WO2021136608A1 - Lightband - Google Patents

Lightband Download PDF

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Publication number
WO2021136608A1
WO2021136608A1 PCT/EP2020/080023 EP2020080023W WO2021136608A1 WO 2021136608 A1 WO2021136608 A1 WO 2021136608A1 EP 2020080023 W EP2020080023 W EP 2020080023W WO 2021136608 A1 WO2021136608 A1 WO 2021136608A1
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WO
WIPO (PCT)
Prior art keywords
light
lead frame
light module
light source
plastic
Prior art date
Application number
PCT/EP2020/080023
Other languages
German (de)
French (fr)
Inventor
Peter Broghammer
Qilong Feng
Dietmar Weisser
Original Assignee
Marquardt Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marquardt Gmbh filed Critical Marquardt Gmbh
Publication of WO2021136608A1 publication Critical patent/WO2021136608A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
    • B60Q3/00—Arrangement of lighting devices for vehicle interiors; Lighting devices specially adapted for vehicle interiors
    • B60Q3/50—Mounting arrangements
    • B60Q3/56—Lighting devices mounted on elongate supports, e.g. on flexible arms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

Definitions

  • the invention is based on a light module according to the preamble of claim 1.
  • Such a light module which can for example be in the form of a strip, is used in particular for the interior and / or interior lighting of a motor vehicle.
  • Such a light module comprises at least one light source and a carrier for the light source. Furthermore, an enclosure is provided for the light source and the carrier.
  • the light sources are soldered onto small circuit boards and the circuit boards are connected by means of strands, which is complex. In particular, this can only be done manually by hand, which means that such light modules are also expensive.
  • the invention is based on the object of further developing the light module in such a way that it has a simpler design and / or is more cost-effective.
  • the light sources in the light module should be designed to be flexible and / or in a confined space.
  • the carrier is formed from a stamped grid. This eliminates the need for a large number of printed circuit boards and their fault-prone connection using strands.
  • the light module is advantageously designed in a simpler manner and is therefore more cost-effective. Furthermore, the light module also offers a higher operating and / or Functional reliability. Further refinements of the invention are the subject of the subclaims.
  • the stamped grid can consist of a material with a high electrical conductivity and / or thermal conductivity, which further increases the operational reliability of the light module.
  • the metal for the lead frame can be copper, copper-beryllium or the like.
  • a plurality of successive light sources can be provided.
  • the light sources are expediently light-emitting diodes, which are particularly energy-efficient.
  • the light sources can be soldered onto the lead frame in a simple manner.
  • an electronic module for controlling the light source can be in electrical connection with the lead frame.
  • a housing made of material permeable to the light radiation of the light source can be provided.
  • the material for the housing can consist of an optically transparent plastic.
  • the invention also provides a method for producing such a light module.
  • the light sources are soldered onto the lead frame. After soldering, the bridges are separated in the lead frame so that electrical short circuits are prevented. The cutting can be done more easily and efficiently by means of laser radiation. If necessary, the webs are then overmolded with plastic for stabilization. The light sources are then overmolded with the optically transparent plastic, such as silicone, polyurethane (PU), polycarbonate (PC) or the like.
  • the optically transparent plastic such as silicone, polyurethane (PU), polycarbonate (PC) or the like.
  • the lead frame can be overmolded with an optically non-transparent plastic so that a housing for the light module is formed.
  • the light module is thus protected from external influences and can be handled in a simple manner as a component for use in the motor vehicle.
  • the overmoulding with the optically transparent as well as the optically non-transparent plastic can be carried out in a simple and cost-effective manner by means of 2K (two-component) injection molding.
  • the overmoulding or encapsulation can achieve a high level of IP protection, which also allows use under harsh conditions, for example in the exterior, off-road, white goods or the like.
  • a light element is to be developed, specifically primarily for use in the interior of motor vehicles, which, as a strip of light with variable length, can display the most varied of colors and / or dynamics.
  • the aim here is to achieve the greatest possible flexibility with regard to the length of the light strip, adaptation to 3D geometries of the vehicle, installation space and / or control such as ambient light, dynamic light or the like.
  • a manufacturing process is to be used here that ensures a high degree of automation and / or high process reliability.
  • a stamped grid made of a material that conducts electricity well and / or heat is used as a carrier for the light emitting diodes.
  • a specially shaped lead frame is ideal for this purpose. This has the following advantages:
  • a flexible and / or plastic deformation of the lead frame is made possible, so that it can be adapted to the installation conditions in the vehicle and / or in the application.
  • the length can vary according to the application.
  • the invention thus creates a light band with a stamped grid.
  • the advantages achieved with the invention are, in particular, that the light module offers good heat dissipation, low power loss, high mechanical strength, low costs due to the high level of automation for production and flexible design. Furthermore, the light module enables variable lengths and also has small installation dimensions. The investment costs for the production of the light module are low, since different lengths and / or geometries can be realized with a single punching tool.
  • FIG. 1 shows a lead frame with light-emitting diodes for a light module seen from the top
  • FIG. 2 shows the lead frame from FIG. 1 seen from the underside
  • FIG. 4 shows a cross section through the light module from FIG. 3 and FIG. 5 shows the method steps for producing the light module.
  • a strip-shaped light module 1 for the interior and / or interior lighting of a motor vehicle can be seen.
  • the light module 1 comprises at least one light source 2, which is in particular a light-emitting diode, and a carrier 3 for the Light source 2.
  • a housing 4 is provided for the light source 2 and the carrier 3.
  • the carrier 3 is formed from a stamped grid, as can be seen with reference to FIGS. 1 and 2.
  • the lead frame 3 consists of a material with a high electrical conductivity and / or a high thermal conductivity.
  • the metal for the lead frame 3 can be copper, copper-beryllium or the like.
  • a multiplicity of successive light sources 2 are provided for the strip-shaped light module 1.
  • the light sources 2 are soldered onto the lead frame.
  • the housing 4 consists of a material that is transparent to the light radiation 5 from the light source 2 shown in FIG. 4.
  • the housing 4 can consist of an optically transparent plastic.
  • an electronics module 6 for controlling the light source 2 is electrically connected to the lead frame 3.
  • a housing 7 made of an optically non-transparent plastic is also provided for the light module 1, as can be seen in FIG. 4.
  • the method for producing the light module 1 can be seen in more detail in FIG. 5.
  • a first method step VI the lead frame 3 is produced from a metal strip by punching and rolled up on a roll.
  • the light sources 2 are soldered onto the lead frame 3 unrolled from the roll.
  • the bridges in the lead frame 3 are separated in method step V3, in particular by means of laser radiation, and the lead frame 3 is cut to the desired length for the light module 1. If necessary, the webs in the lead frame 3 can also be overmolded with plastic for stabilization.
  • the electronics module 6 is soldered onto the lead frame 3.
  • the light sources 2 are encapsulated with the optically transparent plastic, such as silicone, polyurethane (PU), polycarbonate (PC) or the like.
  • the lead frame 3 can then be overmolded with an optically nontransparent plastic, in such a way that the housing 7 is formed, the light module 1 then being obtained in method step V6 for installation in the motor vehicle.
  • the encapsulation with the optically transparent as well as the optically non-transparent plastic can be made by means of 2K (two-component) injection molding.
  • the invention is not restricted to the exemplary embodiment described and illustrated. Rather, it also includes all technical developments within the scope of the invention defined by the patent claims.
  • the light module can not only be used for exterior and / or interior lighting in a motor vehicle. Rather, the light module 1 can also be used in the manner of an “intelligent” spotlight, also for uses other than in the motor vehicle, for example in household appliances, in real estate or the like.
  • the invention can also be used for dynamic interior lighting in real time, for example for dynamic roof lighting, for exterior lighting, for example for floor lighting or logo drawing on the floor, and / or for optical communication in an autonomous vehicle, for example for communication between the Vehicles or between the vehicle and pedestrians.

Abstract

The invention relates to a lightband, in particular for the interior and/or interior lighting of a motor vehicle. The light module comprises at least one light source, a support for the light source and an enclosure for both the light source and the support. The support is made from a punched grid.

Description

Lichtband Light band
Die Erfindung geht aus von einem Lichtmodul nach dem Oberbegriff des Patentanspruchs 1. The invention is based on a light module according to the preamble of claim 1.
Ein solches Lichtmodul, das beispielsweise bandförmig ausgebildet sein kann, wird insbesondere für die Innen- und/oder Interieur-Beleuchtung eines Kraftfahrzeugs eingesetzt. Such a light module, which can for example be in the form of a strip, is used in particular for the interior and / or interior lighting of a motor vehicle.
Ein derartiges Lichtmodul umfasst wenigstens eine Lichtquelle und einen Träger für die Lichtquelle. Des Weiteren ist eine Umhausung für die Lichtquelle sowie den Träger vorgesehen. Bei dem bekannten Lichtmodul sind die Lichtquellen auf kleinen Leiterplatten aufgelötet und die Leiterplatten mittels Litzen verbunden, was aufwändig ist. Insbesondere ist dies nur manuell in Handarbeit möglich, womit solche Lichtmodule auch teuer sind. Such a light module comprises at least one light source and a carrier for the light source. Furthermore, an enclosure is provided for the light source and the carrier. In the known light module, the light sources are soldered onto small circuit boards and the circuit boards are connected by means of strands, which is complex. In particular, this can only be done manually by hand, which means that such light modules are also expensive.
Der Erfindung liegt die Aufgabe zugrunde, das Lichtmodul derart weiterzuentwickeln, dass dieses einfacher ausgebildet und/oder kostengünstiger ist. Insbesondere sollen bei dem Lichtmodul die Lichtquellen flexibel und/oder auf engem Bauraum gestaltet sein. The invention is based on the object of further developing the light module in such a way that it has a simpler design and / or is more cost-effective. In particular, the light sources in the light module should be designed to be flexible and / or in a confined space.
Diese Aufgabe wird bei einem gattungsgemäßen Lichtmodul durch die kennzeichnenden Merkmale des Anspruchs 1 gelöst. In the case of a generic light module, this object is achieved by the characterizing features of claim 1.
Beim erfindungsgemäßen Lichtmodul ist der Träger aus einem Stanzgitter gebildet. Es entfällt damit die Vielzahl von Leiterplatten sowie deren fehleranfällige Verbindung mittels Litzen. In vorteilhafter Weise ist das Lichtmodul einfacher ausgebildet und damit kostengünstiger. Des Weiteren bietet das Lichtmodul auch eine höhere Betriebs- und/oder Funktionssicherheit. Weitere Ausgestaltungen der Erfindung sind Gegenstand der Unteransprüche . In the light module according to the invention, the carrier is formed from a stamped grid. This eliminates the need for a large number of printed circuit boards and their fault-prone connection using strands. The light module is advantageously designed in a simpler manner and is therefore more cost-effective. Furthermore, the light module also offers a higher operating and / or Functional reliability. Further refinements of the invention are the subject of the subclaims.
In weiterer Ausgestaltung kann das Stanzgitter aus einem Material mit einer hohen elektrischen Leitfähigkeit und/oder Wärmeleitfähigkeit bestehen, was die Betriebssicherheit des Lichtmoduls weiter steigert. Bei dem Metall für das Stanzgitter kann es sich um Kupfer, Kupfer-Beryllium o. dgl. handeln. In a further embodiment, the stamped grid can consist of a material with a high electrical conductivity and / or thermal conductivity, which further increases the operational reliability of the light module. The metal for the lead frame can be copper, copper-beryllium or the like.
Zwecks bandförmiger Ausgestaltung des Lichtmoduls kann eine Vielzahl von aufeinander folgenden Lichtquellen vorgesehen sein. Zweckmäßigerweise handelt es sich bei den Lichtquellen um Leuchtdioden, welche besonders energieeffizient sind. In einfacher Art und Weise können die Lichtquellen auf das Stanzgitter aufgelötet sein. In kompakter Bauart kann ein Elektronik-Modul zur Ansteuerung der Lichtquelle mit dem Stanzgitter in elektrischer Verbindung stehen. For the purpose of a band-shaped configuration of the light module, a plurality of successive light sources can be provided. The light sources are expediently light-emitting diodes, which are particularly energy-efficient. The light sources can be soldered onto the lead frame in a simple manner. In a compact design, an electronic module for controlling the light source can be in electrical connection with the lead frame.
Zum Schutz der Lichtquellen kann eine Umhausung aus für die Lichtstrahlung der Lichtquelle durchlässigem Material vorgesehen sein. In kostengünstiger Art kann das Material für die Umhausung aus einem optisch transparenten Kunststoff bestehen. To protect the light sources, a housing made of material permeable to the light radiation of the light source can be provided. In a cost-effective way, the material for the housing can consist of an optically transparent plastic.
Die Erfindung stellt weiterhin ein Verfahren zur Herstellung eines solchen Lichtmoduls bereit. The invention also provides a method for producing such a light module.
Beim erfindungsgemäßen Herstellverfahren werden die Lichtquellen auf das Stanzgitter aufgelötet. Nach dem Auflöten werden die Brücken im Stanzgitter aufgetrennt, so dass elektrische Kurzschlüsse verhindert sind. Das Auftrennen kann einfacher sowie effizienter Art und Weise mitttels Laserstrahlung erfolgen. Gegebenenfalls werden dann noch die Stege zur Stabilisierung mit Kunststoff umspritzt. Anschließend werden die Lichtquellen mit dem optisch transparenten Kunststoff, wie Silikon, Polyurethan (PU), Polycarbonat (PC) o. dgl., umspritzt. In the manufacturing process according to the invention, the light sources are soldered onto the lead frame. After soldering, the bridges are separated in the lead frame so that electrical short circuits are prevented. The cutting can be done more easily and efficiently by means of laser radiation. If necessary, the webs are then overmolded with plastic for stabilization. The light sources are then overmolded with the optically transparent plastic, such as silicone, polyurethane (PU), polycarbonate (PC) or the like.
In weiterer Ausgestaltung kann das Stanzgitter mit einem optisch nichttransparenten Kunststoff umspritzt werden, derart dass ein Gehäuse für das Lichtmodul ausgebildet ist. Damit ist das Lichtmodul vor äußeren Einflüssen geschützt und als ein Bauteil zum Einsatz im Kraftfahrzeug in einfacher Art und Weise handhabbar. Das Umspritzen mit dem optisch transparenten sowie dem optisch nichttransparenten Kunststoff kann in einfacher und kostengünstiger Art und Weise mittels 2K(Zwei-Komponenten)-Spritzgießen erfolgen. Durch das Umspritzen beziehungsweise Vergießen kann ein hoher IP-Schutz erreicht werden, der auch eine Anwendung unter harten Bedingungen, beispielsweise im Exterieur, bei Offroad, bei weißer Ware o. dgl., zulässt. In a further embodiment, the lead frame can be overmolded with an optically non-transparent plastic so that a housing for the light module is formed. The light module is thus protected from external influences and can be handled in a simple manner as a component for use in the motor vehicle. The overmoulding with the optically transparent as well as the optically non-transparent plastic can be carried out in a simple and cost-effective manner by means of 2K (two-component) injection molding. The overmoulding or encapsulation can achieve a high level of IP protection, which also allows use under harsh conditions, for example in the exterior, off-road, white goods or the like.
Für eine besonders bevorzugte Ausgestaltung der Erfindung ist nachfolgendes festzustellen. The following is to be stated for a particularly preferred embodiment of the invention.
Es soll ein Lichtelement, und zwar schwerpunktmäßig für den Einsatz im Interieur von Kraftfahrzeugen entwickelt werden, welches als Lichtband mit variabler Länge unterschiedlichste Farben und/oder Dynamik aufzeigen kann. Hierbei soll eine möglichst hohe Flexibilität bezüglich der Länge des Lichtbandes, Anpassung an 3D-Geometrien des Fahrzeugs, Einbauraum und/oder Ansteuerung, wie Ambient Light, Dynamic Light o. dgl., erreicht werden. Zusätzlich soll hierbei ein Fertigungsverfahren verwendet werden, das eine hohe Automatisierbarkeit und/oder eine hohe Prozesssicherheit gewährleistet. A light element is to be developed, specifically primarily for use in the interior of motor vehicles, which, as a strip of light with variable length, can display the most varied of colors and / or dynamics. The aim here is to achieve the greatest possible flexibility with regard to the length of the light strip, adaptation to 3D geometries of the vehicle, installation space and / or control such as ambient light, dynamic light or the like. In addition, a manufacturing process is to be used here that ensures a high degree of automation and / or high process reliability.
Als Träger für die Leuchtdioden, und zwar für RGB-LEDs und/oder Smart LEDs, wird ein Stanzgitter aus einem gut elektrisch und/oder wärmeleitenden Material verwendet. Hierzu bietet sich ein speziell geformtes Stanzgitter an. Dies hat folgende Vorteile: As a carrier for the light emitting diodes, specifically for RGB LEDs and / or Smart LEDs, a stamped grid made of a material that conducts electricity well and / or heat is used. A specially shaped lead frame is ideal for this purpose. This has the following advantages:
Gute Wärmeabfuhr, wobei eine größere Anzahl von LEDs Wärme erzeugt, die abgeführt werden muss. Good heat dissipation, with a larger number of LEDs generating heat that needs to be dissipated.
Gute elektrische Leitfähigkeit, womit geringe Verluste sowie eine reduzierte Wärmeentwicklung einher gehen. Good electrical conductivity, which means low losses and reduced heat generation.
Gute mechanische Festigkeit und damit Schutz der LEDs. Es ist eine flexible und/oder auch plastische Verformung des Stanzgitters ermöglicht, so dass die Anpassbarkeit an die Einbauverhältnisse im Fahrzeug und/oder in der Anwendung gegeben ist. Good mechanical strength and thus protection of the LEDs. A flexible and / or plastic deformation of the lead frame is made possible, so that it can be adapted to the installation conditions in the vehicle and / or in the application.
Die Länge kann entsprechend den Anwendungen variieren. The length can vary according to the application.
Geschaffen ist somit durch die Erfindung ein Lichtband mit einem Stanzgitter. The invention thus creates a light band with a stamped grid.
Die mit der Erfindung erzielten Vorteile bestehen insbesondere darin, dass das Lichtmodul eine gute Wärmeabfuhr, eine geringe Verlustleistung, eine hohe mechanische Festigkeit, geringe Kosten durch die hohe Automatisiemng für die Herstellung sowie eine flexible Formgestaltung bietet. Des Weiteren ermöglicht das Lichtmodul variable Längen und besitzt auch kleine Einbaumaße. Die Investkosten für die Herstellung des Lichtmoduls sind gering, da verschiedene Längen und/oder Geometrien mit einem einzigen Stanz- Werkzeug realisiert werden können. The advantages achieved with the invention are, in particular, that the light module offers good heat dissipation, low power loss, high mechanical strength, low costs due to the high level of automation for production and flexible design. Furthermore, the light module enables variable lengths and also has small installation dimensions. The investment costs for the production of the light module are low, since different lengths and / or geometries can be realized with a single punching tool.
Ein Ausführungsbeispiel der Erfindung mit verschiedenen Weiterbildungen und Ausgestaltungen ist in den Zeichnungen dargestellt und wird im folgenden näher beschrieben. Es zeigen An embodiment of the invention with various developments and refinements is shown in the drawings and is described in more detail below. Show it
Fig. 1 ein Stanzgitter mit Leuchtdioden für ein Lichtmodul von der Oberseite gesehen, 1 shows a lead frame with light-emitting diodes for a light module seen from the top,
Fig. 2 das Stanzgitter aus Fig. 1 von der Unterseite gesehen, FIG. 2 shows the lead frame from FIG. 1 seen from the underside,
Fig. 3 das Lichtmodul in schematischer Ansicht, 3 the light module in a schematic view,
Fig. 4 einen Querschnitt durch das Lichtmodul aus Fig. 3 und Fig. 5 die Verfahrensschritte zur Herstellung des Lichtmoduls. FIG. 4 shows a cross section through the light module from FIG. 3 and FIG. 5 shows the method steps for producing the light module.
In Fig. 3 ist ein bandförmiges Lichtmodul 1 für die Innen- und/oder Interieur-Beleuchtung eines Kraftfahrzeugs zu sehen. Das Lichtmodul 1 umfasst wenigstens eine Lichtquelle 2, bei der es sich insbesondere um eine Leuchtdiode handelt, und einen Träger 3 für die Lichtquelle 2. Des Weiteren ist eine Umhausung 4 für die Lichtquelle 2 sowie den Träger 3 vorgesehen. Der Träger 3 ist aus einem Stanzgitter gebildet, wie anhand der Fig. 1 und der Fig. 2 zu sehen ist. In FIG. 3, a strip-shaped light module 1 for the interior and / or interior lighting of a motor vehicle can be seen. The light module 1 comprises at least one light source 2, which is in particular a light-emitting diode, and a carrier 3 for the Light source 2. Furthermore, a housing 4 is provided for the light source 2 and the carrier 3. The carrier 3 is formed from a stamped grid, as can be seen with reference to FIGS. 1 and 2.
Das Stanzgitter 3 besteht aus einem Material mit einer hohen elektrischen Leitfähigkeit und/oder einer hohen Wärmeleitfähigkeit. Bei dem Metall für das Stanzgitter 3 kann es sich um Kupfer, Kupfer-Beryllium o. dgl. handeln. Wie anhand der Fig. 1 zu sehen ist, ist eine Vielzahl von aufeinander folgenden Lichtquellen 2 für das bandförmige Lichtmodul 1 vorgesehen. Die Lichtquellen 2 sind auf das Stanzgitter aufgelötet. The lead frame 3 consists of a material with a high electrical conductivity and / or a high thermal conductivity. The metal for the lead frame 3 can be copper, copper-beryllium or the like. As can be seen on the basis of FIG. 1, a multiplicity of successive light sources 2 are provided for the strip-shaped light module 1. The light sources 2 are soldered onto the lead frame.
Die Umhausung 4 besteht aus einem für die in Fig. 4 gezeigte Lichtstrahlung 5 der Lichtquelle 2 durchlässigem Material. Insbesondere kann die Umhausung 4 aus einem optisch transparenten Kunststoff bestehen. Des Weiteren steht gemäß Fig. 3 ein Elektronik- Modul 6 zur Ansteuerung der Lichtquelle 2 mit dem Stanzgitter 3 in elektrischer Verbindung. Schließlich ist noch ein Gehäuse 7 aus einem optisch nichttransparenten Kunststoff für das Lichtmodul 1 vorgesehen, wie in Fig. 4 zu sehen ist. The housing 4 consists of a material that is transparent to the light radiation 5 from the light source 2 shown in FIG. 4. In particular, the housing 4 can consist of an optically transparent plastic. Furthermore, according to FIG. 3, an electronics module 6 for controlling the light source 2 is electrically connected to the lead frame 3. Finally, a housing 7 made of an optically non-transparent plastic is also provided for the light module 1, as can be seen in FIG. 4.
Das Verfahren zur Herstellung des Lichtmoduls 1 ist näher in Fig. 5 zu sehen. Zunächst wird in einem ersten Verfahrensschritt VI das Stanzgitter 3 aus einem Metallband durch Stanzen hergestellt und auf eine Rolle aufgerollt. Danach werden im zweiten Verfahrensschritt V2 die Lichtquellen 2 auf das von der Rolle abgerollte Stanzgitter 3 aufgelötet. Nach dem Auflöten werden im Verfahrensschritt V3 die Brücken im Stanzgitter 3 aufgetrennt, und zwar insbesondere mitttels Laserstrahlung, sowie das Stanzgitter 3 auf die gewünschte Länge für das Lichtmodul 1 abgeschnitten. Gegebenenfalls können die Stege im Stanzgitter 3 noch zur Stabilisierung mit Kunststoff umspritzt werden. Des Weiteren wird im Verfahrensschritt V4 das Elektronikmodul 6 auf das Stanzgitter 3 aufgelötet. Anschließend werden die Lichtquellen 2 in dem folgenden Verfahrensschritt V5 mit dem optisch transparenten Kunststoff, wie Silikon, Polyurethan (PU), Polycarbonat (PC) o. dgl., umspritzt. Falls gewünscht kann dann das Stanzgitter 3 mit einem optisch nichttransparenten Kunststoff umspritzt werden, derart dass das Gehäuse 7 ausgebildet ist, wobei man dann im Verfahrensschritt V6 das für den Einbau in das Kraftfahrzeug fertiggestellte Lichtmodul 1 erhält. Zweckmäßigerweise kann das Umspritzen mit dem optisch transparenten sowie dem optisch nichttransparenten Kunststoff mittels 2K(Zwei-Komponenten)-Spritzgießen erfolgen. The method for producing the light module 1 can be seen in more detail in FIG. 5. First of all, in a first method step VI, the lead frame 3 is produced from a metal strip by punching and rolled up on a roll. Then, in the second method step V2, the light sources 2 are soldered onto the lead frame 3 unrolled from the roll. After soldering, the bridges in the lead frame 3 are separated in method step V3, in particular by means of laser radiation, and the lead frame 3 is cut to the desired length for the light module 1. If necessary, the webs in the lead frame 3 can also be overmolded with plastic for stabilization. Furthermore, in method step V4, the electronics module 6 is soldered onto the lead frame 3. Then, in the following method step V5, the light sources 2 are encapsulated with the optically transparent plastic, such as silicone, polyurethane (PU), polycarbonate (PC) or the like. If desired, the lead frame 3 can then be overmolded with an optically nontransparent plastic, in such a way that the housing 7 is formed, the light module 1 then being obtained in method step V6 for installation in the motor vehicle. Appropriately, the encapsulation with the optically transparent as well as the optically non-transparent plastic can be made by means of 2K (two-component) injection molding.
Die Erfindung ist nicht auf das beschriebene und dargestellte Ausführungsbeispiel beschränkt. Sie umfasst vielmehr auch alle fachmännischen Weiterbildungen im Rahmen der durch die Patentansprüche definierten Erfindung. So ist das Lichtmodul nicht nur für die Außen- und/oder Innenbeleuchtung in einem Kraftfahrzeug einsetzbar. Vielmehr kann das Lichtmodul 1 auch in der Art eines „intelligent“ Spotlights, auch bei anderen Verwendungen als im Kraftfahrzeug, beispielsweise bei Hausgeräten, in Immobilien o. dgl. eingesetzt werden. Insbesondere kann die Erfindung auch für die dynamische Innenbeleuchtung in Echtzeit, beispielsweise für die dynamische Dachbeleuchtung, für die Außenbeleuchtung, beispielsweise zur Bodenbeleuchtung oder Logo-Zeichnung auf dem Boden, und/oder für die optische Kommunikation bei einem autonomen Fahrzeug, beispielsweise zur Kommunikation zwischen den Fahrzeugen oder zwischen dem Fahrzeug und Fußgängern, verwendet werden. The invention is not restricted to the exemplary embodiment described and illustrated. Rather, it also includes all technical developments within the scope of the invention defined by the patent claims. The light module can not only be used for exterior and / or interior lighting in a motor vehicle. Rather, the light module 1 can also be used in the manner of an “intelligent” spotlight, also for uses other than in the motor vehicle, for example in household appliances, in real estate or the like. In particular, the invention can also be used for dynamic interior lighting in real time, for example for dynamic roof lighting, for exterior lighting, for example for floor lighting or logo drawing on the floor, and / or for optical communication in an autonomous vehicle, for example for communication between the Vehicles or between the vehicle and pedestrians.
Bezugszeichen-Liste : : Lichtmodul : Lichtquelle : Träger / Stanzgitter: Umhausung : Lichtstrahlung : Elektronik-Modul: Gehäuse List of reference symbols:: Light module: Light source: Support / lead frame: Housing: Light radiation: Electronics module: Housing

Claims

P at e nt a n s p rü c h e : P at e nt claims:
1. Lichtmodul, insbesondere für die Innen- und/oder Interieur-Beleuchtung eines Kraftfahrzeugs, mit wenigstens einer Lichtquelle (2), mit einem Träger (3) für die Lichtquelle (2) und mit einer Umhausung (4) für die Lichtquelle (2) sowie den Träger (3), dadurch gekennzeichnet, dass der Träger (3) aus einem Stanzgitter gebildet ist. 1. Light module, in particular for the interior and / or interior lighting of a motor vehicle, with at least one light source (2), with a carrier (3) for the light source (2) and with a housing (4) for the light source (2 ) and the carrier (3), characterized in that the carrier (3) is formed from a stamped grid.
2. Lichtmodul nach Anspruch 1, dadurch gekennzeichnet, dass das Stanzgitter (3) aus einem Material mit einer hohen elektrischen Leitfähigkeit und/oder hohen Wärmeleitfähigkeit, insbesondere aus Metall, wie Kupfer, Kupfer-Beryllium o. dgl., besteht. 2. Light module according to claim 1, characterized in that the stamped grid (3) consists of a material with a high electrical conductivity and / or high thermal conductivity, in particular of metal such as copper, copper-beryllium or the like.
3. Lichtmodul nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass eine Vielzahl von aufeinander folgenden Lichtquellen (2), insbesondere von Leuchtdioden, vorgesehen sind, und dass die Lichtquellen (2) auf das Stanzgitter (3) aufgelötet sind. 3. Light module according to claim 1 or 2, characterized in that a plurality of successive light sources (2), in particular light-emitting diodes, are provided, and that the light sources (2) are soldered onto the lead frame (3).
4. Lichtmodul nach Anspruch 1, 2 oder 3, dadurch gekennzeichnet, dass eine Umhausung (4) aus für die Lichtstrahlung (5) der Lichtquelle (2) durchlässigem Material, insbesondere aus einem optisch transparenten Kunststoff bestehend, vorgesehen ist. 4. Light module according to claim 1, 2 or 3, characterized in that a housing (4) made of material which is transparent to the light radiation (5) of the light source (2), in particular consisting of an optically transparent plastic, is provided.
5. Lichtmodul nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, dass ein Elektronik-Modul (6) zur Ansteuerung der Lichtquelle (2) mit dem Stanzgitter (3) in elektrischer Verbindung steht. 5. Light module according to one of claims 1 to 4, characterized in that an electronics module (6) for controlling the light source (2) is in electrical connection with the lead frame (3).
6. Verfahren zur Herstellung eines Lichtmoduls (1) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Lichtquellen (2) auf das Stanzgitter (3) aufgelötet werden, dass nach dem Auflöten die Brücken im Stanzgitter (3), insbesondere mittels Laserstrahlung, aufgetrennt werden, dass gegebenenfalls die Stege zur Stabilisierung mit Kunststoff umspritzt werden, und dass anschließend die Lichtquellen (2) mit dem optisch transparenten Kunststoff, wie Silikon, Polyurethan (PU), Polycarbonat (PC) o. dgl., umspritzt werden. 6. A method for producing a light module (1) according to any one of the preceding claims, characterized in that the light sources (2) are soldered onto the lead frame (3), that after soldering the bridges in the lead frame (3), in particular by means of laser radiation, be separated, that if necessary the webs are overmolded with plastic for stabilization, and that the light sources (2) are then overmolded with the optically transparent plastic, such as silicone, polyurethane (PU), polycarbonate (PC) or the like.
7. Verfahren nach Anspruch 6, dadurch gekennzeichnet, dass das Stanzgitter (3) mit einem optisch nichttransparenten Kunststoff umspritzt wird, derart dass ein Gehäuse (7) ausgebildet ist, und dass vorzugsweise das Umspritzen mit dem optisch transparenten sowie dem optisch nichttransparenten Kunststoff mittels 2K(Zwei-Komponenten)-Spritzgießen erfolgt. 7. The method according to claim 6, characterized in that the lead frame (3) is overmolded with an optically nontransparent plastic, such that a housing (7) is formed, and that preferably the overmolding with the optically transparent and the optically nontransparent plastic by means of 2K (Two-component) injection molding takes place.
PCT/EP2020/080023 2019-12-31 2020-10-26 Lightband WO2021136608A1 (en)

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