JP6300493B2 - Lamp and lighting device - Google Patents

Description

  The present invention relates to a lamp and a lighting device. The present invention relates to, for example, a straight tube lamp using a light emitting element such as an LED as a light source, and an illumination device using the lamp.

  In recent years, lamps using LEDs have been increasingly used as long-life, low-power-consumption lamps in response to social demands for environmental considerations. Also in straight tube lamps, replacement of conventional fluorescent lamps with LED lamps is progressing.

  In the LED, a part of the input electric power becomes heat to generate heat. This heat generation causes deterioration of the LED. Therefore, the LED lamp is provided with a heat radiating member (heat sink) (see, for example, Patent Documents 1 to 7).

JP 2013-77453 A JP 2012-204162 A JP 2012-69303 A JP 2012-69297 A JP 2010-177441 A JP 2012-238600 A JP 2012-238430 A

  In the LED lighting device of Patent Document 1, a recess is provided on the side of the heat sink that faces the inner surface of the straight pipe, and the recess is a gap. However, the portion where the heat sink and the straight tube are close to each other is near the uppermost portion of the straight tube, that is, near the LED back side on the opposite side to the light output side of the LED.

  The surface temperature of the portion adjacent to the heat sink of the straight tube is higher than the surface temperature of the portion where the LED of the straight tube emits light. In the configuration as in Patent Document 1, when viewed from the temperature distribution of the straight tube cross section, the surface temperature of the portion that is directly behind the LED of the straight tube (that is, the uppermost portion of the straight tube) is the highest temperature. The surface temperature of the portion corresponding to (i.e., the lowermost portion of the straight pipe) is the lowest temperature. Due to this temperature difference, there is a problem that the amount of elongation due to the heat of the straight pipe differs between the heat sink side and the light output side, resulting in warping of the straight pipe.

  In the illumination device of Patent Document 2, a substrate on which a plurality of LEDs are arranged is bonded onto a heat sink and then inserted into a straight pipe, and the heat sink is brought close to the inner surface of the straight pipe and held by bonding. . The heat generated by the LED is transmitted to the heat sink via the substrate, and further radiated from the heat sink to the outside air via an adhesive and a straight pipe.

  In the LED lamps of Patent Documents 3 and 4, a recess or notch is provided on the side facing the inner surface of the straight pipe of the heat sink, an adhesive is disposed in the recess or notch, and the heat sink is fixed to the straight pipe. Yes.

  The configurations as in Patent Documents 2 to 4 have the same problems as the configuration as in Patent Document 1.

  The LED lamp of Patent Document 5 includes a plurality of LED chips, a rod-shaped heat radiation member for supporting the plurality of LED chips, and a case for housing the heat radiation member. The heat dissipation member has a high density portion and a low density portion sandwiching the high density portion in the longitudinal direction. The high density part has a mass per unit length in the longitudinal direction larger than that of the low density part.

  In the configuration as in Patent Document 5, since a plurality of materials are used for the heat radiating member, there is a problem that the structure of the heat radiating member becomes complicated.

  The straight tube lamps of Patent Documents 6 and 7 include a substrate on which a plurality of solid state light emitting elements are mounted, a heat dissipation member that dissipates heat from the substrate, and a cylindrical case that accommodates the substrate and the heat dissipation member. Yes. A heat insulating member is provided between the heat radiating member and the case.

  In configurations such as Patent Documents 6 and 7, a heat insulating member is required in addition to the heat radiating member, and a structure for arranging the heat insulating member in the case is also required, so that the structure of the straight tube lamp is complicated as a whole. There is a problem of becoming.

  An object of the present invention is, for example, to suppress lamp warping with a simple configuration.

A lamp according to one aspect of the present invention includes:
A tubular member having translucency;
A substrate on which a light emitting element is mounted and accommodated in the tubular member;
A substrate placement portion on which the substrate is placed, and a pair of extension portions that are separated from each other by an interval of at least half the width of the substrate and extend along the inner peripheral surface of the tubular member, and are accommodated in the tubular member And a heat sink that dissipates heat by conducting heat generated in the substrate from the substrate installation portion to the tubular member via the pair of extending portions.

  According to the present invention, the heat sink of the lamp has a pair of extending portions extending along the inner peripheral surface of the tubular member of the lamp, and the pair of extending portions is spaced at least half the width of the lamp substrate. Therefore, it is possible to suppress the warp of the lamp with a simple configuration.

1 is a perspective view of a lighting device according to Embodiment 1. FIG. 1 is a perspective view of a lamp according to Embodiment 1. FIG. FIG. 3 is a cross-sectional view of the lamp according to the first embodiment, taken along line AA. Sectional drawing of the lamp | ramp which concerns on Embodiment 1. FIG. Sectional drawing of the lamp | ramp which concerns on a comparative example. The figure which shows the state which curvature generate | occur | produced in the lamp | ramp which concerns on Embodiment 1. FIG. The figure which shows the state which curvature generate | occur | produced in the lamp | ramp which concerns on a comparative example. Sectional drawing of the lamp | ramp which concerns on Embodiment 2. FIG. Sectional drawing of the lamp | ramp which concerns on Embodiment 3. FIG. 10 is a graph showing the relationship between the opening angle of the heat sink of the lamp according to Embodiment 3 and the temperature difference between the upper and lower portions of the cover. FIG. 6 is a cross-sectional view taken along the line AA of the lamp according to the fourth embodiment. Sectional drawing of the cover of the lamp | ramp which concerns on Embodiment 4. FIG. Sectional drawing of the light source module of the lamp | ramp which concerns on Embodiment 4. FIG. The figure which shows the state which the curvature by the dead weight generate | occur | produced in the lamp | ramp which concerns on Embodiment 4. FIG. The figure which shows the state which the curvature by the heat | fever generate | occur | produced in the lamp | ramp which concerns on Embodiment 4. FIG. FIG. 6 is a cross-sectional view taken along the line AA of the lamp according to the fifth embodiment. Sectional drawing of the cover of the lamp | ramp which concerns on Embodiment 5. FIG. AA sectional drawing of the lamp | ramp which concerns on Embodiment 6. FIG. Sectional drawing of the cover of the lamp | ramp which concerns on Embodiment 6. FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, this invention is not limited only to the form described in the figure. In the description of the embodiment, the directions such as “up”, “down”, “left”, “right”, “front”, “rear”, “front”, “back” are as such for convenience of explanation. However, it is not intended to limit the arrangement or orientation of devices, instruments, parts, or the like.

Embodiment 1 FIG.
FIG. 1 is a perspective view of a lighting device 10 according to the present embodiment.

  In FIG. 1, the lighting device 10 includes a detachable lamp 11 and a lighting fixture 12 that supplies power to the lamp 11 to light the lamp 11. The illuminating device 10 is attached to a ceiling via a fixture, and illuminates a floor surface or an indoor space by the lamp 11 being lit. Note that the present embodiment can be applied even if the lighting device 10 is attached to other than the ceiling. For example, the lighting device 10 may be installed on a table to illuminate the table, may be attached to a wall via a fixture, or used in other places or applications. There may be.

  The lamp 11 will be described in detail later.

  The lighting fixture 12 includes a power supply socket 13, a ground socket 14, and a fixture body 15.

  The power supply socket 13 and the earth socket 14 are electrically connected to the lamp 11. The power supply socket 13 and the earth socket 14 also have a role of holding the lamp 11.

  A power supply socket 13 and a ground socket 14 are attached to the instrument body 15. The instrument main body 15 accommodates a power supply box (not shown). The power supply box houses a power supply device (not shown) that supplies power to the lamp 11 via the power supply socket 13 when the switch is turned on and stops power supply when the switch is turned off.

  FIG. 2 is a perspective view of the lamp 11. In FIG. 2, a part of the outer portion (cover 20) is removed, and a part of the internal configuration is shown.

  In FIG. 2, the lamp 11 includes a cover 20 (cylinder tube, straight tube), a power supply base 30, a ground base 40, and a light source module 50.

  The cover 20 is an example of a tubular member. The cover 20 has translucency. The cover 20 is substantially cylindrical and houses the light source module 50 therein. The cover 20 is formed of a resin material that can be extruded. As the resin material, polycarbonate (PC) or the like is used. The cover 20 may have functions such as diffusion, reflection, and color rendering according to the design specifications of the product (lamp 11). As the cover 20, for example, a milky white tube made of polycarbonate mixed with a diffusing material and diffusing and transmitting light can be used. The material of the cover 20 is not limited to a resin material, and may be a glass material, for example. Further, since at least a part of the cover 20 needs to have a region that emits light, for example, the light-emitting side material may be a translucent resin, and the material opposite to the light-emitting side may be a white highly reflective resin.

  The power supply base 30 is an example of a base part. The power supply cap 30 is provided at the end of the cover 20. The power supply base 30 includes a power supply terminal 31 having conductivity and a power supply base casing 32 (base member) in which the power supply terminal 31 is embedded. The power supply terminal 31 and the power supply base casing 32 are integrally formed by insert molding or the like. As the power supply cap 30, for example, a GX16 type cap can be used. Other types of caps such as G13 type may be used. The power supply cap casing 32 is formed of an insulating resin material.

  The earth base 40 is an example of a base part. The ground base 40 is provided at the end of the cover 20 opposite to the power supply base 30. The ground base 40 includes a ground terminal 41 having conductivity and a ground base housing 42 (base member) in which the ground terminal 41 is embedded. The ground terminal 41 and the ground cap casing 42 are integrally formed by insert molding or the like. As the ground base 40, for example, a GX16 type base can be used. Other types of caps such as G13 type may be used. The ground base casing 42 is formed of an insulating resin material.

  The light source module 50 includes a plurality of LEDs 51, a substrate 52 provided with a wiring pattern on one surface, and a heat sink 53 on which the substrate 52 is installed.

  The LED 51 is an example of a light emitting element. The LED 51 is mounted on the substrate 52. The LEDs 51 are arranged linearly and in a line on the surface of the substrate 52. A light source circuit is formed by connecting a wiring pattern provided on the surface of the LED 51 and the substrate 52. As the LED 51, for example, a pseudo white LED packaged by arranging a phosphor that converts blue light into yellow light on an LED chip that emits blue light of about 440 to 480 nm can be used. Note that an LED chip directly mounted on the substrate 52 such as a chip on board (COB) may be used. The number, arrangement, and type of the LEDs 51 can be appropriately changed according to the use of the lamp 11 and the like. Moreover, it can replace with LED51 and devices, such as a laser diode (LD) and organic EL, etc. (light emitting element) can also be used. For example, in the case of an organic EL or the like, one long light emitting element may be mounted on the substrate 52 instead of mounting a plurality of light emitting elements on the substrate 52.

  The substrate 52 is long (longitudinal), and the length is longer than the width. A plurality of LEDs 51 are mounted on the substrate 52 along the longitudinal direction (length direction). On the substrate 52, a lighting circuit element (not shown) made of a diode, a fuse, a resistor and the like for lighting the LED 51 is mounted. The board | substrate 52 is electrically connected with the electric power feeding terminal 31 of the electric power feeding base 30, and when the lighting circuit of the board | substrate 52 is electrically fed via the electric power feeding terminal 31 from an external power supply, LED51 can be lighted. As the base material of the substrate 52, a glass epoxy material, a paper phenol material, or a metal material such as aluminum (AL) is selected and used in consideration of component arrangement, heat dissipation, and material cost. The thickness dimension of the substrate 52 is, for example, about 1 mm, but other thickness dimensions may be used. A reflective material may be disposed on the surface of the substrate 52 (particularly, the surface on which the LED 51 is disposed) by a method such as coating, printing, or vapor deposition in order to improve the utilization efficiency of light emitted from the LED 51. .

  The heat sink 53 is a long material having thermal conductivity. The heat sink 53 transfers operating heat generated from the LED 51 to the cover 20 and dissipates it to the outside. The heat sink 53 has rigidity to support the lamp 11 in the longitudinal direction, and preferably has a small linear expansion coefficient. The heat sink 53 is formed of a metal material that can be extruded. As the metal material of the heat sink 53, aluminum, iron, or the like can be used. Note that the material of the heat sink 53 is not limited to a metal material, and may be a high thermal conductive resin, for example.

  FIG. 3 is a cross-sectional view of the lamp 11 taken along the line AA. FIG. 3 shows a cut surface of the lamp 11 taken along line AA in FIG.

  In FIG. 3, the outer peripheral surface 21 of the cover 20 is substantially circular. The inner peripheral surface 22 of the cover 20 has a shape in which a part of a substantially circular shape protrudes. There are two protruding portions of the inner peripheral surface 22 of the cover 20, and a pair of holding protrusions 23 are formed. The cover 20 is manufactured by extrusion molding.

  The light source module 50 is inserted into the cover 20 along the axial direction (cylindrical direction) of the inner peripheral surface 22 of the cover 20.

  The heat sink 53 has a pair of wall portions 54, a substrate installation portion 55, and a pair of arc portions 57.

  The pair of wall portions 54 has a function of positioning (guide) when the substrate 52 is placed on the substrate placement portion 55. The wall portion 54 shields lighting circuit components (such as an inter-board connector) (not shown) other than the LEDs 51 mounted on the substrate 52 so as not to be viewed from the outside of the cover 20.

  A substrate 52 is installed in the substrate installation unit 55. For example, the substrate 52 on which the LED 51 and the lighting circuit component are mounted is attached and fixed to the substrate installation portion 55 using an adhesive silicon resin (adhesive) or an adhesive member such as a double-sided tape. In addition, the board | substrate 52 may be fixed to the board | substrate installation part 55 using other methods, such as screwing. Or the board | substrate 52 may be integrally installed in the board | substrate installation part 55. FIG. In other words, the circuit pattern of the substrate 52 may be formed in the substrate installation portion 55.

  The board installation part 55 is provided with a screw fixing part 56. The screw fixing portion 56 is a structure for screwing a screw (not shown) inserted in the axial direction of the inner peripheral surface 22 of the cover 20 from the outside of the lamp 11 through the power supply base 30 and the ground base 40. The screw fixing portion 56 is provided with a screw hole 58 into which a screw is screwed. That is, the screw hole 58 is provided along the axial direction of the inner peripheral surface 22 of the cover 20 on the surface opposite to the surface on which the substrate 52 of the substrate installation portion 55 is installed. In order to manufacture the heat sink 53 by extrusion molding, it is preferable that the lowermost portion of the screw fixing portion 56 is opened. The screw is an example of a fastening member for fastening the heat sink 53 to the power supply base 30 and the ground base 40, and the screw hole 58 is a groove into which the fastening member is inserted (the lowermost part of the screw fixing portion 56 is opened). If not, it is an example of a hole). When the screw is screwed into the screw hole 58, the power supply base 30 and the ground base 40 are fixed to the heat sink 53. The power supply cap 30 and the ground cap 40 may be screwed by other methods or may be fixed by a method other than screwing.

  The pair of arc portions 57 is an example of a pair of extending portions. The arc portion 57 is formed to extend in an arc shape along the inner peripheral surface 22 of the cover 20. The arc portion 57 has substantially the same curvature as the inner peripheral surface 22 of the cover 20 and is in contact with or close to the inner peripheral surface 22 of the cover 20. The arc portion 57 provides a path for dissipating the operating heat of the LED 51 to the outside of the cover 20. The part where the board installation part 55 and the arc part 57 are connected extends perpendicularly to the board 52 from both ends of the board installation part 55 in the direction opposite to the light output side of the LED 51. By extending the part connected to the circular arc part 57 from the both ends of the board | substrate installation part 55, the thickness of the heat sink 53 can be made uniform and a moldability can be improved. The outer end of the arc portion 57 (the side far from the central portion of the heat sink 53) reaches the holding protrusion 23 of the cover 20 or the vicinity thereof. As a result, the light source module 50 is positioned inside the cover 20. In addition, between the surface extending along the inner peripheral surface 22 of the cover 20 of the arc portion 57 and the inner peripheral surface 22 of the cover 20, there is an adhesive or a heat conductive member such as a heat conductive grease or a heat conductive sheet. It may be provided. Whether an adhesive or a heat conductive member is provided may be determined as appropriate from the heat-resistant temperature, life, strength, etc. of the LED 51 and circuit elements used.

  On the side opposite to the light output side of the LED 51, a recess 59 is formed in the vicinity of the center of the region W of the heat sink 53 facing the inner peripheral surface 22 of the cover 20. The substrate installation portion 55 and the arc portion 57 form a wall of the recess 59. A region surrounded by the recess 59 and the inner peripheral surface 22 of the cover 20 is a gap 60. That is, there is a gap 60 between the surface opposite to the surface on which the substrate 52 of the substrate installation portion 55 is installed and the inner peripheral surface 22 of the cover 20.

  The heat sink 53 transmits heat generated when the LED 51 and circuit components (elements, etc.) mounted on the substrate 52 are turned on, that is, heat generated on the substrate 52 from the substrate installation portion 55 via a pair of arc portions 57. The heat is dissipated by being conducted to the cover 20.

  FIG. 4 is a cross-sectional view of the lamp 11 according to the present embodiment. On the other hand, FIG. 5 is a cross-sectional view of a lamp 81 according to a comparative example. FIG. 4 shows the same cut surface of the lamp 11 as in FIG. 3, but the vertical direction is reversed.

  4 and 5, the axis X is a central axis that passes through the center of the cross section of the covers 20 and 90 and is parallel to the surface of the boards 52 and 92 on which the LEDs 51 and 91 are mounted. The axis Y is a central axis that passes through the center of the cross section of the covers 20 and 90 and is perpendicular to the surface on which the LEDs 51 and 91 of the substrates 52 and 92 are mounted.

  The lamp 11 according to the present embodiment and the lamp 81 according to the comparative example differ only in the shape of the heat sinks 53 and 93. In the comparative example, the heat sink 93 has an arc shape along the inner peripheral surface of the cover 90 in the entire region W of the heat sink 93 opposite to the light emitting side of the LED 91 and facing the inner peripheral surface of the cover 90. , Is in contact with or close to the inner peripheral surface of the cover 90.

  FIG. 6 is a diagram illustrating a state in which the lamp 11 according to the present embodiment is warped. On the other hand, FIG. 7 is a diagram illustrating a state in which the lamp 81 according to the comparative example is warped.

  First, the cause of warping of the lamp 81 according to the comparative example will be described.

  When the LED 91 is lit, the LED 91 and the lighting circuit element mounted on the substrate 92 generate heat. The generated heat is transmitted to the heat sink 93 mainly through the substrate 92 and the adhesive. Further, the heat transmitted to the heat sink 93 is transmitted to the cover 90 mainly from a portion of the heat sink 93 that is in contact with or close to the inner peripheral surface of the cover 90, and is released to the outside air from the outer peripheral surface of the cover 90. Since the thermal conductivity of the polycarbonate resin used for the cover 90 is as low as about 0.19 [W / (m · K)], the cover 90 is not soaked, and points A to A on the surface of the cover 90 in FIG. Among H, the temperature at point A (top) is the highest and the temperature at point E (bottom) is the lowest.

Here, the cover 90 expands due to heat. Polycarbonate has a linear expansion coefficient of about 7 [1 / ° C. × 10 ⁻⁵ ]. Expansion due to heat on the heat sink 93 side (point A side) of the cover 90 is larger than expansion due to heat on the light emission side (point E side). Therefore, the balance of the tube length is lost above and below the cover 90, and as shown in FIG. 7, the center of the cover 90 protrudes upward and a large warp occurs.

  Next, the lamp 11 according to the present embodiment will be described.

  When the LED 51 is lit, the heat generated from the LED 51 and the lighting circuit element mounted on the substrate 52 is transmitted to the heat sink 53 mainly by heat conduction, as in the comparative example. The heat transmitted to the heat sink 53 is mainly transmitted from the arc portion 57 of the heat sink 53 to the cover 20 and is released from the outer peripheral surface 21 of the cover 20 to the outside air. In the present embodiment, since the concave portion 59 is formed in the heat sink 53, the vicinity of the point A that hits the back of the LED 51 on the heat sink 53 side of the cover 20 is not transferred from the arc portion 57. Further, in the region surrounded by the recess 59 and the inner peripheral surface 22 of the cover 20, no adhesive or heat conducting material that promotes heat conduction is arranged, and the gap 59 is formed. Heat transfer from the surface to be formed to the inner peripheral surface 22 of the cover 20 facing the recess 59 is suppressed. That is, in the present embodiment, when heat of the LED 51, the circuit element, etc. is radiated through the heat sink 53, it is directly behind the LED 51 and is symmetric with respect to the center (point E) of the light exit surface with respect to the axis X. (Point A), that is, a structure in which heat is not transmitted to the vicinity of the center of the region W but is mainly radiated from the arc portion 57 where the heat sink 53 and the cover 20 are in contact to the outside air. For this reason, the temperature rise of the point A on the surface of the cover 20 in FIG. 4 is suppressed, and the temperature difference between the point A and the point E becomes smaller than that of the lamp 81 according to the comparative example.

  Therefore, according to the present embodiment, it is possible to suppress the deviation of the tube length above and below the cover 20, and to reduce or prevent the warpage in the vertical direction as shown in FIG.

  In FIG. 4, the distance P between the left arc portion 57 and the right arc portion 57 of the heat sink 53 is approximately the same as the width Q of the substrate 52. That is, P≈Q. As described above, P ≧ Q / 2 is desirable in order to suppress the temperature rise at point A and reduce the temperature difference between point A and point E. That is, it is desirable that the left circular arc portion 57 and the right circular arc portion 57 be separated from each other at an interval of half or more of the width Q of the substrate 52.

  In the present embodiment, the arc portion 57 of the heat sink 53 extends along the inner peripheral surface 22 of the cover 20 in the light output direction of the LED 51. In other words, in the present embodiment, the pair of arc portions 57 are perpendicular to the surface opposite to the surface on which the substrate 52 of the substrate placement portion 55 is placed at positions corresponding to both ends in the width direction of the substrate 52. It extends outward from an intersection K between the extended line and the inner peripheral surface 22 of the cover 20. For this reason, a large area where the arc portion 57 and the cover 20 are in contact with each other can be secured, and the heat generated by the LED 51 can be sufficiently released.

  In addition, although the temperature of the point B, the point C, the point G, and the point H where the arc part 57 is close increases, the left and right arc parts 57 are symmetrical with respect to the axis Y, so No warpage occurs. In other words, in the present embodiment, the pair of arc portions 57 are arranged symmetrically with respect to the center line (axis Y) in the width direction of the substrate 52, so that warping in the left-right direction is reduced or prevented. Can do. In the present embodiment, since the pair of arc portions 57 has a symmetrical shape with respect to the center line (axis Y) in the width direction of the substrate 52, the warpage in the left-right direction is further reduced. Or it can be prevented.

  As described above, in the present embodiment, the heat sink 53 has a region (concave portion 33) in which the air gap 60 is formed in the vicinity of the center of the region W facing the inner peripheral surface 22 of the cover 20, and On both sides, there are two regions (a pair of arc portions 57) whose surface shape substantially coincides with the inner peripheral surface 22 and is in contact with or close to the inner peripheral surface 22. Due to the air gap 60, the temperature difference between the side of the cover 20 that emits light and the side of the heat sink 53 is hindered from heat conduction to the area around the LED 51 on the heat sink 53 side (near point A in FIG. 4). Can be reduced. Furthermore, since the gap 60 is not in contact with the area where the heat sink 53 and the cover 20 are directly behind the LED 51, the arc portion 57 extends outward from both ends of the substrate 52, so that the contact area between the heat sink 53 and the cover 20 is increased. The heat generated from the LED 51 and the lighting circuit element can be efficiently radiated to the outside air, and the warpage of the cover 20 can be easily suppressed.

  According to the present embodiment, it is possible to provide the lamp 11 that has sufficient heat dissipation, has a simple configuration, suppresses warpage, and reduces the warpage of the lamp 11.

  In this embodiment, since the shape of the cover 20 is cylindrical, the arc portion 57 of the heat sink 53 is formed so as to extend in an arc shape along the inner peripheral surface 22 of the cover 20. The shapes of the arc 20 and the arc portion 57 can be appropriately changed according to the use of the lamp 11 or the like. For example, the inner peripheral surface 22 of the cover 20 may have a corner, and if the arc portion 57 is in contact with or close to the corner, the shape of the arc portion 57 preferably includes the corner.

Embodiment 2. FIG.
In the present embodiment, differences from the first embodiment will be mainly described.

  The configuration of lighting apparatus 10 according to the present embodiment is the same as that of the first embodiment shown in FIG.

  FIG. 8 is a cross-sectional view of the lamp 11 according to the present embodiment. FIG. 8 shows a cut surface of the lamp 11 along the line AA in FIG. 2, but the vertical direction is reversed.

  In FIG. 8, the heat sink 53 is formed of an aluminum plate material. The arc portion 57 is formed by bending both ends of the plate material into an arc shape that substantially matches the shape of the inner peripheral surface 22 of the cover 20.

  The inner peripheral surface 22 of the cover 20 has four protruding portions and forms two pairs of holding projections 23. The portion where the board setting portion 55 and the arc portion 57 are connected (the portion where the plate material of the heat sink 53 is bent) and the lower end of the arc portion 57 (the opposite side to the substrate setting portion 55 of the heat sink 53) are It reaches the holding protrusion 23 or the vicinity thereof. As a result, the light source module 50 is positioned inside the cover 20. The arc portion 57 is positioned so as to be vertically symmetric with respect to the axis X.

  Between the surface extending along the inner peripheral surface 22 of the cover 20 of the arc portion 57 and the inner peripheral surface 22 of the cover 20, a heat conductive adhesive made of silicon is disposed.

  Also in the present embodiment, similarly to the first embodiment, heat from the LED 51 and the circuit element is radiated to the outside mainly through the arc portion 57. In the present embodiment, since the heat conductive adhesive is used, the heat conduction from the arc portion 57 to the cover 20 is promoted, and the temperature of the LED 51 and the circuit element can be lowered. Moreover, since the space | gap 60 is formed widely, the temperature rise of the point A which hits the back of LED51 can be suppressed significantly. Further, since the arc portion 57 which is the main heat conduction path is arranged symmetrically with respect to the axis X and the axis Y, the surface temperature distribution of the cover 20 is also substantially symmetrical with respect to the axis X and the axis Y, and the cover 20 warpage is further suppressed.

  The distance P between the left arc portion 57 and the right arc portion 57 of the heat sink 53 is equal to or greater than the width Q of the substrate 52. That is, P> Q. Therefore, the temperature difference between point A and point E can be greatly reduced.

Embodiment 3 FIG.
In the present embodiment, differences from the first embodiment will be mainly described.

  The configuration of lighting apparatus 10 according to the present embodiment is the same as that of the first embodiment shown in FIG.

  FIG. 9 is a cross-sectional view of the lamp 11 according to the present embodiment. FIG. 10 is a graph showing the relationship between the opening angle θ of the heat sink 53 of the lamp 11 and the temperature difference between the upper and lower portions of the cover 20 (temperature difference between point A and point E). FIG. 9 shows a cut surface of the lamp 11 along the line AA in FIG. 2, but the vertical direction is reversed.

  In FIG. 9, the portion where the substrate setting portion 55 and the circular arc portion 57 of the heat sink 53 are connected to each other in the direction opposite to the light emission side of the LED 51 from the inner side (side closer to the center portion of the heat sink 53) than the both ends of the substrate setting portion 55. The substrate 52 extends obliquely. For this reason, in the present embodiment, the substrate 52 of the substrate installation portion 55 is located at the end corresponding to the both ends in the width direction of the substrate 52, inside the arc portion 57 (side closer to the center of the heat sink 53). The circular arc portion 57 can be formed so as to be located outside the intersection K between the line extending perpendicularly from the surface opposite to the surface on which the is installed and the inner peripheral surface 22 of the cover 20.

  Here, it is assumed that the area of the portion where the arc portion 57 of the heat sink 53 contacts the cover 20 is constant, and the opening angle θ of the concave portion 59 of the heat sink 53 is changed. As shown in FIG. 10, in order to effectively reduce the temperature difference between the upper and lower portions of the cover 20, the opening angle θ of the recess 59 of the heat sink 53 is changed from the center line (axis Y) of the substrate installation portion 55 or the substrate 52. It is desirable to make it 20 degrees or more. In other words, it is desirable that the left arc portion 57 and the right arc portion 57 of the heat sink 53 be separated from each other at an interval of 40 degrees or more with respect to the angle 360 degrees of the entire inner peripheral surface 22 of the cover 20. On the other hand, when the opening angle θ of the recess 59 of the heat sink 53 is increased, it is required that the light from the LED 51 is not blocked by the heat sink 53 as much as possible. It is desirable that at least the arc portion 57 does not extend to the light emission side from the light emission surface of the LED 51. As shown in FIG. 10, when the opening angle θ of the recess 59 of the heat sink 53 is 60 degrees or more from the center line (axis Y) of the substrate installation portion 55 or the substrate 52, the temperature difference between the upper and lower portions of the cover 20 is substantially constant. Therefore, the opening angle θ of the recess 59 is preferably in the range of 20 to 60 degrees. That is, it is desirable that the left arc portion 57 and the right arc portion 57 be separated from each other at an interval of 40 degrees or more and 120 degrees or less with respect to an angle 360 degrees of the entire inner peripheral surface 22 of the cover 20.

Embodiment 4 FIG.
In the present embodiment, differences from the first embodiment will be mainly described.

  The configuration of lighting apparatus 10 according to the present embodiment is the same as that of the first embodiment shown in FIG.

  FIG. 11 is a cross-sectional view taken along line AA of the lamp 11 according to the present embodiment. FIG. 12 is a cross-sectional view of the cover 20. FIG. 13 is a cross-sectional view of the light source module 50. FIG. 11 shows a cut surface of the lamp 11 taken along line AA in FIG. FIG. 12 shows only the cover 20 of the lamp 11 of FIG. FIG. 13 shows only the light source module 50 of the lamp 11 of FIG.

  In FIG. 11, the heat sink 53 further includes an engaging portion 61.

  In the cross section of the heat sink 53, the substrate installation portion 55 and the wall portion 54, and the extended wall portion 54 and the arc portion 57 are connected. The board installation part 55 and the arc part 57 extend outward from the wall part 54. The engaging part 61 extends downward from the board installation part 55 of the wall part 54 between the part extending outside the wall part 54 of the board installation part 55 and the arc part 57 and connecting them. Formed with parts. When the light source module 50 is accommodated in the cover 20, the light projection module 50 is not rotated by engaging the holding protrusion 23 provided on the inner peripheral surface 22 of the cover 20 with the engaging portion 61. It is stably held inside the cover 20. In the assembly process of the lamp 11, when the light source module 50 is inserted into the cover 20, the engaging portion 61 and the holding projection 23 that engage with each other function as an insertion guide.

  A substrate 52 is fixed to the substrate setting portion 55 using an adhesive member 70. A space 60 is formed in a region surrounded by the arcuate portion 57, a portion where the substrate placement portion 55 and the wall portion 54 are extended downward from the substrate placement portion 55.

  As described above, the holding protrusion 23 of the cover 20 is engaged with the engaging portion 61 of the heat sink 53. As in the first embodiment, the holding projection 23 is erected with a predetermined height from the inner peripheral surface 22 of the cover 20 toward the inside of the cover 20. Since the cover 20 is extruded, the holding projection 23 extends in the axial direction of the inner peripheral surface 22 of the cover 20.

  In a region sandwiched between the holding projections 23 of the cover 20, a maintenance projection 24 is formed. The maintenance protrusion 24 is an example of a protrusion. Three maintenance protrusions 24 are erected with a predetermined height from the inner peripheral surface 22 of the cover 20 toward the inside of the cover 20. Since the cover 20 is extruded, the sustaining protrusion 24 also extends in the axial direction of the inner peripheral surface 22 of the cover 20. In addition, the maintenance protrusion 24 may be provided only in one place instead of three places, may be provided in two places, and may be provided in four or more places.

  As described above, in the present embodiment, the maintenance protrusion 24 is provided at a location on the inner peripheral surface 22 of the cover 20 that faces the surface opposite to the surface on which the substrate 52 of the substrate installation portion 55 is installed, It protrudes toward the board installation part 55. The maintenance protrusion 24 is provided between the pair of arc portions 57 of the heat sink 53. The maintenance protrusion 24 corrects the warpage of the cover 20 by hitting the outer surface of the wall that forms the screw fixing portion 56 of the board setting portion 55, that is, the screw hole 58, but in the state where the warpage of the cover 20 is not generated, It is separated from the substrate installation part 55. For this reason, even if lighting of LED51 starts, there is no heat transfer from the heat sink 53 to the uppermost part of the cover 20, the temperature rise of the uppermost part of the cover 20 is suppressed, and the temperature difference of the upper and lower parts of the cover 20 becomes large. Hateful. Still, when the LED 51 continues to be lit for a long time and the temperature difference between the upper and lower portions of the cover 20 gradually increases and the cover 20 is warped, the warp is large due to the sustaining protrusions 24 hitting the board installation portion 55. Is prevented. Thus, according to this Embodiment, it becomes possible to suppress the curvature of the lamp | ramp 11 with a simple structure. Note that the maintenance protrusion 24 may hit a portion other than the screw fixing portion 56 of the substrate installation portion 55.

  The clearance between the tip of the maintenance projection 24 of the cover 20 and the tip of the screw fixing portion 56 of the heat sink 53 is, for example, in consideration of design specifications such as the axial length of the inner peripheral surface 22 of the cover 20. The optimum value is selected and set in the range of 0.2 to 2.0 mm. This numerical value is a numerical value that determines the maximum deformation (warp) dimension of the cover 20 having a large linear expansion coefficient and having flexibility, based on the heat sink 53 having a small linear expansion coefficient and high rigidity. Strictly speaking, since the heat sink 53 is also slightly deformed (warped), the absolute deformation (warp) dimension of the lamp 11 is not directly controlled. Since deformation (warpage) is dominant, it is substantially synonymous with controlling the deformation (warpage) of the lamp 11.

  The shape of the tip of each of the holding protrusion 23 and the maintaining protrusion 24 is not limited to the shape shown in FIG. The dimensions of each part of the cover 20 are not limited to the dimensions shown in FIG. 12, but it is preferable that T1 = T2 = T3 = T4 when priority is given to the optimum conditions for extrusion molding of the cover 20. Here, T1 is the thickness dimension of the cover 20 (distance between the outer peripheral surface 21 and the inner peripheral surface 22), T2 is the average thickness dimension of the holding projection 23, T3 is the average thickness dimension of the maintaining projection 24, and T4 Is the average dimension of the spacing between the sustaining protrusions 24.

  The shape of the heat sink 53 is not limited to the shape shown in FIG. 13. For example, the shape similar to that of the first embodiment shown in FIGS. 3 and 4 and the second embodiment shown in FIG. The shape may be the same as that of the third embodiment, or the same shape as that of the third embodiment shown in FIG. Further, the dimensions of each part of the light source module 50 are not limited to the dimensions shown in FIG. 13, but T5 = T6 = T7 is preferred when priority is given to the optimum conditions for extrusion of the heat sink 53. Here, T5 is an average thickness dimension of a portion excluding the screw fixing portion 56 of the substrate installation portion 55, T6 is an average thickness dimension of a portion where the wall portion 54 is extended downward from the substrate installation portion 55, and T7 is an arc. This is the average thickness dimension of the portion 57.

  FIG. 14 is a diagram illustrating a state in which the lamp 11 has warped due to its own weight. FIG. 15 is a diagram illustrating a state in which the lamp 11 is warped by heat.

  14 and 15, an arrow E indicates the light emission direction of the LED 51 (light irradiation direction of the lamp 11). In FIG. 14, W1 is the maximum deformation (warp) dimension due to the weight of the lamp 11 (cover 20). In FIG. 15, W2 is the maximum deformation (warp) dimension due to heat during the lighting operation of the lamp 11 (cover 20).

  When the lamp 11 is deformed (warped) by its own weight, the tip of the screw fixing portion 56 of the heat sink 53 and the tip of the maintenance projection 24 of the cover 20 come into contact with each other in the vicinity of the center of the lamp 11. Deformation (warping) is regulated. On the other hand, when the lamp 11 is turned on and is deformed (warped) by the operating heat of the LED 51, the distal end portion of the screw fixing portion 56 of the heat sink 53 and the distal end portion of the maintenance protrusion 24 of the cover 20 near both end portions of the lamp 11. Comes into contact with each other, and deformation (warping) of the cover 20 is restricted.

  Thus, in this Embodiment, although the lamp | ramp 11 is a simple structure, the curvature by a dead weight or a heat | fever can be suppressed.

  In the present embodiment, as in the first to third embodiments, the arc portion 57 on the left side of the heat sink 53 and the arc portion 57 on the right side of the heat sink 53 are spaced at least half the width of the substrate 52 or within the cover 20. The entire circumferential surface 22 may not be separated from each other at an interval of 40 degrees or more and 120 degrees or less with respect to an angle of 360 degrees. In other words, in the present embodiment, the pair of arc portions 57 are arranged at intervals of less than half of the width of the substrate 52 or at intervals of less than 40 degrees with respect to the angle 360 degrees of the entire inner peripheral surface 22 of the cover 20. Even if they are separated, the warp of the cover 20 can be suppressed by the maintenance protrusion 24 of the cover 20.

Embodiment 5. FIG.
In the present embodiment, differences from the fourth embodiment will be mainly described.

  The configuration of lighting apparatus 10 according to the present embodiment is the same as that of the first embodiment shown in FIG.

  FIG. 16 is a cross-sectional view taken along line AA of the lamp 11 according to the present embodiment. FIG. 17 is a cross-sectional view of the cover 20. FIG. 16 shows a cut surface of the lamp 11 taken along line AA in FIG. FIG. 17 shows only the cover 20 of the lamp 11 of FIG.

  In FIG. 16, the maintenance protrusion 24 of the cover 20 is provided only at one place. The maintenance protrusion 24 includes one plate portion 24a and three leg portions 24b. The plate portion 24a of the sustaining protrusion 24 has a plate shape curved in a substantially arc shape. The width of the plate portion 24 a of the maintenance protrusion 24 is larger than the width of the screw fixing portion 56 of the heat sink 53. Therefore, when the cover 20 is warped, the plate portion 24a of the sustaining protrusion 24 reliably hits the substrate installation portion 55. Of the three leg portions 24 b of the maintenance protrusion 24, the left and right leg portions 24 b correspond to portions that rise from the inner peripheral surface 22 of the cover 20 to the inside of the cover 20. The left leg portion 24b is not connected to the left end portion of the plate portion 24a but is connected between the left end portion and the central portion of the plate portion 24a. Therefore, a concave portion 25 into which the tip of the arc portion 57 on the left side of the heat sink 53 fits is formed in the maintenance protrusion 24. Similarly, the right leg 24b is connected not between the right end of the plate 24a but between the right end and the center of the plate 24a. For this reason, the maintenance protrusion 24 is also formed with a recess 25 into which the tip of the arc portion 57 on the right side of the heat sink 53 fits. Of the three legs 24 b of the maintenance protrusion 24, the center leg 24 b protrudes from the center of the plate 24 a to the outside of the cover 20. For this reason, a groove 26 extending along the axial direction of the inner peripheral surface 22 of the cover 20 is formed between the central leg portion 24b and the left leg portion 24b. A groove 26 extending along the axial direction of the inner peripheral surface 22 of the cover 20 is also formed between the central leg portion 24b and the right leg portion 24b. That is, a groove 26 is formed between the adjacent leg portions 24 b on the outer peripheral surface 21 of the cover 20.

  The shapes of the plate portion 24a (the end portion on the side facing the substrate installation portion 55) and the leg portion 24b of the sustaining protrusion 24 are not limited to the shapes shown in FIG. The number of the leg portions 24b of the maintenance protrusion 24 is not limited to three. The dimensions of each part of the cover 20 are not limited to the dimensions shown in FIG. 17, but it is preferable that T1 = T2 = T8 = T9 = T10 when priority is given to the optimum conditions for extrusion molding of the cover 20. Here, T1 is a thickness dimension of the cover 20 (distance between the outer peripheral surface 21 and the inner peripheral surface 22), T2 is an average thickness dimension of the holding projection 23, and T8 is an average thickness of the leg portion 24b of the maintenance projection 24. The dimension T9 is an average dimension of the intervals (that is, the grooves 26) of the leg portions 24b of the sustaining protrusion 24, and T10 is an average thickness dimension of the plate part 24a of the retaining protrusion 24.

  In the present embodiment, as in the fourth embodiment, the lamp 11 can be prevented from warping due to its own weight or heat while having a simple configuration. Further, in the present embodiment, as compared with the fourth embodiment, since the sustain protrusion 24 has the recess 25, the arc portion 57 of the heat sink 53 can be hooked, and the position of the heat sink 53 can be easily fixed. Further, since the cover 20 has a rib (a leg portion 24b at the center of the maintenance projection 24), the cooling of the maintenance projection 24 is facilitated during the extrusion molding of the cover 20, and the vicinity of the recess 25 of the maintenance projection 24 (the arc of the heat sink 53). The stability of the shape of the portion where the portion 57 is hooked is improved.

Embodiment 6 FIG.
In the present embodiment, differences from the fourth embodiment will be mainly described.

  The configuration of lighting apparatus 10 according to the present embodiment is the same as that of the first embodiment shown in FIG.

  FIG. 18 is a cross-sectional view taken along line AA of the lamp 11 according to the present embodiment. FIG. 19 is a cross-sectional view of the cover 20. FIG. 18 shows a cut surface of the lamp 11 taken along line AA in FIG. FIG. 19 shows only the cover 20 of the lamp 11 of FIG.

  In FIG. 18, the maintenance protrusions 24 of the cover 20 are provided at two locations. Any one of the maintenance protrusions 24 stands from the inner peripheral surface 22 of the cover 20 toward the inside of the cover 20. The left end of the maintenance protrusion 24 is bent to the left (in a direction away from the right maintenance protrusion 24). Therefore, a concave portion 25 into which the tip of the arc portion 57 on the left side of the heat sink 53 fits is formed in the maintenance protrusion 24. Similarly, the right sustaining protrusion 24 is bent at the tip (to the side away from the left sustaining protrusion 24) on the right side. For this reason, the maintenance protrusion 24 is also formed with a recess 25 into which the tip of the arc portion 57 on the right side of the heat sink 53 fits.

  The shape of the tip end portion of the sustaining protrusion 24 (the end portion on the side facing the substrate installation portion 55) is not limited to the shape shown in FIG. The dimensions of the respective parts of the cover 20 are not limited to the dimensions shown in FIG. 19, but preferably T1 = T2 = T11 when priority is given to the optimum conditions for the extrusion molding of the cover 20. Here, T1 is a thickness dimension of the cover 20 (distance between the outer peripheral surface 21 and the inner peripheral surface 22), T2 is an average thickness dimension of the holding projection 23, and T11 is an average thickness dimension of the maintaining projection 24. .

  In the present embodiment, as in the fourth embodiment, the lamp 11 can be prevented from warping due to its own weight or heat while having a simple configuration. Further, in the present embodiment, compared to the fifth embodiment, the cover 20 does not have a rib (the leg portion 24b at the center of the maintenance protrusion 24) and the outline of the cross section of the cover 20 is a perfect circle, or at least Since it is close to a perfect circle, the rigidity is relatively improved and warping can be further suppressed.

  As mentioned above, although embodiment of this invention was described, you may implement in combination of 2 or more among these embodiment. Alternatively, one of these embodiments may be partially implemented. Alternatively, two or more of these embodiments may be partially combined. In addition, this invention is not limited to these embodiment, A various change is possible as needed.

  DESCRIPTION OF SYMBOLS 10 Lighting device, 11, 81 Lamp, 12 Lighting fixture, 13 Power supply socket, 14 Ground socket, 15 Appliance main body, 20, 90 Cover, 21 Outer peripheral surface, 22 Inner peripheral surface, 23 Holding protrusion, 24 Maintenance protrusion, 24a 24b Leg part, 25 concave part, 26 groove, 30 power supply base, 31 power supply terminal, 32 power supply base case, 40 ground base, 41 ground terminal, 42 ground base case, 50 light source module, 51, 91 LED, 52, 92 board | substrate, 53,93 heat sink, 54 wall part, 55 board installation part, 56 screw fixing | fixed part, 57 circular arc part, 58 screw hole, 59 recessed part, 60 space | gap, 61 engaging part, 70 adhesive member.

Claims (10)

A tubular member having translucency;
A substrate on which a light emitting element is mounted and accommodated in the tubular member;
A substrate placement portion on which the substrate is placed, and a pair of extension portions that are separated from each other by an interval of at least half the width of the substrate and extend along the inner peripheral surface of the tubular member, and are accommodated in the tubular member A heat sink that dissipates heat by conducting heat generated in the substrate from the substrate installation portion to the tubular member via the pair of extending portions,
The heat sink further has a portion extending perpendicularly or obliquely with respect to the substrate in a direction opposite to the substrate installation side of the substrate installation portion from the substrate installation portion and connected to the pair of extension portions. The region surrounded by this portion, the substrate installation portion, the pair of extending portions, and the inner peripheral surface of the tubular member is a gap ,
A pair of holding projections are provided on the inner peripheral surface of the tubular member,
In the heat sink, both end portions of the substrate installation portion and the outer end portions of the pair of extension portions extend outward from a portion connected to the pair of extension portions from the substrate installation portion. The pair of holding projections are fitted into a holding portion formed by a portion and a portion connecting from the substrate installation portion to the pair of extending portions, and is fixed inside the tubular member. And a lamp.   2. The lamp according to claim 1, wherein the pair of extending portions are separated from each other by an interval equal to or larger than the width of the substrate. A tubular member having translucency;
A substrate on which a light emitting element is mounted and accommodated in the tubular member;
A pair of extensions extending along the inner peripheral surface of the tubular member and spaced apart from each other by 40 ° or more with respect to an angle of 360 ° of the entire inner peripheral surface of the tubular member and the substrate mounting portion on which the substrate is installed A heat sink that is housed in the tubular member and dissipates heat by conducting heat generated in the substrate from the substrate installation portion to the tubular member through the pair of extending portions,
The heat sink further has a portion extending perpendicularly or obliquely with respect to the substrate in a direction opposite to the substrate installation side of the substrate installation portion from the substrate installation portion and connected to the pair of extension portions. The region surrounded by this portion, the substrate installation portion, the pair of extending portions, and the inner peripheral surface of the tubular member is a gap ,
A pair of holding projections are provided on the inner peripheral surface of the tubular member,
In the heat sink, both end portions of the substrate installation portion and the outer end portions of the pair of extension portions extend outward from a portion connected to the pair of extension portions from the substrate installation portion. The pair of holding projections are fitted into a holding portion formed by a portion and a portion connecting from the substrate installation portion to the pair of extending portions, and is fixed inside the tubular member. And a lamp.   4. The lamp according to claim 3, wherein the pair of extending portions are separated from each other by an interval of 120 degrees or less with respect to an angle of 360 degrees of the entire inner peripheral surface of the tubular member. The lamp according to any one of claims 1 to 4 , wherein the pair of extending portions are arranged symmetrically with respect to a center line in the width direction of the substrate. The pair of extending portions includes a line extending vertically from a surface opposite to a surface on which the substrate is installed of the substrate installation portion and a position of the tubular member at positions corresponding to both ends in the width direction of the substrate. The lamp according to any one of claims 1 to 5 , wherein the lamp extends outward from an intersection with the inner peripheral surface. The tubular member is cylindrical,
The lamp according to any one of claims 1 to 6 , wherein the pair of extending portions extend in an arc shape along an inner peripheral surface of the tubular member. An adhesive or a heat conducting member is provided between a surface of the pair of extending portions extending along an inner peripheral surface of the tubular member and an inner peripheral surface of the tubular member. Item 8. The lamp according to any one of Items 1 to 7 . The lamp according to any one of claims 1 to 8 , wherein the tubular member is made of resin. A lamp according to any one of claims 1 to 9 ;
An illuminating device comprising: a lighting device that supplies power to the lamp to light the lamp.