a cross-sectional view taken along the line DD of FIG. 19 of the lighting apparatus according to the fourth embodiment. FIG. 22 is a cross-sectional view taken along line EE of FIG. 19 of the lighting apparatus according to Embodiment 4. 23 is a cross-sectional view of the lighting apparatus according to Embodiment 4 taken along line FF in FIG. The illumination device 110 according to the second embodiment includes an instrument main body 15, a cover 20, and a light source module 50.

  The cover 20 of the fourth embodiment is a cylindrical member having a cover inner space 60 surrounded by the cover arc portion 25, the cover flat portion 26, and the cover side wall portion 27. The points other than the shape are the same as those of the cover 20 of the first embodiment. The cover arc portion 25 indicates an arc-shaped portion located on the emission side. Moreover, the cover plane part 26 points out the plane-shaped part located in the instrument side. Further, the cover side wall portion 27 is a portion that connects the cover flat portion 26 and the end of the cover arc portion 25 in the short direction of the cover 20.

  A pair of insertion holes 28 are formed in the cover flat portion 26 at substantially the same interval as the interval between side surfaces parallel to the longitudinal direction of the instrument body 15 so that a part of the instrument body 15 described later can be accommodated. Has been.

  Further, on the inner peripheral surface 22 of each cover side wall portion 27, a mounting projection portion 23 is provided in the longitudinal direction of the cover 20 so as to protrude into the cover inner space 60. Two mounting projections 23 are provided for one cover side wall 27, and the interval between the mounting projections 23 provided on the same cover side wall 27 is substantially equal to the thickness of a substrate 52 described later. Arranged at intervals.

  The light source module 50 according to the fourth embodiment includes an LED light source 51, a substrate 52, and a heat sink 53, as in the first embodiment. The configuration of the LED light source 51 is the same as that of the first embodiment. In addition, the substrate 52 has a substrate notch 52a as in the first embodiment, and the substrate 52 includes a substrate narrow portion 52b and a substrate wide portion 52c. The width in the short direction of the narrow substrate portion 52b is formed to be shorter than the interval between the mounting projections 23 provided on the different cover side wall portions 27. Further, the width in the short direction of the wide substrate portion 52 b is formed to be longer than the interval between the mounting projections 23 provided on the different cover side wall portions 27.

  The heat sink 53 protrudes perpendicularly with respect to the substrate installation portion 53a from the device installation surface of the substrate installation portion 53a, and has a longitudinal direction of the heat sink 53. It is comprised from a pair of heat sink wall part 53f formed in this way. Each heat sink wall 53f has a heat sink protrusion 53g on the surface facing each other. Further, the width of the substrate installation portion 53a in the short direction is formed to be shorter than the interval between the mounting projections 23 provided on the different cover side wall portions 27. The heat sink 53 of the fourth embodiment is the same as the heat sink 53 of the first embodiment except for the shape.

  The light source module 50 is accommodated in the cover inner space 60 by inserting the substrate 52 along the mounting projection 23 as shown in FIGS. At the time of storage, the wide substrate portion 52c of the substrate 52 enters between the mounting projections 23 provided on the same cover side wall 27, and the light source module 50 and the cover 20 are fixed. Further, the cover inner space 60 can be divided into an emission side space 61 and an instrument side space 62 with the light source module 50 as a reference.

  21 and 23, the width of the substrate placement portion 53a of the heat sink 53 and the width of the substrate width narrow portion 52b of the substrate 52 are different from each other between the mounting projections 23 provided on the cover side wall 27. It is formed so as to be shorter. For this reason, when the light source module 50 is inserted into the cover inner space 60, the substrate installation portion 53 a and the substrate narrow portion 52 b do not contact the placement protrusion 23, and communicate the emission side space 61 and the instrument side space 62. A gap is formed between the light source module 50 and the inner peripheral surface 22 of the cover 20.

  By inserting a side surface parallel to the longitudinal direction of the instrument body 15 into the insertion hole 28 of the cover 20, a part of the instrument body 15 is accommodated in the cover inner space 60 of the cover 20. At this time, the instrument side space 62 is divided into a first instrument side space 62 a, a second instrument side space 62 b, and a third instrument side space 62 c by side surfaces parallel to the longitudinal direction of the instrument body 15. As shown in FIGS. 21 and 23, a gap is formed so as to communicate with the first instrument side space 62a and the third instrument side space 62c.

  Further, a heat sink wall 53 f is in contact with a side surface parallel to the longitudinal direction of the instrument body 15. An instrument body fitting hole 17 is provided on a side surface parallel to the longitudinal direction of the instrument body 15 at a position corresponding to the heat sink projection 53g, and the instrument body fitting hole 17 and the heat sink projection 53 are fitted. Thus, the instrument main body 15 and the light source module 50 are fixed.

  Further, among the side surfaces parallel to the longitudinal direction of the instrument main body 15, the instrument main body through hole 18 is intermittently provided along the longitudinal direction of the instrument main body 15 at locations where the heat sink wall 53 f is not in contact. Yes. This communicates the first instrument side space 62a, the second instrument side space 62b, and the third instrument side space 62c, and enables movement of air and heat in each space. That is, the second instrument side space 62b is also communicated with the emission side space 61 via the first instrument side space 62a and the third instrument side space 62c.

  A power supply box 16 that houses a switch (not shown) and a power supply device (not shown) is housed in the second instrument side space 62b. Further, the power supply box 16 is disposed so as to be in contact with a surface of the heat sink 53 on the instrument side of the board installation portion 55. The instrument body 15 and the power supply box 16 are made of a material having high thermal conductivity that can transmit heat generated by the power supply device to the heat sink 53, such as a metal material. 20 and 21, detailed cross-sectional views inside the power supply box 16 are omitted.

  The power supply device of the power supply box 16 is connected to an external power supply. When the switch is ON, power is supplied to the LED light source 51 via the circuit pattern of the substrate 52, and when the switch is OFF, the power supply is stopped. . That is, unlike the lighting device 10 of the first embodiment, the power supply device supplies power to the LED light source 51 without passing through the power supply socket 13 and the power supply terminal 31.

  In the illumination device of the fourth embodiment, the heat sink 53 does not face the emission side space 61 but faces only the instrument side space 62. The second instrument side space 62b is divided into first to third instrument side spaces 62a to 62c by the heat sink wall 53f and the instrument body 15, and each of the first to third instrument side spaces 62a to 62c. Is smaller than the heat capacity of the exit side space 61. Further, since the power supply box 16 is accommodated in the second appliance side space 62b, the heat generated by the power supply device in the power supply box 16 is radiated to the second appliance side space 62b via the power supply box 16. For this reason, the temperature inside the 2nd instrument side space 62b becomes high compared with the temperature of the air in the 1st instrument side space 62a and the 3rd instrument side space 62c. For this reason, the temperature inside the space increases in the order of “the second instrument side space 62b> the first instrument side space 62a and the third instrument side space 62c> the emission side space 61”, and there is a temperature difference in each space. Will occur.

  However, the exit side space 61 communicates with the first instrument side space 62a and the third instrument side space 62c via a gap. Further, the second instrument side space 62b communicates with the first instrument side space 62a and the third instrument side space 62c via the instrument main body through hole 18. For this reason, the emission side space 61 and the first to third instrument side spaces 62a to 62c communicate with each other, and movement of air and heat is possible in each space. For this reason, also in the illuminating device 110 of Embodiment 4, the temperature difference of the output side space 61 and the 1st-3rd instrument side space 62a-c reduces like the illumination lamp of Embodiment 1, and it originates in the said temperature difference. Warping is suppressed.

  As in the illumination device according to the fourth embodiment, an illumination lamp that hardly warps can be obtained by forming a gap that communicates the emission side space and the instrument side space.

  In the illumination device 110 according to the fourth embodiment, the substrate 52 is provided with the substrate notch 52a to form the gap that communicates the emission side space 61 and the instrument side space 62. However, the present invention is not limited to this. For example, a method of providing a substrate through-hole 52d in the substrate 52 as in the illumination lamp of a modification of the first embodiment, a method of providing a heat sink notch in the heat sink as in the illumination lamp of the second embodiment, or the embodiment As in the case of the illumination lamp 3, a gap for communicating the emission side space 61 and the instrument side space 62 may be formed by a method of intermittently forming the mounting projections in the longitudinal direction of the illumination device.

  In the illumination device 110 according to the fourth embodiment, the fixture body through-hole 18 is intermittently provided in the longitudinal direction of the illumination device 110. However, the present invention is not limited to this, and for example, one fixture body through-hole 18 is provided in the illumination device. 110 may be provided continuously in the longitudinal direction.

  Furthermore, although Embodiment 1-4 demonstrated only when the temperature in the air in the instrument side space 62 was higher than the air in the output side space 61, it is not restricted to this. For example, the heat capacity of the exit side space 61 is smaller than the heat capacity of the instrument side space 62, or the amount of heat radiated to the exit side space 61 is greater than the amount of heat radiated to the instrument side space 62. It can be assumed that the temperature of the air in the emission side space 61 is higher than the temperature of the air in the appliance side space 62. Even in such a case, since the temperature difference is generated between the appliance side space 62 and the emission side space 61, the illumination lamp is warped. Since the present invention reduces the temperature difference between the exit side space 61 and the instrument side space 62 by providing a gap that communicates the exit side space 61 and the instrument side space 62, the temperature of the air in the instrument side space 62 is reduced. Even when the temperature of the air in the exit side space 61 is high, there is an effect of suppressing the warp of the illumination lamp 11 or the illumination device 110 due to the temperature difference.

DESCRIPTION OF SYMBOLS 10 Lighting device, 11 Lighting lamp, 12 Lighting fixture, 13 Power supply socket, 14 Ground socket, 15 Appliance main body, 16 Power supply box, 17 Appliance main body fitting hole, 18 Appliance main body through-hole, 20 Cover, 20a 1st cover component , 20b Second cover part, 21 outer peripheral surface, 22 inner peripheral surface, 23 mounting projection, 24 fitting projection, 25 cover arc, 26 cover plane, 27 cover side wall, 28 insertion hole, 30 Base, 31 Power supply terminal, 32 Power supply base housing, 40 Ground base, 41 Ground terminal, 42 Ground base housing, 50 Light source module, 51 LED light source, 52 Substrate, 52a Substrate notch, 52b Substrate narrow portion, 52c Wide part of substrate, 52d Substrate through hole, 53 Heat sink, 53a Substrate installation part, 53b Heat sink fitting part, 53c Heat sink notch 53d Heat sink narrow part, 53e Heat sink wide part, 53f Heat sink wall part, 53g Heat sink projection part, 60 Cover inner space, 61 Outlet side space, 62 Instrument side space, 62a First instrument side space, 62b Second instrument Side space, 62c 3rd instrument side space, 70 base material, 71 base material through-hole, 72 base material notch part,
73 Cutting processing part, 110 Illumination device

Claims (18)

A light source module comprising: a substrate on which a solid light emitting element is mounted; and a heat sink fixed to a surface opposite to the surface on which the solid light emitting element is mounted on the substrate.
A cover having a light-transmitting property, which is cylindrical and accommodates the light source module therein;
A base attached to both ends of the cover,
Inside the cover, a space surrounded by the inner surface of the cover and the base is formed,
The light source module divides the space inside the cover into a first space on the solid light emitting element side and a second space on the heat sink side with respect to the substrate,
The illumination lamp, wherein the first space and the second space communicate with each other. The illumination lamp according to claim 1, wherein a gap is provided between the light source module and an inner peripheral surface of the cover in a cross section perpendicular to the axial direction of the cover. The light source module has a long shape,
A notch is intermittently provided in the longitudinal direction of the light source module at an end in the short direction of the light source module, and a gap is provided between the notch and the inner peripheral surface of the cover. The illumination lamp according to claim 2. The illumination lamp according to claim 3, wherein the notch is provided in the substrate. The illumination lamp according to claim 3, wherein the notch is provided in the heat sink. On the inner peripheral surface of the cover, there is provided a mounting protrusion that protrudes in the direction of the space inside the cover and on which the light source module is mounted. The mounting protrusion is provided intermittently in the axial direction of the cover. The illumination lamp according to claim 2, wherein: The light source module has a through hole,
The illumination lamp according to claim 1, wherein the first space and the second space communicate with each other through the through hole. The illumination lamp according to claim 7, wherein the through hole is provided in the substrate. A light source module comprising: a substrate on which a solid light emitting element is mounted; and a heat sink fixed to a surface of the substrate opposite to the side on which the solid light emitting element is mounted;
A cylindrical cover, in which a space for housing the light source module is formed, and a light-transmitting cover;
A power supply device for supplying power to the solid state light emitting device,
The light source module divides the space inside the cover into a first space located on the fixed light emitting element side with respect to the substrate and a second space located on the heat sink side,
The lighting device, wherein the first space and the second space communicate with each other. The lighting device according to claim 9, wherein the power supply device is provided in the second space. The lighting device according to claim 9 or 10, wherein the second space is divided into a plurality of portions, and all the divided second spaces communicate with the first space. 12. The gap according to claim 9, wherein a gap is provided between the light source module and an inner peripheral surface of the cover in a cross section perpendicular to the axial direction of the cover. Lighting device. A notch is intermittently provided in the longitudinal direction of the light source module at an end in the short direction of the light source module, and a gap is provided between the notch and the inner peripheral surface of the cover. The lighting device according to claim 12. The lighting device according to claim 13, wherein the notch is provided in the substrate. The lighting device according to claim 13, wherein the notch is provided in the heat sink. On the inner peripheral surface of the cover, there is provided a mounting protrusion that protrudes in the direction of the space inside the cover and on which the light source module is mounted. The mounting protrusion is provided intermittently in the axial direction of the cover. The lighting device according to claim 12, wherein The light source module has a through hole,
The lighting device according to any one of claims 9 to 11, wherein the first space and the second space communicate with each other through the through hole. The illumination lamp according to claim 17, wherein the through hole is provided in the substrate.

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